TWI412768B - Inspection fixture for substrate inspection and detecting device using the inspection fixture - Google Patents
Inspection fixture for substrate inspection and detecting device using the inspection fixture Download PDFInfo
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- TWI412768B TWI412768B TW099139014A TW99139014A TWI412768B TW I412768 B TWI412768 B TW I412768B TW 099139014 A TW099139014 A TW 099139014A TW 99139014 A TW99139014 A TW 99139014A TW I412768 B TWI412768 B TW I412768B
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- 238000007689 inspection Methods 0.000 title claims abstract description 158
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 239000000523 sample Substances 0.000 claims abstract description 106
- 238000012360 testing method Methods 0.000 claims description 119
- 230000000295 complement effect Effects 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 6
- 238000003556 assay Methods 0.000 claims 4
- 230000035515 penetration Effects 0.000 abstract 2
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
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- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明係關於將待檢查物之檢查對象部上所事先設定的檢查點與檢查裝置二者電連接的檢查治具。The present invention relates to an inspection jig that electrically connects both a check point set in advance on an inspection target portion of an object to be inspected and an inspection device.
檢查治具使用在:對於待檢查物所具有的檢查對象部,從檢查裝置經由接觸件或探針,對既定檢查位置供給電流或電氣信號,同時從檢查對象部檢測出電氣信號,藉以進行檢查對象部之電氣信號的檢測、動作試驗的實施等。The inspection jig is used for supplying an electric current or an electric signal to a predetermined inspection position from the inspection device via the contact or probe, and detecting an electrical signal from the inspection target portion, thereby performing inspection on the inspection target portion of the inspection object. Detection of electrical signals in the target unit, implementation of an operation test, and the like.
就待檢查物而言,例如有印刷電路基板、撓性基板、陶瓷多層配線基板、液晶顯示器或電漿顯示器用的電極板,及半導體封裝用的封裝基板或薄膜載體等各種基板,或者半導體晶圓、半導體晶片或CSP(Chip size package,晶片尺寸封裝)等半導體裝置。Examples of the object to be inspected include a printed circuit board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, and various substrates such as a package substrate or a film carrier for semiconductor packaging, or a semiconductor crystal. A semiconductor device such as a circle, a semiconductor wafer, or a CSP (Chip size package).
本說明書中,將上述待檢查物總稱為「待檢查物」,並將待檢查物上所形成的檢查對象部稱為「對象部」。In the present specification, the object to be inspected is collectively referred to as "object to be inspected", and the portion to be inspected formed on the object to be inspected is referred to as "target portion".
例如,待檢查物為基板,而且具有搭載於基板之IC(積體電路)等半導體電路或電阻器等電氣‧電子零件時,形成在基板上的對象部為配線或電極。此時,為了確保對象部之配線能準確地傳達電氣信號到該等部份,對於安裝電氣‧電子零件前之印刷電路基板、液晶顯示器或電漿顯示器面板上所形成配線上的既定檢查點間之電阻值等電氣特性進行檢測,以判斷該配線良否。For example, when the object to be inspected is a substrate and has an electrical or electronic component such as a semiconductor circuit such as an IC (integrated circuit) mounted on the substrate or a resistor, the target portion formed on the substrate is a wiring or an electrode. In this case, in order to ensure that the wiring of the target part can accurately convey the electrical signal to the parts, between the predetermined checkpoints on the wiring formed on the printed circuit board, liquid crystal display or plasma display panel before the installation of electrical and electronic parts The electrical characteristics such as the resistance value are detected to determine whether the wiring is good or not.
具體而言,該配線良否的判定以下述方式進行:使電流供給用端子及/或電壓測定用探針的前端抵接到各檢查點,而從該探針之電流供給用端子供給檢測用電流到檢查點,同時對於抵接到檢查點之探針前端間的配線所產生的電壓進行測定,然後從該等供給電流與所測定到的電壓二者計算出既定檢查點間之配線的電阻值。Specifically, the determination of the quality of the wiring is performed by abutting the front end of the current supply terminal and/or the voltage measuring probe against each of the inspection points, and supplying the detection current from the current supply terminal of the probe. At the checkpoint, the voltage generated by the wiring between the probe tips abutting the checkpoint is measured, and then the resistance value of the wiring between the predetermined checkpoints is calculated from the supplied current and the measured voltage. .
又,使用基板檢查裝置進行檢查用基板的檢查時,進行下述控制:令治具移動機構移動以使基板檢查治具的檢查用探針(接觸銷)抵接到檢查用基板的接觸部份,藉此進行既定之檢查,且當檢查結束時,令治具移動機構移動以使檢查治具遠離檢查用基板。Further, when the inspection substrate is inspected by the substrate inspection device, the control device is moved such that the inspection probe (contact pin) of the substrate inspection jig is in contact with the contact portion of the inspection substrate. Thereby, a predetermined inspection is performed, and when the inspection is completed, the jig moving mechanism is moved to move the inspection jig away from the inspection substrate.
專利文獻1記載有檢查治具,該檢查治具包含:以支柱所固定的檢查對象之電子零件側的支持板與檢查設備側的支持板,且該檢查治具之端部固定在檢查設備側的支持板,而檢查探針的測試頭貫穿於電子零件側的支持板。Patent Document 1 discloses an inspection jig including a support plate on an electronic component side to be inspected by a support and a support plate on the inspection device side, and the end portion of the inspection jig is fixed to the inspection device side. The support plate of the inspection probe is inserted through the support plate on the side of the electronic component.
該檢查用探針具有彈性,當令檢查對象之電子零件的檢查點接觸到檢查用探針的測試頭之前端面而強力抵靠推入時,檢查用探針將因彈性而屈曲成可復原的程度。The test probe has elasticity, and when the inspection point of the electronic component to be inspected comes into contact with the front end surface of the test probe before the test head is strongly pushed against, the test probe will be flexed to a recoverable degree due to elasticity. .
【專利文獻1】日本特開2008-197009號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-197009
近年來,檢查對象之基板不斷複雜化或細微化,設定於基板的檢查點形成得更細或更小,因此檢查用探針的直徑也形成得更小。於是,在移動治具移動機構以使檢查治具的檢查用探針抵接至檢查用基板的檢查點時,該檢查用探針之前端偏離移動,晃動或振動,而有時難以使該前端準確地抵接到既定之檢查點。In recent years, the substrate to be inspected has been continuously complicated or miniaturized, and the inspection dots set on the substrate have been formed to be finer or smaller, so that the diameter of the inspection probe is also formed smaller. Then, when the jig moving mechanism moves the inspection probe of the inspection jig to the inspection point of the inspection substrate, the front end of the inspection probe is displaced, shakes or vibrates, and the front end may be difficult to be made. Accurately reach the established checkpoint.
專利文獻1中,檢查探針的測試頭從電子零件側的支持板突出,使電子零件的檢查點接觸於檢查探針的測試頭之前端面而強力抵靠,以將該測試頭推入電子零件側的支持板內,藉此使檢查探針因著彈性而撓曲。In Patent Document 1, the test head of the inspection probe protrudes from the support plate on the electronic component side, and the inspection point of the electronic component is brought into contact with the front end surface of the test head of the inspection probe to strongly abut against the test head to push the electronic component into the electronic component. In the side support plate, the inspection probe is deflected by elasticity.
因此,檢查探針貫通於設在測試頭平板的貫通孔而被固持,但是當檢查探針推壓至檢查點時,由於從測試頭平板之貫通孔出來的檢查探針的伸出量(突出量)發生變化,因此檢查探針之前端部推壓檢查點之力變化,而使檢查探針的測試頭之前端面有時未準確地接觸到電子零件的檢查點,或者在電子零件將檢查探針的測試頭之前端面向下按壓直到該電子零件抵接到電子零件側的支持板之間,有時該測試頭之前端面會從檢查點偏離移動。又,因著如上述動作,而檢查探針與測試頭平板之貫通孔的側壁之間進行滑動,檢查探針表面的電鍍剝落或者表面刮傷,為其問題。Therefore, the inspection probe is held through the through hole provided in the test head plate, but when the inspection probe is pushed to the inspection point, the amount of the inspection probe from the through hole of the test head plate is protruded (protrusion The amount) changes, so the force change at the end of the probe is pressed to check the check point, so that the front end of the test head of the test probe sometimes does not accurately touch the check point of the electronic part, or the electronic part will be inspected. The front end of the test head of the needle is pressed down until the electronic part abuts between the support plates on the side of the electronic component, and sometimes the front end face of the test head is deviated from the check point. Further, due to the above operation, the inspection probe is slid between the side wall of the through hole of the test head plate, and the plating peeling or the surface scratch of the probe surface is inspected, which is a problem.
因此,本發明之目的為:提供基板檢查用之檢查治具,其藉由使檢查用探針之前端部不偏離移動而保持在準確位置,以使該檢查用探針之前端能準確地抵接於微小檢查點的既定位置。Therefore, an object of the present invention is to provide an inspection jig for substrate inspection which is held at an accurate position by moving the front end portion of the inspection probe without deviation, so that the front end of the inspection probe can accurately reach Connected to a given location of a small checkpoint.
又,本發明之目的為:提供基板檢查用之檢查治具,其能保持使檢查用探針之前端準確地抵接於檢查用基板之檢查點的狀態。Moreover, an object of the present invention is to provide an inspection jig for inspection of a substrate which can maintain a state in which the front end of the inspection probe is accurately brought into contact with the inspection point of the inspection substrate.
又,本發明之目的為:提供基板檢查用之檢查治具,其在使檢查用探針之前端強力抵緊於檢查部時,該前端不會從檢查部偏離移動。Moreover, an object of the present invention is to provide an inspection jig for inspection of a substrate, which does not deviate from the inspection portion when the front end of the inspection probe is strongly pressed against the inspection portion.
而且,本發明之目的為:提供基板檢查用之檢查治具,其在使檢查用探針之前端抵接於檢查用基板部份時,可防止該檢查用探針之前端折彎或彎曲等的變形。Further, an object of the present invention is to provide an inspection jig for inspection of a substrate, which can prevent the front end of the inspection probe from being bent or bent when the front end of the inspection probe is brought into contact with the inspection substrate portion. The deformation.
依本發明之檢查治具使用於用來測定待檢查物之電氣特性的測定裝置,因著上述課題,該檢查治具的特徵係包含:複數之探針,分別具有用來接觸至該待檢查物之既定對象部的前端部,與電連接至該測定裝置的後端部;測試頭平板,具有供該複數之探針的該前端部貫穿的孔部;底板,具有用來將該複數之探針的該後端部電連接到該測定裝置的電極;及支持棒,具有位置確定機構;其中該位置確定機構設在該測試頭平板與該底板之間,以使該測試頭平板可從第1位置沿著軸線方向移動到第2位置,且至少於該第1位置使該測試頭平板保持於既定之位置。The inspection jig according to the present invention is used in a measuring device for measuring the electrical characteristics of an object to be inspected. According to the above problem, the inspecting jig includes: a plurality of probes respectively for contacting the to-be-inspected a front end portion of the predetermined target portion of the object and a rear end portion electrically connected to the measuring device; the test head plate having a hole portion through which the front end portion of the plurality of probes penetrates; and a bottom plate having a plurality of The rear end portion of the probe is electrically connected to the electrode of the measuring device; and the support rod has a position determining mechanism; wherein the position determining mechanism is disposed between the test head plate and the bottom plate, so that the test head plate can be The first position is moved to the second position along the axial direction, and the test head plate is held at a predetermined position at least at the first position.
該檢查治具可具有如下之互補的形狀:於該測試頭平板被保持在該第1位置時,該測試頭平板與該支持棒互相嵌合。The inspection jig may have a complementary shape in which the test head plate and the support bar are fitted to each other when the test head plate is held in the first position.
該檢查治具可具有如下之互補的形狀:於該測試頭平板被保持在該第2位置時,該測試頭平板與該支持棒互相嵌合。The inspection jig may have a complementary shape in which the test head plate and the support bar are fitted to each other when the test head plate is held in the second position.
該檢查治具所具有之該互補的形狀為:在該支持棒形成有以大圓為上底而小圓為下底之圓錐台形狀的圓錐台,並可在該測試頭平板形成有圓錐台形狀的孔部,該孔部之圓錐台形狀係對應於該圓錐台之圓錐面的形狀,以大圓為上底而小圓為下底。The complementary shape of the inspection jig is such that the support bar is formed with a truncated cone shape having a large circle as a base and a small circle as a lower base, and a truncated cone shape can be formed on the test head plate. The hole portion has a truncated cone shape corresponding to the shape of the conical surface of the truncated cone, and the large circle is the upper bottom and the small circle is the lower bottom.
該檢查治具所具有之該互補的形狀為:在該支持棒形成有以大圓為下底而小圓為上底之圓錐台形狀的圓錐台,並可在該測試頭平板形成有圓錐台形狀的孔部,該孔部之圓錐台形狀係對應於該圓錐台之圓錐面的形狀,以大圓為下底而小圓為上底。The complementary shape of the inspection jig is such that the support bar is formed with a truncated cone shape having a large circle as a lower bottom and a small circle as an upper bottom, and a truncated cone shape can be formed on the test head plate. The hole portion has a truncated cone shape corresponding to the shape of the conical surface of the truncated cone, and the large circle is the lower bottom and the small circle is the upper bottom.
該檢查治具中,環繞該支持棒設置有彈簧部,且該彈簧部可形成為使該測試頭平板朝離開該底板的方向偏壓。In the inspection jig, a spring portion is provided around the support rod, and the spring portion may be formed to bias the test head plate in a direction away from the bottom plate.
該檢查治具中,該測試頭平板形成有凹部,該探針之該前端部可從形成該凹部的底面些微突出。In the inspection jig, the test head plate is formed with a concave portion, and the front end portion of the probe may slightly protrude from a bottom surface forming the concave portion.
該基板檢查用之檢查治具中,在不貫穿於該測試頭平板之該孔部的該探針之至少一部份,可形成有較該測試頭平板之該孔部的直徑大的大直徑部,以使該大直徑部卡止於該測試頭平板。In the inspection jig for substrate inspection, at least a portion of the probe that does not penetrate through the hole portion of the test head plate may be formed with a large diameter larger than a diameter of the hole portion of the test head plate a portion such that the large diameter portion is locked to the test head plate.
又,依本發明之用來測定待檢查物之電氣特性的測定裝置,其特徵係包括檢查治具與信號控制處理裝置;其中該檢查治具包含:複數之探針,分別具有用來接觸至該待檢查物之既定對象部的前端部,與電連接至該測定裝置的後端部;測試頭平板,具有供該複數之探針的該前端部貫穿的孔部;底板,具有用來將該複數之探針的該後端部電連接到該測定裝置的電極;及支持棒,具有位置確定機構;且該位置確定機構設在該測試頭平板與該底板之間,以使該測試頭平板可從第1位置沿著軸線方向移動到第2位置,且至少於該第1位置使該測試頭平板保持於既定之位置;而該信號控制處理裝置電連接於該檢查治具之該測試頭平板的該電極,以對於用來測定該待檢查物之電氣特性的信號進行控制及處理。Further, the measuring apparatus for determining the electrical characteristics of the object to be inspected according to the present invention is characterized in that it comprises an inspection jig and a signal control processing device; wherein the inspection jig comprises: a plurality of probes each having a contact for a front end portion of the predetermined target portion of the object to be inspected and a rear end portion electrically connected to the measuring device; the test head plate has a hole portion through which the front end portion of the plurality of probes penetrates; the bottom plate has a The rear end portion of the plurality of probes is electrically connected to the electrode of the measuring device; and the support rod has a position determining mechanism; and the position determining mechanism is disposed between the test head plate and the bottom plate to enable the test head The flat plate is movable from the first position along the axial direction to the second position, and the test head plate is held at a predetermined position at least at the first position; and the signal control processing device is electrically connected to the test of the inspection jig The electrode of the head plate is controlled and processed for signals used to determine the electrical characteristics of the object to be inspected.
在此,所謂「從底面突出」,係指「從底面些微突出」。對於「些微」的上限與下限,屬於以熟悉本技藝之士的水準可依環境加以變更的設計事項。以下,在本說明書中亦同。Here, "protruding from the bottom surface" means "slightly protruding from the bottom surface". The upper and lower limits of "slightly" are design items that can be changed according to the environment to the level of the person skilled in the art. Hereinafter, the same applies to this specification.
依本發明,藉由使檢查用探針之前端部保持在準確位置,可使該檢查用探針之前端準確地抵接於微小檢查點的既定位置。According to the present invention, the front end of the test probe can be accurately brought into contact with the predetermined position of the minute check point by holding the front end portion of the test probe at an accurate position.
依本發明,能保持使檢查用探針之前端準確地抵接於檢查用基板之檢查點的狀態。According to the present invention, it is possible to maintain a state in which the front end of the inspection probe is accurately brought into contact with the inspection point of the inspection substrate.
依本發明,在使檢查用探針之前端強力抵緊於檢查部時,可防止該前端從檢查部偏離移動。According to the invention, when the front end of the test probe is strongly pressed against the inspection portion, the front end can be prevented from being displaced from the inspection portion.
又,依本發明,在使檢查用探針之前端抵接於檢查用基板部份時,可防止該檢查用探針之前端折彎或彎曲等的變形。Moreover, according to the present invention, when the front end of the test probe is brought into contact with the test substrate portion, deformation of the front end of the test probe such as bending or bending can be prevented.
而且,依本發明,在使檢查用探針之前端抵接於檢查用基板部份而進行檢查後,可輕易地去除該檢查用探針之前端所附著的氧化膜之碎片或銲錫屑等污物,或者可使該等污物容易從檢查用探針脫落。Further, according to the present invention, after the inspection probe front end is brought into contact with the inspection substrate portion and inspected, the oxide film fragments or solder chips adhering to the front end of the inspection probe can be easily removed. Or, the dirt can be easily detached from the test probe.
[檢查治具的概要][Overview of inspection jig]
圖1係顯示依本發明之一實施形態的檢查治具10之部份剖面的側面概略圖。又,為了便於理解,全圖中之各構件的厚度、長度、形狀、構件間的間隔、間隙等,適當加以放大、縮小、變形、簡略化等。又,說明圖式時之上下、左右的表現,係表示面向該圖之狀態下的位置關係。Fig. 1 is a schematic side view showing a part of a cross section of an inspection jig 10 according to an embodiment of the present invention. Moreover, in order to facilitate understanding, the thickness, the length, the shape, the interval between the members, the gap, and the like of the respective members in the full drawing are appropriately enlarged, reduced, deformed, simplified, and the like. In addition, the expression of the top, bottom, left and right in the drawing will be described, and the positional relationship in the state of the figure will be shown.
檢查治具10包含:測試頭平板11、底板14、基座15及支持棒13。測試頭平板11、底板14及基座15係由樹脂材料等絕緣材料構成的板狀構件。支持棒13之後端部貫通底板14而固定於基座15。支持棒13之前端部如後所述,以測試頭平板11可沿支持棒13移動的方式安裝於測試頭平板11。又,環繞支持棒13設置有彈簧構件12,而將測試頭平板11沿支持棒13之軸線朝著圖1的上方偏壓。The inspection jig 10 includes a test head plate 11, a bottom plate 14, a base 15, and a support rod 13. The test head flat plate 11, the bottom plate 14, and the base 15 are plate-like members made of an insulating material such as a resin material. The rear end of the support rod 13 passes through the bottom plate 14 and is fixed to the base 15. The front end of the support rod 13 is attached to the test head plate 11 in such a manner that the test head plate 11 can be moved along the support bar 13 as will be described later. Further, the surrounding support bar 13 is provided with the spring member 12, and the test head plate 11 is biased toward the upper side of FIG. 1 along the axis of the support bar 13.
至於測試頭平板11,簡略說明之,係形成有複數之貫通孔11h,且貫通孔11h插入有探針17之前端部17a,而如後所述,該前端部17a被該貫通孔引導向基板等檢查對象物的檢查點。不過,前端部17a雖如後述從貫通孔11h突出,但較佳係不從測試頭平板11之頂面突出,而保持於從該頂面縮入的位置。As for the test head plate 11, a plurality of through holes 11h are formed, and the through holes 11h are inserted into the front end portion 17a of the probe 17, and the front end portion 17a is guided to the substrate by the through holes as will be described later. Check the checkpoint of the object. However, the distal end portion 17a protrudes from the through hole 11h as will be described later, but preferably does not protrude from the top surface of the test head flat plate 11, but is held at a position retracted from the top surface.
測試頭平板11如圖1所示,由3片的板片11a、11b、11c構成,且該等板片11a、11b、11c相互固定。又,詳如後述,該等板片形成有構成貫通孔11h的貫通孔11ah、11bh、11ch。As shown in FIG. 1, the test head flat plate 11 is composed of three sheets 11a, 11b, and 11c, and the sheets 11a, 11b, and 11c are fixed to each other. Further, as will be described later, the above-mentioned sheets are formed with through holes 11ah, 11bh, and 11ch constituting the through holes 11h.
底板14及基座15分別形成有貫通孔14h、15h。底板14的貫通孔14h插入有探針之後端部17b,而基座15的貫通孔15h嵌入有電極15b。該電極15b電連接著探針17之後端部17b。又,電極15b連接著電線16,該電線16通過基座15中而配線,且電連接至未圖示之用來進行電氣特性等檢查的掃描器。又,在此將底板與基座二者作為個別構件來進行說明,但也可在底板設置電極而省略基座。Through holes 14h and 15h are formed in the bottom plate 14 and the base 15 respectively. The probe rear end portion 17b is inserted into the through hole 14h of the bottom plate 14, and the electrode 15b is embedded in the through hole 15h of the base 15. The electrode 15b is electrically connected to the end portion 17b of the probe 17. Further, the electrode 15b is connected to the electric wire 16, which is wired through the susceptor 15, and is electrically connected to a scanner (not shown) for performing inspections such as electrical characteristics. Although the bottom plate and the pedestal are described as individual members, the electrodes may be provided on the bottom plate to omit the susceptor.
探針17之直徑為例如約40至60μm,該探針17可使用例如由不銹鋼構成之具有彈性的鋼琴線或鎢(W)等,且較佳係對於除前端部及後端部外的周面施以絕緣被覆。The probe 17 has a diameter of, for example, about 40 to 60 μm, and the probe 17 can use, for example, an elastic piano wire or tungsten (W) made of stainless steel, and is preferably a circumference other than the front end portion and the rear end portion. The surface is covered with insulation.
尤其,在此雖未圖示,形成有絕緣被覆部的探針17之直徑,較佳係形成為比至少任一個貫通孔11ah、11bh、11ch大。此係由於藉著如此形成,而使探針17確實地卡止在貫通孔。又,如圖1所示,由於探針17彎曲而被固持,因此探針17也能卡止固定於貫通孔11h之側壁。例如,可在探針17的該部份形成突出狀部份,或使該部份之直徑增大,或者使該部份之絕緣被覆的厚度加厚。In particular, although not shown, the diameter of the probe 17 in which the insulating coating portion is formed is preferably larger than at least one of the through holes 11ah, 11bh, and 11ch. By doing so, the probe 17 is surely locked in the through hole. Further, as shown in Fig. 1, since the probe 17 is bent and held, the probe 17 can be locked and fixed to the side wall of the through hole 11h. For example, a protruding portion may be formed in the portion of the probe 17, or the diameter of the portion may be increased, or the thickness of the insulating coating of the portion may be increased.
如上述,探針17由於卡止固定在貫通孔11h,因此從貫通孔11h伸出的突出量至少不會比卡止時的突出量多。因此可使推壓力保持於一定。As described above, since the probe 17 is fixed to the through hole 11h by the locking, the amount of protrusion from the through hole 11h is at least not larger than the amount of protrusion at the time of locking. Therefore, the pressing force can be kept constant.
於基板檢查時,探針17可在測試頭平板11與底板14二者間的空間彎曲,並藉著其傾向於恢復成直線狀的偏壓力,可使探針17之前端部以適當的壓力抵靠於既定之檢查點(對象部),同時可使探針17之後端部以適當的壓力抵靠於電極15b。At the time of substrate inspection, the probe 17 can be bent in the space between the test head plate 11 and the bottom plate 14, and by virtue of the tendency to return to a linear biasing force, the front end of the probe 17 can be appropriately pressurized. Abut against a predetermined check point (object portion), the end portion of the probe 17 can be made to abut against the electrode 15b with an appropriate pressure.
圖2A係將圖1中用短劃線20圍住之位置加以放大的前視圖(包含部份剖面圖)。圖2B係從圖2A僅取出支持棒13。圖2C係用以說明測試頭平板11移動時的狀態。Figure 2A is a front elevational view (including a partial cross-sectional view) of the position enclosed by the dashed line 20 in Figure 1. Fig. 2B is only the support rod 13 taken out from Fig. 2A. Fig. 2C is a view for explaining the state when the test head plate 11 is moved.
如圖2B所清楚顯示,支持棒13之前端部份由下列部份構成:第1位置確定部13a,呈圓錐台形狀,配置成以大圓為上底而小圓為下底;第2位置確定部13c,呈圓錐台形狀,配置成以小圓為上底而大圓為下底;及導引部13b,呈圓柱狀,連結第1位置確定部13a與第2位置確定部13c二者。As clearly shown in Fig. 2B, the front end portion of the support rod 13 is composed of the first portion: the first position determining portion 13a has a truncated cone shape, and is arranged such that the large circle is the upper base and the small circle is the lower base; the second position is determined. The portion 13c has a truncated cone shape, and is arranged such that the small circle is the upper base and the large circle is the lower base. The guide portion 13b has a columnar shape and connects both the first position determining portion 13a and the second position determining portion 13c.
又,如圖2A所示,測試頭平板11的板片11a形成有孔部,該孔部的形狀對應於第1位置確定部13a之上底與下底二者間的圓錐面的形狀;測試頭平板11的板片11c也形成有孔部,該孔部的形狀則對應於第2位置確定部13c之上底與下底二者間的圓錐面的形狀。因此,當第1位置確定部13a嵌入板片11a的該孔部時,板片11a的位置將確定於一定位置;又如圖2C所示,當板片11c下降,而第2位置確定部13c嵌入板片11c的孔部時,板片11c的位置將確定於一定位置。藉由該等位置的確定,而使得固持在測試頭平板11的探針17之前端部17a於各個情形下確實地保持在既定之位置。亦即,可將探針17之前端部17a準確地配置在既定之位置。Further, as shown in FIG. 2A, the plate piece 11a of the test head plate 11 is formed with a hole portion whose shape corresponds to the shape of a conical surface between the upper bottom and the lower bottom of the first position determining portion 13a; The plate piece 11c of the head plate 11 is also formed with a hole portion whose shape corresponds to the shape of a conical surface between the upper bottom and the lower bottom of the second position determining portion 13c. Therefore, when the first position determining portion 13a is fitted into the hole portion of the sheet piece 11a, the position of the sheet piece 11a is determined at a certain position; and as shown in Fig. 2C, when the sheet piece 11c is lowered, the second position determining portion 13c When the hole portion of the sheet piece 11c is fitted, the position of the sheet piece 11c is determined at a certain position. By the determination of the positions, the end portion 17a of the probe 17 held by the test head plate 11 is surely held in a predetermined position in each case. That is, the front end portion 17a of the probe 17 can be accurately placed at a predetermined position.
又,測試頭平板11的板片11b形成有圓錐形狀的孔部,該孔部呈圓錐形狀,係對應於導引部13b之外周面的形狀,以使導引部13b可於該孔部內沿軸線方向移動。又,當導引部13b之外周面與形成孔部之面二者間的間隙大時,在板片11b沿導引部13b移動時,會發生該板片晃動恰該間隙之距離的情形。因著該晃動,使得固持在測試頭平板11的探針17之前端部17a的位置依間隙大小而大幅晃動,因此該間隙較佳為小間隙。Further, the plate 11b of the test head plate 11 is formed with a conical hole portion having a conical shape corresponding to the outer peripheral surface of the guide portion 13b so that the guide portion 13b can be inside the hole portion. Move in the direction of the axis. Further, when the gap between the outer peripheral surface of the guide portion 13b and the surface on which the hole portion is formed is large, when the sheet piece 11b moves along the guide portion 13b, the sheet may be shaken by the distance of the gap. Due to this shaking, the position of the end portion 17a of the probe 17 held by the test head flat plate 11 is largely shaken by the size of the gap, and therefore the gap is preferably a small gap.
利用支持棒13的第1位置確定部13a,和測試頭平板11之具有與該位置確定部13a對應的互補形狀的孔部二者,並利用支持棒13的第2位置確定部13c,和測試頭平板11之具有與該位置確定部13c對應的互補形狀的孔部二者,分別構成位置確定機構。The first position determining portion 13a of the support rod 13 and the hole portion of the test head plate 11 having the complementary shape corresponding to the position determining portion 13a are used, and the second position determining portion 13c of the support rod 13 is used, and the test is performed. The head plate 11 has both complementary hole portions corresponding to the position determining portion 13c, and constitutes a position determining mechanism.
如圖2A及圖2C所示,測試頭平板11的板片11a之頂面固定有載置檢查基板40之一部份的基板固持部11u;且如圖2C所示,隨著檢查基板40向下按壓,測試頭平板11被一同向下按壓。因此,支持棒13的第2位置確定部13c嵌入板片11c的孔部,而將板片11c的位置確定於既定之位置。又,因著測試頭平板11被向下按壓,使彈簧部12被向下按壓而收縮,因此彈簧部12具有將測試頭平板11推回的偏壓力。As shown in FIG. 2A and FIG. 2C, the top surface of the plate 11a of the test head plate 11 is fixed with a substrate holding portion 11u on which a portion of the inspection substrate 40 is placed; and as shown in FIG. 2C, along with the inspection substrate 40 Pressing down, the test head plate 11 is pressed down together. Therefore, the second position determining portion 13c of the support rod 13 is fitted into the hole portion of the plate piece 11c, and the position of the plate piece 11c is determined at a predetermined position. Further, since the test head plate 11 is pressed downward and the spring portion 12 is pressed downward to contract, the spring portion 12 has a biasing force for pushing the test head plate 11 back.
也就是說,測試頭平板11可於圖2A的位置(第1位置)與圖2C的位置(第2位置)之間往返移動。此時,若是圖2A的位置,檢查基板40之既定檢查點未接觸到探針17之前端部17a,或者處於僅接觸而未受推壓力的狀態。又,若是圖2C的位置,測試頭平板11最是被向下按壓,而使探針17之前端部17a處於以最適當的推壓力抵緊至檢查基板40之檢查點之適當位置的狀態。That is, the test head plate 11 can reciprocate between the position (first position) of FIG. 2A and the position (second position) of FIG. 2C. At this time, if it is the position of FIG. 2A, the predetermined inspection point of the inspection substrate 40 does not contact the front end portion 17a of the probe 17, or is in a state of being contacted only without being pressed. Further, in the position of Fig. 2C, the test head flat plate 11 is most pressed downward, and the front end portion 17a of the probe 17 is in a state of being pressed to the proper position of the inspection point of the inspection substrate 40 with the most appropriate pressing force.
如圖2A所示,作為在測試頭平板11安裝支持棒13的方法,可使用下述方法:將例如支持棒13的第1位置確定部13a以與導引部13b另成一體之方式形成,並在例如第1位置確定部13a安裝外螺紋,在導引部13b形成與其嵌合的內螺紋;於未安裝第1位置確定部13a的狀態下,以導引部13b為前端將支持棒13插入測試頭平板11的貫通孔11h,然後將第1位置確定部13a的外螺紋鎖入導引部13b的內螺紋,以將第1位置確定部13a固定在導引部13b。As shown in FIG. 2A, as a method of attaching the support rod 13 to the test head flat plate 11, a method in which the first position determining portion 13a such as the support rod 13 is integrally formed with the guide portion 13b can be used. For example, the external thread is attached to the first position specifying portion 13a, and the internal thread is fitted to the guide portion 13b. The support rod 13 is supported by the guide portion 13b in a state where the first position specifying portion 13a is not attached. The through hole 11h of the test head plate 11 is inserted, and the external thread of the first position specifying portion 13a is locked into the internal thread of the guide portion 13b to fix the first position specifying portion 13a to the guide portion 13b.
圖3係將圖1之基板檢查用之檢查治具10中用短劃線30所示部份加以放大的前視圖(包含部份剖面圖)。如圖3所示,測試頭平板11的板片11a、11b、11c分別形成有貫通孔11ah、11bh、11ch。該等孔部對齊,且該等孔部貫穿有探針17。該等貫通孔之直徑可為例如約40~100μm內的任意大小。Fig. 3 is a front elevational view (including a partial cross-sectional view) showing an enlarged portion of the inspection jig 10 for inspection of the substrate of Fig. 1 by a dashed line 30. As shown in FIG. 3, the sheets 11a, 11b, and 11c of the test head flat plate 11 are formed with through holes 11ah, 11bh, and 11ch, respectively. The holes are aligned, and the holes 17 are inserted through the holes. The diameter of the through holes may be any size within a range of, for example, about 40 to 100 μm.
又,如圖3所示,板片11a、11b、11c分別形成有大直徑的預備孔22、23、24。大直徑的預備孔22、23、24係使各板片具有厚度以確保一定強度,另一方面用來使貫通孔11ah、11bh、11ch容易形成,因此依板片之厚度,該等預備孔並非必要形成。Further, as shown in FIG. 3, the plates 11a, 11b, and 11c are formed with large-diameter preliminary holes 22, 23, and 24, respectively. The large-diameter preliminary holes 22, 23, and 24 are such that the plates have a thickness to ensure a certain strength, and on the other hand, the through holes 11ah, 11bh, and 11ch are easily formed. Therefore, the preliminary holes are not formed according to the thickness of the plate. Necessary to form.
測試頭平板11的板片11a之頂面形成有凹部21。插入板片11a之孔部的探針17之前端部17a,從形成凹部21的底面突出,但是位於較板片11a之頂面下方處。凹部21之深度例如為100~200μm,且如後所述,該凹部可供檢查基板40的檢查點之凸塊42(圖4)進入。又,從該凹部21之底面到探針17的前端部17a之前端面為止的距離,例如為50~100μm。A concave portion 21 is formed on the top surface of the sheet 11a of the test head flat plate 11. The front end portion 17a of the probe 17 inserted into the hole portion of the plate piece 11a protrudes from the bottom surface on which the concave portion 21 is formed, but is located below the top surface of the opposite piece 11a. The depth of the concave portion 21 is, for example, 100 to 200 μm, and as will be described later, the concave portion can be entered by the bump 42 (Fig. 4) of the inspection point of the inspection substrate 40. Moreover, the distance from the bottom surface of the concave portion 21 to the front end surface of the distal end portion 17a of the probe 17 is, for example, 50 to 100 μm.
為說明測試頭平板11與探針17的關係,圖4A及圖4B係從圖3所示部份抽出一部份加以顯示的前視圖(包含部份剖面圖)。To illustrate the relationship between the test head plate 11 and the probe 17, FIGS. 4A and 4B are front views (including partial cross-sectional views) which are extracted from a portion shown in FIG.
圖4A中,檢查基板40接近測試頭平板11的板片11a,但尚未與其接觸,而檢查治具10處於待開始檢查的狀態。又,如該圖所示,板片11a之頂面形成有凹部21,探針17之前端部17a從凹部21之底面向上方僅突出些微的長度。此狀態下,測試頭平板11與支持棒13二者形成圖2A所示的位置關係。亦即,由於使板片11a保持在確定的位置,因此探針17之前端部17a處於準確地保持在既定位置的狀態。In Fig. 4A, the inspection substrate 40 is brought close to the sheet 11a of the test head flat plate 11, but has not yet been in contact therewith, and the inspection jig 10 is in a state to be inspected. Further, as shown in the figure, the top surface of the plate piece 11a is formed with a concave portion 21, and the front end portion 17a of the probe 17 protrudes only slightly from the bottom surface of the concave portion 21 to a slight length. In this state, both the test head plate 11 and the support rod 13 form the positional relationship shown in Fig. 2A. That is, since the sheet piece 11a is held at the determined position, the front end portion 17a of the probe 17 is in a state of being accurately held at a predetermined position.
又,圖4A中雖未圖示,在探針17位於較板片11c之孔部下方的部份,形成比該孔部之直徑大的大直徑部。Further, although not shown in Fig. 4A, the probe 17 is located at a portion below the hole portion of the plate piece 11c, and a large diameter portion larger than the diameter of the hole portion is formed.
圖4B中,探針17之前端部17a抵接於檢查基板40上之配線圖案的凸塊42,而且隨著檢查基板40下降,測試頭平板11被向下按壓恰距離S。此時,如圖2C所示,支持棒13的位置確定部13c嵌合於板片11c之圓錐台形狀的孔部。In Fig. 4B, the front end portion 17a of the probe 17 abuts against the bump 42 of the wiring pattern on the inspection substrate 40, and as the inspection substrate 40 is lowered, the test head flat plate 11 is pressed downward by a proper distance S. At this time, as shown in FIG. 2C, the position determining portion 13c of the support rod 13 is fitted to the hole portion of the truncated cone shape of the plate piece 11c.
此時,測試頭平板11與底板14之間雖縮短距離S,但由於大直徑部卡止在測試頭平板11的板片11c之底面側,因此探針17彎曲而吸收該距離S的變化量。另一方面,於探針17之前端部17a抵接至凸塊42後,如上所述,由於大直徑部卡止在板片11c之底面側,因此探針17之前端部17a從凹部21之底面突出的量不會變化。於是,在前端部17a被凸塊按壓而移動時,可防止該前端部17a從該凸塊之表面的既定位置偏離等。At this time, although the distance S between the test head plate 11 and the bottom plate 14 is shortened, since the large diameter portion is locked to the bottom surface side of the plate 11c of the test head flat plate 11, the probe 17 is bent to absorb the amount of change in the distance S. . On the other hand, after the end portion 17a of the probe 17 abuts against the bump 42, as described above, since the large diameter portion is locked to the bottom surface side of the plate piece 11c, the front end portion 17a of the probe 17 is from the concave portion 21 The amount of protrusion of the bottom surface does not change. Then, when the distal end portion 17a is pressed and moved by the projection, it is possible to prevent the distal end portion 17a from being displaced from a predetermined position on the surface of the projection or the like.
於圖4B所示狀態下,接下來自未圖示的掃描器經由複數之探針17而依序對複數之凸塊42選擇性地供給檢查用信號,同時從該等凸塊42接收檢查用信號,藉此可檢查出複數之凸塊42間的配線電阻值,或者判斷有無導通。In the state shown in FIG. 4B, the inspection signal is selectively supplied to the plurality of bumps 42 sequentially from the scanner (not shown) via the plurality of probes 17, and the inspection is received from the bumps 42. The signal can be used to check the wiring resistance value between the plurality of bumps 42 or to determine whether or not there is conduction.
[另一實施形態][Another embodiment]
圖5係顯示圖2A至圖2C所示部份的另一實施形態。如該圖所示,支持棒13-1由下列部份構成:位置確定部13a-1,呈圓錐台形狀,配置成以大圓為上底而小圓為下底;及圓柱狀的導引部13b-1;而不包含相當於圖2A等之支持棒13的圓錐台形狀之第2位置確定部13c的構成。Fig. 5 is a view showing another embodiment of the portion shown in Figs. 2A to 2C. As shown in the figure, the support rod 13-1 is composed of a position determining portion 13a-1 which has a truncated cone shape and is arranged with a large circle as an upper base and a small circle as a lower base; and a cylindrical guide portion. 13b-1; does not include the configuration of the second position determining portion 13c corresponding to the truncated cone shape of the support rod 13 of Fig. 2A.
又,圖5之實施形態中,測試頭平板11-1由相互固定的板片11a-1、11b-1、11c-1構成。測試頭平板11-1的板片11a-1形成有孔部,該孔部的形狀對應於位置確定部13a-1之上底與下底二者間的圓錐面的形狀;板片11b-1及11c-1也形成有孔部,該孔部的形狀則對應於導引部13b-1之外周面的形狀,而使導引部13b-1可於該孔部內移動。Further, in the embodiment of Fig. 5, the test head plate 11-1 is constituted by the plates 11a-1, 11b-1, and 11c-1 which are fixed to each other. The plate 11a-1 of the test head plate 11-1 is formed with a hole portion having a shape corresponding to the shape of a conical surface between the upper bottom and the lower bottom of the position determining portion 13a-1; the plate 11b-1 And 11c-1 is also formed with a hole portion whose shape corresponds to the shape of the outer peripheral surface of the guide portion 13b-1, and the guide portion 13b-1 is movable in the hole portion.
圖5之實施形態中,雖未圖示,係與圖2A之實施形態相同,環繞支持棒13-1設置有彈簧部12,而使測試頭平板11-1通常朝上方偏壓。In the embodiment of Fig. 5, although not shown, the spring portion 12 is provided around the support bar 13-1, and the test head plate 11-1 is normally biased upward as shown in the embodiment of Fig. 2A.
又,圖5之實施形態還與圖2A之實施形態相同,當導引部13b-1之外周面與板片11b-1及11c-1的孔部之間的間隙大時,因著板片11b-1及11c-1沿導引部13b-1移動時晃動恰該間隙的大小,使得固持在測試頭平板11-1的探針17之前端部17a的位置大幅晃動,因此該間隙較佳為小間隙。Further, the embodiment of Fig. 5 is the same as the embodiment of Fig. 2A, and the gap between the outer peripheral surface of the guide portion 13b-1 and the hole portions of the plates 11b-1 and 11c-1 is large due to the plate. When 11b-1 and 11c-1 move along the guiding portion 13b-1, the size of the gap is swayed so that the position of the end portion 17a of the probe 17 held by the test head plate 11-1 is greatly shaken, so that the gap is preferably For small gaps.
圖5中,實線所示支持棒13-1的位置對應於圖2A中之支持棒13的位置,係探針17之前端部17a接觸到檢查基板40的檢查點例如凸塊,但是該前端部處於尚未被向下按壓的狀態。於該位置,利用未圖示的彈簧部,將測試頭平板11-1往上推,因此支持棒13-1的位置確定部13a-1嵌入板片11a-1的孔部,藉此可將測試頭平板11-1的位置確定在一定位置。因此,探針17之前端部17a的位置也被確定在既定位置。In Fig. 5, the position of the support rod 13-1 shown by the solid line corresponds to the position of the support rod 13 in Fig. 2A, and the front end portion 17a of the probe 17 is in contact with a check point such as a bump of the inspection substrate 40, but the front end The department is in a state that has not been pressed down. At this position, the test head flat plate 11-1 is pushed up by a spring portion (not shown), so that the position determining portion 13a-1 of the support rod 13-1 is fitted into the hole portion of the plate piece 11a-1, whereby The position of the test head plate 11-1 is determined at a certain position. Therefore, the position of the front end portion 17a of the probe 17 is also determined at a predetermined position.
另一方面,虚線所示支持棒13-1的位置對應於圖2C中之支持棒13的位置,係於檢查基板40之底面抵接到基板固持部11u-1,同時探針17之前端部17a抵接到檢查基板40上之配線圖案的凸塊42的狀態下,凸塊42及檢查基板40分別對探針17之前端部17a及基板固持部11u-1施加推壓力,而將測試頭平板11-1向下按壓。其結果,導引部13b-1沿板片11b-1及11c-1的孔部移動。On the other hand, the position of the support rod 13-1 shown by the broken line corresponds to the position of the support rod 13 in Fig. 2C, and the bottom surface of the inspection substrate 40 abuts against the substrate holding portion 11u-1 while the front end of the probe 17 In a state in which the portion 17a is in contact with the bump 42 of the wiring pattern on the inspection substrate 40, the bump 42 and the inspection substrate 40 respectively apply a pressing force to the front end portion 17a of the probe 17 and the substrate holding portion 11u-1, and the test is performed. The head plate 11-1 is pressed downward. As a result, the guide portion 13b-1 moves along the hole portions of the plates 11b-1 and 11c-1.
圖6A係用以顯示依本發明另一實施例之支持棒13-2的前視圖(包含部份剖面圖)。支持棒13-2包含:柱塞61,固定於測試頭平板11;止動部62,與該柱塞61卡合;及圓筒狀的本體部63。圖6B係從圖6A抽出止動部62加以顯示的放大圖。Figure 6A is a front elevational view (including a partial cross-sectional view) showing a support rod 13-2 in accordance with another embodiment of the present invention. The support rod 13-2 includes a plunger 61 fixed to the test head flat plate 11 , a stopper portion 62 engaged with the plunger 61 , and a cylindrical body portion 63 . Fig. 6B is an enlarged view showing the stopper 62 taken out from Fig. 6A.
止動部62由卡止部62a與本體部62b構成,且該止動部62之內部形成有用來使柱塞61可任意移動的貫通孔62in。位於本體部62b之下端面的貫通孔62in具有傾斜面62c。傾斜面62c的傾斜角度例如圖6B所示,可形成為位在對向位置的傾斜面62c之延長線以約90度相交。The stopper portion 62 is constituted by the locking portion 62a and the body portion 62b, and a through hole 62in for arbitrarily moving the plunger 61 is formed inside the stopper portion 62. The through hole 62in located at the lower end surface of the main body portion 62b has an inclined surface 62c. The inclination angle of the inclined surface 62c is, for example, as shown in Fig. 6B, and can be formed so as to intersect at an extension of the inclined surface 62c at the opposite position by about 90 degrees.
止動部62的卡止部62a卡止於圓筒狀之本體部63的上端部,並將圓筒狀之本體部63的縮窄部63p與止動部62的縮窄部62p二者加以例如斂縫,因此圓筒狀之本體部63固定於止動部62。The locking portion 62a of the stopper portion 62 is locked to the upper end portion of the cylindrical body portion 63, and both the narrowed portion 63p of the cylindrical body portion 63 and the narrowed portion 62p of the stopper portion 62 are attached. For example, the caulking is performed, so that the cylindrical body portion 63 is fixed to the stopper portion 62.
柱塞61由連結部61a、傾斜部61b、導引61c及突出部61d構成。連結部61a具有可於止動部62之貫通孔62in內移動的大小的外徑,且連結部61a內部形成有用來例如以螺絲固定於測試頭平板11的內螺紋61in。The plunger 61 is composed of a coupling portion 61a, an inclined portion 61b, a guide 61c, and a protruding portion 61d. The coupling portion 61a has an outer diameter that is movably movable in the through hole 62in of the stopper portion 62, and an internal thread 61in for fixing to the test head flat plate 11 by, for example, a screw is formed inside the coupling portion 61a.
柱塞61的傾斜部61b形成為與止動部62之貫通孔62in的傾斜面62c卡合的角度。又,柱塞61的導引部61c可於圓筒狀之本體部63內部的貫通孔內移動。The inclined portion 61b of the plunger 61 is formed at an angle that engages with the inclined surface 62c of the through hole 62in of the stopper portion 62. Further, the guide portion 61c of the plunger 61 is movable in the through hole inside the cylindrical body portion 63.
本體部63內部的貫通孔配置有線圈狀形成的彈簧部63s,該彈簧部63s之下端部卡止於本體部63的突出部,而上端部抵接於柱塞61之導引部61c的底面。彈簧部63s產生將導引部61c往上推的偏壓力,因此導引部61c被往上推,而使柱塞61的傾斜部61b與止動部62之貫通孔62in的傾斜面62c卡合。因著該卡合,柱塞61的位置得以確定。A spring portion 63s formed in a coil shape is disposed in a through hole in the main body portion 63. The lower end portion of the spring portion 63s is locked to the protruding portion of the main body portion 63, and the upper end portion abuts against the bottom surface of the guiding portion 61c of the plunger 61. . The spring portion 63s generates a biasing force for pushing the guide portion 61c upward, so that the guide portion 61c is pushed upward, and the inclined portion 61b of the plunger 61 is engaged with the inclined surface 62c of the through hole 62in of the stopper portion 62. . Due to this engagement, the position of the plunger 61 is determined.
依圖6的實施例,柱塞61之上端面係例如以螺絲固定於測試頭平板11,且於基板檢查前,因著彈簧部63s的偏壓力,使柱塞61的傾斜部61b與止動部62之貫通孔62in的傾斜面62c卡合。藉此,可使探針前端的位置保持於既定之位置。According to the embodiment of Fig. 6, the upper end surface of the plunger 61 is fixed to the test head flat plate 11 by screws, for example, and the inclined portion 61b of the plunger 61 is stopped by the biasing force of the spring portion 63s before the substrate inspection. The inclined surface 62c of the through hole 62in of the portion 62 is engaged. Thereby, the position of the probe tip can be maintained at a predetermined position.
於檢查時,當柱塞61與測試頭平板一同被向下按壓時,導引部61c將反抗彈簧部63s的偏壓力而向下按壓,因此傾斜部61b離開傾斜面62c。At the time of inspection, when the plunger 61 is pressed downward together with the test head flat plate, the guide portion 61c presses down against the biasing force of the spring portion 63s, so that the inclined portion 61b is separated from the inclined surface 62c.
當檢查結束時,由於測試頭平板回到原來的位置,因此導引部61c被彈簧部63s的偏壓力推回,而使傾斜部61b卡合於傾斜面62c。藉此,可再度使探針前端的位置保持於既定之位置。When the inspection is completed, since the test head plate returns to the original position, the guide portion 61c is pushed back by the biasing force of the spring portion 63s, and the inclined portion 61b is engaged with the inclined surface 62c. Thereby, the position of the probe tip can be again maintained at a predetermined position.
圖7係依圖1之檢查治具10之另一實施形態的檢查治具10-1。檢查治具10-1更包含依另一實施例的支持棒13-3,此係與檢查治具10不同之處。Fig. 7 is an inspection jig 10-1 according to another embodiment of the inspection jig 10 of Fig. 1. The inspection jig 10-1 further includes a support rod 13-3 according to another embodiment, which is different from the inspection jig 10.
支持棒13-3包含:本體部13-3d;彈性部13-3r,可沿該支持棒的軸線方向任意伸縮;及軸心部13-3c,用以防止該彈性部13-3r收縮時折彎或扭歪。彈性部13-3r由例如橡膠構件構成,而當推壓力從兩側沿著軸線方向加大時,該橡膠構件就會收縮,並當該推壓力解除時就能恢復到原來的狀態。又,支持棒13-3的上端部固定於由相互固定之板片11a-2、11b-2、11c-2所構成的測試頭平板11-2。The support rod 13-3 includes: a body portion 13-3d; an elastic portion 13-3r arbitrarily expandable and contractible along an axial direction of the support rod; and a shaft center portion 13-3c for preventing the elastic portion 13-3r from being bent when contracted Or twist. The elastic portion 13-3r is composed of, for example, a rubber member, and when the pressing force is increased from both sides in the axial direction, the rubber member is contracted, and when the pressing force is released, the original state can be restored. Further, the upper end portion of the support rod 13-3 is fixed to the test head flat plate 11-2 composed of the mutually fixed plates 11a-2, 11b-2, and 11c-2.
依圖7之實施形態,當放下檢查基板40時,檢查基板40之底面抵接至測試頭平板11-2之板片11a-2的頂面,與此同時,探針17之前端部17a抵接至檢查基板40上之配線圖案的凸塊42。此時,由於支持棒13-3的上端部固定於由相互固定之板片11a-2、11b-2、11c-2所構成的測試頭平板11-2,因此探針17之前端部17a能準確地抵接到凸塊42的既定位置。According to the embodiment of Fig. 7, when the inspection substrate 40 is lowered, the bottom surface of the inspection substrate 40 abuts against the top surface of the plate 11a-2 of the test head flat plate 11-2, and at the same time, the front end portion 17a of the probe 17 abuts. The bump 42 is connected to the wiring pattern on the inspection substrate 40. At this time, since the upper end portion of the support rod 13-3 is fixed to the test head flat plate 11-2 composed of the mutually fixed plates 11a-2, 11b-2, 11c-2, the front end portion 17a of the probe 17 can be Accurately abuts the predetermined position of the bump 42.
於此狀態下,當放下檢查基板40,而將測試頭平板11-2向下推壓時,彈性部13-3r會沿軸心部13-3c收縮。此時,測試頭平板11-2與底板14之間的距離縮短恰彈性部13-3r的收縮量,因此探針17彎曲而吸收該距離的縮短量。藉著該探針所具有的彎曲恢復力,能使探針17之前端部17a以適當壓力抵緊到凸部,同時也能使探針17之後端部17b抵緊到電極部15b。In this state, when the inspection substrate 40 is lowered and the test head flat plate 11-2 is pushed downward, the elastic portion 13-3r is contracted along the axial center portion 13-3c. At this time, the distance between the test head plate 11-2 and the bottom plate 14 is shortened by the amount of contraction of the elastic portion 13-3r, so that the probe 17 is bent to absorb the shortening amount of the distance. By the bending restoring force of the probe, the front end portion 17a of the probe 17 can be pressed against the convex portion with an appropriate pressure, and the rear end portion 17b of the probe 17 can be brought into contact with the electrode portion 15b.
另一方面,當升高檢查基板40時,測試頭平板11-2因彈性部13-3r的彈性力而恢復到原來的位置。On the other hand, when the inspection substrate 40 is raised, the test head flat plate 11-2 is returned to the original position due to the elastic force of the elastic portion 13-3r.
依上述實施形態,在探針之前端部接觸至檢查點時,由於支持棒13-3保持於既定之位置,因此測試頭平板不會產生晃動,而使探針之前端部可抵接於檢查點之準確的位置。According to the above embodiment, when the tip end of the probe is in contact with the inspection point, since the support rod 13-3 is held at a predetermined position, the test head plate does not sway, and the front end portion of the probe can abut against the inspection. The exact location of the point.
又,即便於該抵接後,也由於檢查點及探針同時沿著軸心部13-3c移動,因此檢查點與探針之間不會產生橫向滑動。Further, even after the abutment, since the inspection point and the probe move along the axial center portion 13-3c at the same time, lateral sliding does not occur between the inspection point and the probe.
又,上述實施形態中,已揭示凹部21供一個凸塊42收納的構成,但凹部21的大小並不限於此,可具有能收納好幾個凸塊的大小。Further, in the above-described embodiment, the configuration in which the concave portion 21 is accommodated by one projection 42 has been disclosed. However, the size of the concave portion 21 is not limited thereto, and may have a size in which several projections can be accommodated.
以上,已針對依本發明之基板檢查用的檢查治具之若干實施形態進行說明,但本發明並不限於該等實施形態,係熟悉本技藝之士可輕易完成的追加、刪除、修改等亦包含於本發明;又,本發明的技術性範圍係依附加之申請專利範圍的記載而決定。In the above, some embodiments of the inspection jig for substrate inspection according to the present invention have been described. However, the present invention is not limited to the embodiments, and is also familiar with additions, deletions, modifications, etc. that can be easily accomplished by those skilled in the art. The invention is also included in the present invention; the technical scope of the present invention is determined in accordance with the description of the appended claims.
10、10-1...基板檢查用之檢查治具10, 10-1. . . Inspection tool for substrate inspection
11、11-1、11-2...測試頭平板11, 11-1, 11-2. . . Test head plate
11a、11b、11c...板片11a, 11b, 11c. . . Plate
11a-1、11b-1、11c-1...板片11a-1, 11b-1, 11c-1. . . Plate
11a-2、11b-2、11c-2...板片11a-2, 11b-2, 11c-2. . . Plate
11h、11ah、11bh、11ch...貫通孔11h, 11ah, 11bh, 11ch. . . Through hole
11u、11u-1...基板固持部11u, 11u-1. . . Substrate holding portion
12...彈簧部(彈簧構件)12. . . Spring part (spring member)
13、13-1、13-2、13-3...支持棒13, 13-1, 13-2, 13-3. . . Support bar
13a、13c、13a-1...位置確定部13a, 13c, 13a-1. . . Position determination unit
13b、13b-1...導引部13b, 13b-1. . . Guide
13-3c...軸心部13-3c. . . Axis
13-3d...本體部13-3d. . . Body part
13-3r...彈性部13-3r. . . Elastic part
14...底板14. . . Bottom plate
14h...貫通孔14h. . . Through hole
15...基座15. . . Pedestal
15b...電極15b. . . electrode
15h...貫通孔15h. . . Through hole
16...電線16. . . wire
17...探針17. . . Probe
17a...探針17之前端部17a. . . Front end of probe 17
17b...探針17之後端部17b. . . End of probe 17
20、30...短劃線20, 30. . . Dash
21...凹部twenty one. . . Concave
22、23、24...預備孔22, 23, 24. . . Preparing hole
40...檢查基板40. . . Inspection substrate
42...凸塊42. . . Bump
61...柱塞61. . . Plunger
61a...連結部61a. . . Linkage
61b...傾斜部61b. . . Inclined portion
61c...導引部61c. . . Guide
61d...突出部61d. . . Protruding
61in...內螺紋61in. . . internal thread
62...止動部62. . . Stop
62a...卡止部62a. . . Clamping part
62b...本體部62b. . . Body part
62c...傾斜面62c. . . Inclined surface
62in...貫通孔62in. . . Through hole
62p...縮窄部62p. . . Narrowing
63...本體部63. . . Body part
63p...縮窄部63p. . . Narrowing
63s...彈簧部63s. . . Spring part
S...測試頭平板11被向下按壓之距離S. . . The distance from which the test head plate 11 is pressed downward
圖1係概略顯示依本發明之一實施例的基板檢查用之檢查治具的側視圖(包含部份剖面圖)。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view (including a partial cross-sectional view) schematically showing an inspection jig for substrate inspection according to an embodiment of the present invention.
圖2A係將圖1之基板檢查用之檢查治具中用短劃線20所示部份加以放大的前視圖(包含部份剖面圖)。Fig. 2A is a front view (including a partial cross-sectional view) showing an enlarged portion of the inspection jig for inspection of the substrate of Fig. 1 by a dashed line 20.
圖2B係取出圖2A所示部份之一部份的前視圖。Fig. 2B is a front view showing a part of the portion shown in Fig. 2A.
圖2C係用以說明圖2A所示部份之變動的前視圖(包含部份剖面圖)。Figure 2C is a front view (including a partial cross-sectional view) for explaining the variation of the portion shown in Figure 2A.
圖3係將圖1之基板檢查用之檢查治具中用短劃線30所示部份加以放大的前視圖(包含部份剖面圖)。Fig. 3 is a front elevational view (including a partial cross-sectional view) showing an enlarged portion of the inspection jig for inspection of the substrate of Fig. 1 by a dashed line 30.
圖4A、4B係為說明圖3所示部份的使用狀態而從圖3抽出一部份加以概略顯示的前視圖(包含部份剖面圖)。4A and 4B are front views (including partial cross-sectional views) showing a portion of the portion shown in Fig. 3 taken out from Fig. 3 and schematically shown.
圖5係關於依本發明之基板檢查用之檢查治具的另一實施形態,為用以顯示圖2A所示部份之另一實施形態的前視圖(包含部份剖面圖)。Fig. 5 is a front view (including a partial cross-sectional view) showing another embodiment of the inspection tool for substrate inspection according to the present invention, showing another embodiment of the portion shown in Fig. 2A.
圖6A、6B係關於依本發明之基板檢查用之檢查治具的支持棒之另一實施形態的前視圖(包含部份剖面圖)。6A and 6B are front views (including partial cross-sectional views) showing another embodiment of a support rod for an inspection jig for inspection of a substrate according to the present invention.
圖7係概略顯示依本發明之基板檢查用之檢查治具的又另一實施形態的前視圖(包含部份剖面圖)。Fig. 7 is a front view (including a partial cross-sectional view) showing still another embodiment of the inspection jig for substrate inspection according to the present invention.
11...測試頭平板11. . . Test head plate
11a、11b、11c...板片11a, 11b, 11c. . . Plate
11u...基板固持部11u. . . Substrate holding portion
12...彈簧部12. . . Spring part
13...支持棒13. . . Support bar
13a...第1位置確定部13a. . . First position determining unit
13b...導引部13b. . . Guide
13c...第2位置確定部13c. . . Second position determining unit
20...短劃線20. . . Dash
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009259969A JP5397619B2 (en) | 2009-11-13 | 2009-11-13 | Inspection jig for board inspection |
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| Publication Number | Publication Date |
|---|---|
| TW201126184A TW201126184A (en) | 2011-08-01 |
| TWI412768B true TWI412768B (en) | 2013-10-21 |
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| TW099139014A TWI412768B (en) | 2009-11-13 | 2010-11-12 | Inspection fixture for substrate inspection and detecting device using the inspection fixture |
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| Country | Link |
|---|---|
| JP (1) | JP5397619B2 (en) |
| KR (1) | KR101157883B1 (en) |
| TW (1) | TWI412768B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5400107B2 (en) * | 2011-08-16 | 2014-01-29 | Ckd株式会社 | Board inspection equipment |
| CN102621354A (en) * | 2012-04-11 | 2012-08-01 | 游森溢 | Detachable test fixture |
| JP7421990B2 (en) * | 2020-04-08 | 2024-01-25 | 株式会社日本マイクロニクス | Electrical connection device and inspection method |
| CN118859028B (en) * | 2024-09-20 | 2024-12-17 | 江西祥益鼎盛科技有限公司 | A LED light board test needle bed |
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|---|---|---|---|---|
| US5808473A (en) * | 1994-08-04 | 1998-09-15 | Nippon Telegraph & Telephone Corp. | Electric signal measurement apparatus using electro-optic sampling by one point contact |
| JPH1152000A (en) * | 1997-07-31 | 1999-02-26 | Mozu Denshi Kogyo Kk | Inspection device and inspection method for printed wiring board |
| TW466389B (en) * | 1999-10-29 | 2001-12-01 | Sony Corp | Charging system for moving robot, method of searching for charging station, moving robot, connector and electric connection structure |
| TW473888B (en) * | 1997-11-07 | 2002-01-21 | Nippon Electric Co | Bump structure and method for making the same |
| TW200635153A (en) * | 2005-02-22 | 2006-10-01 | Fujitsu Ltd | Contactor for electronic parts and a contact method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003307542A (en) * | 2002-02-18 | 2003-10-31 | Tokyo Cosmos Electric Co Ltd | IC socket |
| JP2005061876A (en) * | 2003-08-19 | 2005-03-10 | Japan Electronic Materials Corp | Probe unit and method of manufacturing the probe unit |
| JP4863466B2 (en) * | 2006-08-01 | 2012-01-25 | 日本電産リード株式会社 | Manufacturing method of substrate inspection jig |
| JP4965341B2 (en) * | 2007-05-31 | 2012-07-04 | 日置電機株式会社 | Probe unit and circuit board inspection device |
| JP2009204393A (en) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | Probe card, method for manufacturing probe card, semiconductor inspection apparatus and method for manufacturing semiconductor device |
-
2009
- 2009-11-13 JP JP2009259969A patent/JP5397619B2/en active Active
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5808473A (en) * | 1994-08-04 | 1998-09-15 | Nippon Telegraph & Telephone Corp. | Electric signal measurement apparatus using electro-optic sampling by one point contact |
| JPH1152000A (en) * | 1997-07-31 | 1999-02-26 | Mozu Denshi Kogyo Kk | Inspection device and inspection method for printed wiring board |
| TW473888B (en) * | 1997-11-07 | 2002-01-21 | Nippon Electric Co | Bump structure and method for making the same |
| TW466389B (en) * | 1999-10-29 | 2001-12-01 | Sony Corp | Charging system for moving robot, method of searching for charging station, moving robot, connector and electric connection structure |
| TW200635153A (en) * | 2005-02-22 | 2006-10-01 | Fujitsu Ltd | Contactor for electronic parts and a contact method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011106867A (en) | 2011-06-02 |
| KR20110053181A (en) | 2011-05-19 |
| JP5397619B2 (en) | 2014-01-22 |
| TW201126184A (en) | 2011-08-01 |
| KR101157883B1 (en) | 2012-06-22 |
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