TWI415304B - Light emitting diode package strucyures, display devices and fabrication methods for light emitting diode package structures - Google Patents

Abstract

Light emitting diode package structures, display devices and fabrication methods for light emitting diode package structures are presented. The method includes providing a substrate structure, the substrate structure being made of at least one base material. A first conductive layer is formed on a first face of the substrate structure. Pluralities of drilled holes are formed in the substrate structure. The drilled holes perforate through the substrate structure. An adhesion layer is formed on a second face which is opposite to the first face of the substrate to cover one end of each of the drilled holes. A second conductive layer is formed on the adhesion layer. Part of the adhesion layer is removed from the ends of the drilled holes on the first end of the substrate structure. A metal layer is deposited on the first face of the substrate and formed on inner sidewalls and bottom of the drilled holes. The first and second conductive layers are respectively patterned to form a circuit pattern on the first surface and second face of the substrate structure. An LED die is mounted on the second face of the substrate structure and electrically connected to the circuit pattern. An encapsulation is molded and covers the second face of the substrate structure. The substrate structure is cut along out rims of a package region formed by the drilled holes to form the light emitting diode package structure.

Description

Light-emitting diode package structure, display device, and manufacturing method of light-emitting diode package structure

The invention relates to a side-mounted LED package, in particular to a fully-coated side-mounted LED package formed by a mechanical drilling and copper foil bonding process and a manufacturing method thereof.

The side-mounted LED package has a side-emitting type light-emitting diode, in particular, a package method, and a full-coated lens is formed by transfer molding to form a surface-adhesive side view type (Side View) package.

Fig. 1 is a perspective view showing a conventional side-mounted LED package. In the first embodiment, a small-sized side-mounted LED package 10 includes a substrate 12 having LED dies disposed on conductive lines (not shown). A glue 14 is used to mold the LED die and the solid crystal wire as a lens of the package. Since the design and application of the side-mounted LED package 10 are packaged on a system (for example, an optical touch screen) in a side-mounted manner, in order to increase solder adhesion, both ends of the LED package 10 are required. The electrode layers 16a, 16b are added to increase the side tin area, and it is even necessary to add an additional electrode pad 16c.

Small size side-mounted LED package, the size of the gel has been limited, if the special lens (lens) needs to maximize the use of the gel, it is bound to cover the entire finished PCB. Therefore, the top of the hole that helps to eat tin must also be coated with colloid, but in this way, the hole will be filled with colloid during the process of sealing.

Conventional manufacturing methods must use laser drilling and stop to the uppermost copper foil layer, using a copper foil layer to block the infusion of the gel into the holes. However, if you want to form a hole that can help catch tin, its aperture is too large for the laser drilling method. It is necessary to repeatedly apply multiple lasers (for example, dozens of times) at the same point to achieve large-aperture drilling. The cost is too high and does not meet the production efficiency. Another method is to form a blind hole on the back surface of the PCB substrate. This type of drilling is limited to the necessity of using a PCB board having a large thickness, which affects the height limitation and cost of the finished product, and is only used once during PCB processing. The ability to process a piece of PCB, the same cost is still high. In addition, another method is to use the PI tape to adhere the opening, because the adhesion tolerance of the PI tape itself and the ability to support the colloid during sealing are far less than the copper foil, thus limiting the applicable size of the product. . In addition, the use of solder mask (green paint) semi-plugging method, because taking into account the resistance of the solder resist's molding, it is necessary to fill more than half of the depth, which will affect the side The thickness of tin and PCB must be thickened.

In the prior art, regarding a related art of mechanical drilling of a printed circuit board, a method of manufacturing a printed circuit board is disclosed in Japanese Patent Laid-Open Publication No. Hei 11-298120, which comprises removing a copper foil layer on the upper and lower surfaces of a substrate by etching, and mechanically The way of drilling forms a through hole in the substrate, after which a photoresist and a line are formed on the surface of the insulating substrate.

An embodiment of the present invention provides a method for fabricating a light emitting diode package structure, comprising: providing a substrate structure, the substrate structure being composed of at least one substrate; forming a first conductive layer on the first structure of the substrate structure Forming a plurality of drill holes on the substrate structure, the drill holes penetrating the substrate structure; forming a bonding layer on a second surface opposite the first surface of the substrate structure to One end of the hole is covered; a second conductive layer is formed on the bonding layer; from the first side of the substrate structure, a portion of the bonding layer is removed from one end of the holes; and a metal layer is deposited Forming on the first side of the substrate structure on the inner sidewalls and the bottom of the plurality of holes; respectively patterning the first and second conductive layers to form a circuit pattern on the first side of the substrate structure and a second surface; a light-emitting diode die is mounted on the second surface of the substrate structure and electrically connected to the circuit pattern; a glue is molded and covers the second side of the substrate structure; The outer edges of a package area formed by the holes, Cutting the substrate to form a structure of the light emitting diode package structure.

An embodiment of the present invention further provides a method for fabricating a light emitting diode package structure, comprising: providing a substrate structure, the substrate structure being composed of at least one substrate, the substrate having a first conductive layer formed on the substrate Forming a plurality of holes in the substrate structure, the holes forming a package area; forming a bonding layer on a second side opposite the first side of the substrate structure to One of the holes is covered; a second conductive layer is formed on the bonding layer; from the first side of the substrate structure, a portion of the bonding layer is removed from one end of the holes; a metal layer on the first side of the substrate structure and formed on the inner sidewalls and the bottom of the holes; respectively patterning the first and second conductive layers to form a circuit pattern on the first side of the substrate structure And the second surface; encapsulating a light emitting diode die on the second surface of the substrate structure and electrically connecting with the circuit pattern; molding a glue and covering the second surface of the substrate structure; And outside of a package area formed by the holes Cutting the substrate to form a structure of the light emitting diode package structure.

The embodiment of the invention further provides a light emitting diode package structure, comprising: a substrate having a plurality of quarter circular through holes disposed at a corner of the substrate; a patterned first conductive layer Provided on one surface of the substrate; a patterned second conductive layer disposed on the other surface opposite to the surface of the substrate; a bonding layer disposed on the patterned second conductive layer and the substrate Between the surfaces; a metal layer formed on the inner sidewall of the circular through hole of the substrate; a light emitting diode chip disposed on the patterned second conductive layer and electrically connected by the metal layer The patterned first conductive layer; and an optical lens completely covering the wafer and the surface of the substrate.

The embodiment of the present invention further provides a display device, including: a display panel; and two or more LED package structures as a transmitter and a CMOS receiver as components for detecting touch signals, and are disposed on the display The corner of the panel. The light emitting diode package structure includes: a substrate having a plurality of quarter circular through holes disposed at a corner of the substrate; a patterned first conductive layer disposed on the substrate a patterned second conductive layer disposed on the other surface opposite to the surface of the substrate; a bonding layer disposed between the patterned second conductive layer and the surface of the substrate; a metal layer Forming on the inner sidewall of the circular through hole of the substrate; a light emitting diode chip disposed on the patterned second conductive layer, and electrically connecting the patterned first conductive layer by the metal layer a layer; and an optical lens that completely covers the wafer and the surface of the substrate.

In order to make the invention more apparent, the following detailed description of the embodiments and the accompanying drawings are as follows:

The following is a detailed description of the embodiments and examples accompanying the drawings, which are the basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. In the drawings, the shape or thickness of the embodiment may be expanded and simplified or conveniently indicated. In addition, the components of the drawings will be described separately, and it is noted that the components not shown or described in the drawings are known to those of ordinary skill in the art, and in particular, The examples are merely illustrative of specific ways of using the invention and are not intended to limit the invention.

Generally, the Land Grid Array (LGA) package should be excellent in tin. Most of the PCB holes are used to increase the tin area requirement, which increases the contact surface area between the solder paste and the PCB copper foil. Can meet the thrust test needs. However, in the case of special requirements, such as a small-sized package used in a light-emitting diode (LED) or a light sensor that receives light, the shape of the lens must conform to the limitation of the light-emitting or light-receiving angle. The need, combined with the size constraints, makes it inevitable that the colloid itself must be applied over the borehole. The main embodiment and the aspect of the invention lie in the use of PCB copper foil bonding technology to produce a fully-coated side-mounted package body, which can meet the requirements of excellent tin consumption and low cost.

2A-2G is a schematic view showing steps of a method of manufacturing a side-mounted LED package according to an embodiment of the present invention. Referring to FIG. 2A, a substrate structure 100 is first provided, the substrate structure being composed of at least one substrate, such as a material substrate 101 for making a printed circuit board (PCB). Generally, the commercially available PCB board is a double-layer board and has copper foil on both sides. Therefore, the upper layer copper foil can be removed first by etching. However, the material substrate 101 can also be used and a first conductive layer can be formed. A layer 110 (eg, a copper foil) is on a first side of the substrate structure. Further, a material substrate on which an electroplated copper foil has been formed may be used as it is.

Next, referring to FIG. 2B, a plurality of drill holes 105 are formed in the substrate structure 100, and the holes 105 penetrate the substrate structure. In order to achieve better process efficiency, it is possible to select a plurality of substrate structures and then perform mechanical synchronous drilling to reduce manufacturing costs. In one example, the bores 105 have a radius of approximately 0.5 mm. Next, a bonding layer 115 is formed on a second surface of the first surface of the substrate structure 110 to cover one of the holes 105. In one embodiment, the adhesive tape having the adhesive layer 115 is adhered to the second side of the substrate structure, and the release film on the adhesive layer is removed. In another embodiment, the dry layer of the bonding layer 115 can be directly applied or the substrate-free bonding method can be used on the second side of the substrate structure 100. Next, a second conductive layer 120 (for example, a copper foil) is formed on the adhesion layer 115 as shown in FIG. 2D.

Next, a step of forming the inner wall metallization of the bore 105 is performed. 3A-3C are cross-sectional views showing the steps of forming a metallized conductive layer in a mechanical borehole in accordance with an embodiment of the present invention. Referring to FIG. 3A, a cross-sectional view of the area adjacent the bore 105 is shown to expose the second conductive layer 120 to the interior of the bore 105 for subsequent contact of the metallization layer. In an embodiment of the present invention, a portion of the bonding layer is removed from one end of the substrate from the first side of the substrate structure, and the bonding layer 115 at the bottom of the hole 105 is removed by a chemical solvent. As shown in Figure 3B.

Next, referring to FIG. 3C, a metallization process (such as electroplating, sputtering, or chemical vapor deposition) is performed to form a metal layer 135 on the inner sidewalls and the bottom of the holes 105, wherein the second side The second conductive layer 120 can be guided to the first conductive layer 110 of the first surface by the metal layer 135 (ie, the cathode and anode electrodes 112, 114 formed by subsequent patterning).

Referring to Figure 2E, a patterned line is formed on the solid crystal surface. The first and second conductive layers are respectively patterned to form a circuit pattern on the first side and the second side of the substrate structure. In one embodiment, the second conductive layer 120 is patterned into an electrode circuit structure by applying a lithography and etching step, including a portion of the solid crystal pad 124 and a portion of the metal wire pad 122. In other embodiments, the plating layer may be added according to actual needs, so that the LED die is disposed on the conductive line.

Next, referring to FIG. 2F, a light emitting diode die is encapsulated on the second surface of the substrate structure and electrically connected to the circuit pattern. For example, an LED die 145 is die bonded to the die pad and the wire 140 is connected to the LED die 145 and the pad 122. Thereafter, a glue is molded and covers the second side of the substrate structure. For example, the adhesive 132 is coated with the LED die and the solid crystal wire as a package by a transfer molding process. Lens 130.

After the sealing step is completed, the substrate structure is cut along the outer edge of a package region formed by the holes to form the light emitting diode package structure, that is, the fully covered side-mounted LED package is completed. To achieve the low-cost and high-function small size requirements, the tin area is complete and maximized, and the PCB thickness is not limited. The large-size lens that meets the optical requirements can maximize the coating of the PCB without worrying about the problem of overflowing the tin hole. Furthermore, the package can also be used in a top-looker type package.

2G is a side elevational view showing a fully wrapped side-mounted LED package in accordance with an embodiment of the present invention. A solder resist (green lacquer) layer 150 is disposed between the cathode and anode electrodes 112, 114 to prevent shorting between the electrodes. Furthermore, since the side-mounted LED package is in contact with the package substrate on only one side, the upper drill hole 105' may be omitted in some embodiments. In one embodiment, the plurality of quarter mechanical bores 105 includes two quarters of mechanical bores underneath the side-mounted LED packages, and the upper bores 105' may be omitted.

4A and 4B are schematic views showing the application of a fully-coated plastic side-mounted LED package formed by a mechanical drilling and copper foil bonding process to an optical touch screen system according to an embodiment of the present invention. In FIG. 4A, an optical touch screen system 400 includes a display panel 410, and two or more LED emitters 420 and CMOS receivers as components for detecting touch signals. The LED emitter 420 can be disposed on the top corner of the display panel 410 using a fully encapsulated side-mounted LED package, as shown in FIG. 4B.

According to still another embodiment of the present invention, a display device includes a display panel 410 and two or more LED package structures 420 as a transmitter, and two or more CMOS sensors (not shown) as The components for detecting the touch signal, the LED package structure 420 and the CMOS sensor are disposed in a pair on the corner of the display panel. The LED package structure 420 includes a substrate having a plurality of quarter-circular through holes disposed at corners of the substrate. A patterned first conductive layer is disposed on a surface of the substrate. A patterned second conductive layer is disposed on the other surface opposite the surface of the substrate. A bonding layer is disposed between the patterned second conductive layer and the surface of the substrate. A metal layer is formed on the inner sidewall of the circular through hole of the substrates. A light emitting diode chip is disposed on the patterned second conductive layer, and the patterned first conductive layer is electrically connected by the metal layer. An optical lens completely covers the wafer and the surface of the substrate.

The advantages of the embodiments disclosed in the present invention are that, by using the adhesion technology of the PCB and the copper foil, multiple PCBs can be drilled at the same time according to the aperture requirement, and the thickness of the PCB is not limited, unlike the conventional semi-blind hole drill. The law must use a thicker PCB board. After the upper copper foil is pasted, it directly covers the drilled hole. According to the actual design requirements, the copper foil is etched into a patterned circuit to avoid the problem of adhesive tolerance caused by the traditional adhesion of PI to the etched circuit. The copper foil is subjected to the sealing adhesive. The ability is also far greater than the ability of PI, so it can meet the low-cost side-mounted requirements of small-size fully encapsulated sealants.

The present invention has been disclosed in the above various embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10. . . Side-mounted LED package

12. . . Substrate

14. . . Plastic closures

16a, 16b. . . Electrode layer

16c. . . Additional electrode pad

100. . . Substrate structure

101. . . Material substrate

105, 105’. . . drilling

110. . . First conductive layer

112, 114. . . Cathode and anode electrodes

115. . . Bonding layer

120. . . Second conductive layer

122. . . Metal wire pad

124. . . Solid crystal pad

130. . . lens

132. . . Plastic closures

135. . . Metal layer

140. . . metal wires

145. . . LED die

150. . . Anti-weld paint (green paint) layer

400. . . Optical touch screen system

410. . . Display panel

420. . . Fully encapsulated side-mounted LED package

Figure 1 is a perspective view showing a conventional side-mounted LED package;

2A-2G is a schematic view showing steps of a method of manufacturing a side-mounted LED package according to an embodiment of the present invention;

3A-3C are cross-sectional views showing the steps of forming a metallized conductive layer in a mechanical borehole in accordance with an embodiment of the present invention;

4A and 4B are schematic views showing the application of a fully-coated plastic side-mounted LED package formed by a mechanical drilling and copper foil bonding process to an optical touch screen system according to an embodiment of the present invention.

101. . . Substrate

105, 105’. . . drilling

112, 114. . . Cathode and anode electrodes

122. . . Metal wire pad

124. . . Solid crystal pad

130. . . lens

150. . . Anti-weld paint (green paint) layer

Claims (27)

A manufacturing method of a light emitting diode package structure, comprising: providing a substrate structure, wherein the substrate structure is composed of at least one substrate; forming a first conductive layer on a first surface of the substrate structure; and the substrate structure Forming a plurality of drill holes, the holes are penetrated through the substrate structure; forming a bonding layer on a second surface opposite the first surface of the substrate structure to cover one end of the holes; Forming a second conductive layer on the bonding layer; from the first side of the substrate structure, removing a portion of the bonding layer from one end of the holes; depositing a metal layer on the first of the substrate structure And forming on the inner sidewall and the bottom of the holes; respectively patterning the first and second conductive layers to form a circuit pattern on the first surface and the second surface of the substrate structure; The light emitting diode is on the second surface of the substrate structure and electrically connected to the circuit pattern; molding a glue and covering the second surface of the substrate structure; and forming along the holes An outer edge of a package region, the substrate structure is cut to form A light emitting diode package structure. The method of manufacturing a light emitting diode package structure according to claim 1, wherein the substrate comprises a PCB substrate. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the first conductive layer is a copper foil. The light emitting diode package structure as claimed in claim 1 The manufacturing method, wherein the first conductive layer is patterned into a cathode and an anode electrode. The manufacturing method of the light emitting diode package structure according to claim 1, wherein the forming steps of the holes include stacking a plurality of substrates, and simultaneously mechanically drilling the stacked substrates. hole. The method for fabricating a light emitting diode package structure according to claim 1, wherein the step of forming the adhesive layer comprises coating or forming a second surface of the substrate by using a substrate-free adhesive method. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the second conductive layer is a copper foil. The method of fabricating a light emitting diode package structure according to claim 1, wherein the second conductive layer is patterned into a solid crystal pad and a solder pad. A manufacturing method of a light emitting diode package structure, comprising: providing a substrate structure, the substrate structure is composed of at least one substrate, the substrate having a first conductive layer formed on a first surface of the substrate; Forming a plurality of holes in the substrate structure, the holes forming a package region; forming a bonding layer on a second surface opposite the first surface of the substrate structure to cover one end of the holes Forming a second conductive layer on the bonding layer; from the first side of the substrate structure, removing a portion of the bonding layer from one end of the holes; depositing a metal layer on the substrate structure a first side, and formed on the inner side wall and the bottom of the drill holes; The first and second conductive layers are respectively patterned to form a circuit pattern on the first surface and the second surface of the substrate structure; and a light emitting diode die is encapsulated on the second surface of the substrate structure, and Electrically connecting with the circuit pattern; molding a glue and covering the second side of the substrate structure; and cutting the substrate structure along the outer edge of a package region formed by the holes to form the light emitting diode Body package structure. The method of manufacturing a light emitting diode package structure according to claim 9, wherein the substrate comprises a PCB substrate. The method of manufacturing a light emitting diode package structure according to claim 9, wherein the first conductive layer is a copper foil. The method of fabricating a light emitting diode package structure according to claim 9, wherein the first conductive layer is patterned into a cathode and an anode electrode. The manufacturing method of the light emitting diode package structure according to claim 9, wherein the forming of the holes includes stacking a plurality of substrates, and simultaneously mechanically drilling the stacked substrates. hole. The method for fabricating a light-emitting diode package according to claim 9, wherein the step of forming the adhesive layer comprises coating or forming a second surface of the substrate by using a substrate-free adhesive method. The method for manufacturing a light emitting diode package structure according to claim 9, wherein the second conductive layer is a copper foil. The method of fabricating a light emitting diode package structure according to claim 9, wherein the second conductive layer is patterned into a solid crystal pad and a solder pad. A light emitting diode package structure comprising: a substrate having a plurality of quarter circular through holes disposed at a corner of the substrate; a patterned first conductive layer disposed on the substrate a patterned second conductive layer disposed on the other surface opposite to the surface of the substrate; a bonding layer disposed between the patterned second conductive layer and the surface of the substrate; a metal layer Forming on the inner sidewall of the circular through hole of the substrate; a light emitting diode chip disposed on the patterned second conductive layer, and electrically connecting the patterned first conductive layer by the metal layer a layer; and an optical lens that completely covers the wafer and the surface of the substrate. The light emitting diode package structure of claim 17, wherein the patterned first conductive layer comprises a cathode and an anode. The light emitting diode package structure of claim 18, further comprising a solder resist layer disposed between the cathode and the anode. The illuminating diode package structure of claim 17, wherein the patterned second conductive layer comprises two electrically conductive regions of different conductivity, the two conductive regions being disposed apart from each other. The light emitting diode package structure of claim 20, wherein the wafer is disposed in one of the two conductive regions, and is electrically connected to the other of the two conductive regions by a metal wire. A display device comprising: a display panel; a plurality of LED packages and a plurality of sensors, wherein the LED packages and the sensors are disposed in pairs at the corners of the display panel, and each of the LED structures is used Transmitting a light source, each of the sensors is used as an element for detecting a touch signal; wherein the light emitting diode package structure comprises: a substrate having a plurality of quarter circular through holes disposed on the substrate a patterned first conductive layer disposed on a surface of the substrate; a patterned second conductive layer disposed on the other surface opposite the substrate surface; a bonding layer disposed on the surface Between the patterned second conductive layer and the surface of the substrate; a metal layer formed on the inner sidewall of the circular via of the substrate; a light emitting diode chip disposed on the patterned second conductive And electrically connecting the patterned first conductive layer by the metal layer; and an optical lens completely covering the surface of the wafer and the substrate. The display device of claim 22, wherein the sensor is a CMOS sensor. The display device of claim 22, wherein the patterned first conductive layer comprises a cathode and an anode. The display device of claim 24, further comprising a solder resist layer disposed between the cathode and the anode. The display device of claim 22, wherein the patterned second conductive layer comprises two electrically conductive regions of different conductivity, the two conductive regions being disposed apart from each other. The display device of claim 26, wherein the wafer is disposed in one of the two conductive regions, and is electrically connected to the other of the two conductive regions by a metal wire.