US20100108362A1 - Electronic system with heat dissipation device - Google Patents
Electronic system with heat dissipation device Download PDFInfo
- Publication number
- US20100108362A1 US20100108362A1 US12/436,781 US43678109A US2010108362A1 US 20100108362 A1 US20100108362 A1 US 20100108362A1 US 43678109 A US43678109 A US 43678109A US 2010108362 A1 US2010108362 A1 US 2010108362A1
- Authority
- US
- United States
- Prior art keywords
- base
- portions
- electronic system
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H10W40/73—
-
- H10W40/43—
-
- H10W40/641—
Definitions
- the present disclosure relates to an electronic system with a heat dissipation devices and, particularly, to an electronic system with a heat sink capable of being conveniently assembled to and disassembled from a printed circuit board.
- a heat sink is usually placed in thermal contact with a heat generating electronic device, which is mounted on a printed circuit board (PCB), such as a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device.
- PCB printed circuit board
- CPU central processing unit
- the heat sink and the PCB are assembled together by a number of screws.
- the screws may be assembled to and disassembled from the heat sink and the PCB one by one. This is very time-consuming and trouble.
- the PCB is prone to be destroyed by assembling or disassembling the heat sink repeatedly.
- FIG. 1 is an exploded, isometric view of an electronic system in accordance with an embodiment of the present disclosure.
- FIG. 2 is a partly assembled view of the electronic system in FIG. 1 .
- FIG. 3 is an assembled view of the electronic system in FIG. 1 .
- an electronic system of the present disclosure comprises a printed circuit board 50 (PCB) and a heat dissipation device (not labeled) thermally contacting the PCB 50 .
- the PCB 50 comprises an electronic component 51 , two first hooks 531 and two second hooks 532 around the electronic component 51 .
- the heat dissipation device comprises a base 10 contacting the electronic component 51 , a heat sink 40 mounted on a top surface of the base 10 , a wire clip 30 is mounted on the base 10 and engaging with two first hooks 531 and two second hooks 532 which are around the electronic component 51 of the PCB 50 .
- the heat sink 40 comprises a fin group 44 and four U-shaped heat pipes 42 .
- the fin group 44 is located at the top surface of the base 10 .
- the heat pipes 42 extend through the fin group 44 and are thermally connected to the base 10 .
- the fin group 44 comprises a number of first fins 441 and a number of second fins 442 .
- the first and second fins 441 , 442 are substantially parallel to each other and engage with each other via locking members (not labeled) formed at corners thereof. Air passages are defined between the first and second fins 441 , 442 .
- Each of the first fins 441 and the second fins 442 is a rectangular sheet.
- a length of the second fin 442 is equal to that of the first fin 441 .
- a width of the second fin 442 is smaller than that of the first fin 441 .
- the second fins 442 are located at top of the first fins 441 .
- Right ends of the second fins 442 and right ends of the first fins 441 are coplanar.
- the first fins 441 and the second fins 442 cooperatively form an L-shaped configuration.
- Each of the heat pipes 42 comprises two parallel heat-conductive sections 421 and a connecting section 423 interconnecting the two heat-conductive sections 421 .
- Four heat-conductive sections 421 of the two heat pipes 42 extend through the first and second fins 441 , 442 from bottom to top.
- Four heat-conductive sections 421 of another two heat pipes 42 extend through the first fins 441 from bottom to top and are located beside the second fins 442 .
- the connecting sections 423 are located at a bottom end of the fin group 44 .
- the base 10 is made of aluminum or copper.
- the top surface of the base 10 defines four parallel grooves 11 to receive the connecting sections 423 of the four heat pipes 42 .
- First and third grooves 11 are located near a right end of the base 10 , as viewed from FIG. 1 .
- Second and fourth grooves 11 are located near a left end of the base 10 .
- Two baffling portions 13 extend upwardly from the right and left ends of a rear side of the base 10 , respectively. The two baffling portions 13 restrict the wire clip 30 therebetween.
- Two engaging portions 15 are mounted on the right and left ends of a front side of the base 10 , respectively.
- the engaging portion 15 comprises a rectangular mounting plate 151 and an L-shaped clasp 153 extending from a central portion of a lateral side of the mounting plate 151 .
- Two screws 155 extend through the mounting plate 151 and engage with the base 10 to mount the engaging portion 15 on the base 10 .
- the clasp 153 and the mounting plate 151 cooperatively define a U-shaped opening therebetween to receive the wire clip 30 .
- the two engaging portions 15 are mounted on the right and left ends of the base 10 with the two openings thereof facing to each other.
- the two clasps 153 of the two engaging portions 15 restrict the wire clip 30 therebetween.
- the clip 30 is integrally made of a metal wire.
- the clip 30 comprises a first straight connecting portion 31 , two straight extending portions 32 , two straight second connecting portions 33 , two bended pressing portions 34 , two straight third connecting portions 35 and two operating portions 36 .
- One extending portion 32 , second connecting portion 33 , pressing portion 34 , third connecting portion 35 and operating portion 36 are connected to one end of the first connecting portion 31 in series.
- the other extending portion 32 , second connecting portion 33 , pressing portion 34 , third connecting portion 35 and operating portion 36 are connected to another end of the first connecting portion 31 in series.
- the extending portions 32 perpendicularly extend from opposite ends of the first connecting portion 31 .
- the first connecting portion 31 and the two extending portions 32 form a U-shaped configuration.
- the two second connecting portions 33 perpendicularly extend outwardly from rear ends of the two extending portions 32 , respectively, and are oriented toward opposite directions.
- the two pressing portions 34 extend rearwards from free ends of the two second connecting portions 33 respectively.
- the two third connecting portions 35 extend inwardly from two free ends of the two pressing portions 34 .
- the two operating portions 36 extend perpendicularly and rearwards from two free ends of the two third connecting portions 35 respectively.
- Each of the pressing portion 34 includes a first section close to the second connecting portions 33 , a second section close to the third connecting portions 35 , and a downward protruded portion 344 connected between the first and second sections.
- the first hooks 531 of the printed circuit board 50 engage with the two second connecting portions 33 of the wire clip 30 and the second hooks 532 engage with the two third connecting portions 35 .
- the two first hooks 531 are positioned at a front side of the PCB 50
- the two second hooks 532 are positioned at a rear side of the PCB 50 .
- the operating portions 36 are pressed inwardly to enable the pressing portions 34 of the wire clip 30 be sandwiched between the clasps 153 of the engaging portions 15 and the baffling portions 13 . Thereafter, the operating portions 36 are released, and the first sections of the pressing portions 34 enter the clasps 153 of the engaging portions 15 and the second sections of the pressing portions 34 abut against the baffling portions 13 due to the resilience of the pressing portions 34 .
- the protruded portion 344 of the pressing portion 34 abuts against the top surface of the base 10 .
- the heat-conductive sections 421 of the heat pipes 42 extend through the fin group 44 and the connecting sections 423 of the heat pipes 42 are received in the grooves 11 of the base 10 .
- the heat sink 40 is mounted on the base 10 .
- the base 10 thermally contacts with the electronic component 51 of the PCB 50 .
- the second connecting portions 33 of the clip 30 are clasped by the two first hooks 531 of the PCB 50 .
- the operating portions 36 of the clip 30 are pressed inwardly and downwardly until the third connecting portions 35 of the clip 30 are located at lower portions of the two second hooks 532 of the PCB 50 .
- the operating portions 36 are released, and the third connecting portions 35 are clasped by the two second hooks 532 . Therefore, the electronic system is assembled completely.
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An electronic system includes a printed circuit board, a base, and a wire clip. The printed circuit board includes an electronic component and a plurality of hooks around the electronic component. The base thermally contacts the electronic component of the printed circuit board. Two clasps are formed at opposite ends of the base. The wire clip includes two pressing portions, two first connecting portions extending inwardly from first ends of the two pressing portions respectively, and two second connecting portions extending inwardly from second ends of the two pressing portions respectively. The first and second ends of the pressing portion are opposite. The pressing portions of the wire clip are clasped by the clasps of the base. The first connecting portions engage with two hooks of the printed circuit board, and the second connecting portions engage with another two hooks of the printed circuit board.
Description
- 1. Technical Field
- The present disclosure relates to an electronic system with a heat dissipation devices and, particularly, to an electronic system with a heat sink capable of being conveniently assembled to and disassembled from a printed circuit board.
- 2. Description of Related Art
- A heat sink is usually placed in thermal contact with a heat generating electronic device, which is mounted on a printed circuit board (PCB), such as a central processing unit (CPU), and transfers heat through conduction away from the heat generating electronic device so as to prevent over-heating of the heat generating electronic device.
- Conventionally, the heat sink and the PCB are assembled together by a number of screws. The screws may be assembled to and disassembled from the heat sink and the PCB one by one. This is very time-consuming and trouble. The PCB is prone to be destroyed by assembling or disassembling the heat sink repeatedly.
- What is needed, therefore, is a heat dissipation device overcoming the above-described problems.
-
FIG. 1 is an exploded, isometric view of an electronic system in accordance with an embodiment of the present disclosure. -
FIG. 2 is a partly assembled view of the electronic system inFIG. 1 . -
FIG. 3 is an assembled view of the electronic system inFIG. 1 . - Referring to
FIGS. 1-2 , an electronic system of the present disclosure comprises a printed circuit board 50 (PCB) and a heat dissipation device (not labeled) thermally contacting thePCB 50. The PCB 50 comprises anelectronic component 51, twofirst hooks 531 and twosecond hooks 532 around theelectronic component 51. The heat dissipation device comprises abase 10 contacting theelectronic component 51, aheat sink 40 mounted on a top surface of thebase 10, awire clip 30 is mounted on thebase 10 and engaging with twofirst hooks 531 and twosecond hooks 532 which are around theelectronic component 51 of thePCB 50. - The
heat sink 40 comprises afin group 44 and fourU-shaped heat pipes 42. Thefin group 44 is located at the top surface of thebase 10. Theheat pipes 42 extend through thefin group 44 and are thermally connected to thebase 10. - The
fin group 44 comprises a number offirst fins 441 and a number ofsecond fins 442. The first and 441, 442 are substantially parallel to each other and engage with each other via locking members (not labeled) formed at corners thereof. Air passages are defined between the first andsecond fins 441, 442. Each of thesecond fins first fins 441 and thesecond fins 442 is a rectangular sheet. A length of thesecond fin 442 is equal to that of thefirst fin 441. A width of thesecond fin 442 is smaller than that of thefirst fin 441. Thesecond fins 442 are located at top of thefirst fins 441. Right ends of thesecond fins 442 and right ends of thefirst fins 441 are coplanar. Thus, thefirst fins 441 and thesecond fins 442 cooperatively form an L-shaped configuration. - Each of the
heat pipes 42 comprises two parallel heat-conductive sections 421 and a connectingsection 423 interconnecting the two heat-conductive sections 421. Four heat-conductive sections 421 of the twoheat pipes 42 extend through the first and 441, 442 from bottom to top. Four heat-second fins conductive sections 421 of another twoheat pipes 42 extend through thefirst fins 441 from bottom to top and are located beside thesecond fins 442. The connectingsections 423 are located at a bottom end of thefin group 44. - The
base 10 is made of aluminum or copper. The top surface of thebase 10 defines fourparallel grooves 11 to receive the connectingsections 423 of the fourheat pipes 42. First andthird grooves 11 are located near a right end of thebase 10, as viewed fromFIG. 1 . Second andfourth grooves 11 are located near a left end of thebase 10. Two bafflingportions 13 extend upwardly from the right and left ends of a rear side of thebase 10, respectively. The two bafflingportions 13 restrict thewire clip 30 therebetween. Twoengaging portions 15 are mounted on the right and left ends of a front side of thebase 10, respectively. Theengaging portion 15 comprises arectangular mounting plate 151 and an L-shaped clasp 153 extending from a central portion of a lateral side of themounting plate 151. Twoscrews 155 extend through themounting plate 151 and engage with thebase 10 to mount theengaging portion 15 on thebase 10. Theclasp 153 and themounting plate 151 cooperatively define a U-shaped opening therebetween to receive thewire clip 30. The twoengaging portions 15 are mounted on the right and left ends of thebase 10 with the two openings thereof facing to each other. The twoclasps 153 of the twoengaging portions 15 restrict thewire clip 30 therebetween. - The
clip 30 is integrally made of a metal wire. Theclip 30 comprises a first straight connectingportion 31, two straight extendingportions 32, two straightsecond connecting portions 33, two bendedpressing portions 34, two straight third connectingportions 35 and twooperating portions 36. One extendingportion 32, second connectingportion 33, pressingportion 34, third connectingportion 35 andoperating portion 36 are connected to one end of the first connectingportion 31 in series. Similarly, the other extendingportion 32, second connectingportion 33, pressingportion 34, third connectingportion 35 andoperating portion 36 are connected to another end of the first connectingportion 31 in series. - The extending
portions 32 perpendicularly extend from opposite ends of the first connectingportion 31. The first connectingportion 31 and the two extendingportions 32 form a U-shaped configuration. The twosecond connecting portions 33 perpendicularly extend outwardly from rear ends of the two extendingportions 32, respectively, and are oriented toward opposite directions. The two pressingportions 34 extend rearwards from free ends of the twosecond connecting portions 33 respectively. The two third connectingportions 35 extend inwardly from two free ends of the twopressing portions 34. The twooperating portions 36 extend perpendicularly and rearwards from two free ends of the two third connectingportions 35 respectively. - Each of the
pressing portion 34 includes a first section close to the second connectingportions 33, a second section close to the third connectingportions 35, and a downward protrudedportion 344 connected between the first and second sections. When theclip 30 is assembled to thebase 10, the two first sections of the two oppositepressing portions 34 engage with the twoclasps 153 of the twoengaging portions 15 of thebase 10, and the two second sections thereof are restricted between the twobaffling portions 13 of thebase 10. Thus, the two pressingportions 34 of theclip 30 are restricted regarding lateral movement thereof. - The
first hooks 531 of the printedcircuit board 50 engage with the twosecond connecting portions 33 of thewire clip 30 and thesecond hooks 532 engage with the two third connectingportions 35. The twofirst hooks 531 are positioned at a front side of thePCB 50, and the twosecond hooks 532 are positioned at a rear side of thePCB 50. When the assembly of theclip 30 and thebase 10 is assembled to thePCB 50, the twofirst hooks 531 clasp the twosecond connecting portions 33 and the twosecond hooks 532 clasp the two third connectingportions 35. As a result, the assembly of theclip 30 and thebase 10 is fixed on thePCB 50. - Referring to
FIG. 3 also, in assembling, the operatingportions 36 are pressed inwardly to enable thepressing portions 34 of thewire clip 30 be sandwiched between theclasps 153 of the engagingportions 15 and thebaffling portions 13. Thereafter, the operatingportions 36 are released, and the first sections of thepressing portions 34 enter theclasps 153 of the engagingportions 15 and the second sections of thepressing portions 34 abut against thebaffling portions 13 due to the resilience of thepressing portions 34. The protrudedportion 344 of thepressing portion 34 abuts against the top surface of thebase 10. Thus, thebase 10 and thewire clip 30 are assembled together. - The heat-
conductive sections 421 of theheat pipes 42 extend through thefin group 44 and the connectingsections 423 of theheat pipes 42 are received in thegrooves 11 of thebase 10. Thus, theheat sink 40 is mounted on thebase 10. The base 10 thermally contacts with theelectronic component 51 of thePCB 50. The second connectingportions 33 of theclip 30 are clasped by the twofirst hooks 531 of thePCB 50. The operatingportions 36 of theclip 30 are pressed inwardly and downwardly until the third connectingportions 35 of theclip 30 are located at lower portions of the twosecond hooks 532 of thePCB 50. The operatingportions 36 are released, and the third connectingportions 35 are clasped by the twosecond hooks 532. Therefore, the electronic system is assembled completely. - It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (9)
1. An electronic system comprising:
a printed circuit board having an electronic component and a plurality of hooks around the electronic component;
a base thermally contacting the electronic component of the printed circuit board, two clasps formed at opposite ends of the base; and
a wire clip comprising two pressing portions, two first connecting portions extending inwardly from first ends of the two pressing portions respectively, and two second connecting portions extending inwardly from second ends of the two pressing portions respectively, the first and second ends of the pressing portion being opposite;
wherein the pressing portions of the wire clip are clasped by the clasps of the base, the first connecting portions engage with two hooks of the printed circuit board, and the second connecting portions engage with another two hooks of the printed circuit board.
2. The electronic system as claimed in claim 1 , wherein two baffling portions are formed at opposite ends of the base and abut against the pressing portions of the wire clip to restrict the wire clip therebetween.
3. The electronic system as claimed in claim 1 , wherein a central portion of the pressing portion is punched to form a protruded portion to press the base.
4. The electronic system as claimed in claim 1 , wherein the wire clip further comprises two operation portions extending outwardly from free ends of the second connecting portions respectively.
5. The electronic system as claimed in claim 4 , wherein a U-shaped first connecting portion connects the first connecting portions of the wire clip and extends outwardly from the first connecting portions.
6. The electronic system as claimed in claim 1 , wherein a fin group is located at a top of the base.
7. The electronic system as claimed in claim 6 , wherein a heat pipe extends through the fin group and is secured on the base.
8. The electronic system as claimed in claim 1 , wherein a mounting plate is mounted on the base and the clasp extends from a side of the mounting plate.
9. The electronic system as claimed in claim 1 , wherein the printed circuit board comprises two first hooks positioned at a side of the printed circuit board and two second hooks positioned another side of the printed circuit board, the first hooks engage with the two first connecting portions and the two second hooks engage with the two second connecting portions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810305409.9 | 2008-11-06 | ||
| CN200810305409.9A CN101742885B (en) | 2008-11-06 | 2008-11-06 | Radiator fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20100108362A1 true US20100108362A1 (en) | 2010-05-06 |
Family
ID=42130040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/436,781 Abandoned US20100108362A1 (en) | 2008-11-06 | 2009-05-07 | Electronic system with heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100108362A1 (en) |
| CN (1) | CN101742885B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100172103A1 (en) * | 2009-01-05 | 2010-07-08 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20130083485A1 (en) * | 2011-09-29 | 2013-04-04 | Delta Electronics (Shanghai) Co., Ltd. | Heat dissipation apparatus for medium-voltage drive |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6645164B2 (en) * | 2015-03-17 | 2020-02-14 | 富士電機株式会社 | Power converter |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5808236A (en) * | 1997-04-10 | 1998-09-15 | International Business Machines Corporation | High density heatsink attachment |
| US6449154B1 (en) * | 2000-12-30 | 2002-09-10 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly retainer device |
| US20070103870A1 (en) * | 2005-11-10 | 2007-05-10 | Foxconn Technology Co.,Ltd. | Locking device for heat sink |
| US7283362B2 (en) * | 2005-12-26 | 2007-10-16 | Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a locking device |
| US20080084669A1 (en) * | 2006-10-09 | 2008-04-10 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US7495919B2 (en) * | 2007-05-30 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a locking device assembly |
| US7643299B2 (en) * | 2006-10-31 | 2010-01-05 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Clip for heat sink |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2499886Y (en) * | 2001-03-14 | 2002-07-10 | 富准精密工业(深圳)有限公司 | Radiator combination |
| CN2533642Y (en) * | 2002-01-17 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Fastener of heatsink |
| TWM298735U (en) * | 2006-04-24 | 2006-10-01 | Inventec Corp | Heat sink fixture |
| CN101170888B (en) * | 2006-10-27 | 2010-09-29 | 富准精密工业(深圳)有限公司 | heat sink |
-
2008
- 2008-11-06 CN CN200810305409.9A patent/CN101742885B/en not_active Expired - Fee Related
-
2009
- 2009-05-07 US US12/436,781 patent/US20100108362A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5808236A (en) * | 1997-04-10 | 1998-09-15 | International Business Machines Corporation | High density heatsink attachment |
| US6449154B1 (en) * | 2000-12-30 | 2002-09-10 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly retainer device |
| US20070103870A1 (en) * | 2005-11-10 | 2007-05-10 | Foxconn Technology Co.,Ltd. | Locking device for heat sink |
| US7283362B2 (en) * | 2005-12-26 | 2007-10-16 | Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a locking device |
| US20080084669A1 (en) * | 2006-10-09 | 2008-04-10 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US7643299B2 (en) * | 2006-10-31 | 2010-01-05 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Clip for heat sink |
| US7495919B2 (en) * | 2007-05-30 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a locking device assembly |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100172103A1 (en) * | 2009-01-05 | 2010-07-08 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US7948756B2 (en) * | 2009-01-05 | 2011-05-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20130083485A1 (en) * | 2011-09-29 | 2013-04-04 | Delta Electronics (Shanghai) Co., Ltd. | Heat dissipation apparatus for medium-voltage drive |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101742885A (en) | 2010-06-16 |
| CN101742885B (en) | 2013-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DU, JUAN;LU, CUI-JUN;REEL/FRAME:022649/0366 Effective date: 20090428 Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DU, JUAN;LU, CUI-JUN;REEL/FRAME:022649/0366 Effective date: 20090428 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |