TWI439225B - Electronic protection device - Google Patents
Electronic protection device Download PDFInfo
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- TWI439225B TWI439225B TW100137396A TW100137396A TWI439225B TW I439225 B TWI439225 B TW I439225B TW 100137396 A TW100137396 A TW 100137396A TW 100137396 A TW100137396 A TW 100137396A TW I439225 B TWI439225 B TW I439225B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
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- Microelectronics & Electronic Packaging (AREA)
- Elimination Of Static Electricity (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本發明是有關一種電子保護裝置。The present invention relates to an electronic protection device.
靜電是一種物理現象，其存在於物體或人體的表面，是正負電荷在局部失衡時產生的一種現象。靜電產生的方式有很多種，例如接觸或摩擦等。此外，靜電具有高電壓、低電量、小電流且作用的時間短的特性，對於電子產品來說，在天氣乾燥情況下，人體接觸電子產品的金屬外殼時，可能因人體與金屬外殼間的電位差而產生靜電，靜電可藉由電子產品的金屬外殼傳遞至是電子產品內部的其他電子零件(例如主機板)，當電位差過大時可能會造成電子零件損壞。Static electricity is a physical phenomenon that exists on the surface of an object or human body and is a phenomenon that occurs when the positive and negative charges are locally unbalanced. There are many ways to generate static electricity, such as contact or friction. In addition, static electricity has the characteristics of high voltage, low power, low current and short duration of action. For electronic products, when the human body touches the metal casing of the electronic product in the dry weather, the potential difference between the human body and the metal casing may be caused. Static electricity is generated, which can be transmitted to other electronic parts (such as the motherboard) inside the electronic product through the metal casing of the electronic product. When the potential difference is too large, the electronic parts may be damaged.
另一方面，具有金屬外殼的電子產品也可能因內部電子零件接觸金屬外殼而產生漏電流，例如電子零件與金屬外殼組裝時的誤差或震動產生的位移皆有可能使電子零件接觸金屬外殼。因此，當金屬外殼有電子零件產生的漏電流時，人體接觸金屬外殼便會產生觸電的感覺，嚴重時可能會對人體造成傷害。On the other hand, an electronic product having a metal casing may also cause leakage current due to contact of the internal electronic component with the metal casing. For example, an error in the assembly of the electronic component and the metal casing or a displacement caused by vibration may cause the electronic component to contact the metal casing. Therefore, when the metal casing has leakage current generated by the electronic component, the human body may feel an electric shock when it contacts the metal casing, and may cause harm to the human body in severe cases.
一般而言，電子產品對靜電與漏電流最簡單的防護方式就是避免金屬外殼與電子零件接觸或導通，然而在現今電子產品越來越輕薄的需求下，電子產品的金屬外殼與內部電子零件的距離也會越來越小，因此製造者要製作具有金屬外殼的電子產品又同時保有靜電與漏電流防護的功能並不容易。In general, the simplest protection of electronic products against static electricity and leakage current is to avoid contact or conduction between the metal casing and the electronic components. However, in the increasingly thin and light demand of electronic products, the metal casing and internal electronic components of electronic products The distance will be smaller and smaller, so it is not easy for the manufacturer to make an electronic product with a metal casing while maintaining the protection against static electricity and leakage current.
本發明之一技術態樣為一種電子保護裝置，分別耦接於電子裝置的金屬外殼與電路板接地端。One aspect of the present invention is an electronic protection device that is coupled to a metal housing of the electronic device and a ground end of the circuit board.
根據本發明一實施方式，一種電子保護裝置包含軟性電路板、第一導電部、第二導電部與靜電防護元件。軟性電路板具有第一表面。第一導電部位於第一表面且耦接金屬外殼。第二導電部位於第一表面且耦接電路板接地端。第二導電部與第一導電部之間間隔一絕緣間隙。靜電防護元件跨接於第一導電部與第二導電部。According to an embodiment of the invention, an electronic protection device includes a flexible circuit board, a first conductive portion, a second conductive portion, and an electrostatic protection element. The flexible circuit board has a first surface. The first conductive portion is located on the first surface and coupled to the metal casing. The second conductive portion is located on the first surface and coupled to the ground of the circuit board. An insulating gap is spaced between the second conductive portion and the first conductive portion. The electrostatic protection component is connected across the first conductive portion and the second conductive portion.
在本發明一實施方式中，其中上述電子保護裝置更包含第三導電部位於軟性電路板的第二表面，其中第二表面與第一表面分別位於軟性電路板的相反側。In an embodiment of the invention, the electronic protection device further includes a third conductive portion on the second surface of the flexible circuit board, wherein the second surface and the first surface are respectively located on opposite sides of the flexible circuit board.
在本發明一實施方式中，其中上述軟性電路板具有導電孔，藉以導通第一導電部與第三導電部。In an embodiment of the invention, the flexible circuit board has a conductive hole for conducting the first conductive portion and the third conductive portion.
在本發明一實施方式中，其中上述電子保護裝置更包含導電膠層附著於第三導電部上。In an embodiment of the invention, the electronic protection device further includes a conductive adhesive layer attached to the third conductive portion.
在本發明一實施方式中，其中上述第一導電部、第二導電部與第三導電部的材質包含銀。In an embodiment of the invention, the material of the first conductive portion, the second conductive portion, and the third conductive portion includes silver.
在本發明一實施方式中，其中上述軟性電路板、第一導電部、第二導電部、第三導電部與靜電防護元件的厚度之總和小於0.7mm。In an embodiment of the invention, the sum of the thicknesses of the flexible circuit board, the first conductive portion, the second conductive portion, the third conductive portion, and the static electricity protection element is less than 0.7 mm.
在本發明一實施方式中，其中上述電子保護裝置更包含強化板對應於靜電防護元件的位置且設置於第二表面或第三導電部。In an embodiment of the invention, the electronic protection device further includes a position of the reinforcing plate corresponding to the electrostatic protection element and is disposed on the second surface or the third conductive portion.
在本發明一實施方式中，其中上述強化板的材質包含玻璃纖維或不鏽鋼。In an embodiment of the invention, the material of the reinforcing plate comprises glass fiber or stainless steel.
在本發明一實施方式中，其中上述軟性電路板、第一導電部、第二導電部、第三導電部、靜電防護元件與強化板的厚度之總和小於0.8mm。In an embodiment of the invention, the sum of the thicknesses of the flexible circuit board, the first conductive portion, the second conductive portion, the third conductive portion, the electrostatic protection element, and the reinforcing plate is less than 0.8 mm.
在本發明一實施方式中，其中上述靜電防護元件包含電容或二極體。In an embodiment of the invention, the electrostatic protection element comprises a capacitor or a diode.
在本發明上述實施方式中，由於在軟性電路板之第一表面的第一導電部與第二導電部分別耦接金屬外殼與電路板接地端，且第二導電部與第一導電部之間間隔一絕緣間隙，因此當電路板接地端有漏電流產生時，此絕緣間隙可以阻隔漏電流由第二導電部傳遞至第一導電部，而降低使用者觸摸電子裝置的金屬外殼時發生觸電的機率。此外，電子保護裝置的靜電防護元件跨接於第一導電部與第二導電部之間，因此當使用者觸摸電子裝置的金屬外殼而產生靜電時，此靜電防護元件可以阻隔靜電由第一導電部傳遞至第二導電部，而降低電路板因靜電而損壞的機率。In the above embodiment of the present invention, the first conductive portion and the second conductive portion on the first surface of the flexible circuit board are respectively coupled to the metal housing and the circuit board ground end, and between the second conductive portion and the first conductive portion. An insulating gap is separated, so that when a leakage current is generated at the ground end of the circuit board, the insulating gap can block the leakage current from being transmitted to the first conductive portion by the second conductive portion, thereby reducing the electric shock when the user touches the metal casing of the electronic device. Probability. In addition, the electrostatic protection component of the electronic protection device is connected between the first conductive portion and the second conductive portion, so when the user touches the metal casing of the electronic device to generate static electricity, the static electricity protection component can block static electricity from the first conductive The portion is transferred to the second conductive portion to reduce the probability that the circuit board is damaged by static electricity.
另一方面，電子保護裝置因使用軟性電路板作為基板，因此不具強化板的電子保護裝置其厚度可小於0.7mm，而具有強化板的電子保護裝置其厚度也可小於0.8mm。這樣的設計對於製造者來說，此電子保護裝置具有厚度薄、重量輕的優點，應用於薄型化的電子裝置中不僅不易影響空間使用率與散熱效率，還具有防制漏電流與靜電的功能，而提升產品競爭力。On the other hand, since the electronic protection device uses a flexible circuit board as a substrate, the thickness of the electronic protection device without the reinforcing plate can be less than 0.7 mm, and the thickness of the electronic protection device having the reinforcing plate can be less than 0.8 mm. Such a design has the advantages of thin thickness and light weight for the manufacturer. The thin electronic device not only does not easily affect the space utilization rate and heat dissipation efficiency, but also has the function of preventing leakage current and static electricity. And enhance product competitiveness.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本發明一實施方式之電子保護裝置100應用於電子裝置200的剖面圖。第2圖繪示第1圖之電子保護裝置100的立體圖。同時參閱第1圖與第2圖，電子裝置200具有金屬外殼210與電路板接地端220。電子保護裝置100包含軟性電路板110、第一導電部120、第二導電部130與靜電防護元件140。軟性電路板110具有第一表面112與位於第一表面112相反側的第二表面114。第一導電部120位於第一表面112且耦接金屬外殼210。第二導電部130位於第一表面112且耦接電路板接地端220。第二導電部130與第一導電部120之間間隔絕緣間隙150。靜電防護元件140跨接於第一導電部120與第二導電部130。FIG. 1 is a cross-sectional view showing an electronic protection device 100 applied to an electronic device 200 according to an embodiment of the present invention. FIG. 2 is a perspective view of the electronic protection device 100 of FIG. 1 . Referring also to FIGS. 1 and 2, the electronic device 200 has a metal housing 210 and a circuit board ground terminal 220. The electronic protection device 100 includes a flexible circuit board 110, a first conductive portion 120, a second conductive portion 130, and an electrostatic protection element 140. The flexible circuit board 110 has a first surface 112 and a second surface 114 on the opposite side of the first surface 112. The first conductive portion 120 is located on the first surface 112 and coupled to the metal casing 210. The second conductive portion 130 is located on the first surface 112 and coupled to the circuit board ground terminal 220. An insulating gap 150 is spaced between the second conductive portion 130 and the first conductive portion 120. The static electricity protection component 140 is connected across the first conductive portion 120 and the second conductive portion 130 .
具體而言，由於在軟性電路板110之第一表面112的第一導電部120與第二導電部130分別耦接金屬外殼210與電路板接地端220。因此當電路板接地端220有漏電流產生時，第二導電部130與第一導電部120之間間隔的絕緣間隙150可以阻隔漏電流由第二導電部130傳遞至第一導電部120，而降低使用者觸摸電子裝置200的金屬外殼210時發生觸電的機率。Specifically, the first conductive portion 120 and the second conductive portion 130 of the first surface 112 of the flexible circuit board 110 are respectively coupled to the metal housing 210 and the circuit board ground terminal 220. Therefore, when a leakage current is generated on the ground terminal 220 of the circuit board, the insulation gap 150 between the second conductive portion 130 and the first conductive portion 120 can block the leakage current from being transmitted from the second conductive portion 130 to the first conductive portion 120. The probability of electric shock when the user touches the metal casing 210 of the electronic device 200 is reduced.
此外，電子保護裝置100的靜電防護元件140跨接於第一導電部120與第二導電部130，當使用者觸摸電子裝置200的金屬外殼210時可能會產生靜電，靜電防護元件140可以阻隔靜電由第一導電部120傳遞至第二導電部130，而降低電路板因靜電而損壞的機率。In addition, the static electricity protection component 140 of the electronic protection device 100 is connected to the first conductive portion 120 and the second conductive portion 130. When the user touches the metal outer casing 210 of the electronic device 200, static electricity may be generated, and the static electricity protection component 140 can block static electricity. The first conductive portion 120 is transferred to the second conductive portion 130, thereby reducing the probability that the circuit board is damaged by static electricity.
電子保護裝置100因使用軟性電路板110作為基板，這樣的設計對於製造者來說，電子保護裝置100具有厚度薄、重量輕的優點，應用於薄型化產品中不易影響空間使用率與散熱效率，還具有防制漏電流與靜電的功能，可以提升產品的競爭力。Since the electronic protection device 100 uses the flexible circuit board 110 as a substrate, such a design has the advantages that the electronic protection device 100 has a small thickness and a light weight, and is not easily affected by the space utilization rate and the heat dissipation efficiency in a thin product. It also has the function of preventing leakage current and static electricity, which can enhance the competitiveness of the product.
上述靜電防護元件140可以包含電容或二極體。第一導電部120與第二導電部130的材質可以包含銀(例如銀膠)或其他具導電性的金屬。製造者可以使用網印的方式分別將第一導電部120與第二導電部130形成於軟性電路板110之第一表面112，且第一導電部120與第二導電部130之間的絕緣間隙150大小與靜電防護元件140的尺寸可依照設計者需求而定。The above electrostatic protection element 140 may comprise a capacitor or a diode. The material of the first conductive portion 120 and the second conductive portion 130 may include silver (for example, silver paste) or other conductive metal. The manufacturer can form the first conductive portion 120 and the second conductive portion 130 on the first surface 112 of the flexible circuit board 110 by using a screen printing method, and the insulation gap between the first conductive portion 120 and the second conductive portion 130. The size of the 150 and the size of the ESD protection element 140 can be tailored to the needs of the designer.
第3圖繪示根據本發明另一實施方式之電子保護裝置100應用於電子裝置200的剖面圖。第4圖繪示第3圖之電子保護裝置100的立體圖。電子保護裝置100包含軟性電路板110、第一導電部120、第二導電部130與靜電防護元件140，然而與上述實施方式不同的地方在於電子保護裝置100更包含第三導電部160與導電膠層170。其中，第三導電部160位於軟性電路板110的第二表面114，而導電膠層170附著於第三導電部160上且位於第三導電部160與金屬外殼210之間。此外，軟性電路板110還具有導電孔116藉以導通第一導電部120與第三導電部160。FIG. 3 is a cross-sectional view showing the application of the electronic protection device 100 to the electronic device 200 according to another embodiment of the present invention. FIG. 4 is a perspective view of the electronic protection device 100 of FIG. 3. The electronic protection device 100 includes a flexible circuit board 110, a first conductive portion 120, a second conductive portion 130, and an electrostatic protection device 140. However, the difference from the above embodiment is that the electronic protection device 100 further includes a third conductive portion 160 and a conductive adhesive. Layer 170. The third conductive portion 160 is located on the second surface 114 of the flexible circuit board 110 , and the conductive adhesive layer 170 is attached to the third conductive portion 160 and located between the third conductive portion 160 and the metal casing 210 . In addition, the flexible circuit board 110 further has a conductive hole 116 for conducting the first conductive portion 120 and the third conductive portion 160.
在本實施方式中，第一導電部120不直接接觸金屬外殼210，而是藉由導電孔116、第三導電部160與導電膠層170的設置間接耦接於金屬外殼210。同樣地，當電路板接地端220有漏電流產生時，第二導電部130與第一導電部120之間間隔的絕緣間隙150可以阻隔漏電流由第二導電部130傳遞至第一導電部120。此外，當使用者觸摸電子裝置200的金屬外殼210時可能會產生靜電，接著靜電會由金屬外殼210經由導電膠層170、第三導電部160與導電孔116傳遞至第一導電部120，因此靜電防護元件140仍可以阻隔靜電由第一導電部120傳遞至第二導電部130。這樣的電子保護裝置100也可降低使用者觸摸電子裝置200的金屬外殼210時發生觸電的機率與降低電路板因靜電而損壞的機率。In the embodiment, the first conductive portion 120 does not directly contact the metal casing 210 , but is indirectly coupled to the metal casing 210 by the conductive holes 116 , the third conductive portion 160 and the conductive adhesive layer 170 . Similarly, when a leakage current is generated at the ground terminal 220 of the circuit board, the insulating gap 150 between the second conductive portion 130 and the first conductive portion 120 can block the leakage current from being transmitted from the second conductive portion 130 to the first conductive portion 120. . In addition, when the user touches the metal casing 210 of the electronic device 200, static electricity may be generated, and then the static electricity is transmitted from the metal casing 210 to the first conductive portion 120 via the conductive adhesive layer 170, the third conductive portion 160, and the conductive hole 116. The static electricity protection element 140 can still block static electricity from being transmitted from the first conductive portion 120 to the second conductive portion 130. Such an electronic protection device 100 can also reduce the probability of electric shock when the user touches the metal casing 210 of the electronic device 200 and reduce the probability of damage to the circuit board due to static electricity.
上述第三導電部160的材質可以包含銀。軟性電路板110、第一導電部120、第二導電部130、第三導電部160與靜電防護元件140的厚度之總和H1可以小於0.7mm。此外，在較佳的實施方式中，軟性電路板110的厚度約為0.15至0.2mm，且靜電防護元件140的厚度約為0.3mm。如此一來，電子保護裝置100的厚度之總和H1約為0.45至0.5mm。The material of the third conductive portion 160 may include silver. The sum H1 of the thicknesses of the flexible circuit board 110, the first conductive portion 120, the second conductive portion 130, the third conductive portion 160, and the static electricity protection member 140 may be less than 0.7 mm. Further, in a preferred embodiment, the flexible circuit board 110 has a thickness of about 0.15 to 0.2 mm, and the electrostatic protection element 140 has a thickness of about 0.3 mm. As a result, the total thickness H1 of the electronic protection device 100 is about 0.45 to 0.5 mm.
然而在上述實施方式中，在組裝軟性電路板110時，在絕緣間隙150的位置可能因強度不足易受外力而損壞，在以下實施方式中，將敘述解決軟性電路板110強度不足的技術手段。However, in the above-described embodiment, when the flexible circuit board 110 is assembled, the position of the insulating gap 150 may be damaged by external force due to insufficient strength. In the following embodiments, a technical means for solving the problem of insufficient strength of the flexible circuit board 110 will be described.
第5圖繪示根據本發明又一實施方式之電子保護裝置100應用於電子裝置200的剖面圖。第6圖繪示第5圖之電子保護裝置100的立體圖。電子保護裝置100包含軟性電路板110、第一導電部120、第二導電部130與靜電防護元件140，然而與上述實施方式不同的地方在於電子保護裝置100更包含強化板180，其中強化板180對應於靜電防護元件140的位置且設置於第二表面114。FIG. 5 is a cross-sectional view showing an electronic protection device 100 applied to an electronic device 200 according to still another embodiment of the present invention. FIG. 6 is a perspective view of the electronic protection device 100 of FIG. 5. The electronic protection device 100 includes a flexible circuit board 110, a first conductive portion 120, a second conductive portion 130, and an electrostatic protection element 140. However, the difference from the above embodiment is that the electronic protection device 100 further includes a reinforcing plate 180, wherein the reinforcing plate 180 Corresponding to the position of the static electricity protection element 140 and disposed on the second surface 114.
在本實施方式中，強化板180的材質可以包含玻璃纖維或不鏽鋼。強化板180的設置可使軟性電路板110在絕緣間隙150的位置具有較佳的強度。在以下的敘述中，已經在上述實施方式中提過的元件連接關係與材料，將不再重複贅述，僅就強化板180相關的技術內容再加以補充，合先敘明。In the present embodiment, the material of the reinforcing plate 180 may include glass fiber or stainless steel. The provision of the stiffener 180 allows the flexible circuit board 110 to have better strength at the location of the insulating gap 150. In the following description, the component connection relationships and materials that have been mentioned in the above embodiments will not be described again, and only the technical contents related to the reinforcing plate 180 will be supplemented.
第7圖繪示根據本發明再一實施方式之電子保護裝置100應用於電子裝置200的剖面圖。第8圖繪示第7圖之電子保護裝置100的立體圖。電子保護裝置100包含軟性電路板110、第一導電部120、第二導電部130與靜電防護元件140，然而與上述實施方式不同的地方在於電子保護裝置100更包含第三導電部160與強化板180。其中，強化板180對應於靜電防護元件140的位置且設置於第三導電部160。FIG. 7 is a cross-sectional view showing an electronic protection device 100 applied to an electronic device 200 according to still another embodiment of the present invention. FIG. 8 is a perspective view of the electronic protection device 100 of FIG. 7. The electronic protection device 100 includes a flexible circuit board 110, a first conductive portion 120, a second conductive portion 130, and an electrostatic protection element 140. However, the difference from the above embodiment is that the electronic protection device 100 further includes a third conductive portion 160 and a reinforcing plate. 180. The reinforcing plate 180 corresponds to the position of the static electricity protection element 140 and is disposed on the third conductive portion 160 .
在本實施方式中，軟性電路板110、第一導電部120、第二導電部130、第三導電部160、靜電防護元件140與強化板180的厚度之總和H2可以小於0.8mm。此外，在較佳的實施方式中，軟性電路板110的厚度約為0.15至0.2mm，靜電防護元件140的厚度約為0.3mm，且強化板180的厚度約為0.1mm。如此一來，電子保護裝置100的厚度之總和H2約為0.55至0.6mm。In the present embodiment, the sum H2 of the thicknesses of the flexible circuit board 110, the first conductive portion 120, the second conductive portion 130, the third conductive portion 160, the static electricity protection element 140, and the reinforcing plate 180 may be less than 0.8 mm. Further, in a preferred embodiment, the flexible circuit board 110 has a thickness of about 0.15 to 0.2 mm, the electrostatic protection element 140 has a thickness of about 0.3 mm, and the reinforcing plate 180 has a thickness of about 0.1 mm. As a result, the total thickness H2 of the electronic protection device 100 is about 0.55 to 0.6 mm.
綜合上述，電子保護裝置100主要包含軟性電路板110、第一導電部120、第二導電部130與靜電防護元件140便可具有防制漏電流與靜電的功能，設計者可依照金屬外殼210的位置與形狀來選擇性地增加第三導電部160、導電膠層170或強化板180。In summary, the electronic protection device 100 mainly includes the flexible circuit board 110, the first conductive portion 120, the second conductive portion 130, and the electrostatic protection component 140, and has the functions of preventing leakage current and static electricity, and the designer can follow the metal housing 210. The position and shape are used to selectively increase the third conductive portion 160, the conductive adhesive layer 170, or the reinforcing plate 180.
本發明上述實施方式具有以下優點：The above embodiments of the present invention have the following advantages:
(1) 位於第一導電部與第二導電部之間的絕緣間隙可阻隔漏電流由第二導電部傳遞至第一導電部，而降低使用者觸摸電子裝置的金屬外殼時發生觸電的機率。(1) The insulating gap between the first conductive portion and the second conductive portion can block leakage current from being transmitted to the first conductive portion by the second conductive portion, thereby reducing the probability of electric shock when the user touches the metal casing of the electronic device.
(2) 跨接於第一導電部與第二導電部的靜電防護元件可阻隔靜電由第一導電部傳遞至第二導電部，因此當使用者觸摸電子裝置的金屬外殼而產生靜電時可降低電路板損壞的機率。(2) The ESD protection element that is connected to the first conductive portion and the second conductive portion can block static electricity from being transmitted from the first conductive portion to the second conductive portion, so that when the user touches the metal casing of the electronic device to generate static electricity, the voltage can be reduced. The probability of board damage.
(3) 電子保護裝置因使用軟性電路板作為基板，因此具有厚度薄、重量輕的優點，應用於薄型化的電子裝置中不易影響空間使用率與散熱效率。(3) Since the electronic protection device uses a flexible circuit board as a substrate, it has the advantages of thin thickness and light weight, and it is difficult to affect space utilization rate and heat dissipation efficiency in a thin electronic device.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100．．．電子保護裝置100. . . Electronic protection device
110．．．軟性電路板110. . . Flexible circuit board
112．．．第一表面112. . . First surface
114．．．第二表面114. . . Second surface
116．．．導電孔116. . . Conductive hole
120．．．第一導電部120. . . First conductive part
130．．．第二導電部130. . . Second conductive portion
140．．．靜電防護元件140. . . Electrostatic protection element
150．．．絕緣間隙150. . . Insulation gap
160．．．第三導電部160. . . Third conductive part
170．．．導電膠層170. . . Conductive adhesive layer
180．．．強化板180. . . Reinforcement board
200．．．電子裝置200. . . Electronic device
210．．．金屬外殼210. . . metal shell
220．．．電路板接地端220. . . Board ground
H1．．．厚度之總和H1. . . Sum of thickness
H2．．．厚度之總和H2. . . Sum of thickness
第1圖繪示根據本發明一實施方式之電子保護裝置應用於電子裝置的剖面圖。1 is a cross-sectional view showing an electronic protection device applied to an electronic device according to an embodiment of the present invention.
第2圖繪示第1圖之電子保護裝置的立體圖。Fig. 2 is a perspective view showing the electronic protection device of Fig. 1.
第3圖繪示根據本發明另一實施方式之電子保護裝置應用於電子裝置的剖面圖。3 is a cross-sectional view showing an electronic protection device applied to an electronic device according to another embodiment of the present invention.
第4圖繪示第3圖之電子保護裝置的立體圖。Fig. 4 is a perspective view showing the electronic protection device of Fig. 3.
第5圖繪示根據本發明又一實施方式之電子保護裝置應用於電子裝置的剖面圖。5 is a cross-sectional view showing an electronic protection device applied to an electronic device according to still another embodiment of the present invention.
第6圖繪示第5圖之電子保護裝置的立體圖。Fig. 6 is a perspective view showing the electronic protection device of Fig. 5.
第7圖繪示根據本發明再一實施方式之電子保護裝置應用於電子裝置的剖面圖。FIG. 7 is a cross-sectional view showing an electronic protection device applied to an electronic device according to still another embodiment of the present invention.
第8圖繪示第7圖之電子保護裝置的立體圖。Figure 8 is a perspective view of the electronic protection device of Figure 7.
100．．．電子保護裝置100. . . Electronic protection device
110．．．軟性電路板110. . . Flexible circuit board
112．．．第一表面112. . . First surface
114．．．第二表面114. . . Second surface
120．．．第一導電部120. . . First conductive part
130．．．第二導電部130. . . Second conductive portion
140．．．靜電防護元件140. . . Electrostatic protection element
150．．．絕緣間隙150. . . Insulation gap
Claims (8)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100137396A TWI439225B (en) | 2011-10-14 | 2011-10-14 | Electronic protection device |
| KR1020120105271A KR101410900B1 (en) | 2011-10-14 | 2012-09-21 | Electronic protection device |
| CN201210370268.5A CN103050951B (en) | 2011-10-14 | 2012-09-28 | Electronic protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100137396A TWI439225B (en) | 2011-10-14 | 2011-10-14 | Electronic protection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201316894A TW201316894A (en) | 2013-04-16 |
| TWI439225B true TWI439225B (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW100137396A TWI439225B (en) | 2011-10-14 | 2011-10-14 | Electronic protection device |
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| Country | Link |
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| KR (1) | KR101410900B1 (en) |
| CN (1) | CN103050951B (en) |
| TW (1) | TWI439225B (en) |
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| TWI683557B (en) | 2014-01-31 | 2020-01-21 | 日商新力股份有限公司 | Communications device and method |
| WO2017074088A1 (en) | 2015-10-28 | 2017-05-04 | 주식회사 아모텍 | Electric shock prevention apparatus |
| KR102416213B1 (en) | 2017-05-30 | 2022-07-05 | 삼성전자주식회사 | Method for preventing electric shock and electronic device for the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2077627U (en) * | 1990-07-02 | 1991-05-22 | 北京市电子工艺技术研究中心 | Meter casing with electrostatic-eliminating device |
| JP3513455B2 (en) * | 2000-03-14 | 2004-03-31 | キヤノン株式会社 | Electronics |
| JP2006012495A (en) * | 2004-06-23 | 2006-01-12 | Hitachi Communication Technologies Ltd | Electrostatic discharge structure of electronic equipment |
| TWI318700B (en) * | 2005-11-11 | 2009-12-21 | Innolux Display Corp | A liquid crystal display panel |
| KR20070054929A (en) * | 2005-11-24 | 2007-05-30 | 주식회사 하이닉스반도체 | Electrostatic Protection Devices for Semiconductor Circuits |
| KR20080037468A (en) * | 2006-10-26 | 2008-04-30 | 삼성전자주식회사 | Printed circuit board |
| CN101000753A (en) * | 2007-01-10 | 2007-07-18 | 友达光电股份有限公司 | Data transmission circuit and liquid crystal display with electrostatic protection |
| TWM339184U (en) * | 2007-11-29 | 2008-08-21 | Wintek Corp | Electronic device |
| CN102017339B (en) | 2008-05-08 | 2013-12-04 | 株式会社村田制作所 | Substrate incorporating ESD protection function |
| TWM352223U (en) * | 2008-07-17 | 2009-03-01 | Wintek Corp | Flexible printed circuit and liquid crystal module using the same |
| TWI425881B (en) * | 2009-04-29 | 2014-02-01 | Compal Electronics Inc | Electronic device |
| KR101103296B1 (en) | 2010-07-20 | 2012-01-11 | 엘지이노텍 주식회사 | PCB with Switching Conductor Layer for ESD Protection |
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2011
- 2011-10-14 TW TW100137396A patent/TWI439225B/en active
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2012
- 2012-09-21 KR KR1020120105271A patent/KR101410900B1/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201316894A (en) | 2013-04-16 |
| CN103050951B (en) | 2015-08-26 |
| KR101410900B1 (en) | 2014-06-23 |
| CN103050951A (en) | 2013-04-17 |
| KR20130040698A (en) | 2013-04-24 |
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