TW201902650A - Molding mold and resin molding method - Google Patents

Abstract

Provided is a mold for preventing the leakage of resin even if the precision of the end surface of the workpiece, the step difference on the workpiece, or the viscosity of the resin can be prevented, thereby saving maintenance and maintaining high molding quality.

The lower mold 1 is provided with a movable mold 9 that is separated from the clamping surface of the lower mold and is provided so as to be movable in contact and separation. When the mold is closed, the end of the workpiece W and the resin path intersect with the movable mold 9 and Between the lower mold 1, a part 2c, 9b of a resin path communicating with the cavity recessed portion 2e is formed between the movable mold 9 and the clamping surface of the upper mold 2 facing each other.

Description

   Mould and resin molding method   

The present invention relates to a molding mold for sliding, positioning and holding a workpiece placed on a mold mounting surface, and a resin molding method using the molding mold.

The resin sealing device moves the workpiece into the opened mold and clamps and positions the resin after positioning. As a workpiece, a resin substrate (organic substrate), a ceramic substrate, an aluminum substrate, a semiconductor wafer, a large substrate, or a lead frame (hereinafter, simply referred to simply as a "workpiece") can be used, and held together with the sealing resin and held toward the device. The mold is moved in. The workpiece is held by a molding die, and the molten molding resin cross-cuts (traverses) the substrate and is pressure-fed to the cavity for resin molding.

In the case where the accuracy of the end surface is low like an organic substrate, or in the case of molding a resin with a low viscosity, when the transfer molding is performed from a side gate provided on the side of the workpiece, the resin flow channel is poured across the mold flow channel. The mouth passes through the workpiece end surface and the workpiece placed on the workpiece mounting portion (concave portion) and passes therethrough, so that resin leaks from a small gap portion of the workpiece end surface.

In order to eliminate this unsatisfactory situation, the applicant proposes a molding mold, which places the workpiece on the insert block and closes the mold, and pushes the end surface of the workpiece and pushes the end surface of the opposite side against the end surface of the heating chamber insert to make it lean. In the state, the bridge portion of the heating chamber insert is used to sandwich the workpiece between the bridge portion and the insert block, and the molding resin is supplied to the cavity recessed portion through a resin path provided in the bridge portion (see Patent Document 1: Japan). National Patent Publication No. 2015-51557).

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2015-51557

It is not limited to the case where there is a gap on the end surface of the workpiece, and there may be a case where a resin molded product having a step on the resin molding surface of the workpiece is subjected to resin molding. For example, when an adhesive tape is attached to the resin molding surface formed on the workpiece (for example, when a thermal release sheet is attached to a metal substrate and a semiconductor wafer is die-bonded on the thermal release sheet), Since the runner gate of the side gate passes through the belt junction portion on the workpiece, it may cause the stepped portion of the molding resin to wrap around and the adhesive tape.

In addition, it is not limited to the case where the molding resin flows into the cavity recesses across the end surface of the workpiece, and there may be cases where the molding resin overflows from the cavity recesses or passes through the cavity recesses regardless of transfer molding or compression molding. In the map forming of runner gate connection, the molding resin flows across the end face of the workpiece.

In the case of Patent Document 1, since it is necessary to make the workpiece lean against the heating chamber insert, based on the limitation of the mold layout, the flange portion of the heating chamber and the runner can be made movable according to the size of the workpiece. The large mold structure increases the cost, and once the movable part is added, it takes time to repair or maintain. Further, Patent Document 1 does not provide a return mechanism for returning the edged workpiece to the original position to remove the workpiece after resin molding.

Especially in the case of low-viscosity molding resin (transparent resin for LEDs, etc.), no matter whether there is a step or gap in the workpiece, when the molding resin crosses through the end surface of the workpiece, resin leakage often occurs. Therefore, when the resin adheres to the end surface (side surface) of the work plate, it will hinder handling. It is necessary to remove unnecessary resin in the later process, and it is impossible to use automatic molding equipment for automatic production. Maintenance work requires time and labor.

An object of the present invention is to provide a molding mold and a resin molding method using the molding mold, which solve the problems of the conventional techniques described above, even if deviations in the end face accuracy of the workpiece, step differences occur on the workpiece, or regardless of the molding resin. Whatever the viscosity is, it can prevent leakage of resin, save maintenance, and maintain high molding quality.

To achieve the above object, the present invention has the following configuration.

That is, a molding die is configured to hold the workpiece together with a molding resin by a first die supporting a workpiece and a second die formed with a cavity recess, and the first die is provided with The first mold clamping surface is separated and provided as a movable mold that can move in / out of contact. The end of the workpiece that intersects the resin path is clamped between the movable mold and the first mold when the mold is closed. A part of the resin path communicating with the cavity recessed portion is formed between the movable mold member and the second mold clamping surface that is opposite to the movable mold member.

Therefore, when the mold is closed, the end of the workpiece that intersects the resin path is clamped between the movable mold and the first mold, because the molding resin passes through the clamp formed between the movable mold and the opposite second mold. Part of the resin path between the surfaces, so that no resin leaks from the end of the workpiece.

A molding die is used for transfer molding in which a first mold supporting a workpiece and a second mold formed with a cavity recess are used to hold the workpiece, and a molding resin supplied to a heating chamber is filled toward the cavity recess through a resin path. The molding mold of the invention is characterized in that: a workpiece pushing mechanism pushes one side surface of the workpiece supported by the first mold; a workpiece return mechanism pushes against the other side surface of the workpiece pushed by the workpiece pushing mechanism, And pushing back to the side of the other end of the workpiece in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and a movable module, which is separated from the clamping surface of the first mold in the first mold and is arranged to move in contact / detachment The workpiece supported by the first mold is interlocked with the mold closing action by the workpiece pushing mechanism to be pushed against the workpiece return mechanism and abutted, and the other end side of the workpiece is sandwiched between the movable module and the A recessed portion communicating with the cavity is formed between the first mold and a clamping surface between the movable mold and the opposite second mold. Its resin path.

If the above-mentioned molding mold is used, the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece pushing mechanism and brought to the side before being clamped by the second mold. This makes it possible to reduce the gap generated between the mold and the end face of the workpiece as much as possible. At the same time as closing the mold, the other end side of the workpiece is sandwiched between the movable mold and the first mold. Since the molding resin passes through the resin path between the movable mold and the second mold, it becomes ineffective. Resin may leak from the end surface of the workpiece.

Preferably, the movable mold part is provided at a mold runner gate, and the mold runner gate communicates with a heating chamber provided in the first mold and the cavity recess of the mold.

In this case, since the movable module constitutes a part of the resin path communicating with the cavity of the cavity, it is not necessary to move the workpiece near the heating chamber, for example, even if the workpiece is arranged in a map or the molded resin does not pass through the workpiece. The flow range of the molding resin on the end surface is widened, and transfer molding can be performed without resin leakage. Therefore, the degree of freedom in the layout of the cavities of the molding die becomes wider.

A molding die is configured to compress the molding resin from the cavity recessed portion to the overflow cavity by clamping the foregoing workpiece by a first mold supporting the workpiece and a second mold formed with a cavity recessed portion. A compression mold for compression molding includes a workpiece pushing mechanism for pushing one end side of the workpiece supported by the first mold, and a workpiece return mechanism for pushing against another workpiece of the workpiece pushed by the workpiece pushing mechanism. One end side, and the other end side of the workpiece is pushed back in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and a movable module is separated from the clamping surface of the first mold in the first mold and arranged to be contactable / Moving away, the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece pushing mechanism and moved side by side with the mold closing action, and the other end side of the workpiece is clamped into the movable mold. Formed between the movable mold and the clamping surface of the second mold opposite to the first mold from the cavity recessed portion toward the foregoing Resin path for overflow cavity.

Thereby, since the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece pushing mechanism in conjunction with the mold closing operation, the gap generated on the molding mold and the end surface of the workpiece can be reduced as much as possible. At the same time that the mold is closed, the other end of the workpiece is sandwiched between the movable mold and the first mold, and a resin path is formed between the movable mold and the clamping surface of the opposite second mold. The molding resin overflowing from the cavity recess to the overflow cavity passes through the resin path between the movable mold and the second mold, so that no resin leaks from the end of the workpiece.

In addition, it is preferable that an air suction / ejection hole connected to an air suction / ejection mechanism is provided on the workpiece support surface of the first mold, and the air is sucked from the air while the workpiece is leaned against the first mold. The ejection hole ejects air while pushing the workpiece against the workpiece return mechanism by the workpiece pushing mechanism, and sucks and holds air from the air suction / ejection hole while keeping the workpiece aside.

Therefore, when the end surface of the workpiece is pushed by the workpiece pushing mechanism, the sliding friction between the workpiece and the first mold can be reduced, and the workpiece can be quickly brought to the side and held and held on the workpiece support surface at the side position.

Preferably, a bridge section is formed in the movable mold, and the upper surface of the movable mold is pressed into the first mold in a state that the other end side of the workpiece collides with the workpiece return mechanism, and is provided in the first mold. The elastic member in the mold is always pushed and pushed, so that the bridge portion is separated from the first mold.

Thereby, when the mold is closed, the movable mold is pushed back by the second mold against the elastic member by the second mold to clamp the movable mold between the bridge and the first mold. side. Therefore, by molding and molding the resin through the resin path between the movable mold and the first mold, it is possible to prevent the resin from being drawn toward the end surface of the workpiece.

Preferably, the side-to-side movement of the workpiece pushing mechanism is linked with the lifting movement of an ejector pin plate. When the ejecting pin plate retracts from the first mold, the workpiece pushing mechanism pushes the workpiece. When the ejection pin plate is close to the first mold at one end surface of the workpiece supported by the first mold, the workpiece pushing mechanism is retracted from the one end surface of the workpiece.

Thereby, when the ejector pin is retracted from the first mold, the workpiece pushing mechanism pushes one end surface of the workpiece supported by the first mold to the side, and the workpiece pushing mechanism pushes the ejection pin from the first mold. When protruding, it will retreat from one end surface of the workpiece to allow the workpiece to be pushed back. Therefore, it can be realized in accordance with the timing of the side action of the workpiece before forming, the gate break after forming, and the timing of taking out the workpiece, and the formed product and the unnecessary resin can be efficiently separated and taken out in the mold.

Preferably, the formed workpiece is separated from the workpiece by a mold opening action, and the workpiece return mechanism pushes the other end surface of the workpiece to separate unnecessary resin from the encapsulation portion on the workpiece. .

With this, when the mold opening operation is performed, the gate is broken and separated from the sealing portion when the mold is separated from the workpiece while the movable mold is held with unnecessary resin attached, so that it can be easily removed from the molded product. Separate and remove unnecessary resin.

A resin molding method is characterized in that a pair of molding dies is used to clamp a workpiece, and the molding resin supplied to the heating chamber is filled and transferred to a cavity recess of a cavity through a resin path for transfer molding. The method includes: The first mold of the foregoing molds supports the work of the workpiece; the work of the workpiece pushing member pushing one side of the workpiece and pushing the other side of the workpiece against the workpiece return member and leaning on the side; while maintaining the state that the workpiece is leaning on the side A process of sucking and holding the first mold; closing the mold so that the other end of the workpiece is sandwiched between a movable mold provided separately from the clamping surface of the first mold and the first mold; Engineering; including the resin path formed between the second mold and the movable mold, from the heating chamber through the resin path to the cavity recessed portion of the second mold formed opposite to the workpiece to fill the mold A process of manufacturing a resin and heat-hardening it; a process of making the workpiece pushing member retract from the side of one end of the workpiece after heating and curing; and The process of taking out a molded product from the foregoing mold of the mold.

By this, before the workpiece supported by the first mold is clamped with another mold, the workpiece pushing member is pushed against the workpiece return member and brought to the side by the workpiece, so it can be reduced as much as possible between the mold and the mold. Clearance generated on the end face of the workpiece. When the mold is closed, the other end of the workpiece is sandwiched between the movable mold and the first mold which are provided separately from the first mold clamping surface. A resin path communicating from the heating chamber to the cavity of the cavity is formed between the clamping surfaces, so the molding resin will pass the resin path between the movable mold and another mold, so that no resin will pass from the workpiece end. Department leaks.

In addition, when the mold is opened, the movable resin is separated from the workpiece, and the unnecessary resin is gate-broken, and the workpiece pushing member is retracted and the workpiece is returned to the workpiece and separated from the unnecessary resin by the workpiece returning member. The gate is broken in the mold, and the molded product is separated from the unnecessary resin, so it is possible to efficiently take out the molded product.

When the resin path between the second mold and the movable mold is a mold runner gate that communicates the heating chamber provided in the first mold with the cavity recess, the transfer molding can prevent resin leakage and maintenance Save labor.

A resin molding method uses a pair of molding dies to hold a workpiece and a molding resin so that the foregoing molding resin overflows from a cavity recess into an overflow cavity to perform compression molding. The resin molding method is characterized in that: Including: the process of supporting the workpiece by the first mold in the opened mold; the process of pushing one side of the workpiece with the workpiece pushing member and pushing the other side of the workpiece against the workpiece return member and leaning to the side; The process of closing the mold to sandwich the other end side of the workpiece between the movable mold provided separately from the clamping surface of the first mold and the first mold; including forming the second mold and the movable A process in which the molding resin is formed from a recess in a cavity of the second mold opposite to the workpiece in the resin path between the molds, and overflows through the resin path to the overflow cavity and heat-hardens the process. A process of retreating the workpiece pushing member from one end side of the workpiece after heating and hardening; and a process of taking out a molded product from the molding die that has been opened.

By this, since the workpiece supported by the first mold is clamped between the other mold, the workpiece pushing member is pushed against the workpiece returning member and brought to the side by the workpiece, so that it can be reduced as much as possible between the mold and the mold. Clearance generated on the end face of the workpiece.

When the mold is closed, the other end of the workpiece is sandwiched between the movable mold and the first mold which are separately provided from the clamping surface of the first mold, and the movable mold is opposed to the opposite second mold. A resin path is formed between the clamping surfaces. Therefore, the molding resin overflowing from the cavity recess to the overflow cavity passes through the resin path between the movable mold and another mold, so that no resin leaks from the end of the workpiece.

The resin path between the second mold and the movable mold is a mold flow path, which communicates the cavity recess with the overflow cavity, and prevents the resin from leaking during compression molding and saves maintenance.

Preferably, one side surface of the workpiece is pushed by the workpiece pushing member while keeping the air sprayed from the first mold to the workpiece, so as to push the other side of the workpiece against the workpiece returning member and lean to the side. Thereby, the frictional resistance between the workpiece and the first die is reduced, and the workpiece is smoothly brought to the side, so that the occurrence of the gap at the end surface portion of the workpiece can be reduced.

If the above-mentioned molding mold is used, even if it is a transfer molding mold or a compression molding mold, the resin can be prevented from leaking from the gap between the workpiece and the mold regardless of the accuracy of the workpiece end face, the step accuracy of the workpiece, or the resin viscosity. . Therefore, preventing leakage of the resin saves maintenance of the mold and maintains high molding quality. In addition, even when it is not desired to allow the resin to run on the workpiece, the resin can be prevented from leaking from the gap between the workpiece and the mold.

Regarding the resin molding method, even if it is a transfer molding method or a compression molding method, the molding quality can be stabilized regardless of the accuracy of the end face of the workpiece and the viscosity of the resin, and the stripping operation and pouring of the molded product can be performed reliably. Mouth breaks.

T‧‧‧semiconductor wafer

PKG‧‧‧Packaging

1, 14‧‧‧ lower mold

2,12,13‧‧‧‧Mould

2a‧‧‧ Upper scrap waste

2b, 12d, 12f‧‧‧ upper die runner

2c, 12e

2d‧‧‧Upper gate gutter

2e, 12c ‧‧‧ Recess of upper mold cavity

2f‧‧‧Top Gate

3‧‧‧ Mould

4‧‧‧ heating chamber

5‧‧‧ plunger

6‧‧‧ Lower mold insert block

6a, 15a‧‧‧‧Air suction / exhaust hole

R‧‧‧moulding resin

R’‧‧‧ unwanted resin

W‧‧‧ Workpiece

7‧‧‧Workpiece pushing mechanism

7a‧‧‧Workpiece pushing member

7b, 8b ‧‧‧ fulcrum

7c, 8c, 10, 12i, 14i ‧‧‧ coil springs

7d, 8d ‧‧‧ protruding ejector

8‧‧‧Workpiece return mechanism

8a‧‧‧Workpiece return component

9‧‧‧ movable module

9a‧‧‧Bridge Department

9b‧‧‧Jiaoqiaogou

9c‧‧‧Shaft

9d‧‧‧side

11‧‧‧ film strip

12a‧‧‧ Upper mold cavity module

12b‧‧‧ Upper mold holder

12g‧‧‧ Upper mold overflow cavity

12h, 14h ‧‧‧ Overflow Cavity Module

14a‧‧‧Lower mold cavity module

14b‧‧‧ Lower mold holder

14c‧‧‧Lower mold cavity recess

14d, 14f‧‧‧ lower die runner

14e‧‧‧Bottom of lower mold frame bridge

14g‧‧‧Lower mold overflow cavity

15‧‧‧ Upper mold insert block

FIG. 1 is an engineering explanatory diagram of a resin molding operation by a transfer molding apparatus.

FIG. 2 is an engineering explanatory diagram of a resin molding operation subsequent to FIG. 1.

FIG. 3 is an engineering explanatory diagram of the resin molding operation subsequent to FIG. 2.

Figure 4 is a plan layout of the upper mold and the lower mold.

FIG. 5 is a top view of the semiconductor package.

Fig. 6 is an explanatory view showing another example of the transfer molding apparatus.

FIG. 7 is an explanatory diagram showing a configuration of a compression molding apparatus.

FIG. 8 is a top view showing the layout of the mold of FIG. 7.

FIG. 9 is an explanatory diagram showing a configuration of a mold according to another example.

Hereinafter, suitable embodiments of the molding die and the resin molding method using the same according to the present invention will be described in detail together with the attached drawings. In the following embodiments, a rectangular organic substrate (workpiece) is used as a work, and a work in which a plurality of semiconductor wafers are connected to the work by die bonding is used as an example.

Figure 5 shows a top view of the package sealed with resin. The semiconductor wafer T arranged on the outermost periphery of the resin-sealed package portion (resin-sealed portion) and the cutting lines L1 and L2 surrounding it horizontally and vertically are shown. In addition, the resin molding device is formed into a mold opening and closing mechanism (an electric motor, a screw shaft, a toggle link mechanism, etc .; not shown) including an opening and closing mold, and is inserted into a heating chamber (in the case of transfer molding). The transfer mechanism actuated by a plunger is mainly explained by the structure of a mold.

First, a mold and a resin molding method for transfer molding will be described together with the configuration of the resin molding apparatus.

In FIG. 1A, the resin molding apparatus includes a mold 3 having a lower mold 1 (a first mold) that is a movable mold and an upper mold 2 (a second mold) that is a fixed mold, and opening and closing the molding mold 3. Mold opening and closing mechanism (electric motor, screw shaft, toggle link mechanism, etc .; not shown); and a transfer mechanism for operating the plunger 5 inserted into the heating chamber 4 included in the lower mold 1. Hereinafter, the structure of the mold 3 will be specifically described.

The lower mold 1 is provided with: a lower mold insert block 6 which is aligned with the cavity recessed portion to mount and fix the workpiece W, and is provided adjacent to the lower mold insert block 6 and filled with a molding resin R to be supplied to the cavity recessed portion. The heating chamber 4. The molding resin R may be any of an ingot resin (solid resin), a particulate resin, a powder resin, and a liquid resin.

The insert block 6 is provided with a workpiece pushing mechanism 7 that pushes one end face of the workpiece W. On the workpiece support surface of the insert block 6, on the outer peripheral side of the insert block 6 (a predetermined position separated from the heating chamber 4), the workpiece pushing member 7 a is supported so as to be provided at a fulcrum 7 b at the base end (lower end). Shake for the center. The base end of the workpiece pushing member 7a is centered around the fulcrum 7b by a coil spring 7c (elastic member). In this figure, for example, it is turned counterclockwise (since the situation seen from the inside of the paper is clockwise, so (The description in this figure is omitted hereinafter). In addition, the base end portion of the work pushing member 7a is supported by the protruding pin 7d with the fulcrum 7b as the center, and is supported in a clockwise direction, for example. The front end portion of the workpiece pushing member 7 a protrudes from the clamping surface of the lower die insert block 6 and can push one end face of the workpiece W placed on the lower die insert block 6.

The workpiece pushing action of the workpiece pushing mechanism 7 is linked with the lifting action of an eject pin plate (not shown) provided below the lower die insert block 6. In addition, the ejector pin plate can be moved up and down by a separate separately driven motor, actuator, etc., but it can also be formed when the lower movable plate (lower mold) is moved downward by an ejector bar erected on the lower fixed plate. At this time, the ejector pin is in contact with the ejection pin plate, and the lower movable plate (lower mold) moves downward while the ejection pin plate moves relatively upward.

Specifically, a plurality of ejection pins are erected and supported on the ejection pin plate, and each ejection pin is provided to penetrate the lower die insert block 6 and be protruded by the clamping surface. The ejection pin is a mechanism that protrudes from the mold release surface, the bottom of the molded resin, or the lower surface of the workpiece mounting position, respectively, by a mold opening operation after resin molding to release the workpiece from the mold. Here, the ejector pin plate is connected with a protruding ejector rod 7d. Since the ejector pin plate is retracted (moved downward) from the lower die insert block 6 (the ejector pin is also retracted from the lower die clamping surface), the ejector pin is protruded. 7d is lowered, so by pushing the workpiece pushing member 7a by the coil spring 7c to push one end side of the workpiece W placed on the lower die insert block 6, the workpiece W can be moved from the workpiece mounting position to the pushing position. Also, since the ejector pin 7d rises when the ejector pin plate approaches (moves upward) the lower die insert block 6 (the ejector pin protrudes from the lower die clamping surface), the workpiece pushing member 7a resists the coil spring 7c. On the other hand, the pushing position from one side surface of the pushing work W is moved to the retreat position (work loading position).

The lower die insert block 6 is provided with a workpiece return mechanism 8 that pushes against the other end surface of the workpiece W pushed by the workpiece pushing mechanism 7 and forms the shape in conjunction with a retreat operation from the pushing position of the workpiece pushing mechanism 7. After pushing the other side of the workpiece back side.

Specifically, a workpiece return mechanism 8 is provided at a predetermined position between the heating chamber 4 and the workpiece support surface of the lower mold insert block 6. The work return member 8a is supported so as to be able to swing around a fulcrum 8b provided at the base end portion (lower end portion). The front end portion of the work return member 8 a is provided so as to protrude from the clamping surface of the lower die insert block 6. The base end portion of the work returning member 8a is centered on the fulcrum 8b by the coil spring 8c, and is urged and pushed in a clockwise direction, for example. In addition, the spring force of the coil spring 7c is larger than that of the coil spring 8c.

When the other end side of the workpiece W pushed by the workpiece pushing mechanism 7 is pushed against the workpiece returning member 8a, it resists the elastic thrust of the coil spring 8c and swings counterclockwise with the fulcrum 8b as the center, and stands on the workpiece returning member 8a. The raised position causes the workpiece W to be moved to the side. When the workpiece pushing mechanism 7 retreats from the pushing position, the workpiece returning member 8a swings in the clockwise direction around the fulcrum 8b by the spring push of the coil spring 8c, and pushes the other end side of the workpiece toward the workpiece pushing member 7a .

In the lower mold insert block 6, the movable mold 9 is provided so as to be able to move (elevate) with respect to the lower mold insert block 6 in contact with / detach from the lower mold insert block 6 in conjunction with the mold opening and closing operation. Specifically, at a predetermined position corresponding to the resin path between the heating chamber 4 of the lower mold insert block 6 and the workpiece support surface, the base end side of the shaft portion 9c of the movable mold 9 is provided in a retracted manner at The coil spring 10 in the lower die insert block 6 is always pushed upward.

Further, a bridge portion 9a forming a part of the resin path is formed on the front end side of the shaft portion 9c of the movable module 9 so as to intersect (orthogonally) with the shaft portion 9c. A bridge groove 9b may be formed in the bridge portion 9a as a resin path. This bridge portion 9a presses the upper surface of the workpiece toward the lower die insert block 6 in a state where the other end of the workpiece collides with the workpiece return member 8a. The movable module 9 is always pushed by the coil spring 10, so that the bridge portion 9a is separated from the insert block 6, and is pushed down by the upper mold 2 for closing the mold against the push of the coil spring 10 to push the other end of the workpiece. It is sandwiched between the opposite surface of the bridge portion 9 a and the lower mold insert block 6. The bridge portion 9 a is formed in a T-shape symmetrically around the shaft portion 9 c of the movable module 9, but is not necessarily limited to a symmetrical shape.

In this embodiment, the movable module 9 adopts a simple structure that is always pushed by the coil spring 10 and is closed while the movable module 9 is pushed down to the opposite mold. However, the movable module 9 is also It is possible to employ a configuration in which a moving mechanism having a separate driving source is adapted to independently move the workpiece support surface in contact with and away from the mold opening and closing operation.

With the above configuration, the workpiece W supported by the lower mold insert block 6 is linked to the mold closing operation and pushed against the workpiece return mechanism 8 by the workpiece pushing mechanism 7. When the mold closing is completed, the movable module 9 is borrowed. The mold 2 is pressed down so that the other end side of the workpiece is sandwiched between the bridge portions 9a, and a resin path is formed between the movable mold 9 and the opposing upper mold clamping surface.

Moreover, it is preferable that the workpiece support surface of the insert block 6 be provided with a plurality of air suction / ejection holes 6a connected to the air suction / ejection mechanism. Thereby, when the workpiece W is brought to the side of the insert block 6, the workpiece W is floated up while the air is ejected from the air suction / ejection hole 6a. The workpiece pushing mechanism 7 can be pushed against the workpiece return mechanism 8 and leaned to the side. . In addition, it is possible to perform air suction from the air suction / ejection hole 6a while holding the workpiece W aside, and to hold and hold the workpiece W while a side is held.

Further, the workpiece W is such that air is ejected from the air suction / ejection hole 6a during the mold opening operation, the workpiece pushing mechanism 7 (the workpiece pushing member 7a) is retracted from the pushing position, and the other end side of the workpiece is moved by the workpiece return mechanism 8 ( The workpiece return member 8a) is pushed and pushed back.

Preferably, the workpiece supporting surface of the lower die insert block 6 is subjected to a surface treatment for sliding the workpiece W, for example, sliding coating such as DLC (Diamond-Like Carbon) is applied. Thereby, the workpiece W can perform a smooth side motion. In addition, the workpiece W and the die surface are less likely to be damaged by the movement of the workpiece W.

In addition, the formed workpiece W is used to raise the movable mold 9 by the opening operation of the molding die 3, and the workpiece return mechanism 8 pushes the other end side of the workpiece, so that the unnecessary resin R ′ in the resin path and the workpiece The package portion PKG on W is gate-broken (see FIG. 3B).

In FIG. 1A, an upper mold scrap 2a, an upper mold runner 2b, which communicates with the upper mold scrap 2a, are provided on the upper mold 2 at the relative positions of the heating chamber 4 on the clamping surface of the upper mold, and Resin paths such as the bridge recess 2c that communicates with the upper mold runner 2b, the upper mold gate groove 2d that communicates with the bridge recess 2c, and the upper mold cavity recess 2e that communicates with the upper mold runner 2d are disposed opposite to each other. The upper mold holding surface containing the resin path is covered by the holding and releasing of the release sheet 11. The release sheet 11 has a thickness of about 50 μm, has heat resistance, can be easily peeled from the mold surface, and is flexible and stretchable. For example, PTFE, ETFE, PET, FEP film, glass cloth impregnated with fluorine, poly Single-layer or multi-layer film with acrylic film, polyvinylidene chloride, etc as main components. In addition, in the case where the accuracy of the end face of the workpiece is high or when a mold resin having a large filler diameter is used, the release sheet 11 may be omitted.

As shown in FIG. 4B, the work pushing mechanism 7 and the work return mechanism 8 are each provided in two groups at opposite edge portions of the work W having a rectangular shape. The workpiece pushing mechanism 7 and the workpiece returning mechanism 8 are not limited to two groups, and may be one group or more than two groups. The movable module 9 is not limited to a singular number and may be provided at a plurality of positions.

As shown in FIG. 4B, when the movable mold 9 and the workpiece return mechanism 8 transfer the forming mold, the upper mold runner 2b is provided and communicates with the heating chamber 4 provided in the lower mold 1 and the cavity recess 2e of the upper mold. A position corresponding to the gap between the upper mold gate grooves 2d (a position corresponding to the bridge recess 2c: see FIG. 4A). A resin path is formed between the bridge groove 9b provided on the upper surface of the bridge portion 9a and the opposite bridge recess 2c. In addition, as the resin path, a bridge groove 9b may not be provided on the upper surface of the bridge portion 9a, and a groove may be provided on the bridge recess 2c side. In this case, since the release film 11 is tightly provided on the upper mold 2, a groove provided with a resin path in the upper mold 2 is easier to release than a groove provided with a bridge groove 9b in the bridge portion 9a. Further, a groove for a resin path may be provided on both the upper mold 2 and the bridge portion 9a.

Here, an example of a resin molding operation using a mold for transfer molding will be described with reference to FIGS. 1 to 3. In addition, the release sheet 11 is provided so as to be adsorbed and held on the clamping surface of the upper mold 2.

In FIG. 1A, the workpiece W (the workpiece mounting position) is supplied to the lower mold insert block 6 of the lower mold 1 in the opened mold 3 by the loader etc. which are not shown in figure. The molding resin R is also supplied into the heating chamber 4 together with the workpiece W or separately. At this time, the base end portion of the workpiece pushing member 7a is in a position to swing in the clockwise direction with the fulcrum 7b as the center by projecting the ejector pin 7d against the spring push of the coil spring 7c.

The air is ejected from the air suction / ejection hole 6a of the lower mold insert block 6 to reduce sliding friction between the workpiece W and the lower mold insert block 6. The lowering operation of the pin-out plate is lowered in conjunction with the lowering operation, and one end side of the workpiece W is pushed by the workpiece pushing member 7a.

At this time, the workpiece pushing member 7a is swung counterclockwise around the fulcrum 7b by the elastic pushing of the coil spring 7c to push the one end side of the workpiece W. As shown in FIG. 1B, since the workpiece W is in a state where the frictional resistance with the lower mold insert block 6 is small due to the air ejected from the air suction / ejection hole 6a, the sliding amount on the heating chamber 4 side is fixed ( (E.g., about 4 to 5 mm) so that the other end side of the workpiece is pushed against the workpiece return member 8a. At this time, the workpiece returning member 8a resists the elastic pushing of the coil spring 8c, and shakes and stops in the counterclockwise direction with the fulcrum 8b as the center. Thereby, the workpiece W is leaned to the side in a state where the workpiece pushing member 7a is pushed against the workpiece returning member 8a.

When the workpiece W leans to the side, air is sucked downward from the air suction / ejection hole 6 a toward the die insert block 6, and the workpiece W is sucked and held by the lower die insert block 6. At this time, the movable module 9 is in a state where the bridge portion 9 a is separated from the lower mold insert block 6 by the spring of the coil spring 10.

In FIG. 2A, the mold 3 is closed and the upper mold 2 resists the spring of the coil spring 10 to push the movable mold 9 to the lower mold 1 side. At this time, the bridge portion 9a is depressed by the opposite bridge recess 2c, so that the other end side of the workpiece is sandwiched between the bridge portion 9a and the lower mold insert block 6. Next, as shown in FIG. 2B, the plunger 5 is raised, and the molding resin R melted in the heating chamber 4 passes through the upper mold scrap 2a, the upper mold runner 2b, the bridge recess 2c, and the upper mold gate groove 2d. The cavity recess 2e facing the mold cavity is filled. Next, the molding resin R filled in the recessed part 2e of the upper mold cavity is heat-hardened.

Therefore, by molding the resin R through the resin path (bridge bridge groove 9b) between the movable mold 9 (bridge bridge portion 9a) and the upper mold 2 (bridge bridge groove 2c), it is possible to prevent the resin from entering the end surface of the workpiece.

In FIG. 3A, the adsorption and holding of the work W after the heat hardening is released, and the mold opening of the mold 3 is started. Next, as shown in FIG. 3B, while the state in which air is ejected from the air suction / ejection hole 6 a of the lower mold insert block 6 to the workpiece W is maintained, the movable mold 9 is moved by the coil spring 10 with the mold opening operation. It is separated from the workpiece W by a spring push, thereby breaking the gate. In addition, the ejector pin plate (not shown) moves downward to approach (move up) the lower die insert 6 to raise the protruding ejector 7d, and the workpiece pushing member 7a resists the elastic push of the coil spring 7c and is supported by the fulcrum 7b. Retreat from the self-propelled position to shake the center clockwise. At this time, the resin residue scrap and resin flow path (unwanted resin R ') are protruded from the lower mold 1 by protruding through the eject pins (not shown), and the work return member 8a is pushed by the spring of the coil spring 8c When the other end of the workpiece is pushed back, the workpiece W is separated due to the unnecessary resin R ′ and the gate being broken. The formed workpiece W is separated from the undesired resin R 'from the opened mold 3 by an unillustrated unloader or the like and taken out.

Thereby, since the workpiece W supported by the lower mold 1 is clamped between the lower mold 1 and the upper mold 2, the workpiece pushing member 7a is pushed against the workpiece returning member 8a and leaned to the side, so that it can be reduced as much as possible. A gap generated between the mold 3 and the end surface of the workpiece. When the mold closing is completed, the movable mold 9 is pressed down by the upper mold 2 to sandwich the workpiece W between the movable mold 9 and the lower mold insert 6 and clamp the upper mold 2 opposite to the movable mold 9. A resin path is formed between the holding surfaces, so that the molding resin R will pass through the resin path between the movable mold 9 and the upper mold 2 without leakage of the resin from the end surface of the workpiece.

When the mold is opened, the gate is broken due to the separation of the movable mold 9 from the workpiece W, the workpiece pushing member 7a is retracted, and the workpiece W is pushed back by the workpiece returning member 8a to separate from the unnecessary resin R '. Since the gate can be broken in the mold to separate it from the molded product and the unnecessary resin R ', it is possible to efficiently take out the molded product.

When the workpiece W and the unnecessary resin R ′ are to be taken out integrally, the coil spring 10 that moves the movable module 9 and the coil spring 8c of the workpiece return mechanism 8 are made weak, and the workpiece W and The required resin R 'is integrated. After that, as long as the workpiece W and the unnecessary resin R 'are maintained integrally demolded, they are taken out of the molding die, and after taking out from the molding die and the gate is broken, the unnecessary resin R' is taken out of the workpiece W. can.

6A and 6B show another example of the mold for transfer molding. Those members that are the same as those in FIG. 1 are given the same reference numerals and descriptions will be used.

FIG. 6A shows that the workpiece pushing mechanism 7 provided in the lower die 1 and the workpiece return mechanism 8 are the same components. That is, the workpiece pushing operation of the workpiece pushing mechanism 7 and the workpiece returning movement of the workpiece return mechanism 8 are linked with the lifting operation of an eject pin plate (not shown) provided below the lower die insert block 6. Specifically, the ejector pins 7d and 8d are connected to the ejector pin plate. Since the ejector pins 7d and 8d are lowered when the ejector pin plate is retracted from the lower die insert block 6, the workpiece pushes the member 7a. One end side of the work W placed on the lower die insert block 6 is elastically pushed by the coil spring 7c. The spring force of the coil spring 7c is larger than that of the coil spring 8c. Also, when the ejector pin plate is close to the lower mold insert block 6, the protruding ejectors 7d and 8d will rise, so the workpiece return member 8a resists the coil spring. The spring push of 7c, 8c pushes the other end side of the workpiece back, and at the same time, the workpiece pushing member 7a retracts from the pushing position.

FIG. 6B shows an embodiment in which a bridging groove is not provided as a resin path in the bridging portion 9 a of the movable module 9, and a deep groove is engraved in the bridging recess 2 c of the upper mold 2 opposite to the bridging portion 9 a. The other mold configurations are the same as those of FIG. 1.

FIG. 7 illustrates an embodiment of a mold suitable for compression molding. FIG. 7A shows the cavity of the upper mold cavity, and FIG. 7B shows the mold for forming the cavity of the lower mold cavity.

In FIG. 7A, the structures of the workpiece pushing mechanism 7, the workpiece returning mechanism 8, and the movable module 9 provided in the lower mold 1 (first mold) are the same as those in FIG.

The upper mold 12 (second mold) includes an upper mold cavity mold 12a and an upper mold holder 12b forming an upper mold cavity recess 12c. The upper mold cavity module 12a forms the bottom of the upper mold cavity, and the upper mold holder 12b surrounding the periphery forms the upper mold cavity side. Either the upper mold cavity module 12a or the upper mold holder 12b may be suspended and supported by an unillustrated upper mold base portion by a coil spring, or both may be suspended and supported by a coil spring.

On the clamping surface of the upper mold holder 12b, a bridge recess 12e communicating with the upper mold runner 12d is formed in the upper mold cavity recessed portion 12c. The upper mold bridge recess 12e is disposed opposite to the movable mold 9 of the lower mold 1, and a resin path is formed between the upper mold bridge recess 12e and the bridge groove 9b when the bridge mold 9a is clamped by the upper mold bridge recess 12e. The upper mold overflow cavity 12g is provided in communication with the upper mold bridge recess 12e through the upper mold runner 12f. The upper mold overflow cavity 12g is an overflow cavity module 12h formed by being suspended and supported by the upper mold holder 12b by a coil spring 12i. The release sheet 11 is sucked and held on the upper mold clamping surface including the resin path.

The molding resin is supplied to the workpiece W in a state where the workpiece W supplied to the lower mold 1 is brought to the side by the workpiece pushing mechanism 7 and the workpiece returning mechanism 8. In addition, the molding resin R may be placed on the workpiece W and supplied to the lower mold at the same time. When the upper mold 12 and the lower mold 1 are closed, the movable mold 9 is pressed down by the upper mold 12 against the urging of the coil spring 10. When the bridge portion 9a is fitted into the upper mold bridge recess 12e, The workpiece W is clamped. At this time, as the volume of the upper mold cavity recess 12c decreases, the molding resin R overflowing from the upper mold runner 12d passes through the upper mold through the bridge groove 9b and the upper mold bridge recess 12e formed between the bridge portion 9a. The runner 12f is filled in the overflow cavity 12g. At this time, when the overflow cavity module 12h is pressed against the spring force of the coil spring 12i, it is formed that resin pressure can be applied by pushing back by the spring force of the coil spring 12i.

After compression molding, when the mold 3 is opened, the movable mold 9 rises. Since the workpiece W is returned from the side by the workpiece pushing mechanism 7 and the workpiece return mechanism 8, the gate is broken in the mold. The workpiece W is separated from the unnecessary resin.

FIG. 7B shows a mold for compression molding in which a cavity of a lower mold cavity is formed. The comparison of FIG. 7A shows the arrangement of the first mold and the second mold.

In FIG. 7B, the configuration of the work pushing mechanism 7, the work return mechanism 8, and the movable mold 9 provided in the upper mold 13 (first mold) is the same as that of the lower mold 1 of FIG. 1. The workpiece W is sucked and held by the air suction / ejection hole 15 a provided in the upper mold insert block 15. In consideration of the side-to-side motion, it is preferable that the workpiece W is held by a chuck or the like.

The lower mold 14 (second mold) includes a lower mold cavity mold 14a and a lower mold holder 14b forming a lower mold cavity recess 14c. The lower die cavity module 14a forms the bottom of the lower die cavity and the lower die holder 14b surrounding the lower die holder 14b forms the lower die cavity side. The lower mold cavity module 14a is generally a fixed mold, and the lower mold holder 14b is floatingly supported by a spring, but it can also be used for both the lower mold cavity module 14a and the lower mold holder 14b. The coil spring may be supported by floating, and may be any one. In this case, it is necessary that the spring of the lower die cavity module 14a be made stronger than the spring of the lower die holder 14b.

A lower mold holder bridge recessed portion 14e is formed on the clamping surface of the lower mold holder 14b and communicates with the lower mold cavity recessed portion 14c via the lower mold flow path 14d. The lower mold bridge recess 14e is opposite to the movable mold 9 of the upper mold 13, and a resin path is formed between the lower mold bridge recess 14e and the bridge groove 9b when the bridge mold 9a is clamped by the lower mold bridge recess 14e. The lower mold overflow cavity 14g is provided through the lower mold runner 14f and the lower mold bridge recess 14e. The lower mold overflow cavity 14g is an overflow cavity module 14h which is formed by suspending and supporting the lower mold holder 14b by a coil spring 14i. The release sheet 11 is sucked and held on the lower mold holding surface including the resin path.

With the workpiece pushing mechanism 7 and the workpiece returning mechanism 8 holding the workpiece W supplied to the upper mold 13, the molding resin (not shown) is supplied into the lower cavity recess 14c. In addition, the supply of the workpiece W and the molding resin may be performed simultaneously, or the molding resin may be supplied first. In addition, it is necessary to make the workpiece suction hole as a long hole so that the workpiece fixed to the upper mold can be moved from the mounting position, or the workpiece suction hole itself may slide laterally, or a workpiece holder (chuck, etc.) Does not affect the position of the workpiece moving direction or can be made movable. When the upper mold 13 and the lower mold 14 are closed, the movable mold 9 is pushed down by the lower mold 14 against the urging of the coil spring 10, and the bridge portion 9a is pushed back to the lower mold bridge recess 14e to clamp the workpiece. surface. At this time, as the volume of the lower mold cavity recessed portion 14c decreases, the molding resin R overflowing through the lower mold flow passage 14d passes through the bridge groove 9b and the bridge recess 14e formed through the bridge portion 9a and passes through the lower mold flow passage. 14f is filled in the overflow cavity 14g. At this time, when the overflow cavity module 14h is pressed against the spring force of the coil spring 14i, it is formed that resin pressure can be applied by pushing back the spring force of the coil spring 14i. In addition, although the pressurizing mechanism using the coil spring 14i is placed in the overflow mold cavity 14g of this embodiment, it is not necessary to pressurize, and the overflow mold cavity may be a simple space or an open state.

After the compression molding, when the mold 3 is opened, the movable mold 9 is lowered, and the workpiece W is returned from the edge position by the workpiece pushing mechanism 7 and the workpiece return mechanism 8. Therefore, the gate is broken in the mold to make the workpiece W is separated from unwanted resin.

FIGS. 8A and 8B show examples of the planar layout of the workpiece support side (upper mold 13 or lower mold 14) and the cavity recess side (lower mold 14 or upper mold 13) of the molding mold using compression molding.

FIG. 8A is the layout of the workpiece support side. A workpiece pushing mechanism 7 is provided along two adjacent sides of the rectangular workpiece W so as to push the side surface of one end of the workpiece through the workpiece pushing members 7a provided on two sides of each side. The adjacent two sides are pushed toward the opposite sides, and as a result, the workpiece W is brought to the side based on the corner.

Further, a workpiece return mechanism 8 is provided on each of the side of the workpiece W where the workpiece pushing mechanism 7 is provided and the opposite side, and the other end side of the workpiece is pushed against the workpiece return member 8a provided at two positions on each side. Further, in the vicinity of the work return mechanism 8, the movable module 9 is always urged and pushed in a direction protruding from the clamping surface by the coil spring 10.

The movable mold 9 is formed such that when the mold is closed, the workpiece is held by the bridge portion 9a while the other side of the holding workpiece is pushed against the workpiece return member 8a. In FIG. 8A, although a bridge groove 9b is formed as a resin path in the bridge portion 9a, a groove as a resin path may be provided in the bridge recess 14e, and a groove as a resin path may be provided on both sides.

FIG. 8B shows the layout of the cavity recesses (12c, 14c). Flow paths (12d, 14d) and bridge recesses (12e, 14e), flow paths (12f, 14f), and overflow mold cavities (12g, 14g).

When the mold is closed, the mold resin in the cavity recesses (12c, 14c) overflows between the movable mold 9 and the bridge recesses (12e, 14e) through the flow channels (12d, 14d), and passes through the flow. The channels (12f, 14f) are filled toward the overflow cavity (12g, 14g), and resin pressure is applied by the overflow cavity module (12h, 14h).

FIG. 9 shows another example of the mold 3 for transfer molding. Those with the same components as those in FIG. 1 are given the same reference numerals and descriptions will be used. FIG. 9 shows an embodiment in which the form of the bridge portion 9a and the upper mold bridge recess 2c of the movable mold 9 of the lower mold 1 are changed. The bridge portion 9a has an asymmetric shape with respect to the center of the shaft portion 9c. In addition, the side surface portion 9d of the bridge portion 9a of the movable mold member 9 is provided so as to form a side portion of the upper mold cavity recessed portion 2e.

In addition, a bridging groove 9b as a resin path may be provided in the bridging portion 9a, a deep resin path may be carved in the upper mold bridge recess 2c, or grooves may be carved in both sides.

When the molding mold 3 is closed, the movable mold 9 is pushed back against the spring of the coil spring 10, and the work piece W on the side is clamped with the lower mold insert block 6 and placed in the recess 2e of the upper mold cavity. The side surface forms a top gate 2f.

In this way, not only the mold resin is filled from the mold gate groove 2d formed on the opening on the side of the upper mold clamping surface, but also the mold resin can be filled from the top surface gate 2f formed on the side of the cavity.

In each of the above-mentioned embodiments, the structure of a molding die having a plurality of semiconductor wafers bonded by crystal grains on an organic substrate as the workpiece W and a flow path crossing the substrate has been exemplified. It is also possible to apply a structure of a mold W in which a single or a plurality of semiconductor wafers T are thermally peeled and a plurality of semiconductor wafers T are die-bonded to the thermally peeled sheet, and a flow path crosses a step on the substrate.

In addition, when the workpiece is brought to the side on the insert block or taken out after forming, although air can be ejected from the air suction / exhaust hole formed in the insert block, the ejection of air may be omitted depending on the workpiece W.

In addition, the surface treatment of the workpiece support surface of the insert block may be used in combination with the ejection of air.

In the above-mentioned molding mold, the upper mold 2 is set as a fixed mold and the lower mold 1 is set as a movable mold, but the upper mold 2 may be a movable mold, the lower mold 1 may be a fixed mold, and both sides may be set as movable molds. The heating chamber 4 may be formed in the upper mold 2 and the cavity recessed portion may be formed in the lower mold 1. In addition, the workpiece W is not limited to a metal substrate for packaging an LED element, and may be a resin substrate, or other workpieces in which a semiconductor wafer is connected by a flip chip method or connected to a substrate by a wire bonding method. The molding resin is not limited to a resin for silicone (silicone resin), and may be an epoxy resin or the like.

Claims (11)

    A molding die is configured to hold the workpiece together with a molding resin by a first mold supporting a workpiece and a second mold formed with a cavity recess, and the first mold is provided with the first mold and the first mold. The mold clamping surface is separated and provided as a movable mold that can move in / out of contact. The end of the workpiece that intersects the resin path is clamped between the movable mold and the first mold when the mold is closed. A part of the resin path communicating with the cavity recessed portion of the cavity is formed between the movable mold and the second mold holding surface opposite to the movable mold.         A molding die is used for transfer molding in which a first mold supporting a workpiece and a second mold formed with a cavity recess are used to hold the workpiece, and a molding resin supplied to a heating chamber is filled toward the cavity recess through a resin path. A molding die for: a workpiece pushing mechanism for pushing one side surface of the workpiece supported by the first mold; and a workpiece return mechanism for pushing against the other side surface of the workpiece pushed by the workpiece pushing mechanism. And push back to the side of the other end of the workpiece in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and a movable module, which is separated from the clamping surface of the first mold in the first mold and is arranged to be accessible / detachable Moving, the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece pushing mechanism and moved aside in conjunction with the mold closing action, and the other end side of the workpiece is clamped into the movable mold. A cavity is formed between the movable mold and the clamping surface of the second mold opposite to the first mold. The resin path portion.         According to the mold of claim 1 or 2, wherein the movable mold is provided at a mold runner gate, the mold runner gate communicates with a heating chamber provided in the first mold and the cavity recess of the mold.         A molding die is configured to compress the molding resin from the cavity recessed portion to the overflow cavity by clamping the foregoing workpiece by a first mold supporting the workpiece and a second mold formed with a cavity recessed portion. A compression mold for molding is provided with a workpiece pushing mechanism for pushing one end side of the workpiece supported by the first die, and a workpiece return mechanism for pushing against the workpiece pushed by the workpiece pushing mechanism. The other end side surface, and is pushed back to the other end side surface of the workpiece in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and a movable module, which is separated from the clamping surface of the first mold and provided in contact with the first mold Moving away from the workpiece, the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece pushing mechanism and moved to the side in conjunction with the mold closing action, and the other end of the workpiece is clamped into the movable mold. Between the movable mold and the clamping surface of the second mold opposite to the first mold The resin path that overflows from the overflow cavity is described.         The mold according to any one of claims 1 to 4, wherein a workpiece suction surface of the first mold is provided with an air suction / ejection hole connected to an air suction / ejection mechanism, and the workpiece is pressed against the first When the mold is leaning, the workpiece is pushed against the workpiece returning mechanism by the workpiece pushing mechanism while ejecting air from the air suction / ejection hole, and sucks air from the air suction / ejection hole while keeping the workpiece sideways. Adsorption remains.         The molding die according to any one of claims 1 to 5, wherein a bridge portion is formed in the movable mold, and the upper surface of the movable mold faces the workpiece return mechanism while keeping the other end side of the workpiece against the workpiece return mechanism. The mold is pushed in, and is always pushed by the elastic member provided in the first mold, so that the bridge portion is separated from the first mold.         A resin molding method is characterized in that a pair of molding dies is used to clamp a workpiece, and the molding resin supplied to the heating chamber is filled with a resin path toward the cavity recess to perform transfer molding. The method includes: The first mold of the aforementioned molding dies supports the engineering of the workpiece; the workpiece pushing member pushes one side of the workpiece and pushes the other side of the workpiece against the workpiece return member and leans to the side; while maintaining the state that the workpiece is leaned to the side A process of lowering and holding the first mold; closing the mold to clamp the other end of the workpiece between a movable mold provided separately from the clamping surface of the first mold and the first mold Side process; including the resin path formed between the second mold and the movable mold, from the heating chamber through the resin path to the cavity recess formed in the second mold opposite to the workpiece and filled A process of molding a resin and heat-hardening it; a process of making the workpiece pushing member retract from the side of one end of the workpiece after heating and curing; and The process of taking out the molded product from the aforementioned mold that has been opened.         The resin molding method according to claim 7, wherein the resin path between the second mold and the movable mold is a mold runner gate, which communicates the heating chamber provided in the first mold with the cavity concave portion. .         A resin molding method uses a pair of molding dies to hold a workpiece and a molding resin so that the foregoing molding resin overflows from a cavity recess into an overflow cavity to perform compression molding. The resin molding method is characterized in that: Including: the project of the first mold in the opened mold to support the workpiece; the workpiece pushing member pushes one side of the workpiece and pushes the other side of the workpiece against the workpiece return member and leans to the side; The molding mold is closed to clamp the other end of the workpiece between a movable mold provided separately from the clamping surface of the first mold and the first mold; including a process formed between the second mold and the foregoing mold. Including the resin path between the movable molds, the molding resin is formed from the cavity recess of the second mold opposite to the workpiece, and the resin path overflows through the resin path to the overflow cavity and is heated and hardened. Process; a process of retreating the workpiece pushing member from one end side of the workpiece after heating and hardening; and a process of taking out a molded product from the molding die that has been opened.         The resin molding method according to claim 9, wherein the resin path between the second mold and the movable mold is a mold runner, which communicates the cavity recess with the overflow mold cavity.         The resin molding method according to any one of claims 7 to 10, wherein one side of the workpiece is pushed by the workpiece pushing member by maintaining the state in which air is sprayed from the first mold to the workpiece, so that the other side of the workpiece is pushed Push against the aforementioned workpiece return member and lean to the side.