TWI419634B - Drilling cover - Google Patents
Drilling cover Download PDFInfo
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- TWI419634B TWI419634B TW097150610A TW97150610A TWI419634B TW I419634 B TWI419634 B TW I419634B TW 097150610 A TW097150610 A TW 097150610A TW 97150610 A TW97150610 A TW 97150610A TW I419634 B TWI419634 B TW I419634B
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- drilling
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- resin composition
- drill
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- 238000005553 drilling Methods 0.000 title claims description 54
- 239000011342 resin composition Substances 0.000 claims description 47
- 239000011888 foil Substances 0.000 claims description 45
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 description 47
- 239000011347 resin Substances 0.000 description 47
- 239000010410 layer Substances 0.000 description 41
- 229910052782 aluminium Inorganic materials 0.000 description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 29
- 239000000126 substance Substances 0.000 description 20
- 239000000243 solution Substances 0.000 description 19
- -1 polyethylene Polymers 0.000 description 17
- 238000004804 winding Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000002202 Polyethylene glycol Substances 0.000 description 9
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- 229920001568 phenolic resin Polymers 0.000 description 8
- 238000009826 distribution Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 241000047703 Nonion Species 0.000 description 4
- 229920002538 Polyethylene Glycol 20000 Polymers 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001050 lubricating effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 210000004877 mucosa Anatomy 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 235000017858 Laurus nobilis Nutrition 0.000 description 1
- MMQZBEXYFLXHEN-UHFFFAOYSA-N OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O Chemical compound OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O MMQZBEXYFLXHEN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 235000005212 Terminalia tomentosa Nutrition 0.000 description 1
- 244000125380 Terminalia tomentosa Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Inorganic materials [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2250/00—Compensating adverse effects during turning, boring or drilling
- B23B2250/12—Cooling and lubrication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
- B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Drilling And Boring (AREA)
Description
本發明係關於鑽孔用蓋板(entry sheet),其在製造印刷線路板的步驟中用於在包銅層壓板或者多層板上鑽孔。The present invention relates to an entry sheet for drilling a hole in a copper clad laminate or a multilayer board in the step of manufacturing a printed wiring board.
作為一種印刷線路板材料用包銅層壓板或多層板的鑽孔方法,通常採用的方法是在鑽孔前,將一經由在鋁箔的表面上形成樹脂組成物層而獲得的鑽孔用簡單鋁箔或蓋板作為輔助板,以置於包銅層壓板或多層板或疊置的兩個或以上包銅層壓板或者兩個或以上多層板的頂表面上。為了滿足可靠性增長的要求和高度緻密化的發展,印刷線路板材料係要求高品質的鑽孔。例如,需要提高孔定位精確度或降低孔壁粗糙度。為了滿足上述高品質鑽孔的要求,已經建議並在實施時採用下述製孔方法:使用一如聚乙二醇水溶性樹脂的板(例如,JP-A-4-92494),藉由在金屬箔上形成水溶性樹脂層獲得製孔用的潤滑板(例如,JP-A-6-344297),及藉由在鋁箔上形成熱固性樹脂組成物薄膜和進一步形成水溶性樹脂層獲得製孔用的蓋板(例如,JP-A-2003-136485)。隨著印刷線路板的高度緻密化的進一步發展以及與該發展相關的鑽頭的直徑的降低,在鑽頭周圍捲繞蓋板樹脂的影響變大,使得由於鑽頭跳動(run-out of a drill)、屑片排出差、樹脂剝離等原因更易於發生孔定位精確度的降低和鑽頭破損(drill breakage)。因此,強烈需要在鑽頭周圍幾乎不用捲繞蓋板樹脂並具有極好孔定位精確度的鑽孔用蓋板。As a method of drilling a copper-clad laminate or a multi-layered board for a printed wiring board material, a method is generally employed in which a simple aluminum foil for drilling is obtained by forming a resin composition layer on the surface of an aluminum foil before drilling. Or a cover plate as an auxiliary plate for placing on a copper-clad laminate or a multi-layer board or a stacked two or more copper-clad laminates or a top surface of two or more multi-layer sheets. In order to meet the requirements of reliability growth and the development of high densification, printed wiring board materials require high quality drilling. For example, there is a need to improve hole positioning accuracy or reduce hole wall roughness. In order to meet the above requirements for high-quality drilling, it has been proposed and practiced to adopt a hole making method using a plate such as a polyethylene glycol water-soluble resin (for example, JP-A-4-92494) by A water-soluble resin layer is formed on the metal foil to obtain a lubricating plate for pore making (for example, JP-A-6-344297), and a film for forming a thermosetting resin composition on the aluminum foil and further forming a water-soluble resin layer to obtain a pore-forming hole Cover plate (for example, JP-A-2003-136485). With the further development of the densification of the height of the printed wiring board and the reduction of the diameter of the drill bit associated with this development, the influence of winding the cover resin around the drill bit becomes large, so that due to the run-out of a drill, The reduction in chip positioning accuracy and the drill breakage are more likely to occur due to the difference in chip discharge, resin peeling, and the like. Therefore, there is a strong need for a drilling cover plate which is almost free to wrap the cover resin around the drill bit and has excellent hole positioning accuracy.
本發明的目的是提供一種鑽孔用蓋板,其解決了習知技術關於在包銅層壓板或者多層板上鑽孔的上述問題,即該蓋板幾乎不用在鑽頭周圍捲繞蓋板樹脂(其係使孔定位精確度下降或者造成鑽頭破損),因而具有極好的孔定位精確度。SUMMARY OF THE INVENTION It is an object of the present invention to provide a cover for drilling which solves the above-mentioned problems associated with drilling a copper-clad laminate or a multi-layered board in which the cover sheet hardly wraps around the drill bit ( It reduces the hole positioning accuracy or causes the drill bit to break, and thus has excellent hole positioning accuracy.
本發明人詳細研究了減少在鑽頭周圍捲繞樹脂以及孔定位精確度的改進,結果發現捲繞蓋板樹脂層與在用於鑽孔用蓋板的水溶性樹脂組成物層中所用的聚環氧乙烷的多分散性Mw/Mn之間的關係。基於上述發現,本發明人完成本發明。The inventors have studied in detail the improvement of the winding resin around the drill bit and the accuracy of the hole positioning, and as a result, it has been found that the resin layer for winding the cover sheet and the poly ring used in the water-soluble resin composition layer for the cover plate for drilling The relationship between the polydispersity of oxyethane Mw/Mn. Based on the above findings, the inventors completed the present invention.
即,本發明關於一種鑽孔用蓋板,其包括金屬箔和在金屬箔的至少一個表面上形成的水溶性樹脂組成物層,其中所述的水溶性樹脂組成物層包含多分散性Mw/Mn為2.5或更低的聚環氧乙烷。在上述的鑽孔用蓋板中,聚環氧乙烷較佳具有50,000至150,000的重均分子量Mw,此外,在水溶性樹脂組成物中聚環氧乙烷的含量較佳為20重量%至80重量%。That is, the present invention relates to a cover plate for drilling, comprising a metal foil and a water-soluble resin composition layer formed on at least one surface of the metal foil, wherein the water-soluble resin composition layer contains polydispersity Mw/ Polyethylene oxide having a Mn of 2.5 or less. In the above-mentioned drilling cover sheet, the polyethylene oxide preferably has a weight average molecular weight Mw of 50,000 to 150,000, and further, the content of polyethylene oxide in the water-soluble resin composition is preferably 20% by weight to 80% by weight.
根據對由本發明提供的鑽孔用蓋板的使用,鑽孔時在鑽頭周圍蓋板樹脂的捲繞降低以使孔定位精確度提高。據此,在使用小直徑鑽頭的鑽孔工作中達成極佳的鑽孔品質和產率。According to the use of the drilling cover plate provided by the present invention, the winding of the cover resin around the drill bit is reduced at the time of drilling to improve the hole positioning accuracy. Accordingly, excellent drilling quality and productivity are achieved in drilling operations using small diameter drill bits.
本發明係關於一種鑽孔用蓋板,其包括金屬箔和在金屬箔的至少一個表面上形成的水溶性樹脂組成物層,其中所述的水溶性樹脂組成物層包含多分散性Mw/Mn為2.5或更低的聚環氧乙烷。在金屬箔上形成的樹脂組成物層通常為單層,但樹脂組成物層可以是由至少兩個樹脂組成物層組成的複合層。The present invention relates to a cover plate for drilling, comprising a metal foil and a water-soluble resin composition layer formed on at least one surface of the metal foil, wherein the water-soluble resin composition layer contains polydispersity Mw/Mn Polyethylene oxide of 2.5 or less. The resin composition layer formed on the metal foil is usually a single layer, but the resin composition layer may be a composite layer composed of at least two resin composition layers.
通常地,聚合物的分子量是指聚合物的多個分子量的平均值。平均分子量的計算方法通常為以平均分子量/分子所計算而得之數均分子量Mn,或以重量比重量所計算而得之重均分子量Mw。通常地,GPC方法適用於測定數均分子量Mn,及重均分子量Mw。可以基於水溶性GPC的分析條件對本發明中所用水溶性樹脂的數均分子量的進行測定。通常將聚乙二醇用作標準物質以計算水溶性聚合物化合物的數均分子量和重均分子量。Generally, the molecular weight of a polymer refers to the average of a plurality of molecular weights of the polymer. The calculation method of the average molecular weight is usually the number average molecular weight Mn calculated by the average molecular weight/molecular weight, or the weight average molecular weight Mw calculated by weight ratio. Generally, the GPC method is suitable for determining the number average molecular weight Mn, and the weight average molecular weight Mw. The number average molecular weight of the water-soluble resin used in the present invention can be measured based on the analysis conditions of the water-soluble GPC. Polyethylene glycol is generally used as a standard substance to calculate the number average molecular weight and the weight average molecular weight of the water-soluble polymer compound.
藉由以具有分子量分佈的聚合物化合物的重均分子量Mw除以其數均分子量Mn來獲得多分散性Mw/Mn。隨著多分散性值的增加,分子量分佈變寬。隨著多分散性值的降低,分子量分佈變窄。通常地,諸如纖維素或者澱粉的天然聚合物具有窄分子量分佈,諸如聚乙烯或者聚苯乙烯的合成聚合物具有寬分子量分佈。The polydispersity Mw/Mn is obtained by dividing the weight average molecular weight Mw of the polymer compound having a molecular weight distribution by the number average molecular weight Mn thereof. As the polydispersity value increases, the molecular weight distribution becomes wider. As the polydispersity value decreases, the molecular weight distribution becomes narrow. Generally, natural polymers such as cellulose or starch have a narrow molecular weight distribution, and synthetic polymers such as polyethylene or polystyrene have a broad molecular weight distribution.
並不具體限定由本發明所提供在鑽孔用蓋板的水溶性樹脂組成物層中使用的水溶性樹脂,只要其是在常溫常壓下能夠以1克或者更多的量溶於100克水中的聚合物化合物即可。較佳的水溶性樹脂的例子包括聚環氧乙烷、聚環氧丙烷、聚乙烯醇、聚丙烯酸鈉、聚丙烯醯胺、聚乙烯吡咯烷酮、羧甲基纖維素、聚丁二醇、聚醚酯、聚乙烯醇、聚乙二醇、聚丙二醇;聚氧乙烯的單醚,例如聚氧乙烯油基醚、聚氧乙烯十六烷基醚、聚氧乙烯硬脂基醚、聚氧乙烯月桂基醚、聚氧乙烯壬基苯基醚和聚氧乙烯辛基苯基醚;聚氧乙烯單硬脂酸酯、聚氧乙烯山梨糖醇酐單硬脂酸酯;聚丙三醇單硬脂酸酯,例如六丙三醇單硬脂酸酯和十六丙三醇單硬脂酸酯;以及聚氧乙烯丙烯共聚物。按照需要,可以單獨使用水溶性樹脂或者使用至少兩種水溶性樹脂的混合物。The water-soluble resin to be used in the water-soluble resin composition layer of the cover sheet for drilling according to the present invention is not particularly limited as long as it can be dissolved in 100 g of water in an amount of 1 g or more at normal temperature and pressure. The polymer compound is sufficient. Examples of preferred water-soluble resins include polyethylene oxide, polypropylene oxide, polyvinyl alcohol, sodium polyacrylate, polyacrylamide, polyvinylpyrrolidone, carboxymethylcellulose, polytetramethylene glycol, polyether. Ester, polyvinyl alcohol, polyethylene glycol, polypropylene glycol; monoether of polyoxyethylene, such as polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene laurel Ether, polyoxyethylene nonylphenyl ether and polyoxyethylene octyl phenyl ether; polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate; polyglycerol monostearate Esters such as hexaglycerol monostearate and hexadecaglycerol monostearate; and polyoxyethylene propylene copolymers. A water-soluble resin may be used alone or a mixture of at least two water-soluble resins may be used as needed.
包含在本發明的水溶性樹脂組成物層中的聚環氧乙烷的多分散性Mw/Mn較佳為2.5或更低,更佳2.0或更低。當聚環氧乙烷的多分散性超過2.5時,分子量分佈變寬使得捲繞鑽頭的樹脂量增加。The polydispersity Mw/Mn of the polyethylene oxide contained in the water-soluble resin composition layer of the present invention is preferably 2.5 or less, more preferably 2.0 or less. When the polydispersity of polyethylene oxide exceeds 2.5, the molecular weight distribution is broadened so that the amount of resin of the wound drill bit is increased.
在本發明的水溶性樹脂組成物層中的多分散性Mw/Mn為2.5或更低的聚環氧乙烷的分子量以重均分子量Mw計較佳為50,000至150,000。根據對重均分子量Mw為50,000至150,000的聚環氧乙烷的使用,鑽孔時的潤滑效果極好,另外,捲繞鑽頭的樹脂的量少使得有可能以高的孔定位精確度完成鑽孔。The molecular weight of the polyethylene oxide having a polydispersity Mw/Mn of 2.5 or less in the water-soluble resin composition layer of the present invention is preferably 50,000 to 150,000 in terms of the weight average molecular weight Mw. According to the use of polyethylene oxide having a weight average molecular weight Mw of 50,000 to 150,000, the lubricating effect at the time of drilling is excellent, and in addition, the amount of resin wound around the drill bit is small, making it possible to complete the drilling with high hole positioning accuracy. hole.
在本發明的水溶性樹脂組成物中的多分散性Mw/Mn為2.5或更低的聚環氧乙烷的含量較佳為20重量%至80重量%,更佳為30重量%至60重量%。當其少於20重量%時,捲繞鑽頭的樹脂量大。當其超過80重量%時,樹脂層的強度降低。The content of the polyethylene oxide having a polydispersity Mw/Mn of 2.5 or less in the water-soluble resin composition of the present invention is preferably from 20% by weight to 80% by weight, more preferably from 30% by weight to 60% by weight. %. When it is less than 20% by weight, the amount of the resin wound around the drill is large. When it exceeds 80% by weight, the strength of the resin layer is lowered.
由本發明所提供在鑽孔用蓋板的金屬箔的至少一個表面上所形成的水溶性樹脂組成物層的厚度隨著鑽孔所用鑽頭的直徑或者待鑽孔包銅層壓板或多層板的結構而變化。通常地,水溶性樹脂組成物層的厚度較佳為5至250微米,更佳為10至200微米。當水溶性樹脂組成物層的厚度小於5微米時,不能獲得足夠的潤滑效果。當水溶性樹脂組成物層的厚度超過250微米時,捲繞鑽頭的蓋板樹脂的量增加。此外,水溶性樹脂組成物層可以進一步包含多種添加劑。例如,根據預期目的可以使用有機或者無機填料、染料、著色顏料等。The thickness of the water-soluble resin composition layer formed on at least one surface of the metal foil of the drilling cover plate provided by the present invention, the diameter of the drill bit used for drilling or the structure of the copper-clad laminate or the multi-layer board to be drilled And change. Generally, the thickness of the water-soluble resin composition layer is preferably from 5 to 250 μm, more preferably from 10 to 200 μm. When the thickness of the water-soluble resin composition layer is less than 5 μm, a sufficient lubricating effect cannot be obtained. When the thickness of the water-soluble resin composition layer exceeds 250 μm, the amount of the cover resin of the wound drill bit increases. Further, the water-soluble resin composition layer may further contain various additives. For example, organic or inorganic fillers, dyes, coloring pigments, and the like can be used depending on the intended purpose.
由本發明提供的在鑽孔用蓋板中所用的金屬箔較佳為厚度為50至300微米的鋁箔。當鋁箔的厚度小於50微米時,鑽孔時易於出現層壓板的毛邊(burrs)。當鋁箔的厚度超過300微米時,難以排出鑽孔時生成的屑片。對於鋁箔材料,較佳純度為至少95%的鋁。其具體實例包括5052、3004、3003、1N30、1050、1070和1085,其各定義在JIS-H4160中。使用高純度鋁箔作為金屬箔減輕了鑽頭的振動,並改進了鑽頭的咬合(biting)性能。高純度鋁箔的上述使用和在鑽頭上的水溶性樹脂組成物層的潤滑效果改進了鑽孔的孔定位精確度。考慮到水溶性樹脂組成物的黏合性,較佳使用在其上形成的黏膜厚度為0.1微米至10微米的鋁箔。用於黏膜的黏合劑的實例包括胺甲酸乙酯黏合劑、乙酸乙烯酯黏合劑、氯乙烯黏合劑、聚酯黏合劑、該等化合物的共聚物黏合劑、環氧黏合劑和氰酸酯黏合劑。The metal foil used in the cover plate for drilling provided by the present invention is preferably an aluminum foil having a thickness of 50 to 300 μm. When the thickness of the aluminum foil is less than 50 μm, the burrs of the laminate are apt to occur during drilling. When the thickness of the aluminum foil exceeds 300 μm, it is difficult to discharge the chips generated at the time of drilling. For aluminum foil materials, aluminum having a purity of at least 95% is preferred. Specific examples thereof include 5052, 3004, 3003, 1N30, 1050, 1070, and 1085, each of which is defined in JIS-H4160. The use of high-purity aluminum foil as a metal foil mitigates the vibration of the drill bit and improves the biting performance of the drill bit. The above-described use of the high-purity aluminum foil and the lubricating effect of the water-soluble resin composition layer on the drill bit improve the hole positioning accuracy of the drilled hole. In view of the adhesiveness of the water-soluble resin composition, it is preferred to use an aluminum foil having a film thickness of 0.1 μm to 10 μm formed thereon. Examples of the adhesive for the mucosa include a urethane adhesive, a vinyl acetate adhesive, a vinyl chloride adhesive, a polyester adhesive, a copolymer adhesive of the compounds, an epoxy adhesive, and a cyanate adhesive. Agent.
作為在金屬箔的至少一個表面上形成水溶性樹脂組成物層的方法,例如將預先製備的水溶性樹脂組成物的板層壓在金屬箔上的方法,以及藉由塗覆法等將水溶性樹脂組成物的熔融材料或者水溶性樹脂組成物的溶液直接施用於金屬箔,然後將其乾燥以在金屬箔上形成水溶性樹脂組成物層的方法。As a method of forming a water-soluble resin composition layer on at least one surface of a metal foil, for example, a method of laminating a plate of a water-soluble resin composition prepared in advance on a metal foil, and water-soluble by a coating method or the like A method in which a molten material of a resin composition or a solution of a water-soluble resin composition is directly applied to a metal foil and then dried to form a water-soluble resin composition layer on the metal foil.
當在諸如包銅層壓板或者多層板的印刷線路板材料上鑽孔時,鑽孔時將本發明的蓋板置於包銅層壓板、多層板或疊置的複數個包銅層壓板或者多層板的至少一個頂表面上,使得蓋板與印刷線路板材料接觸,並且蓋板的水溶性樹脂組成物層的一面朝上,從鑽孔用蓋板的水溶性樹脂組成物層的表面鑽孔。When drilling a hole in a printed wiring board material such as a copper-clad laminate or a multi-layer board, the cover sheet of the present invention is placed in a copper-clad laminate, a multi-layer board or a plurality of laminated copper-clad laminates or a plurality of layers when drilling. The at least one top surface of the plate is such that the cover plate is in contact with the printed wiring board material, and the side of the water-soluble resin composition layer of the cover plate faces upward, and the surface of the water-soluble resin composition layer of the drilling cover plate is drilled hole.
以下將參考實施例和比較例具體闡釋本發明。The invention will be specifically explained below with reference to examples and comparative examples.
在130℃的溫度、氮氣密封下,在捏合機中捏合50重量份多分散性Mw/Mn為1.5、重均分子量Mw為110,000的聚環氧乙烷(ALKOX L11,由Meisei Chemical Works,Ltd.提供)和50重量份的重均分子量Mw為20,000的聚乙二醇(PEG20000,由Sanyo Chemical Industries,Ltd.提供),然後使捏合的混合物通過100℃下的加熱輥,以獲得厚度為50微米的水溶性樹脂組成物板。使水溶性樹脂組成物板經層壓機層壓在厚度為100微米的鋁箔上(由Mitsubishi Aluminum Co.,Ltd.提供,材料3004)以獲得鑽孔用蓋板A。將鑽孔用蓋板A置於疊置的各厚度為0.8毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板A的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.2毫米、旋轉頻率為250,000rpm、進料速度為15微米/轉的條件下進行鑽孔。各鑽頭之鑽數(number of hits)為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。50 parts by weight of polyethylene oxide having a polydispersity Mw/Mn of 1.5 and a weight average molecular weight Mw of 110,000 (ALKOX L11, by Meisei Chemical Works, Ltd.) was kneaded in a kneader at a temperature of 130 ° C under a nitrogen atmosphere. Provided) and 50 parts by weight of polyethylene glycol (PEG 20000, supplied by Sanyo Chemical Industries, Ltd.) having a weight average molecular weight Mw of 20,000, and then passing the kneaded mixture through a heating roll at 100 ° C to obtain a thickness of 50 μm A water-soluble resin composition plate. The water-soluble resin composition sheet was laminated on an aluminum foil having a thickness of 100 μm (provided by Mitsubishi Aluminum Co., Ltd., material 3004) via a laminator to obtain a cover sheet A for drilling. The drilling cover A was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.8 mm (CCL-HL832, copper foil 12 μm on both sides, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover A is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under conditions of a drill diameter of 0.2 mm, a rotational frequency of 250,000 rpm, and a feed rate of 15 μm/rev. Each bit has a number of hits of 2,000 and is drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在140℃的溫度、氮氣氣體下,在捏合機中捏合50重量份多分散性Mw/Mn為1.5、重均分子量Mw為80,000的聚環氧乙烷(ALKOX L8,由Meisei Chemical Works,Ltd.提供)和50重量份的聚氧乙烯單硬脂酸酯(NONION S-40,由NOF CORPORATION提供),然後用擠壓機擠出捏合的混合物,以獲得厚度為100微米的水溶性樹脂組成物板。將水溶性樹脂組成物板置於厚度為100微米的鋁箔的一個表面上(由Nippon Foil Mfg Co.,Ltd提供,材料1N30),其上作為黏膜的聚酯黏合劑(R820,由CEMEDINE Co.,Ltd.提供)已經被塗覆2微米厚度。用100℃下的加熱輥使水溶性樹脂組成物板與鋁箔結合,以獲得鑽孔用蓋板B。將鑽孔用蓋板B置於疊置的各厚度為0.4毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板B的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.15毫米、旋轉頻率為300,000rpm、進料速度為12微米/轉的條件下進行鑽孔。各鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。50 parts by weight of polyethylene oxide having a polydispersity Mw/Mn of 1.5 and a weight average molecular weight Mw of 80,000 (ALKOX L8, by Meisei Chemical Works, Ltd.) was kneaded in a kneader at a temperature of 140 ° C under a nitrogen gas. Provided) and 50 parts by weight of polyoxyethylene monostearate (NONION S-40, supplied by NOF CORPORATION), and then extruding the kneaded mixture with an extruder to obtain a water-soluble resin composition having a thickness of 100 μm board. The water-soluble resin composition sheet was placed on one surface of an aluminum foil having a thickness of 100 μm (supplied by Nippon Foil Mfg Co., Ltd., material 1N30) as a polyester adhesive for the mucosa (R820, by CEMEDINE Co.). , Ltd.) has been coated to a thickness of 2 microns. The water-soluble resin composition plate was bonded to the aluminum foil with a heating roll at 100 ° C to obtain a cover plate B for drilling. The drilled cover plate B was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.4 mm (CCL-HL832, copper foil on both sides 12 micrometers, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover B is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under the conditions of a drill diameter of 0.15 mm, a rotational frequency of 300,000 rpm, and a feed rate of 12 μm/rev. Each drill has a drill number of 2,000 and is drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在攪拌槽中,將60重量份多分散性Mw/Mn為1.1、重均分子量Mw為85,000的聚環氧乙烷(SE-8,由Nihon Waters K.K.提供)和40重量份的聚乙二醇(商標名:PEG20000,由Sanyo Chemical Industries,Ltd.提供)溶解在250重量份的水中以製備樹脂溶液。用模塗布機(die coater)將樹脂溶液施用於厚度為100微米的鋁箔的一個表面(材料:1085),在其上已經塗覆了厚度為5微米的聚酯黏合劑(R820),使得施用的樹脂溶液的厚度為140微米。藉由使所得鋁箔以0.1米/秒的速度經過具有3個室(rooms),每個室的長度為3米的輥支撐型乾燥爐,(預定溫度:60-100-140℃),並使熱空氣以20米/分鐘的風速吹過鋁箔的施用樹脂溶液的表面來乾燥施用的樹脂溶液,由此得到總厚度為140微米的鑽孔用蓋板C。將鑽孔用蓋板C置於疊置的各厚度為0.8毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板C的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.2毫米、旋轉頻率為250,000rpm、進料速度為15微米/轉的條件下進行鑽孔。各鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。60 parts by weight of polyethylene oxide (SE-8, supplied by Nihon Waters KK) having a polydispersity Mw/Mn of 1.1, a weight average molecular weight Mw of 85,000, and 40 parts by weight of polyethylene glycol in a stirred tank (Trade name: PEG 20000, supplied by Sanyo Chemical Industries, Ltd.) was dissolved in 250 parts by weight of water to prepare a resin solution. The resin solution was applied to one surface (material: 1085) of an aluminum foil having a thickness of 100 μm by a die coater, to which a polyester adhesive (R820) having a thickness of 5 μm was applied, so that application was performed. The thickness of the resin solution was 140 microns. By passing the obtained aluminum foil at a speed of 0.1 m/sec through a roll-supported drying oven having 3 chambers each having a length of 3 m (predetermined temperature: 60-100-140 ° C), and allowing hot air The applied resin solution was dried by blowing the surface of the applied resin solution of the aluminum foil at a wind speed of 20 m/min, thereby obtaining a drilling cover plate C having a total thickness of 140 μm. The drilling cover C was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.8 mm (CCL-HL832, copper foil 12 μm on both sides, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover C is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under conditions of a drill diameter of 0.2 mm, a rotational frequency of 250,000 rpm, and a feed rate of 15 μm/rev. Each drill has a drill number of 2,000 and is drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在攪拌槽中,將20重量份多分散性Mw/Mn為1.5、重均分子量Mw為150,000的聚環氧乙烷(ALKOX L15,由Meisei Chemical Works,Ltd.提供)、50重量份的聚乙二醇.對苯二甲酸二甲酯縮聚物(Paogen PP-15,由Daiichi-Kogyo Seiyaku Co;,Ltd.提供)和30重量份的聚氧乙烯單硬脂酸酯(NONION S-40)溶解在250重量份水中以製備樹脂溶液。用模塗布機將樹脂溶液施用於厚度為70微米的鋁箔的一個表面(材料:1070),使得施用的樹脂溶液的厚度為140微米。使所得鋁箔以0.07米/秒的速度經過具有3個室,每個室的長度為3米的輥支撐型乾燥爐,(預定溫度:60-90-120℃),並使熱空氣以15米/分鐘的風速吹過鋁箔的施用樹脂溶液表面,由此得到總厚度為110微米的鑽孔用蓋板D。將鑽孔用蓋板D置於疊置的各厚度為0.4毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板D的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.15毫米、旋轉頻率為300,000rpm、進料速度為12微米/轉的條件下進行鑽孔。各鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。20 parts by weight of polyethylene oxide (ALKOX L15, supplied by Meisei Chemical Works, Ltd.) having a polydispersity Mw/Mn of 1.5 and a weight average molecular weight Mw of 150,000 in a stirring tank, 50 parts by weight of polyethylene Glycol. Dimethyl terephthalate polycondensate (Paogen PP-15, supplied by Daiichi-Kogyo Seiyaku Co;, Ltd.) and 30 parts by weight of polyoxyethylene monostearate (NONION S-40) dissolved in 250 weight A portion of the water was used to prepare a resin solution. The resin solution was applied to one surface (material: 1070) of an aluminum foil having a thickness of 70 μm by a die coater so that the thickness of the applied resin solution was 140 μm. The obtained aluminum foil was passed through a roll-supported drying oven having 3 chambers each having a length of 3 m at a rate of 0.07 m/sec (predetermined temperature: 60-90-120 ° C), and hot air was 15 m / min. The wind speed was blown over the surface of the applied resin solution of the aluminum foil, thereby obtaining a drilling cover D having a total thickness of 110 μm. The drilling cover plate D was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.4 mm (CCL-HL832, copper foil on both sides 12 micrometers, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover D is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under the conditions of a drill diameter of 0.15 mm, a rotational frequency of 300,000 rpm, and a feed rate of 12 μm/rev. Each drill has a drill number of 2,000 and is drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在130℃的溫度、氮氣密封下,在捏合機中捏合50重量份多分散性Mw/Mn為3.5、重均分子量Mw為150,000的聚環氧乙烷(ALKOX R-150,由Meisei Chemical Works,Ltd.提供)和50重量份的重均分子量Mw為20,000的聚乙二醇(PEG20000,由Sanyo Chemical Industries,Ltd.提供),然後使捏合的混合物經100℃下的加熱輥,以獲得厚度為50微米的樹脂組成物板。使樹脂組成物板經層壓機層壓在厚度為100微米的鋁箔上(由Mitsubishi Aluminum Co.,Ltd.提供,材料3004)以獲得鑽孔用蓋板E。將鑽孔用蓋板E置於疊置的各厚度為0.8毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板E的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.2毫米、旋轉頻率為250,000rpm、進料速度為15微米/轉的條件下進行鑽孔。各鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。50 parts by weight of polyethylene oxide having a polydispersity Mw/Mn of 3.5 and a weight average molecular weight Mw of 150,000 (ALKOX R-150, by Meisei Chemical Works, kneaded in a kneader at a temperature of 130 ° C under a nitrogen atmosphere) Ltd. provided) and 50 parts by weight of polyethylene glycol (PEG 20000, supplied by Sanyo Chemical Industries, Ltd.) having a weight average molecular weight Mw of 20,000, and then subjecting the kneaded mixture to a heating roll at 100 ° C to obtain a thickness of 50 micron resin composition plate. The resin composition plate was laminated on an aluminum foil having a thickness of 100 μm (provided by Mitsubishi Aluminum Co., Ltd., material 3004) via a laminator to obtain a cover plate E for drilling. The drilling cover E was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.8 mm (CCL-HL832, copper foil 12 μm on both sides, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover E is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under conditions of a drill diameter of 0.2 mm, a rotational frequency of 250,000 rpm, and a feed rate of 15 μm/rev. Each drill has a drill number of 2,000 and is drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在140℃的溫度、氮氣氣體下,在捏合機中捏合50重量份多分散性Mw/Mn為3.5、重均分子量Mw為150,000的聚環氧乙烷(ALKOX R-150,由Meisei Chemical Works,Ltd.提供)和50重量份的聚氧乙烯單硬脂酸酯(NONION S-40,由NOF CORPORATION提供),然後用擠壓機擠出捏合的混合物,以獲得厚度為100微米的板。將該板置於厚度為100微米的鋁箔的一個表面上(由Nippon Foil Mfg Co.,Ltd提供,材料1N30),其上作為黏膜的聚酯黏合劑(R820,由CEMEDINE Co.,Ltd.提供)已經被塗覆2微米厚度。用100℃下的加熱輥使該板與鋁箔結合,以獲得鑽孔用蓋板F。將鑽孔用蓋板F置於疊置的各厚度為0.4毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板F的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.15毫米、旋轉頻率為300,000rpm、進料速度為12微米/轉的條件下進行鑽孔。每鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示了結果。50 parts by weight of polyethylene oxide (ALKOX R-150, having a weight average molecular weight Mw of 150,000) having a polydispersity Mw/Mn of 3.5 and a weight average molecular weight of 150,000 was kneaded in a kneader at a temperature of 140 ° C under a nitrogen gas (by Meisei Chemical Works, Ltd. supplied) and 50 parts by weight of polyoxyethylene monostearate (NONION S-40, supplied by NOF CORPORATION), and then the kneaded mixture was extruded by an extruder to obtain a plate having a thickness of 100 μm. The plate was placed on one surface of an aluminum foil having a thickness of 100 μm (supplied by Nippon Foil Mfg Co., Ltd., material 1N30), and a polyester adhesive (R820, supplied by CEMEDINE Co., Ltd.) as a mucous film thereon. ) has been coated to a thickness of 2 microns. The plate was bonded to an aluminum foil with a heating roll at 100 ° C to obtain a cover plate F for drilling. The drilling cover F was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.4 mm (CCL-HL832, copper foil 12 μm on both sides, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover F is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under the conditions of a drill diameter of 0.15 mm, a rotational frequency of 300,000 rpm, and a feed rate of 12 μm/rev. The number of drills per drill was 2,000 and was drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在攪拌槽中,將60重量份多分散性Mw/Mn為3.5、重均分子量Mw為150,000的聚環氧乙烷(ALKOX R-150,由Meisei Chemical Works,Ltd.提供)和40重量份的聚乙二醇(商標名:PEG20000,由Sanyo Chemical Industries,Ltd.提供)溶解在250重量份的水中以製備樹脂溶液。用模塗布機將樹脂溶液施用於厚度為100微米的鋁箔的一個表面(材料:1085),在其上已經塗覆了厚度為5微米的聚酯黏合劑(R820),使得所施用樹脂溶液的厚度為140微米。藉由使所得鋁箔以0.1米/秒的速度經過具有3個室,每個室的長度為3米的輥支撐型乾燥爐,(預定溫度:60-100-140℃),並使熱空氣以20米/分鐘的風速吹過鋁箔的施用樹脂溶液的表面來乾燥施用的樹脂溶液,由此得到總厚度為140微米的鑽孔用蓋板G。將鑽孔用蓋板G置於疊置的各厚度為0.8毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板G的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.2毫米、旋轉頻率為250,000rpm、進料速度為15微米/轉的條件下進行鑽孔。每鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示了結果。60 parts by weight of polyethylene oxide (ALKOX R-150, supplied by Meisei Chemical Works, Ltd.) having a polydispersity Mw/Mn of 3.5 and a weight average molecular weight Mw of 150,000 and 40 parts by weight in a stirring tank Polyethylene glycol (trade name: PEG 20000, supplied by Sanyo Chemical Industries, Ltd.) was dissolved in 250 parts by weight of water to prepare a resin solution. The resin solution was applied to a surface (material: 1085) of an aluminum foil having a thickness of 100 μm by a die coater to which a polyester adhesive (R820) having a thickness of 5 μm was applied so that the applied resin solution The thickness is 140 microns. By passing the obtained aluminum foil at a speed of 0.1 m/sec through a roll-supported drying oven having 3 chambers each having a length of 3 m (predetermined temperature: 60-100-140 ° C) and allowing hot air to be 20 m The wind speed of /min was blown through the surface of the applied resin solution of the aluminum foil to dry the applied resin solution, thereby obtaining a drilling cover plate G having a total thickness of 140 μm. The drilling cover G was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.8 mm (CCL-HL832, copper foil on both sides 12 micrometers, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover G is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under conditions of a drill diameter of 0.2 mm, a rotational frequency of 250,000 rpm, and a feed rate of 15 μm/rev. The number of drills per drill was 2,000 and was drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
在攪拌槽中,將20重量份多分散性Mw/Mn為3.5、重均分子量Mw為150,000的聚環氧乙烷(ALKOX R150,由Meisei Chemical Works,Ltd.提供)、50重量份的聚乙二醇‧對苯二甲酸二甲酯縮聚物(Paogen PP-15)和30重量份的聚氧乙烯單硬脂酸酯(NONION S-40)溶解在250重量份水中以製備樹脂溶液。用模塗布機將樹脂溶液施用於厚度為70微米的鋁箔的一個表面(1070),使得施用的樹脂溶液的厚度為140微米。使所得鋁箔以0.07米/秒的速度經過具有3個室,每個室的長度為3米的輥支撐型乾燥爐,(預定溫度:60-90-120℃),並使熱空氣以15米/分鐘的風速吹過鋁箔的施用樹脂溶液的表面,由此得到總厚度為110微米的鑽孔用蓋板H。將鑽孔用蓋板H置於疊置的各厚度為0.4毫米的三個包銅層壓板的頂表面上(CCL-HL832,兩側的銅箔12微米,由Mitsubishi Gas Chemical Company,Inc.提供)使得蓋板H的水溶性樹脂組成物層的一面朝上。將墊板(酚醛樹脂板)置於疊置的包銅層壓板的較下側。在鑽頭直徑為0.15毫米、旋轉頻率為300,000rpm、進料速度為12微米/轉的條件下進行鑽孔。每鑽頭之鑽數為2,000,用15個鑽頭鑽孔。評估在鑽頭周圍捲繞樹脂的程度和孔定位精確度。表1顯示結果。20 parts by weight of polyethylene oxide (ALKOX R150, supplied by Meisei Chemical Works, Ltd.) having a polydispersity Mw/Mn of 3.5 and a weight average molecular weight Mw of 150,000 in a stirring tank, 50 parts by weight of polyethylene A diol ‧ terephthalate condensate (Paogen PP-15) and 30 parts by weight of polyoxyethylene monostearate (NONION S-40) were dissolved in 250 parts by weight of water to prepare a resin solution. The resin solution was applied to one surface (1070) of an aluminum foil having a thickness of 70 μm by a die coater so that the thickness of the applied resin solution was 140 μm. The obtained aluminum foil was passed through a roll-supported drying oven having 3 chambers each having a length of 3 m at a rate of 0.07 m/sec (predetermined temperature: 60-90-120 ° C), and hot air was 15 m / min. The wind speed was blown over the surface of the applied resin solution of the aluminum foil, thereby obtaining a drilling cover plate H having a total thickness of 110 μm. The drilling cover H was placed on the top surfaces of the stacked three copper-clad laminates each having a thickness of 0.4 mm (CCL-HL832, copper foil 12 μm on both sides, supplied by Mitsubishi Gas Chemical Company, Inc. The side of the water-soluble resin composition layer of the cover H is made to face upward. A backing plate (phenolic resin sheet) was placed on the lower side of the stacked copper-clad laminate. Drilling was carried out under the conditions of a drill diameter of 0.15 mm, a rotational frequency of 300,000 rpm, and a feed rate of 12 μm/rev. The number of drills per drill was 2,000 and was drilled with 15 drill bits. The degree of winding of the resin around the drill bit and the accuracy of the hole positioning were evaluated. Table 1 shows the results.
1)捲繞樹脂的程度:在2,000次鑽孔後,用顯微鏡以25倍的放大倍數觀察15個鑽頭中的每一個,從而獲得以鑽頭直徑計的在鑽頭周圍捲繞的樹脂的最大直徑。以以下1至3等級評價這15個鑽頭(小於鑽頭直徑的1.5倍:非常小,鑽頭直徑的1.5至5倍:小,大於鑽頭直徑的5倍:大)。「在15個鑽頭中的相關鑽頭的數目」代表捲繞的程度。1) Degree of winding of the resin: After 2,000 holes were drilled, each of the 15 drill bits was observed with a microscope at a magnification of 25 times, thereby obtaining the maximum diameter of the resin wound around the drill bit in terms of the diameter of the drill. The 15 drill bits were evaluated on the following 1 to 3 scales (less than 1.5 times the diameter of the drill: very small, 1.5 to 5 times the diameter of the drill: small, greater than 5 times the diameter of the drill: large). "The number of related drill bits among the 15 drill bits" represents the degree of winding.
2)孔定位精確度:用孔分析儀(由Hitachi Via Mechanics,Ltd.提供)測量每個鑽頭經2,000次形成的孔位置相對於在疊置的包銅層壓板的最低包銅層壓板的背面上的目標座標的位移。得到其平均值和標準偏差(σ)。由此,計算「平均值+3σ」和「最大值」。表1顯示了在15個鑽孔加工中的「平均值+3σ」和「最大值」的平均值。2) Hole positioning accuracy: The hole position of each drill bit was measured 2,000 times with respect to the back surface of the lowest copper-clad laminate on the laminated copper-clad laminate using a hole analyzer (supplied by Hitachi Via Mechanics, Ltd.). The displacement of the target coordinates on the top. The mean and standard deviation (σ) are obtained. Thus, "average + 3σ" and "maximum value" are calculated. Table 1 shows the average of "average + 3σ" and "maximum value" in 15 drilling processes.
3)分子量測量:採用水溶性GPC進行分子量的測量,其中ShodexSB-G、ShodexSB-803HQ和ShodexSB-806MHQ(由Showa Denko K. K.提供)的柱順序排列。在下述條件下測量聚合物化合物的數均分子量和重均分子量。分析樣品的測量條件:3) Molecular weight measurement: The molecular weight was measured using a water-soluble GPC in which the columns of Shodex SB-G, Shodex SB-803HQ and Shodex SB-806MHQ (supplied by Showa Denko K. K.) were sequentially arranged. The number average molecular weight and the weight average molecular weight of the polymer compound were measured under the following conditions. Analyze the measurement conditions of the sample:
載體:50mM-NaCl水溶液。Carrier: 50 mM-NaCl aqueous solution.
流速:0.7毫升/分鐘。Flow rate: 0.7 ml/min.
爐溫:35℃。Furnace temperature: 35 ° C.
樣品的注入體積:20微升。Injection volume of the sample: 20 microliters.
檢測:差示折射計(RID-6A,由Shimadzu Corporation提供)。Detection: Differential refractometer (RID-6A, supplied by Shimadzu Corporation).
標準物質:聚乙二醇試劑盒(由POLYMER LABORATORIES Ltd.提供)。Reference material: Polyethylene glycol kit (supplied by POLYMER LABORATORIES Ltd.).
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| JP4821930B2 (en) * | 2008-06-10 | 2011-11-24 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| WO2011025144A2 (en) * | 2009-08-26 | 2011-03-03 | (주)상아프론테크 | Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same |
| RU2526106C1 (en) * | 2010-09-17 | 2014-08-20 | Мицубиси Гэс Кемикал Компани, Инк. | Stencil for hole drilling |
| MY154888A (en) | 2011-01-07 | 2015-08-11 | Mitsubishi Gas Chemical Co | Drill entry sheet |
| CN102501468B (en) * | 2011-11-30 | 2014-06-04 | 湖南科技大学 | Manufacturing method of aluminum-based cover plate for drilling |
| TWI560049B (en) * | 2014-10-15 | 2016-12-01 | Uniplus Electronics Co Ltd | A drilling entry board |
| TWI549598B (en) * | 2014-11-05 | 2016-09-11 | Shu-Jing Yang | Method for manufacturing heat -resistant auxiliary sheet |
| US10486324B2 (en) * | 2015-03-19 | 2019-11-26 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and method for drilling processing using same |
| MY186196A (en) * | 2015-03-19 | 2021-06-30 | Mitsubishi Gas Chemical Co | Entry sheet for drilling and method for drilling processing using same |
| CN106001696A (en) * | 2016-05-26 | 2016-10-12 | 深圳市柳鑫实业股份有限公司 | PCB mechanically-drilled cover plate and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW566064B (en) * | 2001-10-31 | 2003-12-11 | Mitsubishi Gas Chemical Co | Entry sheet for drilling and method for drilling hole |
| TW200417303A (en) * | 2003-01-28 | 2004-09-01 | Mitsubishi Gas Chemical Co | Lubricant sheet for drilling and method of drilling |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747586A (en) * | 1993-08-02 | 1995-02-21 | Gunze Ltd | Water-soluble sheet |
| JP4896533B2 (en) * | 2006-01-25 | 2012-03-14 | 三菱瓦斯化学株式会社 | Resin composite copper foil and method for producing the same |
| JP5011823B2 (en) * | 2006-05-30 | 2012-08-29 | 三菱瓦斯化学株式会社 | Method of manufacturing entry sheet for drilling |
| JP4821930B2 (en) * | 2008-06-10 | 2011-11-24 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
-
2008
- 2008-12-24 JP JP2008327700A patent/JP4752910B2/en not_active Expired - Fee Related
- 2008-12-25 TW TW097150610A patent/TWI419634B/en not_active IP Right Cessation
- 2008-12-26 KR KR1020080134261A patent/KR101262165B1/en not_active Expired - Fee Related
- 2008-12-26 CN CN2008101873372A patent/CN101468404B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW566064B (en) * | 2001-10-31 | 2003-12-11 | Mitsubishi Gas Chemical Co | Entry sheet for drilling and method for drilling hole |
| TW200417303A (en) * | 2003-01-28 | 2004-09-01 | Mitsubishi Gas Chemical Co | Lubricant sheet for drilling and method of drilling |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4752910B2 (en) | 2011-08-17 |
| TW200938039A (en) | 2009-09-01 |
| CN101468404B (en) | 2010-12-29 |
| KR20090071467A (en) | 2009-07-01 |
| JP2009172752A (en) | 2009-08-06 |
| HK1130226A1 (en) | 2009-12-24 |
| KR101262165B1 (en) | 2013-05-14 |
| CN101468404A (en) | 2009-07-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |