TWI417038B - Clip and heat dissipation device having the same - Google Patents
Clip and heat dissipation device having the same Download PDFInfo
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- TWI417038B TWI417038B TW97142128A TW97142128A TWI417038B TW I417038 B TWI417038 B TW I417038B TW 97142128 A TW97142128 A TW 97142128A TW 97142128 A TW97142128 A TW 97142128A TW I417038 B TWI417038 B TW I417038B
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- heat sink
- abutting portion
- portions
- heat
- abutting
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 230000013011 mating Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種扣具及使用該扣具之散熱裝置組合,特別涉及一種可方便拆裝之扣具及使用該扣具之散熱裝置組合。 The present invention relates to a buckle and a heat sink assembly using the same, and more particularly to a buckle that can be easily attached and detached and a heat sink assembly using the same.
如今,於電腦產業中,為將發熱電子元件產生之熱量有效散發,通常採用之方法係將散熱器緊密貼設於發熱電子元件之溢熱表面,以協助發熱電子元件散熱,保證發熱電子元件於適當溫度下運作。 Nowadays, in the computer industry, in order to effectively dissipate the heat generated by the heat-generating electronic components, the method is generally applied to the heat-dissipating surface of the heat-generating electronic component to assist the heat dissipation of the heat-generating electronic components, thereby ensuring the heat-generating electronic components. Operate at the right temperature.
為將散熱器緊密貼設於發熱電子元件之溢熱表面,業界通常採用一扣具將散熱器固定至發熱電子元件所在之電路板上。該扣具常藉由複數個螺絲固定於散熱器上而與散熱器形成一整體。然而,此種扣具藉由鎖螺絲之方式與散熱器結合,其與散熱器固定或拆卸時,需借助外部工具,繁瑣且費時,故,需進一步改進。 In order to closely attach the heat sink to the heat-dissipating surface of the heat-generating electronic component, a fastener is usually used to fix the heat sink to the circuit board on which the heat-generating electronic component is located. The clip is often integrally formed with the heat sink by a plurality of screws fixed to the heat sink. However, such a buckle is combined with a heat sink by means of a locking screw. When it is fixed or detached from the heat sink, an external tool is required, which is cumbersome and time consuming, and further improvement is required.
有鑒於此,有必要提供一種可方便拆裝之扣具及其散熱裝置組合。 In view of this, it is necessary to provide a buckle that can be easily disassembled and a heat sink combination thereof.
一種散熱裝置組合,用以對一發熱電子元件進行散熱,該散熱裝置組合包括一散熱器及二扣具,所述散熱器包括一底座及自該底 座表面延伸之複數個平行且間隔設置之散熱鰭片,所述二扣具可移動地套設於二散熱鰭片上,每一扣具包括一與一相應之散熱鰭片之側面相接觸之抵靠部,與該散熱鰭片二端部配合之二限位部及用以與發熱電子元件所在電路板相配合之二鎖扣部,所述二鎖扣部分別自抵靠部之二端延伸,所述二限位部相互間隔地自所述抵靠部彎曲延伸而出,且所述二限位部位於所述二鎖扣部之間。 A heat sink assembly for dissipating heat from a heat-generating electronic component, the heat sink assembly comprising a heat sink and two buckles, the heat sink including a base and the bottom a plurality of parallel and spaced heat dissipation fins extending from the surface of the seat, the two fasteners being movably sleeved on the two heat dissipation fins, each of the buckles being in contact with a side of the corresponding heat dissipation fin a second limiting portion that cooperates with the two ends of the heat dissipating fin and two locking portions for cooperating with the circuit board where the heat-generating electronic component is located, and the two locking portions respectively extend from the two ends of the abutting portion The two limiting portions are bent and extended from the abutting portion at intervals, and the two limiting portions are located between the two locking portions.
一種用於固定散熱器之扣具,該扣具包括一抵靠部,二限位部及二鎖扣部,所述二鎖扣部分別自抵靠部之二端延伸,所述二限位部相互間隔地自所述抵靠部彎曲延伸而出,且所述二限位部位於所述二鎖扣部之間。 A fastener for fixing a heat sink, the buckle comprising an abutting portion, a second limiting portion and a second locking portion, wherein the two locking portions respectively extend from two ends of the abutting portion, the two limiting positions The portions are bent and extended from the abutting portion at intervals, and the two limiting portions are located between the two locking portions.
與先前技術相比,本發明散熱裝置組合中,所述二扣具僅藉由沿散熱器之散熱鰭片之高度方向上下移動即可實現其與散熱器組裝與拆卸,方便快捷。另外,上述扣具可裝配於散熱器之任何散熱鰭片上,如此,扣具之鎖扣部之間之間距可配合不同規格之電路板而改變,適用性強。 Compared with the prior art, in the heat dissipating device combination of the present invention, the two fasteners can be assembled and disassembled with the heat sink only by moving up and down along the height direction of the heat dissipating fins of the heat sink, which is convenient and quick. In addition, the above-mentioned fasteners can be mounted on any heat-dissipating fins of the heat sink, so that the distance between the latching portions of the buckles can be changed with the circuit boards of different specifications, and the applicability is strong.
下面參照附圖,結合具體實施例對本發明作進一步之描述。 The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.
100‧‧‧散熱裝置組合器 100‧‧‧heat sink combination
10‧‧‧散熱器 10‧‧‧ radiator
20‧‧‧扣具 20‧‧‧ buckle
11‧‧‧底座 11‧‧‧Base
12‧‧‧散熱鰭片陣列 12‧‧‧Fixing fin array
121‧‧‧最外側散熱鰭片 121‧‧‧ outermost fins
121a‧‧‧內表面 121a‧‧‧ inner surface
121b‧‧‧外表面 121b‧‧‧ outer surface
21‧‧‧抵靠部 21‧‧‧Affiliation
22‧‧‧限位部 22‧‧‧Limited
23‧‧‧鎖扣部 23‧‧‧Locking Department
221‧‧‧連接段 221‧‧‧ Connection section
222‧‧‧抵靠段 222‧‧‧Affiliated section
211‧‧‧抵靠面 211‧‧‧Abutment
212‧‧‧側面 212‧‧‧ side
213‧‧‧底面 213‧‧‧ bottom
215‧‧‧端面 215‧‧‧ end face
214‧‧‧頂面 214‧‧‧ top surface
216‧‧‧開口 216‧‧‧ openings
2161‧‧‧第一面 2161‧‧‧ first side
2162‧‧‧第二面 2162‧‧‧ second side
231‧‧‧彎曲部 231‧‧‧Bend
232‧‧‧鎖合部 232‧‧‧Locking Department
230‧‧‧螺孔 230‧‧‧ screw holes
圖1為本發明散熱裝置組合之一較佳實施例之立體分解圖。 1 is a perspective exploded view of a preferred embodiment of a heat sink assembly of the present invention.
圖2為圖1中散熱裝置組合之立體組合圖。 2 is a perspective assembled view of the heat sink assembly of FIG. 1.
以下,將結合附圖及實施例對本技術方案之散熱裝置組合進行詳細說明。 Hereinafter, the heat sink assembly of the present technical solution will be described in detail with reference to the accompanying drawings and embodiments.
參閱圖1,一散熱裝置組合100,其包括一散熱器10以及用於將散熱器10固定到一發熱電子元件(圖未示)表面上之二扣具20。 Referring to Figure 1, a heat sink assembly 100 includes a heat sink 10 and two clips 20 for securing the heat sink 10 to the surface of a heat generating electronic component (not shown).
所述散熱器10由高導熱性材料如銅、鋁或其合金等一體成型製成。所述散熱器10包括一用於與發熱電子元件相接觸之底座11及一自該底座11頂面垂直延伸設置之散熱鰭片陣列12。所述散熱鰭片陣列12由複數個互相平行且間隔設置之散熱鰭片組成。該散熱鰭片陣列12包括與底座11二端部相連接之二最外側散熱鰭片121。每一最外側散熱鰭片121具有一內表面121a與一外表面121b。所述二扣具20可移動地套設於散熱鰭片陣列12中之任何二相互對稱之散熱鰭片上,本實施例中,所述二扣具20可移動地套設於散熱鰭片陣列12之二最外側散熱鰭片121上,以將散熱器10固定於發熱電子元件之表面。 The heat sink 10 is integrally formed of a highly thermally conductive material such as copper, aluminum or an alloy thereof. The heat sink 10 includes a base 11 for contacting the heat-generating electronic component and a heat dissipation fin array 12 extending perpendicularly from a top surface of the base 11. The heat dissipation fin array 12 is composed of a plurality of heat dissipation fins arranged in parallel and spaced apart from each other. The heat dissipation fin array 12 includes two outermost heat dissipation fins 121 connected to the two ends of the base 11. Each of the outermost fins 121 has an inner surface 121a and an outer surface 121b. The two fastening devices 20 are movably sleeved on the heat dissipating fins 12 of the heat dissipating fin array 12 . In this embodiment, the two fastening devices 20 are movably sleeved on the heat dissipating fin array 12 . The second outermost fins 121 are fixed to the surface of the heat-generating electronic component.
每一扣具20為一金屬質地之一體成型結構,其包括一抵靠部21、二限位部22及二鎖扣部23。所述二鎖扣部23分別自抵靠部21之二端延伸,且位於抵靠部21之同側。所述二鎖扣部23可垂直於抵靠部21,亦可相對於抵靠部21向外扭轉一定角度,即,該二鎖扣部23亦可非垂直於所述抵靠部21。所述二限位部22相互間隔地自抵靠部21相向地彎曲延伸,且位於抵靠部21之同側。該二限位部22位於二鎖扣部23之間。每一限位部22包括一彎曲連接於抵靠部21之連接段221及一與該抵靠部21平行之抵靠段222。所述二限位部22之二抵靠段222分別與抵靠部21間隔相同距離。所述抵靠部21與每一限位部22之抵靠段222之間間隔之距離與與其配合之最外側散熱鰭片121之厚度基本相同,以使該最外側散熱鰭片121沿其 厚度方向恰好設置於抵靠部21與二抵靠段222之間。所述二限位部22之二連接段221之間間隔之距離基本等於與其配合之最外側散熱鰭片121之寬度,以使該最外側散熱鰭片121沿其寬度方向恰好設置在二連接段221之間。 Each of the fasteners 20 is a metal body forming structure, and includes an abutting portion 21, two limiting portions 22 and two locking portions 23. The two latching portions 23 respectively extend from the two ends of the abutting portion 21 and are located on the same side of the abutting portion 21 . The two latching portions 23 can be perpendicular to the abutting portion 21 or can be twisted outwardly relative to the abutting portion 21, that is, the two latching portions 23 can also be non-perpendicular to the abutting portion 21. The two limiting portions 22 are bent away from the abutting portion 21 at a distance from each other and are located on the same side of the abutting portion 21 . The two limiting portions 22 are located between the two latching portions 23 . Each of the limiting portions 22 includes a connecting portion 221 bently connected to the abutting portion 21 and an abutting portion 222 parallel to the abutting portion 21 . The two abutting portions 222 of the two limiting portions 22 are respectively spaced apart from the abutting portion 21 by the same distance. The distance between the abutting portion 21 and the abutting portion 222 of each limiting portion 22 is substantially the same as the thickness of the outermost radiating fin 121 that is coupled thereto, so that the outermost fin 14 is along the same The thickness direction is just between the abutting portion 21 and the abutting portion 222. The distance between the two connecting segments 221 of the two limiting portions 22 is substantially equal to the width of the outermost heat radiating fins 121 matched thereto, so that the outermost heat radiating fins 121 are disposed in the two connecting segments along the width direction thereof. Between 221.
具體地,所述抵靠部21為一矩形片體結構,其包括一用於與最外側散熱鰭片121之內表面121a相接觸之抵靠面211、一與該抵靠面211相對之側面212、一用於與底座11相接觸之底面213、一與該底面213相對之頂面214及二相對之端面215。二開口216分別靠近二端面215開設於該抵靠部21,且該二開口216貫通抵靠面211與側面212。每一開口216為自底面213開設之一切口,其相鄰兩側具有分別與端面215平行之一第一面2161,及一與頂面214平行之第二面2162。 Specifically, the abutting portion 21 is a rectangular sheet structure including an abutting surface 211 for contacting the inner surface 121a of the outermost heat radiating fin 121 and a side opposite to the abutting surface 211. 212, a bottom surface 213 for contacting the base 11, a top surface 214 opposite to the bottom surface 213, and two opposite end surfaces 215. The two openings 216 are respectively open to the abutting portion 21 near the two end faces 215 , and the two openings 216 penetrate through the abutting surface 211 and the side surface 212 . Each of the openings 216 defines a slit from the bottom surface 213, and adjacent sides thereof have a first surface 2161 parallel to the end surface 215 and a second surface 2162 parallel to the top surface 214.
所述二限位部22之連接段221分別自二開口216之靠近端面215之第一面2161向抵靠部21之抵靠面211彎曲延伸一定距離(約為最外側散熱鰭片121之厚度),然後沿與抵靠面211平行之方向延伸出抵靠段222。 The connecting portion 221 of the two limiting portions 22 is bent from the first surface 2161 of the second opening 216 near the end surface 215 to the abutting surface 211 of the abutting portion 21 by a certain distance (about the thickness of the outermost heat radiating fin 121). And then extends out of the abutment section 222 in a direction parallel to the abutment surface 211.
所述二鎖扣部23分別自抵靠面211之二端部向遠離該抵靠面211之方向同向垂直延伸。所述二鎖扣部23與二限位部22位於抵靠部21之同側,即,位於抵靠面211之同一側。每一鎖扣部23包括一與抵靠部21之底面213相接之彎曲部231及一用於與發熱電子元件相配合之鎖合部232。每一彎曲部231位於抵靠部21之一端面215與靠近該端面215之開口216之間,且該彎曲部231之一端與該端面215相接,另一端與靠近該端面215之開口216之靠近該端面之第 一面2161相接。每一鎖合部232為一矩形板體,其開設有至少一螺孔230,用以與螺釘或螺栓配合將散熱器10固定於發熱電子元件所在之電路板(圖未示)上。 The two latching portions 23 extend perpendicularly from the opposite ends of the abutting surface 211 in a direction away from the abutting surface 211 . The two locking portions 23 and the two limiting portions 22 are located on the same side of the abutting portion 21 , that is, on the same side of the abutting surface 211 . Each of the locking portions 23 includes a curved portion 231 that is in contact with the bottom surface 213 of the abutting portion 21 and a locking portion 232 that cooperates with the heat-generating electronic component. Each of the curved portions 231 is located between an end surface 215 of the abutting portion 21 and an opening 216 adjacent to the end surface 215, and one end of the curved portion 231 is in contact with the end surface 215, and the other end is adjacent to the opening 216 of the end surface 215. Close to the end of the face One side is connected to 2161. Each of the latching portions 232 is a rectangular plate body having at least one screw hole 230 for engaging the screw or the bolt to fix the heat sink 10 to a circuit board (not shown) on which the heat generating electronic component is located.
可以理解,所述二鎖扣部23與二限位部22亦可位於抵靠部21之異側,例如,二鎖扣部23位於抵靠面211之一側,而二限位部22位於側面212之另一側。另外,所述二限位部22可位於抵靠部21之同側或異側。所述二鎖扣部23可位於抵靠部21之同側或異側。 It can be understood that the two locking portions 23 and the two limiting portions 22 can also be located on opposite sides of the abutting portion 21, for example, the two locking portions 23 are located on one side of the abutting surface 211, and the two limiting portions 22 are located. The other side of the side 212. In addition, the two limiting portions 22 may be located on the same side or different sides of the abutting portion 21 . The two locking portions 23 may be located on the same side or on the opposite side of the abutting portion 21 .
可以理解,所述二限位部22亦可為一體結構,例如,所述二限位部22之兩抵靠段222可連接於一起,從而形成一體結構之限位元件。 It can be understood that the two limiting portions 22 can also be a unitary structure. For example, the two abutting portions 222 of the two limiting portions 22 can be coupled together to form a limiting structure of the integral structure.
可以理解,根據電路板之規格結構,所述二扣具20不限於配合於散熱鰭片陣列12之二最外側散熱鰭片121上。只要可確保散熱器10穩定地固定於發熱電子元件之表面,二扣具20可分別配合於散熱鰭片陣列12中之其他散熱鰭片上。優先地,二扣具20配合於散熱鰭片陣列12之二對稱之散熱鰭片上,例如,二扣具20分別配合於散熱鰭片陣列12中之二次外側散熱鰭片上。 It can be understood that, according to the specification structure of the circuit board, the two fasteners 20 are not limited to be fitted to the two outermost heat dissipation fins 121 of the heat dissipation fin array 12 . As long as the heat sink 10 can be stably fixed to the surface of the heat-generating electronic component, the two fasteners 20 can be respectively fitted to the other heat-dissipating fins in the heat-dissipating fin array 12. Preferably, the two fasteners 20 are coupled to the two symmetrical heat dissipation fins of the heat dissipation fin array 12 . For example, the two fasteners 20 are respectively fitted to the secondary outer heat dissipation fins of the heat dissipation fin array 12 .
將二扣具20組裝于散熱器10時,將二扣具20由散熱器10之頂端向下分別套置於二最外側散熱鰭片121上,如此,便實現扣具20與散熱器10組裝成一體。其中,每一最外側散熱鰭片121之二端分別抵靠於一相應扣具20之二限位部22,這樣,扣具20沿該二最外側散熱鰭片121之寬度方向得以固定。每一扣具20之二限位部22之二抵靠段222與一相應之最外側散熱鰭片121之外表面121a相配 合,該扣具20之抵靠部21之抵靠面211與該最外側散熱鰭片121之內表面121a相配合,這樣,所述限位部22與所述抵靠部21共同將扣具20沿該最外側散熱鰭片121之厚度方向得以固定。因此,所述扣具20沿該兩最外側散熱鰭片121之寬度與厚度方向均被固定,而沿該兩最外側散熱鰭片121之高度方向上未被固定。這樣,二扣具20可沿二最外側散熱鰭片12之高度方向可移動地配合於該二最外側散熱鰭片121上。明顯地,將扣具20由散熱器10底座11之表面移向最外側散熱鰭片12之頂端,即可實現扣具20與散熱器10之分離。 When the two clips 20 are assembled to the heat sink 10, the two clips 20 are respectively placed on the two outermost fins 121 from the top end of the heat sink 10, so that the clip 20 and the heat sink 10 are assembled. In one. The two ends of each of the outermost fins 121 are respectively abutted against the two limiting portions 22 of the corresponding clips 20, so that the clips 20 are fixed along the width direction of the two outermost fins 121. Each of the two retaining members 20 of the retaining portions 22 and the abutting portion 222 are matched with the outer surface 121a of the corresponding outermost radiating fin 121. The abutting surface 211 of the abutting portion 21 of the clip 20 cooperates with the inner surface 121a of the outermost fin 14121, so that the limiting portion 22 and the abutting portion 21 together 20 is fixed along the thickness direction of the outermost heat dissipation fin 121. Therefore, the clips 20 are fixed along the width and thickness directions of the two outermost fins 121, and are not fixed along the height direction of the two outermost fins 121. In this way, the two fasteners 20 can be movably fitted to the two outermost heat dissipation fins 121 along the height direction of the two outermost heat dissipation fins 12 . Obviously, the separation of the buckle 20 from the heat sink 10 can be achieved by moving the buckle 20 from the surface of the base 11 of the heat sink 10 to the top end of the outermost heat radiating fins 12.
當扣具20將散熱器10固定至發熱電子元件時,二扣具20位於散熱器10之底座11表面,每一扣具20之二鎖扣部23藉由螺釘或螺栓或其他固定件與發熱電子元件所在之電路板或位於電路板背面之背板(圖未示)進行固定連接。這樣便實現散熱器10與發熱電子元件之貼合固定。 When the clip 20 fixes the heat sink 10 to the heat-generating electronic component, the two clips 20 are located on the surface of the base 11 of the heat sink 10, and the second latching portion 23 of each clip 20 is heated by screws or bolts or other fixing members. The circuit board on which the electronic components are located or the backplane (not shown) on the back of the circuit board is fixedly connected. In this way, the heat sink 10 and the heat-generating electronic component are bonded and fixed.
與先前技術相比,上述扣具20僅經由沿散熱器10散熱鰭片之高度方向上下移動即可實現其與散熱器10組裝拆卸,方便快捷。另外,上述扣具20可裝配於散熱器10之任何散熱鰭片上,如此,扣具20之鎖扣部23之間距可配合不同規格之電路板而改變,適用性強。 Compared with the prior art, the above-mentioned clip 20 can be assembled and disassembled from the heat sink 10 only by moving up and down along the height direction of the heat sink fins of the heat sink 10, which is convenient and quick. In addition, the above-mentioned fasteners 20 can be mounted on any heat-dissipating fins of the heat sink 10. Thus, the locking portions 23 of the fasteners 20 can be changed with different circuit boards of different specifications, and the applicability is strong.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100‧‧‧散熱裝置組合器 100‧‧‧heat sink combination
10‧‧‧散熱器 10‧‧‧ radiator
20‧‧‧扣具 20‧‧‧ buckle
11‧‧‧底座 11‧‧‧Base
12‧‧‧散熱鰭片陣列 12‧‧‧Fixing fin array
121‧‧‧最外側散熱鰭片 121‧‧‧ outermost fins
121a‧‧‧內表面 121a‧‧‧ inner surface
121b‧‧‧外表面 121b‧‧‧ outer surface
21‧‧‧抵靠部 21‧‧‧Affiliation
22‧‧‧限位部 22‧‧‧Limited
23‧‧‧鎖扣部 23‧‧‧Locking Department
221‧‧‧連接段 221‧‧‧ Connection section
222‧‧‧抵靠段 222‧‧‧Affiliated section
211‧‧‧抵靠面 211‧‧‧Abutment
212‧‧‧側面 212‧‧‧ side
213‧‧‧底面 213‧‧‧ bottom
215‧‧‧端面 215‧‧‧ end face
214‧‧‧頂面 214‧‧‧ top surface
216‧‧‧開口 216‧‧‧ openings
2161‧‧‧第一面 2161‧‧‧ first side
2162‧‧‧第二面 2162‧‧‧ second side
231‧‧‧彎曲部 231‧‧‧Bend
232‧‧‧鎖合部 232‧‧‧Locking Department
230‧‧‧螺孔 230‧‧‧ screw holes
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97142128A TWI417038B (en) | 2008-10-31 | 2008-10-31 | Clip and heat dissipation device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97142128A TWI417038B (en) | 2008-10-31 | 2008-10-31 | Clip and heat dissipation device having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201018377A TW201018377A (en) | 2010-05-01 |
| TWI417038B true TWI417038B (en) | 2013-11-21 |
Family
ID=44831206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97142128A TWI417038B (en) | 2008-10-31 | 2008-10-31 | Clip and heat dissipation device having the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI417038B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436798A (en) * | 1994-01-21 | 1995-07-25 | Wakefield Engineering, Inc. | Spring clip and heat sink assembly for electronic components |
| CN1180232A (en) * | 1996-06-22 | 1998-04-29 | Lg产电株式会社 | Circuit breaker mounting apparatus |
-
2008
- 2008-10-31 TW TW97142128A patent/TWI417038B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436798A (en) * | 1994-01-21 | 1995-07-25 | Wakefield Engineering, Inc. | Spring clip and heat sink assembly for electronic components |
| CN1180232A (en) * | 1996-06-22 | 1998-04-29 | Lg产电株式会社 | Circuit breaker mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201018377A (en) | 2010-05-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |