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TWI428301B - Scribing wheel and its manufacturing method - Google Patents

Scribing wheel and its manufacturing method Download PDF

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Publication number
TWI428301B
TWI428301B TW099136458A TW99136458A TWI428301B TW I428301 B TWI428301 B TW I428301B TW 099136458 A TW099136458 A TW 099136458A TW 99136458 A TW99136458 A TW 99136458A TW I428301 B TWI428301 B TW I428301B
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TW
Taiwan
Prior art keywords
wheel
leading edge
cylindrical shaft
tapered
angle
Prior art date
Application number
TW099136458A
Other languages
Chinese (zh)
Other versions
TW201114706A (en
Inventor
Hiroyoshi Hayashi
Naoko Tomei
Tadanobu Nakano
Mikio Kondo
Masanobu Soyama
Hiroshi Tomimori
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
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Priority claimed from JP2009248810A external-priority patent/JP5075184B2/en
Priority claimed from JP2009248811A external-priority patent/JP5075185B2/en
Priority claimed from JP2009248809A external-priority patent/JP4960429B2/en
Priority claimed from JP2009261678A external-priority patent/JP5123919B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201114706A publication Critical patent/TW201114706A/en
Application granted granted Critical
Publication of TWI428301B publication Critical patent/TWI428301B/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085On sheet material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)

Description

劃線輪及其製造方法Scribing wheel and manufacturing method thereof

本發明係關於為了刻劃玻璃板等脆性材料基板之刻劃輪及其製造方法。The present invention relates to a scribing wheel for scribing a substrate of a brittle material such as a glass plate, and a method of manufacturing the same.

以往在分斷玻璃板或陶瓷基板等脆性材料基板之場合係先於此等基板沿所欲之線形成刻劃線,其後沿刻劃線分斷。於刻劃使用之刻劃輪有例如專利文獻1所示,圓板狀且其外周部分為由兩側被切除為錐面狀之算盤珠形狀者。圖1(A)係顯示此一例之前視圖。此刻劃輪100係於中心部具有將銷101做為軸插入之貫通孔。Conventionally, in the case of breaking a brittle material substrate such as a glass plate or a ceramic substrate, the substrate is formed with a scribe line along a desired line, and the scribe line is cut along the scribe line. The scribing wheel used for scribing is, for example, a disk-shaped shape as shown in Patent Document 1, and an outer peripheral portion thereof is an abacus bead shape which is cut into a tapered shape on both sides. Fig. 1(A) shows a front view of this example. At this time, the row wheel 100 has a through hole at the center portion in which the pin 101 is inserted as a shaft.

此外,於專利文獻2、3、4亦顯示有將軸與刻劃輪本體部一體化而形成之刻劃輪。圖1(B)係顯示此一例之前視圖。劃線輪110具有將2個圓錐狀構件底面接著之剖面菱形之形狀,兩端部保持於刀輪保持具而使用。Further, Patent Documents 2, 3, and 4 also show a scribing wheel formed by integrating a shaft and a scribing wheel body portion. Fig. 1(B) shows a front view of this example. The scribing wheel 110 has a shape in which the bottom surfaces of the two conical members are tapered in a rhombic shape, and both end portions are held by the cutter holder and used.

專利文獻1:日本專利4219945號Patent Document 1: Japanese Patent No. 4219945

專利文獻2:國際公開WO2003/51784號公報Patent Document 2: International Publication WO2003/51784

專利文獻3:日本實開平4-4028號公報Patent Document 3: Japanese Shikai Kai 4-4028

專利文獻4:日本特開平-223799號公報Patent Document 4: Japanese Laid-Open Patent Publication No. 223799

然而,在專利文獻1中,刃前緣部之厚度與刻劃輪之厚度相同,且由於必須將銷無偏差地插入刻劃輪之中心軸,在刻劃中刻劃輪之軸與銷亦須一致,故有難以使刃前緣部之厚度變薄之問題。However, in Patent Document 1, the thickness of the leading edge portion of the blade is the same as the thickness of the scoring wheel, and since the pin must be inserted into the central axis of the scoring wheel without deviation, the axis and the pin of the scoring wheel are also scribing. It must be consistent, so it is difficult to make the thickness of the leading edge portion of the blade thin.

此外,關於將軸與輪一體化之專利文獻2~專利文獻4之刻劃輪,製造之自由度少,且刃前緣之稜線部分之角度或軸間之距離大,故有無法任意選擇刃前緣部厚度之問題。因此,如圖2(a)(b)所示,不論任何場合,在基板111實裝有晶片零件112、113之場合無法刻劃基板之晶片零件間之狹窄間隙,必須使晶片零件之間隔加寬,有於分斷後之基板周圍產生多餘空間之缺點。Further, in the scriber wheels of Patent Documents 2 to 4 in which the shaft and the wheel are integrated, the degree of freedom of manufacture is small, and the angle of the ridge line portion of the leading edge of the blade or the distance between the axes is large, so that the blade cannot be arbitrarily selected. The problem of the thickness of the leading edge portion. Therefore, as shown in Fig. 2 (a) and (b), in any case, when the wafer 111 is mounted on the substrate 111, the narrow gap between the wafer components of the substrate cannot be scribed, and the interval between the wafer components must be increased. Wide, has the disadvantage of creating excess space around the substrate after the break.

又如圖1(b)所示,刃前緣部之角度α與成為與軸承之接觸部之兩側之錐部之角度β在專利文獻3係被個別規定為α為110~130°,β為50~70°。然而α與β之合計值為180°,關於在超過合計180°之範圍之組合並未被顯示。Further, as shown in Fig. 1(b), the angle ? of the leading edge portion of the blade and the angle ? of the tapered portion on both sides of the contact portion with the bearing are individually defined as α to 110 to 130 °, β in Patent Document 3 It is 50 to 70°. However, the total value of α and β is 180°, and the combination in the range exceeding 180° in total is not shown.

此係因為在專利文獻3中,在將刃前緣部與錐部做為連續之外周面形成後,於刃前緣部與錐部之間形成與外周面之外周同心圓之切除(支持部),故在製造方法上,α與β之合計值被限制為180°。此外,於專利文獻4中,刃前緣部之基部之角度α與錐部之角度β皆為90°,關於其他角度範圍並未被顯示。此外,刃前緣部之稜線雖被2段研磨,但具體之角度並未被顯示。In the case of the patent document 3, after the front edge portion and the tapered portion are formed as continuous outer peripheral surfaces, a cut-off of the outer circumference of the outer peripheral surface is formed between the leading edge portion and the tapered portion of the blade (support portion). Therefore, in the manufacturing method, the total value of α and β is limited to 180°. Further, in Patent Document 4, the angle α of the base portion of the blade leading edge portion and the angle β of the tapered portion are both 90°, and are not shown with respect to other angle ranges. Further, although the ridgeline of the leading edge portion of the blade is ground in two stages, the specific angle is not shown.

本發明係鑑於此種以往之問題點而為,以提供即使為銷一體型之刻劃輪亦可使刃前緣之厚度變薄,對於基板上附零件之有狹窄部分亦可刻劃,且可以任意之尺寸無偏差地以高精度容易製造之刻劃輪及其製造方法為目的。The present invention has been made in view of such a conventional problem, and it is possible to provide a scriber wheel of a pin-integrated type, which can reduce the thickness of the leading edge of the blade, and can also scribe a narrow portion of the attached component on the substrate, and The scribe wheel and the manufacturing method thereof which can be easily manufactured with high precision without any deviation can be used.

為了解決上述課題,本發明之刻劃輪,具備:以於中心具有一平面內之圓形之稜線之燒結鑽石形成之圓板狀之輪本體部;於前述輪本體部之左右以燒結鑽石層同軸形成之圓柱軸部;其特徵在於具備:於前述圓柱軸部之各自之外側端部同軸形成為既定之角度之錐部;形成為前述輪本體部之稜線部之頂角成為既定之角度之刃前緣部。In order to solve the above problems, the scribing wheel of the present invention includes: a disk-shaped wheel body portion formed of sintered diamond having a circular ridge line in a plane at the center; and a diamond-plated layer on the left and right sides of the wheel body portion a cylindrical shaft portion formed by coaxially, comprising: a tapered portion formed coaxially at an outer end portion of each of the cylindrical shaft portions at a predetermined angle; and a apex angle of the ridge line portion of the wheel main body portion is formed at a predetermined angle The leading edge of the blade.

在此,前述輪本體部具有至少2段之錐面,且係僅研磨形成前述刃前緣部之稜線之錐面而形成亦可。Here, the wheel main body portion may have at least two tapered surfaces, and may be formed by polishing only the tapered surface forming the ridge line of the blade leading edge portion.

在此,前述刃前緣部於稜線形成有既定形狀之槽亦可。Here, the blade leading edge portion may have a groove having a predetermined shape formed on the ridge line.

在此,使前述刃前緣部之厚度為0.4mm以下亦可。Here, the thickness of the leading edge portion of the blade may be 0.4 mm or less.

在此,僅使前述輪本體部之中由構成稜線之一對錐面狀之面構成之部分為刃前緣部,前述刃前緣部之厚度為0.03mm以上亦可。Here, only the portion of the wheel main body portion which is constituted by one of the ridge lines and the tapered surface is the blade leading edge portion, and the thickness of the blade leading edge portion may be 0.03 mm or more.

在此,前述刃前緣部具有設於輪本體部中央之圓板部、前述圓板部之前端之錐面狀部分亦可。Here, the blade leading edge portion may have a circular plate portion provided at the center of the wheel main body portion and a tapered surface portion at the front end of the disc portion.

在此,前述圓板部之厚度為0.4~0.03mm之範圍易。Here, the thickness of the disc portion is in the range of 0.4 to 0.03 mm.

在此,前述輪本體部係於與前述圓柱軸部之間具有錐面狀之傾斜部亦可。Here, the wheel main body portion may be a tapered portion having a tapered shape with the cylindrical shaft portion.

在此,前述輪本體部之傾斜部係使彎曲為與前述圓柱軸部之間連續亦可。Here, the inclined portion of the wheel main body portion may be curved to be continuous with the cylindrical shaft portion.

在此,前述刃前緣部之稜線部之頂角α與前述錐部之角度β係下式 185°≦α+β≦290°;稜線部之頂角α係75°≦α≦170°;前述錐部之角度β係滿足60°≦β≦120°亦可。Here, the apex angle α of the ridge line portion of the blade leading edge portion and the angle β of the tapered portion are as follows 185°≦α+β≦290°; the apex angle α of the ridge line is 75°≦α≦170°; the angle β of the taper portion may satisfy 60°≦β≦120°.

在此,前述錐部之角度β係滿足下式90°≦β≦120°亦可。Here, the angle β of the tapered portion may satisfy the following formula: 90°≦β≦120°.

在此,前述輪本體部之外徑D滿足下式1mm≦D≦6mm亦可。Here, the outer diameter D of the wheel main body portion may satisfy the following formula: 1 mm ≦ D ≦ 6 mm.

在此,前述輪本體部之外徑D滿足下式1mm≦D≦2.5mm亦可。Here, the outer diameter D of the wheel main body portion may satisfy the following formula: 1 mm ≦ D ≦ 2.5 mm.

在此,前述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D亦可。Here, the outer diameter D of the wheel main body portion and the length C of the cylindrical shaft portion may satisfy the following formula C<D.

15、如申請專利範圍第12項之刻劃輪,其中,前述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D。15. The scriber wheel of claim 12, wherein the outer diameter D of the wheel body portion and the length C of the cylindrical shaft portion satisfy the following formula C<D.

16、如申請專利範圍第13項之刻劃輪,其中,前述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D。16. The scriber of claim 13, wherein the outer diameter D of the wheel body portion and the length C of the cylindrical shaft portion satisfy the following formula C<D.

為了解決上述課題,本發明之刻劃輪之製造方法,使用於以超硬合金形成之圓柱狀構件之一端同軸形成有燒結鑽石層之圓柱部之圓柱狀之加工素材;保持前述超硬合金之圓柱部分同時使旋轉,以線切割放電加工於燒結鑽石層部分形成一對同軸之圓柱軸部與夾於該圓柱軸部之輪本體部;保持前述超硬合金之圓柱部分同時使旋轉,將前述圓柱軸部之各自之外側端部藉由研磨加工而形成為錐面狀;保持前述超硬合金之圓柱部分同時使旋轉,將前述輪本體部之稜線部研磨成為既定之角度以形成刃前緣部;藉由切斷前述燒結鑽石層與前述超硬合金而被製造。In order to solve the above problems, the manufacturing method of the scribing wheel of the present invention is used for forming a cylindrical processing material having a cylindrical portion of a sintered diamond layer coaxially with one end of a cylindrical member formed of a super-hard alloy; and maintaining the superhard alloy The cylindrical portion is simultaneously rotated, and the wire-cut electric discharge machining is performed on the sintered diamond layer portion to form a pair of coaxial cylindrical shaft portions and the wheel body portion sandwiched between the cylindrical shaft portions; while maintaining the cylindrical portion of the super-hard alloy while rotating, the foregoing The outer end portions of the cylindrical shaft portions are formed into a tapered shape by grinding; while the cylindrical portion of the superhard alloy is held and rotated, the ridge portion of the wheel main body portion is ground to a predetermined angle to form a leading edge The part is manufactured by cutting the sintered diamond layer and the aforementioned superhard alloy.

在此,於使用前述線切割放電加工之圓柱軸部與輪本體部之形成時於前述圓柱軸部之外側同時形成錐部;於前述圓柱軸部之錐部之研磨時係將因線切割放電加工而產生之表面之變質層除去亦可。Here, when the cylindrical shaft portion and the wheel body portion of the wire cutting electric discharge machining are used, a taper portion is simultaneously formed on the outer side of the cylindrical shaft portion; when the taper portion of the cylindrical shaft portion is ground, the wire cut discharge is performed. The altered layer of the surface produced by the processing may be removed.

利用具有此種特徵之本發明之刻劃輪,可藉由適當變更加工線(線切割放電加工機之線之行走軌跡(加工部位))與中心軸之距離而任意選擇圓柱軸部之粗度。此外,可任意選擇圓柱軸部之間隔、輪本體部之厚度、刃前緣部之角度。在以往之軸與輪本體部成為一體之側面為菱形形狀之刻劃輪,刃前緣部之錐面之角度、圓柱軸部之錐面之角度或間隔、刃前緣部之外徑雖不能自由設定,但在本發明中此等可分別獨立任意設定。此外,藉由僅研磨需要高精度之圓柱軸端部之錐部與刃前緣部而其他部分則維持放電加工之狀態,可以最少之加工步驟及成本達成所欲之精度之刻劃輪。By using the scribing wheel of the present invention having such a feature, the thickness of the cylindrical shaft portion can be arbitrarily selected by appropriately changing the distance between the processing line (the traveling path of the wire of the wire-cut electric discharge machine (machined portion)) and the central axis. . Further, the interval between the cylindrical shaft portions, the thickness of the wheel body portion, and the angle of the leading edge portion of the blade can be arbitrarily selected. In the conventional side surface in which the shaft and the wheel body are integrated, the diamond wheel has a rhombic shape, and the angle of the tapered surface of the blade front edge portion, the angle or interval of the tapered surface of the cylindrical shaft portion, and the outer diameter of the blade leading edge portion cannot be Freely set, but in the present invention, these can be independently set arbitrarily. Further, by grinding only the tapered portion and the leading edge portion of the end portion of the cylindrical shaft which requires high precision, the other portions are maintained in the state of electric discharge machining, and the desired stroke can be achieved with a minimum of processing steps and costs.

藉由使刃前緣部之厚度為0.4mm以下,可沿實裝有晶片零件等之基板之狹窄線刻劃。此外,若於輪本體部於兩面形成傾斜部,即使減少刃前緣部之厚度亦可保持充分之強度。因此,藉由減少刃前緣部之厚度可沿實裝有晶片零件等之基板之狹窄線刻劃。By making the thickness of the leading edge portion of the blade 0.4 mm or less, it is possible to scribe along a narrow line of a substrate on which a wafer component or the like is mounted. Further, if the inclined portion is formed on both sides of the wheel main body portion, sufficient strength can be maintained even if the thickness of the leading edge portion of the blade is reduced. Therefore, by reducing the thickness of the leading edge portion of the blade, it is possible to scribe along a narrow line of a substrate on which a wafer component or the like is mounted.

另外,刃前緣部之角度α可在刃前緣部獨自選擇最適當之角度,例如75°~170°,藉此水平裂痕或沿刻劃線產生之剝落不易產生,可改善對脆性材料之刻劃性能。此外,錐部之角度β可與α獨自設定為適當之角度,例如60°~120°,與軸承之滑動抵抗變少。此外,亦可獲得於軸承形成之凹陷較淺即可之效果。In addition, the angle α of the leading edge portion of the blade can select the most appropriate angle at the leading edge portion of the blade, for example, 75° to 170°, whereby the horizontal crack or the peeling generated along the score line is not easily generated, and the brittle material can be improved. Characterization performance. Further, the angle β of the tapered portion can be set to an appropriate angle with α alone, for example, 60° to 120°, and the sliding resistance with the bearing is reduced. In addition, it is also possible to obtain an effect that the depression formed by the bearing is shallow.

(第1實施形態)(First embodiment)

針對本發明之第1實施形態之刻劃輪說明。圖3(a)係此刻劃輪之前視圖,圖3(b)係其右側視圖。如此等圖所示,刻劃輪1A於中央具有圓板狀之輪本體部2A,於輪本體部2A之厚度方向之中央做為刃前緣部3A形成有包含包含於一平面內之最大圓周之稜線之錐面狀之部分。此外,於輪本體部2A之兩側之側方同軸具有圓柱軸部4及圓柱軸部5。於圓柱軸部4及圓柱軸部5之各自之外側之端部分別形成有具有相同之傾斜角度之錐部6及錐部7。此刻劃輪1A係全部以燒結鑽石形成為一體。The scribing wheel of the first embodiment of the present invention will be described. Fig. 3(a) is a front view of the rowing wheel at this moment, and Fig. 3(b) is a right side view thereof. As shown in the figures, the scribing wheel 1A has a disk-shaped wheel body portion 2A at the center, and the blade leading edge portion 3A is formed in the center of the wheel body portion 2A in the thickness direction to include the largest circumference included in a plane. The tapered portion of the ridgeline. Further, a cylindrical shaft portion 4 and a cylindrical shaft portion 5 are coaxially formed on the sides of both sides of the wheel main body portion 2A. A tapered portion 6 and a tapered portion 7 having the same inclination angle are respectively formed at the outer end portions of the cylindrical shaft portion 4 and the cylindrical shaft portion 5. At this moment, the rower 1A is all formed integrally with sintered diamond.

於此實施形態中係刃前緣部3A與輪本體部2A之厚度相同,如圖3(a)所示假設其厚度為w1。此厚度w1係例如0.4mm以下,較理想為0.3mm未滿,更理想為0.2mm以下。刃前緣部3A之側方係於刻劃時對基板之面垂直之面。如此一來,即使如圖4(a)(b)所示,於成為刻劃之對象之基板121實裝有晶片零件122、123,將該零件之間之狹窄線上刻劃之際,亦可僅將刃前緣插入晶片零件122、123之間進行刻劃。In this embodiment, the blade leading edge portion 3A and the wheel body portion 2A have the same thickness, and the thickness is assumed to be w1 as shown in Fig. 3(a). The thickness w1 is, for example, 0.4 mm or less, more preferably 0.3 mm or less, and still more preferably 0.2 mm or less. The side of the blade leading edge portion 3A is a surface perpendicular to the surface of the substrate at the time of scribing. In this way, even if the wafer parts 122 and 123 are mounted on the substrate 121 to be scribed as shown in FIGS. 4(a) and 4(b), the narrow line between the parts can be scribed. Only the leading edge of the blade is inserted between the wafer parts 122, 123 for scribing.

在此,可將刃前緣部3A之稜線部之頂角α在刃前緣部3A獨自設定為最適當之角度。例如頂角α為75°~170°,更理想為90°~150°之範圍。若頂角α為鈍角則對脆性材料之水平裂痕或因刻劃線而產生之剝落不易產生,可改善刻劃性能。Here, the apex angle α of the ridge portion of the blade leading edge portion 3A can be set to the optimum angle at the blade leading edge portion 3A alone. For example, the apex angle α is in the range of 75° to 170°, more preferably in the range of 90° to 150°. If the apex angle α is an obtuse angle, the horizontal crack of the brittle material or the flaking due to the scribe line is not easily generated, and the scribe performance can be improved.

另外,錐部6、7之角度β可在錐部獨自設定為最適當之角度。在此,角度β為60°~120°,較理想為75°~120°,更理想為90°~120°之範圍。若角度β大則與軸承之滑動抵抗有變小之傾向,且即使於軸承形成之凹陷較淺亦足夠。但若角度β過大,背隙會變大。反之若角度β較小則與軸承之滑動抵抗會變大。相對於此,在本實施形態係藉由形成於圖3顯示之形狀而可獨立設定刃前緣部3A之稜線部之頂角α與錐部6、7之角度β,可使各自為具體之角度。Further, the angle β of the tapered portions 6 and 7 can be set to an optimum angle at the tapered portion. Here, the angle β is 60° to 120°, more preferably 75° to 120°, and still more preferably 90° to 120°. If the angle β is large, the sliding resistance of the bearing tends to be small, and even if the recess formed by the bearing is shallow, it is sufficient. However, if the angle β is too large, the back gap will become larger. On the other hand, if the angle β is small, the sliding resistance with the bearing becomes large. On the other hand, in the present embodiment, the apex angle α of the ridge line portion of the blade leading edge portion 3A and the angle β of the tapered portions 6 and 7 can be independently set by the shape shown in Fig. 3, and each can be made specific. angle.

此外,在本實施形態係使α+β為以下之範圍。Further, in the present embodiment, α + β is in the range of the following.

185°≦α+β≦290°…(1)185°≦α+β≦290°...(1)

使用藉由於以往之輪之兩側形成圓錐形之外周面來形成相當於圓錐形之頂點之錐部(β)與相當於圓錐形之底邊刃前緣部(α)之方法,因製造上之限制而必然α+β為180°,無法製造α+β≠180°之軸一體型之輪。The method of forming the tapered portion (β) corresponding to the apex of the conical shape and the leading edge portion (α) of the bottom edge corresponding to the conical shape by forming the conical outer peripheral surface on both sides of the conventional wheel is used for manufacturing. The limitation is that α + β is inevitably 180°, and it is impossible to manufacture a shaft-integrated wheel of α + β ≠ 180°.

此外,假設刻劃輪之直徑為D,圓柱軸部之兩端間之長度(兩側之錐部呈圓錐形之場合為兩側之頂點間之距離,錐部非呈圓錐形之場合(形成圓錐台之場合等)為在將錐部(與軸承之接觸部或其切線)延長之場合被假想之兩側之圓錐形之頂點間之距離)為C。在此,若外徑D較小雖以較小之刻劃荷重之刻劃可實現,但若過小則製造、操作變困難。因此外徑D為1mm以上6mm以下,較理想為1mm以上2.5mm以下。在此,在以往之刻劃輪因與保持具之關係而將距離C維持為固定同時為了減少外徑D而必須使角度β變小,但在本實施形態可將C與D獨自設定。In addition, it is assumed that the diameter of the scoring wheel is D, and the length between the two ends of the cylindrical shaft portion (the taper portion on both sides is conical, the distance between the apexes on both sides, and the taper portion is not conical) In the case of a truncated cone, etc.), the distance between the apexes of the conical surfaces on both sides of the imaginary side when the tapered portion (the contact portion with the bearing or the tangential line thereof is extended) is C. Here, if the outer diameter D is small, it is possible to realize the scribe with a small scribed load. However, if it is too small, manufacturing and handling become difficult. Therefore, the outer diameter D is 1 mm or more and 6 mm or less, and preferably 1 mm or more and 2.5 mm or less. Here, in the conventional engraving, the distance C is kept constant by the relationship with the holder, and the angle β is required to be small in order to reduce the outer diameter D. However, in the present embodiment, C and D can be set independently.

以往通常為了使α為90°以上(β為90°以下)而於圖1(b)所示軸支之頂點間之距離C與外徑D之間隔為以下之關係。Conventionally, in order to make α 90° or more (β is 90° or less), the distance between the distance C between the apexes of the axial branches shown in Fig. 1(b) and the outer diameter D is generally the following.

C≧D…(2)C≧D...(2)

反之,在本實施形態角度α及β之大小無依存,圓柱軸部4與圓柱軸部5間之長度C與外徑D之關係為以下之關係。On the other hand, in the present embodiment, the angles α and β are not dependent on each other, and the relationship between the length C between the cylindrical shaft portion 4 and the cylindrical shaft portion 5 and the outer diameter D is as follows.

C<D…(3)C<D...(3)

藉此可抑制刻劃時之偏移。Thereby, the offset at the time of scribing can be suppressed.

其次針對本實施形態之刻劃輪1A之製造方法說明。圖5A~圖5D係顯示本實施形態之刻劃輪1A之製造過程之圖。圖5A係顯示素材塊10之立體圖,於圓柱形狀之超硬合金11之上部一體形成有既定之厚度之燒結鑽石層12。此素材塊10係例如直徑為30mm,高度為16mm,燒結鑽石層12之厚度為3mm,超硬合金11之厚度為13mm。Next, a description will be given of a manufacturing method of the scribing wheel 1A of the present embodiment. 5A to 5D are views showing a manufacturing process of the scribing wheel 1A of the present embodiment. Fig. 5A is a perspective view showing the material block 10 in which a sintered diamond layer 12 having a predetermined thickness is integrally formed on the upper portion of the cylindrical superhard alloy 11. This material block 10 is, for example, 30 mm in diameter and 16 mm in height, 3 mm in thickness of the sintered diamond layer 12, and 13 mm in thickness of the superhard alloy 11.

藉由線切割放電加工平行於此素材塊10之中心軸切取圓柱形之多數構件。藉此如圖5B所示,可獲得細長之加工素材20例如40~50根。此加工素材20係使直徑為配合最終之刻劃輪之外徑D之徑,例如2.0~6.5mm,長度為16mm之圓柱狀之構件。且此加工素材20亦由超硬合金層21與燒結鑽石層22構成。A plurality of cylindrical members are cut parallel to the central axis of the material block 10 by wire-cut electrical discharge machining. Thereby, as shown in FIG. 5B, for example, 40 to 50 elongated processing materials 20 can be obtained. The processed material 20 is a cylindrical member having a diameter that fits the outer diameter D of the final scoring wheel, for example, 2.0 to 6.5 mm and a length of 16 mm. The processed material 20 is also composed of a super-hard alloy layer 21 and a sintered diamond layer 22.

(線切割放電加工)(Wire cutting electrical discharge machining)

其次於圖5C中,將加工素材20之超硬合金層21之左側部分以夾頭固定並以以一點鏈線顯示之圓柱之中心軸為中心高速使旋轉,以線切割放電加工機放電,如圖5C所示切取超硬合金層21與燒結鑽石層22之部分。在此以加工線30~39顯示放電加工之軌跡。加工線30係對以一點鏈線顯示之圓柱之中心軸以既定之角度切除。加工線31係平行於中心軸,加工線32係將錐面狀之線形成為比此稍粗。加工線33係平行於中心軸,加工線34係於加工線33結束後藉由使徑不同形成錐面狀而被形成之加工線。加工線35係為了於輪本體部2A形成刃前緣部3A之錐面狀部分,加工線36亦係具有其相反之傾斜之錐面狀部分。此外,加工線37係為了使直徑減少之線,加工線38係與加工線33對稱且具有相同粗度之平行於中心線之加工線,加工線39係具有與加工線32對稱之傾斜之加工線。在此加工線31~39係全部在燒結鑽石層22被成形。此外,加工線32、39係被設定為比錐部6、錐部7之斜面稍大,殘留有為了後述之研磨加工之切屑。此外,加工線35、36、39係被設定為比刃前緣部3A之斜面稍大,殘留有為了後述之研磨加工之切屑。Next, in FIG. 5C, the left side portion of the superhard alloy layer 21 of the processed material 20 is fixed by a chuck and rotated at a high speed centering on the central axis of the cylinder displayed by a chain line, and discharged by a wire-cut electric discharge machine, such as A portion of the superhard alloy layer 21 and the sintered diamond layer 22 is cut as shown in Fig. 5C. Here, the trajectories of the electric discharge machining are shown by the processing lines 30 to 39. The processing line 30 is cut at a predetermined angle with respect to the central axis of the cylinder displayed by the dotted line. The processing line 31 is parallel to the central axis, and the processing line 32 is formed such that the tapered line is slightly thicker than this. The processing line 33 is parallel to the central axis, and the processing line 34 is a processing line formed by forming a tapered surface after the processing line 33 is completed. The processing line 35 is formed to have a tapered surface portion of the blade leading edge portion 3A in the wheel body portion 2A, and the processing line 36 also has a tapered portion which is oppositely inclined. Further, the processing line 37 is a line for reducing the diameter, the processing line 38 is a processing line which is symmetrical with the processing line 33 and has the same thickness parallel to the center line, and the processing line 39 has a processing which is inclined symmetrically with the processing line 32. line. All of the processing lines 31 to 39 are formed in the sintered diamond layer 22. Further, the processing lines 32 and 39 are set to be slightly larger than the inclined surfaces of the tapered portion 6 and the tapered portion 7, and chips for polishing processing to be described later remain. Further, the processing lines 35, 36, and 39 are set to be slightly larger than the slope of the blade leading edge portion 3A, and chips for polishing processing to be described later remain.

之後在結束線切割放電加工後,如於圖5D顯示正面之局部放大圖般,燒結鑽石層22大致成為刻劃輪1A之形狀之旋轉體。關於右側面圖係與圖3(b)大致相同。Thereafter, after the end of the wire-cut electric discharge machining, as shown in Fig. 5D, the sintered diamond layer 22 is substantially a rotating body of the shape of the scribing wheel 1A. The right side view is substantially the same as FIG. 3(b).

(粗形狀成形(研磨)步驟)(thick shape forming (grinding) step)

其次針對粗形狀成形(研磨)步驟說明。於線切割放電加工之際由於表面為高溫狀態故會形成加工變質層,從表面至內部數十μm為變質狀態。因此,在線切割放電加工之狀態下使用時無法維持高精度。特別是於圖3(a)所示之錐部6、錐部7因與軸承直接接觸,故必須除去加工變質層後形成正確之錐面狀面。在此係於沿加工線32、39線切割放電加工後再為了增加表面之晶度而進行研磨加工。在研磨步驟係與線切割放電加工時同樣將超硬合金層21之左側部分以夾頭固定並以圓柱之中心軸為中心使旋轉,研磨錐面之表面。藉此研磨加工除去於加工線32、39之加工時被形成之變質層,可正確形成左右之圓柱軸部4、圓柱軸部5之前端錐部6、錐部7之錐面狀部分之角度。Next, the description will be given for the rough shape forming (grinding) step. In the case of the wire-cut electric discharge machining, since the surface is in a high temperature state, a work-affected layer is formed, and the surface is tens of μm from the surface to the inside. Therefore, high precision cannot be maintained when used in the state of on-line cutting and electric discharge machining. In particular, since the tapered portion 6 and the tapered portion 7 shown in Fig. 3(a) are in direct contact with the bearing, it is necessary to remove the processed altered layer to form a correct tapered surface. Here, after the electric discharge machining is cut along the processing lines 32 and 39, the polishing process is performed in order to increase the crystallinity of the surface. In the grinding step and the wire-cut electrical discharge machining, the left portion of the super-hard alloy layer 21 is fixed by a chuck and rotated around the central axis of the cylinder to grind the surface of the tapered surface. By this polishing, the altered layer formed during the processing of the processing lines 32 and 39 is removed, and the angles of the left and right cylindrical shaft portions 4, the front end tapered portion 6 of the cylindrical shaft portion 5, and the tapered portion of the tapered portion 7 can be accurately formed. .

再對輪本體部2A之刃前緣部3A亦進行同樣之研磨加工。特別是於圖3(a)所示之刃前緣部3A因與成為刻劃之對象之玻璃板等直接接觸,故必須形成正確之面。在此係為了除去於沿加工線35、36被形成之變質層而將超硬合金層21之左側部分以夾頭固定並以圓柱之中心軸為中心使旋轉進行研磨加工。藉由研磨加工可除去變質層並正確設定銳利之刃前緣部3A之角度。刃前緣部3A之角度係如前述為75°~170°,更理想為90°~150°之範圍。The same polishing process is performed on the blade leading edge portion 3A of the wheel main body portion 2A. In particular, the blade leading edge portion 3A shown in Fig. 3(a) is in direct contact with the glass plate or the like which is the object of scribing, so that it is necessary to form a correct surface. Here, in order to remove the altered layer formed along the processing lines 35, 36, the left side portion of the cemented carbide layer 21 is fixed by a chuck and the rotation is performed centering on the central axis of the cylinder. The altered layer can be removed by grinding and the angle of the sharp edge front edge portion 3A is correctly set. The angle of the blade leading edge portion 3A is as described above in the range of 75 to 170, more preferably in the range of 90 to 150.

(切斷步驟)(cutting step)

藉由切離於圖5D中以一點鏈線顯示之超硬合金層21側之燒結鑽石層22之部分,可如圖3所示獲得輪本體部2A及圓柱軸部4、圓柱軸部5之全部由燒結鑽石層22構成之刻劃輪1A。雖可於此場合研磨切斷後之面以使左右對稱,但由於錐面狀之更前端部分於使用時會進入軸承之貫通孔,故可如圖6所示將錐部6之前端少許殘留,亦可不研磨。By cutting away from the portion of the sintered diamond layer 22 on the side of the superhard alloy layer 21 shown by a dotted line in FIG. 5D, the wheel body portion 2A, the cylindrical shaft portion 4, and the cylindrical shaft portion 5 can be obtained as shown in FIG. The scoring wheel 1A is composed entirely of the sintered diamond layer 22. In this case, the cut surface may be polished to be bilaterally symmetrical. However, since the tapered front end portion enters the through hole of the bearing during use, the front end of the tapered portion 6 may be slightly left as shown in FIG. It can also be omitted.

由於如此完成之刻劃輪1A係將超硬合金層21之左側部分以夾頭保持,使旋轉以線切割放電加工或切削加工,故可使輪本體部2A、圓柱軸部4、圓柱軸部5之軸心正確配合。此外,藉由適當變更加工線33、38與中心軸之距離,可任意選擇圓柱軸部4、圓柱軸部5之粗度。圓柱軸部4、圓柱軸部5之間隔、輪本體部2A之厚度可藉由使加工線34、37之間隔變化任意選擇,刃前緣部3A之寬度可藉由加工線34、37之間隔任意選擇,刃前緣部3A之角度可藉由加工線35、36之角度任意選擇。由於此刻劃輪1A係將輪本體部2A與圓柱軸部4、5一體化,故即使減少刃前緣部3A之厚度亦可確保充分之強度。Since the scribing wheel 1A thus completed holds the left portion of the super-hard alloy layer 21 by the chuck, and the rotation is performed by wire-cut electric discharge machining or cutting, the wheel main body portion 2A, the cylindrical shaft portion 4, and the cylindrical shaft portion can be made. The axis of 5 is correctly matched. Further, the thickness of the cylindrical shaft portion 4 and the cylindrical shaft portion 5 can be arbitrarily selected by appropriately changing the distance between the processing lines 33 and 38 and the central axis. The interval between the cylindrical shaft portion 4 and the cylindrical shaft portion 5 and the thickness of the wheel main body portion 2A can be arbitrarily selected by changing the interval between the processing lines 34, 37, and the width of the leading edge portion 3A can be separated by the processing lines 34, 37. Optionally, the angle of the leading edge portion 3A can be arbitrarily selected by the angle of the processing lines 35, 36. Since the wheel main body 2A is integrated with the cylindrical shaft portions 4 and 5 at this time, the sufficient strength can be ensured even if the thickness of the blade leading edge portion 3A is reduced.

在以往之軸與輪本體成為一體之側面為菱形形狀之刻劃輪,刃前緣部之錐面之角度、圓柱軸部之錐面之角度或間隔、刃前緣部之角度雖不能自由設定,但在本實施形態此等界可分別獨立任意設定。此外,藉由僅研磨需要高精度之圓柱軸部之錐部與刃前緣部而其他部分則維持放電加工之狀態,可以最少之加工步驟及成本達成所欲之精度之刻劃輪。In the conventional side, the side surface of the shaft and the wheel body is a diamond-shaped scoring wheel. The angle of the tapered surface of the leading edge portion of the blade, the angle or interval of the tapered surface of the cylindrical shaft portion, and the angle of the leading edge portion of the blade cannot be freely set. However, in the present embodiment, these boundaries can be independently set independently. Further, by grinding only the tapered portion and the leading edge portion of the cylindrical shaft portion which require high precision, the other portions are maintained in the state of electric discharge machining, and the desired number of strokes can be achieved with a minimum of processing steps and costs.

(第2實施形態)(Second embodiment)

其次使用圖7針對本發明之第2實施形態說明。第2實施形態之刻劃輪1B除輪本體部2B及刃前緣部3B以外與第1實施形態相同。在此刻劃輪1B中,係使輪本體部2B為如圖7(a)所示成為2段錐面者。關於其他構造與第1實施形態相同。此外,左右之錐部6、錐部7之研磨與第1實施形態相同。輪本體部2B之研磨只要為靠近刃前緣部3B之傾斜部分之左右之斜面之研磨加工即足夠。在此場合可僅以刃前緣部3B適當選擇研磨加工之角度。之後,藉由在錐部6之前端切斷使刻劃輪1B完成。Next, a second embodiment of the present invention will be described with reference to Fig. 7 . The scribing wheel 1B of the second embodiment is the same as the first embodiment except for the wheel main body portion 2B and the blade leading edge portion 3B. At this time, the wheel body 1B is such that the wheel body portion 2B is a two-stage tapered surface as shown in Fig. 7(a). The other structure is the same as that of the first embodiment. Further, the polishing of the right and left tapered portions 6 and the tapered portions 7 is the same as that of the first embodiment. It is sufficient that the polishing of the wheel main body portion 2B is performed by grinding the left and right inclined surfaces of the inclined portion of the blade leading edge portion 3B. In this case, the angle of the polishing process can be appropriately selected only by the blade leading edge portion 3B. Thereafter, the scribing wheel 1B is completed by cutting at the front end of the tapered portion 6.

此實施形態中係假設輪本體部2B之厚度為w2a,刃前緣部3B之厚度為w2b。在此場合刃前緣部3B之厚度w2b亦係例如0.4mm以下,較理想為0.3mm未滿,更理想為0.2mm以下。在此場合由於輪本體部2B之厚度與刃前緣部3B之厚度獨立,故刃前緣部3B之厚度可由成為刻劃對象之基板之厚度或零件之實裝密度決定。為了擴大刻劃輪1B之適用範圍,使厚度w2b更薄較理想,例如可為0.05mm以下。此外,刃前緣部3B之厚度w2b之下限係由所需之強度決定,例如為0.03mm以上較理想。在於例如0.7mm以下之厚度之由玻璃板、半導體基板等脆性材料構成之薄基板上以高密度實裝有微細之零件之場合,使用如上述具有薄刃前緣部之刻劃輪刻劃甚為有效。In this embodiment, it is assumed that the thickness of the wheel main body portion 2B is w2a, and the thickness of the blade leading edge portion 3B is w2b. In this case, the thickness w2b of the blade leading edge portion 3B is also, for example, 0.4 mm or less, more preferably 0.3 mm or less, more preferably 0.2 mm or less. In this case, since the thickness of the wheel main body portion 2B is independent of the thickness of the blade leading edge portion 3B, the thickness of the blade leading edge portion 3B can be determined by the thickness of the substrate to be scribed or the mounting density of the component. In order to enlarge the application range of the scribing wheel 1B, it is preferable to make the thickness w2b thinner, for example, 0.05 mm or less. Further, the lower limit of the thickness w2b of the blade leading edge portion 3B is determined by the required strength, and is preferably 0.03 mm or more. In the case where a thin member made of a brittle material such as a glass plate or a semiconductor substrate having a thickness of 0.7 mm or less is used to mount a fine member at a high density, the scribing wheel having the thin edge leading edge portion described above is used. effective.

(第3實施形態)(Third embodiment)

其次使用圖8針對本發明之第3實施形態說明。第3實施形態之刻劃輪1C亦除輪本體部2C及刃前緣部3C以外與第1實施形態相同。此刻劃輪1C係使輪本體部2C為由傾斜部41、42成為2段之錐面者。關於其他構造與第1實施形態相同。輪本體部2C之研磨只要為靠近刃前緣部3C之傾斜部分之左右之斜面之研磨加工即足夠。在此場合亦可僅以刃前緣部3C適當選擇研磨加工之角度。之後,藉由在錐部6之前端切斷使刻劃輪1C完成。Next, a third embodiment of the present invention will be described with reference to Fig. 8 . The scribe wheel 1C of the third embodiment is the same as the first embodiment except for the wheel main body portion 2C and the blade leading edge portion 3C. At this time, the wheel 1C is such that the wheel main body portion 2C is a tapered surface having two inclined portions 41 and 42. The other structure is the same as that of the first embodiment. It is sufficient that the polishing of the wheel main body portion 2C is a grinding process of the left and right inclined surfaces of the inclined portion near the blade leading edge portion 3C. In this case, the angle of the polishing process can be appropriately selected only by the blade leading edge portion 3C. Thereafter, the scribing wheel 1C is completed by cutting at the front end of the tapered portion 6.

此實施形態中係假設輪本體部2C之厚度為w3a,刃前緣部3C之厚度為w3b。在此場合刃前緣部3C之厚度w3b亦係例如0.4mm以下,較理想為0.3mm未滿,更理想為0.2mm以下。在此場合由於輪本體部2C之厚度與刃前緣部3C之厚度獨立,故刃前緣部3C之厚度可由成為刻劃對象之基板之厚度或零件之實裝密度決定。為了擴大刻劃輪1C之適用範圍,使厚度w3b更薄較理想,例如可為0.05mm以下。此外,刃前緣部3C之厚度w3b之下限係由所需之強度決定,例如為0.03mm以上較理想。在於例如0.7mm以下之厚度之由玻璃板、半導體基板等脆性材料構成之薄基板上以高密度實裝有微細之零件之場合,使用如上述具有薄刃前緣部之刻劃輪刻劃甚為有效。In this embodiment, it is assumed that the thickness of the wheel main body portion 2C is w3a, and the thickness of the blade leading edge portion 3C is w3b. In this case, the thickness w3b of the blade leading edge portion 3C is also, for example, 0.4 mm or less, more preferably 0.3 mm or less, more preferably 0.2 mm or less. In this case, since the thickness of the wheel main body portion 2C is independent of the thickness of the blade leading edge portion 3C, the thickness of the blade leading edge portion 3C can be determined by the thickness of the substrate to be scribed or the mounting density of the component. In order to increase the range of application of the scoring wheel 1C, it is preferable to make the thickness w3b thinner, for example, 0.05 mm or less. Further, the lower limit of the thickness w3b of the blade leading edge portion 3C is determined by the required strength, and is preferably 0.03 mm or more. In the case where a thin member made of a brittle material such as a glass plate or a semiconductor substrate having a thickness of 0.7 mm or less is used to mount a fine member at a high density, the scribing wheel having the thin edge leading edge portion described above is used. effective.

(第4實施形態)(Fourth embodiment)

其次使用圖9針對本發明之第4實施形態說明。第4實施形態之刻劃輪1D亦除輪本體部2D及刃前緣部3D以外與第1實施形態相同。此刻劃輪1D係使輪本體部2D為3段之錐面者。亦即,使用3段之傾斜部43、44取代傾斜部41、42,於中央係形成刃前緣部3D。關於其他構造與第1實施形態相同。此外,左右之錐部6、錐部7之研磨與第1實施形態相同。輪本體部2D之研磨只要為靠近刃前緣部3D之傾斜部分之左右之斜面之研磨加工即足夠。在此場合亦可僅以刃前緣部3D適當選擇研磨加工之角度。之後,藉由在錐部6之前端切斷使刻劃輪1C完成。另外,傾斜部43、44可係與圓柱軸部4、圓柱軸部5之間及傾斜部43、44之中央部分形成使彎曲為緩斜連續之所謂R面,在此場合線切割放電加工較容易。Next, a fourth embodiment of the present invention will be described with reference to Fig. 9 . The scribe wheel 1D of the fourth embodiment is the same as the first embodiment except for the wheel main body portion 2D and the blade leading edge portion 3D. At this moment, the rowing wheel 1D is such that the wheel body portion 2D is a three-stage tapered surface. In other words, the inclined portions 41 and 42 are replaced by the inclined portions 43 and 44 of the three stages, and the blade leading edge portion 3D is formed in the center. The other structure is the same as that of the first embodiment. Further, the polishing of the right and left tapered portions 6 and the tapered portions 7 is the same as that of the first embodiment. It is sufficient that the polishing of the wheel main body portion 2D is a grinding process of the left and right inclined surfaces of the inclined portion near the blade leading edge portion 3D. In this case, the angle of the polishing process can be appropriately selected only by the blade leading edge portion 3D. Thereafter, the scribing wheel 1C is completed by cutting at the front end of the tapered portion 6. In addition, the inclined portions 43, 44 may be formed between the cylindrical shaft portion 4, the cylindrical shaft portion 5, and the central portion of the inclined portions 43, 44 to form a so-called R-face that is curved to be continuously inclined. In this case, the wire-cut electrical discharge machining is performed. easily.

此實施形態中係假設輪本體部2D之厚度為w4a,刃前緣部3D之厚度為w4b。在此場合刃前緣部3D之厚度w4b亦係例如0.4mm以下,較理想為0.3mm未滿,更理想為0.2mm以下。在此場合由於輪本體部2D之厚度與刃前緣部3D之厚度獨立,故刃前緣部3D之厚度可由成為刻劃對象之基板之厚度或零件之實裝密度決定。為了擴大刻劃輪1D之適用範圍,使厚度w4b更薄較理想,例如可為0.05mm以下。此外,刃前緣部3D之厚度w4b之下限係由所需之強度決定,例如為0.03mm以上較理想。在於例如0.7mm以下之厚度之由玻璃板、半導體基板等脆性材料構成之薄基板上以高密度實裝有微細之零件之場合,使用如上述具有薄刃前緣部之刻劃輪刻劃甚為有效。In this embodiment, it is assumed that the thickness of the wheel main body portion 2D is w4a, and the thickness of the blade leading edge portion 3D is w4b. In this case, the thickness w4b of the blade leading edge portion 3D is also, for example, 0.4 mm or less, more preferably 0.3 mm or less, more preferably 0.2 mm or less. In this case, since the thickness of the wheel main body portion 2D is independent of the thickness of the blade leading edge portion 3D, the thickness of the blade leading edge portion 3D can be determined by the thickness of the substrate to be scribed or the mounting density of the component. In order to increase the range of application of the scoring wheel 1D, it is preferable to make the thickness w4b thinner, for example, 0.05 mm or less. Further, the lower limit of the thickness w4b of the blade leading edge portion 3D is determined by the required strength, and is preferably 0.03 mm or more. In the case where a thin member made of a brittle material such as a glass plate or a semiconductor substrate having a thickness of 0.7 mm or less is used to mount a fine member at a high density, the scribing wheel having the thin edge leading edge portion described above is used. effective.

(第5實施形態)(Fifth Embodiment)

其次使用圖10針對本發明之第5實施形態說明。第5實施形態之刻劃輪1E亦僅輪本體部2E及刃前緣部3E不同,其他部分與第1實施形態相同。在第5實施形態之刻劃輪1E係如圖10及圖11之局部放大圖所示,刃前緣部3E具有設於輪本體部2E之中央之圓板部40,將其稜線構成為錐面狀之刃前緣者。圓板部40之厚度係刃前緣部3E之厚度,令為w5b。於圓板部40之兩側係設錐面狀之傾斜部46、47及48、49。如此即使減少圓板部40之厚度w5b亦由於傾斜部46~49而強度被維持。此外,左右之錐部6、錐部7之研磨與第1實施形態相同。輪本體部2E之研磨只要為靠近刃前緣部3E之傾斜部分之左右之斜面之研磨加工即足夠。在此場合亦可僅以刃前緣部3E適當選擇研磨加工之角度。之後,藉由在錐部6之前端切斷使刻劃輪1E完成。另外,傾斜部46~49可係與圓柱軸部4、圓柱軸部5之間及傾斜部46與47、48與49之間形成使彎曲為緩斜連續之所謂R面,在此場合線切割放電加工較容易。Next, a fifth embodiment of the present invention will be described with reference to Fig. 10 . The scribe wheel 1E of the fifth embodiment differs only in the wheel main body portion 2E and the blade leading edge portion 3E, and the other portions are the same as those in the first embodiment. In the engraved wheel 1E of the fifth embodiment, as shown in a partially enlarged view of Figs. 10 and 11, the blade leading edge portion 3E has a circular plate portion 40 provided at the center of the wheel main body portion 2E, and the ridge line is formed as a cone. The front edge of the face blade. The thickness of the disc portion 40 is the thickness of the blade leading edge portion 3E, so that it is w5b. Conical inclined portions 46, 47, 48, and 49 are formed on both sides of the disc portion 40. Thus, even if the thickness w5b of the disc portion 40 is reduced, the strength is maintained by the inclined portions 46 to 49. Further, the polishing of the right and left tapered portions 6 and the tapered portions 7 is the same as that of the first embodiment. It is sufficient that the polishing of the wheel main body portion 2E is a grinding process of the left and right inclined surfaces of the inclined portion of the blade leading edge portion 3E. In this case, the angle of the polishing process can be appropriately selected only by the blade leading edge portion 3E. Thereafter, the scribing wheel 1E is completed by cutting at the front end of the tapered portion 6. In addition, the inclined portions 46 to 49 may be formed between the cylindrical shaft portion 4 and the cylindrical shaft portion 5 and between the inclined portions 46 and 47, 48 and 49 so as to form a so-called R-face which is curved to be continuous in a gentle oblique direction. EDM is easier to process.

此實施形態中係假設輪本體部2E之厚度為w5a,刃前緣部3E之厚度為w5b。在此場合刃前緣部3E之厚度w5b亦係例如0.4mm以下,較理想為0.3mm未滿,更理想為0.2mm以下。在此場合由於輪本體部2E之厚度與刃前緣部3E之厚度獨立,故刃前緣部3E之厚度可由成為刻劃對象之基板之厚度或零件之實裝密度決定。為了擴大刻劃輪1E之適用範圍,使厚度w5b更薄較理想,例如可為0.05mm以下。此外,刃前緣部3E之厚度w5b之下限係由所需之強度決定,例如為0.03mm以上較理想。在於例如0.7mm以下之厚度之由玻璃板、半導體基板等脆性材料構成之薄基板上以高密度實裝有微細之零件之場合,使用如上述具有薄刃前緣部之刻劃輪刻劃甚為有效。In this embodiment, it is assumed that the thickness of the wheel main body portion 2E is w5a, and the thickness of the blade leading edge portion 3E is w5b. In this case, the thickness w5b of the blade leading edge portion 3E is also, for example, 0.4 mm or less, preferably 0.3 mm or less, more preferably 0.2 mm or less. In this case, since the thickness of the wheel main body portion 2E is independent of the thickness of the blade leading edge portion 3E, the thickness of the blade leading edge portion 3E can be determined by the thickness of the substrate to be scribed or the mounting density of the component. In order to increase the range of application of the scoring wheel 1E, it is preferable to make the thickness w5b thinner, for example, 0.05 mm or less. Further, the lower limit of the thickness w5b of the blade leading edge portion 3E is determined by the required strength, and is preferably 0.03 mm or more. In the case where a thin member made of a brittle material such as a glass plate or a semiconductor substrate having a thickness of 0.7 mm or less is used to mount a fine member at a high density, the scribing wheel having the thin edge leading edge portion described above is used. effective.

在此實施形態由於設有厚度為一定之圓板部40,故僅於圖11顯示之距離d隨刃前緣部3E之研磨之程度變化,刃前緣部3E之厚度w5b不會變化。In this embodiment, since the disk portion 40 having a constant thickness is provided, only the distance d shown in Fig. 11 varies depending on the degree of polishing of the blade leading edge portion 3E, and the thickness w5b of the blade leading edge portion 3E does not change.

此外,前述之各實施形態中,如日本專利3074143號或WO2007/004700所示於刃前緣之稜線部分形成既定形狀之槽亦可。在此槽之既定形狀可例如圖12(a)~(d)所示為U字狀、V字狀、鋸齒波狀或矩形狀之槽。此種槽可藉由以研削加工或微細放電、雷射等熱加工形成而於刻劃輪之外周部形成既定間隔之突起。在此槽之節距係對應於外徑而為例如20μm以上,槽之深度係對應於外形而為例如2~20μm。藉由預先形成此種槽,在於玻璃基板等脆性材料基板形成刻劃線時不會滑動,且可使垂直裂痕深入伸展,故刻劃後之分斷較容易。適當選擇此節距、槽之深度可取得對玻璃等基板表面之開始性能、使垂直裂痕深入伸展之性能之平衡。Further, in each of the above-described embodiments, as shown in Japanese Patent No. 3074143 or WO2007/004700, a groove having a predetermined shape may be formed at a ridgeline portion of the leading edge of the blade. The predetermined shape of the groove can be, for example, a U-shaped, V-shaped, sawtooth wave or rectangular groove as shown in Figs. 12(a) to 12(d). Such a groove can be formed by forming a predetermined interval on the outer peripheral portion of the scoring wheel by hot working such as grinding, fine discharge, or laser. The pitch of the groove is, for example, 20 μm or more corresponding to the outer diameter, and the depth of the groove is, for example, 2 to 20 μm in accordance with the outer shape. By forming such a groove in advance, the brittle material substrate such as a glass substrate does not slide when the scribe line is formed, and the vertical crack can be deeply extended, so that the division after scribe is easy. Appropriate selection of the pitch and the depth of the groove can achieve a balance between the initial performance of the surface of the substrate such as glass and the ability to extend the vertical crack.

[產業上之可利用性][Industrial availability]

本發明可於刻劃脆性材料基板後分斷之刻劃裝置有用地使用。The present invention can be used usefully in the scoring apparatus after the scribing of the brittle material substrate.

1A、1B、1C、1D、1E...刻劃輪1201A, 1B, 1C, 1D, 1E. . . Scoring wheel 120

2A、2B、2C、2D、2E...輪本體部2A, 2B, 2C, 2D, 2E. . . Wheel body

3A、3B、3C、3D、3E...刃前緣部3A, 3B, 3C, 3D, 3E. . . Front edge

4、5...圓柱軸部4, 5. . . Cylindrical shaft

6、7...錐部6, 7. . . Cone

10...素材塊10. . . Material block

11、21...超硬合金11, 21. . . Superhard alloy

12、22...燒結鑽石層12, 22. . . Sintered diamond layer

20...加工素材20. . . Processing material

30~39...加工線30~39. . . Processing line

40...圓板部40. . . Round plate

41~49...傾斜部41~49. . . Inclined portion

圖1係顯示以往之刻劃輪之例之圖。Fig. 1 is a view showing an example of a conventional marking wheel.

圖2係顯示使用以往之刻劃輪之基板之刻劃狀態之圖。Fig. 2 is a view showing a state of scribing of a substrate using a conventional scribing wheel.

圖3係本發明之第1實施形態之刻劃輪之前視圖及右側視圖。Fig. 3 is a front view and a right side view of the engraving wheel according to the first embodiment of the present invention.

圖4係顯示使用本實施形態之刻劃輪之基板之刻劃狀態之圖。Fig. 4 is a view showing a state of scribing of a substrate using the scribing wheel of the embodiment.

圖5A係顯示於本實施形態之刻劃輪之製造使用之素材塊10之立體圖。Fig. 5A is a perspective view showing the material block 10 used for the manufacture of the marking wheel of the embodiment.

圖5B係顯示從素材塊10被切取之加工素材20之立體圖。FIG. 5B is a perspective view showing the processed material 20 cut from the material block 10.

圖5C係顯示加工素材20之放電加工之加工線(加工部位)之圖。Fig. 5C is a view showing a processing line (processed portion) of the electric discharge machining of the processed material 20.

圖5D係顯示放電加工後之燒結鑽石層之放大圖。Fig. 5D is an enlarged view showing the sintered diamond layer after the electric discharge machining.

圖6係顯示第1實施形態之變形例之圖。Fig. 6 is a view showing a modification of the first embodiment.

圖7係本發明之第2實施形態之刻劃輪之前視圖及右側視圖。Fig. 7 is a front view and a right side view of the engraving wheel according to the second embodiment of the present invention.

圖8係本發明之第3實施形態之刻劃輪之前視圖及右側視圖。Fig. 8 is a front view and a right side view of the scribe wheel of the third embodiment of the present invention.

圖9係本發明之第4實施形態之刻劃輪之前視圖及右側視圖。Fig. 9 is a front view and a right side view of the scribe wheel of the fourth embodiment of the present invention.

圖10係本發明之第5實施形態之刻劃輪之前視圖及右側視圖。Fig. 10 is a front view and a right side view of the scribe wheel of the fifth embodiment of the present invention.

圖11係本發明之第5實施形態之刻劃輪之刃前緣之局部放大圖。Fig. 11 is a partially enlarged plan view showing the leading edge of the scribing wheel of the fifth embodiment of the present invention.

圖12係顯示本發明之各實施形態之刻劃輪之刃前緣之槽之一例之局部放大圖。Fig. 12 is a partially enlarged view showing an example of a groove of a leading edge of a scribe wheel of each embodiment of the present invention.

1A...刻劃輪1201A. . . Scoring wheel 120

2A...輪本體部2A. . . Wheel body

3A...刃前緣部3A. . . Front edge

4、5...圓柱軸部4, 5. . . Cylindrical shaft

6、7...錐部6, 7. . . Cone

C...圓柱軸部之長度C. . . Length of cylindrical shaft

D...輪本體部之外徑D. . . Outer diameter of the wheel body

w1...刃前緣部與輪本體部之厚度W1. . . Thickness of the leading edge of the blade and the body of the wheel

α...刃前緣部之角度α. . . Angle of the leading edge of the blade

β...錐部之角度β. . . Angle of the cone

Claims (17)

一種刻劃輪,具備:以中心具有一平面內之圓形之稜線之燒結鑽石形成之圓板狀輪本體部;於前述輪本體部左右以燒結鑽石層同軸形成之圓柱軸部;其特徵在於,具備:於前述圓柱軸部之各自之外側端部同軸形成為既定角度之錐部;以及以前述輪本體部之稜線部頂角為既定角度之方式形成之刃前緣部;前述輪本體部,具有與前述圓柱軸部連續的錐狀的傾斜部,且將前述傾斜部的形成角設定成較前述稜線部的頂角為小。 A scribing wheel comprising: a disc-shaped wheel body portion formed by a sintered diamond having a circular ridge line in a plane; a cylindrical shaft portion coaxially formed by a sintered diamond layer on the left and right sides of the wheel body portion; a tapered portion formed coaxially at an outer end portion of each of the cylindrical shaft portions at a predetermined angle, and a blade leading edge portion formed at a predetermined angle of a ridgeline portion of the wheel body portion; the wheel body portion And having a tapered inclined portion continuous with the cylindrical shaft portion, and setting the formation angle of the inclined portion to be smaller than a vertex angle of the ridge portion. 如申請專利範圍第1項之刻劃輪,其中,前述輪本體部具有至少2段之錐面,係僅研磨形成前述刃前緣部之稜線之錐面而形成。 The scriber wheel of claim 1, wherein the wheel body portion has at least two tapered surfaces formed by polishing only a tapered surface forming a ridge line of the blade leading edge portion. 如申請專利範圍第1項之刻劃輪,其中,前述刃前緣部於稜線形成有既定形狀之槽。 The scriber wheel of claim 1, wherein the blade leading edge portion is formed with a groove having a predetermined shape in a ridge line. 如申請專利範圍第1項之刻劃輪,其中,前述刃前緣部之厚度係設為0.4mm以下。 The scriber wheel of claim 1, wherein the thickness of the front edge portion of the blade is set to 0.4 mm or less. 如申請專利範圍第1項之刻劃輪,其中,僅設前述輪本體部中由構成稜線之一對錐狀面構成之部分為刃前緣部,前述刃前緣部之厚度設為0.03mm以上。 The scriber wheel of claim 1, wherein only the portion of the wheel body portion formed by one of the ridge lines is a blade leading edge portion, and the thickness of the blade leading edge portion is set to 0.03 mm. the above. 如申請專利範圍第1項之刻劃輪,其中,前述刃前 緣部具有設於輪本體部中央之圓板部、前述圓板部前端之構成前述稜線部的錐面狀部分;前述傾斜部設於前述圓板部的兩側。 For example, the marking wheel of claim 1 of the patent scope, wherein the aforementioned blade The edge portion has a circular plate portion provided at the center of the wheel main body portion, and a tapered surface portion constituting the ridge portion at the tip end of the circular plate portion. The inclined portion is provided on both sides of the disc portion. 如申請專利範圍第6項之刻劃輪,其中,前述圓板部之厚度設在0.4~0.03mm之範圍。 For example, in the marking wheel of claim 6, wherein the thickness of the disc portion is set in the range of 0.4 to 0.03 mm. 如申請專利範圍第1項之刻劃輪,其中,係使前述輪本體部之傾斜部彎曲成與前述圓柱軸部之間連續。 The scriber wheel of claim 1, wherein the inclined portion of the wheel body portion is curved to be continuous with the cylindrical shaft portion. 如申請專利範圍第1項之刻劃輪,其中,前述刃前緣部之稜線部頂角α與前述錐部之角度β滿足下式185°≦α+β≦290°;稜線部之頂角α為90°≦α≦170°;前述錐部之角度β滿足75°≦β≦120°。 The scriber wheel of claim 1, wherein the apex angle apex of the ridge portion of the blade edge portion and the angle β of the tapered portion satisfy the following formula: 185° ≦α+β≦290°; the apex angle of the ridge line portion α is 90° ≦ α ≦ 170°; the angle β of the aforementioned taper portion satisfies 75° ≦ β ≦ 120°. 如申請專利範圍第9項之刻劃輪,其中,前述錐部之角度β滿足下式90°≦α≦120°。 The scriber wheel of claim 9, wherein the angle β of the tapered portion satisfies the following formula: 90° ≦ α ≦ 120°. 如申請專利範圍第9或10項之刻劃輪,其中,前述輪本體部之外徑D滿足下式1mm≦D≦6mm。 The marking wheel of claim 9 or 10, wherein the outer diameter D of the wheel body portion satisfies the following formula 1 mm ≦ D ≦ 6 mm. 如申請專利範圍第9或10項之刻劃輪,其中,前述輪本體部之外徑D滿足下式1mm≦D≦2.5mm。 The marking wheel of claim 9 or 10, wherein the outer diameter D of the wheel body portion satisfies the following formula 1 mm ≦ D ≦ 2.5 mm. 如申請專利範圍第9或10項之刻劃輪,其中,前 述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D。 Such as the marking of the 9th or 10th patent range, where the former The outer diameter D of the wheel body portion and the length C of the cylindrical shaft portion satisfy the following formula C<D. 如申請專利範圍第11項之刻劃輪,其中,前述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D。 The scriber wheel of claim 11, wherein the outer diameter D of the wheel body portion and the length C of the cylindrical shaft portion satisfy the following formula C<D. 如申請專利範圍第12項之刻劃輪,其中,前述輪本體部之外徑D與前述圓柱軸部之長度C滿足下式C<D。 The scriber wheel of claim 12, wherein the outer diameter D of the wheel body portion and the length C of the cylindrical shaft portion satisfy the following formula C<D. 一種刻劃輪之製造方法,其係:使用在以超硬合金形成之圓柱狀構件之一端同軸形成有燒結鑽石層之圓柱部之圓柱狀加工素材;保持前述超硬合金之圓柱部分同時使旋轉,以線切割放電加工於燒結鑽石層部分形成一對同軸之圓柱軸部與夾於該圓柱軸部之輪本體部;保持前述超硬合金之圓柱部分同時使旋轉,將前述圓柱軸部之各自之外側端部藉由研磨加工而形成為錐狀;保持前述超硬合金之圓柱部分同時使旋轉,將前述輪本體部之稜線部研磨成既定角度以形成刃前緣部;於前述輪本體部,形成與前述圓柱軸部連續的錐狀的傾斜部,且將前述傾斜部的形成角設定成較前述稜線部的頂角為小;藉由切斷前述燒結鑽石層與前述超硬合金而製造。 A method for manufacturing a scoring wheel, which is a cylindrical processing material in which a cylindrical portion of a sintered diamond layer is coaxially formed at one end of a cylindrical member formed of a super-hard alloy; and the cylindrical portion of the superhard alloy is maintained while rotating Forming a pair of coaxial cylindrical shaft portions and a wheel body portion sandwiched between the cylindrical shaft portions by wire-cut electrical discharge machining; maintaining the cylindrical portion of the super-hard alloy while rotating, respectively, the respective cylindrical shaft portions The outer end portion is formed into a tapered shape by grinding; while maintaining the cylindrical portion of the super-hard alloy while rotating, the ridge line portion of the wheel body portion is ground to a predetermined angle to form a blade leading edge portion; Forming a tapered inclined portion continuous with the cylindrical shaft portion, and setting an angle of formation of the inclined portion to be smaller than a vertex angle of the ridge portion; and manufacturing by cutting the sintered diamond layer and the superhard alloy . 如申請專利範圍第16項之刻劃輪之製造方法,其中,於使用前述線切割放電加工之圓柱軸部與輪本體部之 形成時,於前述圓柱軸部之外側同時形成錐部;於前述圓柱軸部之錐部之研磨時,將因線切割放電加工而產生之表面變質層除去。 The manufacturing method of the marking wheel of claim 16, wherein the cylindrical shaft portion and the wheel body portion of the wire cutting electric discharge machining are used At the time of formation, the tapered portion is simultaneously formed on the outer side of the cylindrical shaft portion, and the surface-degraded layer generated by the wire-cut electrical discharge machining is removed during the polishing of the tapered portion of the cylindrical shaft portion.
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