JP2011023164A - Socket for semiconductor device - Google Patents

Abstract

When a semiconductor device is held, the semiconductor device can be held without scratching the outer peripheral surface of an IC package of the semiconductor device.
A pressing member supporting member and a pressing member are rotated around a connecting pin of the pressing member supporting member so as to protrude into an opening of a base. The 20T pressing surface is brought into contact with the outer peripheral surface of the IC package of the semiconductor device DVA without rubbing against the upper surface of the semiconductor device DVA.
[Selection] Figure 1

Description

  The present invention relates to a semiconductor device socket including a holding mechanism that selectively and releasably holds a semiconductor device.

  A semiconductor device (for example, an integrated circuit and an IC package (EIAJED-7303A: Electronic Information Technology Industry Association standard)) mounted on an electronic device or the like is subjected to various tests before being mounted, and its potential. Defects are removed. The test is performed, for example, in a state in which the semiconductor device is mounted in the semiconductor device socket.

A socket for a semiconductor device subjected to such a test is generally called an IC socket,
It is arranged on a predetermined printed wiring board (test board). The printed wiring board has an input / output unit for supplying a test voltage and sending an abnormality detection signal representing a short circuit from a semiconductor device as an object to be inspected.

In the case of a semiconductor device socket, for example, in the case of an open top type socket, Patent Document 1
As shown, the socket body that is arranged on a printed wiring board (not shown) and that accommodates a contact terminal group that electrically connects the semiconductor device to the printed wiring board, and the contact terminal group in the socket body A positioning member (referred to as a pedestal in Patent Document 1) having a housing portion disposed at a position of the semiconductor device, and a semiconductor device disposed around the positioning member with respect to the housing portion of the positioning member A latch mechanism as a holding mechanism having a pair of pressing members (for example, in Patent Document 1, which is constituted by a pressing lever member and a pressing member), and a predetermined driving mechanism. And a cover member that transmits to the latch mechanism so as to operate the presser member.

The cover member has an opening in the central portion through which the semiconductor device passes when the cover member is attached to and detached from the housing portion of the positioning member of the semiconductor device. The cover member is arranged to be movable up and down with respect to the socket body, and is connected to the above-described drive mechanism. The drive mechanism includes, for example, an operating pin that connects the cover member and the base end portion of the pressing member of the latch mechanism, and a pivot pin that rotates the pressing member in accordance with the up and down movement of the cover member.

  The positioning member is fixed to the socket body, and for example, by positioning the outer peripheral portion of the semiconductor device mounted in the housing portion, the relative position of the terminal of the semiconductor device with respect to the contact terminal group is determined.

The pair of pressing members in the latch mechanism are arranged opposite to each other with the mounted semiconductor device interposed therebetween. The holding member is rotatably supported by the socket body, a base end portion connected to the drive mechanism, a contact portion that selectively contacts or separates from the upper surface of the outer peripheral surface of the IC package of the semiconductor device, and the socket body. The base end portion and the contact portion are connected to each other.

When the semiconductor device is mounted in the housing portion, the contact portion of the pressing member takes a standby position separated from the housing portion so as not to interfere with the semiconductor device, and after the semiconductor device is mounted in the housing portion. The abutting portion of the pressing member enters the housing portion and takes a holding position.

  In such a configuration, when the semiconductor device is mounted in the positioning member housing through the opening of the cover member, the cover member is pressed against the socket body and the positioning member by a predetermined stroke from the upper position to the lower position. By being held, the contact portions of the pair of pressing members described above are spaced apart from each other with respect to the housing portion of the positioning member and take a standby position, so that the semiconductor device can be mounted on the housing portion.

Next, when the cover member is released from the held state, the cover member is raised by the urging force of the urging member and returned to the initial position, so that the contact portions of the pair of presser members are in the standby position. Are positioned close to each other and placed in contact with the upper surface of the outer peripheral surface of the IC package of the semiconductor device, and the terminals of the semiconductor device positioned by the positioning member are pressed toward the contact terminal group at the holding position. Will be. Therefore, the semiconductor device is held with respect to the accommodating portion of the positioning member.

  For example, in patent document 1, the press member which has such a contact part is provided in the front-end | tip part of the press lever member rotatably supported by a socket main body so that a displacement is possible. As a result, even if there is a variation in the thickness of the semiconductor device, the variation is absorbed by the spring member, so that the semiconductor device is held at a constant contact pressure.

  Further, as disclosed in Patent Document 2, a swinging member is swingably swingable at the tip of a latch member as a presser member in order to suppress application of local stress or shear stress to the semiconductor device to be pressed. It has been proposed that

Japanese Patent Laid-Open No. 2003-133022 JP 2003-168532 A

When the semiconductor device is mounted on the positioning member housing portion through the opening of the cover member, the contact portions of the pair of pressing members are brought close to the positioning member housing portion from the standby position as described above. At that time, the contact portion is brought into sliding contact with the outer peripheral surface of the IC package of the semiconductor device with a minute movement. In particular, according to the test, when the contact portion is repeatedly slidably contacted with the upper surface of the outer peripheral surface of the IC package, for example, in one semiconductor device, or when the contact portion increases as the number of contact terminals increases. When the contact portion slides in a state where the pressing force is increased, the contact portion may form a scratch on the outer peripheral surface of the IC package of the semiconductor device. As a result, a semiconductor device regarded as a non-defective product may be regarded as a defective product in appearance due to scratches on the outer peripheral surface of the IC package in appearance inspection, and the yield may be reduced.

In view of the above problems, the present invention is a socket for a semiconductor device having a holding mechanism for selectively holding the semiconductor device so as to be releasable, and when holding the semiconductor device, the outer peripheral surface of the IC package of the semiconductor device It is an object of the present invention to provide a socket for a semiconductor device that can hold the semiconductor device without scratching.

  In order to achieve the above object, a socket for a semiconductor device according to the present invention includes a semiconductor device mounting portion on which a semiconductor device is detachably mounted and a contact terminal group electrically connected to terminals of the semiconductor device. When close to the main body and the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion, the pressing surface is substantially parallel to the surface and moves along a direction perpendicular to the surface and contacts the surface. A pressing member having a pressing surface, supported by the socket body so as to be close to or separated from the semiconductor device mounting portion with the pressing member, one end is connected to the pressing member so as to be relatively movable, and the other end is a driving means. The pressing member support connected to the semiconductor device and the pressing member are interlocked according to the movement of the pressing member support by the driving means, and the IC package of the semiconductor device mounted on the semiconductor device mounting portion is mounted. Position restriction guide that regulates and guides the position of the sliding portion of the pressing member so that the pressing surface of the pressing member moves along the direction orthogonal to the surface and contacts the surface when approaching the surface of the surface And configured.

  According to the semiconductor device socket according to the present invention, when the semiconductor device socket is close to the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion, the pressing surface is substantially parallel to the surface and is orthogonal to the surface. And a pressing member having a pressing surface that moves along the surface of the semiconductor device and is supported by the socket body so as to be close to or separated from the semiconductor device mounting portion with the pressing member, and one end is relative to the inner peripheral portion of the pressing member. A pressing member support that is movably connected to the driving means, and a position restriction guide portion, and the position restriction guide portion is a semiconductor in which the pressing member is mounted on the semiconductor device mounting portion. When approaching the surface of the IC package of the apparatus, the position of the sliding portion of the pressing member is regulated and guided so that the pressing surface of the pressing member moves along the direction orthogonal to the surface and contacts the surface. Since the case of holding a semiconductor device, capable of holding a semiconductor device without causing scratches on the outer peripheral surface of the IC package of the semiconductor device.

It is a perspective view including the fragmentary sectional view which shows an example of the socket for semiconductor devices which concerns on this invention. It is a fragmentary sectional view which expands and shows a part in FIG. It is a perspective view which shows the external appearance of an example of the socket for semiconductor devices which concerns on this invention. It is a perspective view which decomposes | disassembles and shows each component in the example shown by FIG. (A) is a top view of the pressing member support body used in the example shown by FIG. 1, (B) is a side view of the pressing member support body shown by (A). (A) is a top view of the pressing member used in the example shown in FIG. 1, (B) is a front view of the pressing member shown in (A), and (C) is shown in (A). It is a side view of a pressing member. (A) is a top view of another example of the pressing member support used in the example shown in FIG. 1, and (B) is a side view of the pressing member support shown in (A). (A) is a top view of another example of the pressing member used in the example shown in FIG. 1, (B) is a front view of the pressing member shown in (A), and (C) is (A It is a side view of the press member shown by. (A), (B), and (C) are perspective views each including a partial cross-sectional view for explaining the operation in the example shown in FIG. (A), (B), (C), and (D) are partial sectional views provided for explaining the operation in the example shown in FIG. It is a perspective view which expands and shows a part shown by FIG. 9 (B). It is a perspective view which expands and shows the part shown by FIG.9 (C). It is a figure where it uses for description of the press area in the press part of a press member. It is a figure where it uses for description of the press area in the press part of a press member. In the example shown by FIG. 1, it is sectional drawing with which it uses for description of the pressing operation of a pressing member when the semiconductor device from which thickness differs is each mounted | worn. It is a fragmentary sectional view which shows the structure of a device side alignment mechanism. FIG. 17 is a plan view showing the device shifting mechanism in the state shown in FIG. 16 together with the semiconductor device. It is a fragmentary sectional view used for operation | movement description of a device partial alignment mechanism. FIG. 19 is a plan view showing the device shifting mechanism in the state shown in FIG. 18 together with the semiconductor device. It is a top view which shows another example of the socket main body used for an example of the socket for semiconductor devices which concerns on this invention with a part of base. It is sectional drawing shown along the XXI-XXI line in the example shown by FIG. It is sectional drawing shown along the XXII-XXII line in the example shown by FIG.

  FIG. 3 is an enlarged view of an example of a semiconductor device socket according to the present invention.

  The socket for a semiconductor device is arranged on the printed wiring board PB (see FIG. 15). The printed wiring board PB is supplied with a predetermined test voltage and has an input / output unit that sends out an abnormality detection signal representing a short circuit or the like from a semiconductor device as each object to be inspected. In FIG. 3, one semiconductor device socket is shown as a representative of the plurality of semiconductor device sockets arranged vertically and horizontally on the printed wiring board PB.

  In FIG. 3, the socket for a semiconductor device is a contact pin module 36 (FIG. 15) that electrically connects each electrode pad portion (terminal portion) of the printed wiring board PB to a semiconductor device DVA or a terminal of the semiconductor device DVB described later. A socket body 10 having a module housing portion 10A for housing the contact pin module 36, and a base 14 as a positioning member for aligning each electrode of the semiconductor device DVA with respect to each terminal portion of the contact pin module 36, The cover member 12 is movably supported on the socket body 10 and is movably supported by the pressing member support 18 and the cover member 12 that turns the pressing member support 18, which will be described later, to selectively approach or separate from the base 14. The terminals of the semiconductor device DVA are contact pins according to the lifting / lowering operation of the cover member 12. It is configured to include a pressing member 20 for pressing and holding or releasing, as main components with respect to the contact pins 28ai Joule 36.

  Also, below the pedestal 14, a device-side alignment plate 16 that aligns the upper portions of the terminals of the contact pin module 36, and the device can be moved to the socket body 10 so as to face the device-side alignment plate 16 across the contact pin module 36. A board-side alignment plate 26 that arranges the fixed-side terminals of the terminals of the contact pin module 36 is arranged.

  As shown in FIG. 4, the device-side alignment plate 16 includes a contact alignment portion 16B in which a plurality of pores in which contact portions of the contact pins 28ai described later are arranged at the center are formed in a substantially rectangular shape. And a claw portion 16N that protrudes toward the contact pin module from four corners of the flat contact alignment portion 16B.

  Each pore in the contact alignment portion 16B is formed corresponding to each terminal and contact pin of the semiconductor device DVA. In addition, each pore has a relative position with respect to a positioning projection 14PS of a pedestal 14 described later. That is, the position of the positioning projection 14PS is set in accordance with each pore. Accordingly, the relative positions of the terminals of the semiconductor device DVA with respect to the respective pores are positioned by the positioning protrusions 14PS, and the relative positions of the terminals of the semiconductor device DVA with respect to the contact pins of the contact pin module 36 are positioned. It becomes.

  The tip of each claw portion 16N is locked to each locking portion of the socket body 10 (not shown). Between the device-side alignment plate 16 and the contact pin module 36, a coil spring (not shown) is provided that urges the device-side alignment plate 16 in a direction in which the device-side alignment plate 16 is separated from the contact pin module 36. Thereby, the device side alignment plate 16 is supported on the upper part of the contact pin module 36 so as to be movable up and down.

  A device aligning mechanism, which will be described later, is provided at one place of a predetermined corner of the contact alignment portion 16B.

  As shown in FIG. 4, the board-side alignment plate 26 has locking pieces 26 </ b> N that are selectively locked to the socket body 10 at three locations. The reason why the locking pieces 26N are provided at three locations is to prevent the mounting direction of the board-side alignment plate 26 from being set to an incorrect direction when it is attached to the socket body 10 during manufacturing. is there. In addition, a pair of protruding pieces 26 </ b> P are formed on the surface of the board-side alignment plate 26 that faces the lower surface of the socket body 10. When the socket body 10 is attached to the substrate, the protruding pieces 26P are inserted into or pulled out of the grooves formed in the lower part of the socket body 10, respectively. Therefore, as shown in FIG. 15, the board-side alignment plate 26 protrudes from the recess at the lower end of the socket body 10 and aligns the fixed-side terminals of the terminals of the contact pin module 36, as shown in FIG. The state of being housed in the recess is taken. Further, when the protruding piece 26 </ b> P is inserted into a groove formed in the lower part of the socket body 10, a hook member (not shown) that holds the contact pin module 36 formed on the socket body 10 is removed from the contact pin module 36. It prevents it from coming off.

  A semiconductor device DVA (see FIG. 9A) as an object to be inspected is a semiconductor device having an outer portion formed of a BGA type IC package (EIAJED-7303A: Electronic Information Technology Industries Association standard). In the semiconductor device DVA, a bump-shaped electrode to be connected to the contact pin module 36 through the pores of the contact alignment portion 16B of the device side alignment plate 16 is used as a terminal on a surface facing a device side alignment plate 16 described later. A plurality are formed over the entire surface at a predetermined interval.

  The semiconductor device DVA is not limited to a semiconductor device formed with a BGA type IC package, but may be a semiconductor device formed with an LGA type or QFN type IC package, for example.

  As shown in FIG. 3, guide grooves 10 </ b> G in which guide claws 12 </ b> N of a cover member 12, which will be described later, are engaged with each other so as to move up and down are provided at predetermined intervals on the outer peripheral portion of each side of the socket body 10. Is formed. The guide groove 10 </ b> G is formed substantially perpendicular to the bottom surface portion of the socket body 10. As shown in FIG. 3, when the cover member 12 takes the uppermost end position, the tip end of the guide claw portion 12N is locked to one end portion of each groove 10G.

  When the cover member 12 is lowered between a pair of guide grooves 10G on two long sides of at least four sides of the socket body 10 as shown in FIG. 4, an arm portion of the cover member 12 described later is provided. Recesses 10RR and 10LR into which 12RL and 12LL are inserted are formed substantially parallel to the guide groove 10G.

  In FIG. 4, one end of a coil spring 30 to be described later is disposed at the intersection of the long side wall 10RW and the short side wall 10SW forming the outer periphery of the socket body 10. A spring receiving portion is formed. Also, in FIG. 4, one end of each coil spring 32 to be described later is disposed at the intersection between the wall 10 </ b> LW facing the wall 10 </ b> RW and the other wall 10 </ b> SW on the short side. Spring receiving portions are formed adjacent to each other. Further, a notch portion to which a spring accommodating end portion 16EB in a device side-alignment mechanism described later is fixed is formed between the spring receiving portions where one end of the coil spring 32 is disposed.

A module housing portion 10 </ b> A (see FIG. 15) in which the contact pin module 36 is housed is formed at a substantially central portion of the socket body 10. The contact alignment portion 16B of the above-described device side alignment plate 16 is disposed on the upper part of the module housing portion 10A.

  Between the module housing portion 10A and the recesses 10RR and 10LR, there are formed cutout portions through which a pressing member support 18 and a pressing member 20 described later pass, respectively. Further, as shown in FIG. 4, guide grooves 10 </ b> RB and 10 </ b> LB for guiding both end portions of a guide pin 27 described later are formed in the wall portion that forms each notch portion. The pair of guide grooves 10 </ b> RB formed apart from each other is formed substantially parallel to the bottom surface of the socket body 10. In addition, a pair of guide grooves 10 </ b> LB formed apart from each other are also formed substantially parallel to the bottom surface of the socket body 10.

  A pedestal 14 is placed on the contact alignment portion 16 </ b> B in the socket body 10. The pedestal 14 has positioning protrusions 14PS, which are respectively engaged with each corner of the outer peripheral portion of the IC package of the semiconductor device DVA to be mounted, at three locations on the bottom of the semiconductor device housing portion 14A described later. Thereby, a predetermined gap is formed between the electrode portion of the IC package of the semiconductor device DVA positioned by the positioning protrusion 14PS and the surface of the contact alignment portion 16B.

  The pedestal 14 is fixed to the socket body 10 by engaging claw portions integrally formed at a plurality of locations on the side surface with the socket body 10. As shown in FIG. 4, the pedestal 14 formed in the shape of a rectangular frame has a semiconductor device housing portion 14A for housing the semiconductor device DVA disposed above the contact alignment portion 16B in the central portion. The relative position of the bottom of the semiconductor device housing portion 14A that receives the semiconductor device DVA with respect to the contact pin module 36 is set regardless of the thickness of the semiconductor device DVA, as will be described later.

  The semiconductor device housing portion 14A opens toward the cover member 12 and the contact alignment portion 16B. Further, positioning protrusions 14PS (see FIG. 17) are formed at three corners inside the periphery of the opening at the bottom of the semiconductor device housing 14A. Further, as shown in FIG. 4, a hole 14 a through which a tip end portion of a one-sided arm 40 in a device side-by-side mechanism to be described later passes is formed at one corner inside thereof.

  Furthermore, rectangular holes 14H are respectively formed in the central portions of the sides of the outer portion that forms the semiconductor device housing portion 14A. When the semiconductor device DVA is attached / detached, a pressing member support 18 and a pressing member 20, which will be described later, pass through the hole 10H facing the wall 10RW and the wall 10LW. A pair of slidable contact surfaces 14 </ b> SW are formed in parallel to each other at the periphery of the hole 14 </ b> H in the outer peripheral portion of the base 14. Each sliding contact surface 14SW is formed substantially perpendicular to the surface of the contact alignment portion 16B. Thereby, the slidable contact surface 14SW becomes substantially perpendicular to the plane including the upper surface of the IC package of the semiconductor device DVA positioned by the positioning protrusion 14PS above the contact alignment portion 16B.

  A slidable contact surface 14SW as a position restricting guide portion with respect to the pressing member 20, which will be described later, regulates the rotation angle of each sliding portion 20UE of the pressing member 20 when the semiconductor device DVA is mounted on the base 14, and The smooth downward movement of the moving part 20UE will be guided. Further, when the semiconductor device DVA is detached from the pedestal 14, the sliding contact surface 14 </ b> SW guides the smooth movement of the pressing member 20 upward of the sliding portion 20 </ b> UE.

  As shown in FIG. 9A, the frame-shaped cover member 12 has an opening 12a through which the upper end of the semiconductor device DVA or the pedestal 14 passes in the center. Arm members 12RL and 12LL project vertically from portions of the cover member 12 facing the recesses 10RR and 10LR of the socket body 10 described above.

  Since the arm members 12RL and 12LL have the same structure, the structure of the arm member 12RL will be described, and the description of the structure of the arm member 12LL will be omitted.

  One end of the pressing member support 18 is connected to the lower end of the arm member 12RL formed in a substantially H shape. A common connecting pin 24 passes through a hole at one end of the pressing member support 18 disposed between the leg portions of the arm member 12RL and a hole of each leg portion of the arm member 12RL. Thereby, the pressing member support 18 can be rotated with respect to the leg portion of the arm member 12RL.

  At the end of each side of the cover member 12, a guide claw portion 12 </ b> N that engages with the guide groove 10 </ b> G of the socket main body portion 10 protrudes toward the socket main body 10.

  As shown in FIGS. 1 and 4, a cam piece 12CA constituting a part of the device side-alignment mechanism is substantially parallel to the guide claw portion 12N at a predetermined one of the four corners of the cover member 12. Is formed.

  Two coil springs 32 for urging the cover member 12 upward are provided at positions adjacent to the corners of the cover member 12 where the cam pieces 12CA are provided, and the lower surface of the cover member 12 and the socket body 10 described above. The spring receivers are spaced apart from each other. Further, three coil springs 30 having a diameter larger than the diameter of the coil spring 32 are provided at three corners of the cover member 12 excluding the above-described corners, and the lower surface thereof and the spring of the socket body 10 described above. It is provided between the receiving part. The three coil springs 30 cooperate with the two coil springs 32 to urge the cover member 12 upward.

  As shown in, for example, Japanese Patent Application Laid-Open No. 2002-202344, the contact pin module 36 is substantially parallel to each other via a spacer between a pair of side plates that form both ends thereof and between the side plates. A plurality of lead frames arranged so as to overlap with each other are the main elements. The contact pins 28ai are not limited to the form of the contact pin module 36. For example, as shown in Japanese Patent Application Laid-Open No. 2003-133022, the lower ends of the contact pins 28ai are contact pins of the socket body. The contact pin 28ai may be fixed by being press-fitted into the mounting hole.

  A device shifting mechanism that presses the three corners of the semiconductor device DVA against the positioning protrusions 14PS is connected to the cam follower member 38 and one end of the cam follower member 38 as shown in an enlarged view in FIG. And the cam piece 12CA of the cover member 12 engaged with the hole 38CF of the cam follower member 38 when the semiconductor device DVA is attached and detached.

  The cam follower member 38 is movably disposed on a slidable contact surface 16 </ b> S formed at the upper end of the spring accommodating end portion 16 </ b> EB connected to the contact alignment portion 16 </ b> B of the device side alignment plate 16. The spring accommodating end portion 16EB penetrates the notch portion of the socket body 10 described above toward the outside. The cam follower member 38 is guided so as to be movable between guide pieces 16SG integrally formed opposite to the outer peripheral portion of the spring accommodating end portion 16EB. A coil spring 42 that urges the cam follower member 38 toward the inside of the pedestal 14 through the hole 14a of the pedestal 14 is disposed inside the spring accommodating end 16EB.

  As shown in FIG. 16, when the cover member 12 takes the uppermost position, the cam piece 12CA of the cover member 12 is disposed at a position directly above the hole 38CF of the cam follower member 38.

  A hole formed at one end of the one-sided arm 40 is fitted into a connecting pin 38P at one end of the cam follower member 38. As a result, as shown in FIG. 17, the one-sided arm 40 and the cam follower member 38 are coupled so that the center axis of the one-sided arm 40 is on a common straight line with the center axis of the cam follower member 38. The front end portion of the one-sided arm 40 has an abutting portion that abuts against one corner of the semiconductor device DVA. The abutting portion is formed by being bent to one side with respect to the central axis of the one-sided arm 40, and has a recess that is engaged with one corner of the semiconductor device DVA.

  In such a configuration, when the semiconductor device DVA is placed in the pedestal 14 placed on the contact alignment portion 16B of the device side alignment plate 16, first, the cover member 12 is as shown in FIG. 18 and FIG. The cam piece 12CA is inserted into the hole 38CF after being pressed downward and the inclined surface of the cam piece 12CA is engaged with the peripheral edge of the hole 38CF. Thereby, the cam follower member 38 is moved in a direction away from the base 14 against the urging force of the coil spring 42.

  Next, when the cover member 12 is maintained at the lowermost position, the semiconductor device DVA is placed in the base 14. At that time, the three corners of the semiconductor device DVA are engaged with the positioning protrusions 14PS. 17 and 19 representatively show one positioning projection 14PS among the three positioning projections 14PS.

  Subsequently, when the pressing force applied to the cover member 12 is released, the cover member 12 is raised upward by the urging force of the coil springs 30 and 32. Accordingly, as shown in FIGS. 16 and 17, since the cam piece 12CA is separated from the hole 38CF, the cam follower member 38 is pressed in the direction approaching the base 14 by the urging force of the coil spring 42. The depression of the shift arm 40 is engaged with one corner of the IC package of the semiconductor device DVA, and the three corners of the IC package are pressed against the positioning projection 14PS. Therefore, the semiconductor device DVA is positioned with respect to the base 14 and the contact alignment portion 16B.

  On the other hand, when removing the semiconductor device DVA from the pedestal 14 of the device side alignment plate 16, first, as shown in FIGS. 18 and 19, the cover member 12 is pressed downward to the lowest end position and the cam piece 12CA. After the inclined surface is engaged with the peripheral edge of the hole 38CF, the cam piece 12CA is held in a state of being inserted into the hole 38CF. Thereby, the cam follower member 38 is moved in a direction away from the base 14 against the urging force of the coil spring 42. Next, the semiconductor device DVA released from the one-sided arm 40 is removed from the inside of the base 14 through the opening 12 a of the cover member 12.

  The set of pressing member support 18 and pressing member 20 are provided in the recesses 10RR and 10LR of the socket body 10 described above, respectively.

  For example, as shown in FIGS. 5A and 5B, the pressing member support 18 is formed of a resin material and has a base end portion having a through hole 18a into which the above-described connecting pin 24 is inserted, and a pressing member. It is comprised from the connection end part 18T which has a pair of long groove 18G with which the engagement pin 20P of the member 20 is engaged in both sides | surfaces, and the connection part which couple | bonds a base end part and a connection end part.

  The base end portion of each pressing member support 18 is connected to the arm portions 12RL and 12LL of the cover member 12 via a connecting pin 24.

  The long groove 18G of the connecting end 18T is formed along the direction in which the connecting end 18T extends. The connecting pin 20P of the pressing member 20 is inserted into the long groove 18G of the connecting end 18T. As a result, the pressing member 20 can reciprocate relative to the connecting end portion 18T by a distance corresponding to the length of the long groove 18G.

  In the coupling portion described above, a hole 18b into which the guide pin 27 is inserted is formed at an intermediate position between the hole 18a and the long groove 18G. The center axis of the hole 18b is formed substantially parallel to the center axis of the hole 18a.

  As described above, both ends of the guide pin 27 are guided by the above-described guide groove 10RB or 10LB.

  In addition, an opening 18c larger than the hole 18b is formed between the hole 18b and the hole 18b in the coupling portion. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening 18c. One end of the torsion coil spring 22 is locked to the peripheral edge of the opening 18c (see FIG. 10D), and the other end of the torsion coil spring 22 is engaged with a base end portion connected to the sliding portion 20UE of the pressing member 20. It has been stopped. Accordingly, the proximal end portion of the pressing member 20 is urged in a direction in which the pressing member 20 contacts the pressing member support 18.

  The pressing member 20 is formed of a resin material, for example, as shown in FIGS. 6A, 6B, and 6C, and abuts against the outer peripheral surface of the IC package of the semiconductor device DVA to press the outer peripheral surface. It comprises a pressing part 20T having a pressing surface at the tip part and a sliding part 20UE connected to the base end of the pressing part 20T.

  The groove-shaped pressing portion 20T has a connecting pin 20P that engages with the long groove 18G of the pressing member support 18 on the inner side. Further, as shown in FIG. 6B, the pressing surface of the pressing portion 20T is formed to be orthogonal to a plane including the sliding contact surface 20Ua formed on the sliding portion 20UE.

  Further, as shown in FIG. 1, an opening 20a into which the connecting end 18T of the pressing member support 18 is inserted is formed on the proximal end side of the pressing portion 20T. As a result, the lower end surface of the inserted connecting end portion 18T is brought into contact with the inner surface of the pressing portion 20T with a predetermined pressure by the elastic force of the torsion coil spring 22.

  A projection 20CP that is inserted into the opening 18c of the pressing member support 18 described above is formed at the center of the connecting portion that connects the pair of sliding portions 20UE. By inserting the projection 20CP into the opening 18c of the pressing member support 18, the pressing member support 18 can be smoothly moved relative to the pressing member 20.

  The pressing member 20 and the pressing member support 18 are not limited to such an example. For example, FIGS. 7 (A), (B), and FIGS. 8 (A), (B), and (C ), The pressing member support 18 ′ may have a connecting end 18′T, and the pressing member 20 ′ may have a long hole 20′G.

  The pressing member support 18 ′ is formed of, for example, a resin material, and engages with a base end portion having a through hole 18′a into which the above-described connecting pin 24 is inserted, and a long hole 20′G of the pressing member 20 ′. The connecting end portion 18′T having a pair of connecting pins 18′P on both side surfaces and a connecting portion that connects the base end portion and the connecting end portion.

  A base end portion of each pressing member support 18 ′ is connected to the arm portions 12 RL and 12 LL of the cover member 12 via a connecting pin 24.

  The connecting pins 18'P of the connecting end 18'T are formed to face each other. The connecting pin 18′P is inserted into the long hole 20′G of the pressing member 20 ′. As a result, the pressing member 20 ′ can reciprocate relatively by a distance corresponding to the length of the long hole 20′G with respect to the connecting end portion 18T.

  A hole 18′b into which the guide pin 27 is inserted is formed at the intermediate position between the hole 18′a and the connecting pin 18′P in the above-described coupling portion. The center axis of the hole 18'b is formed substantially parallel to the center axis of the hole 18'a.

  In addition, an opening 18'c larger than the hole 18'b is formed between the hole 18'b and the hole 18'b in the coupling portion. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening 18′c. One end of the torsion coil spring 22 is locked to the peripheral edge of the opening 18'c, and the other end of the torsion coil spring 22 is locked to the base end portion connected to the sliding portion 20'UE of the pressing member 20 '. Yes. As a result, the proximal end portion of the pressing member 20 ′ is biased in the direction in which the pressing member 20 ′ comes into contact with the pressing member support 18 ′.

  Further, as shown in FIGS. 8A, 8B, and 8C, the pressing member 20 ′ is formed of, for example, a resin material, and comes into contact with the outer peripheral surface of the IC package of the semiconductor device DVA. It comprises a pressing portion 20′T having a pressing surface for pressing the surface at its distal end, and a sliding portion 20′UE connected to the base end of the pressing portion 20′T.

  The groove-shaped pressing portion 20′T has long holes 20′G into which the connecting pins 18′P of the pressing member support 18 ′ are inserted so as to face each other. Further, the pressing surface of the pressing portion '20T is formed to be orthogonal to a plane including the sliding contact surface 20'Ua formed on the sliding portion 20'UE.

  Further, an opening 20′a into which the connecting end 18′T of the pressing member support 18 ′ is inserted is formed on the proximal end side of the pressing portion 20′T. Thereby, the lower end surface of the inserted connecting end 18′T is brought into contact with the inner surface of the pressing portion 20′T with a predetermined pressure by the elastic force of the torsion coil spring 22.

  A projection 20′CP that is inserted into the opening 18′c of the pressing member support 18 ′ described above is formed at the center of the connecting portion that connects the pair of sliding portions 20′UE. By inserting the protrusion 20′CP into the opening 18′c of the pressing member support 18 ′, the pressing member support 18 ′ can be smoothly moved relative to the pressing member 20 ′.

  In such a configuration, when testing the semiconductor device DVA, first, for example, the cover member 12 is moved from the top end position shown in FIG. As shown in FIG. 4, the coil springs 30 and 32 are pressed downwardly as indicated by arrows against the urging force of the coil springs 30 and 32.

  As a result, the connecting pin 27 of each pressing member support 18 is drawn toward the arm portions 12RL and 12LL of the cover member 12 while being guided by the guide grooves 10RB and 10LB, and each pressing member support 18 is connected to the connecting pin. It is rotated in a direction away from the base 14 around 27. Therefore, the pressing member 20 and each pressing member support 18 pass through the opening portion 14H of the base 14 toward the arm portions 12RL and 12LL.

  Next, when the cover member 12 is further pressed to the lowermost position and then held, a predetermined standby position in which the pressing member 20 and the rotated pressing member support 18 are formed around the outside of the base 14. Will be placed. As shown in FIG. 18 and FIG. 19, the position of the tip of the one-side arm 40 in the device one-side mechanism is a position separated from the hole 14 a of the base 14. At that time, the semiconductor device DVA is sucked and held by a transfer arm of a transfer robot (not shown) and placed on the semiconductor placement portion 16B of the device side alignment plate 16.

  Subsequently, as shown in FIGS. 9B and 9C, the cover member 12 is moved in the direction indicated by the arrow in a state where the tip of the work robot is in contact with the upper surface of the cover member 12, that is, When it is raised, it is raised to the uppermost position by the urging force of the coil springs 30 and 32.

  At that time, the mounted semiconductor device DVA is automatically positioned and mounted on the positioning projection 14PS of the base 14 as shown in FIGS. 16 and 17 by the above-described device shifting mechanism.

  As the arm members 12RL and 12LL of the cover member 12 are raised, as shown in FIG. 10A, the pressing member support 18 and the pressing member 20 are centered on the connecting pin 27 of the pressing member support 18. It starts to rotate so as to protrude into the opening 14H of the base 14. At that time, the connecting pin 27 is moved in the direction away from the arm portions 12RL and 12LL of the cover member 12 and close to the opening 14H while being guided by the guide grooves 10RB and 10LB.

  When the connecting pin 27 is further moved toward the opening 14H of the pedestal 14, as shown in FIG. 10B, the sliding contact surface 20Ua of the sliding portion 20UE of the pressing member 20 is enlarged in FIG. As shown, it is brought into contact with the sliding contact surface 14SW of the base 14. Thereby, the rotation angle of the pressing member 20 is regulated. At that time, the connecting end 18 </ b> T of the pressing member support 18 starts to move with respect to the inner surface of the pressing member 20. Further, the pressing surface of the pressing portion 20T of the pressing member 20 is substantially parallel to the upper surface of the semiconductor device DVA with a predetermined gap.

  Then, as shown in FIGS. 9B and 10C, when the arm members 12RL and 12LL of the cover member 12 are further raised, the pressing surface of the pressing portion 20T of the pressing member 20 is rubbed. Without contact with the upper surface of the semiconductor device DVA. In this case, since the connecting end 18T of the pressing member support 18 moves with respect to the inner surface of the pressing member 20, the pressing area PA pressed by the pressing surface of the pressing portion 20T is conventional as shown in FIG. 13 and FIG. This is a belt-like region having a predetermined width expanded as compared with the pressing area of the latch member. Accordingly, a pressing force moderately dispersed with respect to the semiconductor device DVA is applied to the upper surface of the semiconductor device DVA.

  At that time, as shown in FIG. 11, the sliding contact surface 20 </ b> Ua of the sliding portion 20 </ b> UE of the pressing member 20 is in contact with the sliding contact surface 14 </ b> SW from the initial contact position H <b> 1 shown in FIG. 12. Starts to move to the predetermined position H2. At that time, as shown in FIG. 10D, only the tip of the connecting end 18T of the pressing member support 18 is slidably contacted with the inner surface of the pressing member 20 so as to push down the pressing member 20, and protrudes by a predetermined amount ΔH. The

  Accordingly, the pressing surface of the pressing portion 20T of the pressing member 20 is brought into contact with the outer peripheral surface of the IC package of the semiconductor device DV without rubbing against the upper surface of the semiconductor device DVA. Therefore, the pressing surface presses the semiconductor device DVA toward the contact pin module 36. As a result, there is no possibility that the IC package of the semiconductor device DVA is damaged by the pressing portion 20T of the pressing member 20.

  Then, for example, when an inspection signal is supplied to the input / output unit of the printed wiring board PB while the cover member 12 is maintained at the test position, the inspection signal is supplied to the semiconductor device DVA through the contact pin module 36. When an abnormality of the circuit is detected, an abnormality detection signal from the semiconductor device DVA is supplied to, for example, an external failure diagnosis device through the input / output unit.

  When the inspection of the semiconductor device DVA is completed, the tip of the arm of the work robot is brought into contact with the upper surface of the cover member 12 in order to take out the semiconductor device DVA and mount a new semiconductor device DVA, as described above. The coil springs 30 and 32 are pressed downward against the urging force. The tested semiconductor device DVA is taken out from the device side alignment plate 16 by the transfer arm, and the new semiconductor device DVA to be tested is mounted in the same manner as described above.

  In the above example, as shown in FIG. 15, even when the semiconductor device DVB having a thickness smaller than the thickness of the semiconductor device DVA is mounted, the semiconductor device DVB is pressed by the pressing member 20. When pressed by the pressing surface of the portion 20T, the lowermost position (push-out position) of the bottom of the semiconductor housing portion 14A that receives the semiconductor device DVB on the base 14 is the bottom of the semiconductor housing portion 14A when the semiconductor device DVA is mounted. It becomes the same as the lowest end position. Therefore, there is no need to change the relative position of the bottom of the semiconductor device housing portion 14A with respect to the contact pin module 36 in accordance with the thickness of the semiconductor device.

  Furthermore, in the above-mentioned example, while restricting the rotation angle of each sliding part 20UE of the pressing member 20, the slidable contact surface 14SW as a position regulating guide part that guides the smooth movement of each sliding part 20UE downward. Is formed at the periphery of the hole 14H in the outer peripheral portion of the base 14, but is not limited to such an example. For example, as shown in FIGS. 20 to 22, the recesses 10′RR and 10′LR A post 10′PO as a position regulation guide portion may be formed integrally with the socket body 10 ′ in a notch portion formed between the module housing portion 10′A.

  In FIG. 20, guide grooves 10′G are formed at predetermined intervals on outer peripheral portions of the respective sides of the socket body 10 ′ so that guide claws 12N of a cover member, which will be described later, are engaged so as to be movable up and down. ing. The guide groove 10 ′ G is formed substantially perpendicular to the bottom surface portion of the socket body 10. When the cover member 12 takes the uppermost end position, the tip end of the guide claw portion 12N is locked to one end portion of each groove 10′G.

  When the cover member 12 is lowered between a pair of guide grooves 10′G on two long sides of at least four sides of the socket body 10 ′, arm portions 12RL and 12LL of the cover member 12 described later The recesses 10′RR and 10′LR into which are inserted are formed substantially parallel to the guide groove 10G.

Further, a module housing portion 10′A in which the contact pin module 36 is housed is formed at a substantially central portion of the socket body 10 ′. The contact alignment portion 16B of the device-side alignment plate 16 is disposed above the module housing portion 10′A.

  Between the module housing portion 10′A and the recesses 10′RR and 10′LR, cutout portions through which the above-described pressing member support 18 and pressing member 20 pass are formed. A pair of posts 10′PO are formed inside each notch so as to be substantially perpendicular to a plane including the contact alignment portion 16B. As a result, as shown in FIG. 20, the rotation angle of each sliding portion 20UE of the pressing member 20 is regulated by the post 10′PO, and smooth downward movement of each sliding portion 20UE is guided. It will be.

  In the example of the socket for a semiconductor device according to the present invention described above, the pressing members 20 and 20 ′ are driven in a configuration in which one ends of the pressing member supports 18 and 18 ′ are connected to the cover member 12. Without being limited to such an example, as shown in, for example, Japanese Patent Application Laid-Open No. 2006-071375 (see FIG. 53), instead of the cover member 12, pressing member supports 18 and 18 are provided by a material handling unit. The pressing members 20 and 20 'may be configured to be rotated by pressing or releasing one end of'.

DESCRIPTION OF SYMBOLS 10 Socket main body 12 Cover member 14 Base 14A Semiconductor device accommodating part 14H Opening part 14SW Sliding contact surface 18 Pressing member support body 20 Pressing member 20UE Sliding part 20Ua Sliding contact surface 22 Torsion coil spring 24 Connecting pin 27 Guide pin DVA, DVB Semiconductor apparatus

Claims (7)

A socket body having a semiconductor device mounting portion to which the semiconductor device is detachably mounted and a contact terminal group electrically connected to a terminal of the semiconductor device;
When approaching the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion, the pressing surface is substantially parallel to the surface and moves along a direction perpendicular to the surface and contacts the surface. A pressing member having a pressing surface in contact;
A pressing device that is supported by the socket body so as to be close to or separated from the semiconductor device mounting portion with the pressing member, one end of which is movably connected to the pressing member, and the other end that is connected to the driving means. A member support;
When the pressing member is interlocked with the movement of the pressing member support by the driving means and is close to the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion, the pressing surface of the pressing member is A position restricting guide portion for restricting and guiding the position of the sliding portion of the pressing member so as to move along a direction orthogonal to the surface and contact the surface;
A socket for a semiconductor device comprising:   The pressing member support is configured to press the pressing member guided by the position regulation guide portion toward the IC package after the pressing surface of the pressing member contacts the surface of the IC package of the semiconductor device. The socket for a semiconductor device according to claim 1, wherein:   3. The semiconductor device socket according to claim 1, wherein one end of the pressing member support is arranged to be movable relative to an inner peripheral portion of the pressing member. The driving means is a cover member supported by the socket body so as to be movable up and down;
Urging means for urging the cover member in a direction separating the cover member from the socket body,
When the pressing member and the pressing member support are close to the surface of the IC package of the semiconductor device mounted on the semiconductor device mounting portion in accordance with the raising operation of the cover member based on the biasing force of the biasing means Then, after rotating in conjunction with the ascending operation of the cover, the position regulating guide portion regulates and guides the position of the sliding portion of the pressing member, and the pressing surface of the pressing member is orthogonal to the outer surface. 4. The semiconductor device socket according to claim 1, wherein the socket moves along a direction and abuts against the surface. The socket for a semiconductor device according to claim 1, wherein the position regulation guide portion is formed on an outer peripheral surface of a base having the semiconductor device mounting portion.   The position restriction guide portion is formed in a passage through which the pressing member and the pressing member support pass through the socket body so as to be close to or separated from the semiconductor device mounting portion. 1. The semiconductor device socket according to 1.   2. The socket for a semiconductor device according to claim 1, further comprising a device side-shift mechanism for selectively urging the semiconductor device toward a plurality of positioning projections for positioning the semiconductor device.

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