CN201438809U - electromagnetic interference suppression module - Google Patents

Abstract

An electromagnetic interference suppression module comprises at least one metal gasket which is arranged on a circuit board. The metal gasket comprises a welding part and a grounding part which are connected. At least one fixing lug of a connector is welded on the welding part, and at least one bulge on the grounding shell is contacted with the grounding part so as to electrically connect the connector to the grounding shell.

Description

Electromagnetic Interference Suppression Module

technical field

The utility model relates to a suppressing module, in particular to a suppressing module for electromagnetic interference.

Background technique

With the rapid development of science and technology today, various electronic devices have become an indispensable part of modern life. As the functions of electronic devices become more and more complex, opportunities for different electronic devices to be connected to each other to transmit data are becoming more and more frequent. The most common way of connecting electronic devices is to transmit data through connecting wires.

For example, use a universal serial bus (Universal Serial Bus, USB) cable to connect a notebook computer and a digital camera. The two ends of the USB cable are respectively connected to the USB connector of the notebook computer and the USB connector of the digital camera, so as to transmit the images stored in the digital camera to the notebook computer. In notebook computers, the USB connector (or other I/O connector) is often secured to the circuit board of the notebook computer by one or more tabs on the connector itself. The case of the notebook computer has a corresponding opening, whereby the connector is exposed.

However, when the notebook computer is being tested for electromagnetic interference or electrostatic discharge, or when a user touches a connector exposed to the housing, the connector will not work normally due to the influence of electromagnetic interference or electrostatic charge. In severe cases, it may even cause damage to the connector.

In order to solve such problems, the general practice in the industry is to use elements such as metal shrapnel (spring finger), conductive foam (gasket) or aluminum foil (foil), and arrange them between the connector and the housing to electrically connect the connector. sexual connection in the case. This method of additionally arranging components between the connector and the shell not only increases the inconvenience of assembling the notebook computer, but also increases the cost.

Utility model content

Therefore, the purpose of this utility model is to provide an electromagnetic interference suppression module that can solve the above problems.

In order to achieve the purpose of the utility model, according to an embodiment of the utility model, an electromagnetic interference suppression module is provided, which at least includes a circuit board, a metal gasket, a connector and a first grounding casing. The circuit board has at least one welding hole passing through a first surface and a second surface opposite to the circuit board. The metal gasket is disposed on the first surface and includes a welding part and a grounding part. The welding part is located around the welding hole, and the ground part is connected to the welding part. The connector is disposed on the second surface and has at least one fixing lug. The fixing lug passes through the welding hole and is welded to the welding portion. The first grounding case has a first protrusion, which contacts the grounding portion on the first surface to electrically connect the connector and the first grounding case.

According to an embodiment of the present invention, the first protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion.

According to another embodiment of the present invention, the shape of the ground portion on the first surface corresponds to the shape of the first protrusion.

According to another embodiment of the present invention, the area of the grounding portion on the first surface is larger than the area of the welding portion on the first surface.

According to another embodiment of the present invention, the area of the grounding portion on the first surface is greater than or equal to the cross-sectional area of the first protrusion on the first surface.

According to still another embodiment of the present invention, the first grounding chassis includes a first electroplated metal layer for electrically connecting to an external grounding plane.

According to another embodiment of the present invention, the first electroplated metal layer covers the first protrusion, and the first protrusion contacts the ground portion on the first surface through the first electroplated metal layer.

According to another embodiment of the present invention, the metal gasket is also arranged on the second surface. The metal pads arranged on the first surface and the second surface respectively include a welding part and a grounding part.

According to another embodiment of the present invention, the fixing lug of the connector is welded to the welding portions on the first and second surfaces.

According to another embodiment of the present invention, the electromagnetic interference suppression module further includes a second grounding casing, which has a second protrusion, which contacts the grounding part on the second surface, so as to electrically connect the connector and the second 2. Ground the chassis.

According to another embodiment of the present invention, the second grounding chassis includes a second electroplated metal layer for electrically connecting to the external grounding plane.

According to another embodiment of the present invention, the second electroplated metal layer covers the second protrusion, and the second protrusion contacts the ground portion on the second surface through the second electroplated metal layer.

According to another embodiment of the present invention, the second protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion.

According to another embodiment of the present invention, the area of the grounding portion on the second surface is larger than the area of the welding portion on the second surface.

According to another embodiment of the present invention, the area of the grounding portion on the second surface is greater than or equal to the cross-sectional area of the second protrusion on the second surface.

The electromagnetic interference suppression module of the embodiment of the utility model uses the way that the protrusion on the grounding case contacts the grounding part of the metal gasket, so that the connector is directly electrically connected to the grounding case, and the damage suffered by the connector can be eliminated. Electrostatic discharge and electromagnetic interference are guided to the grounded chassis, which effectively improves the operation quality of the connector. In addition, there is no need to additionally arrange components such as metal shrapnel and conductive foam between the circuit board and the casing, which can save costs.

Description of drawings

In order to make the above and other purposes, features, advantages and embodiments of the present utility model more obvious and understandable, the description of the accompanying drawings is as follows:

FIG. 1A shows a perspective view of an electromagnetic interference suppression module according to an embodiment of the present invention.

Fig. 1B shows a side view of the electromagnetic interference suppression module in Fig. 1A.

Fig. 2A shows a perspective view of an electromagnetic interference suppression module according to another embodiment of the present invention.

Fig. 2B shows a side view of the electromagnetic interference suppression module in Fig. 2A.

Fig. 3 shows a side view of an electromagnetic interference suppression module according to yet another embodiment of the present invention.

Description of main component symbols

100: Electromagnetic interference suppression module 251: The first grounding chassis

110: Circuit board 251a: The first protrusion

110a: Welding hole 252: Second grounding chassis

111: first surface 252a: second protrusion

112: The second surface 255: The first electroplated metal layer

130: Metal gasket 256: Second electroplating metal layer

130a: Welding part 290: Connector

130b: Grounding part 291: Fixing lug

151: First grounding chassis 300: Electromagnetic interference suppression module

151a: First protrusion 310: Circuit board

155: The first electroplated metal layer 310a: Welding hole

190: connector 311: first surface

191: Fixing lug 312: Second surface

200: Electromagnetic interference suppression module 330: Metal gasket

210: Circuit board 330a: Welding part

210a: Welding hole 330b: Grounding part

211: the first surface 351a: the first protrusion

212: Second surface 352a: Second protrusion

230: metal gasket 390: connector

230a: Welding part 391: Fixing lug

230b: Grounding part G: External grounding plane

Detailed ways

The electromagnetic interference suppression module of the embodiment of the present invention is used to electrically connect the connector on the circuit board to the external ground plane by using the grounding case, so as to isolate the connector from the external electromagnetic interference and maintain the connector quality of operation.

Please refer to FIG. 1A and FIG. 1B at the same time. FIG. 1A shows a perspective view of an EMI suppression module according to an embodiment of the present invention, and FIG. 1B shows a side view of the EMI suppression module in FIG. 1A . The electromagnetic interference suppression module 100 includes a circuit board 110 , a metal washer 130 and a first grounded casing 151 . The circuit board 110 has at least one soldering hole 110a. As shown in FIG. 1B , in the electromagnetic interference suppression module 100 , the circuit board 110 has a plurality of welding holes 110 a as an example. The soldering holes 110 a respectively pass through a first surface 111 and a second surface 112 opposite to the circuit board 110 . The metal pad 130 is disposed on the first surface 111 . The first ground chassis 151 and the first surface 111 are located on the same side of the circuit board 110 . The first grounding chassis 151 has a first protrusion 151 a, and the first protrusion 151 a is in contact with a part of the metal washer 130 .

Further, the metal pad 130 includes a welding portion 130a correspondingly located around each welding hole 110a. The plurality of fixing lugs 191 of the connector 190 respectively pass through the welding holes 110a from the second surface 112 and are welded to the welding portions 130a. In practice, the connector 190 is, for example, an Institute of Electrical and Electronics Engineering (IEEE) 1394 connector, a Universal Serial Bus (USB) connector, or other output/input connectors. In addition, the connector 190 is, for example, welded to the welding portion 130 a on the first surface 111 via soldering.

In addition, the metal washer 130 also includes a ground portion 130b connected to the welding portion 130a. The first protrusion 151 a of the first grounded chassis 151 is in contact with the ground portion 130 b of the metal washer 130 . In one embodiment, the area of the ground portion 130b on the first surface 111 is greater than the area of the soldering portion 130a on the first surface 111 . The area of the grounding portion 130b is greater than or equal to the cross-sectional area of the first protrusion 151a, so that the first protrusion 151a is in good electrical contact with the grounding portion 130b, which can improve the grounding effect.

In addition, the first ground chassis 151 includes a first electroplated metal layer 155 for electrically connecting to an external ground plane G. As shown in FIG. The first electroplated metal layer 155 covers at least the first protrusion 151 a of the first grounded chassis 151 , and the first protrusion 151 a contacts the metal pad 130 on the first surface 111 through the first electroplated metal layer 155 . Therefore, when the connector 190 is subjected to electromagnetic interference or electrostatic discharge, it can be electrically connected to the external ground plane G via the fixing lug 191, the soldering portion 130a, the grounding portion 130b and the first electroplated metal layer 155, thereby suppressing electromagnetic interference. And avoid the problem of electrostatic discharge damage.

In one embodiment, the connector 190 has two fixing lugs 191 , and the circuit board 110 correspondingly has two soldering holes 110 a, which are located on both sides of the connector 190 as shown in FIG. 1A and FIG. 1B . The metal pads 130 are disposed corresponding to the two soldering holes 110a, and the metal pads 130 on the left and right sides of the connector 190 each include a soldering portion 130a and a grounding portion 130b. In addition, in this embodiment, the first protrusion 151a takes two cylinders as an example, as shown in FIG. 1B . The two cylinders respectively contact the ground portion 130b of the metal washer 130 on both sides of the connector 190, so as to electrically connect the connector 190 to the external ground plane G. As shown in FIG.

However, the first protrusion 151a is not limited to a cylindrical shape. For example, the first protrusion 151a may also be a polygonal column, a cone, a polygonal pyramid, or an arc-shaped protrusion. Any surface that protrudes from the first grounded chassis 151 and can be used to contact the metal washer 130 on the first surface 111 can be applied here. In practice, the number of soldering holes 110 a is equal to the number of fixing lugs 191 of the connector 190 , and the shape of the grounding portion 130 b corresponds to the shape of the first protrusion 151 a. In addition, the number of soldering holes 110 a on the circuit board 110 and the arrangement of the metal pads 130 are also not limited to those shown in FIGS. 1A and 1B .

For example, when the connector 190 has a fixing lug 191 , the circuit board 110 has a corresponding welding hole 110 a. The metal pad 130 is disposed corresponding to the welding hole 110a. Correspondingly, the first protrusion 151a includes a cylinder and contacts the ground portion 130b at the corresponding welding hole 110a. When the connector 190 has four fixing lugs 191 , there are correspondingly four soldering holes 110 a on the circuit board 110 . The metal pads 130 are arranged corresponding to the four welding holes 110a, and correspond to the metal pads 130 at each of the welding holes 110a, and each includes a welding portion 130a and a grounding portion 130b. Correspondingly, the first protrusion 151a includes four cylinders, respectively contacting the grounding portion 130b corresponding to each welding hole 110a.

Please refer to FIG. 2A and FIG. 2B at the same time. FIG. 2A shows a perspective view of an EMI suppression module according to another embodiment of the present invention, and FIG. 2B shows a side view of the EMI suppression module in FIG. 2A . In the electromagnetic interference suppression module 200 , the circuit board 210 has a plurality of soldering holes 210 a, and each soldering hole 210 a penetrates through the opposite first surface 211 and the second surface 212 of the circuit board 210 . In addition, the metal gasket 230 is disposed on the first surface 211 and the second surface 212 . The metal pads 230 on the first and second surfaces 211 and 212 each include a soldering portion 230a and a grounding portion 230b. A plurality of fixing lugs 291 of the connector 290 pass through the welding holes 210 a, and are welded to the welding portion 230 a on the first surface 211 and to the welding portion 230 a on the second surface 212 .

In addition, the electromagnetic interference suppression module 200 includes a first grounded casing 251 and a second grounded casing 252 disposed on opposite sides of the circuit board 210 . The first ground chassis 251 is disposed above the first surface 211 of the circuit board 210 and has a first protrusion 251a. The second ground chassis 252 is disposed on the second surface 212 of the circuit board 210 and has a second protrusion 252a. The first protrusion 251 a contacts the ground portion 230 b on the first surface 211 , and the second protrusion 252 a contacts the ground portion 230 b on the second surface 212 .

The area of the grounding portion 230b on the first surface 211 is greater than the area of the soldering portion 230a on the first surface 211 . The area of the grounding portion 230b on the second surface 212 is greater than the area of the soldering portion 230a on the second surface 212 . In addition, the area of the ground portion 230b on the first surface 211 is greater than or equal to the cross-sectional area of the first protrusion 251a on the first surface 211 . The area of the ground portion 230b on the second surface 212 is greater than or equal to the cross-sectional area of the second protrusion 252a on the second surface 212 . In this way, the metal gasket 230 is in good contact with the first and second protrusions 251a and 252a respectively, which can improve the quality of electrical contact, and further improve the grounding effect.

Further, the first grounded chassis 251 includes a first electroplated metal layer 255 for electrically connecting to the external ground plane G. As shown in FIG. The first electroplated metal layer 255 covers the first protrusion 251 a, and the first protrusion 251 a contacts the ground portion 230 b on the first surface 211 via the first electroplated metal layer 255 . In addition, the second ground chassis 252 includes a second electroplated metal layer 256 for electrically connecting to the external ground plane G. As shown in FIG. The second electroplated metal layer 256 covers the second protrusion 252 a, and the second protrusion 252 a contacts the ground portion 230 b on the second surface 212 via the second electroplated metal layer 256 .

The connector 290 is electrically connected to the external ground plane G via the fixing lug 291 , the metal washer 230 on the first surface 211 and the first electroplated metal layer 255 , and at the same time is connected to the external ground plane G via the fixing lug 291 , the metal gasket 230 on the second surface 212 . The metal pad 230 and the second electroplated metal layer 256 are electrically connected to the external ground plane G. As shown in FIG. When the connector 290 suffers from electromagnetic interference or electrostatic discharge, the interference and discharge can be directed to the external ground plane G, which can avoid the damage caused by electromagnetic interference and electrostatic discharge, thereby improving the operation stability of the connector 290 .

In one embodiment, the first protrusion 251 a and the second protrusion 252 a are respectively two cylinders as an example, as shown in FIG. 2A . However, the shapes of the first and second protrusions 251a and 252a are not limited to cylindrical shapes. For example, the first and second protrusions 251a and 252a can also be one or more polygonal pillars, cones, polygonal pyramids, arc-shaped protrusions, etc. respectively. In practice, the shape of the ground portion 230b on the first surface 211 corresponds to the first protrusion 251a, and the shape of the ground portion 230b on the second surface 212 corresponds to the second protrusion 252a. In addition, the first protrusion 251a The second protrusions 252a can have different shapes, for example, the first protrusions 251a can include cylinders, and the second protrusions 252a can include polygonal columns.

Please refer to FIG. 3 , which shows a side view of an electromagnetic interference suppression module according to yet another embodiment of the present invention. In the electromagnetic interference suppression module 300 , the circuit board 310 has a plurality of welding holes 310 a , and each welding hole 310 a penetrates through the first surface 311 and the second surface 312 of the circuit board 310 . The metal gasket 330 is disposed on the first surface 311 and the second surface 312 . The metal pads 330 located on the first surface 311 and the second surface 312 each include a soldering portion 330a and a grounding portion 330b.

In one embodiment, the connector 390 has two fixing lugs 391 , and the circuit board 310 correspondingly has two soldering holes 310 a located on two sides of the connector 390 . The soldering portion 330 a on the first surface 311 is disposed corresponding to the two soldering holes 310 a and located on two sides of the connector 390 respectively. The grounding portion 330b on the first surface 311 is located between the welding portions 330a on both sides. The welding portion 330 a on the second surface 312 is disposed corresponding to the two welding holes 310 a and located on two sides of the connector 390 respectively. The grounding portion 330b on the second surface 312 is also disposed on both sides of the connector 390 and is respectively connected to the soldering portion 330a on both sides of the connector 390 .

In addition, the first protrusion 351a is a cylinder, and the second protrusion 352a is two cylinders. The first protrusion 351a is in contact with the grounding portion 330b on the first surface 311 and between the two welding portions 330a. The second protrusion 352 a contacts the grounding portion 330 b on the second surface 312 and on two sides of the connector 390 . In this way, the connector 390 is electrically connected to the external ground plane G via the fixing lug 391 , the metal washer 330 on the first surface 311 and the first protrusion 351 a. In addition, the connector 390 is electrically connected to the external ground plane G via the fixing lug 391 , the metal washer 330 on the second surface 312 and the second protrusion 352 a at the same time.

In one embodiment, the first protrusion 351 a and the second protrusion 352 a are respectively one cylinder and two cylinders as an example, as shown in FIG. 3A . However, the shapes of the first and second protrusions 351a and 352a are not limited to cylindrical shapes. For example, the first and second protrusions 351a and 352a can also be polygonal pillars, cones, polygonal pyramids, arc-shaped protrusions, etc. respectively. In practice, the shape of the ground portion 330b on the first surface 311 corresponds to the first protrusion 351a, and the shape of the ground portion 330b on the second surface 312 corresponds to the second protrusion 352a. In addition, the first protrusion 351a The second protrusion 252a and the second protrusion 252a may respectively have different shapes. For example, the first protrusion 351a may comprise a cylinder, and the second protrusion 352a may comprise two polygonal columns.

In the above-mentioned electromagnetic interference suppression module according to the embodiment of the present invention, protrusions are formed on the grounded chassis, and metal gaskets are arranged on the circuit board. The fixing lug of the connector is welded on the welding part of the metal washer, and the protrusion is in contact with the grounding part of the metal washer. In this way, the connector can be electrically connected to the external ground plane, avoiding electromagnetic interference and electrostatic discharge of the connector, and maintaining the operation quality of the connector. In addition, by means of the protrusions contacting the metal gasket, there is no need to additionally arrange conductive elements between the grounded chassis and the circuit board, which can reduce the number of elements and save costs.

Although the present utility model has been disclosed as above in terms of implementation, it is not intended to limit the present utility model. Any person skilled in the art may make various modifications and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be defined by the claims.

Claims (20)

1. An electromagnetic interference suppression module, characterized in that it at least includes: A circuit board having at least one soldering hole passing through opposite first and second surfaces of the circuit board; A metal gasket is disposed on the first surface and includes: a weld located around the at least one weld hole; and a grounding portion connected to the welding portion; a connector disposed on the second surface, the connector having at least one fixing lug passing through the at least one welding hole and welded to the welding portion; and A first grounding case has a first protrusion contacting the grounding portion on the first surface to electrically connect the connector and the first grounding case. 2. The module according to claim 1, wherein the first protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion. 3 . The module according to claim 1 , wherein a shape of the ground portion on the first surface corresponds to a shape of the first protrusion. 4 . 4 . The module according to claim 1 , wherein an area of the grounding portion on the first surface is larger than an area of the soldering portion on the first surface. 5. The module according to claim 1, wherein an area of the ground portion on the first surface is greater than or equal to a cross-sectional area of the first protrusion on the first surface. 6. The module according to claim 1, characterized in that, the metal gasket is also arranged on the second surface, and the metal gasket arranged on the first and the second surface respectively includes the welding portion and the the ground section. 7. The module according to claim 6, wherein the at least one fixing lug is welded to the welding portion on the first and second surfaces. 8. The module according to claim 6, further comprising: A second grounding case has a second protrusion contacting the grounding portion on the second surface to electrically connect the connector and the second grounding case. 9. The module according to claim 8, wherein the second protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion. 10 . The module according to claim 9 , wherein a shape of the ground portion on the second surface corresponds to a shape of the second protrusion. 11 . 11. The module according to claim 1, wherein the first ground chassis comprises: A first electroplated metal layer is used to electrically connect to an external ground plane, the first electroplated metal layer covers the first protrusion, and the first protrusion contacts the first protrusion through the first electroplated metal layer. The ground portion of the surface. 12. The module according to claim 11, wherein the first protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion. 13 . The module according to claim 12 , wherein an area of the ground portion on the first surface is larger than an area of the welding portion on the first surface. 14 . 14. The module according to claim 13, wherein an area of the ground portion on the first surface is greater than or equal to a cross-sectional area of the first protrusion on the first surface. 15. The module according to claim 11, characterized in that, the metal spacer is also disposed on the second surface, and the metal spacers disposed on the first and second surfaces respectively include the welding portion and the the ground section. 16. The module of claim 15, further comprising: A second grounding case has a second protrusion contacting the grounding portion on the second surface to electrically connect the connector and the second grounding case. 17. The module of claim 16, wherein the second grounded enclosure comprises: A second electroplating metal layer is used to electrically connect to the external ground plane, the second electroplating metal layer covers the second protrusion, and the second protrusion contacts the second protrusion through the second electroplating metal layer. This ground portion on the surface. 18. The module according to claim 17, wherein the second protrusion is a cylinder, a polygonal column, a cone, a polygonal pyramid or an arc-shaped protrusion. 19. The module according to claim 18, wherein an area of the ground portion on the second surface is larger than an area of the solder portion on the second surface. 20. The module according to claim 19, wherein an area of the ground portion on the second surface is greater than or equal to a cross-sectional area of the second protrusion on the second surface.

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