TWI423285B - Solid electrolytic capacitor and manufacturing method thereof - Google Patents
Solid electrolytic capacitor and manufacturing method thereof Download PDFInfo
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- TWI423285B TWI423285B TW95141536A TW95141536A TWI423285B TW I423285 B TWI423285 B TW I423285B TW 95141536 A TW95141536 A TW 95141536A TW 95141536 A TW95141536 A TW 95141536A TW I423285 B TWI423285 B TW I423285B
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- Taiwan
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- solid electrolytic
- electrolytic capacitor
- silver paste
- capacitor element
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- 239000003990 capacitor Substances 0.000 title claims description 269
- 239000007787 solid Substances 0.000 title claims description 225
- 238000004519 manufacturing process Methods 0.000 title claims description 44
- 239000010410 layer Substances 0.000 claims description 588
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 357
- 229910052709 silver Inorganic materials 0.000 claims description 356
- 239000004332 silver Substances 0.000 claims description 356
- 239000000758 substrate Substances 0.000 claims description 204
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 159
- 229910052799 carbon Inorganic materials 0.000 claims description 159
- 239000011888 foil Substances 0.000 claims description 132
- 239000007788 liquid Substances 0.000 claims description 113
- 229910052751 metal Inorganic materials 0.000 claims description 98
- 239000002184 metal Substances 0.000 claims description 98
- 238000000034 method Methods 0.000 claims description 97
- 229920001940 conductive polymer Polymers 0.000 claims description 90
- 239000000203 mixture Substances 0.000 claims description 73
- 229910052782 aluminium Inorganic materials 0.000 claims description 59
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 59
- 239000011247 coating layer Substances 0.000 claims description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 29
- 239000007784 solid electrolyte Substances 0.000 claims description 19
- 238000010030 laminating Methods 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910052758 niobium Inorganic materials 0.000 claims description 12
- 239000010955 niobium Substances 0.000 claims description 12
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 12
- 229910052715 tantalum Inorganic materials 0.000 claims description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 229910052726 zirconium Inorganic materials 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 6
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- 238000000576 coating method Methods 0.000 description 45
- 239000011248 coating agent Substances 0.000 description 38
- 239000002245 particle Substances 0.000 description 33
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- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 7
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- -1 1,3-dihydrothieno[3,4-b]quinoline Porphyrin Chemical compound 0.000 description 4
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- 239000001741 Ammonium adipate Substances 0.000 description 4
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- 235000019293 ammonium adipate Nutrition 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
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- 239000011737 fluorine Substances 0.000 description 2
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- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
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- 239000000047 product Substances 0.000 description 2
- 125000000168 pyrrolyl group Chemical group 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- VSGXHZUTTFLSBC-UHFFFAOYSA-N thiophene-3-thiol Chemical compound SC=1C=CSC=1 VSGXHZUTTFLSBC-UHFFFAOYSA-N 0.000 description 2
- DVDKQVCHBMZIRJ-UHFFFAOYSA-N 1,2,3,4-tetrahydronaphtho[2,1-f][2]benzothiole Chemical class C1C=2C3=CC=4C(=CSC=4)C=C3C=CC=2CCC1 DVDKQVCHBMZIRJ-UHFFFAOYSA-N 0.000 description 1
- KVRZARWOKBNZMM-UHFFFAOYSA-N 1,3-dihydro-2-benzothiophene Chemical compound C1=CC=C2CSCC2=C1 KVRZARWOKBNZMM-UHFFFAOYSA-N 0.000 description 1
- SLXFEEBANGECTR-UHFFFAOYSA-N 1,3-dihydrobenzo[g][2]benzothiole Chemical group C1=CC2=CC=CC=C2C2=C1CSC2 SLXFEEBANGECTR-UHFFFAOYSA-N 0.000 description 1
- FPQFYFSEKLQJQB-UHFFFAOYSA-N 1,3-dihydrothieno[3,4-b]quinoline Chemical compound C1=CC=C2C=C3CSCC3=NC2=C1 FPQFYFSEKLQJQB-UHFFFAOYSA-N 0.000 description 1
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- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
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- PRXKFMMOWWDCBG-UHFFFAOYSA-N 3,4-diethylfuran Chemical compound CCC1=COC=C1CC PRXKFMMOWWDCBG-UHFFFAOYSA-N 0.000 description 1
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- OJFOWGWQOFZNNJ-UHFFFAOYSA-N 3,4-dimethyl-1h-pyrrole Chemical compound CC1=CNC=C1C OJFOWGWQOFZNNJ-UHFFFAOYSA-N 0.000 description 1
- IVHPMIPYSOTYNM-UHFFFAOYSA-N 3,4-dimethylfuran Chemical compound CC1=COC=C1C IVHPMIPYSOTYNM-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Description
本發明係關於一種低ESR(等效串聯電阻(Equivalent Series Resistance))高電容固體電解電容器。更詳而言之,係關於一種低ESR且每單位體積之電容增大的固體電解電容器及其製造方法。This invention relates to a low ESR (Equivalent Series Resistance) high capacitance solid electrolytic capacitor. More specifically, it relates to a solid electrolytic capacitor having a low ESR and an increase in capacitance per unit volume and a method of manufacturing the same.
近年來,伴隨著電子機器的數位化、個人電腦的高速化,需要一種小型且大電容的電容器、於高頻區域中為低阻抗的電容器。最近已提出一種使用具有電子傳導性之導電性聚合物作為固體電解質的固體電解電容器。In recent years, with the digitization of electronic devices and the speed of personal computers, there is a need for a capacitor having a small size and a large capacitance, and a capacitor having a low impedance in a high frequency region. Recently, a solid electrolytic capacitor using a conductive polymer having electron conductivity as a solid electrolyte has been proposed.
固體電解電容器(9)之製造方法,一般而言如第1圖所示,於由經蝕刻處理之比表面積較大的金屬箔或薄板所構成的陽極基體(1)形成介電質的氧化被膜層(2),於其外側形成固體半導體層(以下稱為固體電解質)(3)作為相對向之電極,再形成導電糊等導電體層(4),而製作固體電解電容器元件。通常係另設有遮蔽層(5),適當附加電極引線部(6、7),並整體以樹脂(8)封裝而作成電容器。In the method for producing a solid electrolytic capacitor (9), as shown in Fig. 1, a dielectric oxide film is formed on an anode substrate (1) composed of a metal foil or a thin plate having a large specific surface area. In the layer (2), a solid semiconductor layer (hereinafter referred to as a solid electrolyte) (3) is formed on the outer side thereof as a counter electrode, and a conductor layer (4) such as a conductive paste is formed to form a solid electrolytic capacitor element. Usually, a shielding layer (5) is additionally provided, and the electrode lead portions (6, 7) are appropriately added, and the resin (8) is integrally packaged to form a capacitor.
前述導電體層(4)主要係使用銀糊,但由於銀於高溫下容易引起遷移(migration),因此一般而言,於設置含有碳粒子的碳糊層(4a)之後,再形成含有銀粒子之銀糊層(4b)(參照第2圖)。該等層係藉由依序浸漬於含有各層成分之液體中即可形成,但一般而言,由於電容器元件的基體為較薄的箔片狀,因此如第2圖所示,於面部與邊(緣)部,所形成的銀糊層(4b)的厚度不同。具體而言,邊(緣)部的層厚度易變小,結果,尤其於層壓電容器元件而形成層壓電容器時之ESR(等效串聯電阻)易變大而不佳。雖然亦可藉由對整體塗佈厚層,以增加邊(緣)部的層厚度,但此種情況由於面上之層厚度亦增加,因此每一元件的高度變大,將其層壓而成之層壓電容器,每單位體積之電容會降低。因此,需要一種由充分確保邊(緣)部之層厚度,且抑制面上之層厚度的銀糊層壓而成的固體電解電容器。Although the above-mentioned conductor layer (4) mainly uses a silver paste, since silver tends to cause migration at a high temperature, generally, after the carbon paste layer (4a) containing carbon particles is provided, silver particles are formed. Silver paste layer (4b) (refer to Figure 2). These layers are formed by sequentially immersing in a liquid containing the components of each layer. However, in general, since the base of the capacitor element is in the form of a thin foil, as shown in Fig. 2, on the face and the side ( In the edge portion, the thickness of the formed silver paste layer (4b) is different. Specifically, the layer thickness of the edge (edge) portion tends to be small, and as a result, the ESR (equivalent series resistance) when the laminated capacitor is formed by laminating the capacitor element is liable to become large. Although it is also possible to apply a thick layer to the entire layer to increase the layer thickness of the side (edge) portion, in this case, since the thickness of the layer on the surface is also increased, the height of each element becomes large, and it is laminated. As a laminated capacitor, the capacitance per unit volume will decrease. Therefore, there is a need for a solid electrolytic capacitor in which a silver paste having a thickness of a layer (edge) portion is sufficiently ensured and a layer thickness on the surface is suppressed.
此外,當於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體的邊(緣)部塗佈覆蓋銀糊時,利用將依序層壓有前述各層之陽極基體浸漬於銀糊後再拉起之浸漬法塗佈銀糊時,與經塗佈之面部所形成之銀糊相較時,附著於邊(緣)部的銀糊較薄。結果,與以橫向流通於該陽極基體面內的電流相較,對由內面流向表面之電流的電阻較高。因此,與以刷毛塗佈銀糊之固體電解電容器相較,以浸漬法塗佈銀糊之固體電解電容器具有ESR較高的趨勢。Further, when the side of the anode substrate is laminated with the oxide film layer, the conductive polymer layer, and the edge portion of the anode substrate of the carbon paste layer, the silver paste is applied, and the layers are laminated in this order. When the silver paste is applied by the immersion method in which the anode substrate is immersed in the silver paste and then pulled up, the silver paste adhering to the edge portion is thinner than the silver paste formed on the coated face portion. As a result, the electric resistance to the current flowing from the inner surface to the surface is higher than the current flowing in the plane of the anode substrate in the lateral direction. Therefore, compared with a solid electrolytic capacitor in which a silver paste is applied by a bristles, a solid electrolytic capacitor coated with a silver paste by a dipping method tends to have a high ESR.
另一方面,以刷毛塗佈銀糊時,由於刷毛斑痕而使於塗佈面形成的銀糊層厚度不均。尤其於使用含有氟樹脂之銀糊時,厚度容易變得不均勻。以不產生薄部位的方式增加塗佈量時,產生高於需要厚度之銀糊層較厚部位,而可封入具一定高度之晶片中的固體電解電容器元件片數減少,使每單位體積之電容減少。On the other hand, when the silver paste is applied by the bristles, the thickness of the silver paste layer formed on the coated surface is uneven due to the bristles. In particular, when a silver paste containing a fluororesin is used, the thickness tends to become uneven. When the coating amount is increased in such a manner that no thin portion is generated, a thick portion of the silver paste layer higher than the required thickness is generated, and the number of solid electrolytic capacitor elements which can be sealed in the wafer having a certain height is reduced, so that the capacitance per unit volume is reduced. cut back.
因此,於由閥作用金屬構成之陽極基體表面依序層壓氧化被膜層、導電性高分子層、碳糊層及銀糊層而成之固體電解電容器中,需要一種於表面具有碳糊層之陽極基體上形成銀糊之層壓構造之ESR(等效串聯電阻)充分低且每單位體積之電容增大的固體電解電容器。Therefore, in the solid electrolytic capacitor in which the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste layer are sequentially laminated on the surface of the anode substrate composed of the valve action metal, it is necessary to have a carbon paste layer on the surface. A solid electrolytic capacitor in which the ESR (equivalent series resistance) of the laminated structure of the silver paste is sufficiently low and the capacitance per unit volume is increased is formed on the anode substrate.
因此,本發明之課題係提供一種於前述陽極基體上形成銀糊之層壓構造之ESR(等效串聯電阻)充分低且每單位體積之電容增大的固體電解電容器。Accordingly, an object of the present invention is to provide a solid electrolytic capacitor in which the ESR (equivalent series resistance) of the laminated structure in which the silver paste is formed on the anode substrate is sufficiently low and the capacitance per unit volume is increased.
本發明人等就上述課題精心研究之結果,發現藉由控制於表面具有碳糊層之陽極基體上形成層壓構造之銀糊的組成或層厚度,可獲得低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。於本發明中,可控制於前述陽極基體上形成層壓構造之銀糊的邊(緣)部之層厚度與面部之層厚度。發現使用對碳糊層之潤濕性不同之2種銀糊組成,若於邊(緣)部塗佈潤濕性較低之組成者,而於面部塗佈潤濕性較高之組成者,則整體可獲得所期望之層厚度。此外發現該現象亦可廣泛應用於依序形成第1被覆層與第2被覆層之層壓構造的形成。此外發現覆蓋於表面具有碳糊層之陽極基體之邊(緣)部的銀糊層係較覆蓋該陽極基體之面部的銀糊層更厚的固體電解電容器元件中,獲得低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。再者亦發現由組成銀糊之含水量為0.5質量%以下之銀糊層壓而成的固體電解電容器元件中,可獲得ESR(等效串聯電阻)更低的固體電解電容器元件。本發明係基於該等發現而完成者。As a result of intensive studies on the above-mentioned problems, the present inventors have found that a low ESR (equivalent series resistance) can be obtained by controlling the composition or layer thickness of a silver paste having a laminated structure formed on an anode substrate having a carbon paste layer on its surface. A solid electrolytic capacitor element with an increased capacitance per unit volume. In the present invention, the layer thickness of the side (edge) portion of the silver paste of the laminated structure and the layer thickness of the face portion can be controlled on the anode substrate. It has been found that when two kinds of silver paste compositions having different wettability to the carbon paste layer are used, if a component having a low wettability is applied to the edge (edge) portion, and a component having a high wettability is applied to the face, The desired layer thickness is then obtained overall. Further, it has been found that this phenomenon can be widely applied to the formation of a laminated structure of the first coating layer and the second coating layer in order. Further, it was found that a silver paste layer covering the side (edge) portion of the anode substrate having the carbon paste layer on the surface is a thicker ESR (equivalent series connection) than a solid electrolytic capacitor element having a thicker silver paste layer covering the surface of the anode substrate. A solid electrolytic capacitor element having a resistance and an increase in capacitance per unit volume. Further, it has been found that a solid electrolytic capacitor element having a lower ESR (equivalent series resistance) can be obtained from a solid electrolytic capacitor element in which a silver paste constituting a silver paste having a water content of 0.5% by mass or less is laminated. The present invention has been completed based on these findings.
以刷毛塗佈銀糊時,因刷毛不齊而於塗佈面形成之銀糊層的厚度不均勻。為了不產生較薄部位而增加塗佈量時,銀糊層會產生必要以上厚度之較厚部位,而會有於一定高度之晶片中可封入的電容器元件片數減少,且每單位體積之電容減少的問題。When the silver paste is applied by the bristles, the thickness of the silver paste layer formed on the coated surface due to uneven bristles is not uniform. In order to increase the coating amount without generating a thinner portion, the silver paste layer may have a thicker portion than necessary, and the number of capacitor elements that can be sealed in the wafer at a certain height is reduced, and the capacitance per unit volume is reduced. Reduced problems.
另一方面,以浸漬法塗佈銀糊時,與於塗佈面所形成之銀糊相較時,附著於邊(緣)之銀糊較薄。結果與以橫向流動於該陽極基體面內的電相較時,對由內面流向表面之電流的電阻較高。因此,與以刷毛塗佈銀糊的電容器相較時,以浸漬法塗佈的電容器有ESR較高的問題。尤其當使用含氟樹脂之膠糊(paste)時,厚度容易不均勻。On the other hand, when the silver paste is applied by the dipping method, the silver paste adhering to the side (edge) is thinner than the silver paste formed on the coated surface. As a result, the electrical resistance to the current flowing from the inner surface to the surface is higher as compared with the electrical phase flowing laterally in the plane of the anode substrate. Therefore, the capacitor coated by the dipping method has a problem that the ESR is high as compared with the capacitor in which the silver paste is applied by the bristles. Especially when a paste of a fluorine-containing resin is used, the thickness is easily uneven.
本發明人等發現:於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器中,使覆蓋其陽極基體之邊(緣)部的銀糊層較覆蓋面部之銀糊層更厚,或者使覆蓋該陽極基體之邊(緣)部之銀糊層的厚度為10 μ m以上的固體電解電容器可解決上述課題,而完成本發明。The present inventors have found that a solid electrolytic capacitor in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on a surface of an anode substrate composed of a valve action metal is covered with an anode substrate. The silver paste layer in the side (edge) portion is thicker than the silver paste layer covering the face portion, or the solid electrolytic capacitor having a thickness of the silver paste layer covering the side (edge) portion of the anode substrate of 10 μm or more can solve the above problem. The present invention has been completed.
本發明人等發現:於由閥作用金屬構成之陽極基體表面依序層壓氧化被膜層、導電性高分子層、碳糊層及銀糊層而成之固體電解電容器之製造方法中,藉由具有:將於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層而成之陽極基體浸漬於銀糊中之步驟;及以刷毛塗佈銀糊於該陽極基體邊(緣)部之步驟的製造方法,即可製造出銀糊層厚度不勻程度小,進而每單位體積之電容高且ESR低之電容器,而完成本發明。The present inventors have found that a method of manufacturing a solid electrolytic capacitor in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on the surface of an anode substrate made of a valve action metal is used. The method comprises the steps of: immersing an anode substrate in which an oxide film layer, a conductive polymer layer and a carbon paste layer are sequentially laminated on a surface of an anode substrate in a silver paste; and coating a silver paste on the anode substrate side with a bristles ( The manufacturing method of the step of the edge portion can produce a capacitor having a small thickness unevenness of the silver paste layer and further having a high capacitance per unit volume and a low ESR, and the present invention has been completed.
添加於形成固體電解電容器之層壓構造之銀糊中的有機系溶劑,係於調製銀糊時或藉由塗佈等而形成層壓構造時吸收空氣中的水分,而使組成銀糊之含水量上升。由含水量上升之銀糊層壓而成之固體電解電容器的ESR不會充分降低。本發明人等依據該等發現精心研究結果,發現:於由閥作用金屬構成之陽極基體表面依序層壓氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器中,若使形成該層壓構造之銀糊組成之含水量為0.5質量%以下,尤其為0.3質量%以下時,則可提供ESR充分低之固體電解電容器,以及於濕度低之環境下,可使前述銀糊組成之含水量成為0.5質量%以下,較佳為0.3質量%以下,而完成本發明。The organic solvent added to the silver paste forming the laminated structure of the solid electrolytic capacitor absorbs moisture in the air when the silver paste is prepared or when a laminate structure is formed by coating or the like, so that the composition of the silver paste is contained. The amount of water has risen. The ESR of a solid electrolytic capacitor laminated with a silver paste having an increased water content is not sufficiently lowered. The present inventors have carefully studied the results based on these findings and found that in the solid electrolytic capacitor in which the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste layer are sequentially laminated on the surface of the anode substrate composed of the valve action metal. When the water content of the silver paste composition forming the laminate structure is 0.5% by mass or less, particularly 0.3% by mass or less, a solid electrolytic capacitor having a sufficiently low ESR can be provided, and in an environment having a low humidity, The water content of the silver paste composition is 0.5% by mass or less, preferably 0.3% by mass or less, to complete the present invention.
亦即,本發明係關於以下所示之低ESR高電容固體電解電容器元件、含有前述固體電解電容器元件之固體電解電容器、將前述固體電解電容器元件層壓而構成之層壓型固體電解電容器、層壓構造之形成方法、固體電解電容器元件之製造方法、以該方法製造之固體電解電容器元件、以及形成固體電解電容器之層壓構造之銀糊。In other words, the present invention relates to a low-ESR high-capacity solid electrolytic capacitor element, a solid electrolytic capacitor including the solid electrolytic capacitor element, and a laminated solid electrolytic capacitor and a layer formed by laminating the solid electrolytic capacitor element. A method of forming a pressure structure, a method of manufacturing a solid electrolytic capacitor element, a solid electrolytic capacitor element produced by the method, and a silver paste forming a laminated structure of a solid electrolytic capacitor.
1.一種固體電解電容器元件,係於由閥作用金屬構成之陽極基體表面依序層壓氧化被膜層、導電性高分子層、碳糊層及銀糊層者,其係對覆蓋於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體之邊(緣)部的銀糊層、以及覆蓋該陽極基體表面之銀糊層的組成或層厚度進行控制。A solid electrolytic capacitor element in which an oxide film layer, a conductive polymer layer, a carbon paste layer and a silver paste layer are sequentially laminated on a surface of an anode substrate composed of a valve action metal, which is coated on the surface of the anode substrate The composition of the silver paste layer on the side (edge) portion of the anode substrate of the oxide film layer, the conductive polymer layer and the carbon paste layer, and the composition or layer thickness of the silver paste layer covering the surface of the anode substrate are controlled.
2.如前述1之固體電解電容器元件,其中,前述覆蓋陽極基體之邊(緣)部之銀糊層的層厚度為6 μ m以上,覆蓋面部之銀糊層的層厚度為20 μ m以下者。2. The solid electrolytic capacitor element according to the above 1, wherein the layer thickness of the silver paste layer covering the side (edge) portion of the anode substrate is 6 μm or more, and the layer thickness of the silver paste layer covering the face is 20 μm or less. By.
3.如前述1之固體電解電容器元件,其係將含有用以於表面具有碳糊層之前述陽極基體上形成銀糊層之材料所組成的A液塗佈於陽極基體的邊(緣)部,將含有形成前述銀糊層用之材料,且對碳糊層之潤濕性較A液高之液體所組成的B液塗佈於陽極基體的面部,而形成層壓構造。3. The solid electrolytic capacitor element according to the above 1, wherein the liquid A containing the material for forming the silver paste layer on the anode substrate having the carbon paste layer on the surface is applied to the side (edge) portion of the anode substrate. A liquid B containing a material for forming the silver paste layer and having a higher wettability than the liquid A of the carbon paste layer is applied to the surface of the anode base to form a laminated structure.
4.如前述3之固體電解電容器元件,其係將前述A液塗佈於陽極基體之邊(緣)部並使其乾燥後,將陽極基體浸漬於前述B液中,藉此將B液塗佈於陽極基體之面部而形成層壓構造。4. The solid electrolytic capacitor element according to the above 3, wherein the liquid A is applied to the side (edge) portion of the anode base and dried, and then the anode substrate is immersed in the liquid B to coat the liquid B. A laminate structure is formed by coating the face of the anode substrate.
5.如前述4之固體電解電容器元件,其係僅將陽極基體之下邊(緣)部浸漬於前述A液,藉此將A液塗佈於下邊(緣)部並使其乾燥後,將包含陽極基體的面部浸漬於前述B液中,藉此將B液塗佈於陽極基體的面部而形成層壓構造。5. The solid electrolytic capacitor element according to the above 4, wherein only the lower side (edge) portion of the anode base is immersed in the liquid A, whereby the liquid A is applied to the lower side (edge) portion and dried, and then The surface of the anode base was immersed in the liquid B described above, whereby the liquid B was applied to the surface of the anode base to form a laminated structure.
6.如前述3之固體電解電容器元件,其係將B液塗佈於陽極基體之面部並使其乾燥後,將陽極基體浸漬於前述A液中,藉此以A液被覆陽極基體之邊(緣)部而形成層壓構造。6. The solid electrolytic capacitor element according to the above 3, wherein the liquid B is applied to the surface of the anode substrate and dried, and then the anode substrate is immersed in the liquid A to thereby coat the side of the anode substrate with the liquid A ( The rim portion forms a laminated structure.
7.如前述3至6中任一者之固體電解電容器元件,其中,形成層壓構造之碳糊層及銀糊層之至少任一者為含有氟樹脂之被覆層者。7. The solid electrolytic capacitor element according to any one of the above 3 to 6, wherein at least one of the carbon paste layer and the silver paste layer forming the laminated structure is a coating layer containing a fluororesin.
8.如前述1至7中任一者之固體電解電容器元件,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。8. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the anode base is in the form of a flat foil, a plate or a rod.
9.如前述1至7中任一者之固體電解電容器元件,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬之表面部分之閥作用金屬本身的氧化物層。9. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the dielectric film layer provided on the surface of the anode substrate is provided on the oxide layer of the valve action metal itself on the surface portion of the valve action metal.
10.如前述1至7中任一者之固體電解電容器元件,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成組群中之1種者。10. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the valve action metal is one selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium and alloys based on the metals. Species.
11.如前述1至7中任一者之固體電解電容器元件,其中,於表面層壓氧化被膜層之由閥作用金屬構成之陽極基體係鋁化成箔(formed Al-foil)者。11. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the anode-based system composed of a valve action metal laminated on the surface of the oxide film layer is aluminized to form a foil (formed Al-foil).
12.一種固體電解電容器,係包含前述1至11中任一者之固體電解電容器元件。A solid electrolytic capacitor comprising the solid electrolytic capacitor element according to any one of the above 1 to 11.
13.一種層壓型固體電解電容器,係包含由複數個前述1至11中任一者之固體電解電容器元件層壓而構成之層壓體者。A laminated solid electrolytic capacitor comprising a laminate comprising a plurality of solid electrolytic capacitor elements according to any one of the above 1 to 11 laminated.
14.如前述1至7中任一者之固體電解電容器元件,其係於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件中,覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體之邊(緣)部的銀糊層,係較覆蓋該陽極基體之面部的銀糊層更厚者。14. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste are sequentially laminated on the surface of the anode substrate formed of the valve action metal. In the solid electrolytic capacitor element of the layer, a silver paste layer on the side (edge) portion of the anode substrate of the oxide film layer, the conductive polymer layer, and the carbon paste layer is laminated on the surface of the anode substrate, and the anode is covered. The silver paste layer on the face of the base is thicker.
15.如前述14之固體電解電容器元件,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。15. The solid electrolytic capacitor element according to the above 14, wherein the anode base is in the form of a flat foil, a plate or a rod.
16.如前述14之固體電解電容器元件,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬表面部分之閥作用金屬本身的氧化物層。16. The solid electrolytic capacitor element according to the above 14, wherein the dielectric film layer provided on the surface of the anode substrate is provided on the oxide layer of the valve action metal itself of the valve action metal surface portion.
17.如前述14之固體電解電容器元件,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成群組之1種者。17. The solid electrolytic capacitor element according to the above 14, wherein the valve action metal is one selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium, and alloys based on the metals.
18.如前述14之固體電解電容器元件,其中,於表面層壓有氧化被膜層之由閥作用金屬構成之陽極基體為鋁化成箔者。18. The solid electrolytic capacitor element according to the above 14, wherein the anode base body composed of the valve action metal laminated with the oxide film layer on the surface thereof is aluminized to a foil.
19.如前述1至7中任一者之固體電解電容器元件,其中,於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件中,覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體之邊(緣)部的銀糊層厚度為10 μ m以上者。19. The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste are sequentially laminated on the surface of the anode substrate composed of the valve action metal. In the solid electrolytic capacitor element of the layer, the thickness of the silver paste layer on the side (edge) portion of the anode substrate on which the oxide film layer, the conductive polymer layer, and the carbon paste layer are laminated on the surface of the anode substrate is 10 μm or more. By.
20.如前述19之固體電解電容器元件,其中,覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體之邊(緣)部的銀糊層厚度為10至200 μ m。20. The solid electrolytic capacitor element according to the above 19, wherein the thickness of the silver paste layer on the side (edge) portion of the anode substrate of the oxide film layer, the conductive polymer layer, and the carbon paste layer is sequentially laminated on the surface of the anode substrate. It is 10 to 200 μ m.
21.如前述19之固體電解電容器元件,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。21. The solid electrolytic capacitor element according to the above 19, wherein the anode base is in the form of a flat foil, a plate or a rod.
22.如前述19之固體電解電容器元件,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬表面部分之閥作用金屬本身的氧化物層。22. The solid electrolytic capacitor element according to the above 19, wherein the dielectric film layer provided on the surface of the anode substrate is provided on the oxide layer of the valve action metal itself of the valve action metal surface portion.
23.如前述19之固體電解電容器元件,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成組群之1種者。23. The solid electrolytic capacitor element according to the above 19, wherein the valve action metal is one selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium, and an alloy based on the metal.
24.如前述19之固體電解電容器元件,其中,於表面層壓有氧化被膜層之由閥作用金屬構成之陽極基體為鋁化成箔。24. The solid electrolytic capacitor element according to the above 19, wherein the anode base body composed of the valve action metal laminated with the oxide film layer on the surface thereof is an aluminized foil.
25.如前述1至7中任一者之固體電解電容器元件,其中,於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件中,係層壓有組成銀糊之含水量為0.5質量%以下的銀糊者。The solid electrolytic capacitor element according to any one of the above 1 to 7, wherein the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste are sequentially laminated on the surface of the anode substrate composed of the valve action metal. In the solid electrolytic capacitor element of the layer, a silver paste constituting a silver paste having a water content of 0.5% by mass or less is laminated.
26.如前述25之固體電解電容器元件,其中,含水量為0.3質量%以下者。26. The solid electrolytic capacitor element according to the above 25, wherein the water content is 0.3% by mass or less.
27.如前述25或26之固體電解電容器元件,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。27. The solid electrolytic capacitor element according to the above 25 or 26, wherein the anode base is in the form of a flat foil, a plate or a rod.
28.如前述25至27中任一者之固體電解電容器元件,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬表面部分之閥作用金屬本身的氧化物層。The solid electrolytic capacitor element according to any one of the preceding items 25 to 27, wherein the dielectric film layer provided on the surface of the anode substrate is provided on the oxide layer of the valve action metal itself of the valve action metal surface portion.
29.如前述25至28中任一者之固體電解電容器元件,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成組群之1種者。The solid electrolytic capacitor element according to any one of the preceding items 25 to 28, wherein the valve action metal is one selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium and alloys based on the metals. By.
30.如前述25至29中任一者之固體電解電容器元件,其中,於表面層壓有氧化被膜層之由閥作用金屬構成之陽極基體為鋁化成箔者。The solid electrolytic capacitor element according to any one of the above-mentioned items 25 to 29, wherein the anode base body composed of the valve action metal laminated on the surface of the oxide film layer is aluminized into a foil.
31.一種層壓構造之形成方法,係於表面具有第1被覆層之箔片上形成第2被覆層之層壓構造之形成方法,其特徵為具有:將含有形成第2被覆層用之材料的A液塗佈於箔片之邊(緣)部之步驟;以及將含有形成第2被覆層用之材料且對第1被覆層之潤濕性較A液高之液體所成之B液塗佈於箔片之面部的步驟。A method for forming a laminated structure, which is a method for forming a laminated structure in which a second coating layer is formed on a foil having a first coating layer on the surface thereof, and is characterized in that it comprises a material for forming a second coating layer. a step of applying the liquid A to the side (edge) portion of the foil; and coating the liquid B containing the material for forming the second coating layer and having the wettability of the first coating layer higher than that of the liquid A The step on the face of the foil.
32.如前述31之層壓構造之形成方法,其係將前述A液塗佈於箔片之邊(緣)部並使其乾燥後,將箔片浸漬於B液而將B液塗佈於箔片之面部者。32. The method for forming a laminate structure according to the above 31, wherein the liquid A is applied to a side (edge) portion of the foil and dried, and then the foil is immersed in the liquid B to apply the liquid B. The face of the foil.
33.如前述32之層壓構造之形成方法,其係僅將箔片之下邊(緣)部浸漬於前述A液且塗佈於下邊(緣)部並使其乾燥後,將包含箔片之面部浸漬於B液,使B液塗佈於箔片之面部者。33. The method for forming a laminate structure according to the above 32, wherein the lower edge (edge) portion of the foil is immersed in the liquid A and applied to the lower edge (edge) portion, and dried, and then the foil is included. The face is immersed in the liquid B, and the liquid B is applied to the face of the foil.
34.如前述31之層壓構造之形成方法,其係將前述B液塗佈於箔片之面部並使其乾燥後,將箔片浸漬於A液而以A液被覆箔片的邊(緣)部者。34. The method for forming a laminate structure according to the above 31, wherein the liquid B is applied to a surface of the foil and dried, and then the foil is immersed in the liquid A to cover the side of the foil with the liquid A. ) Department.
35.如前述31至34中任一者之層壓構造之形成方法,其中,第1被覆層及第2被覆層之至少任一者為含有氟樹脂之被覆層。The method of forming a laminated structure according to any one of the above aspects, wherein the at least one of the first coating layer and the second coating layer is a coating layer containing a fluororesin.
36.如前述31至35中任一者之層壓構造之形成方法,其中,第1被覆層為碳糊層,第2被覆層為碳糊以外之導電糊層。The method for forming a laminate structure according to any one of the above aspects, wherein the first coating layer is a carbon paste layer, and the second coating layer is a conductive paste layer other than the carbon paste.
37.一種固體電解電容器元件之製造方法,係於表面之一部分具有固體電解質層之固體電解電容器元件的固體電解質層上依序形成碳糊層及導電糊層作為陰極部之固體電解電容器元件之製造方法,其特徵為:於碳糊層及導電性糊層之層壓步驟中使用前述36之層壓構造之形成方法。37. A method of manufacturing a solid electrolytic capacitor element, which is a method of manufacturing a solid electrolytic capacitor element in which a carbon paste layer and a conductive paste layer are sequentially formed as a cathode portion on a solid electrolyte layer of a solid electrolytic capacitor element having a solid electrolyte layer on one surface The method is characterized in that the method for forming a laminate structure of the above 36 is used in the lamination step of the carbon paste layer and the conductive paste layer.
38.如前述37之固體電解電容器元件之製造方法,其中,導電糊為銀糊。38. The method of producing a solid electrolytic capacitor element according to 37 above, wherein the conductive paste is a silver paste.
39.一種固體電解電容器元件,係以前述38之方法製成者。39. A solid electrolytic capacitor element produced by the method of 38 above.
40.一種固體電解電容器,係包含前述39之固體電解電容器元件者。A solid electrolytic capacitor comprising the solid electrolytic capacitor element of the aforementioned 39.
41.一種層壓型固體電解電容器,其特徵為:包含將複數個前述39之固體電解電容器元件層壓而構成之層壓體。A laminated solid electrolytic capacitor comprising a laminate comprising a plurality of the solid electrolytic capacitor elements of the foregoing 39 laminated.
42.一種固體電解電容器元件之製造方法,係於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件之製造方法,其特徵為具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟;以及於該陽極基體之邊(緣)部以刷毛塗佈銀糊之步驟。42. A method of producing a solid electrolytic capacitor element, comprising: a solid electrolytic capacitor element in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on a surface of an anode substrate made of a valve action metal; a manufacturing method characterized by comprising: a step of immersing an anode substrate having an oxide film layer, a conductive polymer layer and a carbon paste layer on a surface of an anode substrate in a silver paste; and a side of the anode substrate The step of coating the silver paste with the bristles.
43.如前述42之固體電解電容器元件之製造方法,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。43. The method of producing a solid electrolytic capacitor element according to the above item 42, wherein the shape of the anode base is a flat foil, a plate or a rod.
44.如前述42之固體電解電容器元件之製造方法,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬表面部分之閥作用金屬本身的氧化物層。The method of producing a solid electrolytic capacitor element according to the above item 42, wherein the dielectric film layer provided on the surface of the anode substrate is provided on an oxide layer of the valve action metal itself in the surface portion of the valve action metal.
45.如前述42之固體電解電容器元件之製造方法,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成組群之1種者。The method of producing a solid electrolytic capacitor element according to the above item 42, wherein the valve action metal is one selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium, and an alloy based on the metal.
46.如前述42之固體電解電容器元件之製造方法,其中,於表面層壓有氧化被膜層之由閥作用金屬構成之陽極基體為鋁化成箔者。The method of producing a solid electrolytic capacitor element according to the above item 42, wherein the anode substrate composed of the valve action metal having the oxide film layer laminated thereon is aluminized to a foil.
47.一種固體電解電容器元件之製造方法,係於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件之製造方法,其特徵為:層壓含水量為0.5質量%以下之銀糊。47. A method of producing a solid electrolytic capacitor element, comprising: a solid electrolytic capacitor element in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on a surface of an anode substrate made of a valve action metal; A manufacturing method characterized by laminating a silver paste having a water content of 0.5% by mass or less.
48.如前述47之固體電解電容器元件之製造方法,其中,含水量為0.3質量%以下者。The method of producing a solid electrolytic capacitor element according to the above 47, wherein the water content is 0.3% by mass or less.
49.如前述47或48之固體電解電容器元件之製造方法,其中,陽極基體之形狀為平板狀的箔、板或棒狀者。The method of manufacturing a solid electrolytic capacitor element according to the above 47 or 48, wherein the shape of the anode base is a flat foil, a plate or a rod.
50.如前述47至49中任一者之固體電解電容器元件之製造方法,其中,設於陽極基體表面之介電質被膜層係設於閥作用金屬表面部分之閥作用金屬本身的氧化物層。The method of manufacturing a solid electrolytic capacitor element according to any one of the items 47 to 49, wherein the dielectric film layer provided on the surface of the anode substrate is provided on the oxide layer of the valve action metal itself of the valve action metal surface portion. .
51.如前述47至50中任一者之固體電解電容器元件之製造方法,其中,閥作用金屬為選自鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金所成組群之1種者。The method of manufacturing a solid electrolytic capacitor element according to any one of the above items 47 to 50, wherein the valve action metal is a group selected from the group consisting of aluminum, tantalum, titanium, niobium, zirconium and alloys based on the metals. One of them.
52.如前述47至51中任一者之固體電解電容器元件之製造方法,其中,於表面層壓有氧化被膜層之由閥作用金屬構成之陽極基體為鋁化成箔者。The method of manufacturing a solid electrolytic capacitor element according to any one of the above-mentioned items 47 to 51, wherein the anode base body composed of the valve action metal laminated on the surface of the oxide film layer is aluminized to a foil.
53.一種銀糊,係形成於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件之層壓構造者,其特徵為該銀糊之含水量為0.5質量%以下。53. A silver paste which is a laminate structure of a solid electrolytic capacitor element in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on a surface of an anode substrate made of a valve action metal. It is characterized in that the water content of the silver paste is 0.5% by mass or less.
54.如前述53之銀糊,其中,含水量為0.3質量%以下者。54. The silver paste according to the above-mentioned item 53, wherein the water content is 0.3% by mass or less.
依據本發明,可獲得於表面具有碳糊層之陽極基體上形成銀糊之層壓構造,且ESR(等效串聯電阻)充分低而每單位體積之電容增大的固體電解電容器。於本發明中,藉由控制於表面具有碳糊層之陽極基體上形成層壓構造之銀糊的組成或層厚度,而獲得低ESR、高電容之固體電解電容器元件。若使用對碳糊層之潤濕性不同之2種組成的銀糊,且分別塗佈於邊(緣)部及面部,則整體可獲得所期望之層厚度。使用前述2種組成之銀糊,若於邊(緣)部塗佈潤濕性較低之組成者,於面部塗佈潤濕性較高之組成者,則整體可獲得所期望之層厚度,該現象亦廣泛應用於依序形成第1被覆層與第2被覆層之層壓構造的形成。藉由控制於表面具有碳糊層之陽極基體上形成層壓構造之銀糊的層厚度,可獲得覆蓋前述陽極基體之邊(緣)部之銀糊層、及覆蓋該陽極基體之面部之銀糊層的層厚度受到控制的層壓構造,尤其是邊(緣)部具有充分層厚度(層厚度為6 μ m以上為佳)且面部之層厚度經抑制(面部之層厚度為20 μ m以下為佳)之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。前述層厚度之控制方法係於前述陽極基體上形成前述銀糊之層壓構造時,若前述陽極基體為箔片,則以控制箔片緣部之層厚度與面部之層厚度的方法特別有效。以覆蓋前述陽極基體之邊(緣)部之銀糊層較覆蓋面部之銀糊層更厚的固體電解電容器元件為佳,且宜使用組成前述銀糊之含水量為0.5質量%以下之銀糊。此外,藉由具有:將於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟;及於該陽極基體之邊(緣)部以刷毛塗佈銀糊之步驟,可獲得銀糊層厚度不均勻之程度小,而每單位體積之電容高且ESR低之電容器。再者,最好使用組成前述銀糊之含水量為0.5質量%以下之銀糊。藉由使形成該層壓構造之銀糊組成之含水量為0.5質量%以下,尤其為0.3質量%以下,而可獲得ESR充分低之固體電解電容器及其製造方法。由含水量為0.5質量%以下之組成,尤其為0.3質量%以下之組成所成之銀糊層壓而得之固體電解電容器的ESR降低的理由雖不明確,但可推知當層壓含水量高於0.5質量%之組成所成之銀糊時,當使層壓之銀糊的溶劑乾燥時,水會使銀糊層變質而使ESR上升。因此,依據本發明,可獲得ESR充分低之固體電解電容器及其製造方法。According to the present invention, it is possible to obtain a solid electrolytic capacitor having a laminated structure in which a silver paste is formed on an anode substrate having a carbon paste layer on its surface, and an ESR (equivalent series resistance) is sufficiently low and a capacitance per unit volume is increased. In the present invention, a solid electrolytic capacitor element having a low ESR and a high capacitance is obtained by controlling the composition or layer thickness of a silver paste having a laminated structure formed on an anode substrate having a carbon paste layer on its surface. When a silver paste having two kinds of compositions having different wettabilities to the carbon paste layer is used and applied to the side (edge) portion and the face portion, the desired layer thickness can be obtained as a whole. When the silver paste having the above two compositions is used, if a component having a low wettability is applied to the edge (edge) portion, and a component having a high wettability is applied to the face, the desired layer thickness can be obtained as a whole. This phenomenon is also widely applied to the formation of a laminated structure of the first covering layer and the second covering layer in order. By controlling the layer thickness of the silver paste forming the laminated structure on the anode substrate having the carbon paste layer on the surface, the silver paste layer covering the side (edge) portion of the anode substrate and the silver covering the face of the anode substrate can be obtained. The layer thickness of the paste layer is controlled by a laminated structure, in particular, the edge portion has a sufficient layer thickness (preferably, a layer thickness of 6 μm or more) and the layer thickness of the face layer is suppressed (the thickness of the layer layer is 20 μm) The following is a solid electrolytic capacitor element having a low ESR (equivalent series resistance) and an increase in capacitance per unit volume. In the method of controlling the thickness of the layer, when the laminated structure of the silver paste is formed on the anode substrate, if the anode substrate is a foil, the method of controlling the layer thickness of the edge portion of the foil and the thickness of the layer on the surface of the foil is particularly effective. Preferably, the silver paste layer covering the side (edge) portion of the anode substrate is thicker than the silver paste layer covering the face portion, and a silver paste constituting the silver paste having a water content of 0.5% by mass or less is preferably used. . Further, the step of immersing the anode substrate on which the oxide film layer, the conductive polymer layer and the carbon paste layer are sequentially laminated on the surface of the anode substrate is immersed in the silver paste; and at the side (edge) portion of the anode substrate The step of applying the silver paste to the bristles can obtain a capacitor having a small thickness unevenness of the silver paste layer and a high capacitance per unit volume and a low ESR. Further, it is preferable to use a silver paste which constitutes the silver paste and has a water content of 0.5% by mass or less. The solid electrolytic capacitor having a sufficiently low ESR and a method for producing the same can be obtained by setting the water content of the silver paste composition forming the laminated structure to 0.5% by mass or less, particularly 0.3% by mass or less. The reason why the ESR of the solid electrolytic capacitor obtained by laminating the silver paste obtained by the composition having a water content of 0.5% by mass or less, particularly 0.3% by mass or less, is not clear, but it can be inferred that when the water content of the laminate is high When the silver paste is formed in a composition of 0.5% by mass, when the solvent of the laminated silver paste is dried, water deteriorates the silver paste layer to increase the ESR. Therefore, according to the present invention, a solid electrolytic capacitor having a sufficiently low ESR and a method of manufacturing the same can be obtained.
本發明係於表面具有第1被覆層(典型為碳糊層)之陽極基體(以箔片為佳,以下同)上塗佈含有形成第2被覆層(典型為銀糊層)用之材料的液體(以下稱為第2層形成液)而形成第2被覆層的層壓方法中,用以解決第2被覆層之邊(緣)部之層厚度與面部之層厚度相較極端小之現象者。In the present invention, an anode substrate having a first coating layer (typically a carbon paste layer) on its surface (preferably a foil, the same applies hereinafter) is coated with a material for forming a second coating layer (typically a silver paste layer). In the laminating method of forming the second coating layer by the liquid (hereinafter referred to as the second layer forming liquid), the layer thickness of the side (edge) portion of the second coating layer is extremely small compared with the layer thickness of the face layer. By.
陽極基體係於第1被覆層上塗佈第2層形成液時,包含所有具有面部與邊(緣)部於層厚度上得以產生不同之尺寸條件者。該類尺寸條件一般係依分別組成前述第1被覆層與第2被覆層形成液之成分而異,惟通常包含厚度為1mm以下、面之寬度及長度為其2倍以上者,尤其包含厚度為10至500 μ m、面之寬度及長度為1mm以上者(尤其以箔片為佳)。When the second layer forming solution is applied to the first coating layer on the first coating layer, all of the conditions including the surface portion and the edge portion are different in thickness of the layer. These dimensional conditions generally differ depending on the composition of the first coating layer and the second coating layer forming liquid, respectively, but usually include a thickness of 1 mm or less, a width and a length of the surface of 2 or more times, and particularly a thickness of 10 to 500 μ m, the width of the face and the length of 1 mm or more (especially with foil).
組成第1被覆層與第2被覆層之成分,只要可產生上述現象,即無特別限定,惟當至少任一者含有氟樹脂時,容易發生邊(緣)部之層厚度較面部之層厚度小之現象。The component constituting the first coating layer and the second coating layer is not particularly limited as long as the above phenomenon can occur. However, when at least one of the fluororesin is contained, the thickness of the edge portion is more likely to be the thickness of the layer than the surface layer. Small phenomenon.
例如,第2被覆層為導電糊層(典型為銀糊層),第1被覆層為碳糊層時即相當於上述情形。For example, the second coating layer is a conductive paste layer (typically a silver paste layer), and when the first coating layer is a carbon paste layer, it corresponds to the above case.
又,以下之說明係就適合作為陽極基體使用之箔片獨立存在的情形加以說明,惟只要可實施,則箔片亦可固定於其他之基板等。Further, the following description is suitable for the case where the foil used as the anode base body is independently present, but the foil may be fixed to another substrate or the like as long as it can be carried out.
本發明係為了形成上述層壓構造,其特徵為包含以下步驟:(1)將含有形成第2被覆層用之材料的組成作成的A液塗佈於箔片之邊(緣)部之步驟;以及(2)將作為對含有形成第2被覆層用之材料的第1被覆層,具有潤濕性較A液高之液體組成作成的B液塗佈於箔片之面部的步驟。The present invention is characterized in that, in order to form the above-mentioned laminated structure, the method includes the steps of: (1) applying a liquid A containing a composition for forming a material for forming a second coating layer to a side (edge) portion of a foil; And (2) a step of applying a liquid B having a liquid composition having a higher wettability than the liquid A to the surface of the foil as the first coating layer containing the material for forming the second coating layer.
(1)及(2)任一者先進行均可,例如,當先進行(1)接著進行(2)時,首先,塗佈含有用以於表面具有第1被覆層之箔片的邊(緣)部形成第2被覆層之材料的組成作成的A液,接著,塗佈含有於前述箔片的雙面形成第2被覆層用之材料,且對第1被覆層之潤濕性較A液更高之液體組成作成的B液。(1) and (2) may be performed first. For example, when (1) is performed first (2), first, the edge containing the foil having the first coating layer on the surface is applied. The liquid A formed by forming the composition of the material of the second coating layer, and then applying the material for forming the second coating layer on both sides of the foil, and the wettability to the first coating layer is higher than that of the liquid A The higher liquid composition is made of liquid B.
A液之塗佈可於具有第1被覆層之所有邊(緣)部進行,亦可僅於其任一邊(緣)部或者甚至僅於其一部分進行。例如,當為矩形箔片時,亦可僅於下邊(緣)部進行步驟(1)。又,於本發明中,邊(緣)部係指陽極基體之形狀為平板狀的箔、板或棒狀等立體形狀,其立體形狀係由形成相當於陽極基體厚度之部分面的邊(緣)部、及對前述邊(緣)部具有作為面之關係之面部所構成時之邊(緣)部,若就箔片而言,其邊(緣)部即係指箔片稜邊(edge)及相當於該等稜邊間厚度之部分的面。但於塗佈方法的精確度上、或由於塗佈液體而原則上,亦包含該等部分附近之區域。The application of the A liquid may be performed on all the side edges of the first coating layer, or may be performed only on either side (edge) portion or even only a part thereof. For example, in the case of a rectangular foil, the step (1) may be performed only on the lower edge (edge). Further, in the present invention, the side (edge) portion refers to a three-dimensional shape such as a foil, a plate or a rod shape in which the shape of the anode base is a flat plate, and the three-dimensional shape is formed by forming a side surface corresponding to the thickness of the anode base body. The side portion and the side portion (edge) when the side portion (edge) portion has a surface portion as a surface relationship, the edge portion of the foil means the edge of the foil (edge) And a surface corresponding to a portion of the thickness between the edges. However, in principle, the area in the vicinity of the parts is also included in the accuracy of the coating method or due to the application of the liquid.
塗佈方法並未特別限定。列舉如以刷毛或刮刀(blade)等進行的塗佈、浸漬、印刷、液體的噴霧、投射等。亦可將該等方法組合。因此,例如可以刷毛塗佈將A液塗佈於下緣部及側緣部之後,可將包包含面之部分浸漬於B液中,或者亦可以僅使A液附著於下緣部的方式予以浸漬,接著將包含面之部分浸漬於B液。The coating method is not particularly limited. Coating, dipping, printing, spraying of a liquid, projection, and the like, which are performed by using a bristles or a blade, etc. are mentioned. These methods can also be combined. Therefore, for example, after applying the liquid A to the lower edge portion and the side edge portion, the portion containing the surface of the package may be immersed in the liquid B, or only the liquid A may be attached to the lower edge portion. Impregnation, followed by immersion of the portion containing the surface in solution B.
A液與B液為含有形成第2被覆層用之材料的組成方面係其共同點,但對第1被覆層之潤濕性於B液中係高於A液之組成此點則不同。於此,潤濕性高係指使等量的第2層形成液以同一條件附著於第1層上時,更易於擴散者。潤濕性之調整可依據組成第1層及第2層之成分而以各種方法進行。The liquid A and the liquid B have a common point in the composition of the material for forming the second coating layer, but the wettability of the first coating layer is different from the composition of the liquid A in the liquid B. Here, the high wettability means that when an equal amount of the second layer forming liquid adheres to the first layer under the same conditions, it is more likely to diffuse. The adjustment of the wettability can be carried out in various ways depending on the components constituting the first layer and the second layer.
上述之潤濕性增大方法可列舉如,使用對第1層親和性較高之溶劑或成分組成第2層,或使其含有更多而組成第2層等。例如,第1層為碳糊層而第2層為導電糊層時,於B液中,使用對碳糊層之親油性高於A液的溶劑而組成導電糊層,或者即使為相同溶劑,於B液中,使溶劑含有量大於A液而組成導電糊層,或者,使大多含於導電糊中之氟樹脂成分於B液中成為較A液為少之組成等。不過,其調整方法並未限定,例如,於A液中添加黏性成分而形成A液之流動性低於B液之組成等亦視情況而為有效。The method for increasing the wettability described above may be, for example, a second layer formed by using a solvent or a component having a higher affinity for the first layer or a second layer. For example, when the first layer is a carbon paste layer and the second layer is a conductive paste layer, in the liquid B, a solvent having a lipophilicity to the carbon paste layer higher than that of the A liquid is used to form a conductive paste layer, or even if it is the same solvent, In the liquid B, the amount of the solvent is larger than that of the liquid A to form a conductive paste layer, or the fluororesin component which is mostly contained in the conductive paste is a composition which is less than the liquid A in the liquid B. However, the adjustment method is not limited. For example, it is effective to add a viscous component to the liquid A to form a liquid of the liquid A, which is lower than the composition of the liquid B.
如上所述,於本發明中,可獨立控制緣部與面部中第2層之組成或層厚度。結果,一般而言,可於緣部確保所期望量之層厚度,並抑制面部層厚度之增加。因此,適用於於表面具有碳糊層之陽極基體上,期望導電糊層之緣部較厚、於面部較薄之固體電解電容器元件(第3圖)以及其製造方法。亦即,依據本發明,於由閥作用金屬構成之陽極基體(1)表面依序層壓有氧化被膜層(2)、導電性高分子層(3)、碳糊層(4a)及銀糊層(4b)之固體電解電容器元件中,藉由控制覆蓋於陽極基體(1)表面依序層壓有氧化被膜層(2)、導電性高分子層(3)及碳糊層(4a)之陽極基體之邊(緣)部的銀糊層(4b)、以及覆蓋該陽極基體之面部之銀糊層(4b)的組成或層厚度,即可獲得低ESR(等效串聯電阻)且每單位體積之電容增大之固體電解電容器元件。依據本發明,可獲得覆蓋前述陽極基體邊(緣)部之銀糊層(4b)具有充分層厚度且覆蓋面部之銀糊層(4b)之層厚度受到抑制之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。以將含有用以於表面具有碳糊層(4a)之前述陽極基體上形成銀糊層(4b)的材料之組成作成的A液塗佈於陽極基體的邊(緣)部,將含有形成銀糊層(4b)用之材料’且對碳糊層(4a)之潤濕性高於A液之液體組成作成的B液塗佈於陽極基體的面部,而形成所期望之層壓構造的固體電解電容器元件為佳。將前述A液塗佈於陽極基體邊(緣)部並使其乾燥後,將陽極基體浸漬於B液,藉此將B液塗佈於陽極基體之面部即可形成所期望之層壓構造的固體電解電容器元件。亦可僅將陽極基體的下邊(緣)部浸漬於前述A液而塗佈於下邊(緣)部並使其乾燥後,包含陽極基體的面部浸漬於B液,而將B液塗佈於陽極基體之面部亦可形成所期望之層壓構造的固體電解電容器元件,將前述B液塗佈於陽極基體之面部並使其乾燥後,將陽極基體浸漬於A液,而以A液被覆陽極基體之邊(緣)部亦可形成所期望之層壓構造的固體電解電容器元件。即使於碳糊層(4a)及銀糊層(4b)之至少任一者為含有氟樹脂之被覆層之情形下,亦可獲得覆蓋前述陽極基體之邊(緣)部之銀糊層(4b)具有充分層厚度且覆蓋面部之銀糊層(4b)之層厚度受到抑制之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。本發明係提供該等低ESR高電容固體電解電容器元件、含有前述固體電解電容器元件之固體電解電容器、以及將複數個前述固體電解電容器元件層壓而成之層壓型固體電解電容器。As described above, in the present invention, the composition or layer thickness of the second layer in the edge portion and the face portion can be independently controlled. As a result, in general, the desired thickness of the layer can be ensured at the edge and the increase in the thickness of the face layer can be suppressed. Therefore, it is suitable for a solid electrolytic capacitor element (Fig. 3) having a thick edge portion of a conductive paste layer and a thin face on an anode substrate having a carbon paste layer on its surface, and a method for producing the same. That is, according to the present invention, the oxide film layer (2), the conductive polymer layer (3), the carbon paste layer (4a), and the silver paste are sequentially laminated on the surface of the anode substrate (1) composed of the valve action metal. In the solid electrolytic capacitor element of the layer (4b), the oxide film layer (2), the conductive polymer layer (3), and the carbon paste layer (4a) are laminated in this order by controlling the surface of the anode substrate (1). A low ESR (Equivalent Series Resistance) and a unit per unit can be obtained by the composition or layer thickness of the silver paste layer (4b) at the edge (edge) portion of the anode substrate and the silver paste layer (4b) covering the surface of the anode substrate. Solid electrolytic capacitor element with increased capacitance of volume. According to the present invention, it is possible to obtain a low ESR (equivalent series resistance) in which the silver paste layer (4b) covering the edge (edge) portion of the anode substrate has a sufficient layer thickness and the layer thickness of the silver paste layer (4b) covering the face is suppressed. And a solid electrolytic capacitor element having an increased capacitance per unit volume. Applying the liquid A containing the composition of the material for forming the silver paste layer (4b) on the anode substrate having the carbon paste layer (4a) on the surface thereof is applied to the side (edge) portion of the anode substrate to contain silver. The liquid B for the paste layer (4b) and the liquid B made of the liquid paste layer (4a) having a higher wettability than the liquid composition of the liquid A are applied to the face of the anode substrate to form a solid of the desired laminated structure. Electrolytic capacitor components are preferred. After applying the liquid A to the side of the anode substrate (edge) and drying it, the anode substrate is immersed in the liquid B, whereby the liquid B is applied to the surface of the anode substrate to form a desired laminated structure. Solid electrolytic capacitor component. Alternatively, the lower side (edge) portion of the anode substrate may be immersed in the liquid A and applied to the lower edge (edge) portion, and dried, and then the surface including the anode substrate may be immersed in the liquid B, and the liquid B may be applied to the anode. The surface of the substrate may also form a solid electrolytic capacitor element having a desired laminated structure. After the B liquid is applied to the surface of the anode substrate and dried, the anode substrate is immersed in the A liquid, and the anode substrate is coated with the A liquid. The side (edge) portion can also form a solid electrolytic capacitor element having a desired laminated structure. Even in the case where at least one of the carbon paste layer (4a) and the silver paste layer (4b) is a coating layer containing a fluororesin, a silver paste layer (4b) covering the side (edge) portion of the anode substrate can be obtained. A solid electrolytic capacitor element having a low ESR (equivalent series resistance) in which the layer thickness of the silver paste layer (4b) having a sufficient layer thickness and covering the face is suppressed and the capacitance per unit volume is increased. The present invention provides such a low-ESR high-capacitance solid electrolytic capacitor element, a solid electrolytic capacitor including the solid electrolytic capacitor element, and a laminated solid electrolytic capacitor in which a plurality of the above-described solid electrolytic capacitor elements are laminated.
如第3圖所示,上述固體電解電容器元件係於陽極基體(1)形成介電質之氧化被膜層(2),於該外側形成作為對向電極的固體半導體層(以下稱為固體電解質)(3),再形成導電糊等導電體層(4)而成之固體電解電容器元件,導電體層(4)為雙層構造,典型者係包含:碳糊層(4a)及邊(緣)部確保所期望之層厚度且面部層厚度之增加受到抑制的導電糊層(4b)。As shown in Fig. 3, the solid electrolytic capacitor element is formed of an oxide film layer (2) of a dielectric material formed on the anode base (1), and a solid semiconductor layer (hereinafter referred to as a solid electrolyte) as a counter electrode is formed on the outer side. (3) A solid electrolytic capacitor element in which a conductor layer (4) such as a conductive paste is formed, and the conductor layer (4) has a two-layer structure, and typically includes a carbon paste layer (4a) and a side (edge) portion. The desired thickness of the layer and the increase in the thickness of the face layer are suppressed by the conductive paste layer (4b).
本發明之固體電解電容器及其製造方法,係於由閥作用金屬構成之陽極基體表面依序層壓氧化被膜層、導電性高分子層、碳糊層及銀糊層。The solid electrolytic capacitor of the present invention and the method for producing the same are characterized in that an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on the surface of an anode substrate made of a valve action metal.
表面層壓有氧化被膜層且由閥作用金屬構成之陽極基體,於層壓於該陽極基體之層壓於導電性高分子層之碳糊層上塗佈銀糊時,係包含所有具有面部與邊(緣)部可產生不同層厚度之尺寸條件者,該「邊(緣)」係指加上與陽極相對向之端邊(緣)及與該端邊(緣)正交之側邊(緣)的3個邊(緣)。碳糊層及銀糊層的組成成分並無特別限定。An anode substrate having an oxide film layer laminated thereon and comprising a valve action metal, and coating all of the silver paste on the carbon paste layer laminated on the conductive polymer layer of the anode substrate The edge (edge) portion may have a dimensional condition of different layer thicknesses, and the "edge (edge)" refers to the side edge (edge) opposite to the anode and the side edge orthogonal to the edge (edge) ( 3 sides (edges) of the edge. The composition of the carbon paste layer and the silver paste layer is not particularly limited.
本發明係於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之固體電解電容器元件及其製造方法中,於用以形成上述層壓構造之銀糊層上係具有特徵。亦即,本發明係藉由控制覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體邊(緣)部的銀糊層、以及覆蓋該陽極基體面部之銀糊層的組成或層厚度,而獲得低ESR(等效串聯電阻)且每單位體積之電容增大之固體電解電容器元件,於本發明之特定態樣中,覆蓋前述陽極基體之邊的銀糊層以較覆蓋該陽極基體之面的銀糊層更厚為佳,或者覆蓋該陽極基體之邊的銀糊層厚度為10 μ m以上。較佳厚度為10至200 μ m左右。本發明之特定態樣係於電容器之製造方法中具有下列特徵:具有:將於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟;及於該陽極基體之邊以刷毛塗佈銀糊之步驟。The present invention relates to a solid electrolytic capacitor element in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on a surface of an anode substrate composed of a valve action metal, and a method for producing the same, and is used for forming The silver paste layer of the above laminated structure has characteristics. That is, the present invention is to control the silver paste layer of the anode substrate edge portion of the oxide film layer, the conductive polymer layer, and the carbon paste layer, which is laminated on the surface of the anode substrate, and to cover the anode substrate. a solid electrolytic capacitor element having a low ESR (equivalent series resistance) and a capacitance per unit volume increased in composition or layer thickness of the silver paste layer of the face, in a specific aspect of the invention, covering the side of the anode substrate Preferably, the silver paste layer is thicker than the silver paste layer covering the surface of the anode substrate, or the silver paste layer covering the side of the anode substrate has a thickness of 10 μm or more. A preferred thickness is about 10 to 200 μm. A specific aspect of the present invention is characterized in that the capacitor is manufactured by the method of: immersing an anode substrate of an oxide film layer, a conductive polymer layer, and a carbon paste layer on a surface of an anode substrate in a step of immersing in a silver paste. And a step of coating the silver paste with bristles on the side of the anode substrate.
覆蓋於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層而成之陽極基體之面之銀糊層的形成方法為一般所採用之本身周知之銀糊層的形成方法,可列舉如將其面浸漬於貯槽中之銀糊後拉起之浸漬法、使含有膠糊之刷毛接觸其面而塗佈的方法、藉由噴霧將膠糊噴附於其面而塗佈的方法、使已附著膠糊之滾筒按壓其面使其旋轉而塗佈的方法、以及使膠糊由篩孔(mesh)掉落於其面上之網版印刷法等。A method for forming a silver paste layer on a surface of an anode substrate formed by sequentially laminating an oxide film layer, a conductive polymer layer, and a carbon paste layer on the surface of an anode substrate is a method for forming a silver paste layer which is generally known per se. For example, a dipping method in which the silver paste is immersed in a storage tank and then pulled up, a method in which the bristles containing the paste are applied to the surface thereof, and a method in which the paste is sprayed on the surface thereof by spraying is applied. The method, the method in which the roller to which the adhesive is attached is pressed against the surface to be coated, and the screen printing method in which the paste is dropped on the surface by a mesh.
覆蓋於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體之邊之銀糊層的形成方法,只要由一般所採用之本身周知之膠糊層之形成方法中適當選擇適於覆蓋邊之形成方法即可,該適於覆蓋邊之膠糊層之形成方法,列舉如對貯槽中之銀糊,將其邊浸漬後拉起之浸漬法、使含有膠糊的刷毛接觸其邊而進行塗佈的方法、以及藉由噴霧將膠糊噴附於其邊而進行塗佈的方法等。A method of forming a silver paste layer on the side of an anode substrate of an oxide film layer, a conductive polymer layer, and a carbon paste layer, which is laminated on the surface of the anode substrate, as long as a method for forming a paste layer which is generally known per se is used. The method for forming the covering edge is appropriately selected, and the method for forming the adhesive layer for covering the edge is exemplified by a dipping method in which the silver paste in the storage tank is immersed and pulled up, and the paste is contained. The method in which the bristles are applied to the side of the bristles, and the method in which the bristles are sprayed on the side by spraying, and the like.
如上所示,覆蓋於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體之面部或邊(緣)部之銀糊層的形成方法,只要可達成本發明之目的,並無特別限定。亦即,前述銀糊層形成方法可列舉如:藉由刷毛或噴霧等進行之塗佈、浸漬、印刷、液體噴霧、投射等。亦可將該等方法組合。因此,例如以刷毛塗佈法塗佈於下緣部及側緣部之後,浸漬包含面之部分,或者亦可僅浸漬下緣部,接著浸漬包含面之部分,如此即可製造覆蓋邊之銀糊層較覆蓋面之銀糊層更厚,或者覆蓋邊之銀糊層的厚度為10 μ m以上之本發明之固體電解電容器。As described above, the method of forming the silver paste layer on the surface or the side (edge) portion of the anode substrate of the oxide film layer, the conductive polymer layer, and the carbon paste layer is sequentially laminated on the surface of the anode substrate, as long as the cost is up to the invention. The purpose is not particularly limited. That is, the method for forming the silver paste layer may be, for example, coating, dipping, printing, liquid spraying, projection, or the like by brushing or spraying. These methods can also be combined. Therefore, for example, after coating the lower edge portion and the side edge portion by the brush coating method, the portion including the surface may be impregnated, or only the lower edge portion may be immersed, and then the portion including the surface may be impregnated, thereby producing the silver of the covering edge. The paste layer is thicker than the silver paste layer of the cover layer, or the solid electrolytic capacitor of the present invention having a thickness of the silver paste layer covering the edge of 10 μm or more.
於具有將於陽極基體表面依序層壓氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟;於該陽極基體之邊以刷毛塗佈銀糊之步驟的電容器之製造方法中,由於以浸漬法將銀糊塗佈於包含其面之部分或整體的步驟與以刷毛將銀糊塗佈於其邊之步驟可合併實施,因此,銀糊層厚度不勻程度較小,而可製造每單位體積之電容高且ESR低之電容器。a step of immersing an anode substrate in which an oxide film layer, a conductive polymer layer, and a carbon paste layer are sequentially laminated on a surface of an anode substrate in a silver paste; and a capacitor for coating a silver paste with a brush on the side of the anode substrate In the manufacturing method, since the step of applying the silver paste to the portion or the whole including the surface of the surface by the dipping method and the step of applying the silver paste to the side with the bristles may be carried out in combination, the thickness of the silver paste layer is less uneven. Capacitors with high capacitance per unit volume and low ESR can be fabricated.
本發明係於由閥作用金屬構成之陽極基體表面之氧化被膜層層壓導電性高分子層後,再依序層壓碳糊層及銀糊層。於形成導電性高分子層後,將依期望予以再化成之陽極基體浸漬於碳糊,藉此可於其表面塗佈碳糊,使其乾燥而層壓碳糊層。所使用之碳糊一般係由碳粒子、氟樹脂及乙酸異戊酯等溶劑所構成之組成。In the present invention, after the conductive polymer layer is laminated on the oxide film layer on the surface of the anode substrate made of the valve action metal, the carbon paste layer and the silver paste layer are sequentially laminated. After the formation of the conductive polymer layer, the anode substrate recrystallized as desired is immersed in the carbon paste, whereby the carbon paste can be applied to the surface thereof and dried to laminate the carbon paste layer. The carbon paste to be used is generally composed of a solvent such as carbon particles, a fluororesin, and isoamyl acetate.
將依序層壓碳糊層之陽極基體浸漬於銀糊,藉此可於其表面塗佈銀糊。所使用之銀糊一般係由銀粒子、氟樹脂及乙酸異戊酯等溶劑所構成的組成。所塗佈之銀粒子的形狀並無特別限制,惟以薄片(flake)為佳。The anode substrate in which the carbon paste layer is sequentially laminated is immersed in the silver paste, whereby the silver paste can be applied to the surface thereof. The silver paste used is generally composed of a solvent such as silver particles, a fluororesin, and isoamyl acetate. The shape of the coated silver particles is not particularly limited, but a flake is preferred.
本發明之步驟係具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟(浸漬步驟)、於該陽極基體之邊以刷毛塗佈銀糊的步驟(刷毛塗佈步驟),該等浸漬步驟與刷毛塗佈步驟之任一者均可先實施。例如,如上述於將該陽極基體浸漬於銀糊之浸漬步驟之後,再實施於該陽極基體之邊以刷毛塗佈銀糊的刷毛塗佈步驟。所使用之刷毛並無特別限定,但以筆為佳,例如可使用市面上販售的繪筆。經乾燥而得之該陽極基體之邊內(緣內)之銀糊層的厚度為10 μ m以上,尤以10至200 μ m為佳。The step of the present invention has a step of immersing an anode substrate having an oxide film layer, a conductive polymer layer and a carbon paste layer on the surface of the anode substrate in a step of impregnating the silver paste (impregnation step) on the side of the anode substrate. The step of applying the silver paste to the bristles (bristle coating step) may be performed first by any of the impregnation step and the bristle coating step. For example, as described above, after the impregnation step of immersing the anode substrate in the silver paste, a brush coating step of coating the silver paste with the bristles is performed on the side of the anode substrate. The bristles to be used are not particularly limited, but a pen is preferred, and for example, a commercially available stylus can be used. The thickness of the silver paste layer in the inner side (inside) of the anode substrate obtained by drying is 10 μm or more, particularly preferably 10 to 200 μm.
如上所示,將2片依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層的陽極基體層壓於例如引線框上之後,將未形成有氧化被膜層、導電性高分子層、碳糊層及銀糊層的部位焊接於引線框,將層壓之陽極基體以環氧樹脂封裝,藉此製造固體電解電容器之晶片。As described above, after laminating two anode substrates in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are laminated, for example, on a lead frame, an oxide film layer is not formed and is electrically conductive. The portions of the polymer layer, the carbon paste layer, and the silver paste layer are welded to the lead frame, and the laminated anode substrate is encapsulated with an epoxy resin, thereby manufacturing a wafer of a solid electrolytic capacitor.
以下詳細說明本發明之固體電解電容器。The solid electrolytic capacitor of the present invention will be described in detail below.
於本發明之固體電解電容器及其製造方法係於由閥作用金屬構成之陽極基體的表面依序層壓氧化被膜層、導電性高分子層、碳糊層以及銀糊層。本發明中作為固體電解電容器之陽極基體所使用之閥作用金屬,可使用例如鋁、鉭、鈦、鈮、鋯及以該等金屬為基質之合金等之任一者。陽極基體之形狀可列舉如平板狀的箔或板或棒狀等。於表面層壓有氧化被膜層且由閥作用金屬構成之陽極基體,係包含於層壓於其上之導電性高分子層所層壓之碳糊層上塗佈銀糊時,具有可於面部與邊(緣)部產生層厚度不同之尺寸條件者,由於鋁化成箔於經濟上較為優異,因此廣泛用於實用上。該鋁化成箔係使用40至200 μ m厚、以平板形元件單位而言為縱橫1至30mm左右之矩形者。較佳為寬度2至20mm、長度2至20mm,更佳為寬度2至5mm、長度2至6mm。In the solid electrolytic capacitor of the present invention and the method for producing the same, the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste layer are sequentially laminated on the surface of the anode substrate composed of the valve action metal. In the present invention, as the valve action metal used for the anode base of the solid electrolytic capacitor, for example, any of aluminum, tantalum, titanium, niobium, zirconium, and an alloy based on the metal may be used. The shape of the anode base body may be, for example, a flat foil or a plate or a rod shape. An anode substrate having an oxide film layer laminated on its surface and composed of a valve action metal is provided on the surface of the carbon paste layer laminated on the conductive polymer layer laminated thereon In the case of a size condition in which the thickness of the layer is different from the edge (edge) portion, since the aluminized foil is economically excellent, it is widely used in practice. The aluminized foil is a rectangle having a thickness of 40 to 200 μm and a width of about 1 to 30 mm in terms of a flat element unit. It is preferably 2 to 20 mm in width and 2 to 20 mm in length, more preferably 2 to 5 mm in width and 2 to 6 mm in length.
設於陽極基體表面之介電質被膜層可為設於閥作用金屬表面部分之閥作用金屬本身的氧化物層,或亦可為設於閥作用金屬或閥作用金屬箔之表面上之其他介電質層,惟尤以由閥作用金屬本身之氧化物所構成之層為宜。The dielectric film layer disposed on the surface of the anode substrate may be an oxide layer of the valve action metal itself disposed on the surface of the valve action metal, or may be other layers disposed on the surface of the valve action metal or the valve action metal foil. The electric layer is preferably a layer composed of an oxide of the valve action metal itself.
可將於表面形成介電質被膜層之平板狀陽極基體之端部的一分區作為陽極部,將其餘部分作為陰極部。陽極部與陰極部之區分可使用絕緣樹脂帶(遮蔽(masking))。A portion of the end portion of the flat anode substrate on which the dielectric film layer is formed on the surface may be used as the anode portion, and the remaining portion may serve as the cathode portion. An insulating resin tape (masking) can be used to distinguish the anode portion from the cathode portion.
接著,於陰極部之介電質被膜層上形成固體電解質,但固體電解質層的種類並無特別限制,可使用以往周知之固體電解質,惟以導電率特別高之導電性高分子作為固體電解質所製作之固體電解電容器,與習知使用電解液之濕式電解電容器或使用二氧化錳之固體電解電容器相較,由於其等效串列電阻成分較低,大電容且小型化,且高頻性能良好,故較為理想。Then, a solid electrolyte is formed on the dielectric film layer of the cathode portion. However, the type of the solid electrolyte layer is not particularly limited, and a conventionally known solid electrolyte can be used, but a conductive polymer having a particularly high conductivity is used as the solid electrolyte. Compared with a solid electrolytic capacitor using a known electrolytic capacitor or a solid electrolytic capacitor using manganese dioxide, the solid electrolytic capacitor produced has a low equivalent series resistance component, a large capacitance and a small size, and high frequency performance. Good, so it is ideal.
形成本發明之固體電解電容器所使用之固體電解質的導電性聚合物雖無限定,惟較佳可列舉如具有π電子共軛系構造之導電性聚合物,例如包含以具有噻吩骨架之化合物、具有多環狀硫化物骨架之化合物、具有吡咯骨架之化合物、具有呋喃骨架之化合物等所示構造作為重複單元之導電性聚合物。The conductive polymer forming the solid electrolyte used in the solid electrolytic capacitor of the present invention is not limited, and preferably, for example, a conductive polymer having a π-electron conjugated structure, for example, a compound having a thiophene skeleton, A conductive polymer having a structure of a polycyclic sulfide skeleton, a compound having a pyrrole skeleton, a compound having a furan skeleton, or the like as a repeating unit.
作為導電性聚合物之原料所使用之單體中,具有噻吩骨架之化合物可列舉如:3-甲基噻吩、3-乙基噻吩、3-丙基噻吩、3-丁基噻吩、3-戊基噻吩、3-己基噻吩、3-庚基噻吩、3-辛基噻吩、3-壬基噻吩、3-癸基噻吩、3-氟噻吩、3-氯噻吩、3-溴噻吩、3-氰基噻吩、3,4-二甲基噻吩、3,4-二乙基噻吩、3,4-丁撐噻吩、3,4-甲二氧基噻吩、3,4-乙二氧基噻吩等衍生物。該等化合物一般可利用市售之化合物或以周知方法(例如Synthetic Metals誌、1986年、15卷、169頁)製備者。Among the monomers used as a raw material of the conductive polymer, the compound having a thiophene skeleton may, for example, be 3-methylthiophene, 3-ethylthiophene, 3-propylthiophene, 3-butylthiophene or 3-pentyl Thiophene, 3-hexylthiophene, 3-heptylthiophene, 3-octylthiophene, 3-mercaptothiophene, 3-mercaptothiophene, 3-fluorothiophene, 3-chlorothiophene, 3-bromothiophene, 3-cyano Derivatives such as thiophene, 3,4-dimethylthiophene, 3,4-diethylthiophene, 3,4-butylthiophene, 3,4-methyldioxythiophene, 3,4-ethylenedioxythiophene Things. Such compounds can generally be prepared using commercially available compounds or by well-known methods (e.g., Synthetic Metals, 1986, Vol. 15, p. 169).
此外,例如具有多環狀硫化物骨架之化合物可使用例如:具有1,3-二氫多環狀硫化物(別名:1,3-二氫苯并〔c〕噻吩)骨架之化合物、具有1,3-二氫萘并〔2,3-c〕噻吩骨架之化合物。此外,可列舉:具有1,3-二氫蒽并〔2,3-c〕噻吩骨架之化合物、具有1,3-二氫稠四苯并〔2,3-c〕噻吩骨架之化合物,可藉由周知方法,例如日本專利特開平8-3156號公報記載之方法製備。Further, for example, a compound having a polycyclic sulfide skeleton can be, for example, a compound having a skeleton of 1,3-dihydropolycyclic sulfide (alias: 1,3-dihydrobenzo[c]thiophene), having 1 a compound of the 3-dihydronaphtho[2,3-c]thiophene skeleton. Further, a compound having a 1,3-dihydroindolo[2,3-c]thiophene skeleton and a compound having a 1,3-dihydrofused tetrabenzo[2,3-c]thiophene skeleton may be mentioned. It is prepared by a method known in the art, for example, in the method described in JP-A-8-3156.
此外,例如具有1,3-二氫萘并〔1,2-c〕噻吩骨架之化合物、1,3-二氫菲并〔2,3-c〕噻吩衍生物、1,3-二氫稠三苯并〔2,3-c〕噻吩骨架之化合物、1,3-二氫苯并〔a〕蒽并〔7,8-c〕噻吩衍生物等。Further, for example, a compound having a 1,3-dihydronaphtho[1,2-c]thiophene skeleton, a 1,3-dihydrophenanthro[2,3-c]thiophene derivative, and a 1,3-dihydrogen thick a compound of a tribenzo[2,3-c]thiophene skeleton, a 1,3-dihydrobenzo[a]indolo[7,8-c]thiophene derivative or the like.
亦有於稠合環任意含有氮或N-氧化物之化合物,可列舉如:1,3-二氫噻吩并〔3,4-b〕喹啉、1,3-二氫噻吩并〔3,4-b〕喹啉-4-氧化物、1,3-二氫噻吩并〔3,4-b〕喹啉-4,9-二氧化物等,但並非限定於此。There are also compounds containing nitrogen or an N-oxide in the fused ring, and examples thereof include: 1,3-dihydrothieno[3,4-b]quinoline Porphyrin, 1,3-dihydrothieno[3,4-b]quinoline Porphyrin-4-oxide, 1,3-dihydrothieno[3,4-b]quin Porphyrin-4,9-dioxide or the like, but is not limited thereto.
此外,具有吡咯骨架之化合物可列舉如:3-甲基吡咯、3-乙基吡咯、3-丙基吡咯、3-丁基吡咯、3-戊基吡咯、3-己基吡咯、3-庚基吡咯、3-辛基吡咯、3-壬基吡咯、3-癸基吡咯、3-氟吡咯、3-氯吡咯、3-溴吡咯、3-氰基吡咯、3,4-二甲基吡咯、3,4-二乙基吡咯、3,4-丁撐吡咯、3,4-甲二氧基吡咯、3,4-乙二氧基吡咯等衍生物,惟並非限定於此。該等化合物可為市售品或以周知方法製備。Further, examples of the compound having a pyrrole skeleton include 3-methylpyrrole, 3-ethylpyrrole, 3-propylpyrrole, 3-butylpyrrole, 3-pentylpyrrole, 3-hexylpyrrole, and 3-heptyl group. Pyrrole, 3-octylpyrrole, 3-mercaptopyrrole, 3-mercaptopyrrole, 3-fluoropyrrole, 3-chloropyrrole, 3-bromopyrrole, 3-cyanopyrrole, 3,4-dimethylpyrrole, Derivatives such as 3,4-diethylpyrrole, 3,4-butylpyrrole, 3,4-methyldioxypyrrole, and 3,4-ethanedioxypyrrole are not limited thereto. These compounds can be prepared commercially or by known methods.
此外,具有呋喃骨架之化合物可列舉如:3-甲基呋喃、3-乙基呋喃、3-丙基呋喃、3-丁基呋喃、3-戊基呋喃、3-己基呋喃、3-庚基呋喃、3-辛基呋喃、3-壬基呋喃、3-癸基呋喃、3-氟呋喃、3-氯呋喃、3-溴呋喃、3-氰基呋喃、3,4-二甲基呋喃、3,4-二乙基呋喃、3,4-丁撐呋喃、3,4-甲二氧基呋喃、3,4-乙二氧基呋喃等衍生物,惟並非限定於此。該等化合物可為市售品或以周知方法製備。Further, examples of the compound having a furan skeleton include 3-methylfuran, 3-ethylfuran, 3-propylfuran, 3-butylfuran, 3-pentylfuran, 3-hexylfuran, and 3-heptyl group. Furan, 3-octylfuran, 3-mercaptofuran, 3-mercaptofuran, 3-fluorofuran, 3-chlorofuran, 3-bromofuran, 3-cyanofuran, 3,4-dimethylfuran, Derivatives such as 3,4-diethylfuran, 3,4-butanefuran, 3,4-methyldioxyfuran, and 3,4-ethanedioxyfuran are not limited thereto. These compounds can be prepared commercially or by known methods.
聚合方法可為電解聚合或化學氧化聚合或該等之組合。此外,亦可先於介電質被膜上形成非為導電性聚合物之固體電解質,接著以上述聚合方法形成導電性聚合物之方法。The polymerization process can be electrolytic polymerization or chemical oxidative polymerization or a combination of these. Further, a method in which a solid electrolyte other than a conductive polymer is formed on the dielectric film and then a conductive polymer is formed by the above polymerization method may be employed.
形成導電性聚合物之例可為將3,4-乙二氧基噻吩單體及氧化劑較好於溶液狀態下,分別前後或一起塗佈於介電質被膜上而形成之方法(日本專利特開平2-15611號公報或日本特開平10-32145號公報)等。The method of forming a conductive polymer may be a method in which a 3,4-ethylenedioxythiophene monomer and an oxidizing agent are preferably applied to a dielectric film separately or in a solution state in a solution state (Japanese Patent Application) Kaikai No. 2-15611 or Japanese Patent Laid-Open No. Hei 10-32145).
一般而言,導電性聚合物係使用具有摻雜(doping)能之化合物(摻雜物),摻雜物可添加於單體溶液與氧化劑溶液之任一者中,亦可為摻雜物與氧化劑成為同一化合物之有機磺酸金屬鹽之類者。摻雜物較好使用芳基磺酸鹽系摻雜物。例如,可使用苯磺酸、甲苯磺酸、萘磺酸、蒽磺酸、蒽醌磺酸等之鹽。In general, the conductive polymer uses a compound having a doping energy (dopant), and the dopant may be added to either the monomer solution or the oxidant solution, or may be a dopant and The oxidizing agent is an organic sulfonic acid metal salt of the same compound or the like. As the dopant, an aryl sulfonate-based dopant is preferably used. For example, a salt of benzenesulfonic acid, toluenesulfonic acid, naphthalenesulfonic acid, sulfonic acid, sulfonic acid or the like can be used.
如上述操作製成之固體電解質之電傳導度為約0.1至約200S/cm之範圍,較佳為約1至約150S/cm,更佳為約10至約100S/cm之範圍。The solid electrolyte produced as described above has an electrical conductivity in the range of from about 0.1 to about 200 S/cm, preferably from about 1 to about 150 S/cm, more preferably from about 10 to about 100 S/cm.
本發明係於由閥作用金屬構成之陽極基體表面之氧化被膜層層壓導電性高分子層之後,層壓碳糊層。所使用之碳糊一般係由碳粒子、氟樹脂及乙酸異戊酯等溶劑所構成的組成。組成碳糊層之成分並無特別限定。於形成導電性高分子層之後,藉由將因所期望予以再化成之陽極基體,例如浸漬於前述組成之碳糊,於其表面塗佈碳糊使其乾燥而層壓碳糊層。In the present invention, after the conductive polymer layer is laminated on the oxide film layer on the surface of the anode substrate made of the valve action metal, the carbon paste layer is laminated. The carbon paste to be used is generally composed of a solvent such as carbon particles, a fluororesin, and isoamyl acetate. The component constituting the carbon paste layer is not particularly limited. After the formation of the conductive polymer layer, the carbon paste is immersed in the above-described composition, for example, by immersing it in the carbon paste of the above composition, and the carbon paste is applied to the surface thereof to dry and laminate the carbon paste layer.
於陽極基體表面依序層壓氧化被膜層、及導電性高分子層,然後層壓碳糊層,該碳糊層之形成方法可列舉一般採用之本身周知之糊層形成方法,例如浸漬法、刷毛塗法、噴霧法、滾筒法、網版印刷法等。亦即,於形成有氧化被膜層之陽極基體層壓導電性高分子層而形成碳糊層的方法,係施行下列方法:將已形成氧化被膜層並於其上層壓導電性高分子層之陽極基體浸漬於碳糊後拉起之浸漬法、使含有碳糊之刷毛接觸前述陽極基體而塗佈的方法、藉由噴霧將碳糊噴附於前述陽極基體而塗佈的方法、將附著有碳糊之滾筒按壓前述陽極基體並使其旋轉而塗佈的方法、以及使碳糊由篩孔掉落於前述陽極基體上之網版印刷法等。The oxide film layer and the conductive polymer layer are sequentially laminated on the surface of the anode substrate, and then the carbon paste layer is laminated. The method for forming the carbon paste layer may be a conventionally known method for forming a paste layer, such as a dipping method. Brush coating method, spray method, roller method, screen printing method, and the like. In other words, a method of forming a carbon paste layer by laminating a conductive polymer layer on an anode substrate having an oxide film layer is performed by subjecting an oxide film layer to form an anode of a conductive polymer layer thereon. a method in which a substrate is immersed in a carbon paste and then immersed, a method in which a bristles containing a carbon paste are applied in contact with the anode substrate, a method in which a carbon paste is sprayed onto the anode substrate by spraying, and a method in which carbon is adhered A method in which the paste roller presses and rotates the anode substrate, and a screen printing method in which a carbon paste is dropped from the mesh hole on the anode substrate.
於層壓碳糊層之後,接著層壓銀糊層。本發明之較佳實施態樣中,形成層壓構造之銀糊係由銀粒子、氟樹脂、及乙酸異戊酯等溶劑、以及0.5質量%以下,較佳為0.3質量%以下之水所構成的組成。所塗佈之銀粒子的形狀雖無特別限制,但以薄片形狀為佳。本發明之特徵係在於形成層壓構造之的銀糊。亦即,本發明之固體電解電容器之特徵為:組成覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體而層壓之銀糊的含水量為0.5質量%以下、尤以0.3質量%以下為佳。該等組成銀糊之含水量若為0.5質量%以下即可,但以0.3質量%以下為佳,亦可為0.05質量%以下,以0.02質量%至0.3質量%最佳。After laminating the carbon paste layer, the silver paste layer is then laminated. In a preferred embodiment of the present invention, the silver paste forming the laminate structure is composed of a solvent such as silver particles, a fluororesin, and isoamyl acetate, and 0.5% by mass or less, preferably 0.3% by mass or less. Composition. The shape of the coated silver particles is not particularly limited, but is preferably a sheet shape. The invention is characterized by forming a silver paste in a laminated construction. That is, the solid electrolytic capacitor of the present invention is characterized in that the water content of the silver paste laminated by laminating the anode substrate with the oxide film layer, the conductive polymer layer and the carbon paste layer on the surface of the anode substrate is It is preferably 0.5% by mass or less, particularly preferably 0.3% by mass or less. The water content of the silver paste of the composition may be 0.5% by mass or less, preferably 0.3% by mass or less, more preferably 0.05% by mass or less, and most preferably 0.02% by mass to 0.3% by mass.
本發明之銀糊通常係由銀粒子、氟樹脂及乙酸異戊酯等溶劑所組成,可藉由混合該等構成成分予以調製。用於調製銀糊所使用之該等構成成分之混合比率,以對該等所組成之銀糊全體而言,通常銀粒子為45至65質量%、氟樹脂1至10質量%、以及乙酸異戊酯等溶劑30至50質量%。添加於銀糊之溶劑一般使用有機系溶劑,有機系溶劑係於調製銀糊時或藉由塗佈等而形成層壓構造時,會吸收空氣中的水分,而會使組成銀糊之含水量上升。因而層壓含水量上升之組成的銀糊而得之固體電解電容器的ESR不會充分降低。因此,所使用之有機溶劑較好係最初即為含水量0.5質量%以下之組成者。當必須將有機溶劑脫水時,例如,可利用使用沸石等脫水劑之方法或利用水易透過而有機溶劑難以透過之高分子膜的方法等予以脫水。藉由該等方法可降低有機溶劑中之含水量,而調製含水量為0.5質量%以下,較佳為0.3質量%以下之組成的銀糊。The silver paste of the present invention is usually composed of a solvent such as silver particles, a fluororesin, and isoamyl acetate, and can be prepared by mixing the constituent components. The mixing ratio of the constituent components used for the preparation of the silver paste is generally 45 to 65 mass% of the silver particles, 1 to 10 mass% of the fluororesin, and acetic acid equivalent for the entire silver paste composed of the silver paste. The solvent such as amyl ester is 30 to 50% by mass. The solvent to be added to the silver paste is generally an organic solvent. When the organic solvent is used to prepare a silver paste or when a laminate structure is formed by coating or the like, moisture in the air is absorbed, and the water content of the silver paste is formed. rise. Therefore, the ESR of the solid electrolytic capacitor obtained by laminating the silver paste having a composition having an increased water content is not sufficiently lowered. Therefore, the organic solvent to be used is preferably one which is initially composed of a water content of 0.5% by mass or less. When it is necessary to dehydrate the organic solvent, for example, it can be dehydrated by a method using a dehydrating agent such as zeolite or a method of permeable to water and a polymer film which is difficult to permeate the organic solvent. By such a method, the water content in the organic solvent can be lowered to prepare a silver paste having a composition of water content of 0.5% by mass or less, preferably 0.3% by mass or less.
所製成之含水量為0.5質量%,較佳為0.3質量%以下之組成的銀糊,較好保存於濕度30至60%,較佳為濕度30至50%,更佳為濕度30至40%,或者調整成該等以下濕度之密閉容器,例如乾燥器中為佳,亦可與矽膠等乾燥劑共存。此時之溫度以15至30℃為佳,21至27℃較佳,23至25℃更佳,亦可選擇其以下之溫度。調製前述組成之銀糊時或藉由塗佈等而形成層壓構造時,濕度以30至60%為佳,濕度30至50%更佳,濕度30至40%又更佳,或者選擇其以下之濕度亦可。此時之溫度以15至30℃為佳,21至27℃更佳,23至25℃又更佳,選擇其以下之溫度亦可。濕度為70%以上時,即使於溫度15至30℃的環境下,當使用前述組成之銀糊48小時以上時,會產生組成銀糊之含水量增大而超過0.5%之情形,而會有無法獲得本發明之ESR降低效果的情形。The silver paste having a composition having a water content of 0.5% by mass, preferably 0.3% by mass or less, is preferably stored at a humidity of 30 to 60%, preferably 30 to 50% by humidity, more preferably 30 to 40% by humidity. %, or a closed container adjusted to such humidity, preferably in a desiccator, or coexisting with a desiccant such as silicone. The temperature at this time is preferably 15 to 30 ° C, more preferably 21 to 27 ° C, more preferably 23 to 25 ° C, and the following temperatures may be selected. When the silver paste of the above composition is prepared or when a laminate structure is formed by coating or the like, the humidity is preferably 30 to 60%, the humidity is preferably 30 to 50%, the humidity is preferably 30 to 40%, or the following is selected. The humidity can also be. The temperature at this time is preferably 15 to 30 ° C, more preferably 21 to 27 ° C, and even more preferably 23 to 25 ° C. The temperature below may be selected. When the humidity is 70% or more, even in the environment of a temperature of 15 to 30 ° C, when the silver paste of the above composition is used for 48 hours or more, the water content of the composition silver paste increases and exceeds 0.5%, and there is a case where The case of the ESR reducing effect of the present invention cannot be obtained.
本發明之前述組成之銀糊係藉由塗佈等而層壓而形成層壓構造,但覆蓋前述陽極基體之邊的前述銀糊層較好比覆蓋該陽極基體之面的前述銀糊層更厚,或者覆蓋前述陽極基體之邊的前述銀糊層的厚度較好為10 μ m以上,尤其以10至200 μ m左右為佳。此外,本發明之固體電解電容器之製造方法,較佳者係具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體浸漬於前述組成之銀糊的步驟;以及於該陽極基體之邊以刷毛塗佈前述銀糊的步驟。The silver paste of the above composition of the present invention is laminated by lamination to form a laminated structure, but the silver paste layer covering the side of the anode substrate is preferably thicker than the silver paste layer covering the surface of the anode substrate. The thickness of the silver paste layer covering the side of the anode substrate is preferably 10 μm or more, particularly preferably about 10 to 200 μm. Further, in the method for producing a solid electrolytic capacitor of the present invention, preferably, an anode substrate having an oxide film layer, a conductive polymer layer, and a carbon paste layer laminated on the surface of the anode substrate is immersed in the silver of the above composition. a step of pasting; and a step of coating the silver paste with bristles on the side of the anode substrate.
於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層以及前述組成之銀糊層的固體電解電容器中,覆蓋該陽極基體之邊的前述銀糊層較覆蓋面之前述銀糊層更厚或者覆蓋該陽極基體之邊的前述銀糊層的厚度為10 μ m以上時,可獲得邊(緣)部具有足夠層厚度而面部層厚度受到抑制之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件,故較理想。In the solid electrolytic capacitor in which the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste layer of the above composition are sequentially laminated on the surface of the anode substrate composed of the valve action metal, the silver covering the side of the anode substrate When the paste layer is thicker than the silver paste layer of the cover surface or the thickness of the silver paste layer covering the side of the anode substrate is 10 μm or more, the edge portion can have a sufficient layer thickness and the thickness of the face layer can be suppressed. A solid electrolytic capacitor element having a low ESR (equivalent series resistance) and an increase in capacitance per unit volume is preferable.
於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層以及前述組成之銀糊層的固體電解電容器之製造方法中,具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體浸漬於前述組成之銀糊的步驟;以及於該陽極基體之邊以刷毛塗佈前述銀糊的步驟之製造方法,由於包含其面之部分或整體以浸漬法塗佈前述銀糊的步驟及於其邊以刷毛塗佈前述銀糊的步驟,因此前述銀糊層厚度不均的程度較小,因而可製造出每單位體積之電容較高而且ESR較低的固體電解電容器,故較為理想。In the method for producing a solid electrolytic capacitor in which an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer of the above composition are sequentially laminated on a surface of an anode substrate composed of a valve action metal, the anode base body is to be used. a step of immersing an anode substrate having an oxidized coating layer, a conductive polymer layer, and a carbon paste layer on the silver paste of the above composition in sequence; and manufacturing the step of coating the silver paste with bristles on the side of the anode substrate In the method, the step of coating the silver paste by a dipping method and the step of coating the silver paste with a bristles by a portion or a whole of the surface thereof, the thickness of the silver paste layer is small, and thus the film can be manufactured. It is preferable to have a solid electrolytic capacitor having a high capacitance per unit volume and a low ESR.
將於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體浸漬於前述組成之銀糊的步驟(浸漬步驟)、及於該陽極基體之邊以刷毛塗佈前述銀糊的步驟(刷毛塗佈步驟),該等浸漬步驟與刷毛塗佈步驟之任一者先實施均可。例如,於將前述陽極基體浸漬於前述銀糊之浸漬步驟之後,再實施於該陽極基體之邊以刷毛塗佈前述銀糊的刷毛塗佈步驟。所使用之刷毛並無特別限定,但以筆為佳,例如可使用市售之繪筆。經乾燥而得之該陽極基體之邊內(緣內)之前述銀糊層之厚度為10 μ m以上,尤以10至200 μ m為佳。a step of immersing an anode substrate having an oxide film layer, a conductive polymer layer, and a carbon paste layer on the surface of the anode substrate composed of a valve action metal in a silver paste of the above composition (impregnation step), and the anode The step of coating the silver paste with the bristles on the side of the substrate (bristle coating step) may be performed first by either of the immersing step and the bristles coating step. For example, after the anode substrate is immersed in the impregnation step of the silver paste, a bristle coating step of coating the silver paste with the bristles is performed on the side of the anode substrate. The bristles to be used are not particularly limited, but a pen is preferred, and for example, a commercially available stylus can be used. The thickness of the silver paste layer in the inner side (inside) of the anode substrate obtained by drying is 10 μm or more, particularly preferably 10 to 200 μm.
覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體之面的前述組成之銀糊層的形成方法,可列舉如:浸漬於貯槽中之前述銀糊後拉起之浸漬法、使含有前述銀糊之刷毛接觸其面而進行塗佈的刷毛塗佈法、藉由噴霧將前述銀糊噴附於其面而進行塗佈的噴霧方法、將附著有前述銀糊之滾筒按壓其面並使其旋轉而進行塗佈的滾筒法、以及使前述銀糊由篩孔掉落於其面之網版印刷法等。The method for forming the silver paste layer having the above-described composition in which the surface of the anode substrate is laminated on the surface of the anode substrate, and the surface of the anode layer of the carbon paste layer is laminated, for example, the silver immersed in the storage tank a dipping method in which the paste is pulled up, a brush coating method in which the bristles containing the silver paste are applied to the surface thereof, a spray method in which the silver paste is sprayed on the surface thereof by spraying, and a coating method is applied. A drum method in which the drum of the silver paste is pressed against the surface and rotated, and a screen printing method in which the silver paste is dropped by a sieve hole on the surface thereof.
覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體之邊的前述組成之銀糊層之形成方法,係由前述銀糊層之形成方法中適當選擇適於覆蓋邊之形成方法即可,上述適於覆蓋邊之前述銀糊層之形成方法可列舉如:浸漬於貯槽中之前述銀糊後拉起的浸漬法、使含有前述銀糊的刷毛接觸其邊而進行塗佈的刷毛塗佈方法、以及藉由噴霧將前述銀糊噴附於其邊而進行塗佈的噴霧方法等。A method for forming a silver paste layer having the above-described composition in which an oxide film layer, a conductive polymer layer, and an anode base of a carbon paste layer are laminated on the surface of an anode substrate, and is suitably formed by the method for forming the silver paste layer The method for forming the covering edge may be selected, and the method for forming the silver paste layer suitable for the covering edge may be, for example, a dipping method in which the silver paste is immersed in a storage tank, and a bristles containing the silver paste. A method of applying a brush to be applied while contacting the side, and a spraying method of applying the silver paste to the side by spraying, and the like.
如上所示,覆蓋於陽極基體表面依序層壓有氧化被膜層、導電性高分子層以及碳糊層之陽極基體之面部及/或邊(緣)部之前述組成之銀糊層的形成方法,只要可達成本發明之目的即可,並未特別特定,前述銀糊形成方法可列舉如藉刷毛或噴霧進行之塗佈、浸漬、印刷、液體噴霧、投射等,或將該等方法組合,只要於該等方法中分別適當選擇適合之形成方法即可。因此,例如可於以刷毛塗佈法塗佈於下緣部及側緣部後,浸漬包含面之部分,或者可僅浸漬下緣部,接著,再浸漬包含面之部分。由此可製造覆蓋邊之前述銀糊層較覆蓋面之前述銀糊層更厚或者覆蓋邊之前述銀糊層的厚度為10 μ m以上之較厚固體電解電容器。As described above, the method for forming a silver paste layer having the above-described composition of the surface portion and/or the edge portion of the anode substrate of the oxide film layer, the conductive polymer layer, and the carbon paste layer is laminated on the surface of the anode substrate. It is not particularly specific as long as it can achieve the purpose of the invention, and the silver paste forming method may be, for example, coating, dipping, printing, liquid spraying, projection, or the like by bristles or spray, or combining the methods. It suffices to appropriately select a suitable formation method in each of these methods. Therefore, for example, after coating the lower edge portion and the side edge portion by the brush coating method, the portion including the surface may be immersed, or only the lower edge portion may be immersed, and then the portion including the surface may be immersed. Thereby, a thick solid electrolytic capacitor having a thickness of the above-mentioned silver paste layer covering the edge of the silver paste layer or covering the side of the silver paste layer having a thickness of 10 μm or more can be produced.
如此所得之固體電解電容器元件通常係連接引線端子,並藉由施予例如樹脂模塑、樹脂外殼、金屬製外裝外殼、樹脂浸漬等之外裝,製成各種用途的電容器製品。此外,亦可進行層壓封裝。亦即,例如,將於由閥作用金屬構成之陽極基體表面依序層壓有氧化被膜層、導電性高分子層、碳糊層及銀糊層之陽極基體2至4片,層壓於例如引線架(lead frame)之後,將未形成有氧化被膜層、導電性高分子層、碳糊層及銀糊層之部位焊接於引線架,連接引線端子,並藉由施予例如樹脂模塑、樹脂外殼、金屬製外裝外殼、環氧樹脂浸漬等之外裝,即可製成各種用途的層壓固體電解電容器製品。The solid electrolytic capacitor element thus obtained is usually connected to a lead terminal, and is molded into a capacitor product of various uses by, for example, resin molding, a resin outer casing, a metal outer casing, resin impregnation, or the like. In addition, laminate packaging is also possible. That is, for example, 2 to 4 anode substrates of an oxide film layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are sequentially laminated on the surface of the anode substrate composed of a valve action metal, and laminated, for example, to After the lead frame, a portion where the oxide film layer, the conductive polymer layer, the carbon paste layer, and the silver paste layer are not formed is soldered to the lead frame, and the lead terminals are connected, and by, for example, resin molding, The resin outer casing, the metal outer casing, the epoxy resin impregnation, and the like can be used to form a laminated solid electrolytic capacitor product for various purposes.
以下顯示本發明之代表例,並進一步具體說明之。該等僅為用以說明之例示,本明並非受限於該等者。Representative examples of the invention are shown below and are further described in detail. These are for illustrative purposes only and are not intended to be limiting.
於以下之例中,等效串聯電阻(ESR)係使用惠普(Hewlett-Packard)公司製LCR測試儀4284A,以100kHz測定之。In the following examples, the equivalent series resistance (ESR) was measured at 100 kHz using an LCR tester 4284A manufactured by Hewlett-Packard.
於短軸方向3mm×長軸方向10mm、厚度約100 μ m之鋁化成箔(以下稱為化成箔)上,以遮罩材(耐熱性樹脂)形成周狀之寬度1mm的遮蔽,並分成陰極部與陽極部,將該化成箔之前端側分區部分的陰極部於電解液中通電、化成並水洗。接著,將陰極部浸漬於3,4-乙二氧基噻吩之異丙醇溶液1mol/L,接著,浸漬於氧化劑(過硫酸銨)與摻雜劑(萘-2-磺酸鈉)之混合水溶液中,以進行氧化聚合。反覆進行該含浸步驟及聚合步驟,於化成箔的微細孔內形成含摻雜劑之固體電解質層。將已形成含摻雜劑之固體電解質層的化成箔水洗,形成固體電解質層並進行熱風乾燥。於其上被覆碳糊,而形成元件材料。On aluminized foil (hereinafter referred to as a chemical conversion foil) having a short axis direction of 3 mm × a long axis direction of 10 mm and a thickness of about 100 μm, a masking material (heat resistant resin) was used to form a circumferential width of 1 mm, and was divided into cathodes. In the portion and the anode portion, the cathode portion of the partition portion on the end side before the formation of the foil is energized in the electrolytic solution, and is formed into a water wash. Next, the cathode portion was immersed in an isopropanol solution of 3,4-ethylenedioxythiophene at 1 mol/L, followed by immersion in a mixture of an oxidizing agent (ammonium persulfate) and a dopant (sodium naphthalene-2-sulfonate). In an aqueous solution, oxidative polymerization is carried out. The impregnation step and the polymerization step are repeated to form a dopant-containing solid electrolyte layer in the fine pores of the chemical conversion foil. The chemical conversion foil in which the solid electrolyte layer containing the dopant was formed was washed with water to form a solid electrolyte layer and dried by hot air. A carbon paste is coated thereon to form a component material.
另一方面,將銀粉85質量%與VITON橡膠(由偏二氟乙烯-四氟乙烯-六氟丙烯共聚物所構成之氟系橡膠)粉末15質量%混合作成組成導電糊之固形分。於其中添加作為溶劑之乙酸異戊酯,加以混練而調製形成固形分70質量%之組成的黏稠銀糊(A液:以下稱為「第1組成」)。此外,除了將固形分改為60質量%之組成之外,與A液同樣地調製其他組成之銀糊(B液:以下稱為「第2組成」)。於元件材料之碳糊層上分別滴下第1組成與第2組成之銀糊,確認潤濕性,結果確認第1組成之潤濕性低於第2組成之潤濕性。On the other hand, 85 mass% of the silver powder was mixed with 15 mass% of VITON rubber (fluorine-based rubber composed of a vinylidene fluoride-tetrafluoroethylene-hexafluoropropylene copolymer) powder to form a solid component constituting the conductive paste. The isoamyl acetate as a solvent was added thereto, and kneaded to prepare a viscous silver paste having a composition of 70% by mass of solid content (solution A: hereinafter referred to as "first composition"). In addition, a silver paste of another composition (B liquid: hereinafter referred to as "second composition") was prepared in the same manner as the liquid A except that the solid content was changed to a composition of 60% by mass. The silver paste of the first composition and the second composition was dropped on the carbon paste layer of the element material, and the wettability was confirmed. As a result, it was confirmed that the wettability of the first composition was lower than the wettability of the second composition.
備妥以陰極側為下方之方式安裝於支持構件之前述元件材料,朝向含有上述第1組成所成之銀糊(A液)的銀糊槽並使支持構件下降,而使元件材料之陰極側前端0.5mm(僅下緣)浸漬於前述銀糊中。接著,使支持構件上升而將元件材料由液中拉上,並予以溫風乾燥。接著,使支持構件下降,而使元件材料之陰極側3.3mm浸漬於上述第2組成所成之銀糊(B液)中。然後,使支持構件上升而將元件材料由液中拉起而予以乾燥。The element material attached to the support member so as to have the cathode side downward is prepared, and the silver paste groove containing the silver paste (liquid A) of the first composition is placed, and the support member is lowered to make the cathode side of the element material The front end of 0.5 mm (only the lower edge) was immersed in the aforementioned silver paste. Next, the support member is raised to pull the component material from the liquid and dried by warm air. Next, the support member was lowered, and 3.3 mm of the cathode side of the element material was immersed in the silver paste (liquid B) formed by the above second composition. Then, the support member is raised to draw the component material from the liquid and dried.
與實施例1同樣操作,備妥以陰極側為下方之方式安裝於支持構件之前述元件材料,將上述銀糊(A液:第1組成)塗佈於其陰極緣部(全緣),予以乾燥後,朝向含有銀糊(B液:第2組成)之銀糊槽並使支持構件下降,以使元件材料之陰極側前端3.3mm浸漬於銀糊中。接著,使支持構件上升而將元件材料由液中拉起並乾燥之。In the same manner as in the first embodiment, the element material attached to the support member is provided so that the cathode side is downward, and the silver paste (liquid A: first composition) is applied to the cathode edge portion (the entire edge). After drying, the silver paste was placed in a silver paste containing a silver paste (solution B: second composition), and the support member was lowered to immerse the front end of the element material at a side of 3.3 mm in the silver paste. Next, the support member is raised to pull the component material from the liquid and dry it.
與實施例1同樣操作,備妥以陰極側為下方之方式安裝於支持構件之前述元件材料,將上述銀糊(B液:第2組成)塗佈於其陰極面,予以乾燥後,朝向含有銀糊(A液:第1組成)的銀糊槽而使支持構件下降,以使元件材料之陰極側前端0.5mm(僅下緣)浸漬於銀糊中。接著,使支持構件上升而將元件材料由液中拉起並使其乾燥。In the same manner as in the first embodiment, the element material attached to the support member was prepared so that the cathode side was below, and the silver paste (liquid B: second composition) was applied to the cathode surface, dried, and then contained. The silver paste of the silver paste (liquid A: first composition) was lowered to lower the support member so that the front end of the cathode side of the element material was 0.5 mm (only the lower edge) was immersed in the silver paste. Next, the support member is raised to pull the component material from the liquid and dry it.
於實施例1中,除了使用第1組成之銀糊替代第2組成之外,其餘進行相同處理,以形成銀糊層。In Example 1, except that the silver paste of the first composition was used instead of the second composition, the same treatment was carried out to form a silver paste layer.
於實施例1中,除了使用第2組成之銀糊替代第1組成之銀糊外,其餘進行相同處理,以形成銀糊層。In Example 1, except that the silver paste of the second composition was used instead of the silver paste of the first composition, the same treatment was carried out to form a silver paste layer.
將上述各實施例及各比較例所製造之電容器元件,自支持構件切離,並以顯微鏡觀察銀糊層之厚度。結果示於表1。The capacitor element produced in each of the above Examples and Comparative Examples was cut away from the supporting member, and the thickness of the silver paste layer was observed with a microscope. The results are shown in Table 1.
此外,將實施例1之電容器元件4片層壓於引線架上,獲得額定電容220 μ F、額定電壓2V之固體電解電容器各50個。有關比較例所得之電容器元件,亦同樣地於引線架上層壓4片而獲得額定電容220 μ F、額定電壓2V之固體電解電容器各50個。使用250℃之迴焊爐,將如此所得之各50個固體電解電容器焊接於基板上,並測定等效串聯電阻(ESR)。結果示於表1。其中,ESR為9mΩ以下者設為合格值而以○標記(大於8mΩ而9mΩ以下者),特別良好之值以◎(8mΩ以下者)表示。此外,將ESR超過合格值者設為不合格值而以×(大於9mΩ者)標記。此外,層壓厚度係將4片電容器元件層壓於引線框後之元件層壓體的厚度。Further, 4 pieces of the capacitor element of Example 1 were laminated on a lead frame, and 50 solid electrolytic capacitors each having a rated capacity of 220 μF and a rated voltage of 2 V were obtained. Similarly, in the capacitor element obtained in the comparative example, four sheets were laminated on the lead frame to obtain 50 solid electrolytic capacitors each having a rated capacity of 220 μF and a rated voltage of 2 V. Each of the 50 solid electrolytic capacitors thus obtained was welded to the substrate using a reflow oven at 250 ° C, and the equivalent series resistance (ESR) was measured. The results are shown in Table 1. In the case where the ESR is 9 mΩ or less, the value is ○ mark (more than 8 mΩ and 9 mΩ or less), and the particularly good value is ◎ (8 mΩ or less). In addition, those whose ESR exceeds the qualified value are set as the unacceptable value and are marked with × (greater than 9 mΩ). Further, the laminate thickness is a thickness of the element laminate in which four capacitor elements are laminated on the lead frame.
但,表1中各例之銀糊層所形成圖案如下述。However, the pattern formed by the silver paste layer of each of the examples in Table 1 is as follows.
實施例1:低潤濕性(僅下緣)+高潤濕性實施例2:低潤濕性(全緣)+高潤濕性實施例3:高潤濕性+低潤濕性(僅下緣)比較例1:低潤濕性(僅下緣)+低潤濕性比較例2:高潤濕性(僅下緣)+高潤濕性Example 1: Low wettability (lower edge only) + high wettability Example 2: low wettability (total) + high wettability Example 3: high wettability + low wettability (only Lower edge) Comparative Example 1: Low wettability (lower edge only) + low wettability Comparative Example 2: High wettability (lower edge only) + high wettability
如比較例1所示,將低潤濕性之銀糊塗佈於面部與下緣部時,層壓厚度較大。因此,無法製造每單位體積之電容增大的電容器。另一方面,如比較例2所示,將高潤濕性之銀糊塗佈於面部與下緣部時,電容器之ESR較高。因而,如實施例1所示,藉由分別於下緣部塗佈低潤濕性之銀糊、於面部塗佈高潤濕性之銀糊,則層壓厚度較小,因此,可製造每單位體積之電容增大、而且ESR低的電容器。As shown in Comparative Example 1, when a silver paste having low wettability was applied to the face portion and the lower edge portion, the laminate thickness was large. Therefore, it is impossible to manufacture a capacitor having an increased capacitance per unit volume. On the other hand, as shown in Comparative Example 2, when the silver paste having high wettability was applied to the face portion and the lower edge portion, the ESR of the capacitor was high. Therefore, as shown in the first embodiment, by applying a silver paste having a low wettability to the lower edge portion and applying a silver paste having a high wettability to the face, the laminate thickness is small, and therefore, each of the laminates can be manufactured. A capacitor with a large capacitance per unit volume and a low ESR.
如以上之例所示,依據本發明之製造方法,電氣特性尤其是ESR獲得改善,而層壓厚度亦顯著改善。亦即,依據本發明,如以上之例所示,於陽極基體上形成銀糊之層壓構造時,藉由控制緣部之層厚度與面部之層厚度,可獲得低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。尤其可製造ESR(等效串聯電阻)安定且降低、元件厚度較小的電容器元件。使用對碳糊層之潤濕性不同之組成的2種銀糊,若於邊(緣)部塗佈潤濕性較低之組成者,於面部塗佈潤濕性較高之組成者,即整體可獲得所期望的層厚度。As shown in the above examples, according to the manufacturing method of the present invention, electrical characteristics, particularly ESR, are improved, and laminate thickness is also remarkably improved. That is, according to the present invention, as shown in the above example, when the laminated structure of the silver paste is formed on the anode substrate, low ESR (equivalent series resistance) can be obtained by controlling the layer thickness of the edge portion and the layer thickness of the face portion. And a solid electrolytic capacitor element in which the capacitance per unit volume is increased. In particular, a capacitor element in which the ESR (equivalent series resistance) is stabilized and reduced and the thickness of the element is small can be manufactured. When two kinds of silver pastes having different wettability to the carbon paste layer are used, if a component having a low wettability is applied to the edge (edge) portion, a component having a high wettability is applied to the face, that is, The desired layer thickness is obtained overall.
首先,將藉由蝕刻而表面積增大之鋁箔切斷成3mm×10mm之細長形,將細長形鋁箔之下半部分與電極浸漬於溫度80℃、濃度10%之己二酸銨水溶液中,於兩者之間施加10分鐘的3V電壓以流通電流,藉此化成鋁箔,而於箔下半部分的表面形成氧化鋁之衍生物被膜。First, the aluminum foil having an increased surface area by etching is cut into an elongated shape of 3 mm × 10 mm, and the lower half of the elongated aluminum foil and the electrode are immersed in an aqueous solution of ammonium adipate having a temperature of 80 ° C and a concentration of 10%. A voltage of 3 V was applied for 10 minutes to flow a current therebetween, thereby forming an aluminum foil, and a film of a derivative of alumina was formed on the surface of the lower half of the foil.
接著進行將化成之鋁箔浸漬於溶有3,4-乙二氧基噻吩之異丙醇溶液後,予以乾燥的步驟、以及浸漬於溶有蒽醌磺酸鈉及過硫酸銨之水溶液後,予以乾燥的步驟,藉由反覆進行上述步驟使聚3,4-乙二氧基噻吩之導電性高分子層附著於介電質被膜上。Then, the aluminum foil obtained by immersing it in an isopropyl alcohol solution in which 3,4-ethylenedioxythiophene is dissolved is dried, and after being immersed in an aqueous solution containing sodium sulfonate and ammonium persulfate, In the drying step, the conductive polymer layer of the poly 3,4-ethylenedioxythiophene is attached to the dielectric film by repeating the above steps.
再將已形成導電性高分子層的箔與電極浸漬於溫度80℃、濃度10%之己二酸銨水溶液中,施加1分鐘的3V電壓使介電質被膜再化成。將經再化成之鋁箔浸漬於由重量比率為7%之碳粒子、重量比率為3%之氟樹脂及重量比率為90%之乙酸異戊酯所構成之組成的碳糊中,藉此於鋁箔表面塗佈碳糊。碳糊之黏度為60cpoise。所塗佈的碳粒子係由粒徑10至100nm的粒子與粒徑0.8至8 μ m的粒子所構成,該重量比率為30:70。以130℃之溫度乾燥10分鐘後,碳糊層的厚度為5 μ m,碳糊層中所含碳粒子的重量比率為70%。Further, the foil and the electrode on which the conductive polymer layer was formed were immersed in an aqueous solution of ammonium adipate having a temperature of 80 ° C and a concentration of 10%, and a dielectric voltage of 3 V was applied for 1 minute to re-form the dielectric film. The re-formed aluminum foil is immersed in a carbon paste composed of carbon particles having a weight ratio of 7%, a fluororesin having a weight ratio of 3%, and isoamyl acetate having a weight ratio of 90%, thereby being used for the aluminum foil. The surface is coated with carbon paste. The viscosity of the carbon paste is 60 cpoise. The coated carbon particles were composed of particles having a particle diameter of 10 to 100 nm and particles having a particle diameter of 0.8 to 8 μm, and the weight ratio was 30:70. After drying at a temperature of 130 ° C for 10 minutes, the thickness of the carbon paste layer was 5 μm, and the weight ratio of carbon particles contained in the carbon paste layer was 70%.
接著將已塗佈碳糊的鋁箔浸漬於由重量比率為54%之銀粒子、重量比率為6%之氟樹脂及重量比率為40%之乙酸異戊酯所構成之組成的銀糊中,藉此於鋁箔表面塗佈銀糊。銀糊之黏度為400cpoise。所塗佈之銀粒子的形狀為薄片狀,長軸方向的長度為1至5 μ m。於130℃之溫度下乾燥10分鐘後,銀糊層之厚度為15 μ m,銀糊層中所含銀粒子的重量比率為90%。Next, the carbon paste-coated aluminum foil was immersed in a silver paste composed of silver particles having a weight ratio of 54%, a fluororesin having a weight ratio of 6%, and isoamyl acetate having a weight ratio of 40%. This is coated with a silver paste on the surface of the aluminum foil. The viscosity of the silver paste is 400 cpoise. The coated silver particles have a sheet shape and have a length in the long axis direction of 1 to 5 μm. After drying at a temperature of 130 ° C for 10 minutes, the thickness of the silver paste layer was 15 μm, and the weight ratio of the silver particles contained in the silver paste layer was 90%.
於以浸漬法塗佈銀糊之鋁箔之邊,藉由刷毛塗佈以浸漬法所塗佈之銀糊後,以130℃之溫度乾燥10分鐘。The silver paste applied by the dipping method was applied to the side of the aluminum foil coated with the silver paste by dipping, and then dried at a temperature of 130 ° C for 10 minutes.
藉由刷毛之塗佈係使用塗抹水性繪具之市售繪筆(筆毛長度約2cm)作為刷毛,將繪筆浸漬於銀糊之後,以容器之壁將繪筆所含之銀糊充分去除,將繪筆筆頭由斜上方輕輕接觸箔之邊,使繪筆與邊平行移動,而將微量的銀糊塗佈於邊附近(距離邊1mm以內)。The bristles are coated with a commercially available paint pen (with a length of about 2 cm) of the water-based paint, and the stylus is immersed in the silver paste, and the silver paste contained in the paint pen is completely removed by the wall of the container. The pen tip is gently touched by the edge of the foil from the upper side to make the pen move parallel to the side, and a small amount of silver paste is applied near the side (within 1 mm from the side).
將已塗佈銀糊的鋁箔埋入二液混合硬化型樹脂中,將硬化後樹脂以1mm間隔切斷,以光學顯微鏡觀察鋁箔之剖面,藉此測定鋁箔面內之銀糊層之厚度分布。結果,銀糊層的厚度大部分為15 μ m。此外,測定鋁箔邊內的銀糊層厚度,為23至38 μ m。The aluminum foil to which the silver paste was applied was embedded in a two-liquid mixed-hardening resin, and the resin was cut at intervals of 1 mm after hardening, and the cross section of the aluminum foil was observed under an optical microscope to measure the thickness distribution of the silver paste layer in the surface of the aluminum foil. As a result, the thickness of the silver paste layer was mostly 15 μm. Further, the thickness of the silver paste layer in the side of the aluminum foil was measured and found to be 23 to 38 μm.
將2片依序層壓有氧化鋁層、導電性高分子層、碳糊層及銀糊層之鋁箔層壓於引線框之上之後,將未形成有氧化鋁層、導電性高分子層、碳糊層及銀糊層之部位焊接於引線框,層壓後之鋁箔以環氧樹脂封裝,藉此製造電容器的晶片。After laminating two aluminum foils in which an aluminum oxide layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are laminated on a lead frame, an aluminum oxide layer and a conductive polymer layer are not formed. The portions of the carbon paste layer and the silver paste layer are welded to the lead frame, and the laminated aluminum foil is encapsulated with epoxy resin, thereby manufacturing a wafer of the capacitor.
以LCR測試儀評估電容器之結果,電容係120Hz時為102.6 μ F,ESR係100 kHz時為7.4m Ω。此外對100個電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的電容器為100個。The results of the capacitors evaluated by the LCR tester were 102.6 μF for the 120 Hz capacitor and 7.4 mΩ for the ESR at 100 kHz. Further, as a result of measuring a leakage current by applying 2 V to 100 capacitors, there were 100 capacitors having a leakage current of 5 μA or less.
與實施例4同樣操作,以分配器(dispenser)將以浸漬法塗佈之銀糊塗佈於經浸漬法塗佈銀糊之鋁箔的邊之後,以130℃之溫度乾燥10分鐘。以分配器進行之塗佈係使分配器的前端接觸箔之邊,並使其以等速度與邊平行移動,同時以一定速度使銀糊流出,藉此將大致一定厚度的銀糊塗佈於邊。測定鋁箔之面內及邊內之銀糊層厚度,分別為14至18 μ m及25至34 μ m。In the same manner as in Example 4, the silver paste coated by the dipping method was applied to the side of the aluminum foil coated with the silver paste by a dipping method, and then dried at a temperature of 130 ° C for 10 minutes. The coating by the dispenser is such that the front end of the dispenser contacts the edge of the foil and moves it parallel to the side at a constant speed while flowing the silver paste at a constant speed, thereby applying a silver paste of a substantially constant thickness to the side. . The thickness of the silver paste layer in the in-plane and in the side of the aluminum foil was measured to be 14 to 18 μm and 25 to 34 μm, respectively.
將2片依序層壓有氧化鋁層、導電性高分子層、碳糊層及銀糊層之鋁箔層壓於引線框上後,將未形成有氧化鋁層、導電性高分子層、碳糊層及銀糊層之部位焊接於引線框,將層壓後的鋁箔以環氧樹脂封裝,藉此製造電容器的晶片。After laminating two aluminum foils in which an aluminum oxide layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are laminated on a lead frame, an aluminum oxide layer, a conductive polymer layer, and carbon are not formed. The portions of the paste layer and the silver paste layer were welded to the lead frame, and the laminated aluminum foil was encapsulated with an epoxy resin to fabricate a wafer of the capacitor.
以LCR測試儀評估電容器的結果,電容係120Hz時為101.5 μ F,ESR係100kHz時為7.4m Ω。此外對100個電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的電容器為100個。The results of the capacitors evaluated by the LCR tester were 101.5 μF for the 120 Hz capacitor and 7.4 mΩ for the ESR system at 100 kHz. Further, as a result of measuring a leakage current by applying 2 V to 100 capacitors, there were 100 capacitors having a leakage current of 5 μA or less.
首先,對以與實施例4相同方法形成導電性高分子層及碳糊層之鋁箔,使用繪筆作為刷毛,將繪筆浸漬於與實施例4相同之銀糊後,於未充分去除銀糊的情況下,以使繪筆筆腹按壓箔之方式進行塗佈並予以乾燥。測定鋁箔面內銀糊層之厚度分布結果,銀糊層厚度為8至55 μ m。First, the aluminum foil in which the conductive polymer layer and the carbon paste layer were formed in the same manner as in Example 4 was immersed in the same silver paste as in Example 4 using a stylus as a bristles, and the silver paste was not sufficiently removed. In the case of coating, the pen is pressed and pressed to dry the foil. The thickness distribution of the silver paste layer in the aluminum foil was measured, and the thickness of the silver paste layer was 8 to 55 μm.
接著以與實施例4相同方法製造電容器之晶片,以LCR測試儀評估電容器的結果,電容係120Hz時為103.3 μ F,ESR係100kHz時為7.7m Ω。此外對100個電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的電容器為100個。Next, a wafer of a capacitor was fabricated in the same manner as in Example 4, and the result of the capacitor was evaluated by an LCR tester, which was 103.3 μF at 120 Hz and 7.7 mΩ at 100 kHz for ESR. Further, as a result of measuring a leakage current by applying 2 V to 100 capacitors, there were 100 capacitors having a leakage current of 5 μA or less.
首先,對以與實施例4相同方法形成導電性高分子層及碳糊層之鋁箔,以浸漬法塗佈與實施例4相同的銀糊,並予以乾燥。測定鋁箔面內之銀糊層的厚度分布之結果,銀糊層厚度為25至37 μ m。此外,測定鋁箔邊內銀糊層之厚度分布之結果,銀糊層厚度為12至40 μ m。First, an aluminum foil having a conductive polymer layer and a carbon paste layer formed in the same manner as in Example 4 was coated with the same silver paste as in Example 4 by dipping, and dried. As a result of measuring the thickness distribution of the silver paste layer in the surface of the aluminum foil, the thickness of the silver paste layer was 25 to 37 μm. Further, as a result of measuring the thickness distribution of the silver paste layer in the edge of the aluminum foil, the thickness of the silver paste layer was 12 to 40 μm.
接著以與實施例4相同方法製造電容器之晶片,以LCR測試儀評估電容器的結果,電容係120Hz時為103.3 μ F,ESR係100kHz時為25.7mΩ。此外對100個電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的電容器為100個。Next, a wafer of a capacitor was fabricated in the same manner as in Example 4, and the result of the capacitor was evaluated by an LCR tester, which was 103.3 μF at 120 Hz and 25.7 mΩ at 100 kHz ESR. Further, as a result of measuring a leakage current by applying 2 V to 100 capacitors, there were 100 capacitors having a leakage current of 5 μA or less.
實施例4、5及比較例3、4所得之電容器的評估結果示於表2。The evaluation results of the capacitors obtained in Examples 4 and 5 and Comparative Examples 3 and 4 are shown in Table 2.
如以上之例所示,依據本發明,電氣特性尤其是ESR獲得改善,且銀糊層之厚度分布亦顯著改善。亦即,依據本發明,如以上之例所示,可獲得邊(緣)部具有足夠層厚度同時面部之層厚度受到抑制之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。依據本發明,如以上之例所示,藉由具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟;以及於該陽極基體之邊以刷毛塗佈銀糊之步驟的製造方法,而可提供一種銀糊層厚度不勻程度較小,因此每單位體積之電容增高且ESR低之電容器。As shown in the above examples, according to the present invention, electrical characteristics, particularly ESR, are improved, and the thickness distribution of the silver paste layer is also remarkably improved. That is, according to the present invention, as shown in the above examples, it is possible to obtain a low ESR (equivalent series resistance) in which the edge portion has a sufficient layer thickness while the layer thickness of the face is suppressed and the capacitance per unit volume is increased. Solid electrolytic capacitor component. According to the present invention, as shown in the above examples, the step of immersing the anode substrate in which the oxide film layer, the conductive polymer layer, and the carbon paste layer are sequentially laminated on the surface of the anode substrate is immersed in the silver paste; The side of the anode substrate is a method of manufacturing a silver paste by brushing, and a capacitor having a small thickness unevenness of the silver paste layer and thus having a high capacitance per unit volume and a low ESR can be provided.
首先,將藉由蝕刻增大表面積之鋁箔切斷成3mm×10mm的細長形,將細長形鋁箔的下半部分與電極浸漬於溫度80℃、濃度10%之己二酸銨水溶液中,於兩者之間施加3V電壓10分鐘以流通電流,藉此化成鋁箔,而於箔之下半部分的表面形成氧化鋁之衍生物被膜。First, an aluminum foil having a surface area increased by etching is cut into an elongated shape of 3 mm × 10 mm, and the lower half of the elongated aluminum foil and the electrode are immersed in an aqueous solution of ammonium adipate having a temperature of 80 ° C and a concentration of 10%. A voltage of 3 V was applied between them for 10 minutes to flow an electric current, thereby forming an aluminum foil, and a film of a derivative of alumina was formed on the surface of the lower half of the foil.
繼之,藉由反覆進行:將接著所化成之鋁箔浸漬於溶有3,4-乙二氧基噻吩之異丙醇溶液後予以乾燥的步驟、以及浸漬於溶有蒽醌磺酸鈉及過硫酸銨溶解之水溶液後予以乾燥的步驟,藉重複該等步驟而使聚3,4-乙二氧基噻吩的導電性高分子層附著於介電質被膜上。Then, by repeating: a step of immersing the formed aluminum foil in an isopropyl alcohol solution in which 3,4-ethylenedioxythiophene is dissolved, and immersing in sodium sulfonate The step of drying the aqueous solution in which the ammonium sulfate is dissolved is carried out, and the conductive polymer layer of the poly 3,4-ethylenedioxythiophene is adhered to the dielectric film by repeating the steps.
此外將已形成導電性高分子層之箔與電極浸漬於溫度80℃、濃度10%之己二酸銨水溶液中,施加3V電壓1分鐘使介電質被膜再化成。將經再化成之鋁箔浸漬於以7質量%之碳粒子、3質量%之氟樹脂及90質量%之乙酸異戊酯的比率所構成之組成的碳糊中,藉此於鋁箔表面塗佈碳糊。碳糊的黏度為60cpoise。所塗佈的碳粒子係由粒徑10至100nm的粒子與粒徑0.8至8 μ m的粒子所構成,該質量比為30:70。以130℃之溫度乾燥10分鐘後,碳糊層的厚度為9 μ m,碳糊層中所含碳粒子的比率為74質量%。Further, the foil and the electrode on which the conductive polymer layer was formed were immersed in an aqueous solution of ammonium adipate having a temperature of 80 ° C and a concentration of 10%, and a voltage of 3 V was applied for 1 minute to re-form the dielectric film. The re-formed aluminum foil is immersed in a carbon paste having a composition of 7% by mass of carbon particles, 3% by mass of fluororesin, and 90% by mass of isoamyl acetate, thereby coating carbon on the surface of the aluminum foil. paste. The carbon paste has a viscosity of 60 cpoise. The coated carbon particles are composed of particles having a particle diameter of 10 to 100 nm and particles having a particle diameter of 0.8 to 8 μm, and the mass ratio is 30:70. After drying at a temperature of 130 ° C for 10 minutes, the thickness of the carbon paste layer was 9 μm, and the ratio of carbon particles contained in the carbon paste layer was 74% by mass.
接著,將已塗佈碳糊的鋁箔浸漬於以55.7質量%之銀粒子、5.9質量%之氟樹脂及38.1質量%之乙酸異戊酯及0.3質量%之水的比率所構成之組成的銀糊中,藉此於鋁箔表面塗佈銀糊。該質量比率係以熱重量測定機(日本Rigaku公司TG8129)與卡費雪水分測定儀(Karl Fischer Moisture Titrator)(KEM公司MKS-500)所測定之重量。銀糊之黏度為400cpoise。所塗佈之銀粒子的形狀為薄片狀(flake),長軸方向之長度為1至5 μ m。於130℃之溫度下乾燥10分鐘後,銀糊層之厚度為13 μ m,銀糊層中所含之銀粒子為90質量%。Next, the carbon paste-coated aluminum foil was immersed in a silver paste composed of a ratio of 55.7 mass% of silver particles, 5.9% by mass of fluororesin, and 38.1% by mass of isoamyl acetate and 0.3% by mass of water. Thereby, a silver paste is applied to the surface of the aluminum foil. The mass ratio was measured by a thermogravimetric measuring machine (Japan Rigaku Corporation TG8129) and a Karl Fischer Moisture Titrator (KEM MKS-500). The viscosity of the silver paste is 400 cpoise. The coated silver particles have a flake shape and a length in the long axis direction of 1 to 5 μm. After drying at a temperature of 130 ° C for 10 minutes, the thickness of the silver paste layer was 13 μm, and the silver particles contained in the silver paste layer were 90% by mass.
於以浸漬法塗佈銀糊後之鋁箔的邊,以刷毛塗佈經浸漬法塗佈之銀糊,並以130℃之溫度乾燥10分鐘以刷毛進行之塗佈係使用塗抹水性繪具用之市售繪筆(筆毛長度約2cm)作為刷毛,將繪筆浸漬於銀糊之後,以容器之壁將繪筆所含之銀糊充分去除,將繪筆筆頭由斜上方輕輕接觸箔的邊,並使繪筆與邊平行移動,而將微量的銀糊塗佈於邊附近(距離邊1mm以內)。Coating the silver paste coated with the silver paste by the dipping method, coating the silver paste coated with the immersion method, and drying at a temperature of 130 ° C for 10 minutes to apply the bristles by using the smear-painting tool. Commercially available paint pen (with a length of about 2cm) is used as the bristles. After the stylus is immersed in the silver paste, the silver paste contained in the stylus is completely removed by the wall of the container, and the tip of the stylus is gently touched by the foil from the upper side. Edge, and move the pen parallel to the side, and apply a small amount of silver paste near the side (within 1 mm from the side).
其中,銀糊於使用之前係保管於濕度調整於30%以下之乾燥器中。保管溫度為24℃。此外,當塗佈銀糊時,將周圍濕度設定於40%、溫度設定於24℃。Among them, the silver paste is stored in a dryer whose humidity is adjusted to 30% or less before use. The storage temperature is 24 °C. Further, when the silver paste was applied, the ambient humidity was set to 40% and the temperature was set to 24 °C.
將已塗佈銀糊之鋁箔埋入二液混合硬化型樹脂中,將硬化後樹脂以1mm間隔切斷,以光學顯微鏡觀察鋁箔之剖面,藉此測定鋁箔面內銀糊層之厚度分布。結果,銀糊層的厚度大部分為16 μ m。測定鋁箔邊內銀糊層之厚度,為24至30 μ m。The aluminum foil coated with the silver paste was embedded in a two-liquid mixed-hardening resin, and the cured resin was cut at intervals of 1 mm, and the cross section of the aluminum foil was observed under an optical microscope to measure the thickness distribution of the silver paste layer in the aluminum foil. As a result, the thickness of the silver paste layer was mostly 16 μm. The thickness of the silver paste layer in the side of the aluminum foil was measured and found to be 24 to 30 μm.
將2片依序層壓有氧化鋁層、導電性高分子層、碳糊層及銀糊層之鋁箔層壓於引線框上後,將未形成有氧化鋁層、導電性高分子層、碳糊層及銀糊層之部位焊接於引線框,將層壓後之鋁箔以環氧樹脂封裝,藉此製造電容器的晶片。After laminating two aluminum foils in which an aluminum oxide layer, a conductive polymer layer, a carbon paste layer, and a silver paste layer are laminated on a lead frame, an aluminum oxide layer, a conductive polymer layer, and carbon are not formed. The portions of the paste layer and the silver paste layer are welded to the lead frame, and the laminated aluminum foil is encapsulated with an epoxy resin, thereby manufacturing a wafer of the capacitor.
以LCR測試儀評估100個固體電解電容器之結果,120Hz之電容平均值為102.6 μ F,100kHz之ESR平均值為6.3mΩ。此外對100個固體電解電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的固體電解電容器為100個。The results of evaluating 100 solid electrolytic capacitors with an LCR tester showed an average capacitance of 102.6 μF at 120 Hz and an average ESR of 6.3 mΩ at 100 kHz. Further, as a result of measuring a leak current by applying 2 V to 100 solid electrolytic capacitors, there were 100 solid electrolytic capacitors having a leakage current of 5 μA or less.
與實施例6同樣操作,於形成於鋁箔之介電質被膜上依序形成導電性高分子層及碳糊層。In the same manner as in Example 6, a conductive polymer layer and a carbon paste layer were sequentially formed on the dielectric film formed on the aluminum foil.
接著,將已塗佈碳糊之鋁箔浸漬於以55.9質量%之銀粒子、5.9質量%之氟樹脂及38.1質量%之乙酸異戊酯及0.1質量%之水的比率所構成之組成的銀糊中,藉此於鋁箔表面塗佈銀糊。質量比率係以熱重量測定機(日本Rigaku公司TG8129)與卡費雪水分測定儀(KEM公司MKS-500)所測定的重量。Next, the carbon paste-coated aluminum foil was immersed in a silver paste composed of a ratio of 55.9 mass% of silver particles, 5.9% by mass of fluororesin, and 38.1% by mass of isoamyl acetate and 0.1% by mass of water. Thereby, a silver paste is applied to the surface of the aluminum foil. The mass ratio was measured by a thermogravimetric measuring machine (Japan Rigaku Corporation TG8129) and a Kafushi Moisture Analyzer (KEM MKS-500).
再者,與實施例6同樣操作,於鋁箔的邊藉由刷毛塗佈銀糊之後,製造固體電解電容器。Further, in the same manner as in Example 6, a silver paste was applied to the edges of the aluminum foil by the bristles, and then a solid electrolytic capacitor was produced.
以LCR測試儀評估100個固體電解電容器之結果,120Hz之電容平均值為103.5 μ F,100kHz之ESR平均值為6.4mΩ。此外對100個固體電解電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的固體電解電容器為100個。The results of evaluating 100 solid electrolytic capacitors with an LCR tester showed an average capacitance of 103.5 μF at 120 Hz and an average ESR of 6.4 mΩ at 100 kHz. Further, as a result of measuring a leak current by applying 2 V to 100 solid electrolytic capacitors, there were 100 solid electrolytic capacitors having a leakage current of 5 μA or less.
與實施例6同樣操作,於形成於鋁箔之介電質被膜上依序形成導電性高分子層及碳糊層。In the same manner as in Example 6, a conductive polymer layer and a carbon paste layer were sequentially formed on the dielectric film formed on the aluminum foil.
接著,將已塗佈碳糊之鋁箔浸漬於以55.7質量%之銀粒子、5.9質量%之氟樹脂及37.6質量%之乙酸異戊酯及0.8質量%之水的比率所構成之組成的銀糊中,藉此於鋁箔表面塗佈銀糊。質量比率係以熱重量測定機(日本Rigaku公司TG8129)與卡費雪水分測定儀(KEM公司MKS-500)所測定的重量。Next, the carbon paste-coated aluminum foil was immersed in a silver paste composed of a ratio of 55.7 mass% of silver particles, 5.9% by mass of fluororesin, and 37.6 mass% of isoamyl acetate and 0.8% by mass of water. Thereby, a silver paste is applied to the surface of the aluminum foil. The mass ratio was measured by a thermogravimetric measuring machine (Japan Rigaku Corporation TG8129) and a Kafushi Moisture Analyzer (KEM MKS-500).
再者,與實施例6同樣操作,於鋁箔之邊藉由刷毛塗佈銀糊後,製造固體電解電容器。Further, in the same manner as in Example 6, a silver paste was applied to the edge of the aluminum foil by the bristles to prepare a solid electrolytic capacitor.
以LCR測試儀評估100個固體電解電容器之結果,120Hz之電容平均值為101.8 μ F,100kHz之ESR平均值為8.4mΩ。此外對100個固體電解電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的固體電解電容器為100個。As a result of evaluating 100 solid electrolytic capacitors with an LCR tester, the average capacitance at 120 Hz was 101.8 μF, and the average ESR at 100 kHz was 8.4 mΩ. Further, as a result of measuring a leak current by applying 2 V to 100 solid electrolytic capacitors, there were 100 solid electrolytic capacitors having a leakage current of 5 μA or less.
與實施例6同樣操作,於形成於鋁箔之介電質被膜上依序形成導電性高分子層及碳糊層。In the same manner as in Example 6, a conductive polymer layer and a carbon paste layer were sequentially formed on the dielectric film formed on the aluminum foil.
接著,將已塗佈碳糊之鋁箔浸漬於以55.9質量%之銀粒子、5.9質量%之氟樹脂及35.1質量%之乙酸異戊酯及3.1質量%之水的比率所構成之組成的銀糊中,藉此於鋁箔表面塗佈銀糊。質量比率係以熱重量測定機(日本Rigaku公司TG8129)與卡費雪水分測定儀(KEM公司MKS-500)所測定的重量。Next, the carbon paste-coated aluminum foil was immersed in a silver paste composed of a ratio of 55.9 mass% of silver particles, 5.9% by mass of fluororesin, and 35.1% by mass of isoamyl acetate and 3.1% by mass of water. Thereby, a silver paste is applied to the surface of the aluminum foil. The mass ratio was measured by a thermogravimetric measuring machine (Japan Rigaku Corporation TG8129) and a Kafushi Moisture Analyzer (KEM MKS-500).
再者,與實施例6同樣操作,於鋁箔之邊以刷毛塗佈銀糊後,製造固體電解電容器。Further, in the same manner as in Example 6, a silver paste was applied to the side of the aluminum foil with a brush to prepare a solid electrolytic capacitor.
以LCR測試儀評估100個固體電解電容器之結果,120Hz之電容平均值為101.8 μ F,100kHz之ESR平均值為9.0m Ω。此外對100個固體電解電容器施加2V而測定漏電流之結果,漏電流為5 μ A以下的固體電解電容器為100個。The results of evaluating 100 solid electrolytic capacitors with an LCR tester showed an average capacitance of 101.8 μF at 120 Hz and an average ESR of 9.0 m Ω at 100 kHz. Further, as a result of measuring a leak current by applying 2 V to 100 solid electrolytic capacitors, there were 100 solid electrolytic capacitors having a leakage current of 5 μA or less.
於實施例6、7及比較例5、6中所得之固體電解電容器的評估結果示於表3。The evaluation results of the solid electrolytic capacitors obtained in Examples 6 and 7 and Comparative Examples 5 and 6 are shown in Table 3.
如以上之例所示,藉由層壓含水量0.5質量%以下,尤其是0.3質量%以下之組成的銀糊,藉此可製造出ESR充分低的固體電解電容器。As shown in the above examples, a silver paste having a composition having a water content of 0.5% by mass or less, particularly 0.3% by mass or less, is laminated, whereby a solid electrolytic capacitor having a sufficiently low ESR can be produced.
本發明係提供一種於表面具有碳糊層之陽極基體上形成銀糊之層壓構造之ESR(等效串聯電阻)充分低而且每單位體積之電容增大的固體電解電容器。本發明係藉由控制於表面具有碳糊層之陽極基體上形成層壓構造之銀糊的組成或層厚度,而獲得低ESR、高電容之固體電解電容器元件。若使用對碳糊層潤濕性不同之2種組成的銀糊,分別將其塗佈於邊(緣)部及面部,則整體可獲得所期望之層厚度。以覆蓋前述陽極基體之邊(緣)部的銀糊層較覆蓋面部之銀糊層更厚的固體電解電容器元件為佳,最好使用組成前述銀糊之含水量為0.5質量%以下之銀糊。本發明係於表面具有碳糊層之陽極基體上形成銀糊之層壓構造時,藉由控制緣部之層厚度與面部之層厚度,而提供一種低ESR(等效串聯電阻)且將每單位體積之電容增大的固體電解電容器元件,當於前述陽極基體箔片上形成前述銀糊之層壓構造時,以控制線部之層厚度與面部之層厚度的方法特別有效。尤其由於可製造ESR(等效串聯電阻)安定且降低,而元件厚度較小之電容器元件,因此於需求低ESR且低矮化之層壓電容器的製造領域中特別有用。本發明係使用對碳糊層之潤濕性不同之2種銀糊,若於邊(緣)部塗佈潤濕性較低之組成者,於面部塗佈潤濕性較低之組成者,則整體可獲得所期望之層厚度,該現象可廣泛應用於形成依序形成第1被覆層與第2被覆層之層壓構造。本發明之固體電解電容器及其製造方法係提供一種於邊(緣)部具有足夠層厚度且面部的層厚度受到抑制之低ESR(等效串聯電阻)且每單位體積之電容增大的固體電解電容器元件。此外,藉由具有:將於陽極基體表面依序層壓有氧化被膜層、導電性高分子層及碳糊層之陽極基體浸漬於銀糊之步驟:於該陽極基體之邊以刷毛塗佈銀糊之步驟的製造方法,即可提供一種銀糊層厚度不勻程度較小,因此每單位體積之電容高且ESR低之電容器。本發明之固體電解電容器及其製造方法係可提供一種ESR充分低且每單位體積之電容增大的固體電解電容器元件。The present invention provides a solid electrolytic capacitor in which the ESR (equivalent series resistance) of the laminated structure in which the silver paste is formed on the anode substrate having the carbon paste layer on the surface is sufficiently low and the capacitance per unit volume is increased. In the present invention, a solid electrolytic capacitor element having a low ESR and a high capacitance is obtained by controlling the composition or layer thickness of a silver paste having a laminated structure formed on an anode substrate having a carbon paste layer on its surface. When a silver paste having two kinds of compositions having different wettability to the carbon paste layer is used and applied to the side (edge) portion and the face portion, the desired layer thickness can be obtained as a whole. Preferably, the silver paste layer covering the side (edge) portion of the anode substrate is thicker than the silver paste layer covering the face portion, and it is preferable to use a silver paste having a water content of 0.5 mass% or less. . The present invention provides a low ESR (equivalent series resistance) by controlling the layer thickness of the edge portion and the thickness of the layer layer when the laminated structure of the silver paste is formed on the anode substrate having the carbon paste layer on the surface. In the solid electrolytic capacitor element having a large capacitance per unit volume, when the laminated structure of the silver paste is formed on the anode base foil, a method of controlling the layer thickness of the line portion and the layer thickness of the face portion is particularly effective. In particular, a capacitor element having a small ESR (equivalent series resistance) stability and reduction and a small component thickness is particularly useful in the field of manufacturing a laminated capacitor which requires low ESR and is low in thickness. In the present invention, two kinds of silver pastes having different wettability to the carbon paste layer are used, and when a component having a low wettability is applied to the edge (edge) portion, a component having a low wettability on the face is applied. The desired layer thickness can be obtained as a whole, and this phenomenon can be widely applied to form a laminated structure in which the first coating layer and the second coating layer are sequentially formed. The solid electrolytic capacitor of the present invention and the method of manufacturing the same provide a solid electrolysis having a low ESR (Equivalent Series Resistance) with a sufficient layer thickness at the edge (edge) portion and a reduced layer thickness of the face portion and an increase in capacitance per unit volume. Capacitor component. Further, the step of immersing the anode substrate in which the oxide film layer, the conductive polymer layer and the carbon paste layer are sequentially laminated on the surface of the anode substrate is immersed in the silver paste: silver is coated with bristles on the side of the anode substrate In the manufacturing method of the paste step, a capacitor having a small thickness unevenness of the silver paste layer and thus having a high capacitance per unit volume and a low ESR can be provided. The solid electrolytic capacitor of the present invention and the method of manufacturing the same can provide a solid electrolytic capacitor element in which the ESR is sufficiently low and the capacitance per unit volume is increased.
1...陽極基體1. . . Anode substrate
2...氧化被膜層2. . . Oxidized coating
3...固體電解質層3. . . Solid electrolyte layer
4...導電體層4. . . Conductor layer
4a...碳糊層4a. . . Carbon paste layer
4b...導電糊層4b. . . Conductive paste layer
5...遮蔽層5. . . Masking layer
6...陽極引線部6. . . Anode lead
7...陰極引線部7. . . Cathode lead
8...密封樹脂8. . . Sealing resin
9...固體電解電容器9. . . Solid electrolytic capacitor
第1圖係顯示固體電解電容器元件之一般構造的剖視圖。Fig. 1 is a cross-sectional view showing a general configuration of a solid electrolytic capacitor element.
第2圖係用以說明固體電解電容器元件中習知之塗糊被覆構造之模式圖。Fig. 2 is a schematic view for explaining a conventional paste coating structure in a solid electrolytic capacitor element.
第3圖係用以說明本發明固體電解電容器元件中之塗糊被覆構造之模式圖。Fig. 3 is a schematic view for explaining a paste-coating structure in the solid electrolytic capacitor element of the present invention.
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| JPH10172853A (en) * | 1996-12-14 | 1998-06-26 | Taiyo Yuden Co Ltd | Coil type electronic parts and its manufacturing method |
| JPH11251204A (en) * | 1998-03-06 | 1999-09-17 | Murata Mfg Co Ltd | Ceramic electronic part and manufacture thereof |
| JP2000068158A (en) * | 1998-06-11 | 2000-03-03 | Showa Denko Kk | Single plate capacitor element and laminated solid electrolytic capacitor |
| US6249424B1 (en) * | 1998-06-11 | 2001-06-19 | Showa Denko K.K. | Monolayer capacitor element and solid electrolytic multilayer capacitor |
| JP2002015957A (en) * | 2000-06-29 | 2002-01-18 | Matsushita Electric Ind Co Ltd | Method and apparatus for manufacturing solid electrolytic capacitor and solid electrolytic capacitor |
| JP2003086449A (en) * | 2001-09-10 | 2003-03-20 | Sumitomo Metal Mining Co Ltd | Method of manufacturing paste for internal electrode of multilayer ceramic capacitor |
| JP2004235377A (en) * | 2003-01-29 | 2004-08-19 | Kyocera Corp | Ceramic electronic components |
| JP2005064282A (en) * | 2003-08-14 | 2005-03-10 | Tdk Corp | Method for forming external electrode of chip-shaped electronic component, and chip-shaped electronic component |
| JP2005294817A (en) * | 2004-03-09 | 2005-10-20 | Showa Denko Kk | Solid electrolytic capacitor and its use |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4947431B2 (en) | 2012-06-06 |
| JPWO2007055247A1 (en) | 2009-04-30 |
| TW200735150A (en) | 2007-09-16 |
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