TWI434043B - Probe structure - Google Patents
Probe structure Download PDFInfo
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- TWI434043B TWI434043B TW100111518A TW100111518A TWI434043B TW I434043 B TWI434043 B TW I434043B TW 100111518 A TW100111518 A TW 100111518A TW 100111518 A TW100111518 A TW 100111518A TW I434043 B TWI434043 B TW I434043B
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- Prior art keywords
- needle
- thermistor
- probe
- temperature
- needle shaft
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- 239000000523 sample Substances 0.000 title claims description 44
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000012491 analyte Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- CKFRRHLHAJZIIN-UHFFFAOYSA-N cobalt lithium Chemical compound [Li].[Co] CKFRRHLHAJZIIN-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
本發明係關於一種探針結構,尤指一種可加設熱敏電阻之探針結構。The present invention relates to a probe structure, and more particularly to a probe structure to which a thermistor can be added.
許多電子產品以及電子元件在使用時都會有溫升的現象,溫度升高除了可能造成使用效能降低,嚴重時更可能產生安全性的問題,例如鋰鈷電池就是一個非常典型的例子。Many electronic products and electronic components will have a temperature rise when they are used. In addition to the possibility of lowering the temperature, the temperature rise is more likely to cause safety problems. For example, a lithium-cobalt battery is a typical example.
因此,這類電子產品與電子元件在進行電性測試時,通常也必須對待測物的溫度同步做量測,如第一圖所示,第一圖係為習知技術於電性測試時偵測溫度之系統示意圖。要對待測物100做電性測試時,係利用探針21接觸待測物100之正電極,一般來說,探針21係藉由針套211連結於電路板22,且探針21本身係為單純的金屬探針;同時,為了構成電性測試的迴路,還必須以固定於電路板24上的探針23接觸待測物100之負電極;除此之外,習知技術是藉由設置熱敏電阻25於電路板22之上,以量測待測物100周遭溫度的變化。Therefore, when such electronic products and electronic components are electrically tested, it is usually necessary to measure the temperature of the object to be measured simultaneously. As shown in the first figure, the first figure is a conventional technique for detecting electrical tests. A schematic diagram of the temperature measurement system. When the test object 100 is to be electrically tested, the probe 21 is used to contact the positive electrode of the object to be tested 100. Generally, the probe 21 is coupled to the circuit board 22 by the needle sleeve 211, and the probe 21 itself is A simple metal probe; at the same time, in order to form a circuit for electrical testing, the probe 23 fixed to the circuit board 24 must also be in contact with the negative electrode of the object to be tested 100; in addition, the conventional technique is A thermistor 25 is disposed on the circuit board 22 to measure a change in temperature of the object 100 to be tested.
然而,熱敏電阻25的設置位置距離待測物100太遠,所量測到的溫度也就與待測物100的實際溫度有相當大的差距,請參照第二圖,第二圖係為待測物溫度與熱敏電阻所量測之溫度之時間-溫度示意圖。曲線S1係為待測物100 之實際溫度變化,曲線S2係為熱敏電阻25所量測到之環境溫度變化,可以清楚發現,當待測物100處於工作狀態時,溫度會快速升高,並於時間T1時就達到溫度H1,然而此時熱敏電阻25由於距離待測物100過遠,且絕大部分的熱度係藉由空氣傳導,因此僅能量測到較低的溫度H2,熱敏電阻25若要量測到溫度H1,則必須等到許久之後的時間T2。However, the setting position of the thermistor 25 is too far from the object to be tested 100, and the measured temperature is also quite different from the actual temperature of the object to be tested 100. Please refer to the second figure, the second picture is A time-temperature diagram of the temperature of the analyte and the temperature measured by the thermistor. Curve S1 is the object to be tested 100 The actual temperature change, the curve S2 is the ambient temperature change measured by the thermistor 25, it can be clearly found that when the object to be tested 100 is in operation, the temperature will rise rapidly and reach the temperature at time T1. H1, however, the thermistor 25 is too far away from the object to be tested 100, and most of the heat is conducted by air, so only the lower temperature H2 is measured by the energy, and the thermistor 25 is to be measured. To the temperature H1, it is necessary to wait until the time T2 after a long time.
由於熱敏電阻25設置電路板25之上,使得熱敏電阻25所量測到的溫度與待測物100的實際溫度有相當大的差距,這樣的情況可能會導致待測物100已經脫離安全的工作溫度範圍,然而測試者卻無法得知,並因此產生危險。Since the thermistor 25 is disposed above the circuit board 25, the temperature measured by the thermistor 25 is substantially different from the actual temperature of the object to be tested 100. Such a situation may cause the object 100 to be safely removed. The operating temperature range, however, is not known to the tester and is therefore dangerous.
緣此,本發明之主要目的係提供可加設熱敏電阻之探針結構,以使熱敏電阻能夠設置於鄰近待測物之處,且待測物所產生之熱度能夠同時透過探針與空氣傳導至熱敏電阻,使熱敏電阻能夠更迅速且準確的量測到待測物之溫度。Therefore, the main object of the present invention is to provide a probe structure to which a thermistor can be added, so that the thermistor can be disposed adjacent to the object to be tested, and the heat generated by the object to be tested can simultaneously pass through the probe and The air is conducted to the thermistor, enabling the thermistor to measure the temperature of the object to be tested more quickly and accurately.
一種探針結構,係包含針軸、絕緣層與針頭,針軸係為導體材質所構成;絕緣層係包覆該針軸;針頭係為導體材質所構成,並包覆該絕緣層,以凸設於該針軸之一端。A probe structure comprising a needle shaft, an insulating layer and a needle, wherein the needle shaft is made of a conductor material; the insulating layer covers the needle shaft; the needle is made of a conductor material, and the insulating layer is covered to be convex It is provided at one end of the needle shaft.
於本發明之一較佳實施例中,探針結構更包括電路板 與熱敏電阻,電路板係設置於鄰近該針頭之處;熱敏電阻係設置於該電路板,並透過該電路板使該熱敏電阻之二電極接點分別電性連結於該針軸與該針頭。In a preferred embodiment of the present invention, the probe structure further includes a circuit board And a thermistor, the circuit board is disposed adjacent to the needle; the thermistor is disposed on the circuit board, and the two electrode contacts of the thermistor are electrically connected to the needle shaft through the circuit board The needle.
本發明更揭露一種探針之製造方法,該製造方法係包括以下步驟:製備一導體材質之針軸;將一絕緣層套設於該針軸;將一針頭套設於該絕緣層,藉以使該針頭凸設於該針軸之一端。The invention further discloses a method for manufacturing a probe, the manufacturing method comprising the steps of: preparing a needle shaft of a conductor material; sleeve an insulating layer on the needle shaft; and sleeve a needle on the insulating layer, thereby The needle is protruded from one end of the needle shaft.
於本發明之一較佳實施例中,該針軸之側壁係具有一環狀凹槽,且該絕緣層與該針頭皆包覆於該環狀凹槽之外,且該製造方法更包括對該針頭相對於該環狀凹槽之位置進行一滾壓製程。In a preferred embodiment of the present invention, the side wall of the needle shaft has an annular groove, and the insulating layer and the needle are covered outside the annular groove, and the manufacturing method further includes The needle is subjected to a rolling press process with respect to the position of the annular groove.
相較於習知於電性測試同時量測待測物溫度之方法,本發明之探針結構藉由改變探針的結構,能夠將熱敏電阻設置於鄰近待測物之處,且待測物所產生之熱度能夠同時透過探針與空氣傳導至熱敏電阻,使熱敏電阻更迅速且準確的量測到待測物之溫度,以維護電性測試時的安全性。The probe structure of the present invention can set the thermistor adjacent to the object to be tested by changing the structure of the probe compared to the conventional method of measuring the temperature of the object to be tested in the electrical test, and is to be tested. The heat generated by the object can be simultaneously transmitted to the thermistor through the probe and the air, so that the thermistor can measure the temperature of the object to be tested more quickly and accurately to maintain the safety during the electrical test.
本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and drawings.
本發明係關於一種探針結構,尤指一種可加設熱敏電 阻之探針結構。以下茲列舉一較佳實施例以說明本發明,然熟習此項技藝者皆知此僅為一舉例,而並非用以限定發明本身。有關此較佳實施例之內容詳述如下。The invention relates to a probe structure, in particular to a thermosensitive electric device Blocked probe structure. The invention is illustrated by the following description of the preferred embodiments of the invention, and is not intended to limit the invention. The contents of this preferred embodiment are detailed below.
請參閱第三圖與第四圖,第三圖係為本發明之探針結構剖面示意圖,第四圖係為本發明之探針實際使用示意圖。本發明之探針係包含針軸31、絕緣層32與針頭33,針軸31係為導體材質所構成;絕緣層32係包覆該針軸31;針頭33係為導體材質所構成,並包覆該絕緣層32,以凸設於該針軸31之一端;其中,該絕緣層32可以是由鐵弗龍與塑膠等絕緣材質所組成。Please refer to the third and fourth figures. The third figure is a schematic cross-sectional view of the probe structure of the present invention, and the fourth figure is a schematic diagram of the actual use of the probe of the present invention. The probe of the present invention comprises a needle shaft 31, an insulating layer 32 and a needle 33. The needle shaft 31 is made of a conductor material, the insulating layer 32 covers the needle shaft 31, and the needle 33 is made of a conductor material. The insulating layer 32 is protruded from one end of the needle shaft 31. The insulating layer 32 may be made of an insulating material such as Teflon and plastic.
在使用時,探針可以連結熱敏電阻34,熱敏電阻34係具有二電極接點,且該二電極接點係分別電性連結於該針軸31與該針頭33,而為了讓所製造的探針能夠具有統一的標準,於本發明之一較佳實施例中,探針更可以包括電路板35,其中電路板35係設置於鄰近該針頭33之處,熱敏電阻34則設置於該電路板35,並透過該電路板35使該熱敏電阻34之二電極接點分別電性連結於該針軸31與該針頭33;由於電路板35在製造過程中能夠精準的利用焊接點341與焊接點342焊接於針軸31與針頭33之上,因此能夠使熱敏電阻34與針頭33的距離保持在一定的範圍內。In use, the probe can be coupled to the thermistor 34. The thermistor 34 has a two-electrode contact, and the two-electrode contact is electrically connected to the needle shaft 31 and the needle 33, respectively. The probe can have a uniform standard. In a preferred embodiment of the present invention, the probe may further include a circuit board 35, wherein the circuit board 35 is disposed adjacent to the needle 33, and the thermistor 34 is disposed on the The circuit board 35 and the two electrode contacts of the thermistor 34 are electrically connected to the needle shaft 31 and the needle 33 respectively through the circuit board 35; since the circuit board 35 can accurately utilize the soldering point in the manufacturing process The 341 and the solder joint 342 are soldered to the needle shaft 31 and the needle 33, so that the distance between the thermistor 34 and the needle 33 can be kept within a certain range.
此外,探針更可以包括針套36與彈性元件37,針套36係為一中空套管,以套設於該針軸31相對於該針頭33之一端;彈性元件37係設置於該針套36內部,以分別抵 接於該針套36與該針軸31。In addition, the probe may further include a needle sleeve 36 and an elastic member 37. The needle sleeve 36 is a hollow sleeve for being sleeved on one end of the needle shaft 31 with respect to the needle shaft 33. The elastic member 37 is disposed on the needle sleeve. 36 internal, to separate The needle sleeve 36 is connected to the needle shaft 31.
在使用時,針套36係固定於電路板41,針頭33係電性接觸待測物100之正電極,並且利用固定於電路板43之一般的探針42接觸待測物100之負電極,如此一來熱敏電阻34即可形成迴路,且即使待測物100的形狀有所改變,彈性元件37皆可供針軸31做伸縮的活動,熱敏電阻34則是與針軸31連帶運動,因此與待測物100之距離並不會有所改變。In use, the needle sleeve 36 is fixed to the circuit board 41. The needle 33 is electrically connected to the positive electrode of the object to be tested 100, and contacts the negative electrode of the object to be tested 100 by a general probe 42 fixed to the circuit board 43. In this way, the thermistor 34 can form a loop, and even if the shape of the object to be tested 100 is changed, the elastic member 37 can be used for the expansion and contraction movement of the needle shaft 31, and the thermistor 34 is coupled with the needle shaft 31. Therefore, the distance from the object to be tested 100 does not change.
綜合以上所述,相較於習知於電性測試同時量測待測物100溫度之方法,本發明之探針結構藉由改變探針的結構,能夠將熱敏電阻34設置於鄰近待測物100之處,且待測物100所產生之熱度能夠同時透過探針與空氣傳導至熱敏電阻34,使熱敏電阻34更迅速且準確的量測到待測物100之溫度,以維護電性測試時的安全性。In summary, the probe structure of the present invention can set the thermistor 34 adjacent to the test by changing the structure of the probe compared to the conventional method of measuring the temperature of the test object 100 at the same time as the electrical test. At the object 100, and the heat generated by the object to be tested 100 can be simultaneously transmitted to the thermistor 34 through the probe and the air, so that the thermistor 34 can more quickly and accurately measure the temperature of the object to be tested 100 to maintain Safety during electrical testing.
本發明亦揭露一種探針之製造方法,此製造方法包括以下步驟:製備一導體材質之針軸31;將一絕緣層32套設於該針軸31;以及將一針頭33套設於該絕緣層32,藉以使該針頭33凸設於該針軸31之一端。The invention also discloses a method for manufacturing a probe, the manufacturing method comprising the steps of: preparing a needle shaft 31 of a conductor material; sleeve an insulating layer 32 on the needle shaft 31; and sleeve a needle 33 on the insulation The layer 32 is such that the needle 33 protrudes from one end of the needle shaft 31.
請參照第五圖與第六圖,第五圖係為未經滾壓製程之探針,第六圖係為經過滾壓製程後之探針。在本發明之較佳實施例中,該針軸31之側壁更可以具有一環狀凹槽311,且該絕緣層32與該針頭33皆包覆於該環狀凹槽311之外,且該製造方法更可以包括對該針頭33相對於該環狀凹槽311之位置施加外力F以進行一滾壓製程,經過滾壓 製程之探針,針頭33之外觀即可觀察到環狀凹槽331。Please refer to the fifth and sixth figures. The fifth figure is the probe without the rolling process, and the sixth picture is the probe after the rolling process. In the preferred embodiment of the present invention, the side wall of the needle shaft 31 may further have an annular groove 311, and the insulating layer 32 and the needle 33 are both wrapped around the annular groove 311, and the The manufacturing method may further include applying an external force F to the position of the needle 33 relative to the annular groove 311 to perform a rolling process, and rolling The probe of the process, the appearance of the needle 33, can observe the annular groove 331.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
100‧‧‧待測物100‧‧‧Test object
21‧‧‧探針21‧‧‧ probe
211‧‧‧針套211‧‧‧ needle sets
22‧‧‧電路板22‧‧‧ Circuit board
23‧‧‧探針23‧‧‧ probe
24‧‧‧電路板24‧‧‧ boards
25‧‧‧熱敏電阻25‧‧‧Thermistor
31‧‧‧針軸31‧‧‧ Needle shaft
311‧‧‧環狀凹槽311‧‧‧ annular groove
32‧‧‧絕緣層32‧‧‧Insulation
33‧‧‧針頭33‧‧‧ needle
331‧‧‧環狀凹槽331‧‧‧ annular groove
34‧‧‧熱敏電阻34‧‧‧Thermistor
341‧‧‧焊接點341‧‧‧ solder joints
342‧‧‧焊接點342‧‧‧ solder joints
35‧‧‧電路板35‧‧‧ boards
36‧‧‧針套36‧‧‧ needle sets
37‧‧‧彈性元件37‧‧‧Flexible components
41‧‧‧電路板41‧‧‧ boards
42‧‧‧探針42‧‧‧Probe
43‧‧‧電路板43‧‧‧ boards
S1‧‧‧曲線S1‧‧‧ Curve
S2‧‧‧曲線S2‧‧‧ Curve
T1‧‧‧時間T1‧‧‧ time
T2‧‧‧時間T2‧‧‧ time
H1‧‧‧溫度H1‧‧‧temperature
H2‧‧‧溫度H2‧‧‧ temperature
F‧‧‧外力F‧‧‧External force
第一圖係為習知技術於電性測試時偵測溫度之系統示意圖;第二圖係為待測物溫度與熱敏電阻所量測之溫度之時間-溫度示意圖;第三圖係為本發明之探針結構剖面示意圖;第四圖係為本發明之探針實際使用示意圖;第五圖係為未經滾壓製程之探針;以及第六圖係為經過滾壓製程後之探針。The first figure is a schematic diagram of the system for detecting temperature during electrical testing; the second picture is a time-temperature diagram of the temperature of the object to be tested and the temperature measured by the thermistor; Schematic diagram of the probe structure of the invention; the fourth diagram is a schematic diagram of the actual use of the probe of the present invention; the fifth diagram is the probe without the rolling process; and the sixth diagram is the probe after the rolling process .
31‧‧‧針軸31‧‧‧ Needle shaft
32‧‧‧絕緣層32‧‧‧Insulation
33‧‧‧針頭33‧‧‧ needle
34‧‧‧熱敏電阻34‧‧‧Thermistor
341‧‧‧焊接點341‧‧‧ solder joints
342‧‧‧焊接點342‧‧‧ solder joints
35‧‧‧電路板35‧‧‧ boards
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100111518A TWI434043B (en) | 2011-04-01 | 2011-04-01 | Probe structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100111518A TWI434043B (en) | 2011-04-01 | 2011-04-01 | Probe structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201241438A TW201241438A (en) | 2012-10-16 |
| TWI434043B true TWI434043B (en) | 2014-04-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100111518A TWI434043B (en) | 2011-04-01 | 2011-04-01 | Probe structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI434043B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI623751B (en) * | 2017-09-29 | 2018-05-11 | 中華精測科技股份有限公司 | Probe device and rectangular probe |
-
2011
- 2011-04-01 TW TW100111518A patent/TWI434043B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI623751B (en) * | 2017-09-29 | 2018-05-11 | 中華精測科技股份有限公司 | Probe device and rectangular probe |
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| Publication number | Publication date |
|---|---|
| TW201241438A (en) | 2012-10-16 |
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