TWI419425B - Semiconductor device socket - Google Patents

Description

Slot for semiconductor device

The present invention is a socket for a semiconductor device including a holding mechanism that can selectively and selectively hold a semiconductor device.

A semiconductor device mounted on an electronic device or the like (for example, an integrated circuit and an IC package (EIAJED-7303A: Electronic Information Technology Industry Association)) is removed after various tests are performed before being mounted. Its potential flaws. The test is carried out, for example, in a state in which the semiconductor device is mounted in the socket for the semiconductor device.

The socket for a semiconductor device to be used for such a test is generally referred to as an IC socket and is disposed on a predetermined printed wiring board (test board). The printed wiring board is an input/output unit that sends an abnormality detection signal indicating a short circuit or the like from the semiconductor device as the inspection object, while the test voltage is supplied.

The semiconductor device slot is, for example, a top-opening type slot, and is also disposed on a printed wiring board (not shown) to electrically connect the semiconductor device, as disclosed in Japanese Laid-Open Patent Publication No. 2003-133022. A socket body that accommodates the contact terminal group of the printed wiring board, and a positioning member that is disposed at a position above the contact group in the slot body and has a housing portion in which the semiconductor device is mounted (Japanese Patent Laid-Open No. 2003-- In the case of the 133 022, it is referred to as a base, and is disposed around the positioning member as a pair of pressing members that selectively hold the semiconductor device with respect to the accommodating portion of the positioning member (for example, in Japanese Laid-Open Patent Publication No. 2003-133022) a latching mechanism of the holding member that is formed by the pressing lever member and the pressing member, and a cover that transmits the operating force to the latching mechanism by operating the pressing member via a predetermined driving mechanism The body member is composed of.

When the lid member is attached or detached to the accommodating portion by the locating member of the semiconductor device, the lid member has an opening through which the semiconductor device passes. The cover member is disposed so as to be movable up and down with respect to the slot body, and is coupled to the above-described drive mechanism. The drive mechanism is, for example, an actuating pin including a base end portion that connects the lid member and the pressing member of the latch mechanism, and a pivot pin that rotates the pressing member in response to the lifting and lowering of the lid member.

The positioning member is fixed to the socket body, and is positioned, for example, by the outer peripheral portion of the semiconductor device mounted in the housing portion, and the relative position of the terminal of the semiconductor device to the contact terminal group is positioned.

The pair of pressing members of the latch mechanism are disposed to face each other across the mounted semiconductor device. The pressing member includes a base end portion coupled to the drive mechanism, and an abutting portion selectively contacting or isolating the upper surface of the outer peripheral surface of the IC package of the semiconductor device, and rotatably supported by the insertion portion The groove body is configured by connecting a joint portion at which the base end portion abuts.

When the semiconductor device is mounted in the accommodating portion, the contact portion of the pressing member is a standby position in which the occluding portion is not interfered with the semiconductor device, and the semiconductor device is mounted in the accommodating portion, and the pressing member is pressed. The abutting portion is formed to intrude into the accommodating portion and adopt a holding position.

In this configuration, when the semiconductor device is attached to the accommodating portion of the positioning member via the opening of the lid member, the lid member pushes the predetermined stroke downward from the upper position of the socket body and the positioning member. The holding portion is held such that the abutting portions of the pair of pressing members are separated from each other by the accommodating portion of the positioning member, and the semiconductor device can be mounted in the accommodating portion.

Then, the lid member is released from the held state, so that the lid member is raised to the initial position by the spring force of the spring member, whereby the abutting portion of the pair of pressing members is from the standby position. The accommodating portions of the positioning members are adjacent to each other, and are slidably attached to the upper surface of the outer peripheral surface of the IC package of the semiconductor device, and the abutting portion of the pressing member is such that the terminal of the semiconductor device positioned by the positioning member is in the holding position. The situation in which the contact terminal group is pushed. Therefore, the semiconductor device is held as a housing portion for the positioning member.

Further, in Japanese Laid-Open Patent Publication No. 2003-133022, a pressing member having such a contact portion is provided in a urging member that is rotatably supported by a socket body via a spring member. Front end. Thereby, even if the thickness of the semiconductor device or the like is uneven, the spring member can absorb the unevenness, and thus the effect of holding the semiconductor device can be exhibited with a constant contact pressure.

Further, as shown in Japanese Laid-Open Patent Publication No. 2003-168532, it is proposed to slidably move the tip end of the latch mechanism as a pressing member in order to suppress application of local stress or shear stress to the pressed semiconductor device. The ground is provided with a shaking member.

When the semiconductor device is attached to the accommodating portion of the positioning member via the opening of the lid member, as described above, the abutting portions of the pair of pressing members approach each other from the standby position to the accommodating portion of the positioning member. At this time, the contact portion is a semiconductor device that is slidably attached to the outer peripheral surface of the IC package by a minute operation. In particular, in response to the test, when the abutting portion is repeatedly slid over the outer peripheral surface of the IC package of a semiconductor device, or under a semiconductor device, the number of contact terminals is increased to make it When the contact pressure is increased in a state in which the pressing force of the joint portion is increased, the abutting portion forms a scratch on the outer circumferential surface of the IC package of the semiconductor device. As a result, as a good semiconductor device, in the visual inspection, the flaw on the outer peripheral surface of the IC package is regarded as a defective product in appearance, and the yield is lowered.

In view of the above drawbacks, the present invention provides a socket for a semiconductor device including a holding mechanism capable of selectively holding a semiconductor device, and when the semiconductor device is held, scratches are not applied to the outer peripheral surface of the IC package of the semiconductor device. Further, it is possible to maintain a slot for a semiconductor device of a semiconductor device.

In order to achieve the above object, a socket for a semiconductor device according to the present invention includes: a semiconductor device mounting portion in which a semiconductor device is detachably mounted, and a contact terminal group electrically connected to a terminal of the semiconductor device And the semiconductor device mounted on the semiconductor device mounting portion, when the surface of the IC package is close to the surface of the IC package, moves toward the surface perpendicular to the surface and has abutting surface a pushing member of the pressing surface; and the semiconductor device mounting portion is supported to the socket body in proximity or isolation with the pressing member, one end is movably coupled to the pressing member, and the other end is connected The pressing member support body of the driving means; and the pressing member interlocked with the movement of the pressing member support by the driving means, and the semiconductor device mounted on the semiconductor device mounting portion faces the surface of the IC package When approaching, the pressing surface of the pressing member limits the position of the sliding portion of the pressing member in such a manner as to move in a direction orthogonal to the surface to abut against the surface. The position limiting guide is configured to guide at the same time.

According to the semiconductor device socket of the present invention, when the semiconductor device mounted on the semiconductor device mounting portion is close to the surface of the IC package, the semiconductor device is moved in a direction orthogonal to the surface with respect to a pressing surface that is approximately parallel to the surface. a pressing member having a pressing surface abutting against the surface; and the semiconductor device mounting portion is supported to the socket body in proximity or isolation with the pressing member, and one end is opposite to the inner peripheral portion of the pressing member The other end is connected to the pressing member support of the driving means, and the position limiting guiding portion is a pressing member, and the IC package is mounted on the semiconductor device mounted in the semiconductor device mounting portion. When the surface of the body approaches, the pressing surface of the pressing member guides while restraining the position of the sliding portion of the pressing member while moving in a direction orthogonal to the surface to abut against the surface, thereby maintaining In the case of the semiconductor device, the semiconductor device can be held without scratching the outer peripheral surface of the IC package of the semiconductor device socket.

Further features of the present invention will be apparent from the following description of exemplary embodiments.

Fig. 3 is an external view showing an example of expanding a slot for a semiconductor device of the present invention.

The slot for the semiconductor device is placed on the printed wiring board PB (see FIG. 15). The printed wiring board PB is an output unit that supplies an abnormality detection signal indicating a short circuit or the like from a semiconductor device as a test object, which is supplied with a predetermined test voltage. In addition, in FIG. 3, one slot for a semiconductor device which is a plurality of slots for semiconductor devices which are arranged vertically and horizontally on the printed wiring board PB is shown.

In the third embodiment, the semiconductor device socket is a contact pin module including a terminal portion (terminal portion) electrically connected to the printed wiring board PB and a terminal of the semiconductor device DVA or the semiconductor device DVB described below. 36 (refer to FIG. 15), and a socket body 10 having a module housing portion 10A for accommodating the contact pin module 36, and a terminal portion of the contact pin module 36 of each electrode as a semiconductor device DVA a base member 14 of the positioning member, and a cover member 12 that is rotatably disposed on the slot body 10 to selectively close or isolate the pressing member support 18 described below, and possibly movably In the push member support member 18, the pressing member 20 for holding or disassembling the respective terminals of the semiconductor device DVA is pushed to the contact pin 28ai of the contact pin module 36 in response to the lifting operation of the lid member 12. The elements are composed.

Further, an element side arranging plate 16 that is arranged at an upper portion of the terminal of the contact pin module 36 is disposed below the chassis 14, and is movably moved toward the socket body 10 with respect to the element side arranging plate 16 via the contact pin module 36. In the arrangement, the substrate-side alignment plates 26 of the fixed-side terminals of the terminals of the contact pin module 36 are arranged.

As shown in Fig. 4, the element-side arranging plate 16 includes a contact array portion 16B in which a plurality of fine holes in which the contact portions of the contact pins 28ai described below are disposed are vertically and horizontally formed at the center portion thereof, and The claw portion 16N projecting from the contact pin module is formed from four of the four corner portions of the rectangular flat contact portion 16B.

The respective holes of the contact array portion 16B are formed corresponding to the respective terminals of the semiconductor device DVA and the contact pins. Further, each of the fine holes is set to have a relative position of the base 14 to the positioning projection 14PS. That is, the position of the positioning projection 14PS is set in accordance with each of the fine holes. Therefore, by the positioning protrusions 14PS, the relative positions of the respective terminals of the semiconductor device DVA with respect to the respective fine holes are positioned, and the relative positions of the respective terminals of the semiconductor device DVA with respect to the contact pins of the contact pin module 36 are positioned.

The distal end of each of the claw portions 16N is locked to each of the locking portions of the semiconductor device 10 corresponding to the illustration. Between the element-side aligning plate 16 and the contact pin module 36, a coil spring (not shown) that pushes the element-side arranging plate 16 toward the contact pin module 36 in the direction of isolation is provided. Thereby, the element side alignment plate 16 is supported by the upper portion of the contact pin module 36 so as to be liftable.

A component biasing mechanism is provided at a portion of the fixed corner portion of the contact array portion 16B.

As shown in FIG. 4, the substrate-side aligning plate 26 is a locking piece 26N having three portions that are selectively locked to the socket body 10. The locking piece 26N is provided in three places, and when the board-side aligning plate 26 is attached to the socket main body 10 at the time of manufacture, in order to prevent the mounting direction of the mounting side from being an erroneous direction which is not an appropriate direction. Further, a pair of protruding pieces 26P are formed on the lower surface of the socket main body 10 of the board 26 on the substrate side. When the socket body 10 is attached to the substrate, the protruding piece 26P is inserted into the groove formed in the lower portion of the socket body 10 or pulled out from the groove. Therefore, the substrate-side aligning plate 26 is in a state in which the fixed-side terminal of the terminal of the pin module 36 is arranged to protrude from the concave portion of the lower end portion of the socket main body 10 as shown in Fig. 15, and as shown in Fig. 1 The person who is in the state of being accommodated in the recess. Further, the protruding piece 26P is inserted into the lower portion of the socket body 10 to prevent the hook member (not shown) formed by the contact pin module 36 of the socket body 10 from being held by the contact pin module 36. The situation of falling off.

A semiconductor device DVA (see FIG. 9A) as a test object is a semiconductor device in which a BGA-type IC package (EIAJED-7303A: Electronic Information Technology Industry Association standard) is formed. In the semiconductor device DVA, the bump type electrode to be connected to the contact pin module 36 via the pores of the contact array portion 16B of the element side alignment plate 16 is formed on one side of the element side alignment plate 16 to be described later. The terminals are formed in a plurality of layers across the entire interval.

Further, the semiconductor device DVA is not limited to a semiconductor device formed of a BGA type IC package, and may be, for example, a semiconductor device formed of an LGA type or QFN type IC package.

As shown in FIG. 3, at the outer peripheral portion of each side of the socket main body 10, guide grooves 10G are formed at predetermined intervals so that the respective guide claw portions 12N of the lid member 12 to be described later can be engaged with each other. . The guide groove 10G is formed substantially perpendicularly to the bottom surface portion of the socket body 10. At one end of each of the grooves 10G, as shown in Fig. 3, when the lid member 12 is at the uppermost position, the tip end of the claw portion 12N is locked.

Between the pair of guide grooves 10G of the two long sides of at least four sides of the socket body 10, as shown in Fig. 4, when the cover member 12 has to be lowered, the arm portion of the cover member 12 described below is caused The recesses 10RR and 10LR into which the 12RL and 12LL are inserted are formed approximately parallel to the guide groove 10G.

In addition, in the fourth embodiment, one end portion of the coil spring 30 described below is formed at a portion where the wall portion 10RW on the long side of the outer peripheral portion of the socket main body 10 and the wall portion 10SW on the short side are formed. A spring receiving portion is provided. In addition, in the fourth figure, the intersection of the wall portion 10LW with respect to the wall portion 10RW and the other wall portion 10SW on the short side is not shown, but each of the following is formed adjacent to each other. A spring receiving portion disposed at one end of the coil spring 32. Further, a gap portion in which the spring receiving end portion 16EB of the element biasing mechanism described below is fixed is formed between the spring receiving portions disposed at one end of the coil spring 32.

At a central portion of the socket body 10, a module housing portion 10A in which the contact pin module 36 is housed is formed (see Fig. 15). The contact arrangement portion 16B of the element side alignment plate 16 is disposed on the upper portion of the module housing portion 10A.

Between the module housing portion 10A and the recess portions 10RR and 10LR, a notch portion through which the pressing member support 18 and the pressing member 20 pass is formed. Further, as shown in Fig. 4, the guide grooves 10RB and 10LB for guiding the both end portions of the guide pins 27 to be described later are formed in the wall portions forming the respective notch portions. The pair of guide grooves 10RB formed to be isolated from each other are formed on the bottom surface of the socket body 10 approximately in parallel. The pair of guide grooves 10LB formed to be isolated from each other are also formed in parallel on the bottom surface of the socket body 10.

Further, the chassis 14 is placed on the contact array portion 16B of the socket body 10. The chassis 14 is a positioning protrusion 14PS that is engaged with each corner of the outer peripheral portion of the IC package of the semiconductor device DVA to be mounted, and has three portions at the bottom of the semiconductor device housing portion 14A to be described later. Thereby, a predetermined gap is formed between the electrode portion of the IC package of the semiconductor device DVA positioned by the positioning protrusion 14PS and the surface of the contact array portion 16B.

The base 14 is engaged with the socket body 10 by a claw portion of a plurality of portions integrally formed on the side surface, and is fixed to the socket body 10. As shown in FIG. 4, the base 14 formed in a rectangular frame shape has a semiconductor device accommodating portion 14A that accommodates the semiconductor device DVA disposed above the contact array portion 16B at the center portion. As described below, the relative position of the bottom portion of the semiconductor device housing portion 14A that blocks the semiconductor device DVA to the contact pin module 36 is set regardless of the thickness of the semiconductor device DVA.

The semiconductor device housing portion 14A is opened toward the lid member 12 and the contact array portion 16B. In the periphery of the opening of the bottom portion of the semiconductor device accommodating portion 14A, there are corners of the three portions formed by the positioning projections 14PS (see FIG. 17). Further, as shown in Fig. 4, a hole 14a through which the tip end portion of the bias arm 40 of the element biasing mechanism described below passes is formed in a corner portion of the inner portion.

Further, a rectangular hole 14H is formed in a central portion of each of the outer portions of the semiconductor device housing portion 14A. When the semiconductor device DVA is attached or detached to the hole 14H of the wall portion 10RW and the wall portion 10LW, the pressing member support 18 and the pressing member 20 described below are passed. A pair of sliding surfaces 14SW are formed in parallel with each other on the periphery of the hole 14H in the outer peripheral portion of the chassis 14. Each of the sliding surfaces 14SW is formed to be approximately perpendicular to the surface of the contact array portion 16B. Thereby, the sliding surface 14SW is above the contact array portion 16B, and is approximately perpendicular to the plane of the upper surface of the IC package including the semiconductor device DVA positioned by the positioning protrusion 14PS.

When the semiconductor device DVA is attached to the chassis 14 as the sliding contact surface 14SW of the position restricting guide portion of the above-described pressing member 20, the rotation angle of each sliding portion 20UE of the pressing member 20 is restricted, and each sliding portion is guided. 20UE for the smooth movement below. Further, when the chassis 14 is detached from the semiconductor device DVA, the sliding contact surface 14SW is a smooth movement of the guiding pressing member 20 above the sliding portion 20UE.

As shown in FIG. 9A, the frame-shaped lid member 12 has a central portion in which the opening portion 12a through which the upper end portion of the semiconductor device DVA or the chassis 14 passes. The arm members 12RL and 12LL are vertically protruded from the recessed portions 10RR and 10LR of the above-described slot body 10 of the cover member 12, respectively.

Since the arm members 12RL and 12LL have the same structure with each other, the structure of the arm member 12RL will be described, and the description of the structure of the arm member 12LL will be omitted.

One end of the pressing member support 18 is coupled to the lower end of the arm member 12RL formed at approximately the H-shaped ground. A hole that is provided at one end of the pressing member support 18 between the leg portions of the arm member 12RL and a hole of each leg portion of the arm member 12RL pass through the common connecting pin 24. Thereby, the pressing member support 18 is made rotatable with respect to the leg portion of the arm member 12RL.

At the end portions of the respective sides of the lid member 12, the guide claw portions 12N that are respectively engaged with the guide grooves 10G of the socket body 10 protrude toward the socket body 10.

At a predetermined one of the four corner portions of the cover member 12, as shown in Figs. 1 and 4, the cam piece 12CA constituting one of the element biasing mechanisms is formed approximately parallel to the guide claw portion 12N. .

At a position adjacent to the corner portion of the cam piece 12CA in which the cover member 12 is provided, the two coil springs 32 that push the cover member 12 upward are provided to be spaced apart from each other under the cover member 12 or the above Between the spring receiving portions of the socket body 10.

Further, in the corner portion of the three portions other than the corner portion of the lid member 12, three coil springs 30 having a larger diameter than the diameter of the coil spring 32 are provided on the lower surface of the socket body 10. Between the spring receiving parts. The three coil springs 30 are engaged with the two coil springs 32 to push the cover member 12 upward.

For example, as shown in Japanese Laid-Open Patent Publication No. 2002-202344, the contact pin module 36 is a pair of side plates which are respectively formed at both end portions thereof, and the side plates are mutually parallel to each other via a spacer. A plurality of overlapping lead frames are used as the main elements. Further, the contact pin 28ai is not limited to the contact pin module 36. For example, as shown in Japanese Laid-Open Patent Publication No. 2003-133022, the lower end portion of each contact pin 28ai is pressed into the slot. The contact pin mounting hole of the body may be fixed with the contact pin 28ai.

As shown in the enlarged view of Fig. 16, the element biasing mechanism for pressing the corner portions of the three portions of the semiconductor device DVA to the positioning projections 14PS respectively includes: the cam follower member 38, and is connected to the cam from The biasing arm 40 at one end of the movable member 38 and the cam piece 12CA of the cover member 12 that is engaged with the hole 38CF of the cam follower member 38 when the semiconductor device DVA is attached or detached.

The cam follower member 38 is a sliding contact surface 16S that is movably disposed at the upper end of the spring receiving end portion 16EB that is connected to the contact array portion 16B of the element-side array plate 16 . The spring receiving end portion 16EB is a notch portion that penetrates the above-described socket body 10 toward the outside. The cam follower member 38 is movably guided to the guide piece 16SG integrally formed with respect to the outer peripheral portion of the spring receiving end portion 16EB. A coil spring 42 that pushes the cam follower member 38 toward the inside of the base 14 via the hole 14a of the base 14 is disposed inside the spring receiving end portion 16E.

As shown in Fig. 16, when the lid member 12 takes the uppermost position, the cam piece 12CA of the lid member 12 is disposed at a position directly above the hole 28CF of the cam follower member 38.

The hole formed at one end of the bias arm 40 is a coupling pin 38P that is fitted to one end of the cam follower member 38. Thereby, as shown in Fig. 17, the biasing arm 40 and the cam follower member 38 are connected such that the central axis of the biasing arm 40 is located on a line in common with the central axis of the cam follower member 38. . The front end portion of the biasing arm 40 is a collision portion having a corner portion that collides with the semiconductor device DVA. The collision portion is formed by bending the center axis of the bias arm 40 toward one side, and has a recess that engages with a corner portion of the semiconductor device DVA.

In such a configuration, when the semiconductor device DVA is placed in the chassis 14 placed on the contact array portion 16B of the element-side alignment plate 16, as shown in Figs. 18 and 19, first, the cover The member 12 is pushed downward so that the inclined surface of the cam piece 12CA is engaged with the circumference of the hole 38CF, and the cam piece 12CA is inserted into the hole 38CF. Thereby, the cam follower member 38 is moved against the spring force of the coil spring 42 in a direction separating from the base 14.

Thereafter, when the cover member 12 is maintained at the lowermost position, the semiconductor device DVA is placed in the chassis 14. At this time, the corner portions of the three portions of the semiconductor device DVA are engaged with the positioning protrusions 14PS. Further, Fig. 17 and Fig. 19 are diagrams showing a positioning projection 14PS in the three positioning projections 14PS.

Then, when the pressing force for the lid member 12 is released, the lid member 12 is raised upward by the elastic force of the coil springs 30 and 32. Thereby, as shown in Figs. 16 and 17, the cam piece 12CA is isolated by the hole 38CF, so that the cam follower member 38 is moved toward the direction close to the base 14 by the spring force of the coil spring 42. By pushing, the recess of the biasing arm 40 is engaged with a corner portion of the IC package of the semiconductor device DVA, so that the corner portions of the three portions of the IC package are pressed against the positioning projection 14PS. Therefore, the semiconductor device DVA is positioned to the chassis 14 and the contact array portion 16B.

On the other hand, when the semiconductor device DVA is removed from the chassis 14 of the element-side aligning plate 16, first, as shown in Figs. 18 and 19, the cover member 12 is pushed all the way downward to the lowermost position, so that the cam After the inclined surface of the sheet 12CA is engaged with the periphery of the hole 38CF, the cam piece 12CA is held in a state of being inserted into the hole 38CF. Thereby, the cam follower member 38 is caused to move against the spring force of the coil spring 42 toward the direction separated from the base 14. Thereafter, the semiconductor device DVA released from the bias arm 40 is detached from the inside of the chassis 14 via the opening portion 12a of the lid member 12.

One set of the pressing member support 18 and the pressing member 20 are recessed portions 10RR and 10LR provided in the above-described socket body 10, respectively.

For example, as shown in FIGS. 5A and 5B, the pressing member support 18 is formed of a resin material and has a base end portion of the through hole 18a into which the coupling pin 24 is inserted, and on both sides. The connecting member 18T of the pair of long grooves 18G in which the pressing member 20 is engaged with the engaging pin 20P, and the coupling portion of the coupling base end portion and the connecting end portion are formed.

The base end portions of the pressing members 18 are the arm portions 12RL and 12LL that are coupled to the lid member 12 via the coupling pins 24 .

Moreover, the long groove 18G of the connection end portion 18T is formed along the direction in which the connection end portion 18T extends. The connecting pin 20P of the pressing member 20 is inserted into the long groove 18G of the connecting end portion 18T. Thereby, the pressing member 20 is relatively reciprocally movable with respect to the distance at which the connecting end portion 18T corresponds to only the length of the long groove 18G.

In the above-described joint portion, the hole 18b into which the guide pin 27 is inserted is formed at an intermediate position between the hole 18a and the long groove 18G. The hole 18b is formed such that its central axis becomes approximately parallel to the central axis of the hole 18a.

As described above, both ends of the guide pin 27 are guided to the above-described guide grooves 10RB or 10LB.

Further, an opening 18c larger than the hole 18b is formed between the hole 18b of the coupling portion and the hole 18b. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening 18c. One end of the torsion coil spring 22 is locked to the periphery of the opening portion 18c (see FIG. 10D), and the other end of the torsion coil spring 22 is locked to the base end portion of the sliding portion 20UE connected to the pressing member 20. . Thereby, the base end portion of the pressing member 20 is elastically urged in the direction in which the pressing member support 18 abuts.

Further, for example, as shown in FIG. 6A, FIG. 6B and FIG. 6C, the pressing member 20 is formed by a resin material and abuts against the outer peripheral surface of the IC package of the semiconductor device DVA, and pushes the outer periphery. The pressing surface of the surface is composed of a pressing portion 20T at the front end portion and a sliding portion 20UE connected to the base end of the pressing portion 20T.

The groove-shaped pressing portion 20T has a coupling pin 20P that engages the long groove 18G of the pressing member support 18 with respect to the inner side. Moreover, as shown in FIG. 6B, the pressing surface of the pressing portion 20T is formed to be orthogonal to the plane including the sliding surface 20Ua formed on the sliding portion 20UE.

Further, as shown in Fig. 1, an opening portion 20a into which the connecting end portion 18T of the pressing member support 18 is inserted is formed on the proximal end side of the pressing portion 20T. Thereby, the lower end surface of the inserted connecting end portion 18T is brought into contact with the inner surface of the pressing portion 20T at a predetermined pressure by the elastic force of the torsion coil spring 22.

A projection 20CP that is inserted into the opening 18c of the above-described pressing member support 18 is formed at a central portion of the coupling portion that connects the pair of sliding portions 20UE. The protruding portion 20CP is inserted into the opening portion 18c of the pressing member support 18 such that the pressing member support 18 is relatively smoothly movable with respect to the pressing member 20.

Further, the pressing member 20 and the pressing member support 18 are not limited to these examples, and for example, as shown in FIG. 7A, FIG. 7B, and FIG. 8A, FIG. 8B, and FIG. 8C, The pressing member support 18' may have a connecting end portion 18T, and the pressing member 20 may have a long hole 20'G.

The pressing member support 18' is formed by, for example, a resin material, a base end portion of the through hole 18'a into which the coupling pin 24 is inserted, and a long hole 20 to be engaged with the pressing member 20'. The pair of coupling pins 18'P of 'G' has a coupling end portion 18'T on both side faces, and a coupling portion between the coupling base end portion and the coupling end portion.

The base end portions of the pressing member supports 18' are the arm portions 12RL and 12LL that are coupled to the lid member 12 via the coupling pins 24.

The connecting pin 18'P of the connecting end portion 18'T is formed in an opposing manner. The joint pin 18'P is a long hole 20'G that is inserted into the pressing member 20'. Thereby, the pressing member 20' is a distance that is relatively reciprocally movable with respect to the long hole 20'G with respect to the joint end portion 18T.

In the coupling portion, the hole 18'b into which the guide pin 27 is inserted is formed at an intermediate position between the hole 18'a and the coupling pin 18'P. The bore 18'b is formed with its central axis approximately parallel to the central axis of the bore 18'a.

Further, an opening 18'c larger than the hole 18'b is formed between the hole 18'b of the coupling portion and the hole 18'b. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening 18'c. One end of the torsion coil spring 22 is locked to the periphery of the opening portion 18'c, and the other end of the torsion coil spring 22 is locked to the base end portion of the sliding portion 20' UE connected to the pressing member 20'. Thereby, the proximal end portion of the pressing member 20' is elastically pushed in the direction in which the pressing member support 18 abuts.

Further, as shown in FIG. 8A, FIG. 8B, and FIG. 8C, the pressing member 20' is formed by, for example, a resin material, and abuts against the outer peripheral surface of the IC package of the semiconductor device DVA, and pushes the outer periphery. The pressing surface of the surface is composed of a pressing portion 20'T at the front end portion and a sliding portion 20'UE connected to the base end of the pressing portion 20'T.

The groove-shaped pressing portion 20'T is a long hole 20'G into which the coupling pin 18'P of the pressing member support 18' is inserted. The pressing surface of the pressing portion 20'T is formed to be orthogonal to a plane including the sliding surface 20'Ua formed on the sliding portion 20' UE.

Further, on the proximal end side of the pressing portion 20'T, an opening portion 20'a into which the connecting end portion 18'T of the pressing member support 18' is inserted is formed. Thereby, the lower end surface of the inserted connecting end portion 18'T is brought into contact with the inner surface of the pressing portion 20'T at a predetermined pressure by the elastic force of the torsion coil spring 22.

A projection 20'CP inserted into the opening 18'c of the above-described pressing member support 18' is formed at a central portion of the coupling portion that connects the pair of sliding portions 20'UE. The protruding portion 20'CP is inserted into the opening portion 18'c of the pressing member support 18' such that the pressing member supporting body 18' is relatively smoothly movable with respect to the pressing member 20'.

In the above-described configuration, when testing the semiconductor device DVA, first, for example, by omitting the end of the arm portion of the working robot, the lid member 12 can be free from the uppermost position shown in FIG. 1 as shown in FIG. 9A. At the ground, the spring thrust of the top anti-coil springs 30, 32 is pushed downward toward the arrow.

Thereby, the pressing member support members 18 are guided to the guide grooves 10RB and 10LB, and are moved to the arm portions 12RL and 12LL side of the cover member 12, and the pressing member support members 18 are directed toward the slave base 14 The direction of the isolation rotates around the joint pin 27. Therefore, the pressing member 20 and each of the pressing member supports 18 are the opening portions 14H that pass through the chassis 14 toward the arm portions 12RL and 12LL.

Thereafter, when the lid member 12 is pressed to the lowermost position and held, the pressing member 20 and the pressed pressing member support 18 are disposed at predetermined waiting positions formed around the outer side of the chassis 14. As shown in Figs. 18 and 19, the position of the front end portion of the biasing arm 40 of the element biasing mechanism is a position which is isolated from the hole 14a of the base 14. At this time, the semiconductor device DVA is placed on the contact array portion 16B of the element-side alignment plate 16 by being sucked and held by the transport arm of the transport robot (not shown).

Thereafter, as shown in FIGS. 9B and 9C, the lid member 12 is moved toward the direction of the arrow in a state where the tip end of the working robot abuts on the upper surface of the lid member 12, that is, when it is raised, The spring force of the coil springs 30 and 32 rises to the uppermost position.

At this time, the semiconductor device DVA to be mounted is automatically positioned to position the positioning projection 14PS attached to the chassis 14 by the above-described component biasing mechanism as shown in FIGS. 16 and 17.

Further, as the arms 12RL and 12LL of the lid member 12 rise, as shown in FIG. 10A, the pressing member support 18 and the pressing member 20 are protruded around the coupling pin 27 of the pressing member support 18. The rotation starts in the manner of being in the opening 14H of the base 14. At this time, the joint pin 27 is guided under the guide grooves 10RB and 10LB, and is separated from the arm portions 12RL and 12LL of the lid member 12 and moved in a direction close to the opening portion 14H.

When the connecting pin 27 moves toward the opening 14H of the chassis 14, as shown in FIG. 10B, the sliding surface 20Ua of the pressing member 20 with respect to the sliding portion 20UE is abutted on the base as shown in FIG. The sliding surface 14SW of 14. Thereby, the rotation angle of the pressing member 20 is restricted. At this time, the joint end 18T of the pressing member support 18 starts to move toward the inner surface of the pressing member 20. Moreover, the pressing surface of the pressing portion 20T of the pressing member 20 is approximately flat with respect to the upper surface of the semiconductor device DVA with a predetermined interval therebetween.

Further, as shown in FIGS. 9B and 10C, when the arm members 12RL and 12LL of the lid member 12 are raised again, the pressing surface of the pressing portion 20T of the pressing member 20 is prevented from abutting against friction. The upper surface of the semiconductor device DVA. At this time, the connection end 18T of the pressing member support 18 is moved to the inner surface of the pressing member 20, and thus the pressing area PA pressed by the pressing surface of the pressing portion 20T is as shown in FIG. As shown in Fig. 14, it is a strip-shaped field having a predetermined width which is expanded more than the pressing area of the conventional latch mechanism. Therefore, in the semiconductor device DVA, the pressing force which is appropriately dispersed acts on the upper surface of the semiconductor device DVA.

At this time, as shown in FIG. 11, the sliding surface 20Ua of the sliding portion 20UE of the pressing member 20 is moved from the initial position H1 to the first position in the state of abutting on the sliding surface 14SW. The position of the specified position H2 below the 12 figure. At this time, as shown in FIG. 10D, only the front end of the connecting end 18T of the pressing member support 18 pushes down the pressing member 20, and the inner surface of the pressing member 20 is slidably protruded to protrude only the quantitative ΔH. .

Thereby, the pressing surface of the pressing portion 20T of the pressing member 20 does not rub against the upper surface of the semiconductor device DVA, and abuts against the outer circumferential surface of the IC package of the semiconductor device DVA with a predetermined pressure. Therefore, the pressing surface thereof is to push the semiconductor device DVA toward the contact pin module 36. As a result, the IC package of the semiconductor device DVA is not damaged by the pressing portion 20T of the pressing member 20.

Further, when the lid member 12 is maintained at the test position, for example, when an inspection signal is supplied to the input/output portion of the printed wiring board PB, the inspection signal is supplied to the semiconductor device DVA via the contact pin module 36, and the circuit thereof is provided. When the abnormality is detected, the abnormality detection signal from the semiconductor device DVA passes through the input/output portion, and is, for example, a fault diagnosis device supplied to the outside.

When the inspection of the semiconductor device DVA is completed, the semiconductor device DVA is taken out, and the arm end of the working robot is brought into contact with the top anti-coil springs 30 and 32 of the cover member 12 in the same manner as described above in order to mount the new semiconductor device DVA. Pushing the pressure and pushing it down. The semiconductor device DVA to be tested was taken out from the element side array plate 16 by the transfer arm, and the new semiconductor device DVA which was tested was mounted in the same manner as described above.

Further, as shown in Fig. 15, in the above example, it is assumed that even if a semiconductor device DVB having a thickness smaller than the thickness of the semiconductor device DVA is mounted, the semiconductor device DVB is pressed by the pressing portion 20T of the pressing member 20. When the pressing surface is pressed, the lowermost end position (exhaustion position) of the bottom portion of the semiconductor device housing portion 14A that blocks the semiconductor device DVB in the chassis 14 is the semiconductor device housing portion 14A when the semiconductor device DVA is mounted. The bottommost position of the bottom is the same.

Therefore, it is not necessary to change the relative position of the bottom portion of the semiconductor device housing portion 14A to the contact pin module 36 in accordance with the thickness of the semiconductor device.

Further, in the above-described example, the rotation angle of each of the sliding portions 20UE of the pressing member 20 is restricted, and the sliding contact surface 14SW that guides the smooth movement of the lower portion of the sliding portion 20UE and the restriction guide portion is formed. The periphery of the hole 14H in the outer peripheral portion of the base 14 is not limited to such an example, and is formed in the recesses 10'RR and 10'LR and the module housing portion as shown in Figs. 20 to 22, for example. In the notch portion between the 10'A, the terminal 10'PO as the position regulating guide may be integrally formed in the socket body 10.

In the outer peripheral portion of each side of the socket main body 10', the guide groove 10'G of each of the guide claw portions 12N that can be moved up and down with the lid member described below is formed at a predetermined interval. . The guide groove 10'G is formed approximately perpendicularly to the bottom surface portion of the socket body 10. At the end of each of the grooves 10'G, when the lid member 12 is at the uppermost end position, the tip end of the guide claw portion 12N is locked.

When the pair of guide grooves 10'G of the two long sides of at least four sides of the socket body 10' are interposed, when the cover member 12 is to be lowered, the arm portions 12RL and 12LL of the cover member 12 described below are inserted. The recesses 10'RR and 10'LR are formed approximately parallel to the guide groove 10G.

Further, a module housing portion 10'A in which the contact pin module 36 is housed is formed in a substantially central portion of the socket body 10'. The contact array portion 16B of the element side alignment plate 16 is disposed on the upper portion of the module housing portion 10'A.

Between the module housing portion 10'A and the recess portions 10'RR and 10'LR, a notch portion through which the pressing member support 18 and the pressing member 20 pass is formed. Inside the respective notch portions, a pair of terminals 10'PO are formed so that the plane including the contact array portion 16B is approximately vertical. Thereby, as shown in Fig. 20, the rotation angle of each sliding portion 20UE of the pressing member 20 is restricted by the binding post 10'PO, and the smooth movement of the lower portion of each sliding portion 20UE is guided.

Further, in the above-described example of the semiconductor device socket of the present invention, one end of the member support members 18 and 18' is pressed, and the pressing member 20 and 20' are driven in the configuration in which the lid member 12 is coupled to the lid member 12. However, it is not limited to such an example. For example, as shown in Japanese Laid-Open Patent Publication No. 2006-071375 (refer to FIG. 53), in place of the cover member 12, the pressing member is supported by the material processing portion. One end of the bodies 18 and 18' is pushed or released, whereby the pressing members 20 and 20' may be rotated.

While the invention has been described with reference to the preferred embodiments thereof, it is understood that the invention is not limited to the disclosed exemplary embodiments. The following additional claims are to be accorded the broadest interpretation to cover all such modifications and equivalent structures and functions.

10. . . Slot body

12. . . Cover member

14. . . Base

14A. . . Semiconductor device housing

14H. . . Opening

14SW. . . Sliding surface

18. . . Pushing member support

20. . . Pushing member

20UE. . . Sliding portion

20Va. . . Sliding surface

twenty two. . . Torsion coil spring

twenty four. . . Link pin

27. . . Guide pin

DVA, DVB. . . Semiconductor device

Fig. 1 is a perspective view showing a partial cross-sectional view showing an example of a slot for a semiconductor device of the present invention.

Fig. 2 is a partial cross-sectional view showing a part of Fig. 1 in an enlarged manner.

Fig. 3 is a perspective view showing an appearance of an example of a slot for a semiconductor device of the present invention.

Fig. 4 is a perspective view showing the components of the example shown in Fig. 1 in an exploded manner.

Fig. 5A is a plan view showing a pressing member support used in the example of Fig. 1, and Fig. 5B is a side view showing the pressing member support shown in Fig. 5A.

6A is a plan view showing a pressing member used in the example of FIG. 1, FIG. 6B is a front view showing the pressing member in FIG. 6A, and FIG. 6C is a pressing member shown in FIG. 6A. Side view.

Fig. 7A is a plan view showing another example of the pressing member support used in the example of Fig. 1, and Fig. 7B is a side view showing the pressing member support of Fig. 7A.

8A is a plan view showing another example of the pressing member used in the example of FIG. 1, and FIG. 8B is a front view showing the pressing member in FIG. 8A, and FIG. 8C is a view showing A side view of the pressing member of Fig. 8A.

Fig. 9A, Fig. 9B and Fig. 9C are perspective views respectively showing a partial cross-sectional view for explaining an operation of the example shown in Fig. 1.

10A, 10B, 10C, and 10D are partial cross-sectional views for explaining the operation of the example shown in Fig. 1, respectively.

Fig. 11 is a perspective view showing an enlarged view of a part of Fig. 9B.

Fig. 12 is a perspective view showing an enlarged view of a part of Fig. 9C.

Fig. 13 is a view for explaining an example of a pressing area of a pressing portion serving as a pressing member.

Fig. 14 is a view for explaining an example of a pressing area of a pressing portion serving as a pressing member.

Fig. 15 is a cross-sectional view for explaining an example of the pressing operation of the pressing member when the semiconductor devices having different thicknesses are respectively mounted in the example of Fig. 1.

Figure 16 is a partial cross-sectional view showing the configuration of the element biasing mechanism.

Fig. 17 is a plan view showing the element biasing mechanism shown in Fig. 16 together with the semiconductor device.

Figure 18 is a partial cross-sectional view showing the operation of the element biasing mechanism.

Fig. 19 is a plan view showing the element biasing mechanism shown in Fig. 18 together with the semiconductor device.

Fig. 20 is a plan view showing another example of the socket main body which is an example of the slot for a semiconductor device used in the present invention.

Fig. 21 is a cross-sectional view taken along line XXI-XXI of the example shown in Fig. 20.

Fig. 22 is a cross-sectional view taken along line XXII-XXII of the example shown in Fig. 20.

10. . . Slot body

10RR. . . Concave

12. . . Cover member

12LL. . . Arm member

12CA. . . Cam piece

12RL. . . Arm

14. . . Base

14SW. . . Sliding surface

16B. . . Contact arrangement

18. . . Pushing member support

20. . . Pushing member

twenty four. . . Link pin

26. . . Substrate side alignment plate

27. . . Guide pin

30,32. . . Coil spring

38. . . Cam follower member

40. . . Offset arm

Claims (8)

A socket for a semiconductor device, comprising: a semiconductor device mounting portion detachably mounted with a semiconductor device; and a socket body electrically connected to a contact terminal group of the terminal of the semiconductor device; And when the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion is close to the surface, the pressing surface is approximately parallel to the surface and moves in a direction orthogonal to the surface and abuts the surface a pressing member for the pressing surface; and the semiconductor device mounting portion is supported by the socket body in proximity or isolation with the pressing member, and one end is coupled to the pressing member so as to be relatively movable. The other end is connected to the pressing member support of the driving means; and the pressing member is interlocked with the movement of the pressing member support by the driving means, and is attached to the semiconductor device mounting portion. When the surface of the IC package of the semiconductor device is close, the pressing surface of the pressing member moves in a direction orthogonal to the surface and abuts the table A position restricting guide that guides while guiding the position of the sliding portion of the pressing member. The socket for a semiconductor device according to the first aspect of the invention, wherein the pressing member support body is such that the pressing surface of the pressing member abuts against a surface of the IC package of the semiconductor device, and the IC package is The body pushes the pressing member guided by the position restricting guide. The slot for a semiconductor device according to the first aspect of the invention, wherein one end of the pressing member support is disposed to be relatively movable with respect to an inner peripheral portion of the pressing member. The slot for a semiconductor device according to the second aspect of the invention, wherein one end of the pressing member support is disposed to be relatively movable with respect to an inner peripheral portion of the pressing member. The slot for a semiconductor device according to any one of the first to fourth aspect, wherein the driving means includes a cover member that is supported by the slot body so as to be movable up and down, and The above-mentioned cover member elastically pushes the cover member in a direction separating from the slot body, and the pressing member and the pressing member support are the cover corresponding to the elastic thrust according to the elastic pushing means When the surface of the IC package mounted on the semiconductor device mounting portion is close to the surface of the IC package mounted on the semiconductor device mounting portion, the rising operation of the cover member is rotated, and then the position regulating guide portion is used. The position of the sliding portion of the pressing member is restricted and guided, and the pressing surface of the pressing member abuts against the surface in a direction orthogonal to the outer contour surface. The slot for a semiconductor device according to the first aspect of the invention, wherein the position limiting guide is formed on an outer circumferential surface of a base having the semiconductor device mounting portion. The slot for a semiconductor device according to the first aspect of the invention, wherein the position restricting guide portion is formed in the pressing member and the pressing member supporting body in the slot body for the semiconductor device mounting portion. Pass near or in isolation through the path used. The socket for a semiconductor device according to the first aspect of the invention, further comprising: a component biasing mechanism that selectively pushes the semiconductor device toward a plurality of positioning projections for positioning the semiconductor device.