TW201636176A - Multi-point diamond tool - Google Patents

Abstract

The multi-point diamond tool of the present invention can still decrease the replacement times of the tool even due to the tip point wear because of proceeding drawing. The solution means is the forming tilt surfaces to the corners of the base seat 11 of the diamond tool 10 from two sides of the base seat, and two sides of the ridge are employed to be the tip points P1-P16. The diamond tool 10 is tilted to make one tip point contact with the substrate for proceeding drawing without rolling. When the tip point is wore because of proceeding drawing, other tip points can be made to contact the substrate for proceeding drawing by rotating the diamond tool 10. Thereby, the multi-tip points can be used in one diamond tool to reduce the tool replacement frequency.

Description

Multi-point diamond cutter

The present invention relates to a multi-point diamond tool for scribing a substrate of a brittle material such as a glass substrate or a tantalum wafer by a diamond tip.

In order to scribe a glass substrate or a tantalum wafer, a tool using a diamond cusp having a scoring wheel or a single crystal diamond has been used. For the glass substrate, the scriber wheel is mainly used for rolling with respect to the substrate, but from the viewpoint of improving the strength of the substrate after the scribe, the diamond cusp using the fixed edge is also discussed. Patent Documents 1 and 2 propose a sharp-point cutter for marking a substrate having a high hardness such as a sapphire wafer or an alumina wafer. In these patent documents, a tool having a tangent point on a ridgeline of a pyramid or a tool for forming a cone at the front end is used. Further, in Patent Document 3, a scribing device using a glass scriber having a conical tip is proposed in order to scribe a glass plate.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-183040

Patent Document 2: Japanese Laid-Open Patent Publication No. 2005-079529

Patent Document 3: Japanese Laid-Open Patent Publication No. 2013-043787

When scribing with a conventional fixed-blade tool, it is necessary to change the sharp point due to sharp point wear. In a pyramid or conical tool, the apex of the sharp point that can be used is 2 Or up to 4 places. Therefore, when the cusp of 2 or 4 points is changed, the tool must be replaced, and there is a problem that the frequency of replacement is high. In addition, in the scribing by the tool, the cusp must be brought into contact with the substrate at an appropriate angle. However, conventional tools must rotate the tool in the axial direction when changing the cusp, and it is not easy to set the contact angle with good precision.

The present invention has been made in view of such conventional problems, and an object thereof is to provide a diamond cutter capable of easily changing a sharp point position and reducing a frequency of replacement even if it is used for scratching at a sharp point of scribing.

In order to solve the problem, the multi-point diamond cutter of the present invention has a pedestal having a columnar shape having a predetermined thickness and having two bottom faces and a plurality of outer peripheral faces; a ridge line which is an intersection of the outer peripheral faces; and an inclined face At least one of the bottom surfaces is ground toward the ridgeline; at least the outer peripheral surface of the pedestal is formed of diamond (diamond), and the intersection of the inclined surface and the ridge line is used as a sharp point.

Here, the inclined surface may have a first inclined surface formed from a bottom surface of one of the bases and a second inclined surface formed from the other bottom surface of the base.

Here, the second ridge line having two polishing surfaces formed by polishing the adjacent two outer circumferential surfaces of the susceptor toward the end portion of the ridge line and the intersection of the two polishing surfaces may be used. The intersection of the two polished surfaces and the second ridge line serves as a sharp point.

Here, the inclined surfaces may be formed by laser processing.

Here, the two polishing surfaces may be formed by machining.

According to the invention having the above features, a plurality of sharp points can be provided around the diamond cutter. Therefore, the following effects can be obtained: even if a sharp point is worn, it is possible to change the drill The use of new cusps at fixed angles of stone tools can reduce the frequency of diamond tool replacement. Further, since the sharp point can be changed while the mounting angle of the tool with respect to the substrate is maintained constant, the contact angle of the sharp point can be easily set.

10, 30‧‧‧Multi-point diamond cutter

11, 31‧‧‧ Pedestal

12, 32‧‧‧through holes

13a~13h, 33a~33h‧‧‧ ridgeline

14a~14h, 34a~34h‧‧‧1st inclined surface

15a~15h, 35a~35h‧‧‧2nd inclined surface

21a, 51c‧‧‧3rd inclined surface

36a, 36b~43a, 43b‧‧‧ground

P1~P16‧‧‧ cusp

Fig. 1 is a front view and a side view of a multi-point diamond cutter according to a first embodiment of the present invention.

Fig. 2 is a side view showing the scribing using the multi-point diamond cutter of the first embodiment.

Fig. 3 is an enlarged view showing a main part of a multi-point diamond cutter according to a modification of the first embodiment of the present invention.

Fig. 4 is a front view and a side view of a diamond cutter according to a second embodiment of the present invention.

Fig. 5 is a bottom plan view showing an enlarged main portion of a diamond cutter according to a second embodiment of the present invention.

Fig. 6 is a side elevational view and a bottom view of a main part of a diamond cutter according to a second embodiment of the present invention.

Fig. 7 is an enlarged view showing a main part of a multi-point diamond cutter according to a modification of the second embodiment of the present invention.

Next, a first embodiment of the present invention will be described. Fig. 1 is a front view and a side view showing an example of a multi-point diamond cutter (hereinafter, simply referred to as a diamond cutter) 10 of the present embodiment. The diamond cutter 10 is a pedestal having a polygonal column having a certain thickness and formed by an arbitrary number of sides of rotational symmetry. In the present embodiment, the susceptor 11 having a regular octagonal column having a constant thickness is formed of a single crystal diamond, and has a through hole 12 at the center thereof. In this case, ridge lines 13a to 13h are equally formed on the octagonal outer peripheral surface of the susceptor 11, and the ridge lines 13a to 13h are parallel to the polygonal column The thickness direction is parallel to the axis of the through hole 12 (the axis perpendicular to the paper surface in Fig. 1(a)).

Further, in the present embodiment, as shown in FIG. 1, the susceptor 11 is polished so as to be chamfered from the ridge lines intersecting the outer peripheral surfaces from the bottom surfaces of the polygonal columns of the corner portions. That is, the first inclined faces 14a to 14h are formed by polishing from the eight corners of one of the faces of the susceptor 11 toward the ridge line of the susceptor 11 in a range smaller than 1/2 of the thickness of the susceptor 11. At this time, the inclined surface is polished such that the side of the bottom surface of the susceptor 11 and the inclined surface are equal to each other, and the isosceles triangle is a vertex having one end of the ridge line as a vertex. The inclined surface described above can be easily formed by laser processing or machining. In addition, mechanical grinding may be further performed after laser processing to further form a precise abrasive surface. According to this, the intersection of each of the ridge lines 13a to 13h and the first inclined surfaces 14a to 14h can be apex, and as shown in FIG. 1(b), eight cusps P1 to P8 are formed on the right side as viewed from the side of the susceptor. . At this time, the inclined faces 14a to 14h of the susceptor 11 become the top faces. Here, the term "top surface" means a surface that is in contact with two outer peripheral surfaces forming a ridge line and shares one end of the ridge line.

Next, the second inclined faces 15a to 15h are formed by polishing from the other side of the susceptor 11 in the same manner toward the outer periphery of the susceptor 11 in a range of less than 1/2 of the thickness of the susceptor. Accordingly, the intersection of the ridge lines 13a to 13h and the second inclined surfaces 15a to 15h can be made a sharp point, and as shown in FIG. 1(b), eight cusps P9 are formed on the left side as viewed from the side of the susceptor. P16. As described above, by using the both ends of the ridge lines 13a to 13h as the cusps P1 to P16, it is possible to form the octagonal diamond tool 10 at the periphery of the apex of 16 points.

Next, a case where the diamond tool 10 of the present embodiment is used for scribing will be described with reference to Fig. 2 . When the substrate 20 is scribed, as shown in FIG. 2(a), the diamond cutter 10 is inclined such that the angle formed by the ridge line and the brittle material substrate is θ, and one sharp point P1 is fixed in contact with the substrate 20. And moving the diamond cutter 10 in the direction of the arrow A of the figure to Perform a scribe. At this time, since the diamond cutter 10 is not rolled, it is possible to perform scribing at the same sharp point. When the sharp point P1 in contact with the substrate 20 is deteriorated by abrasion, as shown in FIG. 2(b), the diamond cutter 10 is rotated by 45° around the through hole 12, and the adjacent sharp point P2 is brought into contact with the substrate 20. And score in the same way. Even if the diamond cutter 10 is rotated by 45°, since the angle θ at which the ridge line of the tip end of the blade contacts the substrate does not change, it is easy to set the contact angle with respect to the substrate when the cusp is changed.

In addition, when the sharp points at the eight points of the cusps P1 to P8 are all worn, the diamond cutter 10 is reversed, and the angle formed by the ridge line and the brittle material substrate is fixed again, so that the other side is sharp. P9~P16 are sequentially contacted with the substrate for scribing. According to this, it is possible to further change the position of the cusp 8 times and perform the slashing, and it is possible to change the cusp by 16 times in total.

Next, a modification of the first embodiment will be described. In the first embodiment, the inclined surface on the outer circumference of the pedestal is used as the top surface, and the apex of the triangle of the first inclined surface is used as the cusp. Fig. 3 is a modification of the same, and as shown in an enlarged view showing a peripheral portion of one cusp P1, the portion close to the ridge line is further polished at a slight angle to form a third inclined surface 21a, so that the inclined surface 21a becomes a top surface. . The same is true for other inclined surfaces. Further, similarly to the second inclined surface, the portion of the second inclined surface that is close to the ridge line is further polished with a slight inclination to form a fourth inclined surface. According to this, the position of each sharp point can be finely adjusted, and the processing can be performed more accurately and precisely.

Next, a second embodiment of the present invention will be described with reference to Figs. 4 and 5 . Fig. 4 is a front view and a side view showing an example of a multi-point diamond cutter (hereinafter, simply referred to as a diamond cutter) 30 of the present embodiment. The diamond cutter 30 is a pedestal 31 having an octagonal bottom surface formed by a single-crystal diamond having a rotationally symmetrical polygonal corner, and has a through hole 32 at its center. At this time, ridge lines 33a to 33h are equally formed on the octagonal outer peripheral surface of the susceptor 31, and the ridge lines 33a to 33h are parallel In the thickness direction of the polygonal column and passing through the axis of the through hole 32 (the axis perpendicular to the paper surface in Fig. 4(a)) is parallel.

Further, in the present embodiment, as shown in Fig. 4, the susceptor 31 is polished to be chamfered from both sides of the corner portions. That is, the first inclined surfaces 34a to 34h are formed by polishing from the corner of one surface toward the inner side of the susceptor 31 in a range of less than 1/2 of the thickness of the susceptor. The second inclined faces 35a to 35h are formed from the other side of the base 31. At this time, polishing is performed so that the angle between the side of the bottom surface of the susceptor 31 and the inclined surface is equal.

In this embodiment, after the first inclined surfaces 34a to 34h and the second inclined surfaces 35a to 35h are formed, the two outer peripheral surfaces adjacent to each other across the ridge line are further polished at both end portions of the ridge lines 33a to 33h. The angle between the top surface and the ridge line becomes larger. Figure 5 is an enlarged view of a circle B indicated by a dotted line in the center of the right side of Figure 4(b), and Figure 6(a) is a circle C shown by a dotted line at the lower right of Figure 4(b). Enlarged view, Figure 6 (b) is a bottom view. This polishing, as shown in Fig. 5, forms a new triangular ridge line (second ridge line) at the intersection of the smaller polished surfaces 36a and 36b and the intersection of the polishing surfaces 36a and 36b at one end of the ridge line 33a. In the same manner, a new ridge line (second ridge line) is formed at one end of the ridge line 33c at the intersection of the triangular polished surfaces 38a and 38b and the polished surfaces 38a and 38b. Similarly to the other ridge lines, the second ridge line of the intersection of the polishing surfaces 36a, 36b to 43a, 43b and the polishing surfaces 36a, 36b to 43a, 43b is formed at one end of each of the ridge lines 33a to 33h. Further, one end of a new ridge line intersecting the adjacent polishing surfaces 36a and 36b, 37a and 37b, ..., that is, the intersection of the second ridge line and the top surface becomes a sharp point P1 to P8. At this time, the line where the triangular polished surfaces 36a and 36b intersect is a ridge line constituting one end of the sharp point. For the other corners, the intersection of the respective polishing surfaces 37a, 37b, 38a, 38b, ... is also a ridge line constituting one end of the sharp point.

In addition, the other end of the ridge line is also applied to the inclined surface 35a~ in the same manner. The intersection of 35h and the ridge line is ground in the same manner from the side to form a polished surface. Then, the intersection of the second ridge line and the inclined surfaces 35a to 35h, which is the intersection of the newly formed polishing surface, is used as the cusps P9 to P16. When the above-described polishing surface is formed by machining, the machining can be performed with high precision, and the position of the cusp can be processed at a desired position. Further, the angle between the top surface and the ridge line can be arbitrarily set in cooperation with the workpiece to be scribed.

When the diamond cutter 30 is used for scribing, one pointed point P1 is brought into contact with the substrate 20 for scribing. Further, when the cusp is worn, the diamond cutter 30 is rotated by 45° along a shaft (not shown) inserted through the through hole in the same manner as in the above-described embodiment, so that the adjacent cusp contacts the substrate 20 for engraving. Draw.

Further, when all the sharp points at the eight points of the sharp points P1 to P8 are worn out, the diamond cutter 30 is reversed, and the sharp points P9 to P16 on the other side are sequentially contacted with the substrate for scribing. According to this, it is possible to further change the position of the cusp 8 times and perform the slashing, and it is possible to change the cusp by 16 times in total.

Next, a modification of the second embodiment will be described. In the second embodiment, the inclined surface on the outer circumference of the pedestal is also used as the top surface, and the apex of the triangle of the first inclined surface is used as the cusp. Fig. 7 is a modification thereof. As shown in an enlarged view showing a peripheral portion of one cusp P3, a portion of the inclined surface 34c which is close to the ridge line is further polished at a slight angle to form a third inclined surface 51c. This inclined surface 51c is made into a top surface. The same is true for other inclined surfaces. Further, similarly to the second inclined surface, the portion of the second inclined surface that is close to the ridge line is further polished with a slight inclination to form a fourth inclined surface. According to this, it is possible to finely adjust the position of each sharp point and perform the processing more accurately.

In the first and second embodiments, although there are 16 pointed points around the base of the regular octagon, the present invention is not limited to the regular octagon, and the polygonal shape of any number of sides can be used as the base. E.g, It is also possible to set 24 cusps for the regular dodecagon. In this case, it is preferable to provide a plurality of sharp points in the outer peripheral portion as much as possible in the range where the adjacent sharp points do not interfere with each other as described above when the cusp is changed. In this way, the cusp can be changed by rotating the diamond tool when the cusps are worn, and the frequency of replacement of the diamond knives can be reduced.

Further, in the above embodiment, the single crystal diamond is used to form the entire circular plate. However, since the diamond layer is required to be in contact with the surface portion of the brittle material substrate, it may be used as a base of a superhard alloy or a sintered diamond. The surface of the front end portion forms a polycrystalline diamond layer and forms an inclined surface there. Further, a single crystal or a polycrystalline diamond having conductivity or the like, which is doped with boron or the like, may be used. By using a conductive diamond, it is possible to easily form a notch by electrical discharge machining.

The multi-point diamond cutter of the present invention can be used for a scribing device for scribing a substrate of a brittle material, and in particular, a scribing object having a high hardness which increases the wear of the diamond cutter can be effectively used.

10‧‧‧Multi-point diamond cutter

11‧‧‧Base

12‧‧‧through holes

13a~13h‧‧‧ ridgeline

14a, 14b, 14h‧‧‧1st inclined surface

15a~15h‧‧‧2nd inclined surface

P1, P2, P7, P8, P9, P10, P15, P16‧‧‧ sharp points

Claims (6)

A multi-point diamond cutter having a base having a columnar shape of a predetermined thickness and having two bottom faces and a plurality of outer peripheral faces; a ridge line which is an intersection of the outer peripheral faces; and an inclined face at least from a bottom surface toward a ridge line Grinding; at least the outer peripheral surface of the base is formed of diamond; the intersection of the inclined surface and the ridge line is used as a sharp point. A multi-point diamond cutter according to claim 1, wherein the inclined surface has a first inclined surface formed from a bottom surface of one of the bases and a second inclined surface formed from a bottom surface of the other base of the base surface. A multi-point diamond cutter according to claim 1 or 2, which has two polishing surfaces which are formed by polishing two adjacent outer circumferential surfaces of the pedestal toward an end portion of the ridge line, and the two polishing surfaces The second ridge line of the intersection line is defined by the intersection of the two polishing surfaces and the second ridge line. For example, the multi-point diamond cutter of claim 1 or 2, wherein the inclined surfaces are formed by laser processing. For example, the multi-point diamond cutter of claim 3, wherein the inclined surfaces are formed by laser processing. For example, the multi-point diamond cutter of claim 3, wherein the two abrasive surfaces are formed by machining.