TWI418418B - Elements washing machine - Google Patents
Elements washing machine Download PDFInfo
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- TWI418418B TWI418418B TW100105446A TW100105446A TWI418418B TW I418418 B TWI418418 B TW I418418B TW 100105446 A TW100105446 A TW 100105446A TW 100105446 A TW100105446 A TW 100105446A TW I418418 B TWI418418 B TW I418418B
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- 238000005406 washing Methods 0.000 title 1
- 238000004140 cleaning Methods 0.000 claims description 129
- 239000012530 fluid Substances 0.000 claims description 46
- 238000001694 spray drying Methods 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 62
- 238000001035 drying Methods 0.000 description 11
- 239000012535 impurity Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000010981 drying operation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
本發明係提供一種可全面性導引元件旋轉甩出之清洗流體依導引氣流流動路徑排出，而使元件迅速乾燥，以提升乾燥效能及縮短作業時間之元件清洗機。The invention provides a component cleaning machine which can fully discharge the cleaning fluid of the guiding element and discharge it according to the guiding airflow flow path, and quickly dry the component to improve the drying performance and shorten the working time.
在現今，半導體晶圓、鏡片、玻璃、印刷電路板、面板或醫療儀器等元件，於製作過程或使用一段時間後，元件之表面均會附著有雜質、污垢等，而影響元件之潔淨度及品質，為避免影響元件之製作良率及品質，業者係以清洗機清洗附著於元件表面之雜質等，以晶圓為例，係必須歷經多道製程，導致晶圓之表面會附著雜質、微粒或化合物等，因此，晶圓於不同製程之前後，必須執行清洗表面作業，例如晶圓在進入熱爐管(furnace)以進行擴散或氧化製程前、進行薄膜沈積前或蝕刻程序後，均需以晶圓清洗機清洗晶圓，以去除晶圓表面之雜質、微粒或化合物等，再將晶圓除濕乾燥，使得晶圓之表面具有高潔淨度，以提升晶圓製作品質。In today's semiconductor wafers, lenses, glass, printed circuit boards, panels or medical instruments, after the manufacturing process or after a period of use, the surface of the components will be attached with impurities, dirt, etc., which will affect the cleanliness of the components. In order to avoid affecting the production yield and quality of components, the manufacturer cleans the impurities attached to the surface of the device with a cleaning machine. For example, in the case of wafers, it is necessary to go through multiple processes, resulting in adhesion of impurities and particles to the surface of the wafer. Or compounds, etc., therefore, the wafer must be cleaned before the different processes, such as before the wafer enters the hot furnace for diffusion or oxidation process, before film deposition or after the etching process. The wafer is cleaned by a wafer cleaning machine to remove impurities, particles or compounds on the surface of the wafer, and the wafer is dehumidified and dried to make the surface of the wafer highly clean to improve wafer fabrication quality.
請參閱第1圖，係為一種晶圓清洗機，其係於機台11上設有一上方具開口121之清洗槽12，該清洗槽12之底面一側係設有排放管13，用以排出清洗流體，一裝配於機台11上之承載裝置14，係設有一凸伸於清洗槽12內之轉軸141，並於轉軸141上裝配有可承載待清洗晶圓之旋轉台142，一位於清洗槽12上方之噴管15，係用以噴灑清洗流體(如離子水或氣體等)，另於清洗槽12之外部設有一連通排放管13之抽風裝置16；於執行清洗晶圓17作業時，可將待清洗之晶圓17置放於旋轉台142上，該旋轉台142即真空吸附待清洗之晶圓17定位，接著承載裝置14之轉軸141係帶動旋轉台142及待清洗之晶圓17旋轉作動，而噴管15則將清洗流體噴灑於待清洗之晶圓17上，進而清洗附著於晶圓17表面之雜質、微粒或化合物等，並利用旋轉台142旋轉之離心力將晶圓17表面之清洗流體向外甩出，此時，抽風裝置16可利用排放管13而抽取清洗槽12內部之空氣，以使晶圓17旋轉甩出之清洗流體可流入於排放管13排出，於清洗完畢後，該噴管15係停止噴灑清洗流體而改以噴灑氣體，由於旋轉台142仍帶動晶圓17旋轉，而可持續利用旋轉台142旋轉之離心力將晶圓17表面乾燥，達到清洗及乾燥晶圓17之目的；惟，該排放管13係位於清洗槽12之一側，導致抽風裝置16僅可於清洗槽12一側近排放管13之區域產生較大之吸力，而使晶圓17旋轉甩出到近排放管13區域的清洗流體迅速流入於排放管13，但清洗槽12另一側之區域則會因吸力變小，以致晶圓17旋轉甩出至該區域的清洗流體會撞擊到清洗槽12之內壁面，而此一撞擊，又會噴濺回晶圓17之表面，致使晶圓17無法迅速旋乾表面，不僅乾燥效率不佳，亦增加乾燥作業時間，造成降低生產效能之缺失。Referring to FIG. 1 , a wafer cleaning machine is provided on the machine table 11 with a cleaning tank 12 having an opening 121 on the bottom surface thereof. The bottom side of the cleaning tank 12 is provided with a discharge pipe 13 for discharging. The cleaning device, a bearing device 14 mounted on the machine table 11, is provided with a rotating shaft 141 protruding from the cleaning tank 12, and a rotating table 142 for carrying the wafer to be cleaned is mounted on the rotating shaft 141, and the cleaning unit is mounted on the rotating shaft 141. The nozzle 15 above the tank 12 is used for spraying a cleaning fluid (such as ionized water or gas), and outside the cleaning tank 12 is provided a suction device 16 that communicates with the discharge pipe 13; The wafer 17 to be cleaned can be placed on the rotating table 142, that is, the vacuum adsorbing the wafer 17 to be cleaned, and then the rotating shaft 141 of the carrying device 14 drives the rotating table 142 and the wafer to be cleaned. 17 is rotated, and the nozzle 15 sprays the cleaning fluid onto the wafer 17 to be cleaned, thereby cleaning impurities, particles or compounds attached to the surface of the wafer 17, and using the centrifugal force of the rotating table 142 to rotate the wafer 17 The cleaning fluid on the surface is thrown outwards. At this time, the exhaust is installed. 16 The exhaust pipe 13 can be used to extract the air inside the cleaning tank 12, so that the cleaning fluid that is rotated out of the wafer 17 can flow into the discharge pipe 13, and after the cleaning is completed, the nozzle 15 stops spraying the cleaning fluid. By spraying the gas, since the rotating table 142 still drives the wafer 17 to rotate, the surface of the wafer 17 can be dried by the centrifugal force of the rotation of the rotating table 142 to clean and dry the wafer 17; however, the discharge tube 13 is located One side of the cleaning tank 12 causes the air extracting device 16 to generate a large suction force only in the region near the discharge pipe 13 on the side of the cleaning tank 12, and the cleaning fluid which is rotated to the vicinity of the discharge pipe 13 in the wafer 17 is rapidly flowed into the area. The discharge pipe 13 is exhausted, but the area on the other side of the cleaning tank 12 is reduced due to the suction force, so that the cleaning fluid that the wafer 17 rotates to the area will hit the inner wall surface of the cleaning tank 12, and this impact will occur again. The surface of the wafer 17 is splashed back, so that the wafer 17 cannot be quickly dried on the surface, which not only has poor drying efficiency, but also increases drying operation time, resulting in a lack of production efficiency.
故，如何設計一種可使元件迅速乾燥，而提升乾燥效能及縮短作業時間之元件清洗機，即為業者研發之標的。Therefore, how to design a component cleaning machine that can quickly dry components and improve drying performance and shorten the working time is the standard developed by the industry.
本發明之目的一，係提供一種元件清洗機，包含有具排放口之清洗槽、具轉軸及旋轉台之承載裝置，以及可噴灑清洗流體之噴灑吹乾裝置，其中，於清洗槽之內部係裝配有導流盤，該導流盤於近轉軸之中間位置係開設有匯流孔，並與旋轉台之外側緣間形成有第一導流通道，另於匯流孔與清洗槽之排放口間設有第二導流通道，並裝設有連通於該第二導流通道之抽風裝置；藉此，於抽風裝置作動時，可利用第一導流通道導引旋轉台四周之空氣向中間位置之匯流孔流動，而於旋轉台之四周產生一全罩式導引氣流，以全面性導引旋轉甩出之清洗流體依導引氣流流動路徑而流入於第二導流通道，再由清洗槽之排放口排出，進而使元件迅速乾燥，達到提升乾燥效能之實用效益。A first object of the present invention is to provide a component cleaning machine comprising a cleaning tank having a discharge port, a carrying device having a rotating shaft and a rotating table, and a spray drying device capable of spraying a cleaning fluid, wherein the inside of the cleaning tank is The guide plate is equipped with a flow hole in a middle position of the near rotating shaft, and a first flow guiding channel is formed between the outer edge of the rotating table and the discharge port of the collecting hole and the cleaning tank. The second flow guiding channel is provided with an air blowing device connected to the second air guiding channel; thereby, when the air blowing device is actuated, the first air guiding channel can be used to guide the air around the rotating table to the intermediate position The collecting hole flows, and a full-cover guiding airflow is generated around the rotating table, so as to comprehensively guide the rotating cleaning fluid to flow into the second guiding channel according to the guiding airflow flow path, and then the cleaning tank The discharge port is discharged, so that the components are quickly dried to achieve the practical benefit of improving the drying efficiency.
本發明之目的二，係提供一種元件清洗機，其設有連通於第二導流通道之抽風裝置，當抽風裝置作動時，可利用第一導流通道導引旋轉台四周之空氣向中間位置之匯流孔流動，而於旋轉台之四周產生全罩式的導引氣流，以全面性導引旋轉甩出之清洗流體依導引氣流流動路徑而流入於第二導流通道，再由清洗槽之排放口排出，進而使元件迅速乾燥，以有效縮短乾燥作業時間，達到提升清洗產能之實用效益。A second object of the present invention is to provide a component cleaning machine that is provided with a drafting device that communicates with a second flow guiding channel. When the air extracting device is actuated, the first guiding channel can be used to guide the air around the rotating table to an intermediate position. The manifold hole flows, and a full-cover type guiding airflow is generated around the rotating table, so as to comprehensively guide the rotating cleaning fluid to flow into the second guiding channel according to the guiding airflow flow path, and then the cleaning tank The discharge port is discharged, so that the components are quickly dried, so as to effectively shorten the drying operation time and achieve the practical benefit of improving the cleaning capacity.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如后：請參閱第2、3圖，該元件清洗機係於機台20上配置有清洗槽30、承載裝置40、噴灑吹乾裝置50、導流盤60及抽風裝置，該清洗槽30係為一內部具容置空間之容器，於本實施例中，該清洗槽30之頂面係設有一具通風口311之上蓋31，以供外部空氣由通風口311流入於清洗槽30內，又清洗槽30可於側面或底面開設有用以排放清洗流體之排放口32，於本實施例中，係於清洗槽30之側面近底部開設有排放口32，用以排出清洗流體，該承載裝置40係於機台20上設有驅動源，用以驅動一轉軸轉動，於本實施例中，該驅動源係為馬達41，馬達41則驅動一為皮帶輪組42之傳動組，使皮帶輪組42帶動轉軸43旋轉，該轉軸43之頂端則凸伸於清洗槽30內，以供裝配一可承置待清洗元件(如晶圓)之旋轉台44，於本實施例中，該旋轉台44可真空吸附待清洗之元件定位，並於頂面之周側設有複數個定位件，用以定位待清洗之元件，於本實施例中，該旋轉台44之周圍係設有複數個為扣具441之定位件，用以扣掣待清洗之元件定位，該噴灑吹乾裝置50係設有一可噴灑清洗流體之噴管51，用以清洗及吹乾元件，一裝配於清洗槽30內部之導流盤60，該導流盤60於近轉軸43之中間位置係開設有匯流孔61，並與旋轉台44之外側緣間形成有第一導流通道62，另於匯流孔61與清洗槽30之排放口32間設有第二導流通道，該第二導流通道係可為於導流盤60本體下方直接成型有通道件，或於導流盤60之下方裝配一為排水盤63之通道件，於本實施例中，係於導流盤60下方裝配一排水盤63，該排水盤63係固設於清洗槽30內，而使得排水盤63與匯流孔61間形成第二導流通道64，該抽風裝置係可為風扇71，風扇71係設有套接部711，用以套置連結於承載裝置40之轉軸43上，並位於第二導流通道64內，使得風扇71可由轉軸43驅動而與旋轉台44同步旋轉。In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing are described in detail as follows: Please refer to Figures 2 and 3, the component cleaning machine is disposed on the machine table 20 The cleaning tank 30, the carrying device 40, the spray drying device 50, the deflector 60 and the air extracting device, the cleaning tank 30 is a container having an internal accommodating space. In this embodiment, the top surface of the cleaning tank 30 The upper cover 311 of the vent 311 is provided for the outside air to flow into the cleaning tank 30 through the vent 311, and the cleaning tank 30 can be provided with a discharge port 32 for discharging the cleaning fluid on the side or the bottom surface, in this embodiment. A discharge port 32 is disposed on the side of the side of the cleaning tank 30 for discharging the cleaning fluid. The carrier 40 is provided with a driving source on the machine table 20 for driving a rotating shaft. In this embodiment, The driving source is a motor 41, and the motor 41 drives a transmission group of the pulley set 42, so that the pulley set 42 drives the rotating shaft 43 to rotate, and the top end of the rotating shaft 43 protrudes into the cleaning tank 30 for assembly. Rotating table 44 for holding components (such as wafers) to be cleaned In this embodiment, the rotating table 44 can vacuum-adsorb the components to be cleaned, and a plurality of positioning members are disposed on the circumferential side of the top surface for positioning the components to be cleaned. In this embodiment, the rotating table There are a plurality of positioning members for the fasteners 441 around the 44 for fastening the components to be cleaned. The spray drying device 50 is provided with a nozzle 51 for spraying the cleaning fluid for cleaning and drying. The guide plate 60 is mounted on the inside of the cleaning tank 30. The guide plate 60 is provided with a flow hole 61 at a middle position of the near rotating shaft 43 and a first flow guiding channel is formed between the outer edge of the rotating table 44 and the outer side of the rotating table 44. 62, a second guiding channel is further disposed between the collecting hole 61 and the discharging port 32 of the cleaning tank 30, and the second guiding channel can directly form a channel member under the body of the guiding plate 60, or can be diverted A channel member for the drain pan 63 is disposed under the disk 60. In the present embodiment, a drain pan 63 is mounted under the baffle plate 60. The drain pan 63 is fixed in the cleaning tank 30 to make the drain pan A second flow guiding channel 64 is formed between the 63 and the manifold 61, and the air blowing device can be a fan 71. Fan system 71 is provided with a socket portion 711 for coupling to the sleeved spindle 40 of the carrier device 43, and located in the second flow passage 64, so that the fan 71 may be driven by the rotary shaft 43 rotate in synchronization with the rotary table 44.
請參閱第4圖，該元件清洗機可應用於清洗半導體晶圓、鏡片、玻璃、印刷電路板、面板或醫療儀器等元件，於本實施例中，該清洗機係應用於清洗晶圓80，於執行清洗作業時，係可將待清洗之晶圓80置放於旋轉台44上，並以旋轉台44之複數個扣具441將待清洗之晶圓80扣掣定位；請參閱第5圖，該承載裝置40之馬達41係利用皮帶輪組42驅動轉軸43轉動，該轉軸43則帶動旋轉台44、風扇71及待清洗之晶圓80同步旋轉，風扇71即利用清洗槽30之通風口311抽取外部空氣，由於導流盤60係於底面近轉軸43之中間位置開設有匯流孔61，而可使自通風口311流入至旋轉台44四周之空氣沿第一導流通道62匯流至中間位置之匯流孔61，以於旋轉台44之四周產生一全罩式向下吸入流動之導引氣流；請參閱第6圖，當旋轉台44帶動待清洗之晶圓80旋轉時，該噴灑吹乾裝置50之噴管51可對旋轉中之待清洗晶圓80噴灑清洗流體(如清洗用之離子水)，以清洗附著於晶圓80表面上之雜質、微粒或化合物等，並使晶圓80利用旋轉之離心力將雜質等由清洗流體噴流向外甩出，此時，可利用風扇71於旋轉台44四周形成全罩式向下吸入流動之導引氣流，以全面性導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，又部份被甩出之清洗流體穿過導引氣流而撞擊至導流盤60之內壁面時，由於導引氣流位於晶圓80與導流盤60之間，此時，亦可利用導引氣流直接導引反彈噴濺之清洗流體向下流動，並不會使撞擊導流盤60之清洗流體噴濺回晶圓80上，使得清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，第二導流通道64內之清洗流體則可由清洗槽30之排放口32排出；請參閱第7圖，於清洗晶圓80完畢後，可控制噴灑吹乾裝置50之噴管51停止噴灑清洗流體，而改以噴灑另一種清洗流體(如乾燥用之氣體)，由於承載裝置40之轉軸43仍帶動旋轉台44及風扇71同步轉動，旋轉台44可帶動晶圓80旋轉，並利用離心力將表面之清洗流體向外甩出，此時，相同的可利用風扇71於旋轉台44四周形成全罩式向下吸入流動之導引氣流，導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，第二導流通道64內之清洗流體則可由清洗槽30之排放口32排出，進而使晶圓80迅速將清洗流體甩乾，以縮短乾燥作業時間，達到提升乾燥效能之實用效益。Referring to FIG. 4, the component cleaning machine can be applied to cleaning semiconductor wafers, lenses, glass, printed circuit boards, panels, or medical instruments. In the present embodiment, the cleaning machine is applied to cleaning wafers 80. When the cleaning operation is performed, the wafer 80 to be cleaned can be placed on the rotating table 44, and the wafers 80 to be cleaned are positioned by the plurality of fasteners 441 of the rotating table 44; see Figure 5 The motor 41 of the carrying device 40 drives the rotating shaft 43 to rotate by the pulley set 42. The rotating shaft 43 drives the rotating table 44, the fan 71 and the wafer 80 to be cleaned to rotate synchronously, and the fan 71 utilizes the vent 311 of the cleaning tank 30. The outer air is extracted, and the air guiding hole 60 is opened at the middle of the bottom surface near the rotating shaft 43 to open the air, and the air flowing from the air vent 311 to the periphery of the rotating table 44 can be merged to the intermediate position along the first guiding channel 62. The manifold 61 is configured to generate a full-cover down-flowing guide airflow around the rotary table 44. Referring to FIG. 6, when the rotary table 44 drives the wafer 80 to be cleaned to rotate, the spray is blown dry. The nozzle 51 of the device 50 can be rotated The cleaning wafer 80 is sprayed with a cleaning fluid (such as ion water for cleaning) to clean impurities, particles or compounds adhering to the surface of the wafer 80, and the wafer 80 is sprayed by the cleaning fluid by centrifugal force of rotation. The fan 71 is used to guide the airflow around the rotating table 44 to form a full-cover down-flowing guide airflow to guide the cleaning flow of the wafer 80. When the first guiding channel 62 and the collecting hole 61 flow into the second guiding channel 64, and the cleaning fluid that is sucked out passes through the guiding airflow and impinges on the inner wall surface of the guiding plate 60, The bleed air is located between the wafer 80 and the deflector 60. At this time, the guide gas flow can also directly guide the bounce spray cleaning fluid to flow downward, and the cleaning fluid of the impinging deflector 60 is not splashed. Returning to the wafer 80, the cleaning fluid flows into the second guiding channel 64 by the first guiding channel 62 and the collecting hole 61 according to the guiding airflow flow path, and the cleaning fluid in the second guiding channel 64 can be cleaned. The discharge port 32 of the tank 30 is discharged; please refer to Fig. 7, Yu Qing After the wafer 80 is washed, the nozzle 51 of the spray drying device 50 can be controlled to stop spraying the cleaning fluid, and the other cleaning fluid (such as the drying gas) can be sprayed, because the rotating shaft 43 of the carrying device 40 still drives the rotating table. 44 and the fan 71 rotate synchronously, the rotary table 44 can drive the wafer 80 to rotate, and centrifugally force the cleaning fluid of the surface to the outside. At this time, the same available fan 71 forms a full cover down the rotary table 44. The flow guiding airflow is sucked, and the cleaning fluid that guides the wafer 80 to rotate out is guided by the guiding airflow flow path, and flows from the first guiding channel 62 and the collecting hole 61 to the second guiding channel 64, and the second guiding flow The cleaning fluid in the channel 64 can be discharged from the discharge port 32 of the cleaning tank 30, so that the wafer 80 can quickly dry the cleaning fluid to shorten the drying operation time and achieve the practical benefit of improving the drying efficiency.
請參閱第8圖，係本發明元件清洗機之另一實施例，係於機台20上配置有清洗槽30、承載裝置40、噴灑吹乾裝置50、導流盤60及抽風裝置，該清洗槽30之頂面係設有一具通風口311之上蓋31，以供外部空氣由通風口311流入，清洗槽30之側面近底部開設有排放口32，用以排出清洗流體，該承載裝置40係於機台20上設有馬達41，馬達41經皮帶輪組42帶動轉軸43旋轉，轉軸43之頂端則凸伸於清洗槽30內，以供裝配一可承置待清洗元件之旋轉台44，該旋轉台44之周圍係設有複數個扣具441，用以扣掣待清洗之元件定位，該噴灑吹乾裝置50係設有一可噴灑清洗流體之噴管51，用以清洗元件，一裝配於清洗槽30內部之導流盤60，該導流盤60於近轉軸43之中間位置係開設有匯流孔61，並與旋轉台44之外側緣間形成有第一導流通道62，又該導流盤60之下方係裝配有排水盤63，該排水盤63係固設於清洗槽30內，而使得排水盤63與匯流孔61間形成第二導流通道64，另該抽風裝置係為抽風機72，抽風機72可裝配於清洗槽30之內部或外部，並連通第二導流通道64，於本實施例中，該抽風機72係裝配於清洗槽30之排放口32外部，並連通導流盤60之第二導流通道64。Referring to FIG. 8 , another embodiment of the component cleaning machine of the present invention is disposed on the machine table 20 with a cleaning tank 30 , a carrying device 40 , a spray drying device 50 , a deflector 60 and a drafting device. The top surface of the trough 30 is provided with a vent 311 upper cover 31 for external air to flow in through the vent 311. The side of the cleaning tank 30 is provided with a discharge port 32 near the bottom for discharging the cleaning fluid. The carrying device 40 is attached. A motor 41 is disposed on the machine 20, and the motor 41 rotates the rotating shaft 43 via the pulley set 42. The top end of the rotating shaft 43 protrudes into the cleaning tank 30 for assembling a rotating table 44 capable of receiving the component to be cleaned. A plurality of fasteners 441 are disposed around the rotary table 44 for fastening the components to be cleaned. The spray drying device 50 is provided with a spray nozzle 51 for spraying the cleaning fluid for cleaning the components. The flow guiding plate 60 is fixed in the middle of the rotating shaft 30. The guiding plate 60 is provided with a collecting hole 61 at a middle position of the rotating shaft 43 and a first guiding channel 62 is formed between the outer edge of the rotating table 44. A drain pan 63 is attached to the lower portion of the flow plate 60, and the drain pan 63 is fixed. In the cleaning tank 30, a second flow guiding passage 64 is formed between the draining disc 63 and the collecting hole 61. The air extracting device is an exhausting device 72, and the exhausting fan 72 can be installed inside or outside the cleaning tank 30, and communicates with the first In the present embodiment, the exhaust fan 72 is mounted outside the discharge port 32 of the cleaning tank 30 and communicates with the second flow guiding passage 64 of the deflector 60.
請參閱第9圖，於執行清洗晶圓作業時，係可將待清洗之晶圓80置放於旋轉台44上，並以旋轉台44之複數個扣具441將待清洗之晶圓80扣掣定位，該承載裝置40之馬達41即利用皮帶輪組42驅動轉軸43轉動，使轉軸43帶動旋轉台44及待清洗之晶圓80同步旋轉，此時，抽風機72可經由第一、二通道62、64及匯流孔61而由通風口311處抽取外部空氣，並使流入至旋轉台44四周之空氣沿第一導流通道62匯流至中間位置之匯流孔61，以於旋轉台44之四周產生一全罩式向下吸入流動之導引氣流；請參閱第10圖，當旋轉台44帶動待清洗之晶圓80旋轉時，該噴灑吹乾裝置50之噴管51係可對旋轉中之待清洗晶圓80噴灑清洗流體(如清洗用之離子水)，以清洗附著於晶圓80表面上之雜質、微粒或化合物等，並使晶圓80利用旋轉之離心力將雜質等由清洗流體噴流向外甩出，此時，可利用抽風機72於旋轉台44四周形成全罩式向下吸入流動之導引氣流，以全面性導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，又部份被甩出之清洗流體穿過導引氣流而撞擊至導流盤60之內壁面時，由於導引氣流位於晶圓80與導流盤60之間，此時，亦可利用導引氣流直接導引反彈噴濺之清洗流體向下流動，並不會使撞擊導流盤60之清洗流體噴濺回晶圓80上，使得清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，再由清洗槽30之排放口32排出；請參閱第11圖，於清洗晶圓80完畢後，可控制噴灑吹乾裝置50之噴管51停止噴灑清洗流體，而改以噴灑另一種清洗流體(如乾燥用之氣體)，由於承載裝置40之轉軸43仍帶動旋轉台44及晶圓80同步旋轉，並利用離心力將表面之清洗流體向外甩出，此時，相同的可利用抽風機72於旋轉台44四周形成全罩式向下吸入流動之導引氣流，導引晶圓80旋轉甩出之清洗流體依導引氣流流動路徑，而由第一導流通道62及匯流孔61流入至第二導流通道64，再由清洗槽30之排放口32排出，進而使晶圓80迅速將清洗流體甩乾，以縮短乾燥作業時間，達到提升乾燥效能之實用效益。Referring to FIG. 9, when the wafer cleaning operation is performed, the wafer 80 to be cleaned can be placed on the rotating table 44, and the wafer 80 to be cleaned is buckled by a plurality of fasteners 441 of the rotating table 44.掣 positioning, the motor 41 of the carrying device 40 drives the rotating shaft 43 to rotate by the pulley set 42, so that the rotating shaft 43 drives the rotating table 44 and the wafer 80 to be cleaned to rotate synchronously. At this time, the extracting fan 72 can pass through the first and second channels. 62, 64 and the bus hole 61, the outside air is extracted from the vent 311, and the air flowing into the periphery of the rotating table 44 is merged along the first guiding channel 62 to the confluence hole 61 at the intermediate position so as to surround the rotating table 44. A full-cover type downwardly inhaling flow guiding airflow is generated; referring to FIG. 10, when the rotating table 44 drives the wafer 80 to be cleaned to rotate, the nozzle 51 of the spray drying device 50 can be rotated. The cleaning wafer 80 is sprayed with a cleaning fluid (such as ion water for cleaning) to clean impurities, particles or compounds adhering to the surface of the wafer 80, and the wafer 80 is sprayed by the cleaning fluid by centrifugal force of rotation. Pull out outwards, at this time, you can use the exhaust fan 72 to spin A guide airflow of a full-cover type downward suction flow is formed around the stage 44 to comprehensively guide the cleaning fluid that is rotated by the wafer 80 to guide the airflow flow path, and is flown by the first flow guiding channel 62 and the manifold hole 61. When the cleaning fluid that has been scooped out passes through the guiding airflow and impinges on the inner wall surface of the deflector 60, the guiding airflow is located between the wafer 80 and the deflector 60, At this time, the guiding fluid flow can also directly guide the bounce spray cleaning fluid to flow downward, and the cleaning fluid of the impinging deflector 60 is not splashed back onto the wafer 80, so that the cleaning fluid flows according to the guiding airflow. The path flows from the first flow guiding channel 62 and the collecting hole 61 to the second guiding channel 64, and is discharged by the discharging port 32 of the cleaning tank 30; referring to FIG. 11, after the wafer 80 is cleaned, it can be controlled. The nozzle 51 of the spray drying device 50 stops spraying the cleaning fluid, and instead sprays another cleaning fluid (such as a gas for drying), because the rotating shaft 43 of the carrying device 40 still drives the rotating table 44 and the wafer 80 to rotate synchronously, and Using centrifugal force to pull out the cleaning fluid on the surface, at this time, The same exhaust fan 72 can be used to form a full-cover down-flowing guide airflow around the rotary table 44, and the cleaning fluid that guides the wafer 80 to rotate out is guided by the flow path of the airflow, and the first flow guiding channel is used. 62 and the flow hole 61 flow into the second flow guiding channel 64, and then discharged from the discharge port 32 of the cleaning tank 30, so that the wafer 80 quickly dries the cleaning fluid to shorten the drying operation time and achieve the practical benefit of improving the drying efficiency. .
據此，本發明可有效導引元件於旋轉清洗乾燥中甩出之清洗流體向下流動排出，使元件迅速清洗乾燥，而提升乾燥效能及縮短作業時間，實為一深具實用性及進步性之設計，然未見有相同之產品及刊物公開，從而允符發明專利申請要件，爰依法提出申請。Accordingly, the present invention can effectively guide the cleaning fluid discharged from the rotating cleaning and drying device to flow downward, so that the components can be quickly cleaned and dried, thereby improving the drying efficiency and shortening the working time, which is practical and progressive. The design, but did not see the same product and publications open, thus allowing the invention patent application requirements, 提出 apply in accordance with the law.
11．．．機台11. . . Machine
12．．．清洗槽12. . . Cleaning tank
121．．．開口121. . . Opening
13．．．排放管13. . . Drain pipe
14．．．承載裝置14. . . Carrying device
141．．．轉軸141. . . Rotating shaft
142．．．旋轉台142. . . Rotary table
15．．．噴管15. . . Nozzle
16．．．抽風裝置16. . . Exhaust device
17．．．晶圓17. . . Wafer
20．．．機台20. . . Machine
30．．．清洗槽30. . . Cleaning tank
31．．．上蓋31. . . Upper cover
311．．．通風口311. . . Vent
32．．．排放口32. . . exhaustion hole
40．．．承載裝置40. . . Carrying device
41．．．馬達41. . . motor
42．．．皮帶輪組42. . . Pulley set
43．．．轉軸43. . . Rotating shaft
44．．．旋轉台44. . . Rotary table
441．．．扣具441. . . Buckle
50．．．噴灑吹乾裝置50. . . Spray drying device
51．．．噴管51. . . Nozzle
60．．．導流盤60. . . Guide disc
61．．．匯流孔61. . . Confluence hole
62．．．第一導流通道62. . . First flow channel
63．．．排水盤63. . . Drainage tray
64．．．第二導流通道64. . . Second flow channel
71．．．風扇71. . . fan
711．．．套接部711. . . Socket
72．．．抽風機72. . . Exhaust fan
80．．．晶圓80. . . Wafer
第1圖：習式晶圓清洗機之示意圖。Figure 1: Schematic diagram of a conventional wafer washer.
第2圖：本發明元件清洗機之示意圖。Figure 2: Schematic diagram of the component cleaning machine of the present invention.
第3圖：本發明元件清洗機之局部零件分解圖。Figure 3 is an exploded view of a partial part of the component cleaning machine of the present invention.
第4圖：本發明之使用示意圖(一)。Figure 4: Schematic diagram of the use of the present invention (I).
第5圖：本發明之使用示意圖(二)。Figure 5: Schematic diagram of the use of the invention (2).
第6圖：本發明之使用示意圖(三)。Figure 6: Schematic diagram of the use of the invention (3).
第7圖：本發明之使用示意圖(四)。Figure 7: Schematic diagram of the use of the invention (4).
第8圖：本發明另一實施例之示意圖。Figure 8 is a schematic view of another embodiment of the present invention.
第9圖：本發明另一實施例之使用示意圖(一)。Figure 9 is a schematic view (1) of use of another embodiment of the present invention.
第10圖：本發明另一實施例之使用示意圖(二)。Fig. 10 is a schematic view showing the use of another embodiment of the present invention (2).
第11圖：本發明另一實施例之使用示意圖(三)。Figure 11 is a schematic view showing the use of another embodiment of the present invention (3).
20．．．機台20. . . Machine
30．．．清洗槽30. . . Cleaning tank
31．．．上蓋31. . . Upper cover
311．．．通風口311. . . Vent
32．．．排放口32. . . exhaustion hole
40．．．承載裝置40. . . Carrying device
41．．．馬達41. . . motor
42．．．皮帶輪組42. . . Pulley set
43．．．轉軸43. . . Rotating shaft
44．．．旋轉台44. . . Rotary table
441．．．扣具441. . . Buckle
50．．．噴灑吹乾裝置50. . . Spray drying device
51．．．噴管51. . . Nozzle
60．．．導流盤60. . . Guide disc
61．．．匯流孔61. . . Confluence hole
62．．．第一導流通道62. . . First flow channel
63．．．排水盤63. . . Drainage tray
64．．．第二導流通道64. . . Second flow channel
71．．．風扇71. . . fan
711．．．套接部711. . . Socket
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100105446A TWI418418B (en) | 2011-02-18 | 2011-02-18 | Elements washing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100105446A TWI418418B (en) | 2011-02-18 | 2011-02-18 | Elements washing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201235121A TW201235121A (en) | 2012-09-01 |
| TWI418418B true TWI418418B (en) | 2013-12-11 |
Family
ID=47222526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100105446A TWI418418B (en) | 2011-02-18 | 2011-02-18 | Elements washing machine |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI418418B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103357636A (en) * | 2013-07-29 | 2013-10-23 | 浙江省机电设计研究院有限公司 | Plane flow distribution cleaning structure of flow distribution type multi-medium cleaning machine |
| CN115424972B (en) * | 2022-11-03 | 2023-07-11 | 苏州智程半导体科技股份有限公司 | An etching device for temperature compensation on the back of the wafer |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762709A (en) * | 1995-07-27 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin coating apparatus |
| JPH1154470A (en) * | 1997-07-31 | 1999-02-26 | Shibaura Eng Works Co Ltd | Spin processing device |
| TW518648B (en) * | 2000-12-27 | 2003-01-21 | Shibaura Mechatronics Corp | Rotary processing device |
| CN101090063A (en) * | 2006-06-16 | 2007-12-19 | 东京毅力科创株式会社 | Liquid processing apparatus |
| TW200922699A (en) * | 2007-10-11 | 2009-06-01 | Semes Co Ltd | Brush assembly and apparatus for cleaning a substrate having the same |
| TW200922701A (en) * | 2007-10-17 | 2009-06-01 | Ebara Corp | Substrate cleaning apparatus |
| US20090285984A1 (en) * | 2008-05-13 | 2009-11-19 | Tokyo Electron Limited | Coating apparatus and method |
| CN101615567A (en) * | 2008-06-27 | 2009-12-30 | 大日本网屏制造株式会社 | Substrate processing equipment |
| KR20100059457A (en) * | 2008-11-26 | 2010-06-04 | 세메스 주식회사 | Single Sheet Substrate Processing Equipment |
-
2011
- 2011-02-18 TW TW100105446A patent/TWI418418B/en not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762709A (en) * | 1995-07-27 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin coating apparatus |
| JPH1154470A (en) * | 1997-07-31 | 1999-02-26 | Shibaura Eng Works Co Ltd | Spin processing device |
| TW518648B (en) * | 2000-12-27 | 2003-01-21 | Shibaura Mechatronics Corp | Rotary processing device |
| CN101090063A (en) * | 2006-06-16 | 2007-12-19 | 东京毅力科创株式会社 | Liquid processing apparatus |
| TW200922699A (en) * | 2007-10-11 | 2009-06-01 | Semes Co Ltd | Brush assembly and apparatus for cleaning a substrate having the same |
| TW200922701A (en) * | 2007-10-17 | 2009-06-01 | Ebara Corp | Substrate cleaning apparatus |
| US20090285984A1 (en) * | 2008-05-13 | 2009-11-19 | Tokyo Electron Limited | Coating apparatus and method |
| CN101615567A (en) * | 2008-06-27 | 2009-12-30 | 大日本网屏制造株式会社 | Substrate processing equipment |
| KR20100059457A (en) * | 2008-11-26 | 2010-06-04 | 세메스 주식회사 | Single Sheet Substrate Processing Equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201235121A (en) | 2012-09-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |