201244184 六、發明說明： 【發明所屬之技術領域】 本發明有關於一種發光二極體封裝結構，特別是指一 種色溫分布均勻且不易產生光暈現象的發光二極體封裝結 構。 【先前技術】 J的發光—極體(light-emitting diode)封裝結構，廣 ^地使二螢光粉來獲得白色、暖色或粉色系的光。舉例來 二的白光發光二極體，主要是混合有黃色螢光 粉的封裝膠體來私# 上Iβ 封裝藍光晶片，透過藍光晶片發射出的藍 / 汽色螢光粉以產生黃光，並且， 光晶片發射出的甘， 展土…两尤曰興監 利用混人右终、、他藍光複合，最終產生白光；或者是， 自藍色和红色螢光粉的封⑽體封裝藍光晶片， 生綠光和^ μ缝光’會激魏色與紅色螢光粉而產 白光。 並且’綠光與紅光會和藍光複合進而產生 螢光粉容2減封裝結構所使用之封I膠體内的 色、綠色螢林/嚴重㈣、分布不均，致使膠體内紅 與綠光，而膠體、 的區域會產生較多色溫低的紅光 生較多色溫心的2二色 、綠色螢光粉分錢少的區域則產 導致色溫叫自4 ’、由於藍光與紅光、綠故合不均， 因沉殿而與高=形成明_光暈現象。另外，若榮光粉 。的晶片直接接觸，就容易使勞光粉因散 201244184 熱不良導致發光二極體的發光效率降低以及螢光粉的損耗 率增加。 【發明内容】 有鑑於此，本發明之主要目的在於提供一種具有均句 为布之色溫且不易產生光暈現象的發光二極體封裝結構。 本發明之另-目的在於提供—種更财久使用的發光二 極體封裝結構。 為達成上述目的，本發明所提供之發光二極體封裝結 構’主要包括有-基板、—發光二極體晶片以及一封裝膠 體。該發光二㈣晶片設置於該基板並與縣板電性連 妾°亥封裝膠體没置於該基板並包覆該發光二極體晶片， 該封裝膠_具有均勻分布的螢光粉。藉此，本發明的發 ，二極體封裝結構具有均勻分布的色溫差且不容易產生光 在本發明的發光二極體封裝結構中，更包含有一導 線=用以連接該發光二極體晶片以及該基板，使該發光 =體^與該基板電性連接，並且，該封鄉體包覆該 化此’該導線可與外界空氣隔絕，叫低該導線氧 的機率，使本發明的發光二極體封裝結構更耐久使用。 包括明的發^二極體封裝結射，該封裝膠體最好 60kg/ms b 叱杨可均勻地分布於該封裝膠體内。 有關本發明所提供之發光二極體封裝結構的詳細構造 201244184 卢二特徵，以下將列舉實施例並配合圖式，在可使本發明 員域中具有通常知識者能㈣單實施本發明實施例的範圍 内進行說明。 【實施方式】 以下簡單說明本發明配合實施例所採用之圖式的内 容’其中： 、第一圖為一剖視圖，顯示依據本發明一較佳實施例所 為之發光二極體封裝結構的態樣；以及 第二圖為一剖視圖，顯示依據本發明該較佳實施例所 :、之發光二極體封裝結構的另一種態樣。 π#首先請參考第一圖’依據本發明一較佳實施例所為的 極體封裝結構10，主要包括有一基板u、一發光二 極體晶片13、一導線15以及-封裝膠體π。 且，垓基板11，可由導電或不導電的導熱材料所製成，並 導熱材料較佳宜選自金屬材料、喊材料、複合材 銀、奈米碳管或是印刷電路板。前述金屬材料可為例如銅、 Λ鉈或其合金；前述陶瓷材料可為例如氧化鋁(Α12〇3)、 炭化矽(SiC)或氮化鋁(Α1Ν)。 °亥發光二極體晶片13，可由碳化矽(SiC)或是由πι-ν ^合物半導斷_製成，其巾财族化合物半導體材 =°為例如氮化鎵（GaN)、鱗化鎵（GaP)或碟畔化鎵 /柳)、。製造時’該發光二極體晶片13 #設置於該基板 上，並且，該發光二極體晶片13的頂面或者是頂、底 201244184 面°又=有正、負電極（圖中未示）’於本實施例中該正、負 ^極設置於該發光二極體13的頂面，而該正、負電極透過 Λ導線15與該基板11連接，使該發光二極體13與該基板 11電性連接。 、 、二封裝膠體17，於本實施例中係由有機樹脂材料以及 螢光粉所構成。其中，該有機樹脂材料的折射率大於14〇， 八有至> 6〇kg/ms的黏滞係數，並且，該有機樹脂材料 =佳為石夕膠；而該螢光粉並無特定限制，其可為一般市售 合；毛光〜極體封裝的螢光粉，且可依實際需求而選擇適 颂色製造時，該封裝膠體17係利用高轉速擾拌脫泡器 來混合該有機樹脂材料以及螢光粉’使螢光粉均勻地分布 於°亥封裝膠體17内’之後，利用點膠機將該封裝膠體17 设置於該基板11並包覆該發光二極體晶片13。 值得一提的是，實際上應用時，該封裝膠體17亦可如 =二圖所示般，設置於該基板u並同時包覆該發光二極體 晶片13以及該導線15，藉以防止該導線15與外界空氣接 觸’降低該導線15氧化的機率，使本發明的發光二極體封 裝結構10能夠更耐久使用。 綜上所陳，由於本發明之發光二極體封裝結構10的封 裝膠體17内具有均勻分布的f光粉，其具有分布均勻 . 的色溫且不易產生光暈現象，產生的光品質較佳，並且， 均勻分布的螢光粉也不易與發光二極體晶片13直接接 觸’所以可減少因散熱不良導致發光效率降低以及榮光粉 才貝耗率增加的問題。另外，將導線15包覆於封裝膠體17 6 201244184 内還能降低導線15的氧化機率，增加本發明發光二極體封 裝結構10的使用期限。 雖然本發明透過前述實施例加以說明，然而本發明並 非侷限於前述實施例，在不違反本發明的精神下所為的各 種修飾以及變化，均倶屬本發明的範疇。 201244184 【圖式簡單說明】 第一圖為一剖視圖，顯示依據本發明一較佳實施例所 為之發光二極體封裝結構的態樣；以及 第二圖為一剖視圖，顯示依據本發明該較佳實施例所 為之發光二極體封裝結構的另一種態樣。 【主要元件符號說明】 10發光二極體封裝結構 11基板 13發光二極體晶片 15導線 17封裝膠體 8201244184 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode package structure, and more particularly to a light-emitting diode package structure in which a color temperature distribution is uniform and halo is less likely to occur. [Prior Art] J's light-emitting diode package structure widely uses two phosphors to obtain white, warm or pink light. For example, two white light emitting diodes, mainly an encapsulated colloid mixed with yellow fluorescent powder, are used to make a yellow light emitted by a blue/vapor color phosphor emitted from a blue light wafer, and The light wafer emits the sweet, and the soil is expanded... The two 曰 曰 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右 右Green light and ^ μ slit light will stimulate the black color and red fluorescent powder to produce white light. And 'green light and red light will be combined with blue light to produce the fluorescent powder capacity 2 minus the color of the seal I used in the package, the green fluorescent forest / serious (four), uneven distribution, resulting in red and green light inside the gel, The area of the colloid will produce more red color with lower color temperature, 2 colors with more color temperature, and less area with less green fluorescent powder. The color temperature is called 4 ', due to blue light and red light, green Inconsistent, due to the sinking of the temple and high = forming a clear _ halo phenomenon. In addition, if glory powder. When the wafer is in direct contact, it is easy to cause the light powder to disperse. 201244184 The poor heat generation causes the luminous efficiency of the light-emitting diode to decrease and the loss rate of the fluorescent powder to increase. SUMMARY OF THE INVENTION In view of the above, it is a primary object of the present invention to provide a light emitting diode package structure having a uniform color temperature and a halo phenomenon. Another object of the present invention is to provide a light-emitting diode package structure that is more economical to use. To achieve the above object, the LED package structure 'provided by the present invention' mainly includes a substrate, a light emitting diode chip, and an encapsulant. The light-emitting two (four) wafer is disposed on the substrate and electrically connected to the county plate. The package is not disposed on the substrate and covers the light-emitting diode chip, and the package adhesive has a uniform distribution of phosphor powder. Therefore, the LED package structure of the present invention has a uniformly distributed color temperature difference and is not easy to generate light in the LED package structure of the present invention, and further includes a wire=for connecting the LED chip. And the substrate, the light-emitting body is electrically connected to the substrate, and the sealing body is coated with the wire. The wire can be insulated from the outside air, and the probability of oxygen of the wire is lowered to make the light of the invention The diode package structure is more durable. Including the clear hair diode package encapsulation, the encapsulant is preferably 60 kg / ms b 叱 Yang can be evenly distributed in the encapsulant. Detailed Description of the Light Emitting Diode Package Structure Provided by the Present Invention 201244184 Lu 2 Features, which will be enumerated below and in conjunction with the drawings, can have a general knowledge in the inventor's domain. Explain within the scope of this. [Embodiment] The following briefly describes the contents of the drawings used in conjunction with the embodiments of the present invention. The first drawing is a cross-sectional view showing the aspect of the LED package structure according to a preferred embodiment of the present invention. And the second figure is a cross-sectional view showing another aspect of the light emitting diode package structure in accordance with the preferred embodiment of the present invention. π# First, please refer to the first figure. The polar package structure 10 according to a preferred embodiment of the present invention mainly includes a substrate u, a light emitting diode chip 13, a wire 15 and an encapsulant π. Further, the ruthenium substrate 11 may be made of a conductive or non-conductive heat conductive material, and the heat conductive material is preferably selected from a metal material, a shim material, a composite silver, a carbon nanotube or a printed circuit board. The foregoing metal material may be, for example, copper, ruthenium or an alloy thereof; the aforementioned ceramic material may be, for example, alumina (Α12〇3), tantalum carbide (SiC) or aluminum nitride (Α1Ν). The light-emitting diode wafer 13 can be made of tantalum carbide (SiC) or semi-conducting by πι-ν^ compound, and its twelfth compound semiconductor material = ° is, for example, gallium nitride (GaN), scale Gallium (GaP) or gallium-plated gallium / willow). At the time of manufacture, the light-emitting diode chip 13 is disposed on the substrate, and the top surface of the light-emitting diode chip 13 or the top and bottom surfaces of the 201244184 surface has a positive and negative electrode (not shown). In the embodiment, the positive and negative electrodes are disposed on the top surface of the light emitting diode 13 , and the positive and negative electrodes are connected to the substrate 11 through the germanium wire 15 to make the light emitting diode 13 and the substrate. 11 electrical connection. The second encapsulant 17 is composed of an organic resin material and a phosphor powder in this embodiment. Wherein, the refractive index of the organic resin material is greater than 14 〇, 八有至> 6〇kg/ms, and the organic resin material=good is shijiao; and the phosphor powder has no specific limitation , which can be a general commercially available product; a fluorescent powder packaged in a hair-light-polar body package, and can be selected according to actual needs, and the packaged colloid 17 is mixed with a high-speed scrambler to mix the organic After the resin material and the phosphor powder 'distribute the phosphor powder uniformly in the gel pack 17', the encapsulant 17 is placed on the substrate 11 by a dispenser and the photodiode wafer 13 is covered. It should be noted that, in practical application, the encapsulant 17 can also be disposed on the substrate u and simultaneously cover the LED chip 13 and the wire 15 as shown in FIG. 2, thereby preventing the wire. The contact with the outside air 'reduces the probability of oxidation of the wire 15 to make the light-emitting diode package structure 10 of the present invention more durable. In summary, since the encapsulating colloid 17 of the LED package structure 10 of the present invention has uniformly distributed f-light powder, it has a uniform distribution of color temperature and is less prone to halo phenomenon, and the generated light quality is better. Further, the evenly distributed phosphor powder is not easily in direct contact with the light-emitting diode wafer 13, so that the problem of a decrease in luminous efficiency due to poor heat dissipation and an increase in the consumption rate of the glare powder can be reduced. In addition, wrapping the wire 15 in the encapsulant 17 6 201244184 can also reduce the oxidation probability of the wire 15 and increase the life of the LED package 10 of the present invention. While the present invention has been described by the foregoing embodiments, the present invention is not limited to the foregoing embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention. 201244184 [Brief Description of the Drawings] The first drawing is a cross-sectional view showing a state of a light emitting diode package structure according to a preferred embodiment of the present invention; and the second drawing is a cross-sectional view showing the preferred embodiment of the present invention. Another embodiment of the LED package structure is shown in the embodiment. [Main component symbol description] 10 LED package structure 11 substrate 13 LED chip 15 wire 17 encapsulant 8