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TWI415789B - Method of forming self-assembled and uniform fullerene array on surface of substrate - Google Patents

Method of forming self-assembled and uniform fullerene array on surface of substrate Download PDF

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TWI415789B
TWI415789B TW98113831A TW98113831A TWI415789B TW I415789 B TWI415789 B TW I415789B TW 98113831 A TW98113831 A TW 98113831A TW 98113831 A TW98113831 A TW 98113831A TW I415789 B TWI415789 B TW I415789B
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carbon
substrate
array
cluster
vapor deposition
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TW201038470A (en
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Mon Shu Ho
Chih Pong Huang
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Nat Univ Chung Hsing
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Abstract

The present invention provides a method of forming a self-assembled fullerene array on the surface of a substrate, comprising the following steps: (1) providing a substrate; (2) pre-annealing the substrate at temperature range from 200 DEG C to 1200 DEG C in a vacuum system; and (3) providing powdered fullerene nanoparticles and depositing those powdered fullerene nanoparticles on the surface of the substrate by physical vapor deposition technology in the vacuum system, so as to form a self-assembled fullerene array on the surface of the substrate. The present invention also provides a fullerene embedded substrate prepared therefrom which has excellent field emission properties and can be used as a field emitter for any field emission displays. Finally, the present invention provides a fullerene embedded substrate prepared therefrom, which can be used to substitute for semiconductor carbides as optoelectronic devices and high-temperature, high-power, or high-frequency electric devices.

Description

於基板表面生成自組裝且高度均勻之碳簇分子陣列的方法Method for generating self-assembled and highly uniform carbon cluster molecular arrays on a substrate surface

本發明係關於在基板表面生成自組裝且高度均勻之碳簇分子陣列之方法。特定言之,本發明係關於可作為場發射器、光電元件及高溫、高功率、抗高溫或高頻率電子元件之碳簇分子陣列嵌入式基板的新穎製備方法。The present invention relates to a method of producing a self-assembled and highly uniform array of carbon cluster molecules on the surface of a substrate. In particular, the present invention relates to novel methods of fabricating carbon cluster molecular array embedded substrates that can be used as field emitters, optoelectronic components, and high temperature, high power, high temperature or high frequency electronic components.

在1985年之前,對於碳元素的認識只有兩種為人們所知,分別是二維結構的石墨及三維結構的鑽石。直到Kroto與Smally等人在一項研究星際塵埃之物性的實驗中,利用強力聚焦雷射產生攝氏一萬度高溫打在石墨上將之汽化,企圖得到只含碳的直鏈分子,用以模擬星際間純碳分子的聚合物。實驗結果發現,在常溫下有種新化合物的產量特別高,結構相當穩定,直徑大小約為7.1的三十二面體;其中二十面為六邊形,十二面為五邊形且彼此不會連接在一起,符合孤立五邊形定則(Isolated Pentagons Rule;簡稱IPR),而其六十個頂點上分別被六十個碳原子所佔據。於是在1985年時,Kroto與Smally藉由美國建築師Buck-minster Fuller所設計出的圓頂建築物的概念提出了碳六十分子的結構有如足球結構,故將此碳六十分子球之命名為「Buckminster-fullerene」,簡稱為巴克球(Buckyballs)或碳簇分子(Fullerenes;故又稱富勒烯)。Prior to 1985, there were only two known knowledge of carbon, namely two-dimensional graphite and three-dimensional diamonds. Until Kroto and Smally et al. in a study on the physical properties of interstellar dust, using a powerful focused laser to generate a high temperature of 10,000 degrees Celsius on a graphite to vaporize it, in an attempt to obtain a linear molecule containing only carbon, to simulate A polymer of interstellar pure carbon molecules. The experimental results show that the yield of a new compound at room temperature is particularly high, the structure is quite stable, and the diameter is about 7.1. The dodecahedron; the twenty faces are hexagonal, the twelve faces are pentagons and are not connected to each other, conforming to the Isolated Pentagons Rule (IPR), and its sixty The vertices are each occupied by sixty carbon atoms. So in 1985, Kroto and Smally proposed the structure of a carbon hexapole, such as a football structure, by the concept of a dome designed by American architect Buck-minster Fuller. "Buckminster-fullerene", referred to as Buckyballs or carbon cluster molecules (Fullerenes; also known as fullerenes).

此後,類似碳六十的純碳分子,例如碳七十或碳八十四或由更多碳原子組成之碳簇分子,相繼被發現,形狀則為橢圓形或長型。各類碳簇分子形狀小至碳二十,最大可至碳奈米管(carbon nanotubes;簡稱CNT)或是碳一千五百。目前已發現形狀最小且結構最穩定的碳簇分子是碳三十:由六個五邊形及五個六邊形所構成。其中在中間的一個五邊形被五個六邊形所環繞著,另外五個外圍的五邊形則連接著六邊形,外圍的五個五邊形且彼此不會連接在一起,符合孤立五邊形定則。碳三十擁有十個未鍵結完成的共價鍵,分別位於五個外圍的五邊形。如圖1所示,在碳三十的未鍵結完成共價鍵上增加數個碳原子所形成之六邊形,即可形成較碳三十稍大的碳四十分子,利用同樣的方式在未鍵結完成的共價鍵上增加六邊形的數目,即可形成更大的碳簇分子如碳五十甚至是碳奈米管。Thereafter, a carbon-like molecule similar to carbon sixty, such as carbon seventy or eighty-four carbon or a carbon cluster molecule composed of more carbon atoms, has been found successively in the shape of an ellipse or a long shape. The types of carbon clusters are as small as carbon 20, up to carbon nanotubes (CNT) or carbon 1,500. It has been found that the smallest and most structurally stable carbon cluster molecule is carbon thirty: consisting of six pentagons and five hexagons. One of the pentagons in the middle is surrounded by five hexagons, and the other five pentagons are connected to the hexagon, and the five pentagons on the periphery are not connected to each other. The pentagon rule. Carbon Thirty has ten unbonded covalent bonds located in five peripheral pentagons. As shown in Fig. 1, in the hexagonal form formed by adding a few carbon atoms to the unbonded covalent bond of carbon 30, a carbon tetrathroid which is slightly larger than carbon 30 can be formed, in the same manner. By increasing the number of hexagons on the unbonded covalent bond, larger carbon cluster molecules such as carbon fifty or even carbon nanotubes can be formed.

碳簇分子之通式為Cn(n為大於24的偶數)。一般而言,n<40稱為低碳簇分子,n>40為高碳簇分子,n>400則為巨碳簇分子,例如奈米碳管。奈米碳管之結構為捲成管狀的石墨外加兩顆做為封蓋的半球狀碳簇分子。1991半日本NEC公司的飯島澄男(S. Ijinma)於研究碳簇分子時偶然發現多層奈米碳管(multiwall carbon nanotubes;簡稱MWCNTs)。隨後又發現單層奈米碳管(single wall carbon nanotubes;簡稱SWCNTs)。單層奈米碳管已知有以下三種結構:(1)扶手椅型(armchair);(2)鋸齒型(zigzag);及(3)螺旋型(helix)。依據石墨層的寬度與捲曲方向的不同,奈米碳管可以表現出金屬、半金屬、半導體等不同特性。The carbon cluster molecule has the general formula Cn (n is an even number greater than 24). In general, n<40 is called a low carbon cluster molecule, n>40 is a high carbon cluster molecule, and n>400 is a giant carbon cluster molecule, such as a carbon nanotube. The structure of the carbon nanotubes is a tubular graphite and two hemispherical carbon cluster molecules as caps. In 1991, S. Ijinma of NEC Corporation of Japan accidentally discovered multiwall carbon nanotubes (MWCNTs) when studying carbon cluster molecules. Subsequently, single wall carbon nanotubes (SWCNTs) were discovered. Single-layer carbon nanotubes are known to have three structures: (1) an armchair (2) a zigzag; and (3) a helix. Depending on the width of the graphite layer and the direction of the crimp, the carbon nanotubes can exhibit different properties such as metals, semi-metals, and semiconductors.

高碳簇分子或巨碳簇分子具有非常特別的性質,諸如低密度、高強度、高韌性、可撓曲、高表面積、表面曲度大、高熱導度、導電性特異等等,所以吸引許多研究工作者專注於開發其可能的應用方式,例如複合材料、微電子元件、平面顯示器、無線通訊、燃料電池以及鋰離子電池等等。以奈米碳管為例,由於其具有極優異的導電性能,且具有幾乎接近理論極限之尖端表面積(尖端曲率半徑愈小,其局部電場愈集中),因此,奈米碳管係已知最好的場發射材料,它具有極低場發射電壓,可傳輸極大電流密度,且電流極穩定,非常適合做為場發射顯示器之電子場發射器。High carbon cluster molecules or giant carbon cluster molecules have very special properties, such as low density, high strength, high toughness, flexibility, high surface area, large surface curvature, high thermal conductivity, conductivity specificity, etc., so attract many Researchers focus on developing possible applications, such as composites, microelectronics, flat panel displays, wireless communications, fuel cells, and lithium-ion batteries. Taking a carbon nanotube as an example, the carbon nanotube system is known because it has excellent electrical conductivity and has a tip surface area close to the theoretical limit (the smaller the radius of curvature of the tip is, the more concentrated the local electric field is). A good field emission material, which has a very low field emission voltage, can transmit a large current density, and is extremely stable in current, and is very suitable as an electron field emitter for a field emission display.

奈米碳管場發射顯示器(Carbon Nanotube Field Emission Display;簡稱CNT-FED)不僅保留了傳統陰極射線管顯示器的影像品質,並具有省電及體積薄小之優點,同時結合奈米碳管的低導通電場、高發射電流密度、高穩定性等特性,成為兼具低驅動電壓、高發光效率、無視角問題、省電的大尺寸、低成本…等優點的全新平面顯示器。Carbon Nanotube Field Emission Display (CNT-FED) not only retains the image quality of traditional cathode ray tube displays, but also has the advantages of power saving and small size, combined with low carbon nanotubes. The characteristics of conduction electric field, high emission current density, high stability, etc., become a new flat panel display that combines the advantages of low driving voltage, high luminous efficiency, no viewing angle, large power saving, low cost, and the like.

目前業界中主要使用以下兩種方式製作奈米碳管場發射器:第一,以塗佈方式將含有奈米碳管的導電漿料或者有機粘結劑在基板上印刷成圖形,通過後續處理使得奈米碳管能夠從漿料之埋藏中露出頭來成為發射體;以及第二,以催化成長方式直接在基板上生長奈米碳管圖形。At present, the carbon nanotube field emitters are mainly produced in the following two ways in the industry: First, a conductive paste or an organic binder containing a carbon nanotube is printed on a substrate into a pattern by a coating method, and is subsequently processed. The carbon nanotubes are allowed to emerge from the burial of the slurry to become an emitter; and secondly, the carbon nanotube pattern is grown directly on the substrate in a catalytic growth mode.

第一種方法的製程成本較低而且易於做到大尺寸,但很難控制奈米碳管陣列中每一根碳管的方向。催化成長法則通常採用化學氣相沈積法(CVD)在半導體基板上生長出奈米碳管陣列作為發射體。此方法包括先將陰極板蝕刻為孔徑大小固定之坑洞,利用CVD法將金屬催化劑(一般為金屬鐵、鈷、鎳)細粒填入細孔中,在高溫裂解C2 H2 ,如此可以沿著孔洞長出排列整齊的奈米碳管,再配合由Prof. Milne等學者發展的單一光罩與自對準技術,製作出高品質的奈米碳管發射器。其缺陷是製程成本較高,且奈米碳管末端通常發生彎曲、相互交織。為形成性能良好之發射尖端,需對奈米碳管陣列進行後續處理,將奈米碳管陣列之毛糙表面去除,形成整齊豎直之發射尖端,且採用該化學氣相沈積方法在做成大面積高度均勻陰極發射體方面仍存在一定困難。The first method has a low process cost and is easy to size, but it is difficult to control the direction of each carbon tube in the carbon nanotube array. The catalytic growth method generally uses a chemical vapor deposition (CVD) method to grow a carbon nanotube array as an emitter on a semiconductor substrate. The method comprises first etching a cathode plate into a pit having a fixed pore size, and filling a fine metal particle (generally metal iron, cobalt, nickel) into a fine hole by a CVD method, and cleaving the C 2 H 2 at a high temperature, so that A well-organized carbon nanotubes are grown along the holes, and a high-quality carbon nanotube emitter is produced in conjunction with a single mask and self-alignment technology developed by Prof. Milne et al. The drawback is that the process cost is high, and the ends of the carbon nanotubes are usually bent and interwoven. In order to form a good performance emitter tip, the carbon nanotube array is subjected to subsequent treatment to remove the rough surface of the carbon nanotube array to form a neat vertical emission tip, and the chemical vapor deposition method is used to make the large There are still some difficulties in terms of a highly uniform cathode emitter.

因此,開發適合大尺寸面板、排列整齊而且成本低的碳簇分子發射器製程仍是業界持續努力的方向。Therefore, the development of a carbon cluster molecular emitter process suitable for large-sized panels, neatly arranged and low in cost is still the direction of continuous efforts of the industry.

本發明之一目的為提供一種於基板表面生成自組裝且高度均勻之碳簇分子陣列的方法,其包括以下之步驟:It is an object of the present invention to provide a method of generating a self-assembled and highly uniform array of carbon cluster molecules on a substrate surface comprising the steps of:

(1) 提供一基板;(1) providing a substrate;

(2) 在真空環境下將該基板加熱至約200℃至約1200℃;(2) heating the substrate to a temperature of about 200 ° C to about 1200 ° C in a vacuum environment;

(3) 提供一碳簇分子奈米粉末,並在該真空環境下藉由物理氣相沈積法將該碳簇分子奈米粉末沈積在該基板表面上,從而於該基板表面上形成自組裝且高度均勻之碳簇分子陣列。(3) providing a carbon cluster molecular nanopowder, and depositing the carbon cluster molecular nanopowder on the surface of the substrate by physical vapor deposition in the vacuum environment, thereby forming self-assembly on the surface of the substrate A highly uniform array of carbon cluster molecules.

本發明之又一目的為提供一種由此製得之碳簇分子陣列嵌入式基板,其具有優異之場發射性能,可作為場發射器用於任何場發射顯示器中。It is still another object of the present invention to provide a carbon cluster molecular array embedded substrate thus produced which has excellent field emission properties and can be used as a field emitter in any field emission display.

本發明之再一目的為提供一種由此製得之碳簇分子陣列嵌入式基板,其可替代習知碳化半導體材料,作為光電元件及高溫、高功率、抗高溫或高頻率電子元件之用。It is still another object of the present invention to provide a carbon cluster molecular array embedded substrate thus produced which can be used as a photovoltaic element and a high temperature, high power, high temperature resistant or high frequency electronic component instead of a conventional carbonized semiconductor material.

本發明方法的步驟(1)在於提供一可供碳簇分子於其上自組裝生成之基板。適合用於本發明之基板並無特殊限制,包括,但不限於,鍺、矽、砷、鋁、硼、氮化矽、氧化鋅、氮化鎵、氮化硼、磷化鎵、砷化鎵、砷化銦、磷化銦、藍寶石、硫化鋅及硫化鎘。較佳係使用矽(100)基板或矽(111)基板。更佳係使用n型或p型矽(111)基板。The step (1) of the method of the present invention consists in providing a substrate on which carbon cluster molecules can be self-assembled. The substrate suitable for use in the present invention is not particularly limited, and includes, but not limited to, ruthenium, osmium, arsenic, aluminum, boron, tantalum nitride, zinc oxide, gallium nitride, boron nitride, gallium phosphide, gallium arsenide. Indium arsenide, indium phosphide, sapphire, zinc sulfide and cadmium sulfide. Preferably, a ruthenium (100) substrate or a ruthenium (111) substrate is used. More preferably, an n-type or p-type germanium (111) substrate is used.

本發明方法的步驟(2)在於在真空環境下將該基板加熱至約200℃至約1200℃,較佳約400℃至約1000℃之溫度,更佳約700℃至約900℃之溫度。本文中「真空環境」乙詞並無特殊定義,意指真空度約在1大氣壓以下,較佳1×10-5 Pa以下,更佳1×10-7 Pa以下之環境,此係此技術領域中具有通常知識者所熟知。Step (2) of the process of the present invention consists in heating the substrate to a temperature of from about 200 ° C to about 1200 ° C, preferably from about 400 ° C to about 1000 ° C, more preferably from about 700 ° C to about 900 ° C, under vacuum. The term "vacuum environment" is not specifically defined herein, and means that the degree of vacuum is about 1 atmosphere or less, preferably 1 × 10 -5 Pa or less, more preferably 1 × 10 -7 Pa or less. It is well known to those of ordinary knowledge.

本發明方法的步驟(3)包括在該真空環境下藉由物理氣相沈積法使碳簇分子奈米粉末沈積在該基板表面上。不欲受理論所限制,但咸信由於基板於真空環境下經預先加熱,從而碳簇分子奈米粉末可藉此於基板表面自我組裝成高度均勻之碳簇分子陣列。此處之「高度均勻碳簇分子陣列」,意指碳簇分子係高度均勻地分佈在基板上且大多數垂直於基板表面緊密排列,再者,所形成之碳簇分子陣列具有實質上一致之垂直高度。The step (3) of the method of the present invention comprises depositing carbon cluster molecular nanopowder on the surface of the substrate by physical vapor deposition in the vacuum environment. Without wishing to be bound by theory, it is believed that since the substrate is preheated in a vacuum environment, the carbon cluster molecular nanopowder can self-assemble into a highly uniform array of carbon cluster molecules on the surface of the substrate. The "highly uniform carbon cluster molecular array" herein means that the carbon cluster molecular system is highly uniformly distributed on the substrate and most of them are closely arranged perpendicular to the surface of the substrate, and further, the formed carbon cluster molecular array has substantially the same Vertical height.

適合用於本發明之物理氣相沈積法包括,但不限於,蒸鍍法、分子束磊晶法及濺鍍法。根據本發明之一實施態樣,碳簇分子奈米粉末係藉由蒸鍍方式在真空環境下加熱蒸發為氣體從而沈積在該基板表面上。蒸鍍操作溫度介於約200℃至約1200℃之間,其與碳簇分子的種類有關。原則上碳原子數目越高蒸鍍操作溫度也隨之增高。以碳八十四為例,蒸鍍操作溫度介於約550℃至約750℃之間。若使用碳一百二十作為碳簇分子來源,蒸鍍操作溫度則介於約600℃至約900℃之間。若使用碳三百作為碳簇分子來源,蒸鍍操作溫度則介於約700℃至約1100℃之間。根據本發明之另一實施態樣,碳簇分子奈米粉末亦可藉由分子束磊晶法方式在真空環境下沈積在基板表面上。此外,亦可將碳簇分子奈米粉末壓縮成靶材,再以濺鍍法在真空環境下使碳簇分子沈積在基板表面上。Physical vapor deposition methods suitable for use in the present invention include, but are not limited to, evaporation, molecular beam epitaxy, and sputtering. According to an embodiment of the present invention, the carbon cluster molecular nanopowder is deposited on the surface of the substrate by evaporation by evaporation in a vacuum atmosphere to a gas. The evaporation operation temperature is between about 200 ° C and about 1200 ° C, which is related to the type of carbon cluster molecules. In principle, the higher the number of carbon atoms, the higher the vapor deposition operating temperature. Taking carbon eighty-four as an example, the evaporation operation temperature is between about 550 ° C and about 750 ° C. If carbon 120 is used as the carbon cluster molecular source, the evaporation operation temperature is between about 600 ° C and about 900 ° C. If carbon three is used as the carbon cluster molecular source, the evaporation operation temperature is between about 700 ° C and about 1100 ° C. According to another embodiment of the present invention, the carbon cluster molecular nanopowder powder can also be deposited on the surface of the substrate in a vacuum environment by molecular beam epitaxy. In addition, the carbon cluster molecular nano powder can also be compressed into a target, and the carbon cluster molecules are deposited on the surface of the substrate in a vacuum environment by sputtering.

根據本發明之一實施態樣,在步驟(1)與步驟(2)之間可視情況包含一預清潔基板之步驟。該預清潔步驟包含以溶劑清洗基板表面,隨後在真空環境下加熱該基板以去除基板表面氧化層及雜質。適合用於預清潔步驟之溶劑種類係此技術領域中具有通常技藝者所熟知者,包括,但不限於,去離子水、酮類、醇類、酸類、鹼類及其組合。According to an embodiment of the invention, the step of pre-cleaning the substrate may optionally be included between step (1) and step (2). The pre-cleaning step includes washing the surface of the substrate with a solvent, and then heating the substrate in a vacuum environment to remove oxide layers and impurities on the surface of the substrate. The types of solvents suitable for use in the pre-cleaning step are well known to those of ordinary skill in the art, including, but not limited to, deionized water, ketones, alcohols, acids, bases, and combinations thereof.

用於本發明之碳簇分子奈米粉末係商業上可購得者。各種此技術領域中具有通常知識者所熟知之碳簇分子皆可用於本發明方法中,從而於基板上形成自組裝且高度均勻之陣列。合適之碳簇分子包括,但不限於,碳二十、碳二十四、碳三十六、碳四十、碳四十二、碳四十八、碳五十、碳五十五、碳六十、碳六十二、碳六十四、碳六十八、碳七十、碳七十二、碳七十六、碳七十八、碳八十、碳八十二、碳八十四、碳九十、碳九十四、碳九十六、碳一百、碳一百零二、碳一百二十、碳一百四十、碳三百、單壁奈米碳管、雙壁奈米碳管及多壁奈米碳管。The carbon cluster molecular nanopowder used in the present invention is commercially available. A variety of carbon cluster molecules well known to those of ordinary skill in the art can be used in the method of the present invention to form a self-assembled and highly uniform array on a substrate. Suitable carbon cluster molecules include, but are not limited to, carbon twenty, carbon twenty four, carbon thirty six, carbon forty, carbon forty two, carbon forty eight, carbon fifty, carbon fifty five, carbon sixty, Carbon sixty two, carbon sixty four, carbon sixty eight, carbon seventy, carbon seventy two, carbon seventy six, carbon seventy eight, carbon eighty, carbon eighty two, carbon eighty four, carbon nine X. Carbon 94, carbon 96, carbon 100, carbon 102, carbon 120, carbon 140, carbon 300, single-walled carbon nanotubes, double-walled nanocarbon Tube and multi-walled carbon nanotubes.

本發明方法不僅製程簡單、成本低,且由於碳簇分子陣列呈高度均勻分佈,由此製得之結構發射效率高且起始電壓小,非常適合用於場發射顯示器中作為場發射器。再者,由於碳簇分子於基板上緊密排列,所形成之結構也不易受到氫、氧及氮(包含彼等元素之原子態、離子態或分子態及其化合物)的侵蝕。The method of the invention not only has simple process and low cost, but also has a high uniform distribution of carbon cluster molecular arrays, thereby obtaining a structure with high emission efficiency and small starting voltage, which is very suitable for use as a field emitter in a field emission display. Furthermore, since the carbon cluster molecules are closely arranged on the substrate, the formed structure is also less susceptible to attack by hydrogen, oxygen, and nitrogen (including atomic, ionic, or molecular states of their elements and their compounds).

另一方面,當使用半導體材料作為基板時,根據本發明方法所形成之碳簇分子陣列嵌入式基板也非常適合作為習知碳化半導體材料之替代物。On the other hand, when a semiconductor material is used as the substrate, the carbon cluster molecular array embedded substrate formed by the method of the present invention is also very suitable as a substitute for the conventional carbonized semiconductor material.

碳化半導體材料是新一代最重要的半導體材料之一,其擁有許多優異的物理及化學性質,例如寬能帶、高功率、抗高溫及高頻率等性質。以碳化矽為例,由於其擁有許多優異的物理及化學性質,在各種領域上都有著絕佳的應用。在力學性質方面,由於其硬度極高(摩氏硬度9.0),僅次於鑽石(10.0),遠大於矽(7.0)及砷化鎵(~5.0-5.5),故可應用於複合材料之強化材料、研磨材料、切削工具、幫浦內襯及纖維補強材料等。在熱學性質方面,由於碳化矽具有在室溫下其具有高熱導率(3~5W/cm.K),高於矽(1.5W/cm.K)及砷化鎵(0.5W/cm.K),且其高熔點(2830℃)的特性,遠高於矽(1420℃)及砷化鎵(1240℃),可承受較高的操作溫度,耐熱震(thermal shock resistance)、抗高溫氧化,因此可應用於飛機及汽車引擎感測器、噴射引擎點火裝置及渦輪引擎葉片等。Carbonized semiconductor materials are one of the most important semiconductor materials in the new generation. They have many excellent physical and chemical properties, such as wide band, high power, high temperature resistance and high frequency. Taking strontium carbide as an example, it has excellent applications in various fields due to its many excellent physical and chemical properties. In terms of mechanical properties, due to its extremely high hardness (Mohs hardness 9.0), second only to diamond (10.0), much larger than 矽 (7.0) and gallium arsenide (~5.0-5.5), it can be applied to the reinforcement of composite materials. Materials, abrasive materials, cutting tools, pump linings and fiber reinforcement materials. In terms of thermal properties, tantalum carbide has a high thermal conductivity (3~5W/cm.K) at room temperature, higher than 矽(1.5W/cm.K) and gallium arsenide (0.5W/cm.K). ), and its high melting point (2830 ° C) characteristics, much higher than 矽 (1420 ° C) and gallium arsenide (1240 ° C), can withstand higher operating temperatures, thermal shock resistance, high temperature oxidation, Therefore, it can be applied to aircraft and automobile engine sensors, injection engine ignition devices, and turbine engine blades.

碳化矽在電學性質方面,其具有寬能帶(1.8-3.0eV)的特性,大於矽(1.12eV)及砷化鎵(1.42eV),可阻抗電子穿透,適合作為光激發二極體(Light Emitting Diode,LED)的發光材料[3]。此外,其高飽和電子漂移率(high saturation drift velocity)之特性也促使碳化矽激發出短波長的光,適合用作藍光光激發二極體(blue LED)、近太陽盲光紫外光探測器(nearly solar blind UV photodetectors)、高頻電源供應器及相控陣列雷達系統(phased array radar system)。碳化矽具有高崩潰電場(2.2~4 x 106 V/cm),遠高於矽(2.5 x 105 V/cm)及砷化鎵(3x 105 V/cm),可應用在高組裝密度(high device packing density)的積體電路上。此外,碳化矽並具有高功率、高介電常數等特性,可提高轉換功率並降低能量耗損,可應用於蕭基特二極體(Schottky diodes)、金氧半場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOSFET)、高頻MESFET元件、接面場效電晶體(Junction Field Effect Transistor,JFET)、雙載子接面電晶體(Bipolar Junction Transistor,BJT)、PiN diodes、絕緣柵雙極電晶體(Insulated Gate Bipolar Transistor,IGBT)、高功率及高壓整流器及太陽能電池之薄膜,在光電元件及高溫電子元件的應用上極具發展潛力。In terms of electrical properties, niobium carbide has a wide band (1.8-3.0 eV), greater than 矽 (1.12 eV) and gallium arsenide (1.42 eV), and can be impedance electron penetration, suitable as a photoexcited diode ( Light Emitting Diode, LED) luminescent material [3]. In addition, its high saturation drift velocity characteristics also promote the excitation of short-wavelength light by barium carbide, which is suitable for use as a blue light-emitting diode (blue LED) and a near-sun blind ultraviolet light detector ( Nearly solar blind UV photodetectors), high frequency power supplies and phased array radar systems. Tantalum carbide has a high collapse electric field (2.2~4 x 10 6 V/cm), much higher than 矽 (2.5 x 10 5 V/cm) and gallium arsenide (3x 10 5 V/cm), which can be applied at high packing density. (high device packing density) on the integrated circuit. In addition, tantalum carbide has high power, high dielectric constant and other characteristics, which can improve conversion power and reduce energy consumption. It can be applied to Schottky diodes and metal oxide half field effect transistors (Metal-Oxide- Semiconductor Field-Effect Transistor (MOSFET), high-frequency MESFET components, Junction Field Effect Transistor (JFET), Bipolar Junction Transistor (BJT), PiN diodes, IGBT Insulated Gate Bipolar Transistors (IGBTs), high-power and high-voltage rectifiers and solar cell films have great potential for the application of optoelectronic components and high-temperature electronic components.

然而,習知碳化半導體材料不僅製備過程繁複,且基材表面上的缺陷(defect)過多導致電阻過大且熱導性不佳,以致於製造出的元件(device)效能不佳。However, conventional carbonized semiconductor materials are not only complicated in the preparation process, but also have too many defects on the surface of the substrate to cause excessive resistance and poor thermal conductivity, so that the manufactured device is not effective.

根據本發明方法所形成之碳簇分子陣列嵌入式基板不僅具有習知碳化半導體材料之優點(例如,高能帶隙(bandgap)及高崩潰電場(breakdown voltage)),且同時可避免習知碳化半導體生成物之孔洞效應,非常適合作為習知碳化半導體材料之替代物,作為光電元件及高溫、高功率、抗高溫或高頻率電子元件之用。The carbon cluster molecular array embedded substrate formed by the method of the present invention not only has the advantages of conventional carbonized semiconductor materials (for example, high energy bandgap and high breakdown voltage), but also avoids conventional carbonized semiconductors. The hole effect of the product is very suitable as a substitute for the conventional carbonized semiconductor material, and is used as a photovoltaic element and high temperature, high power, high temperature resistant or high frequency electronic components.

以下實施例係用於對本發明作進一步說明,唯非用以限制本發明之範圍。任何此技術技藝中具有通常知識者可輕易達成之修飾及改變均包括於本案說明書揭示內容及所附申請專利範圍之範圍內。The following examples are intended to illustrate the invention and are not intended to limit the scope of the invention. Modifications and variations that may be readily made by those skilled in the art are within the scope of the disclosure of the present disclosure and the scope of the appended claims.

實施例Example

(1) 提供一n型矽(111)基板。(1) An n-type germanium (111) substrate is provided.

(2) 將該矽基板依序置於去離子水、丙酮及甲醇溶液中以超音波震洗。(2) The ruthenium substrate was sequentially placed in deionized water, acetone, and methanol solution to be ultrasonically washed.

(3) 在超高真空腔體(~1x10-8 Pa)內將該矽基板緩慢加熱至約600℃,並在此溫度停留6~12小時。隨後將該矽基板緩慢加熱至約1250℃,停留10秒~5分鐘後再降溫至室溫,以去除表面的氧化層及不乾淨的物質。整個過程都在超高真空腔體中進行。(3) Slowly heat the crucible substrate to about 600 ° C in an ultra-high vacuum chamber (~1x10 -8 Pa) and stay at this temperature for 6 to 12 hours. The crucible substrate is then slowly heated to about 1250 ° C, left for 10 seconds to 5 minutes, and then cooled to room temperature to remove the oxide layer on the surface and the dirty material. The entire process is carried out in an ultra-high vacuum chamber.

(4)在超高真空腔體內將該矽基板緩慢加熱至約700℃至约900℃,並使基板維持在此溫度。(4) The crucible substrate is slowly heated to about 700 ° C to about 900 ° C in an ultra-high vacuum chamber, and the substrate is maintained at this temperature.

(5)在超高真空腔體內將純度98%的市售碳八十四奈米粉末(Aldrich Chem.Co.),利用熱蒸鍍槍(Vacweld Miniature K-Cell)加熱至約550℃至約750℃。隨後,在距離該矽基板4~10公分處,於1~40分鐘內將碳八十四奈米粉末垂直地熱蒸鍍在該矽基板表面上,使碳八十四在該矽基板表面上自我組裝,形成高度均勻之陣列,如圖2所示。(5) A commercially available carbon eighty-nano-nano powder (Aldrich Chem. Co.) having a purity of 98% was heated in an ultra-high vacuum chamber to a temperature of about 550 ° C by a vapor deposition gun (Vacweld Miniature K-Cell). 750 ° C. Subsequently, the carbon eighty-nano-nano powder is vertically vapor-deposited on the surface of the crucible substrate in a range of 4 to 10 cm from the crucible substrate within 1 to 40 minutes, so that carbon 84 is self-deposited on the surface of the crucible substrate. Assembled to form a highly uniform array, as shown in Figure 2.

測試方法及結果Test methods and results

(1)分佈均勻性評估(1) Distribution uniformity assessment

使用掃描穿隧顯微鏡(STM)對上述實例中製得之碳八十四陣列進行三維分析,結果如圖2至5所示。STM照片顯示碳八十四係高度均勻地分佈在矽基板上。再者,剖面分析圖亦顯示大多數碳八十四係垂直於矽基板表面緊密排列,且所形成之碳八十四陣列具有實質上一致之垂直高度。Three-dimensional analysis of the eighty-four carbon arrays prepared in the above examples was carried out using a scanning tunneling microscope (STM), and the results are shown in Figs. The STM photo shows that the carbon eighty-four series is highly evenly distributed on the ruthenium substrate. Furthermore, the profile analysis also shows that most of the carbon eighty-four series are closely aligned perpendicular to the surface of the tantalum substrate, and that the formed array of carbon eighty-four has a substantially uniform vertical height.

此外,由於碳八十四於矽基板上緊密排列,所形成之碳化矽基板也不易受到氫、氧及氮(包含彼等元素之原子態、離子態或分子態及其化合物)的侵蝕。In addition, since the carbon eighty-four is closely arranged on the substrate, the formed tantalum carbide substrate is also less susceptible to attack by hydrogen, oxygen and nitrogen (including atomic states, ionic states or molecular states of the elements and their compounds).

(2)發射特性評估(2) Evaluation of emission characteristics

起始電壓Starting voltage

使用STM針對上述實例中製得之碳八十四陣列量測I-V曲線,結果如圖6所示,圖中所示曲線係針對白色X點之量測值。由圖6可知,起始電壓僅約1.36V左右。The I-V curve was measured for the carbon eighty-four array prepared in the above example using STM, and the results are shown in Fig. 6. The curves shown in the figure are for the measurement of the white X point. As can be seen from Fig. 6, the starting voltage is only about 1.36V.

場發射效率Field emission efficiency

根據場發射量子理論,得知在未外加電場的情形下,導體內的電子必須具備足夠的能量,才有機會越過位能障到達另一端的真空側,但是當此能量障礙所延伸的空間範圍很窄時,若加上一微小電場使得能障的形狀改變,那麼便可驅使部分電子穿越過能障而出現在能量障礙的另一端。由於電場的強弱直接影響場發射的電流大小,當增加元件的操作電壓會造成電場增加,此時電子所需穿透的位能障會減少,故所得到的電流則會增強,但這不符合業界所希望的低壓操作。故若能製作一物體呈尖端狀,則在尖端處有較高的電場,則可獲得較低的啟動電場(Eon)與較高的啟動電流密度(Jon)。根據Fowler-Nordheim理論將電場與電流密度做ln(J/E2)對1/E之圖(即為F-N plot),若是場發射電流其應是成直線關係,此可作為判斷是否為場發射電子的依據,此外藉由計算場增強因子β(Field Enhancement factor)可得知其場發射效率之優劣。According to the field emission quantum theory, it is known that in the absence of an applied electric field, the electrons in the conductor must have sufficient energy to have the opportunity to cross the potential barrier to the vacuum side of the other end, but the spatial extent extended by this energy barrier When it is very narrow, if a tiny electric field is added to change the shape of the energy barrier, it can drive some electrons to cross the energy barrier and appear at the other end of the energy barrier. Since the strength of the electric field directly affects the current of the field emission, when the operating voltage of the component is increased, the electric field is increased. At this time, the potential energy barrier required for the electron is reduced, so the current obtained is increased, but this does not match. Low pressure operation desired by the industry. Therefore, if an object can be made to have a tip shape, a higher electric field at the tip end can obtain a lower starting electric field (Eon) and a higher starting current density (Jon). According to Fowler-Nordheim theory, the electric field and current density are plotted as ln(J/E2) versus 1/E (that is, FN plot). If the field emission current is in a straight line relationship, this can be used as a field emission electron. Based on the calculation of the Field Enhancement Factor (beta), the field emission efficiency is known.

由圖7至12之電流密度對電場的特性圖及場發射的F-N特性圖可知,本發明實施例所製得之碳八十四陣列具有相當優異的場發射效率。From the characteristics of the current density versus electric field and the F-N characteristic of the field emission, the eighty-four arrays of carbon produced in the embodiment of the present invention have relatively excellent field emission efficiency.

(3) 能帶隙評估(3) Band gap assessment

將所測量的測電流與電壓特性圖轉換成圖13所示之dI/dV特性圖,可測量其能帶隙約為3.09eV。由此可知本發明實施例所製得之碳八十四陣列確實具有相當優異的寬能帶隙特性。The measured current and voltage characteristic map is converted into the dI/dV characteristic diagram shown in Fig. 13, and the energy band gap can be measured to be about 3.09 eV. It can be seen that the eighty-four carbon arrays produced by the embodiments of the present invention do have quite excellent broad band gap characteristics.

(4) 崩潰電場評估(4) Crash electric field assessment

在真空下場發射將所測量的測電流與電壓特性圖轉換成圖8所示之F-N特性圖,可測量其崩潰電場約為4.1x106 V/cm。由此可知本發明實施例所製得之碳八十四陣列確實具有相當優異的高崩潰電場特性。The field emission under vacuum converts the measured current and voltage characteristic map into the FN characteristic diagram shown in Fig. 8, and the collapse electric field can be measured to be about 4.1 x 10 6 V/cm. From this, it is understood that the eighty-four carbon arrays produced by the embodiments of the present invention do have quite excellent high breakdown electric field characteristics.

本發明方法不僅製程簡單、成本低,且經由實驗數據證明,所製得之碳簇分子陣列呈高度均勻分佈,具有良好的發射特性及小的起始電壓、能帶隙(bandgap)高、崩潰電場(breakdown voltage)高、又可避免碳化半導體生成物之孔洞效應,非常適合用於場發射顯示器中作為場發射器之用或作為習知碳化半導體材料之替代物。相信本發明方法對於場發射顯示器及碳化半導體材料應用領域必能有重大的改良與突破。The method of the invention not only has simple process and low cost, but also proves through experimental data that the prepared carbon cluster molecular array has a highly uniform distribution, good emission characteristics, small initial voltage, high bandgap, and collapse. The high breakdown voltage and the hole effect of the carbonized semiconductor product are very suitable for use as a field emitter in field emission displays or as a substitute for conventional carbonized semiconductor materials. It is believed that the method of the present invention is capable of significant improvements and breakthroughs in the field of application of field emission displays and carbonized semiconductor materials.

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神與範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

圖1為碳簇分子增長示意圖。Figure 1 is a schematic diagram of the molecular growth of carbon clusters.

圖2及3為本發明實施例所製得之碳八十四陣列的掃描穿隧顯微鏡(STM)所攝得之照片(40x40nm2 )及其剖面分析圖。2 and 3 are photographs (40x40 nm 2 ) and cross-sectional analysis views of a scanning tunneling microscope (STM) of an eighty-four array of carbon obtained in an embodiment of the present invention.

圖4為本發明實施例所製得之碳八十四陣列的STM照片(20x20nm2 )及其剖面分析圖。4 is a STM photograph (20× 20 nm 2 ) of a carbon eighty-four array prepared according to an embodiment of the present invention and a cross-sectional analysis diagram thereof.

圖5為本發明實施例所製得之碳八十四陣列的STM照片(12.5x12.5nm2 )及其剖面分析圖。5 is a STM photograph (12.5×12.5 nm 2 ) of a carbon eight-four array prepared according to an embodiment of the present invention and a cross-sectional analysis diagram thereof.

圖6為在真空下以STM測量本發明實施例所製得之碳八十四陣列所獲得之電流對電壓的特性圖。Fig. 6 is a graph showing the current versus voltage obtained by measuring the carbon eighty-four arrays obtained in the examples of the present invention by STM under vacuum.

圖7為在真空下以STM測量本發明實施例所製得之碳八十四陣列其場發射的電流密度對電場的特性圖。其啟動電流密度與啟動電場分別為100A/cm2 及1422V/μm。Figure 7 is a graph showing the current density versus electric field of field emission of an eighty-four array of carbons prepared by an embodiment of the present invention under vacuum using STM. The starting current density and the starting electric field were 100 A/cm 2 and 1422 V/μm, respectively.

圖8為在真空下以STM測量本發明實施例所製得之碳八十四陣列其場發射的F-N特性圖,其場增強因子β約為51.9,崩潰電場約為4.1x106 V/cm。Figure 8 is a graph showing the FN characteristics of the field emission of the eighty-fourth carbon array obtained by the embodiment of the present invention under vacuum, with a field enhancement factor β of about 51.9 and a collapse electric field of about 4.1 x 10 6 V/cm.

圖9為在一大氣壓下以原子力顯微鏡(AFM)測量本發明實施例所製得之碳八十四陣列其場發射的電流密度對電場的特性圖。其啟動電流密度與啟動電場分別為0.01A/cm2 及8035V/μm。Fig. 9 is a graph showing the characteristics of current density versus electric field of field emission of an eighty-four array of carbons obtained by an atomic force microscope (AFM) measurement at an atmospheric pressure. The starting current density and the starting electric field were 0.01 A/cm 2 and 8035 V/μm, respectively.

圖10為在一大氣壓下以AFM測量本發明實施例所製得之碳八十四陣列其場發射的F-N特性圖。其場增強因子β約為4.4。Figure 10 is a graph showing the F-N characteristics of the field emission of an eighty-four array of carbons obtained by an AFM measurement at an atmospheric pressure in an embodiment of the present invention. Its field enhancement factor β is about 4.4.

圖11在一大氣壓下測量本發明實施例所製得之碳八十四陣列其場發射的電流密度對電場的特性圖。其啟動電流密度與啟動電場分別為1μA/cm2 及1.12V/μm。Figure 11 is a graph showing the measurement of the current density versus electric field of the field emission of the eighty-four array of carbons produced in the examples of the present invention under atmospheric pressure. The starting current density and the starting electric field were 1 μA/cm 2 and 1.12 V/μm, respectively.

圖12為在一大氣壓下測量本發明實施例所製得之碳八十四陣列其場發射的F-N特性圖。其場增強因子β約為4.3x103Figure 12 is a graph showing the FN characteristics of the field emission of the eighty-four array of carbon produced in the embodiment of the present invention under atmospheric pressure. Its field enhancement factor β is approximately 4.3x10 3 .

圖13為在真空下以STM測量本發明實施例所製得之碳八十四陣列所獲得之dIdV的特性圖,測量其能帶隙約為3.09eV。Figure 13 is a graph showing the characteristics of dIdV obtained by measuring the carbon eighty-four arrays obtained in the examples of the present invention by STM under vacuum, and measuring the band gap of about 3.09 eV.

(無元件符號說明)(no component symbol description)

Claims (19)

一種於基板表面生成自組裝、高度均勻碳簇分子陣列的方法,其包括以下之步驟:(1)提供一基板;(2)在真空環境下將該基板加熱至約600℃至約900℃;及(3)在該真空環境下藉由物理氣相沈積法將碳簇分子奈米粉末嵌入於該基板表面中,從而於該基板表面上形成自組裝且高度均勻之碳簇分子陣列。 A method for generating a self-assembled, highly uniform carbon cluster molecular array on a substrate surface, comprising the steps of: (1) providing a substrate; (2) heating the substrate to a temperature of about 600 ° C to about 900 ° C in a vacuum environment; And (3) embedding carbon cluster molecular nanopowder in the surface of the substrate by physical vapor deposition in the vacuum environment to form a self-assembled and highly uniform array of carbon cluster molecules on the surface of the substrate. 如請求項2之方法,其中步驟(2)中係將該基板加熱至約700℃至約900℃。 The method of claim 2, wherein in step (2) the substrate is heated to between about 700 ° C and about 900 ° C. 如請求項1或2之方法,其中該基板係選自由鍺、矽、砷、鋁、硼、氮化矽、氧化鋅、氮化鎵、氮化硼、磷化鎵、砷化鎵、砷化銦、磷化銦、藍寶石、硫化鋅及硫化鎘所組成之群。 The method of claim 1 or 2, wherein the substrate is selected from the group consisting of ruthenium, osmium, arsenic, aluminum, boron, tantalum nitride, zinc oxide, gallium nitride, boron nitride, gallium phosphide, gallium arsenide, arsenic A group of indium, indium phosphide, sapphire, zinc sulfide, and cadmium sulfide. 如請求項3之方法,其中該基板係矽(100)基板或矽(111)基板。 The method of claim 3, wherein the substrate is a (100) substrate or a germanium (111) substrate. 如請求項4之方法,其中該基板係n型或p型矽(111)基板。 The method of claim 4, wherein the substrate is an n-type or p-type germanium (111) substrate. 如請求項1或2之方法,其中步驟(2)中之真空環境係指真空度在約1×10-5 Pa以下之環境。The method of claim 1 or 2, wherein the vacuum environment in the step (2) is an environment having a degree of vacuum of about 1 × 10 -5 Pa or less. 如請求項1或2之方法,其中步驟(3)中之物理氣相沈積法係蒸鍍法、分子束磊晶法及濺鍍法。 The method of claim 1 or 2, wherein the physical vapor deposition method in the step (3) is an evaporation method, a molecular beam epitaxy method, and a sputtering method. 如請求項7之方法,其中該物理氣相沈積法係蒸鍍法。 The method of claim 7, wherein the physical vapor deposition method is an evaporation method. 如請求項8之方法,其中該蒸鍍操作溫度介於約200℃至約1200℃之間。 The method of claim 8, wherein the evaporation operation temperature is between about 200 ° C and about 1200 ° C. 如請求項9之方法,其中該蒸鍍操作溫度介於約550℃至約750℃之間。 The method of claim 9, wherein the evaporation operation temperature is between about 550 ° C and about 750 ° C. 如請求項9之方法,其中該蒸鍍操作溫度介於約600℃至約900℃之間。 The method of claim 9, wherein the evaporation operation temperature is between about 600 ° C and about 900 ° C. 如請求項9之方法,其中該蒸鍍操作溫度介於約700℃至約1100℃之間。 The method of claim 9, wherein the evaporation operation temperature is between about 700 ° C and about 1100 ° C. 如請求項7之方法,其中該物理氣相沈積法係分子束磊晶法。 The method of claim 7, wherein the physical vapor deposition method is molecular beam epitaxy. 如請求項7之方法,其中該物理氣相沈積法係濺鍍法。 The method of claim 7, wherein the physical vapor deposition method is a sputtering method. 如請求項1或2之方法,其中在步驟(1)與步驟(2)之間進一步包含一預清潔基板之步驟,包括以溶劑清洗基板表面,隨後在真空環境下加熱該基板以去除基板表面氧化層及雜質。 The method of claim 1 or 2, further comprising the step of pre-cleaning the substrate between the step (1) and the step (2), comprising: cleaning the surface of the substrate with a solvent, and then heating the substrate in a vacuum environment to remove the surface of the substrate Oxide layer and impurities. 如請求項15之方法,其中該溶劑係選自由去離子水、酮類、醇類、酸類、鹼類及其組合所組成之群組。 The method of claim 15, wherein the solvent is selected from the group consisting of deionized water, ketones, alcohols, acids, bases, and combinations thereof. 如請求項1或2之方法,其中該碳簇分子係選自由碳二十、碳二十四、碳三十六、碳四十、碳四十二、碳四十八、碳五十、碳五十五、碳六十、碳六十二、碳六十四、碳六十八、碳七十、碳七十二、碳七十六、碳七十八、碳八十、碳八十二、碳八十四、碳九十、碳九十四、碳九十六、碳一百、碳一百零二、碳一百二十、碳一百四十、碳三百、單壁奈米碳管、雙壁奈米碳管及多 壁奈米碳管所組成之群。 The method of claim 1 or 2, wherein the carbon cluster molecule is selected from the group consisting of carbon twenty, carbon twenty four, carbon thirty six, carbon forty, carbon forty two, carbon forty eight, carbon fifty, carbon fifty 5. Carbon 60, carbon 62, carbon 64, carbon 68, carbon 70, carbon 72, carbon 76, carbon 78, carbon 80, carbon 82, carbon Eighty-four, carbon ninety, carbon ninety-four, carbon ninety-six, carbon one hundred, carbon one hundred two, carbon one hundred twenty, carbon one hundred and forty, carbon three hundred, single-walled carbon nanotube , double-walled carbon nanotubes and more A group of wall-nanocarbon tubes. 一種如請求項1至17中任一項之方法所製得之碳簇分子嵌入式基板。 A carbon cluster molecular embedded substrate produced by the method of any one of claims 1 to 17. 一種場發射器,其包含如請求項18之碳簇分子陣列嵌入式基板。A field emitter comprising a carbon cluster molecular array embedded substrate as claimed in claim 18.
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JP2004263241A (en) * 2003-02-28 2004-09-24 Fuji Xerox Co Ltd Method for manufacturing fullerene device, and fullerene device
CN101150088A (en) * 2006-09-19 2008-03-26 北京大学 Realization method of single-walled carbon nanotube axial energy band regulation
TW200826136A (en) * 2006-12-01 2008-06-16 Hon Hai Prec Ind Co Ltd Method for manufacturing electron emitters and electron sources using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263241A (en) * 2003-02-28 2004-09-24 Fuji Xerox Co Ltd Method for manufacturing fullerene device, and fullerene device
CN101150088A (en) * 2006-09-19 2008-03-26 北京大学 Realization method of single-walled carbon nanotube axial energy band regulation
TW200826136A (en) * 2006-12-01 2008-06-16 Hon Hai Prec Ind Co Ltd Method for manufacturing electron emitters and electron sources using the same

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