TWI434441B - Light emitting diode package structure - Google Patents

Description

Light emitting diode package structure

The invention relates to a light-emitting diode package structure, in particular to a light-emitting diode package structure with uniform color temperature distribution and low halo phenomenon.

In the current light-emitting diode package structure, fluorescent powder is widely used to obtain white, warm or pink light. For example, a general white light emitting diode mainly uses a potting compound mixed with yellow phosphor powder to encapsulate a blue light wafer, and blue light emitted from the blue light crystal excites yellow fluorescent powder to generate yellow light, and is generated. The yellow light will be combined with other blue light emitted by the blue light wafer to eventually produce white light; or, the blue light wafer may be encapsulated by an encapsulant mixed with green and red fluorescent powder, and the blue light emitted from the blue light crystal will excite the green and red fluorescent powder. The green light and the red light are generated, and the green light and the red light are combined with the blue light to generate white light.

Fluorescent powder in the encapsulant used in the conventional LED package structure is easily precipitated and unevenly distributed by gravity, resulting in a region with a large distribution of red and green phosphors in the gel body. Red light and green light, while the red and green fluorescent powder distribution in the gel body produces more blue light with high color temperature. Due to the uneven mixing of blue light and red light and green light, the color temperature is not uniform and the obvious light is formed. Halo phenomenon. In addition, if the phosphor powder is directly contacted with a high-powered wafer due to precipitation, it is easy to cause the phosphor powder to disperse. Poor heat causes a decrease in the luminous efficiency of the light-emitting diode and an increase in the loss rate of the fluorescent powder.

In view of the above, it is a primary object of the present invention to provide a light emitting diode package structure having a uniformly distributed color temperature and which is less prone to halo phenomenon.

Another object of the present invention is to provide a light-emitting diode package structure that is more durable to use.

To achieve the above objective, the LED package structure of the present invention mainly comprises a substrate, a light emitting diode chip and an encapsulant. The LED chip is disposed on the substrate and electrically connected to the substrate. The encapsulant is disposed on the substrate and covers the LED chip. The encapsulant has uniformly distributed phosphor powder. Thereby, the light emitting diode package structure of the present invention has a uniformly distributed color temperature difference and is less prone to halo phenomenon.

The LED package of the present invention further includes a wire for connecting the LED chip and the substrate to electrically connect the LED chip to the substrate, and the encapsulant Wrap the wire. Thereby, the wire can be insulated from the outside air to reduce the probability of oxidation of the wire, and the LED package structure of the present invention is more durable.

In the LED package structure of the present invention, the encapsulant preferably comprises a viscosity coefficient of at least 60 kgf. s/m ² organic resin material. Thereby, the phosphor powder can be uniformly distributed in the encapsulant.

Detailed structure of the light emitting diode package structure provided by the present invention The features and the features of the embodiments of the present invention are set forth in the appended claims.

The following is a brief description of the contents of the drawings used in conjunction with the embodiments of the present invention, wherein: FIG. 1 is a cross-sectional view showing a state of a light emitting diode package structure according to a preferred embodiment of the present invention; and a second view In another cross-sectional view, another aspect of a light emitting diode package structure in accordance with the preferred embodiment of the present invention is shown.

Referring to the first embodiment, a light emitting diode package structure 10 according to a preferred embodiment of the present invention mainly includes a substrate 11, a light emitting diode chip 13, a wire 15 and an encapsulant 17.

The substrate 11 may be made of a conductive or non-conductive heat conductive material, and the heat conductive material is preferably selected from a metal material, a ceramic material, a composite material, a carbon nanotube or a printed circuit board. The foregoing metal material may be, for example, copper, silver, aluminum or an alloy thereof; the aforementioned ceramic material may be, for example, alumina (Al ₂ O ₃ ), tantalum carbide (SiC) or aluminum nitride (AlN).

The LED wafer 13 may be made of tantalum carbide (SiC) or a III-V compound semiconductor material, such as gallium nitride (GaN) or gallium phosphide (for example). GaP) or gallium arsenide (GaAsP). When manufacturing, the LED chip 13 is disposed on the substrate 11, and the top surface of the LED chip 13 is top or bottom. The positive and negative electrodes are disposed on the top surface of the light emitting diode 13 in the embodiment, and the positive and negative electrodes pass through the wire 15 and the substrate 11 . The light-emitting diode 13 is electrically connected to the substrate 11 .

The encapsulant 17 is composed of an organic resin material and phosphor powder in this embodiment. Wherein, the organic resin material has a refractive index greater than 1.40 and has a minimum of 60 kgf. a viscosity coefficient of s/m ² , and the organic resin material is preferably a silicone resin; and the phosphor powder is not particularly limited, and may be a commercially available phosphor powder for a light emitting diode package, and Choose the appropriate color according to actual needs. At the time of manufacture, the encapsulant 17 is mixed with the organic resin material and the phosphor powder by a high-speed stirring defoamer to uniformly distribute the phosphor powder in the encapsulant 17, and then the encapsulant is assembled by a dispenser. 17 is disposed on the substrate 11 and covers the LED chip 13 .

It is worth mentioning that, in practical application, the encapsulant 17 can also be disposed on the substrate 11 and simultaneously cover the LED chip 13 and the wire 15 as shown in the second figure, thereby preventing the wire. The contact with the outside air 15 reduces the probability of oxidation of the wire 15, so that the light-emitting diode package structure 10 of the present invention can be used more durable.

In summary, since the encapsulating colloid 17 of the LED package structure 10 of the present invention has uniformly distributed phosphor powder, it has a uniform distribution of color temperature and is less prone to halo phenomenon, and the generated light quality is better. Further, since the uniformly distributed phosphor powder is not easily in direct contact with the light-emitting diode wafer 13, the problem of a decrease in luminous efficiency and an increase in the loss rate of the phosphor powder due to heat dissipation can be reduced. In addition, wrapping the wire 15 in the encapsulant 17 can also reduce the oxidation probability of the wire 15 and increase the service life of the LED package structure 10 of the present invention.

While the present invention has been described by the foregoing embodiments, the present invention is not limited to the foregoing embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention.

10. . . Light emitting diode package structure

11. . . Substrate

13. . . Light-emitting diode chip

15. . . wire

17. . . Encapsulant

1 is a cross-sectional view showing a state of a light emitting diode package structure in accordance with a preferred embodiment of the present invention;

The second figure is a cross-sectional view showing another aspect of the light emitting diode package structure in accordance with the preferred embodiment of the present invention.

10. . . Light emitting diode package structure

11. . . Substrate

13. . . Light-emitting diode chip

15. . . wire

17. . . Encapsulant

Claims (3)

A light emitting diode package structure includes: a substrate; a light emitting diode chip disposed on the substrate and electrically connected to the substrate; and an encapsulant disposed on the substrate and covering the light emitting diode a wafer having a uniformly distributed phosphor in the encapsulant, wherein the encapsulant comprises a viscosity coefficient of at least 60 kgf. s/m ² organic resin material. The light emitting diode package structure of claim 1, further comprising a wire connecting the light emitting diode chip and the substrate to electrically connect the light emitting diode chip to the substrate, the package colloid Wrap the wire. The light emitting diode package structure according to claim 1, wherein the encapsulant system is prepared by mixing the organic resin material and the phosphor powder with a high-speed stirring defoamer.