TWI421381B - Plating fixture - Google Patents

Description

Plating rack

The present invention relates to the field of electroplating technology, and more particularly to an electroplating rack for holding a circuit board for electroplating.

Electroplating refers to a surface processing method in which an anode device is used to reduce an anode metal ion in a salt-based plating solution including an anode metal into a metal element by using an electrolysis device, and a metal element is deposited on a surface of a workpiece to be plated to form a plating layer. The electrolysis device includes an anode connected to the positive electrode of the power source, a cathode connected to the negative electrode of the power source, and a plating tank for containing the plating solution. Typically, the anode is an anode metal rod. The anode metal rod is immersed in the plating solution for generating anode metal ions and supplementing the anode metal ion content in the plating solution to maintain the anode metal ion concentration in the plating solution within a predetermined range.

Electroplating processes are widely used to make circuit boards. For details, see the literature: A.J. Cobley, D.R. Gabe; Methods for achieving high speed acid copper electroplating in the PCB industry; Circuit World; 2001, Volume 27, Issue 3, Page: 19-25. Existing methods of plating circuit boards are usually carried out by immersing the board in a plating solution by means of a pylon. In order to conduct current to the board for electroplating, the pylon is electrically connected to the cathode of the electroplating apparatus and has a conductive pinch that is electrically connected to the board. The conductive pinch is more or less exposed to plating In the liquid, after long-term use, the plating layer is also deposited on the conductive pinch, which not only wastes the plating liquid raw material, but also causes trouble for cleaning and subsequent use.

In view of this, it is necessary to provide a plating rack to avoid depositing plating itself and reduce the waste of plating liquid raw materials.

A plating rack for holding a circuit board for electroplating. The circuit board has opposite first and second ends. The plating rack includes a first clamping assembly, a first connecting rod, a second clamping assembly, a current conducting mechanism and a pressing mechanism. The first clamping assembly is for clamping the first end. The first clamping assembly includes an opposite first bottom plate and a first cover plate. The first bottom plate is provided with a plurality of first card slots, the first cover plate has a plurality of first latches, and the plurality of first latches are configured to cooperate with the plurality of first card slots to fix the first bottom plate With the first cover. The first connecting rod is coupled between the first clamping assembly and the second clamping assembly. The second clamping assembly is opposite the first clamping assembly. The second clamping assembly is for clamping the second end. The second clamping assembly includes an opposite second and second cover. The second bottom plate is provided with a plurality of second card slots, the second cover plate has a plurality of second latches, and the plurality of second latching holes are configured to cooperate with the plurality of second card slots to fix the second bottom plate With the second cover. The current conducting mechanism includes at least one first conductive block embedded in the first clamping component and at least one second conductive block embedded in the second clamping component. The at least one first conductive block and the at least one second conductive block are respectively used to conduct current to the first end and the second end. The pressing mechanism includes at least one first pressing block disposed on the first clamping assembly and at least one second pressing block disposed on the second clamping assembly. The at least one first pressing block and the at least one second pressing block are respectively used for the first of the circuit boards The end abuts the second end.

The electroplating rack of the technical solution has a current conducting mechanism and a pressing mechanism, and the pressing mechanism abuts against the surface of the circuit board, so that the current conducting mechanism can be in full contact with the surface of the circuit board, so that the circuit board is exposed to the portion of the plating solution. The plating layer is uniformly deposited, and the current conducting mechanism itself does not deposit a plating layer, which is advantageous for reducing the waste of the plating liquid raw material.

10‧‧‧Electroplating rack

11‧‧‧First connecting rod

12‧‧‧First clamping assembly

120‧‧‧first bottom plate

1200‧‧‧ first clamping surface

1201‧‧‧First annular side

1202‧‧‧ bottom

1203‧‧‧First card slot

1204‧‧‧First accommodating slot

1205‧‧‧First positioning column

1206‧‧‧First engagement space

1207‧‧‧Second engagement space

121‧‧‧First cover

1210‧‧‧Second clamping surface

1211‧‧‧ second annular side

1212‧‧‧ top surface

1213‧‧‧First card

1214‧‧‧Second accommodating slot

1215‧‧‧First positioning hole

1216‧‧‧First card fit

1217‧‧‧Second card body

122‧‧‧First seal ring

123‧‧‧Second seal ring

13‧‧‧Second connecting rod

14‧‧‧Second clamping assembly

140‧‧‧second bottom plate

1400‧‧‧ third clamping surface

1402‧‧‧Second card slot

1403‧‧‧The third accommodating slot

1404‧‧‧Second positioning post

141‧‧‧second cover

1410‧‧‧4th clamping surface

1412‧‧‧Second card

1413‧‧‧4th accommodating slot

1414‧‧‧Second positioning hole

142‧‧‧ Third sealing ring

143‧‧‧fourth sealing ring

150‧‧‧First conductive block

151‧‧‧Second conductive block

160‧‧‧First compact

161‧‧‧Second pressed block

17‧‧‧ first hook

170‧‧‧First wire

18‧‧‧second hook

180‧‧‧second wire

FIG. 1 is a schematic structural view of a plating rack provided by the technical solution.

Figure 2 is a cross-sectional view taken along line II-II of Figure 1.

FIG. 3 is a structural schematic view showing the first clamping component and the second clamping component of the plating hanger provided by the technical solution in an exploded state.

FIG. 4 is a schematic structural view of a circuit board held by using the above-described plating rack.

Figure 5 is a cross-sectional view taken along line V-V of Figure 4.

The plating rack of the present technical solution will be described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 to FIG. 3 together, the technical solution provides a plating rack 10 for clamping a circuit board for electroplating. The circuit board has opposing first and second surfaces. The circuit board is generally rectangular having opposite first and second ends. The first end portion and the second end portion are respectively provided with a plurality of through holes penetrating the first surface and the second surface. The plating rack 10 is substantially a rectangular frame, and includes a first connecting rod 11, a first clamping assembly 12, a second connecting rod 13, a second clamping assembly 14, and electricity. The flow transmission mechanism, the pressing mechanism, the first hook 17 and the second hook 18.

The first connecting rod 11 , the first clamping assembly 12 , and the second connecting rod 13 are in end-to-end contact with the second clamping assembly 14 , wherein the second clamping assembly 14 is opposite to the first clamping assembly 12 . The second connecting rod 13 is opposite to the first connecting rod 11 and is connected between the second clamping assembly 14 and the first clamping assembly 12 . The first connecting rod 11 and the second connecting rod 13 may both be rectangular parallelepiped rods.

The first clamping assembly 12 is for clamping a first end of the circuit board. The first clamping assembly 12 includes a first bottom plate 120, a first cover plate 121, a first sealing ring 122 and a second sealing ring 123. The first cover plate 121 is opposite to the first bottom plate 120. The first bottom plate 120 and the first cover plate 121 can both be made of engineering plastic. The first sealing ring 122 and the second sealing ring 123 may both be O-rings made of rubber material. The first sealing ring 122 and the second sealing ring 123 have a certain degree of flexibility.

The first bottom plate 120 may be a rectangular parallelepiped plate having a first clamping surface 1200, a first annular side surface 1201 and a bottom surface 1202 connected in sequence. The first clamping surface 1200 is adjacent to the first cover 121. The first clamping surface 1200 is for contacting a portion of the first surface of the circuit board adjacent the first end. The bottom surface 1202 is opposite to the first clamping surface 1200. The bottom surface 1202 is away from the first cover plate 121. The first annular side surface 1201 is vertically connected between the first clamping surface 1200 and the bottom surface 1202. The first sealing ring 122 surrounds the first bottom plate 120 and is in close contact with the first annular side surface 1201 of the first bottom plate 120. The height of the first sealing ring 122 may be slightly larger than the thickness of the first bottom plate 120, that is, the first sealing ring 122 slightly protrudes from the first clamping surface 1200. The first bottom plate 120 has a plurality of first card slots 1203 , at least one first receiving slot 1204 , and a plurality of first positioning posts 1205 . The plurality of first card slots 1203 are all close to the first seal The ring 122 substantially surrounds a central portion of the first clamping surface 1200. Each of the first card slots 1203 is a blind slot that opens from the first clamping surface 1200 toward the bottom surface 1202. Each of the first card slots 1203 includes a first engagement space 1206 and a second engagement space 1207 that are in communication. The first engagement space 1206 is adjacent to the first clamping surface 1200. The second engagement space 1207 is away from the first clamping surface 1200. The cross-sectional area of the second engaging space 1207 is larger than the cross-sectional area of the first engaging space 1206. The at least one first receiving groove 1204 is distributed on a center line of the first clamping surface 1200 . Each of the first accommodating grooves 1204 is a blind groove opened from the first clamping surface 1200 toward the bottom surface 1202. In this embodiment, the at least one first accommodating groove 1204 is a plurality of first accommodating grooves 1204 and is distributed on a center line of the first clamping surface 1200 . Each of the first accommodating grooves 1204 has a rectangular cross section. The plurality of first positioning posts 1205 are also distributed on the center line of the first clamping surface 1200. In this embodiment, the number of the first positioning posts 1205 is two, and each of the first positioning posts 1205 is cylindrical.

The first cover plate 121 can be a rectangular parallelepiped plate having a second clamping surface 1210, a second annular side surface 1211 and a top surface 1212 that are sequentially connected. The second clamping surface 1210 is opposite to the first clamping surface 1200. The second clamping surface 1210 is for contacting the first end of the second surface of the circuit board. The top surface 1212 is away from the first bottom plate 120. The second annular side surface 1211 is vertically connected between the second clamping surface 1210 and the top surface 1212. The second sealing ring 123 surrounds the first cover plate 121 and is in close contact with the second annular side surface 1211 of the first cover plate 121. The height of the second sealing ring 123 may be slightly larger than the thickness of the first cover plate 121, that is, the second sealing ring 123 slightly protrudes from the second clamping surface 1210. The first cover plate 121 has a plurality of first latches 1213 , at least one second receiving slot 1214 , and a plurality of first positioning holes 1215 . The plural first card The 榫 1213 is in one-to-one correspondence with the plurality of first card slots 1203. That is, the shape, the number, and the position distribution of the plurality of first cassettes 1213 are in one-to-one correspondence with the plurality of first card slots 1203. The plurality of first cassettes 1213 are also distributed near the second sealing ring 123 and substantially surround the central portion of the second clamping surface 1210. The plurality of first cassettes 1213 are configured to cooperate with the plurality of first card slots 1203 to fix the first bottom plate 120 and the first cover plate 121. Each of the first cassettes 1213 includes a first engaging body 1216 and a second engaging body 1217 that are connected. The first engaging body 1216 is adjacent to the second clamping surface 1210. The second engaging body 1217 is away from the second clamping surface 1210. The cross-sectional area of the second engaging body 1217 is larger than the cross-sectional area of the first engaging body 1216. The first cassette 1213 has elasticity and can be received in the first card slot 1203 such that the first bottom plate 120 and the first cover plate 121 are tightly coupled together. The at least one second receiving groove 1214 is distributed on a center line of the second clamping surface 1210. Each of the second accommodating grooves 1214 is a blind groove opened from the second clamping surface 1210 toward the top surface 1212. In this embodiment, the at least one second accommodating groove 1214 is distributed on the center line of the second clamping surface 1210 and is staggered with the at least one first accommodating groove 1204. That is, when the second clamping surface 1210 is opposite to the first clamping surface 1200, each of the second receiving grooves 1214 faces the gap between the adjacent two first receiving grooves 1204. The at least one second receiving groove 1214 has a rectangular cross section. The plurality of first positioning holes 1215 are in one-to-one correspondence with the plurality of first positioning posts 1205. The plurality of first positioning holes 1215 are also distributed on the center line of the second clamping surface 1210. In this embodiment, each of the first positioning holes 1215 has a circular cross section, and each of the first positioning holes 1215 has a larger diameter than the corresponding first positioning post 1205, so that the second clamping surface 1210 is When the first clamping faces 1200 are opposite, each of the first positioning posts 1205 is received in a corresponding first positioning hole 1215.

The second clamping assembly 14 is for clamping the second end of the circuit board. The second clamping assembly 14 is substantially identical in structure to the first clamping assembly 12. The second clamping assembly 14 also includes a second bottom plate 140, a second cover plate 141, a third sealing ring 142 and a fourth sealing ring 143. The second cover plate 141 is opposite to the second bottom plate 140. The third seal ring 142 surrounds the second bottom plate 140. The fourth seal ring 143 surrounds the second cover plate 141.

The second bottom plate 140 has a third clamping surface 1400. The third clamping surface 1400 is for contacting the first end of the circuit board near the second end. The third clamping surface 1400 of the second bottom plate 140 has a plurality of second card slots 1402 , a plurality of third receiving slots 1403 , and a plurality of second positioning posts 1404 . The plurality of second card slots 1402 are distributed around the edge of the third clamping surface 1400. Each of the second card slots 1402 is a blind slot formed in the third clamping surface 1400. The plurality of third accommodating grooves 1403 are distributed on a center line of the third clamping surface 1400. Each of the third accommodating grooves 1403 is a blind groove formed in the third clamping surface 1400. The plurality of second positioning posts 1404 are also distributed on the center line of the third clamping surface 1400. In this embodiment, the number of the second positioning posts 1404 is also two.

The second cover plate 141 has a fourth clamping surface 1410. The fourth clamping surface 1410 is for contacting the second end of the circuit board adjacent to the second end. The fourth clamping surface 1410 is opposite to the third clamping surface 1400 for cooperating with the third clamping surface 1400 to clamp the circuit board. The second cover plate 141 has a plurality of second latches 1412, a plurality of fourth receiving slots 1413 and a plurality of second positioning holes 1414. The plurality of second cassettes 1412 are in one-to-one correspondence with the plurality of second card slots 1402. The plurality of second cassettes 1412 are also distributed around the edges of the fourth clamping surface 1410. The plurality of second cassettes 1412 The second base plate 140 and the second cover plate 141 are fixed to cooperate with the plurality of second card slots 1402. The plurality of fourth accommodating grooves 1413 are distributed on a center line of the fourth clamping surface 1410. Each of the fourth accommodating grooves 1413 is a blind groove formed in the fourth clamping surface 1410. In this embodiment, the plurality of fourth accommodating grooves 1413 are respectively distributed on another straight line parallel to the plurality of third accommodating grooves 1403, and are alternately distributed with the plurality of third accommodating grooves 1403. That is, when the fourth clamping surface 1410 is opposite to the third clamping surface 1400, each of the fourth receiving grooves 1413 faces the gap between the adjacent two third receiving grooves 1403. The plurality of second positioning holes 1414 are in one-to-one correspondence with the plurality of second positioning posts 1404. The plurality of second positioning holes 1414 are also distributed on the center line of the fourth clamping surface 1410.

The current conducting mechanism includes at least one first conductive block 150 embedded in the first clamping component 12 and at least one second conductive block 151 embedded in the second clamping component 14 . The at least one first conductive block 150 is configured to conduct current to the first end of the circuit board. The at least one first conductive block 150 may be embedded only in the first bottom plate 120 or only embedded in the first cover plate 121. As such, the at least one first conductive block 150 embedded in the first clamping component 12 can only conduct current to one surface of the circuit board. In this embodiment, the at least one first conductive block 150 is a plurality of first conductive blocks 150. In the plurality of first conductive blocks 150, a portion of the first conductive block 150 is embedded in the plurality of first receiving grooves 1204 of the first bottom plate 120, and is flush with the first clamping surface 1200, and the remaining first conductive portions The block 150 is embedded in the plurality of second receiving grooves 1214 of the first cover plate 121 and flush with the second clamping surface 1210. The plurality of first conductive blocks 150 are each a rectangular parallelepiped shape. Corresponding to the positions of the plurality of first accommodating grooves 1204 and the plurality of second accommodating grooves 1214, the plurality of first conductive blocks 150 located on the first bottom plate 120 are located at the first cover The plurality of first conductive blocks 150 of the board 121 are staggered, and a first conductive block 150 of the first bottom plate 120 faces the gap between two adjacent first conductive blocks 150 on the first cover 121.

The at least one second conductive block 151 is configured to conduct current to the second end of the circuit board. The at least one second conductive block 151 may be embedded only in the second bottom plate 140 or only embedded in the second cover plate 141. As such, the at least one second conductive block 151 embedded in the second clamping component 14 can conduct current only to one surface of the circuit board. In this embodiment, the at least one second conductive block 151 is a plurality of second conductive blocks 151. In the plurality of second conductive blocks 151, a portion of the second conductive blocks 151 are embedded in the plurality of third receiving grooves 1403 of the second bottom plate 140, and are flush with the third clamping surface 1400, and the remaining second conductive portions The block 151 is embedded in the plurality of fourth receiving grooves 1413 of the second cover plate 141 and is flush with the fourth clamping surface 1410. The plurality of second conductive blocks 151 are each a rectangular parallelepiped shape. Corresponding to the positions of the plurality of third accommodating grooves 1403 and the plurality of fourth accommodating grooves 1413, the plurality of second conductive blocks 151 located at the second bottom plate 140 and the plurality of second conductive blocks 151 located at the second cover plate 141 The staggered distribution is located in a gap between a second conductive block 151 of the second bottom plate 140 facing the two adjacent second conductive blocks 151 on the second cover plate 141.

Of course, the number of the first conductive block 150 and the second conductive block 151 may also be one, two, etc., and the number of the first conductive block 150 and the second conductive block 151 is not necessarily the same.

The pressing mechanism includes at least one first pressing block 160 disposed on the first clamping assembly 12 and at least one second pressing block 161 disposed on the second clamping assembly 14 . The at least one first pressing block 160 is for abutting against the first end of the circuit board. Said to One less first pressing block 160 corresponds to the at least one first conductive block 150. When the at least one first conductive block 150 is embedded in the first bottom plate 120 , the at least one first pressing block 160 is disposed on the first cover plate 121 and protrudes from the second clamping surface 1210 . When the at least one first conductive block 150 is embedded in the first cover plate 121 , the at least one first pressing block 160 is disposed on the first bottom plate 120 and protrudes from the first clamping surface 1200 . In this embodiment, the at least one first pressing block 160 is a plurality of first pressing blocks 160. In the plurality of first pressing blocks 160, a portion of the first pressing block 160 is disposed on the first bottom plate 120, and a portion of the first pressing block 160 is disposed on the first cover plate 121, and the first pressing portion disposed on the first cover plate 121 is pressed. The block 160 is opposite to the first conductive block 150 embedded in the first bottom plate 120. The first pressing block 160 disposed on the first bottom plate 120 faces the first conductive block 150 of the first cover plate 121. In this embodiment, the plurality of first pressing blocks 160 located on the first bottom plate 120 and the plurality of first receiving grooves 1204 are alternately arranged. That is, each of the first pressing blocks 160 is located between the two adjacent first receiving grooves 1204 so as to oppose the first conductive block 150 in the second receiving groove 1214 of the first cover plate 121. Similarly, the plurality of first pressing blocks 160 located at the first cover plate 121 and the plurality of second receiving grooves 1214 are alternately arranged. That is, each of the first pressing blocks 160 is located between the two adjacent second receiving grooves 1214 so as to oppose the first conductive block 150 in the first receiving groove 1204 of the first bottom plate 120.

The at least one second pressing block 161 is for abutting against the second end of the circuit board. The at least one second pressing block 161 corresponds to the at least one second conductive block 151. When the at least one second conductive block 151 is embedded in the second bottom plate 140, the at least one second pressing block 161 is disposed on the second cover plate 141 and protrudes from the fourth clamping surface 1410. When the at least one second conductive block 151 is embedded in the second cover 141, The at least one second pressing block 161 is disposed on the second bottom plate 140 and protrudes from the third clamping surface 1400. In this embodiment, the at least one second pressing block 161 is a plurality of second pressing blocks 161. In the plurality of second pressing blocks 161, a portion of the second pressing block 161 is disposed on the second bottom plate 140, and a portion of the second pressing block 161 is disposed on the second cover plate 141, and the second pressing plate 141 is disposed on the second pressing plate 141. The block 161 is opposite to the second conductive block 151 of the second bottom plate 140. The second pressing block 161 disposed on the second bottom plate 140 faces the second conductive block 151 of the second cover 141. In this embodiment, the plurality of second pressing blocks 161 located on the second bottom plate 140 and the plurality of third receiving grooves 1403 are alternately arranged. That is, each of the second pressing blocks 161 is located between the two adjacent third receiving grooves 1403 so as to oppose the second conductive block 151 in the fourth receiving groove 1413 of the second cover plate 141. Similarly, the plurality of second pressing blocks 161 located in the second cover plate 141 are alternately arranged with the plurality of fourth receiving grooves 1413. That is, each of the second pressing blocks 161 is located between the two adjacent fourth receiving grooves 1413 so as to oppose the second conductive block 151 in the third receiving groove 1403 of the second bottom plate 140.

The first hook 17 and the second hook 18 are respectively connected to the first bottom plate 120 and the second bottom plate 140. The first hook 17 and the second hook 18 are both used to bond the plating hanger 10 to the cathode rod of the plating apparatus for electroplating. The first hook 17 is electrically connected to the at least one first conductive block 150 by at least one first wire 170. In this embodiment, corresponding to the at least one first conductive block 150, the at least one first wire 170 is a plurality of first wires 170. The plurality of first wires 170 are connected in parallel with each other and are electrically connected between the first hook 17 and the at least one first conductive block 150. The at least one first wire 170 may be disposed in the first bottom plate 120 or the first cover plate 121. The second hook 18 is electrically connected to the at least one second wire 180 to the One second conductive block 151 is missing. Corresponding to the at least one second conductive block 151, the at least one second wire 180 is a plurality of second wires 180. The plurality of second wires 180 are connected in parallel with each other and are electrically connected between the second hooks 18 and the at least one second conductive block 151. The at least one second wire 180 may be disposed in the second bottom plate 140 or the second cover plate 141.

Referring to FIG. 3 to FIG. 5 , when the electroplating rack 10 of the present technical solution is used to hold the circuit board for electroplating, the following steps may be taken: First, the circuit board 100 is provided, including the first surface 101 and the second surface opposite to each other. 102. The circuit board 100 has a first end portion 103 and a second end portion 104 opposite thereto. The first end portion 103 and the second end portion 104 are respectively provided with a plurality of through holes 105 penetrating the first surface 101 and the second surface 102 . In this embodiment, the first end portion 103 and the second end portion 104 of the circuit board 100 are respectively provided with two through holes 105.

Then, the first end portion 103 of the circuit board 100 is held by the first clamping assembly 12, and the second end portion 104 is held by the second clamping assembly 14. The second end 104 of the circuit board 100 can be positioned on the third clamping surface 1400 of the second clamping assembly 14 by the cooperation between the through hole 105 and the second positioning post 1404. The second cover plate 141 is fixed to the second bottom plate 140 by the cooperation between the second latch 1412 and the second card slot 1402, thereby holding the second end portion 104 of the circuit board 100 to the second clamping assembly 14 . . At this time, the second surface 102 of the circuit board 100 is in contact with the third clamping surface 1400, and the first surface 101 is in contact with the fourth clamping surface 1410. On one side of the first surface 101, a second pressing block 161 abuts against the circuit board 100 such that the second surface 102 of the circuit board 100 is in close contact with a second conductive block 151 of the second pressing block 161. .

Finally, the plating rack 10 and the circuit board 100 are bonded to the cathode of the plating apparatus by the first hook 17 and the second hook 18, and the circuit board 100 is immersed in the plating solution. Electroplating can be performed by energizing the cathode. Due to the pressing action of the first pressing block 160, the at least one first conductive block 150 can stably conduct current to the first end portion 103 of the circuit board 100. Due to the pressing action of the second pressing block 161, the at least one second conductive block 151 can stably conduct current to the second end portion 104 of the circuit board 100. The portions of the first surface 101 and the second surface 102 of the circuit board 100 that are exposed to the plating solution are uniformly deposited. Due to the action of the first sealing ring 122, the second sealing ring 123, the third sealing ring 142 and the fourth sealing ring 143, the plating solution does not penetrate into the first bottom plate 120 and the first cover plate 121, and the second bottom plate 140 Between the second cover plates 141, the at least one first conductive block 150 and the second conductive block 151 respectively embedded in the first clamping component 12 and the second clamping component 14 do not deposit plating themselves, which is beneficial to reduce plating Waste of raw materials.

The electroplating rack of the technical solution has a current conducting mechanism and a pressing mechanism, and the pressing mechanism abuts against the surface of the circuit board, so that the current conducting mechanism can be in full contact with the surface of the circuit board, so that the circuit board is exposed to the portion of the plating solution. The plating layer is uniformly deposited, and the current conducting mechanism itself does not deposit a plating layer, which is advantageous for reducing the waste of the plating liquid raw material.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Electroplating rack

11‧‧‧First connecting rod

12‧‧‧First clamping assembly

121‧‧‧First cover

122‧‧‧First seal ring

123‧‧‧Second seal ring

13‧‧‧Second connecting rod

14‧‧‧Second clamping assembly

141‧‧‧second cover

142‧‧‧ Third sealing ring

143‧‧‧fourth sealing ring

17‧‧‧ first hook

170‧‧‧First wire

18‧‧‧second hook

180‧‧‧second wire

Claims (10)

An electroplating rack for clamping a circuit board for electroplating, the circuit board having opposite first and second ends, the electroplating rack comprising a first clamping assembly, a first connecting rod, and a first a second clamping assembly, a current conducting mechanism, a pressing mechanism, a first hook and a second hook, the first clamping assembly for clamping the first end, the first clamping assembly comprising an opposite first bottom plate a first cover, the first bottom plate is provided with a plurality of first card slots, the first cover plate has a plurality of first latches, and the plurality of first latches are configured to cooperate with the plurality of first card slots To fix the first bottom plate and the first cover plate, the first connecting rod is connected between the first clamping assembly and the second clamping assembly, and the second clamping assembly is opposite to the first clamping assembly, The second clamping assembly is configured to clamp the second end portion, the second clamping assembly includes an opposite second bottom plate and a second cover plate, and the second bottom plate is provided with a plurality of second card slots, The second cover has a plurality of second cassettes, and the plurality of second cassettes are configured to cooperate with the plurality of second slots Fixing the second bottom plate and the second cover plate, the current conducting mechanism includes at least one first conductive block embedded in the first clamping component and at least one second conductive embedded in the second clamping component Block, the at least one first conductive block and the at least one second conductive block respectively for conducting current to the first end and the second end of the circuit board, the pressing mechanism comprising being disposed on the first clamping component At least one first pressing block and at least one second pressing block disposed on the second clamping assembly, the at least one first pressing block and the at least one second pressing block being respectively used with the first end of the circuit board The first hook and the second hook are respectively connected to the first bottom plate and the second bottom plate, and the first hook is electrically connected to the at least one first conductive block, Second hook and place The at least one second conductive block is electrically connected, and the first hook and the second hook are both used to bond the plating hanger to the cathode rod of the plating device for electroplating. The plating rack of claim 1, wherein the first bottom plate has a first clamping surface adjacent to the first cover, and the first cover has a first clamping surface a second clamping surface, the at least one first conductive block is embedded in the first bottom plate and flush with the first clamping surface; the at least one first pressing block is disposed on the first cover plate, and Projecting on the second clamping surface, the at least one first pressing block corresponding to the at least one first conductive block; the second bottom plate having a third clamping surface adjacent to the second cover, the second cover The plate has a fourth clamping surface opposite to the third clamping surface, the at least one second conductive block is embedded in the second bottom plate and flush with the third clamping surface; the at least one The second pressing block is disposed on the second cover plate and protrudes from the fourth clamping surface, and the at least one second pressing block corresponds to the at least one second conductive block. The plating rack of claim 1, wherein the first bottom plate has a first clamping surface adjacent to the first cover, and the first cover has a first clamping surface a second clamping surface, the at least one first conductive block is embedded in the first cover plate and flush with the second clamping surface; the at least one first pressing block is disposed on the first bottom plate, and Projecting on the first clamping surface, the at least one first pressing block corresponding to the at least one first conductive block; the second bottom plate having a third clamping surface adjacent to the second cover, the second cover The plate has a fourth clamping surface opposite to the third clamping surface, the at least one second conductive block is embedded in the second cover plate and flush with the fourth clamping surface; the at least one The second pressing block is disposed on the second bottom plate and protrudes from the third clamping surface, and the at least one second pressing block corresponds to the at least one second conductive block. The electroplating pylon of claim 1, wherein the at least one first conductive block is a plurality of first conductive blocks, and the first first conductive block is a part of the first conductive The electric block is embedded in the first bottom plate and flush with the first clamping surface, and the remaining first conductive blocks are embedded in the first cover plate and are flush with the second clamping surface; the at least one The first pressing block corresponds to the at least one first conductive block, the at least one first pressing block is a plurality of first pressing blocks, and a part of the first pressing blocks is disposed at the first a first conductive block is disposed on the first bottom plate, and a first pressing block disposed on the first cover is directly disposed on the first conductive block of the first bottom plate, and is disposed on the first bottom plate The first pressing block faces the first conductive block embedded in the first cover. The plating rack of claim 1, wherein the first bottom plate has a first clamping surface, a first annular side surface and a bottom surface connected in sequence, and the first clamping surface is adjacent to the first cover. The bottom surface is opposite to the first clamping surface, the first annular side is vertically connected between the first clamping surface and the bottom surface, and the first cover has a second clamping surface and a second ring sequentially connected a side surface and a top surface, the second clamping surface is adjacent to the first bottom surface, the top surface is opposite to the second clamping surface, and the second annular side surface is perpendicularly connected between the second clamping surface and the top surface The first clamping assembly further includes a first sealing ring and a second sealing ring, the first sealing ring surrounding the first bottom plate and in close contact with the first annular side surface of the first bottom plate, the second sealing A ring surrounds the first cover and is in intimate contact with the second annular side of the first cover. The plating rack of claim 5, wherein the plurality of first card slots are adjacent to the first sealing ring and substantially surround a central portion of the first clamping surface, the plurality of first cards The crucibles are all adjacent to the second sealing ring and substantially surround a central portion of the second clamping surface. The electroplating pylon of claim 1, wherein the first end portion and the second end portion of the circuit board are respectively provided with a plurality of through holes, and the first cover plate is opened a plurality of first positioning holes, wherein the first bottom plate has a plurality of first positioning posts, the plurality of first positioning posts are in one-to-one correspondence with the plurality of first positioning holes, and each of the first positioning posts is used to pass through one The first end portion of the through hole and a first positioning hole to position the first end of the circuit board; the second cover plate is provided with a plurality of second positioning holes, and the second bottom plate has a plurality of second holes a positioning post, the plurality of second positioning posts are in one-to-one correspondence with the plurality of second positioning holes, each of the second positioning posts is configured to pass through the through holes of one of the second ends and a second positioning hole Position the second end of the board. The plating rack of claim 1, wherein the plating rack further comprises a second connecting rod, the second connecting rod is connected between the first bottom plate and the second bottom plate, and The first connecting rod is opposite. The electroplating pylon of claim 1, wherein the first hook is electrically connected to the at least one first conductive block by a plurality of first wires, and the second hook is connected by the plurality of second wires Electrically connected to the at least one second conductive block. The electroplating pylon of claim 9, wherein the first current conducting component comprises a plurality of first conductive blocks embedded in the first bottom plate and a plurality of embedded in the first cover The second conductive block, the plurality of first conductive blocks and the plurality of second conductive blocks are electrically connected to the first hook by a plurality of first wires connected in parallel with each other.