TWI418871B - Lens module and fabrication method thereof - Google Patents
Lens module and fabrication method thereof Download PDFInfo
- Publication number
- TWI418871B TWI418871B TW98145383A TW98145383A TWI418871B TW I418871 B TWI418871 B TW I418871B TW 98145383 A TW98145383 A TW 98145383A TW 98145383 A TW98145383 A TW 98145383A TW I418871 B TWI418871 B TW I418871B
- Authority
- TW
- Taiwan
- Prior art keywords
- lens
- layer
- transparent substrate
- light
- lens module
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000010410 layer Substances 0.000 claims description 180
- 239000000758 substrate Substances 0.000 claims description 77
- 230000003287 optical effect Effects 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lens Barrels (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
本發明是有關於一種模組,且特別是有關於一種鏡頭模組。 The present invention relates to a module, and more particularly to a lens module.
隨著電子產品的模組微型化與低價化之趨勢,晶圓級模組(Wafer Level Module,WLM)技術之出現備受關注。晶圓級模組的技術主要是可將電子產品利用晶圓級的製造技術,而將電子產品的體積微型化並降低成本。其中,晶圓級模組的技術也可以是應用於製作鏡頭模組上,而使得鏡頭模組在體積上遠較傳統的鏡頭模組得以獲得縮減,進而可應用在電子裝置(如筆記型電腦、手機等)的相機模組上。 With the trend of miniaturization and low price of electronic products, the emergence of Wafer Level Module (WLM) technology has attracted much attention. The technology of wafer-level modules is mainly to make electronic products use wafer-level manufacturing technology, and to miniaturize and reduce the cost of electronic products. Among them, the technology of the wafer level module can also be applied to the lens module, so that the lens module can be reduced in size compared with the conventional lens module, and can be applied to electronic devices (such as notebook computers). , mobile phone, etc.) on the camera module.
圖1為習知一種採用晶圓級模組技術的鏡頭模組的局部剖示圖。請參考圖1,鏡頭模組100包括一第一透鏡層110、一第二透鏡層120與一間隙層130。第一透鏡層110具有多個第一透鏡112以及一透光基板114,其中第一透鏡112位於透光基板114上。第二透鏡層120具有多個第二透鏡122以及一透光基板124,其中第二透鏡位於透光基板124上。間隙層130配置於第一透鏡層110與第二透鏡層120之間,如圖1所示。 1 is a partial cross-sectional view of a conventional lens module using wafer level module technology. Referring to FIG. 1 , the lens module 100 includes a first lens layer 110 , a second lens layer 120 , and a gap layer 130 . The first lens layer 110 has a plurality of first lenses 112 and a light transmissive substrate 114 , wherein the first lens 112 is located on the transparent substrate 114 . The second lens layer 120 has a plurality of second lenses 122 and a transparent substrate 124, wherein the second lens is located on the transparent substrate 124. The gap layer 130 is disposed between the first lens layer 110 and the second lens layer 120, as shown in FIG.
在鏡頭模組100中,間隙層130通常是採用玻璃或是塑膠之類的透光材料,然而,在進行光學成像時,雜散光 便容易穿透此間隙層130而無法有效地被隔離,因此,會造成鏡頭模組100在進行成像時雜訊的比例過大,而在成像品質上無法有效獲得提升。 In the lens module 100, the gap layer 130 is usually made of a light-transmitting material such as glass or plastic. However, when optical imaging is performed, stray light is used. The gap layer 130 is easily penetrated and cannot be effectively isolated. Therefore, the proportion of the noise of the lens module 100 during imaging is too large, and the image quality cannot be effectively improved.
另外,在製作鏡頭模組100的過程中,通常是必須使用進行兩次黏著製程,以使間隙層130可分別與第一透鏡層110與第二透鏡層120接合,而組立鏡頭模組100。然而,採用前述結構的製作方式容易造成對位上的高困難度,而降低製作鏡頭模組100的可靠度。 In addition, in the process of manufacturing the lens module 100, it is generally necessary to perform the adhesion process twice, so that the gap layer 130 can be bonded to the first lens layer 110 and the second lens layer 120, respectively, and the lens module 100 is assembled. However, the manufacturing method using the foregoing structure is likely to cause high difficulty in alignment, and the reliability of manufacturing the lens module 100 is lowered.
有鑑於此,本發明提供一種鏡頭模組,其可有效降低雜散光,而具有較佳的成像品質。 In view of this, the present invention provides a lens module which can effectively reduce stray light and has better imaging quality.
本發明另提供一種鏡頭模組的製作方法,其可製作出上述的鏡頭模組。 The invention further provides a method for manufacturing a lens module, which can manufacture the above lens module.
本發明提出一種鏡頭模組,其具有一集光區以及一非集光區。此鏡頭模組包括一第一透鏡層、一第二透鏡層以及一遮光間隙層。第一透鏡層具有一第一透光基板以及一光學元件。光學元件配置於第一透光基板上並具有至少一第一透鏡以及連接第一透鏡的一連接部。第一透鏡位於集光區內,而連接部位於非集光區內。第二透鏡層具有一第二透光基板以及至少一相對第一透鏡的第二透鏡。第二透鏡配置於第二透光基板上並位於集光區內,而光學元件位於第一透光基板與第二透光基板之間。遮光間隙層配置於第一透鏡層與第二透鏡層之間,以於第一透鏡層與第二透 鏡層之間保持一間隙。遮光間隙層具有一支撐部與一覆蓋部,其中支撐部連接連接部與第二透光基板,而覆蓋部覆蓋第一透鏡的週邊。 The invention provides a lens module having a collecting region and a non-collecting region. The lens module includes a first lens layer, a second lens layer and a light shielding gap layer. The first lens layer has a first light transmissive substrate and an optical element. The optical component is disposed on the first transparent substrate and has at least one first lens and a connecting portion connecting the first lens. The first lens is located in the light collecting region, and the connecting portion is located in the non-light collecting region. The second lens layer has a second transparent substrate and at least one second lens opposite the first lens. The second lens is disposed on the second transparent substrate and located in the light collecting region, and the optical component is located between the first transparent substrate and the second transparent substrate. The light shielding gap layer is disposed between the first lens layer and the second lens layer for the first lens layer and the second lens layer A gap is maintained between the mirror layers. The light shielding gap layer has a supporting portion and a covering portion, wherein the supporting portion connects the connecting portion and the second transparent substrate, and the covering portion covers the periphery of the first lens.
在本發明之一實施例中,支撐部具有一第一厚度,而覆蓋部具有一第二厚度,其中第一厚度大於第二厚度。 In an embodiment of the invention, the support portion has a first thickness and the cover portion has a second thickness, wherein the first thickness is greater than the second thickness.
在本發明之一實施例中,連接部的表面為一凹凸面。在本發明之一實施例中,遮光間隙層與連接部連接的表面共形於凹凸面。在本發明之一實施例中,遮光間隙層的材質為黑色膠質。 In an embodiment of the invention, the surface of the connecting portion is a concave-convex surface. In an embodiment of the invention, the surface of the light-shielding gap layer connected to the connecting portion conforms to the uneven surface. In an embodiment of the invention, the material of the light-shielding gap layer is black colloid.
在本發明之一實施例中,第二透光基板具有一第一表面與一相對第一表面的第二表面,且至少一第二透鏡的數量為多個時,這些第二透鏡分別配置於第一表面與第二表面上並相互對應。 In an embodiment of the present invention, the second transparent substrate has a first surface and a second surface opposite to the first surface, and when the number of the at least one second lens is plural, the second lenses are respectively disposed on The first surface and the second surface correspond to each other.
在本發明之一實施例中,鏡頭模組更包括至少一第三透鏡,其中此第三透鏡相對第一透鏡配置於第一透光基板上,且第一透光基板位於第一透鏡與第三透鏡之間。 In an embodiment of the invention, the lens module further includes at least one third lens, wherein the third lens is disposed on the first transparent substrate relative to the first lens, and the first transparent substrate is located on the first lens and the first lens Between the three lenses.
在本發明之一實施例中,鏡頭模組更包括一黏著層,其中此黏著層位於支撐部與第二透光基板之間。 In an embodiment of the invention, the lens module further includes an adhesive layer, wherein the adhesive layer is located between the support portion and the second transparent substrate.
在本發明之一實施例中,第一透光基板與光學元件為一體成型或各自成型。在本發明之一實施例中,第二透光基板與至少一第二透鏡為一體成型或各自成型。 In an embodiment of the invention, the first light transmissive substrate and the optical element are integrally formed or formed separately. In an embodiment of the invention, the second transparent substrate and the at least one second lens are integrally formed or formed separately.
在本發明之一實施例中,第一透鏡與第二透鏡各為凹透鏡或凸透鏡。 In an embodiment of the invention, the first lens and the second lens are each a concave lens or a convex lens.
本發明另提出一種製作出上述鏡頭模組的方法。其製作方法包括下列步驟。首先,提供上述的第一透鏡層。接 著,形成上述的遮光間隙層於該第一透鏡層上。然後,提供上述的第二透鏡層並將第二透鏡層覆蓋於遮光間隙層上,以組合第一透鏡層與第二透鏡層。 The present invention further provides a method of fabricating the above lens module. The manufacturing method includes the following steps. First, the first lens layer described above is provided. Connect The light-shielding gap layer is formed on the first lens layer. Then, the second lens layer described above is provided and the second lens layer is overlaid on the light-shielding gap layer to combine the first lens layer and the second lens layer.
在本發明之一實施例中,形成遮光間隙層的方法包括下列步驟。首先,使用一模具製程於光學元件上。然後,注入一遮光間隙材料於模具製程中,以形成連接光學元件的支撐部與覆蓋部。接著,固化遮光間隙材料以形成遮光間隙層。 In an embodiment of the invention, the method of forming the light-shielding gap layer comprises the following steps. First, a mold process is used on the optical component. Then, a light-shielding gap material is injected into the mold process to form a support portion and a cover portion connecting the optical elements. Next, the light-shielding gap material is cured to form a light-shielding gap layer.
在本發明之一實施例中,上述的製作方法更包括於連接部的表面上形成一凹凸結構。在本發明之一實施例中,形成一遮光間隙層於第一透鏡層時,遮光間隙層與連接部連接的表面共形於凹凸結構。 In an embodiment of the invention, the manufacturing method further includes forming a concave-convex structure on the surface of the connecting portion. In an embodiment of the invention, when a light-shielding gap layer is formed on the first lens layer, the surface of the light-shielding gap layer and the connecting portion is conformed to the uneven structure.
在本發明之一實施例中,第一透光基板與光學元件的形成方式包括一體成型或各自成型。 In an embodiment of the invention, the first transparent substrate and the optical element are formed in a form of integral molding or molding.
在本發明之一實施例中,第二透光基板與至少一第二透鏡的形成方式包括一體成型或各自成型。 In an embodiment of the invention, the second transparent substrate and the at least one second lens are formed by integral molding or molding.
在本發明之一實施例中,在提供第一透鏡層的同時,更包括於第一透光基板上形成至少一第三透鏡,其中第三透鏡相對第一透鏡,且第一透光基板位於第一透鏡與第三透鏡之間。在本發明之一實施例中,第三透鏡與第一透鏡為同時製作。 In an embodiment of the present invention, at least one third lens is formed on the first transparent substrate while the first lens layer is provided, wherein the third lens is opposite to the first lens, and the first transparent substrate is located Between the first lens and the third lens. In an embodiment of the invention, the third lens and the first lens are fabricated simultaneously.
基於上述,本發明之鏡頭模組主要是透過遮光間隙層是採用不易透光的材質,而可減少雜散光的入射,藉以提高鏡頭模組的成像品質。其中,此遮光間隙層具有支撐部與覆蓋部,而支撐部可隔絕大部分的雜散光入射至透鏡內 並具有支撐第一透鏡層與第二透鏡層之用,且覆蓋部可更進一步地阻隔雜散光傳遞至透鏡內,而同樣具有提高鏡頭模組成像品質的優點。 Based on the above, the lens module of the present invention mainly adopts a material that is not easy to transmit light through the light-shielding gap layer, and can reduce the incidence of stray light, thereby improving the imaging quality of the lens module. Wherein, the light-shielding gap layer has a support portion and a cover portion, and the support portion can isolate most of the stray light from entering the lens The utility model has the advantages of supporting the first lens layer and the second lens layer, and the covering portion can further block the transmission of stray light into the lens, and has the advantages of improving the imaging quality of the lens module.
另外,由於連接部的表面可為凹凸面,如此則可提高遮光間隙層與第一透鏡層之間的附著力。再者,若遮光間隙層是採用不易透光的膠質材料時,則在形成遮光間隙層於光學元件上,便可直接黏固於第一透鏡層上,而無須另外使用黏著劑將遮光間隙層固定於第一透鏡層上。換言之,相對習知技術需採用至少兩次的黏著製程,本實施例之鏡頭模組具有較為簡易的製程步驟,而具有較佳的製程可靠度。 Further, since the surface of the connecting portion can be an uneven surface, the adhesion between the light-shielding gap layer and the first lens layer can be improved. Furthermore, if the light-shielding gap layer is made of a colloidal material which is not easy to transmit light, the light-shielding gap layer is formed on the optical element, and the light-shielding gap layer can be directly adhered to the first lens layer without using an additional adhesive. Fixed on the first lens layer. In other words, the lens module of the present embodiment has a relatively simple process step and has better process reliability than the prior art.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖2為本發明一實施例之鏡頭模組的剖面示意圖。請參考圖2,本實施例之鏡頭模組200具有一集光區P1以及一非集光區P2。此鏡頭模組200包括一第一透鏡層210、一第二透鏡層220以及一遮光間隙層230。第一透鏡層210具有一第一透光基板212以及一光學元件214。光學元件214配置於第一透光基板212上並具有至少一第一透鏡214a以及連接第一透鏡214a的一連接部214b,其中第一透鏡214a位於集光區P1內,而連接部214b位於非集光區P2內。在本實施例中,第一透鏡214a與連接部214b可為一體成型,意即可利用壓模製程或是其他適當半導體製程 的方式同時形成第一透鏡214a與連接部214b。 2 is a cross-sectional view of a lens module in accordance with an embodiment of the present invention. Referring to FIG. 2, the lens module 200 of the embodiment has a light collecting area P1 and a non-light collecting area P2. The lens module 200 includes a first lens layer 210, a second lens layer 220, and a light shielding gap layer 230. The first lens layer 210 has a first transparent substrate 212 and an optical element 214. The optical component 214 is disposed on the first transparent substrate 212 and has at least a first lens 214a and a connecting portion 214b connected to the first lens 214a. The first lens 214a is located in the light collecting area P1, and the connecting portion 214b is located in the non-lighting area P1. In the light collection area P2. In this embodiment, the first lens 214a and the connecting portion 214b may be integrally formed, that is, the stamping process or other suitable semiconductor process may be utilized. The manner of forming the first lens 214a and the connecting portion 214b at the same time.
在光學元件214中,第一透鏡214a是位於第一透鏡層210與第二透鏡層220之間,且第一透鏡214a可以是採用如圖2繪示的凸透鏡,其中此凸透鏡的凸面為朝向第二透鏡層220的方向。然而,在其他未繪示的實施例中,第一透鏡214a也可以是採用凹透鏡的設計,此部分端視使用者的需求與設計而定。在本實施例中,連接部214b的表面S105可以是採用如圖2所繪示的一凹凸面的設計,但在其他未繪示的實施例中,表面S105也可以是一平面,此部分亦可視使用者的需求與設計而定。 In the optical element 214, the first lens 214a is located between the first lens layer 210 and the second lens layer 220, and the first lens 214a may be a convex lens as shown in FIG. 2, wherein the convex surface of the convex lens is oriented The direction of the second lens layer 220. However, in other embodiments not shown, the first lens 214a may also be a design using a concave lens depending on the needs and design of the user. In this embodiment, the surface S105 of the connecting portion 214b may be a concave-convex surface as shown in FIG. 2, but in other embodiments not shown, the surface S105 may also be a flat surface. It can be determined by the needs and design of the user.
另外,第一透光基板212與光學元件214可以是一體成型,即可利用如鑄模或其他特殊模具來完成一體成型的製作。或者是,第一透光基板212與光學元件214可以是各自成型,如:可於第一透光基板212上形成上述的光學元件214。本實施例是以各自成型的方式將光學元件214製作於第一透光基板212,但不僅限於此。在本實施例中,採用各自成型的方式在第一透光基板212上形成光學元件214時,由於光學元件214具有連接第一透鏡214a的連接部214b,因此,光學元件214於第一透光基板212上的接觸面積便可提高,而可使得光學元件214更為穩固地位於第一透光基板212上。 In addition, the first transparent substrate 212 and the optical element 214 may be integrally formed, that is, the molding may be completed by using, for example, a mold or other special mold. Alternatively, the first transparent substrate 212 and the optical element 214 may be formed separately, for example, the optical element 214 described above may be formed on the first transparent substrate 212. In this embodiment, the optical element 214 is formed on the first transparent substrate 212 in a manner of molding each, but is not limited thereto. In this embodiment, when the optical element 214 is formed on the first transparent substrate 212 by means of the respective molding, since the optical element 214 has the connecting portion 214b connecting the first lens 214a, the optical element 214 is in the first light transmission. The contact area on the substrate 212 can be increased, and the optical element 214 can be more stably positioned on the first transparent substrate 212.
在本實施例中,鏡頭模組200更包括至少一第三透鏡226,其中此第三透鏡226相對第一透鏡214a配置於第一透光基板212上,且第一透光基板212位於第一透鏡214a 與第三透鏡226之間,如圖2所示。在本實施例中,第三透鏡226可以是採用如圖2繪示的凸透鏡,其中此凸透鏡的凸面為背向第一透光基板212的方向。然而,在其他未繪示的實施例中,第三透鏡226也可採用凹透鏡的設計,此部分端視使用者的需求與設計而定。 In this embodiment, the lens module 200 further includes at least one third lens 226, wherein the third lens 226 is disposed on the first transparent substrate 212 opposite to the first lens 214a, and the first transparent substrate 212 is located at the first Lens 214a Between the third lens 226 and FIG. In this embodiment, the third lens 226 may be a convex lens as shown in FIG. 2 , wherein the convex surface of the convex lens is a direction facing away from the first transparent substrate 212 . However, in other embodiments not shown, the third lens 226 can also be designed with a concave lens depending on the needs and design of the user.
第二透鏡層220具有一第二透光基板222以及至少一相對第一透鏡214a的第二透鏡224。第二透鏡224配置於第二透光基板222上並位於集光區P1內,而光學元件214位於第一透光基板212與第二透光基板222之間,如圖2所示。在本實施例中,第二透光基板222具有一第一表面222a與一相對第一表面的第二表面222b,且圖2所示的第二透鏡224的數量為多個,而這些第二透鏡224分別配置於第一表面222a與第二表面222b上並相互對應。在本實施例中,第二透鏡224是採用如圖2所繪示的凸透鏡的設計,且其凸面皆是背向第二透光基板222的方向,在另一實施例中,第二透鏡224也可以是採用凹透鏡的設計,本實施例僅是以凸透鏡作為舉例說明,但不限於此。 The second lens layer 220 has a second transparent substrate 222 and at least one second lens 224 opposite to the first lens 214a. The second lens 224 is disposed on the second transparent substrate 222 and located in the light collecting region P1, and the optical element 214 is located between the first transparent substrate 212 and the second transparent substrate 222, as shown in FIG. 2 . In this embodiment, the second transparent substrate 222 has a first surface 222a and a second surface 222b opposite to the first surface, and the number of the second lenses 224 shown in FIG. 2 is plural, and these second The lenses 224 are respectively disposed on the first surface 222a and the second surface 222b and correspond to each other. In this embodiment, the second lens 224 is designed as a convex lens as shown in FIG. 2 , and the convex surface thereof is in a direction away from the second transparent substrate 222 . In another embodiment, the second lens 224 It may also be a design using a concave lens. This embodiment is merely illustrative of a convex lens, but is not limited thereto.
在另一未繪示的實施例中,第二透鏡224也可以是僅配置於第一表面222a或第二表面222b上,而其數量可以是單一個或多個,此部分係依據使用者對透鏡模組200所需的規格而定,換言之,上述第一透鏡214a、第二透鏡224與第三透鏡226的數量與配置位置是用來舉例說明本發明的概念,但不僅限於此。 In another embodiment, the second lens 224 may be disposed only on the first surface 222a or the second surface 222b, and the number may be one or more, depending on the user. Depending on the specifications required for the lens module 200, in other words, the number and arrangement positions of the first lens 214a, the second lens 224, and the third lens 226 are used to exemplify the concept of the present invention, but are not limited thereto.
另外,第二透光基板222與第二透鏡224可以是一體成型,即可利用如鑄模或其他特殊模具來完成一體成型的 製作。或者是,第二透光基板222與第二透鏡224也可以是各自成型,如:可於第二透光基板222上形成如圖2的第二透鏡224。本實施例是以各自成型的方式將第二透鏡224製作於第二透光基板222,但不僅限於此。 In addition, the second transparent substrate 222 and the second lens 224 may be integrally formed, that is, integrally formed by using a mold or other special mold. Production. Alternatively, the second transparent substrate 222 and the second lens 224 may be formed separately. For example, the second lens 224 of FIG. 2 may be formed on the second transparent substrate 222. In this embodiment, the second lens 224 is formed on the second transparent substrate 222 in a manner of molding each, but is not limited thereto.
遮光間隙層230配置於第一透鏡層210與第二透鏡層220之間,以於第一透鏡層210與第二透鏡層220之間保持一間隙S101,圖2所示。遮光間隙層230具有一支撐部232與一覆蓋部234,其中支撐部232連接連接部214b與第二透光基板222,而覆蓋部234覆蓋第一透鏡214a的週邊S103。詳細而言,遮光間隙層230使第一透鏡層210與第二透鏡層220所保持的間隙S101主要是用來配合第一透鏡214a、第二透鏡224以及第三透鏡226所產生的焦距之距離,並可避免透鏡214a、224互相碰撞或碰撞到透光基板212、222。換言之,遮光間隙層230的厚度需視第一透鏡214a、第二透鏡224以及第三透鏡226所需的焦距以及使用者的設計需求而定。 The light-shielding gap layer 230 is disposed between the first lens layer 210 and the second lens layer 220 to maintain a gap S101 between the first lens layer 210 and the second lens layer 220, as shown in FIG. 2 . The light-shielding gap layer 230 has a supporting portion 232 and a covering portion 234. The supporting portion 232 connects the connecting portion 214b and the second transparent substrate 222, and the covering portion 234 covers the periphery S103 of the first lens 214a. In detail, the gap S101 of the first lens layer 210 and the second lens layer 220 is mainly used to match the focal length of the first lens 214a, the second lens 224, and the third lens 226. The lenses 214a, 224 can be prevented from colliding with each other or colliding with the transparent substrates 212, 222. In other words, the thickness of the light-shielding gap layer 230 depends on the required focal length of the first lens 214a, the second lens 224, and the third lens 226, and the design requirements of the user.
在本實施例中,支撐部232具有一第一厚度H1,而覆蓋部234具有一第二厚度H2,其中第一厚度H1大於第二厚度H2,如圖2所示。詳細而言,支撐部232及其厚度H1主要是用來保持第一透鏡層210與第二透鏡層220之間的間隙S101,而覆蓋部分連接部214b與第一透鏡214a的週邊S103的覆蓋部234可增加與光學元件214的接觸面積,以提高遮光間隙層230於第一透鏡層210上的穩固性。 In the present embodiment, the support portion 232 has a first thickness H1, and the cover portion 234 has a second thickness H2, wherein the first thickness H1 is greater than the second thickness H2, as shown in FIG. In detail, the support portion 232 and its thickness H1 are mainly used to maintain the gap S101 between the first lens layer 210 and the second lens layer 220, and cover the portion of the connection portion 214b and the periphery S103 of the first lens 214a. 234 may increase the contact area with the optical element 214 to improve the stability of the light-shielding gap layer 230 on the first lens layer 210.
在本實施例中,遮光間隙層230的材質由於是採用不 易透光的材質,例如是以黑色膠質,如此,大部分的雜散光便可被支撐部232遮擋,即影像光的雜訊便可獲得降低,從而可提高鏡頭模組200本身成像的訊雜比(signal-to-noise ratio,SNR)。此外,覆蓋部分連接部214b與第一透鏡214a的週邊S103的覆蓋部234可更進一步地減少雜散光進入透鏡之間的機會,從而可提高鏡頭模組200的成像品質。 In this embodiment, the material of the light-shielding gap layer 230 is not used. The light-transmissive material is, for example, a black gel, so that most of the stray light can be blocked by the support portion 232, that is, the noise of the image light can be reduced, thereby improving the imaging of the lens module 200 itself. Signal-to-noise ratio (SNR). In addition, the covering portion 214b and the covering portion 234 of the periphery S103 of the first lens 214a can further reduce the chance of stray light entering between the lenses, so that the imaging quality of the lens module 200 can be improved.
另外,在連接部214b的表面S105是採用凹凸面的情況下,配置其上的遮光間隙層230與連接部214b連接的表面便會共形於凹凸面,如圖2所示。透過上述凹凸面的結構,在形成遮光間隙層230於光學元件214時,便可提高遮光間隙層230與連接部214b之間的附著力,以及增加遮光間隙層230與連接部214b的接觸面積,進而提高遮光間隙層230於第一透鏡層210的穩固性。 Further, when the surface S105 of the connecting portion 214b is a concave-convex surface, the surface on which the light-shielding gap layer 230 and the connecting portion 214b are disposed is conformed to the uneven surface, as shown in FIG. Through the structure of the uneven surface, when the light-shielding gap layer 230 is formed on the optical element 214, the adhesion between the light-shielding gap layer 230 and the connecting portion 214b can be improved, and the contact area between the light-shielding gap layer 230 and the connecting portion 214b can be increased. Further, the stability of the light-shielding gap layer 230 on the first lens layer 210 is improved.
在本實施例中,鏡頭模組200更包括一黏著層240,其中此黏著層240位於支撐部232與第二透光基板222之間,如圖2所示。詳細而言,在遮光間隙層230採用膠質材料的情況下,則形成遮光間隙層230於第一透鏡層210時,遮光間隙層230便可先與第一透鏡層210固接。此時,為了可組裝如圖2所示的透鏡模組200,便可使用黏著層240於支撐部232與第二透光基板222之間,以將第一透鏡層210與第二透鏡層220組立。 In this embodiment, the lens module 200 further includes an adhesive layer 240, wherein the adhesive layer 240 is located between the support portion 232 and the second transparent substrate 222, as shown in FIG. In detail, when the light-shielding gap layer 230 is made of a gel material, when the light-shielding gap layer 230 is formed on the first lens layer 210, the light-shielding gap layer 230 may be fixed to the first lens layer 210 first. At this time, in order to assemble the lens module 200 as shown in FIG. 2, an adhesive layer 240 may be used between the support portion 232 and the second transparent substrate 222 to connect the first lens layer 210 and the second lens layer 220. Formed.
需要說明的是,本實施例之第一透鏡層210與第二透鏡層220是採用晶圓級模組(wafer level module,WLM)技 術,將多個透鏡214a、224、226製作透光基板上,其中圖2僅是繪示鏡頭模組的局部區域。意即每一透光基板上皆可有多個透鏡陣列,而形成如上述的透鏡層210、220,並且將具有多個透鏡陣列的透光基板疊合組立,則可形成多個如本實施例所述的鏡頭模組200。其中,本實施例是以兩層透鏡層210、220作為舉例說明,在其他實施例中,基於本實施例所傳達的概念,鏡頭模組200也可以採用多層(三層以上)透鏡層的結構。 It should be noted that the first lens layer 210 and the second lens layer 220 of the embodiment adopt a wafer level module (WLM) technology. The plurality of lenses 214a, 224, and 226 are formed on the light-transmissive substrate, and FIG. 2 is only a partial area of the lens module. That is, each of the light-transmissive substrates may have a plurality of lens arrays, and the lens layers 210 and 220 are formed as described above, and the light-transmissive substrates having the plurality of lens arrays are stacked and assembled, thereby forming a plurality of embodiments as in the present embodiment. The lens module 200 is described in the example. In this embodiment, the two lens layers 210 and 220 are exemplified. In other embodiments, the lens module 200 may also adopt a multi-layer (three or more layers) lens layer structure based on the concept conveyed by the embodiment. .
承上述結構可知,本實施例之鏡頭模組200主要是透過遮光間隙層230是採用不易透光的材質,而可減少雜散光的入射,藉以提高鏡頭模組200的成像品質。其中,此遮光間隙層230具有支撐部232與覆蓋部232,而支撐部232可隔絕大部分的雜散光入射至透鏡內並具有支撐第一透鏡層210與第二透鏡層220之用,且覆蓋部可更進一步地阻隔雜散光傳遞至透鏡內,而同樣具有提高鏡頭模組200成像品質的優點。 According to the above structure, the lens module 200 of the present embodiment mainly uses a material that is not easy to transmit light through the light-shielding gap layer 230, and can reduce the incidence of stray light, thereby improving the imaging quality of the lens module 200. The light-shielding gap layer 230 has a support portion 232 and a cover portion 232, and the support portion 232 can isolate most of the stray light from entering the lens and having the support for the first lens layer 210 and the second lens layer 220, and covering The portion can further block the transmission of stray light into the lens, and also has the advantage of improving the imaging quality of the lens module 200.
另外,在光學元件214中,由於連接部214b的表面S105可為凹凸面,如此則可提高遮光間隙層230與第一透鏡層210之間的附著力。再者,若遮光間隙層230是採用不易透光的膠質材料時,則在形成遮光間隙層230於光學元件214上,便可直接黏固於第一透鏡層210上,而無須另外使用黏著劑將遮光間隙層230固定於第一透鏡層210上。換言之,相對習知技術需採用至少兩次的黏著製程,本實施例之鏡頭模組200具有較為簡易的製程步驟,而具有較佳的製程可靠度。 Further, in the optical element 214, since the surface S105 of the connecting portion 214b can be an uneven surface, the adhesion between the light-shielding gap layer 230 and the first lens layer 210 can be improved. In addition, if the light-shielding gap layer 230 is made of a non-transmissive gel material, the light-shielding gap layer 230 is formed on the optical element 214, and can be directly adhered to the first lens layer 210 without using an additional adhesive. The light-shielding gap layer 230 is fixed to the first lens layer 210. In other words, the lens module 200 of the present embodiment has a relatively simple process step and has better process reliability than the prior art.
基於上述,本發明亦提供一種製作上述鏡頭模組的方法,其說明如下。 Based on the above, the present invention also provides a method of fabricating the above lens module, which is explained below.
圖3A~圖3C為本發明一實施例之鏡頭模組的製作流程圖。請參考圖3A,首先,提供一上述的第一透鏡層210,其中關於第一透鏡層210的說明可參考前述,在此不再贅述。 3A-3C are flowcharts showing the fabrication of a lens module according to an embodiment of the invention. Referring to FIG. 3A, first, a first lens layer 210 is provided. The description of the first lens layer 210 can be referred to the foregoing, and details are not described herein again.
接著,形成一上述的遮光間隙層230於第一透鏡層210上,如圖3B所繪示。在本實施例中,形成遮光間隙層230的方式例如是使用一模具製程(未繪示)於光學元件214上。然後,注入一遮光間隙材料(未繪示)於模具製程中,以形成連接光學元件214的支撐部232與覆蓋部234。接著,固化遮光間隙材料便可形成如圖3B所繪示的遮光間隙層230。在本實施例中,遮光間隙材料可以是採用不易透光的膠質材料,例如是黑色膠質,如此一來,在形成遮光間隙層230於第一透鏡層210後,遮光間隙層230便可直接地黏固於第一透鏡層210上,而無須再使用黏著製程黏著遮光間隙層230與第一透鏡層210。 Next, a light-shielding gap layer 230 is formed on the first lens layer 210, as shown in FIG. 3B. In the present embodiment, the manner in which the light-shielding gap layer 230 is formed is, for example, a mold process (not shown) on the optical element 214. Then, a light-shielding gap material (not shown) is injected into the mold process to form the support portion 232 and the cover portion 234 connecting the optical element 214. Then, the light-shielding gap material 230 can be formed as shown in FIG. 3B by curing the light-shielding gap material. In this embodiment, the light-shielding gap material may be a colloidal material that is not easy to transmit light, for example, a black gel. Thus, after the light-shielding gap layer 230 is formed on the first lens layer 210, the light-shielding gap layer 230 may be directly The first lens layer 210 is adhered to the first lens layer 210 without using an adhesive process to adhere the light-shielding gap layer 230 to the first lens layer 210.
然後,提供一上述的第二透鏡層220並將第二透鏡層220覆蓋於遮光間隙層230上,以組合第一透鏡層210與第二透鏡層220,如圖3C所示。在本實施例中,第二透鏡層220的說明可參考前述,在此不再贅述。另外,在將第二透鏡層220覆蓋於遮光間隙層230時,更可於第二透鏡層220與遮光間隙層230塗佈一黏著層(未繪示),藉以將 第二透鏡層220與遮光間隙層230黏固。至此,大致完成一種上述鏡頭模組200的製作方法。 Then, a second lens layer 220 is provided and the second lens layer 220 is covered on the light-shielding gap layer 230 to combine the first lens layer 210 and the second lens layer 220, as shown in FIG. 3C. In the present embodiment, the description of the second lens layer 220 can be referred to the foregoing, and details are not described herein again. In addition, when the second lens layer 220 is covered on the light-shielding gap layer 230, an adhesive layer (not shown) may be applied to the second lens layer 220 and the light-shielding gap layer 230, thereby The second lens layer 220 is adhered to the light-shielding gap layer 230. So far, a method of fabricating the above lens module 200 has been substantially completed.
從圖3A至圖3C的製作方法中,可得知在製作鏡頭模組200時,其除了可具有前述鏡頭模組所提及的優點外,相對習知技術的製作方法,本實施例之製作方法可省略一道黏著製程,進而提高製程可靠度並降低進行黏著製程的對位困難度。 3A to 3C, it can be seen that in the production of the lens module 200, in addition to the advantages mentioned in the lens module, the manufacturing method of the present embodiment is the same as the manufacturing method of the present embodiment. The method can omit an adhesive process, thereby improving process reliability and reducing the difficulty of alignment of the adhesive process.
圖4為本發明另一實施例之鏡頭模組的爆炸示意圖。請參考圖4,本實施例之鏡頭模組400例如是採用前述的鏡頭模組200的概念,惟二者不同處在於,鏡頭模組400的第一透鏡層210與第二透鏡層220上的透鏡214a、224是採用多個透鏡陣列A1的形式。另外,為了對應每個透鏡214a、224,因此遮光間隙層230其形狀亦會隨著更動。 4 is a schematic exploded view of a lens module according to another embodiment of the present invention. Referring to FIG. 4 , the lens module 400 of the present embodiment adopts the concept of the lens module 200 described above, but the difference is that the first lens layer 210 and the second lens layer 220 of the lens module 400 are The lenses 214a, 224 are in the form of a plurality of lens arrays A1. In addition, in order to correspond to each of the lenses 214a, 224, the shape of the light-shielding gap layer 230 is also changed.
由於鏡頭模組400是採用鏡頭模組200的概念,因此,鏡頭模組400同樣具有鏡頭模組200所提及的優點,相關說明可參照前述,在此不再贅述。 Since the lens module 400 is a concept of the lens module 200, the lens module 400 also has the advantages mentioned in the lens module 200. For related description, reference may be made to the foregoing, and details are not described herein.
綜上所述,本發明之鏡頭模組主要是透過遮光間隙層230是採用不易透光的材質,而可減少雜散光的入射,藉以提高鏡頭模組200的成像品質。其中,此遮光間隙層230具有支撐部232與覆蓋部234,而支撐部232可隔絕大部分的雜散光入射至透鏡內並具有支撐第一透鏡層210與第二透鏡層220之用,且覆蓋部234可更進一步地阻隔雜散光傳遞至透鏡內,而同樣具有提高鏡頭模組200成像品質的優點。 In summary, the lens module of the present invention mainly uses a material that is not easy to transmit light through the light-shielding gap layer 230, and can reduce the incidence of stray light, thereby improving the imaging quality of the lens module 200. The opaque layer 230 has a support portion 232 and a cover portion 234, and the support portion 232 can isolate most of the stray light from entering the lens and having the support for the first lens layer 210 and the second lens layer 220, and covering The portion 234 can further block the transmission of stray light into the lens, and also has the advantage of improving the imaging quality of the lens module 200.
另外,在光學元件214中,由於連接部214b的表面 S105可為凹凸面,如此則可提高遮光間隙層230與第一透鏡層210之間的附著力。再者,若遮光間隙層230是採用不易透光的膠質材料時,則在形成遮光間隙層230於光學元件214上,便可直接黏固於第一透鏡層210上,而無須另外使用黏著劑將遮光間隙層230固定於第一透鏡層210上。換言之,相對習知技術需採用至少兩次的黏著製程,本實施例之鏡頭模組200具有較為簡易的製程步驟,而具有較佳的製程可靠度。 In addition, in the optical element 214, due to the surface of the connecting portion 214b S105 may be an uneven surface, and thus the adhesion between the light-shielding gap layer 230 and the first lens layer 210 may be improved. In addition, if the light-shielding gap layer 230 is made of a non-transmissive gel material, the light-shielding gap layer 230 is formed on the optical element 214, and can be directly adhered to the first lens layer 210 without using an additional adhesive. The light-shielding gap layer 230 is fixed to the first lens layer 210. In other words, the lens module 200 of the present embodiment has a relatively simple process step and has better process reliability than the prior art.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200、400‧‧‧鏡頭模組 100, 200, 400‧‧‧ lens module
110‧‧‧第一透鏡層 110‧‧‧ first lens layer
120‧‧‧第二透鏡層 120‧‧‧second lens layer
130‧‧‧間隙層 130‧‧‧Gap layer
112‧‧‧第一透鏡 112‧‧‧First lens
114、124‧‧‧透光基板 114, 124‧‧‧Transparent substrate
122‧‧‧第二透鏡 122‧‧‧second lens
210‧‧‧第一透鏡層 210‧‧‧First lens layer
212‧‧‧第一透光基板 212‧‧‧First transparent substrate
214‧‧‧光學元件 214‧‧‧Optical components
214a‧‧‧第一透鏡 214a‧‧‧first lens
214b‧‧‧連接部 214b‧‧‧Connecting Department
220‧‧‧第二透鏡層 220‧‧‧second lens layer
222‧‧‧第二透光基板 222‧‧‧Second transparent substrate
222a‧‧‧第一表面 222a‧‧‧ first surface
222b‧‧‧第二表面 222b‧‧‧ second surface
224‧‧‧第二透鏡 224‧‧‧second lens
226‧‧‧第三透鏡 226‧‧‧ third lens
230‧‧‧遮光間隙層 230‧‧‧ shading gap layer
232‧‧‧支撐部 232‧‧‧Support
234‧‧‧覆蓋部 234‧‧‧ Coverage
240‧‧‧黏著層 240‧‧‧Adhesive layer
A1‧‧‧透鏡陣列 A1‧‧‧ lens array
H1‧‧‧第一厚度 H1‧‧‧first thickness
H2‧‧‧第二厚度 H2‧‧‧second thickness
P1‧‧‧集光區 P1‧‧‧Light collection area
P2‧‧‧非集光區 P2‧‧‧ non-light collection area
S101‧‧‧間隙 S101‧‧‧ gap
S103‧‧‧週邊 Surrounding S103‧‧
S105‧‧‧表面 S105‧‧‧ surface
圖1為習知一種採用晶圓級模組技術的鏡頭模組的局部剖示圖。 1 is a partial cross-sectional view of a conventional lens module using wafer level module technology.
圖2為本發明一實施例之鏡頭模組的剖面示意圖。 2 is a cross-sectional view of a lens module in accordance with an embodiment of the present invention.
圖3A~圖3C為本發明一實施例之鏡頭模組的製作流程圖。 3A-3C are flowcharts showing the fabrication of a lens module according to an embodiment of the invention.
圖4為本發明另一實施例之鏡頭模組的爆炸示意圖。 4 is a schematic exploded view of a lens module according to another embodiment of the present invention.
200‧‧‧鏡頭模組 200‧‧‧ lens module
210‧‧‧第一透鏡層 210‧‧‧First lens layer
212‧‧‧第一透光基板 212‧‧‧First transparent substrate
214‧‧‧光學元件 214‧‧‧Optical components
214a‧‧‧第一透鏡 214a‧‧‧first lens
214b‧‧‧連接部 214b‧‧‧Connecting Department
220‧‧‧第二透鏡層 220‧‧‧second lens layer
222‧‧‧第二透光基板 222‧‧‧Second transparent substrate
222a‧‧‧第一表面 222a‧‧‧ first surface
222b‧‧‧第二表面 222b‧‧‧ second surface
224‧‧‧第二透鏡 224‧‧‧second lens
226‧‧‧第三透鏡 226‧‧‧ third lens
230‧‧‧遮光間隙層 230‧‧‧ shading gap layer
232‧‧‧支撐部 232‧‧‧Support
234‧‧‧覆蓋部 234‧‧‧ Coverage
240‧‧‧黏著層 240‧‧‧Adhesive layer
H1‧‧‧第一厚度 H1‧‧‧first thickness
H2‧‧‧第二厚度 H2‧‧‧second thickness
P1‧‧‧集光區 P1‧‧‧Light collection area
P2‧‧‧非集光區 P2‧‧‧ non-light collection area
S101‧‧‧間隙 S101‧‧‧ gap
S103‧‧‧週邊 Surrounding S103‧‧
S105‧‧‧表面 S105‧‧‧ surface
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98145383A TWI418871B (en) | 2009-12-28 | 2009-12-28 | Lens module and fabrication method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98145383A TWI418871B (en) | 2009-12-28 | 2009-12-28 | Lens module and fabrication method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201122612A TW201122612A (en) | 2011-07-01 |
| TWI418871B true TWI418871B (en) | 2013-12-11 |
Family
ID=45046257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98145383A TWI418871B (en) | 2009-12-28 | 2009-12-28 | Lens module and fabrication method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI418871B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI486623B (en) * | 2012-10-05 | 2015-06-01 | Himax Tech Ltd | Wafer level lens, lens sheet and manufacturing method thereof |
| TWI696858B (en) * | 2019-05-10 | 2020-06-21 | 新鉅科技股份有限公司 | Lens with shielding structure and lens module |
| TWI818830B (en) * | 2022-12-14 | 2023-10-11 | 新鉅科技股份有限公司 | Lens with light-shading structure and lens module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200739167A (en) * | 2006-04-14 | 2007-10-16 | Altus Technology Inc | A lens module |
| US20080316623A1 (en) * | 2007-06-20 | 2008-12-25 | Hitachi Maxell, Ltd. | Lens module, camera module, and method of manufacturing camera module |
-
2009
- 2009-12-28 TW TW98145383A patent/TWI418871B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200739167A (en) * | 2006-04-14 | 2007-10-16 | Altus Technology Inc | A lens module |
| US20080316623A1 (en) * | 2007-06-20 | 2008-12-25 | Hitachi Maxell, Ltd. | Lens module, camera module, and method of manufacturing camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201122612A (en) | 2011-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6876812B2 (en) | Lens group, camera module and its manufacturing method | |
| CN100466269C (en) | image capture device | |
| US8361830B2 (en) | Image sensor module and method of manufacturing the same | |
| TWI402979B (en) | Electronic component wafer module, electronic component module, sensor wafer module, sensor module, lens array disk, sensor module manufacturing method, and electronic information device | |
| CN100581216C (en) | Ultra-small camera module and manufacturing method thereof | |
| CN102738189A (en) | Solid-state imaging apparatus, method for manufacturing same, and electronic system | |
| TW202010140A (en) | Optical sensor, optical sensing system and method for manufacturing the same | |
| JP2011138089A (en) | Wafer-level lens array, lens module and imaging unit | |
| US20110292271A1 (en) | Camera module and fabrication method thereof | |
| KR20090060758A (en) | Wafer scale lens assembly manufacturing method and wafer scale lens assembly manufactured thereby | |
| CN101518050A (en) | Solid-state image pickup device and method for manufacturing the same | |
| CN111163254A (en) | Image sensing module | |
| CN109690564A (en) | Optical lens and preparation method thereof, fingerprint recognition mould group, mobile terminal | |
| TWI393932B (en) | Image capture lens | |
| TWI418871B (en) | Lens module and fabrication method thereof | |
| CN113824865A (en) | Camera assembly and electronic equipment | |
| TWI714498B (en) | Image-capturing assembly and manufacturing method thereof | |
| CN102045494A (en) | Camera module and making method thereof | |
| CN216625827U (en) | Camera Components and Electronics | |
| TWI444666B (en) | Wafer level lens module, wafer level multi-lenses light-sensitive module and manufacturing method thereof | |
| CN201107808Y (en) | Light-sensing device with light-gathering structure | |
| CN101738696A (en) | Wafer level camera module and manufacturing method thereof | |
| WO2009137022A1 (en) | Camera system including radiation shield and method of shielding radiation | |
| TWI421612B (en) | Optical zoom system | |
| CN102854549B (en) | Wafer-level lens module, wafer-level multi-lens photosensitive module and manufacturing method thereof |