TWI430025B - 感放射線性樹脂組成物、與層間絕緣膜及微透鏡之製法 - Google Patents
感放射線性樹脂組成物、與層間絕緣膜及微透鏡之製法 Download PDFInfo
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- TWI430025B TWI430025B TW098109358A TW98109358A TWI430025B TW I430025 B TWI430025 B TW I430025B TW 098109358 A TW098109358 A TW 098109358A TW 98109358 A TW98109358 A TW 98109358A TW I430025 B TWI430025 B TW I430025B
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- MKOSBHNWXFSHSW-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-en-5-ol Chemical compound C1C2C(O)CC1C=C2 MKOSBHNWXFSHSW-UHFFFAOYSA-N 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- IGKOKEBHGRCHSR-UHFFFAOYSA-N bis(3,4,5-trihydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=C(O)C(O)=C(O)C=2)=C1 IGKOKEBHGRCHSR-UHFFFAOYSA-N 0.000 description 1
- 229940116229 borneol Drugs 0.000 description 1
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- RRIRSNXZGJWTQM-UHFFFAOYSA-N butyl 3-methoxypropanoate Chemical compound CCCCOC(=O)CCOC RRIRSNXZGJWTQM-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- RHFOYRRUVLOOJP-UHFFFAOYSA-N ethoxyethane;propanoic acid Chemical compound CCOCC.CCC(O)=O RHFOYRRUVLOOJP-UHFFFAOYSA-N 0.000 description 1
- SVBSJWKYFYUHTF-UHFFFAOYSA-N ethyl 2-butoxyacetate Chemical compound CCCCOCC(=O)OCC SVBSJWKYFYUHTF-UHFFFAOYSA-N 0.000 description 1
- HMONIZCCNGYDDJ-UHFFFAOYSA-N ethyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OCC HMONIZCCNGYDDJ-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- ZXONMBCEAFIRDT-UHFFFAOYSA-N ethyl 2-propoxyacetate Chemical compound CCCOCC(=O)OCC ZXONMBCEAFIRDT-UHFFFAOYSA-N 0.000 description 1
- GIRSHSVIZQASRJ-UHFFFAOYSA-N ethyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OCC GIRSHSVIZQASRJ-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- LLACVNYOVGHAKH-UHFFFAOYSA-N ethyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OCC LLACVNYOVGHAKH-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- UACSZOWTRIJIFU-UHFFFAOYSA-N hydroxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCO UACSZOWTRIJIFU-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- BKFQHFFZHGUTEZ-UHFFFAOYSA-N methyl 2-butoxyacetate Chemical compound CCCCOCC(=O)OC BKFQHFFZHGUTEZ-UHFFFAOYSA-N 0.000 description 1
- QBVBLLGAMALJGB-UHFFFAOYSA-N methyl 2-butoxypropanoate Chemical compound CCCCOC(C)C(=O)OC QBVBLLGAMALJGB-UHFFFAOYSA-N 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- GSJFXBNYJCXDGI-UHFFFAOYSA-N methyl 2-hydroxyacetate Chemical compound COC(=O)CO GSJFXBNYJCXDGI-UHFFFAOYSA-N 0.000 description 1
- AVVSSORVCLNBOS-UHFFFAOYSA-N methyl 2-propoxyacetate Chemical compound CCCOCC(=O)OC AVVSSORVCLNBOS-UHFFFAOYSA-N 0.000 description 1
- VBCSBEIIIFLVQV-UHFFFAOYSA-N methyl 3-butoxypropanoate Chemical compound CCCCOCCC(=O)OC VBCSBEIIIFLVQV-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- DMHHINXESLPPMV-UHFFFAOYSA-N methyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OC DMHHINXESLPPMV-UHFFFAOYSA-N 0.000 description 1
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- MWKFXSUHUHTGQN-UHFFFAOYSA-N n-decyl alcohol Natural products CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- ZWWQICJTBOCQLA-UHFFFAOYSA-N o-propan-2-yl (propan-2-yloxycarbothioyldisulfanyl)methanethioate Chemical compound CC(C)OC(=S)SSC(=S)OC(C)C ZWWQICJTBOCQLA-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- FOKLVOHHYNATHU-UHFFFAOYSA-N oxan-2-ylmethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCCCO1 FOKLVOHHYNATHU-UHFFFAOYSA-N 0.000 description 1
- ZADZUSCZHASNAH-UHFFFAOYSA-N oxetan-3-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1COC1 ZADZUSCZHASNAH-UHFFFAOYSA-N 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- VQSLYBNAHOGNCE-UHFFFAOYSA-N pentan-3-yl propanoate Chemical compound CCC(CC)OC(=O)CC VQSLYBNAHOGNCE-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- XNWSMNKRGNKRKP-UHFFFAOYSA-M propanoate;tetramethylazanium Chemical compound CCC([O-])=O.C[N+](C)(C)C XNWSMNKRGNKRKP-UHFFFAOYSA-M 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- JCMFJIHDWDKYIL-UHFFFAOYSA-N propyl 3-methoxypropanoate Chemical compound CCCOC(=O)CCOC JCMFJIHDWDKYIL-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
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Description
本發明涉及感放射線性樹脂組成物以及層間絕緣膜和微透鏡的製造方法。
薄膜電晶體(以下記為“TFT”)型液晶顯示元件及磁頭元件、積體電路元件、固態攝像元件等電子產品,通常在層狀佈置的佈線之間設置絕緣用的層間絕緣膜。由於作為形成層間絕緣膜的材料,較佳為獲得必要圖案形狀所需的步驟數少、且具有足夠好的平坦性的材料,因而感放射線性樹脂組成物被廣泛地使用(參見專利文獻1和專利文獻2)。
另外,作為傳真機、電子影印機、固態攝像元件等晶載彩色濾光片成像光學系統或者光纖連接器的光學系統材料,使用具有3~100μm左右透鏡直徑的微透鏡,或者將這些微透鏡按規律排列而成的微透鏡陣列。微透鏡或者微透鏡陣列的形成,已知在形成相當於透鏡的抗蝕圖案後,通過加熱處理使其熔體流動後直接作為透鏡使用的方法,或者將熔體流動的透鏡圖案作為掩模,通過乾蝕刻法向底層轉印透鏡形狀的方法等。在上述透鏡圖案的形成中,廣泛地使用感放射線性樹脂組成物(參見專利文獻3和專利文獻4)。
這些層間絕緣膜和微透鏡或微透鏡陣列要求有高耐熱性、高耐溶劑性、高透明性、與底層的黏附性等各種性能。並且,近年來,在TFT液晶顯示元件領域,正處於大螢幕化、快速回應化、薄型化等的趨勢下,作為其中所用層間絕緣膜的形成用組成物,在具有高敏感度、作為形成的層間絕緣膜具有低介電常數方面,要求比以前有所提高的高性能。並且,在製造層間絕緣膜和微透鏡的過程中,在其顯影步驟中,如果顯影時間哪怕是稍微超過最佳時間,則圖案與基板之間容易滲入顯影液而發生脫落,故而必須嚴格控制顯影時間,因此,需要開發具有足夠顯影界限的感放射線性樹脂組成物。
【專利文獻1】日本特開2001-354822號公報
【專利文獻2】日本特開2001-343743號公報
【專利文獻3】日本特開平6-18702號公報
【專利文獻4】日本特開平6-136239號公報
本發明是基於以上情況而作出的。因此,本發明的目的是提供一種感放射線性組成物,其具有高的感放射線敏感度和優良的顯影界限,並且能夠容易地形成與底層的黏附性優良的圖案狀薄膜。
本發明的另一目的是提供一種感放射線性樹脂組成物,當其用於形成層間絕緣膜時,能夠形成高耐熱性、高耐溶劑性、高透光率、低介電常數的層間絕緣膜,並且當用於形成微透鏡時,能夠形成具有高透光率和良好的熔融形狀的微透鏡。
本發明的又一目的是提供一種用上述感放射線性樹脂組成物形成層間絕緣膜和微透鏡的方法。
本發明的其他目的和優點可以由以下的說明獲悉。
根據本發明,本發明的上述目的和優點,第一,由一種感放射線性樹脂組成物達成,其特徵在於包括:
[A]含有(a1)由不飽和羧酸和不飽和羧酸酐構成的群組中選出的至少一種和(a2)由具有環氧乙基的不飽和化合物和具有氧雜環丁烷基的不飽和化合物構成的群組中選出的至少一種之不飽和混合物的共聚物(以下也稱為“共聚物(A)”),
[B]1,2-醌二疊氮化合物(以下也稱為“[B]成分”),以及
[C]具有碳原子數為6~15的芳基之倍半矽氧烷(silsesquinoxane)(以下也稱為“[C]成分”)。
根據本發明,本發明的上述目的和優點,第二,由一種層間絕緣膜或微透鏡的形成方法達成,其特徵在於包括按照下述順序之以下步驟,
(1)在基板上形成上述感放射線性樹脂組成物塗膜的步驟,
(2)對該塗膜的至少一部分照射放射線的步驟,
(3)將照射後的塗膜進行顯影的步驟,和
(4)將顯影後的塗膜進行加熱的步驟。
本發明的感放射線性樹脂組成物,具有高的感放射線敏感度和優良的顯影界限,並且,通過使用該感放射線性樹脂組成物,能夠容易地形成與底層的黏附性優良的圖案狀薄膜。
由上述組成物形成的本發明層間絕緣膜,耐溶劑性和耐熱性優良,具有高透光率和低介電常數,可適合作為電子產品的層間絕緣膜使用。另外,由上述組成物形成的本發明微透鏡,耐溶劑性和耐熱性優良,並且具有高透光率和良好的熔融形狀,可適合作為固態攝像元件的微透鏡使用。
以下,對本發明的感放射線性樹脂組成物進行詳細說明。
本發明中使用的共聚物[A],可以經由將含有(a1)由不飽和羧酸和不飽和羧酸酐構成的群組中選出的至少一種(以下也稱為“化合物(a1)”)和(a2)由具有環氧乙基的不飽和化合物和具有氧雜環丁烷基的不飽和化合物構成的群組中選出的至少一種(以下也稱為“化合物(a2)”)的不飽和混合物在溶劑中,在聚合引發劑的存在下進行自由基共聚合而製造。
化合物(a1)是具有自由基聚合性的不飽和羧酸和/或不飽和羧酸酐,可以列舉例如單羧酸、二羧酸、二羧酸的酸酐、多元羧酸的單[(甲基)丙烯醯氧基烷基]酯、兩末端具有羧基和羥基的聚合物的單(甲基)丙烯酸酯、具有羧基的多環式化合物及其酸酐等。
作為其具體例子,單羧酸可以列舉例如丙烯酸、甲基丙烯酸、巴豆酸等;二羧酸可以列舉例如馬來酸、富馬酸、檸康酸、中康酸、衣康酸等;二羧酸的酸酐可以列舉例如作為上述二羧酸而例示的化合物的酸酐等;多元羧酸的單[(甲基)丙烯醯氧基烷基]酯可以列舉例如琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸單[2-(甲基)丙烯醯氧基乙基]酯等;兩末端具有羧基和羥基的聚合物的單(甲基)丙烯酸酯可以列舉例如ω-羧基聚己內酯的單(甲基)丙烯酸酯等;具有羧基的多環式化合物及其酸酐可以列舉例如5-羧基二環[2.2.1]庚-2-烯、5,6-二羧基二環[2.2.1]庚-2-烯、5-羧基-5-甲基二環[2.2.1]庚-2-烯、5-羧基-5-乙基二環[2.2.1]庚-2-烯、5-羧基-6-甲基二環[2.2.1]庚-2-烯、5-羧基-6-乙基二環[2.2.1]庚-2-烯、5,6-二羧基二環[2.2.1]庚-2-烯酸酐等。
其中,較佳使用單羧酸、二羧酸的酸酐,從共聚合反應性、對於鹼顯影液的溶解性和容易獲得性方面考慮,特佳使用丙烯酸、甲基丙烯酸、馬來酸酐。這些化合物(a1)可以單獨或兩種以上組合使用。
化合物(a2)是具有環氧乙基的不飽和化合物和/或具有氧雜環丁烷基的不飽和化合物,作為具有環氧乙基的不飽和化合物,可以列舉例如丙烯酸縮水甘油基酯、甲基丙烯酸縮水甘油基酯、α-乙基丙烯酸縮水甘油基酯、α-正丙基丙烯酸縮水甘油基酯、α-正丁基丙烯酸縮水甘油基酯、丙烯酸-3,4-環氧基丁基酯、甲基丙烯酸-3,4-環氧基丁基酯、丙烯酸-6,7-環氧基庚基酯、甲基丙烯酸-6,7-環氧基庚基酯、α-乙基丙烯酸-6,7-環氧基庚基酯、丙烯酸-3,4-環氧基環己基酯、甲基丙烯酸-3,4-環氧基環己基酯、丙烯酸-3,4-環氧基環己基甲基酯、甲基丙烯酸-3,4-環氧基環己基甲基酯、鄰乙烯基苄基縮水甘油基醚、間乙烯基苄基縮水甘油基醚、對乙烯基苄基縮水甘油基醚等。其中,從提高共聚合反應性和所得層間絕緣膜或微透鏡的耐熱性、表面硬度的方面考慮,較佳使用甲基丙烯酸縮水甘油基酯、甲基丙烯酸-6,7-環氧基庚基酯、鄰乙烯基苄基縮水甘油基醚、間乙烯基苄基縮水甘油基醚、對乙烯基苄基縮水甘油基醚、甲基丙烯酸-3,4-環氧基環己基酯、甲基丙烯酸-3,4-環氧基環己基甲基酯等。
作為具有氧雜環丁烷基的不飽和化合物,可以列舉例如3-(丙烯醯氧基甲基)氧雜環丁烷、3-(丙烯醯氧基甲基)-2-甲基氧雜環丁烷、3-(丙烯醯氧基甲基)-3-乙基氧雜環丁烷、3-(丙烯醯氧基甲基)-2-苯基氧雜環丁烷、3-(2-丙烯醯氧基乙基)氧雜環丁烷、3-(2-丙烯醯氧基乙基)-2-乙基氧雜環丁烷、3-(2-丙烯醯氧基乙基)-3-乙基氧雜環丁烷、3-(2-丙烯醯氧基乙基)-2-苯基氧雜環丁烷等丙烯酸酯、3-(甲基丙烯醯氧基甲基)氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-甲基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-3-乙基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-苯基氧雜環丁烷、3-(2-甲基丙烯醯氧基乙基)氧雜環丁烷、3-(2-甲基丙烯醯氧基乙基)-2-乙基氧雜環丁烷、3-(2-甲基丙烯醯氧基乙基)-3-乙基氧雜環丁烷、3-(2-甲基丙烯醯氧基乙基)-2-苯基氧雜環丁烷等甲基丙烯酸酯。
其中,從共聚合反應性方面考慮,較佳使用3-(丙烯醯氧基甲基)-2-甲基氧雜環丁烷、3-(丙烯醯氧基甲基)-3-乙基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-甲基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-3-乙基氧雜環丁烷等。
這些化合物(a2)可以單獨或組合使用。
本發明中所用的共聚物[A],較佳為上述化合物(a1)、(a2)以及進一步的能夠與它們共聚合的其他不飽和化合物(以下也稱為“化合物(a3)”)的共聚物。作為這種化合物(a3),只要是具有自由基聚合性的不飽和化合物,則對其沒有特別的限制,可以列舉例如甲基丙烯酸烷基酯、甲基丙烯酸環狀烷基酯、丙烯酸烷基酯、丙烯酸環狀烷基酯、甲基丙烯酸芳基酯、丙烯酸芳基酯、不飽和二羧酸二酯、具有羥基的甲基丙烯酸酯、二環不飽和化合物、馬來醯亞胺化合物、不飽和芳香族化合物、共軛二烯、具有四氫呋喃骨架、呋喃骨架、四氫吡喃骨架、吡喃骨架或(聚)烷二醇骨架的不飽和化合物、具有酚性羥基的不飽和化合物以及其他的不飽和化合物。
作為它們的具體例子,甲基丙烯酸烷基酯可以列舉例如甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸異癸酯、甲基丙烯酸正十二烷基酯、甲基丙烯酸十三烷基酯、甲基丙烯酸正十八烷基酯等;作為甲基丙烯酸環狀烷基酯可以列舉例如甲基丙烯酸環基酯、甲基丙烯酸2-甲基環己酯、甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯(以下稱為“甲基丙烯酸二環戊基酯”)、甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基氧基乙酯、甲基丙烯酸異冰片酯等;作為丙烯酸烷基酯可以列舉例如丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸正丁酯、丙烯酸第二丁酯、丙烯酸第三丁酯等;作為丙烯酸環狀烷基酯可以列舉例如丙烯酸環己酯、丙烯酸2-甲基環己酯、丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯(以下稱為“丙烯酸二環戊基酯”)、丙烯酸三環[5.2.1.02,6
]癸烷-8-基氧基乙酯、丙烯酸異冰片酯等;作為丙烯酸芳基酯可以列舉例如丙烯酸苯酯、丙烯酸苄酯等;作為甲基丙烯酸芳基酯可以列舉例如甲基丙烯酸苯酯、甲基丙烯酸苄酯等;作為不飽和二羧酸二酯可以列舉例如馬來酸二乙酯、富馬酸二乙酯、衣康酸二乙酯等;作為具有羥基的甲基丙烯酸酯可以列舉例如甲基丙烯酸羥基甲酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸3-羥基丙酯、甲基丙烯酸4-羥基丁酯、二甘醇單甲基丙烯酸酯、甲基丙烯酸2,3-二羥基丙酯、2-甲基丙烯醯氧基乙基糖苷等;作為二環不飽和化合物可以列舉例如二環[2.2.1]庚-2-烯、5-甲基二環[2.2.1]庚-2-烯、5-乙基二環[2.2.1]庚-2-烯、5-羥基二環[2.2.1]庚-2-烯、5-羧基二環[2.2.1]庚-2-烯、5-羥甲基二環[2.2.1]庚-2-烯、5-(2-羥基乙基)二環[2.2.1]庚-2-烯等;作為馬來醯亞胺化合物可以列舉例如N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、N-苄基馬來醯亞胺、N-(4-羥基苯基)馬來醯亞胺、N-(4-羥基苄基)馬來醯亞胺、N-琥珀醯亞胺基-3-馬來醯亞胺基苯甲酸酯、N-琥珀醯亞胺基-4-馬來醯亞胺基丁酸酯、N-琥珀醯亞胺基-6-馬來醯亞胺基己酸酯、N-琥珀醯亞胺基-3-馬來醯亞胺基丙酸酯、N-(9-吖啶基)馬來醯亞胺等;作為不飽和芳香族化合物可以列舉例如苯乙烯、α-甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、乙烯基甲苯、對甲氧基苯乙烯等;作為共軛二烯可以列舉例如1,3-丁二烯、異戊二烯、2,3-二甲基-1,3-丁二烯等;作為具有四氫呋喃骨架的不飽和化合物可以列舉例如(甲基)丙烯酸四氫糠基酯、2-甲基丙烯醯氧基-丙酸四氫糠基酯、3-(甲基)丙烯醯氧基四氫呋喃-2-酮等;作為具有呋喃骨架的不飽和化合物可以列舉例如2-甲基-5-(3-呋喃基)-1-戊烯-3-酮、(甲基)丙烯酸糠基酯、1-呋喃-2-丁基-3-烯-2-酮、1-呋喃-2-丁基-3-甲氧基-3-烯-2-酮、6-(2-呋喃基)-2-甲基-1-己烯-3-酮、6-呋喃-2-基-己-1-烯-3-酮、丙烯酸2-呋喃-2-基-1-甲基-乙基酯、6-(2-呋喃基)-6-甲基-1-庚烯-3-酮等;作為具有四氫吡喃骨架的不飽和化合物可以列舉例如甲基丙烯酸(四氫吡喃-2-基)甲酯、2,6-二甲基-8-(四氫吡喃-2-基氧基)-辛-1-烯-3-酮、2-甲基丙烯酸四氫吡喃-2-基酯、1-(四氫吡喃-2-氧基)-丁基-3-烯-2-酮等;作為具有吡喃骨架的不飽和化合物可以列舉例如4-(1,4-二氧雜-5-酮基-6-庚烯基)-6-甲基-2-吡喃酮、4-(1,5-二氧雜-6-酮基-7-辛烯基)-6-甲基-2-吡喃酮等;具有(聚)烷二醇骨架的不飽和化合物可以列舉例如聚乙二醇(n=2~10)單(甲基)丙烯酸酯、聚丙二醇(n=2~10)單(甲基)丙烯酸酯等;具有酚性羥基的不飽和化合物可以列舉(甲基)丙烯酸4-羥基苄酯、(甲基)丙烯酸4-羥基苯酯、鄰羥基苯乙烯、對羥基苯乙烯、α-甲基-對羥基苯乙烯、N-(4-羥基苄基)(甲基)丙烯醯胺、N-(3,5-二甲基-4-羥基苄基)(甲基)丙烯醯胺、N-(4-羥基苯基)(甲基)丙烯醯胺等;其他的不飽和化合物可以列舉例如丙烯腈、甲基丙烯腈、氯乙烯、偏氯乙烯、丙烯醯胺、甲基丙烯醯胺、乙酸乙烯酯。
其中,較佳使用甲基丙烯酸烷基酯、甲基丙烯酸環狀烷基酯、丙烯酸環狀烷基酯、馬來醯亞胺化合物、不飽和芳香族化合物、共軛二烯、具有四氫呋喃骨架、呋喃骨架、四氫吡喃骨架、吡喃骨架、(聚)烷二醇骨架的不飽和化合物、具有酚性羥基的不飽和化合物,從共聚合反應性和對於鹼水溶液的溶解性方面考慮,特佳為苯乙烯、甲基丙烯酸第三丁酯、甲基丙烯酸正十二烷基酯、甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯、對甲氧基苯乙烯、丙烯酸2-甲基環己酯、N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、1,3-丁二烯、(甲基)丙烯酸四氫糠基酯、聚乙二醇(n=2~10)單(甲基)丙烯酸酯、3-(甲基)丙烯醯氧基四氫呋喃-2-酮、(甲基)丙烯酸4-羥基苄酯、(甲基)丙烯酸4-羥基苯酯、鄰羥基苯乙烯、N-(4-羥基苯基)(甲基)丙烯醯胺、對羥基苯乙烯、α-甲基-對羥基苯乙烯。這些化合物(a3)可以單獨或兩種以上組合使用。
作為本發明中所用的共聚物[A]的較佳具體例子,可以列舉例如甲基丙烯酸/甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯/丙烯酸2-甲基環己酯/甲基丙烯酸縮水甘油基酯/苯乙烯、甲基丙烯酸/甲基丙烯酸四氫糠基酯/甲基丙烯酸縮水甘油基酯/N-環己基馬來醯亞胺/甲基丙烯酸十二烷基酯/α-甲基-對羥基苯乙烯、苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油基酯/甲基丙烯酸(3-乙基氧雜環丁烷-3-基酯)/甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯、苯乙烯/甲基丙烯酸/甲基丙烯酸縮水甘油基酯/N-(4-羥基苯基)甲基丙烯醯胺。
本發明中使用的共聚物[A],基於衍生自化合物(a1)、(a2)和(a3)的重複單元的合計量,較佳含有5~40重量%的衍生自化合物(a1)的重複單元,特佳含有5~25重量%。如果使用該重複單元不足5重量%的共聚物,則會導致在顯影步驟中難溶於鹼水溶液,另一方面,超過40重量%的共聚物,則會出現對於鹼水溶液的溶解性過大的傾向。
另外,本發明中使用的共聚物[A],基於衍生自化合物(a1)、(a2)和(a3)的重複單元的合計量,較佳含有10~80重量%的衍生自化合物(a2)的重複單元,特佳含有30~80重量%。當該重複單元不足10重量%時,則會出現所得層間絕緣膜或微透鏡的耐熱性、表面硬度和耐剝離液性下降的傾向,另一方面,當該重複單元的量超過80重量%時,則會出現感放射線性樹脂組成物的保存穩定性降低的傾向。
本發明中使用的共聚物[A]的聚苯乙烯換算的重量平均分子量(以下稱為“Mw”)較佳為2×103
~1×105
,更佳為5×103
~5×104
。如果Mw不足2×103
,則會出現顯影界限不夠的情況,使所得覆膜的殘膜率等下降,並且使所得層間絕緣膜或微透鏡的圖案形狀、耐熱性等變差,另一方面,若超過1×105
,則會出現敏感度下降、圖案形狀變差的情況。此外,所欲之分子量分布(以下稱為“Mw/Mn”)較佳為5.0以下,更佳為3.0以下。如果Mw/Mn超過5.0,則會出現所得層間絕緣膜或微透鏡的圖案形狀變差的情況。含有上述共聚物[A]的感放射線性樹脂組成物在顯影時不會產生顯影殘留,能夠容易地形成所預定的圖案形狀。
共聚物[A]可以通過例如將化合物(a1)、化合物(a2)和化合物(a3)在適當的溶劑中,在自由基聚合引發劑的存在下進行聚合而合成。
作為共聚物[A]製備中所用的溶劑,可以列舉例如二甘醇、丙二醇單烷基醚、丙二醇烷基醚乙酸酯、丙二醇烷基醚丙酸酯、酮、酯等。
它們的具體例子,作為二甘醇,可以列舉例如二甘醇單甲醚、二甘醇單乙醚、二甘醇二甲醚、二甘醇二乙醚、二甘醇乙基甲基醚等;作為丙二醇單烷基醚,可以列舉例如丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單丁醚等;作為丙二醇烷基醚丙酸酯,可以列舉例如丙二醇甲基醚丙酸酯、丙二醇乙基醚丙酸酯、丙二醇丙基醚丙酸酯、丙二醇丁基醚丙酸酯等;作為丙二醇烷基醚乙酸酯,可以列舉例如丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯、丙二醇丙基醚乙酸酯、丙二醇丁基醚乙酸酯等;作為酮,可以列舉例如甲基乙基酮、環己酮、4-羥基-4-甲基-2-戊酮等;作為酯,可以列舉例如乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、2-羥基丙酸乙酯、2-羥基-2-甲基丙酸甲酯、2-羥基-2-甲基丙酸乙酯、羥基乙酸甲酯、羥基乙酸乙酯、羥基乙酸丁酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁酯、甲氧基乙酸甲酯、甲氧基乙酸乙酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯、丙氧基乙酸甲酯、丙氧基乙酸乙酯、丁氧基乙酸甲酯、丁氧基乙酸乙酯、2-甲氧基丙酸甲酯、2-甲氧基丙酸乙酯、2-乙氧基丙酸甲酯、2-乙氧基丙酸乙酯、2-丁氧基丙酸甲酯、2-丁氧基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-甲氧基丙酸丙酯、3-甲氧基丙酸丁酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、3-丙氧基丙酸甲酯、3-丙氧基丙酸乙酯、3-丁氧基丙酸甲酯、3-丁氧基丙酸乙酯等酯。
其中,較佳為二甘醇二烷基醚、丙二醇單烷基醚、丙二醇烷基醚乙酸酯,特佳為二甘醇二甲醚、二甘醇乙基甲基醚、丙二醇甲基醚、丙二醇乙基醚、丙二醇甲基醚乙酸酯、3-甲氧基丙酸甲酯。
作為共聚物[A]製備中所用的聚合引發劑,可以使用已知作為自由基聚合引發劑的聚合引發劑。可以列舉例如2,2’-偶氮二異丁腈、2,2’-偶氮二-(2,4-二甲基戊腈)、2,2’-偶氮二-(4-甲氧基-2,4-二甲基戊腈)等偶氮化合物;過氧化苯甲醯、過氧化月桂醯、第三丁基過氧化特戊酸酯、1,1’-二(第三丁基過氧化)環己烷等有機過氧化物;以及過氧化氫。當使用過氧化物作為自由基聚合引發劑時,還可以將過氧化物與還原劑同時使用作為氧化還原型引發劑。
在共聚物[A]的製備中,還可以使用調節分子量用的分子量調節劑。作為其具體例子,可以列舉氯仿、四溴化碳等鹵代烴類;正己硫醇、正辛硫醇、正十二烷硫醇、第三十二烷硫醇、巰基乙酸等硫醇類;二甲基黃原素硫化物、二異丙基黃原素二硫化物等黃原素類;萜品油烯、α-甲基苯乙烯二聚物等。
本發明中使用的[B]成分是通過照射放射線能夠產生羧酸的1,2-醌二疊氮化合物,可以使用由酚性化合物或醇性化合物(以下稱為“母核”)與1,2-萘醌二疊氮磺醯鹵的縮合物。
作為上述母核,可以列舉例如三羥基二苯酮、四羥基二苯酮、五羥基二苯酮、六羥基二苯酮、(多羥基苯基)烷。
作為它們的具體例子,三羥基二苯酮可以列舉例如2,3,4-三羥基二苯酮、2,4,6-三羥基二苯酮等;作為四羥基二苯酮可以列舉例如2,2’,4,4’-四羥基二苯酮、2,3,4,3’-四羥基二苯酮、2,3,4,4’-四羥基二苯酮、2,3,4,2’-四羥基-4’-甲基二苯酮、2,3,4,4’-四羥基-3’-甲氧基二苯酮等;作為五羥基二苯酮可以列舉例如2,3,4,2’,6’-五羥基二苯酮等;作為六羥基二苯酮可以列舉例如2,4,6,3’,4’,5’-六羥基二苯酮、3,4,5,3’,4’,5’-六羥基二苯酮等;作為(多羥基苯基)烷可以列舉例如二(2,4-二羥基苯基)甲烷、二(對羥基苯基)甲烷、三(對羥基苯基)甲烷、1,1,1-三(對羥基苯基)乙烷、二(2,3,4-三羥基苯基)甲烷、2,2-二(2,3,4-三羥基苯基)丙烷、1,1,3-三(2,5-二甲基-4-羥基苯基)-3-苯基丙烷、4,4’-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚、二(2,5-二甲基-4-羥基苯基)-2-羥基苯基甲烷、3,3,3’,3’-四甲基-1,1’-螺雙茚-5,6,7,5’,6’,7’-六醇、2,2,4-三甲基-7,2’,4’-三羥基黃烷等。
此外,還可以適當使用將以上例示的母核的酯鍵改為醯胺鍵後的1,2-萘醌二疊氮磺醯胺類,例如2,3,4-三羥基二苯酮-1,2-萘醌二疊氮-4-磺醯胺等。
這些母核當中,較佳為2,3,4,4’-四羥基二苯酮、4,4’-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚。
此外,作為1,2-萘醌二疊氮磺醯鹵,較佳例如1,2-萘醌二疊氮磺醯氯,作為其具體的例子,可以列舉1,2-萘醌二疊氮-4-磺醯氯和1,2-萘醌二疊氮-5-磺醯氯,其中,較佳使用1,2-萘醌二疊氮-5-磺醯氯。
在縮合反應中,相對於酚性化合物或者醇性化合物中的OH基數,較佳可使用相當於30~85莫耳%、更佳為50~70莫耳%的1,2-萘醌二疊氮磺醯鹵。
縮合反應可以採用公知的方法進行。
這些[B]成分可以單獨或者兩種以上組合使用。
[B]成分的使用比例,相對於100重量份共聚物[A],較佳為5~100重量份,更佳為10~50重量份。當該比例不足5重量份時,則照射放射線的部分與未照射放射線的部分相對於作為顯影液的鹼水溶液的溶解度之差較小,會出現難以形成圖案的情況,並且會出現所得層間絕緣膜或微透鏡的耐熱性和耐溶劑性不夠好的情況。另一方面,當該比例超過100重量份時,則照射放射線的部分如上述鹼水溶液中的溶解度不夠大,會出現難以顯影的情況。
本發明中使用的[C]成分,是具有碳原子數為6~15的芳基的倍半矽氧烷。通過使感放射線性樹脂組成物中含有這種成分,可獲得具有高放射線敏感度和優良的顯影界限的感放射線性樹脂組成物,並且可以形成低介電常數的層間絕緣膜,同時,可以形成與底層的黏附性也優良的層間絕緣膜或微透鏡。
[C]成分可以通過例如將下述式(1)表示的矽烷化合物(以下也稱為“化合物(c1)”)水解而製備。
Si(R1
)(OR2
)(OR3
)(OR4
) ……(1)
(式中,R1
表示碳原子數為6~15的芳基,R2
~R4
相互獨立地表示氫原子、碳原子數為1~4的取代或未取代的烷基或醯基)。
上述水解物應當理解為包括:原料中可水解的部分被全部水解的水解物,以及其一部分被水解而一部分未被水解而殘留的水解物。
上述式(1)中,作為R1
的碳原子數為6~15的芳基,可以列舉萘基、苯基、蒽基、菲基、苄基等,較佳為苯基或苄基,特佳為苯基。
作為化合物(c1)的具體例子,可以列舉苯基三甲氧基矽烷、苯基三乙氧基矽烷、苯基三正丙氧基矽烷、苯基三異丙氧基矽烷、苯基三乙醯氧基矽烷、苯基三(甲氧基乙氧基)矽烷等。
其中,從反應性和保存穩定性方面考慮,較佳為苯基三甲氧基矽烷和苯基三乙氧基矽烷。化合物(c1)可以單獨或兩種以上組合使用。
本發明中使用的[C]成分,從顯影界限和所得固化膜的黏附性方面考慮,較佳為化合物(c1)與下述式(2)表示的矽烷化合物(以下也稱為“化合物(c2)”)的水解縮合物。
Si(R5
)(OR6
)(OR7
)(OR8
) ……(2)
(式中,R5
為碳原子數為1~15的烷基,R6
~R8
相互獨立地為氫原子、碳原子數為1~4的取代或未取代的烷基或醯基)。上述式(2)中,作為上述碳原子數為1~15的烷基,較佳為碳原子數為1~6的直鏈或支鏈烷基,或者碳原子數為5~10的環烷基。更佳例如甲基、乙基、正丙基、異丙基、正丁基、第三丁基、環戊基、環己基、金剛烷基、異冰片基、三環癸基等,特佳為甲基。
作為化合物(c2)的具體例子,可以列舉甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三正丙氧基矽烷、甲基三異丙氧基矽烷、甲基三乙醯氧基矽烷、甲基三(甲氧基乙氧基)矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、乙基三正丙氧基矽烷、乙基三異丙氧基矽烷、乙基三乙醯氧基矽烷、乙基三(甲氧基乙氧基)矽烷、正丙基三甲氧基矽烷、正丙基三乙氧基矽烷、正丙基三正丙氧基矽烷、正丙基三異丙氧基矽烷、正丙基三乙醯氧基矽烷、正丙基三(甲氧基乙氧基)矽烷、環己基三甲氧基矽烷、環己基三乙氧基矽烷、環己基三正丙氧基矽烷、環己基三異丙氧基矽烷、環己基三乙醯氧基矽烷、環己基三(甲氧基乙氧基)矽烷等。
其中,從反應性和保存穩定性方面考慮,較佳為甲基三甲氧基矽烷和甲基三乙氧基矽烷。化合物(c2)可以單獨或兩種以上組合使用。
本發明中使用的[C]成分,基於衍生自化合物(c1)和(c2)的重複單元的合計量,較佳含有50重量%以上衍生自化合物(c1)的重複單元,更佳含有50~95重量%,特佳含有60~90重量%。如果該重複單元不足50重量%,則存在於感放射線性樹脂組成物中與共聚物[A]發生相分離而妨礙塗膜形成的可能。
製備[C]成分的水解反應,較佳在適當的溶劑中進行。作為這種溶劑,可以列舉例如甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第三丁醇、丙酮、甲基乙基酮、甲基異丁基酮、丙二醇單甲醚、丙二醇甲醚乙酸酯、四氫呋喃、二氧六環、乙腈等水溶性溶劑或它們的水溶液。
這些水溶性溶劑由於在之後的步驟中要被除去,因此較佳為甲醇、乙醇、正丙醇、異丙醇、丙酮、甲基乙基酮、甲基異丁基酮、四氫呋喃等沸點較低的溶劑,從原料的溶解性方面考慮,更佳為丙酮、甲基乙基酮、甲基異丁基酮等酮類,特佳為甲基異丁基酮。
另外,水解反應,較佳在酸催化劑例如鹽酸、硫酸、硝酸、甲酸、草酸、乙酸、三氟乙酸、三氟甲磺酸、酸性離子交換樹脂、各種路易士酸,或鹼催化劑例如氨、一級胺類、二級胺類、三級胺類、吡啶等含氮芳香族化合物、鹼性離子交換樹脂、氫氧化鈉等氫氧化物、碳酸鉀等碳酸鹽、醋酸鈉等羧酸鹽、各種路易士鹼等的存在下進行。催化劑的用量,相對於1莫耳單體,較佳為0.2莫耳以下,更佳為0.00001~0.1莫耳。
水的含量、反應溫度、反應時間可適當地設定。例如可以採用下述條件。
水的含量,相對於製備中所用的矽烷化合物中水解基團的合計量1莫耳,為1.5莫耳以下,較佳為1莫耳以下,更佳為0.9莫耳以下的量。
反應溫度較佳為40~200℃,更佳為50~150℃。反應時間較佳為30分鐘~24小時,更佳為1~12小時。
本發明中使用的[C]成分的聚苯乙烯換算的重量平均分子量,較佳為5×102
~5×103
,更佳為1×103
~4.5×103
。若[C]成分的重量平均分子量不足5×102
,則存在顯影界限不夠的可能,另一方面,若超過5×103
,則存在在感放射線性樹脂組成物中與共聚物[A]發生相分離而妨礙塗膜形成的可能。
[C]成分的使用比例,相對於100重量份共聚物[A],較佳為10~100重量份以下,更佳為15~50重量份。當該使用比例不足10重量份時,則存在不能獲得所需的效果的可能,另一方面,當超過100重量份時,則存在與共聚物[A]發生相分離而妨礙塗膜形成的可能。
本發明的感放射線性樹脂組成物,含有上述共聚物[A]、[B]和[C]成分作為必需成分,除此以外還可以根據需要含有[D]熱敏性產酸化合物、[E]含有至少一個乙烯性不飽和雙鍵的聚合性化合物、[F]共聚物[A]以外的環氧樹脂、[G]界面活性劑或者[H]黏合輔助劑。
上述[D]熱敏性產酸化合物可以為了提高耐熱性和硬度而使用。作為其具體的例子,可以列舉鋶鹽、苯并噻唑鎓鹽、銨鹽、鏻鹽等已知的鎓鹽類。
[D]成分的使用比例,相對於100重量份共聚物[A],較佳為20重量份以下,更佳為5重量份以下。當該使用量超過20重量份時,則在塗膜形成步驟中會析出沉澱物,出現防礙塗膜形成的情況。
作為[E]成分的含有至少一個乙烯性不飽和雙鍵的聚合性化合物,較佳可以列舉例如已知的單官能(甲基)丙烯酸酯、雙官能(甲基)丙烯酸酯或者三官能以上的(甲基)丙烯酸酯。其中,較佳使用三官能以上的(甲基)丙烯酸酯,特佳為三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。
[E]成分的使用比例,相對於100重量份共聚物[A],較佳為50重量份以下,更佳為30重量份以下。
通過使其以這種比例含有[E]成分,可以提高由本發明感放射線性樹脂組成物製得的層間絕緣膜或微透鏡的耐熱性和表面硬度等。如果該使用量超過了50重量份,則會出現在基板上形成感放射線性樹脂組成物塗膜的步驟中產生膜皸裂的情況。
作為上述[F]成分的共聚物[A]以外的環氧樹脂,只要對相容性沒有影響,則對其沒有限制。較佳可以列舉雙酚A型環氧樹脂、苯酚酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、環狀脂肪族環氧樹脂、縮水甘油酯型環氧樹脂、縮水甘油基胺型環氧樹脂、雜環式環氧樹脂、與甲基丙烯酸縮水甘油基酯(共)聚合的樹脂等。其中,特佳為雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、縮水甘油酯型環氧樹脂等。
[F]成分的使用比例,相對於100重量份共聚物[A],較佳為30重量份以下。通過以這種比例含有[F]成分,可以進一步提高由本發明感放射線性樹脂組成物製得的保護膜或絕緣膜的耐熱性和表面硬度等。如果該比例超過了30重量份,則在基板上形成感放射線性樹脂組成物塗膜時,會出現塗膜的膜厚度均一性不夠好的情況。
另外,共聚物[A]也可以稱作為“環氧樹脂”,但是其在具有鹼可溶性這一點上與[F]成分不同。[F]成分是鹼不溶性的。
在本發明的感放射線性樹脂組成物中,為了進一步提高塗敷性,還可以使用作為上述[G]成分的界面活性劑。作為[G]界面活性劑,較佳可使用例如氟系界面活性劑、矽氧烷類界面活性劑。
作為氟系界面活性劑的具體例子,可以列舉1,1,2,2-四氟辛基(1,1,2,2-四氟丙基)醚、1,1,2,2-四氟辛基己基醚、八乙二醇二(1,1,2,2-四氟丁基)醚、六乙二醇(1,1,2,2,3,3-六氟戊基)醚、八丙二醇二(1,1,2,2-四氟丁基)醚、六丙二醇二(1,1,2,2,3,3-六氟戊基)醚、全氟十二烷基磺酸鈉、1,1,2,2,8,8,9,9,10,10-十氟十二烷、1,1,2,2,3,3-六氟癸烷等,除此之外,還可以列舉氟代烷基苯磺酸鈉、氟代烷基氧乙烯醚、碘化氟代烷基銨、氟代烷基聚氧乙烯醚、全氟烷基聚氧乙醇、全氟代烷基烷氧化物、氟系烷基酯等。作為它們的市售品,可以列舉BM-1000、BM-1100(以上,由BM Chemie公司生產)、Megafac F142D、Megafac F172、Megafac F173、Megafac F183、Megafac F178、Megafac F191、Megafac F471(以上,由大日本油墨化學工業(股)生產)、Fluorad FC-170C、FC-171、FC-430、FC-431(以上,由住友3M(股)生產)、Surflon S-112、Surflon S-113、Surflon S-131、Surflon S-141、Surflon S-145、Surflon S-382、Surflon SC-101、Surflon SC-102、Surflon SC-103、Surflon SC-104、Surflon SC-105、Surflon SC-106(旭硝子(股)生產)、Eftop EF 301、Eftop EF 303、Eftop EF 352(新秋田化成(股)生產)等。
作為上述矽氧烷系界面活性劑,可以列舉例如以DC3PA、DC7PA、FS-1265、SF-8428、SH11PA、SH21PA、SH28PA、SH29PA、SH30PA、SH-190、SH-193、SZ-6032(以上,由Toray Dowcorning Silicone Co.生產)、TSF-4440、TSF-4300、TSF-4445、TSF-4446、TSF-4460、TSF-4452(以上由GE東芝Silicon(股)生產)等商品名銷售的矽氧烷系界面活性劑。
這些界面活性劑可以單獨或者兩種以上組合使用。這些[G]界面活性劑,相對於100重量份共聚物[A],較佳使用5重量份以下,更佳為2重量份以下。如果[G]界面活性劑的使用量超過了5重量份,則在基板上形成塗膜時,會出現塗膜容易產生膜皸裂的情況。
此外,為了提高與基體的黏合性,本發明的感放射線性樹脂組成物中還可以使用黏合輔助劑[H]成分。作為這種[H]黏合輔助劑,較佳使用官能性矽烷偶合劑,可以列舉例如具有羧基、甲基丙烯醯基、異氰酸酯基、環氧基等反應性取代基的矽烷偶合劑。具體地可以列舉三甲氧基矽烷基安息香酸酯、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸酯基丙基三乙氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等。這種[H]黏合輔助劑,相對於100重量份共聚物[A],較佳以20重量份以下的量,更佳以10重量份以下的量進行使用。當黏合輔助劑的量超過20重量份時,會出現在顯影步驟中容易產生顯影殘留的情況。
本發明的感放射線性樹脂組成物可以通過將上述共聚物[A]、[B]和[C]成分以及如上所述任選添加的其他成分均勻混合而配製。本發明的感放射線性樹脂組成物較佳以溶於適當溶劑中的溶液狀態使用。例如可以通過將共聚物[A]、[B]和[C]成分以及任選添加的其他成分以所定的比例混合而配製成溶液狀態的感放射線性樹脂組成物。
作為本發明感放射線性樹脂組成物的配製中使用的溶劑,可以使用能均勻溶解共聚物[A]、[B]和[C]成分以及任選混合的其他成分中的各成分,且不與各成分反應的溶劑。
作為這種溶劑,可以列舉與上述作為共聚物[A]的製造中可以使用的溶劑而例示的相同溶劑。
在這種溶劑中,從各成分的溶解性、與各成分的反應性、形成塗膜的容易性等角度出發,較佳使用醇、乙二醇醚、乙二醇烷基醚乙酸酯、酯和二甘醇。其中,可特佳可使用苄醇、2-苯乙醇、3-苯基-1-丙醇、乙二醇單丁基醚乙酸酯、二甘醇單乙基醚乙酸酯、二甘醇二乙醚、二甘醇乙基甲基醚、二甘醇二甲醚、丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、甲氧基丙酸甲酯、乙氧基丙酸乙酯。
為了提高膜厚的面內均勻性,還可以進一步與上述溶劑一起聯用高沸點溶劑。作為可以聯用的高沸點溶劑,可以列舉例如N-甲基甲醯胺、N,N-二甲基甲醯胺、N-甲基甲醯苯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、苄基乙基醚、二己基醚、丙酮基丙酮、異佛爾酮、己酸、辛酸、1-辛醇、1-壬醇、乙酸苄酯、苯甲酸乙酯、草酸二乙酯、馬來酸二乙酯、γ-丁內酯、碳酸乙二酯、碳酸丙二酯、苯基溶纖劑乙酸酯等。其中,較佳為N-甲基吡咯烷酮、γ-丁內酯、N,N-二甲基乙醯胺。
作為本發明感放射線性樹脂組成物的溶劑,當聯用高沸點溶劑時,其用量相對於全部溶劑的量可為50重量%以下,較佳為40重量%以下,更佳為30重量%以下。當高沸點溶劑的用量超過該用量時,則會出現塗膜厚度均勻性、敏感度和殘膜率下降的情況。
當將本發明的感放射線性樹脂組成物配製成溶液狀態時,溶液中除溶劑以外的成分(即共聚物[A]、[B]和[C]成分以及任選添加的其他成分的合計量)的所占的比例,可以根據使用目的和所需膜厚度值等任意地設定。即使如此,較佳為5~50重量%,更佳為10~40重量%,進一步較佳為15~35重量%。
如此配製的組成物溶液還可以用孔徑為0.2μm左右的微孔濾器等過濾後再供給使用。
接著,對用本發明感放射線性樹脂組成物形成本發明的層間絕緣膜、微透鏡的方法進行說明。本發明的層間絕緣膜或微透鏡的形成方法按照下述順序包括以下步驟。
(1)在基板上形成本發明感放射線性樹脂組成物塗膜的步驟,
(2)對該塗膜的至少一部分照射放射線的步驟,
(3)將照射後的塗膜進行顯影的步驟,和
(4)將顯影後的塗膜進行加熱的步驟。
在上述步驟(1)中,將本發明的組成物溶液塗敷於基板表面上,較佳經由進行預烘焙除去溶劑,形成感放射線性樹脂組成物的塗膜。
作為可以使用的基板的種類,可以列舉例如玻璃基板、矽晶片以及在它們表面上形成各種金屬的基板。
作為組成物溶液的塗敷方法,對其沒有特別的限制,可以採用例如噴塗法、輥塗法、旋轉塗布法(旋塗法)、縫模塗敷法、棒塗法、噴墨法等適當的方法,特佳使用旋塗法、縫模塗敷法。作為預烘焙的條件,根據各成分的種類、使用比例等而不同。例如,可以在60~110℃下進行30秒鐘~15分鐘左右。
所形成的塗膜的厚度,作為預烘焙後的值,當形成層間絕緣膜時,較佳為例如3~6μm,當形成微透鏡時,較佳為例如0.5~3μm。
在上述步驟(2)中,對所形成的塗膜,經由具有規定圖案的掩模照射放射線後,用顯影液進行顯影處理除去照射了放射線的部分,形成圖案。作為此時使用的放射線,可以列舉例如紫外線、遠紫外線、X射線、帶電粒子束等。
作為上述紫外線,可以列舉例如g線(波長436nm)、i線(波長365nm)等。作為遠紫外線,可以列舉例如KrF準分子鐳射等。作為X射線,可以列舉例如同步加速放射線等。作為帶電粒子束,可以列舉例如電子束等。
它們當中,較佳為紫外線,其中特佳為含g線和/或i線的放射線。
作為曝光量,當形成層間絕緣膜時,較佳為50~1500J/m2
,當形成微透鏡時,較佳為50~2000J/m2
。
作為顯影處理中使用的顯影液,可以使用例如氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨、氫氧化四甲基銨、氫氧化四乙基銨、吡咯、呱啶、1,8-二氮雜二環[5.4.0]-7-十一碳烯、1,5-二氮雜二環[4.3.0]-5-壬烷等鹼(鹼性化合物)的水溶液。此外,還可以將在上述鹼水溶液中添加適量的甲醇、乙醇等水溶性有機溶劑或界面活性劑的水溶液,或者溶解本發明組成物的各種有機溶劑作為顯影液使用。另外,作為顯影方法,可以採用例如盛液法、浸漬法、震盪浸漬法、沖洗法等適當的方法。此時的顯影時間,根據組成物的組成而不同,可以為例如30~120秒。
另外,以前已知的感放射線性樹脂組成物,如果顯影時間比最佳值超過20~25秒的程度,則由於形成的圖案會發生脫落,因而必須嚴格控制顯影時間,而對於本發明的感放射線性樹脂組成物的情況,即使比最佳顯影時間超出的時間達到30秒以上,也可以形成良好的圖案,在製品成品率方面存在優勢。
如上進行了(3)顯影步驟之後,對形成圖案的薄膜較佳進行例如流水清洗的沖洗處理,並且,較佳採用高壓汞燈等進行全面照射放射線(後曝光),對該薄膜中殘留的1,2-醌二疊氮化合物進行分解處理,然後,通過將該薄膜用加熱板、烘箱等加熱裝置進行加熱處理(後烘焙處理),對該薄膜進行固化處理。在上述後曝光步驟中的曝光量,較佳為2000~5000J/m2
左右。並且,該固化處理中的烘焙溫度為例如120~250℃。加熱時間根據加熱機器的種類而不同,例如,當在加熱板上進行加熱處理時,可以為5~30分鐘,當在烘箱中進行加熱處理時,可以為30~90分鐘。此時,還可以採用進行兩次以上的加熱步驟的分步烘焙法等。這樣,可在基板表面上形成對應於目標層間絕緣膜或者微透鏡的圖案狀薄膜。
如上形成的層間絕緣膜和微透鏡,由下述實施例可知,介電常數、黏附性、耐熱性、耐溶劑性和透明性等優良。
如上形成的本發明層間絕緣膜,介電常數低,對基板的黏附性良好,耐溶劑性和耐熱性優良,具有高的透光率,可適合用作為電子產品的層間絕緣膜。
如上形成的本發明微透鏡,對基板的黏附性良好,耐溶劑性和耐熱性優良,且具有高透光率和良好的熔融形狀,可適合用作為固態攝像元件的微透鏡。另外,本發明微透鏡的形狀,如第1圖(a)所示,為半凸透鏡形狀。
以下經由例示合成例、實施例對本發明進行更具體的說明,但是本發明並不局限於以下的實施例。
向裝有冷卻管和攪拌器的燒瓶中,加入7重量份2,2’-偶氮二(2,4-二甲基戊腈)和200重量份二甘醇乙基甲基醚。繼續加入16重量份甲基丙烯酸、14重量份甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯、20重量份丙烯酸2-甲基環己酯、40重量份甲基丙烯酸縮水甘油基酯、10重量份苯乙烯和3重量份α-甲基苯乙烯二聚物,用氮氣置換後,開始緩慢攪拌。使溶液的溫度升至70℃,保持該溫度4小時,得到含共聚物[A-1]的聚合物溶液。共聚物[A-1]的聚苯乙烯換算重量平均分子量(Mw)為8000,分子量分布(Mw/Mn)為2.3。另外,在此製得的聚合物溶液的固體含量濃度為34.4重量%。
向裝有冷卻管和攪拌器的燒瓶中,加入8重量份2,2’-偶氮二(2,4-二甲基戊腈)和220重量份二甘醇乙基甲基醚。繼續加入13重量份甲基丙烯酸、12重量份甲基丙烯酸四氫糠基酯、40重量份甲基丙烯酸縮水甘油基酯、15重量份N-環己基馬來醯亞胺、10重量份甲基丙烯酸十二烷基酯、10重量份α-甲基-對羥基苯乙烯和3重量份α-甲基苯乙烯二聚物,用氮氣置換後,開始緩慢攪拌。使溶液的溫度升至70℃,保持該溫度5小時,得到含共聚物[A-2]的聚合物溶液。
共聚物[A-2]的聚苯乙烯換算重量平均分子量(Mw)為8000,分子量分布(Mw/Mn)為2.3。另外,在此製得的聚合物溶液的固體含量濃度為31.9重量%。
向裝有冷卻管和攪拌器的燒瓶中,加入8重量份2,2’-偶氮二(2,4-二甲基戊腈)和220重量份二甘醇乙基甲基醚。繼續加入10重量份苯乙烯、20重量份甲基丙烯酸、40重量份甲基丙烯酸縮水甘油基酯、10重量份甲基丙烯酸(3-乙基氧雜環丁烷-3-基酯)和20重量份甲基丙烯酸三環[5.2.1.02,6
]癸烷-8-基酯,用氮氣置換後,開始緩慢攪拌。使溶液的溫度升至70℃,保持該溫度5小時,得到含共聚物[A-3]的聚合物溶液。
共聚物[A-3]的聚苯乙烯換算重量平均分子量(Mw)為7900,分子量分布(Mw/Mn)為2.4。另外,在此製得的聚合物溶液的固體含量濃度為31.6重量%。
向裝有冷卻管和攪拌器的燒瓶中,加入8重量份2,2’-偶氮二(2,4-二甲基戊腈)和220重量份二甘醇乙基甲基醚。繼續加入15重量份苯乙烯、15重量份甲基丙烯酸、45重量份甲基丙烯酸縮水甘油基酯和20重量份N-(4-羥基苯基)-甲基丙烯醯胺,用氮氣置換後,再加入5重量份1,3-丁二烯,開始緩慢攪拌。使溶液的溫度升至70℃,保持該溫度5小時,得到含共聚物[A-4]的聚合物溶液。
共聚物[A-4]的聚苯乙烯換算重量平均分子量(Mw)為7900,分子量分布(Mw/Mn)為2.4。另外,在此製得的聚合物溶液的固體含量濃度為31.5重量%。
取100g苯基三甲氧基矽烷置於500ml的三頸燒瓶中,加入100g甲基異丁基酮使其溶解,一邊用磁力攪拌器攪拌,一邊加熱升溫至60℃。向該溶液中經1小時連續地加入溶解了1重量%草酸的8.6g離子交換水。使溶液的溫度保持60℃反應4小時後,將所得反應液冷卻至室溫。然後,減壓蒸餾從反應液中除去反應副產物醇成分。如此製得的倍半矽氧烷[C-1]的重量平均分子量為1600。
取79.8g苯基三甲氧基矽烷和21.2g甲基三甲氧基矽烷置於500ml的三頸燒瓶中,加入100g丙二醇甲醚乙酸酯使其溶解,一邊用磁力攪拌器攪拌,一邊加熱升溫至60℃。向該溶液中經1小時連續地加入溶解了1重量%草酸的8.6g離子交換水。使溶液的溫度保持60℃反應4小時後,將所得反應液冷卻至室溫。然後,減壓蒸餾從反應液中除去反應副產物醇成分。如此製得的倍半矽氧烷[C-2]的重量平均分子量為2000。
將作為[A]成分的上述合成例1中合成的共聚物[A-1]100重量份(換算為固體成分),作為[B]成分的4,4’-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚(1.0莫耳)與1,2-萘醌二疊氮-5-磺醯氯(2.0莫耳)的縮合物(B-1)30重量份,以及倍半矽氧烷[C-1]30重量份(換算為固體成分)進行混合,將其溶於二甘醇乙基甲基醚,使其固體含量濃度為30重量%,然後用孔徑為0.2μm的濾膜過濾,配製得到感放射線性樹脂組成物的溶液(S-1)。
在實施例1中,除了[A]~[C]成分使用如表1中所列的種類、用量以外,與實施例1同樣地操作,配製出感放射線性樹脂組成物的溶液(S-2)~(S-8)和(s-1)。
另外,在實施例2、4、6、8中,[B]成分所列的表示分別聯用了兩種1,2-醌二疊氮化合物。
在實施例1中,溶解於乙二醇乙基甲基醚/丙二醇單甲醚乙酸酯=6/4中,使其固體含量濃度為20重量%,並添加矽氧烷類界面活性劑SH-28PA(Toray Dowcorning Silicone Co.生產),除此以外,與實施例1同樣地配製組成物,配製出感放射線性樹脂組成物溶液(S-9)。
B-1:4,4’-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚(1.0莫耳)與1,2-萘醌二疊氮-5-磺醯氯(2.0莫耳)的縮合物
B-2:4,4’-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚(1.0莫耳)與1,2-萘醌二疊氮-5-磺醯氯(1.0莫耳)的縮合物
F:矽氧烷類界面活性劑(商品名為SH-28PA,Toray Dowcorning Silicone Co.生產)。
使用如上配製的感放射線性樹脂組成物,對其作為層間絕緣膜的各種性能如下進行評價。
對於實施例10~17、比較例2,採用旋塗器將表2中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。對於實施例18,採用縫模塗敷器進行塗敷,在0.5Torr下進行真空乾燥,再在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。經由具有預定圖案的圖案掩模,採用Canon製造的PLA-501F曝光機(超高壓汞燈),使曝光時間變化,對所得塗膜進行曝光後,在表2中所示濃度的氫氧化四甲基銨水溶液中,在25℃下採用盛液法進行顯影,當採用0.4%濃度的顯影液時,顯影80秒,當採用2.38%濃度的顯影液時,顯影50秒。再用超純水進行1分鐘流水沖洗,並使其乾燥,在矽片上形成圖案。測定使3.0μm線條和間隙(10比1)的間隙‧圖案完全溶解所必需的曝光量。以該值作為敏感度列於表2。當該值為1000J/m2
以下時,可以認定敏感度為良好。
對於實施例10~17、比較例2,採用旋塗器將表2中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。對於實施例18,採用縫模塗敷器進行塗敷,在0.5Torr下進行真空乾燥,再在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。經由具有3.0μm線條和間隙(10比1)圖案的掩模,採用Canon製造的PLA-501F曝光機(超高壓汞燈),以相當於上述“敏感度評價”中測定的敏感度值的曝光量對所得塗膜進行曝光,在表2所示濃度的氫氧化四甲基銨水溶液中,於25℃下以變化的顯影時間經由盛液法進行顯影。然後用超純水進行1分鐘流水沖洗,並使其乾燥,在矽片上形成圖案。這時,以使線條的線寬為3.0μm所必需的顯影時間為最佳顯影時間列於表2。
並且,在自最佳顯影時間起進一步繼續顯影時,測定直到3.0μm線條圖案脫落時的時間,以其作為顯影界限列於表2。當該值為30秒以上時,則可以認定顯影界限為良好。
對於實施例10~17、比較例2,採用旋塗器將表2中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預烘焙2分鐘,形成塗膜。對於實施例18,採用縫模塗敷器進行塗敷,在0.5Torr下進行真空乾燥,再在加熱板上於90℃下預烘焙2分鐘,形成塗膜。採用Canon製造的PLA-501F曝光機(超高壓汞燈)以累積照射量為3000J/m2
對所得塗膜進行曝光,將該矽基板在潔淨烘箱中於220℃下加熱1小時,得到厚度為3.0μm的固化膜。測定所得固化膜的膜厚(T1)。然後,將形成了該固化膜的矽基板在溫度控制在70℃的二甲亞碸中浸漬20分鐘後,測定該固化膜的膜厚(t1),算出由浸漬導致的膜厚變化率{|t1-T1|/T1)×100[%]。結果列於表2。當該值為5%以下時,可以認定耐溶劑性為良好。
另外,在耐溶劑性評價中形成的膜由於不需要形成圖案,故省略了顯影步驟,僅供對塗膜形成步驟、照射放射線的步驟和加熱步驟進行評價。
與上述耐溶劑性的評價同樣地形成固化膜,測定所得固化膜的膜厚(T2)。然後,將該固化膜基板置於潔淨烘箱中在240℃下追加烘焙1小時後,測定該固化膜的厚度(t2),計算由追加烘焙導致的膜厚變化率{|t2-T2|/T2}×100[%]。結果列於表2。當該值為5%以下時,可以認定耐熱性為良好。
與上述耐溶劑性的評價同樣地形成固化膜,將預先塗敷了環氧樹脂的具有直徑為0.27cm圓形黏合面的鋁制大頭釘(QUAD公司生產)黏合在固化膜上,使釘與基板相垂直,在潔淨烘箱中於150℃下進行1小時烘焙,使環氧樹脂固化。然後,用牽拉試驗機“Motorized Stand SDMS-0201-100SL((股)今田製作所製造)”牽拉大頭釘,測定固化膜與基板脫離時的力。此時的力值列於表2。若該值為150N以上,可認定對基板的黏附性為良好。
在上述耐溶劑性的評價中,除了採用玻璃基板“Corning 7059(由Corning公司製造)”代替矽基板以外,同樣地在玻璃基板上形成固化膜。用分光光度計“150-20型雙光束((股)日立製作所製造)”在400~800nm波長範圍內測定具有該固化膜的玻璃基板的透光率。此時的最低透光率值列於表2。當該值為90%以上時,可以認定透明性為良好。
對於實施例10~17、比較例2,採用旋塗器將表2中所列的組成物塗敷於研磨後的SUS304製基板上後,在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。對於實施例18,採用縫模塗敷器進行塗敷,在0.5Torr下進行真空乾燥,再在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為3.0μm的塗膜。採用Canon製造的PLA-501F曝光機(超高壓汞燈)以累積照射量為3000J/m2
對所得塗膜進行曝光,將該基板在潔淨烘箱中於220℃下烘焙1小時,得到固化膜。將該固化膜經由蒸鍍法形成Pt/Pd電極圖案,製作出測定介電常數用的樣品。對該基板,採用Hewlett-Packard製造的HP16451B電極和HP4284A精密LCR儀,經由CV法以10kHz的頻率測定該基板的介電常數。結果列於表2。當該值為3.9以下時,可以認定介電常數為良好。
另外,在介電常數評價中形成的膜由於不需要形成圖案,故省略了顯影步驟,僅供對塗膜形成步驟、照射放射線的步驟和加熱步驟進行評價。
採用上述配製的感放射線性樹脂組成物,對其作為微透鏡的各種性能如下進行評價。另外,耐溶劑性評價、耐熱性評價、透明性評價將參照上述作為層間絕緣膜的性能評價中的結果。
對於實施例19~26、比較例3,採用旋塗器將表3中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為2.0μm的塗膜。經由具有規定圖案的圖案掩模,採用Nikon製造的NSR1755i7A縮小投影曝光機(NA=0.50,λ=365nm),使曝光時間變化,對所得塗膜進行曝光,再在表3所示濃度的氫氧化四甲基銨水溶液中,於25℃下經由盛液法顯影1分鐘。用水沖洗、乾燥,在矽片上形成圖案。測定使0.8μm線條和間隙(1比1)的間隙線寬為0.8μm所必需的曝光時間。以該值作為敏感度列於表3。當該值為2000J/m2
以下時,可認定敏感度為良好。
對於實施例19~26、比較例3,採用旋塗器將表3中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預烘焙2分鐘,形成膜厚度為2.0μm的塗膜。經由具有規定圖案的圖案掩模,採用Nikon製造的NSR1755i7A縮小投影曝光機(NA=0.50,λ=365nm),以相當於上述“敏感度評價”中測定的敏感度值的曝光量對所得塗膜進行曝光,在表3所示濃度的氫氧化四甲基銨水溶液中,於25℃下經由盛液法顯影1分鐘。用水沖洗、乾燥,在矽片上形成圖案。以使0.8μm線條和間隙圖案(1比1)的間隙線寬為0.8μm所必需的顯影時間作為最佳顯影時間列於表3。並且,在自最佳顯影時間起進一步繼續顯影時,測定直到0.8μm寬度的圖案脫落時的時間(顯影界限),以其作為顯影界限列於表3。當該值為30秒以上時,可以認定顯影界限為良好。
對於實施例19~26、比較例3,採用旋塗器將表3中所列的組成物塗敷於矽基板上後,在加熱板上於90℃下預焙燒2分鐘,形成膜厚度為2.0μm的塗膜。經由具有4.0μm點2.0μm間隙圖案的圖案掩模,採用Nikon製造的NSR1755i7A縮小投影曝光機(NA=0.50,λ=365nm),以相當於上述“敏感度評價”中測定的敏感度值的曝光量對所得塗膜進行曝光,在表3的作為敏感度評價中的顯影液濃度而列出的濃度的氫氧化四甲基銨水溶液中,於25℃下經由盛液法顯影1分鐘。用水沖洗,乾燥,在矽片上形成圖案。然後,採用Canon製造的PLA-501F曝光機(超高壓汞燈)以累積照射量為3000J/m2
進行曝光。然後在加熱板上於160℃下加熱10分鐘後,進一步在230℃下加熱10分鐘,使圖案熔體流動,形成微透鏡。
所形成的微透鏡的底部(與基板接合的面)的尺寸(直徑)和斷面形狀列於表3。當微透鏡底部的尺寸超過4.0μm且不足5.0μm時,可認定為良好。另外,如果該尺寸為5.0μm以上,則其處於與相鄰透鏡相互接觸的狀態,是不佳的。此外,斷面形狀在第1圖所示的示意圖中,當為如(a)所示的半凸透鏡形狀時,為良好,而如(b)所示的近似梯形的情形為不良。
第1圖為微透鏡剖面形狀的模式圖。
Claims (6)
- 一種感放射線性樹脂組成物,其特徵在於包括:[A]含有(a1)由不飽和羧酸和不飽和羧酸酐構成的群組中選出的至少一種和(a2)由具有環氧乙基的不飽和化合物和具有氧雜環丁烷基的不飽和化合物構成的群組中選出的至少一種之不飽和混合物的共聚物,[B]1,2-醌二疊氮化合物,以及[C]下述式(1)表示的矽烷化合物的水解縮合物之倍半矽氧烷:Si(R1 )(OR2 )(OR3 )(OR4 )...(1)式中,R1 表示碳原子數為6~15的芳基,R2 ~R4 相互獨立地表示氫原子、碳原子數為1~4的取代或未取代的烷基或醯基。
- 如申請專利範圍第1項之感放射線性樹脂組成物,其中[C]倍半矽氧烷為50~95重量%的上述式(1)表示的矽烷化合物與5~50重量%的下述式(2)表示的矽烷化合物的水解縮合物,Si(R5 )(OR6 )(OR7 )(OR8 )...(2)式中,R5 為碳原子數為1~15的烷基,R6 ~R8 相互獨立地為氫原子、碳原子數為1~4的取代或未取代的烷基或醯基。
- 如申請專利範圍第1或2項之感放射線性樹脂組成物,其用於形成層間絕緣膜。
- 一種層間絕緣膜之製造方法,其特徵在於包括按照下述順序之以下步驟:(1)在基板上形成如申請專利範圍第3項之感放射線性樹脂組成物的塗膜的步驟,(2)對該塗膜的至少一部分照射放射線的步驟,(3)將照射後的塗膜進行顯影的步驟,和(4)將顯影後的塗膜進行加熱的步驟。
- 如申請專利範圍第1或2項之感放射線性樹脂組成物,其用於形成微透鏡。
- 一種微透鏡之製造方法,其特徵在於包括按照下述順序之以下步驟:(1)在基板上形成如申請專利範圍第5項之感放射線性樹脂組成物的塗膜的步驟,(2)對該塗膜的至少一部分照射放射線的步驟,(3)將照射後的塗膜進行顯影的步驟,和(4)將顯影後的塗膜進行加熱的步驟。
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