JP2007178311A - Probe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a measurement probe which performs four-terminal measurement by securely brought into contact with a measurement object with a simple structure even in a flip chip surface where a high-density wiring pattern is formed, and also to provide its manufacturing method and measurement device. <P>SOLUTION: The measurement probe is provided with first and second probe parts each having a contact part brought into contact with the measurement object for measuring the resistance value of the measurement object, wherein one probe is used for voltage measurement and the other is used for application of a current. In the measurement probe, the second probe part includes: a body part formed so as to surround the first probe part; a head part including the contact part; and an energizing means so that the head part resiliently energizes the contact part of the first probe part to be protected in the axial direction. The contact part of the head part when unused is at a position projecting more than that of the first probe part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe, and more particularly to a measurement probe used in a four-terminal measurement method for measuring a resistance value of a measurement target such as a wiring pattern on a circuit board, a measurement probe manufacturing method, and a resistance measurement device. .

  The term “circuit board” used in this application document is not limited to a package substrate for a semiconductor package or a film carrier, but a printed wiring board, for example, a flexible substrate, a multilayer wiring board, an electrode for a liquid crystal display or a plasma display. It is a generic term for substrates on which various wirings such as plates are applied. That is, the circuit board includes all boards that can be subjected to four-terminal measurement.

  Conventionally, in the continuity inspection of wiring provided on a substrate such as a semiconductor package substrate, probes are brought into contact with both ends of the wiring pattern, and only continuity between the probes is detected. However, in recent years, it has become necessary to accurately measure not only the continuity, but also the resistance value of the wiring pattern to conduct a continuity test, so that the resistance value can be measured while eliminating the influence of the contact resistance of the probe. Four-terminal measurement is commonly used.

In such four-terminal measurement, it is necessary that the voltage measurement probe and the current application probe are provided as close as possible to each other and reliably contact substantially the same inspection point, and various means have been proposed.
In this document, a coaxial type comprising a voltage measuring probe, a current measuring probe arranged so as to surround the periphery thereof, and a sleeve for holding the current measuring probe so as to be movable back and forth in the axial direction. A probe is disclosed. There, the voltage measuring probe is urged and held so as to freely advance and retract within the probe. JP 2004-144663 A discloses a cylinder type Kelvin probe. In this document, the electrical continuity of a printed circuit board is inspected using a probe socket for inspecting a printed circuit board. Japanese Patent No. 3691003 This document discloses a probe tip adapter for a probe. JP-A-11-258294 Japanese Patent Application Laid-Open No. 11-118868 5 and 6 show a structure in which a probe is attached to a probe head.

  The conventional probe is structurally complicated as shown in the cited documents 1 to 6, and both the voltage measuring probe and the current applying probe as in the cited document 1 cannot reliably come into contact with the measurement object. Moreover, it was not possible to easily cope with the difference in the shape of the measurement object. Therefore, the present invention is simple in structure, but both the voltage measurement probe and the amperometric application probe can reliably contact the measurement object and can easily be in close contact with the shape of the measurement object. An object of the present invention is to provide a measurement probe that can be used. Another object of the present invention is to provide a resistance measuring device using the measuring probe and a method for manufacturing the measuring probe.

  In order to solve the above-described problems, the measurement probe according to the present invention has a contact portion that contacts the measurement object in order to measure the resistance value of the measurement object, one for voltage measurement and the other for current application. First and second probe units used are provided. In the measurement probe, the second probe part is formed so as to surround the first probe part, the head part including the contact part, and the head part pivots on the contact part of the first probe part. It has an urging means for elastically urging so as to protrude in the direction, and the contact portion of the head portion is in a position protruding from the contact portion of the first probe portion when not in use.

  In addition, the measurement probe according to the present invention includes first and second contact portions that are in contact with the measurement target in order to measure the resistance value of the measurement target, one for voltage measurement and the other for current measurement. A second probe unit is provided. In the measurement probe, the second probe portion includes a main body portion surrounding the first probe portion, and the first probe portion includes a head portion including a contact portion, and a main body portion of the second probe portion. And a biasing means that elastically biases the main body portion and the contact portion of the first probe so as to protrude in the axial direction, and the contact portion of the head portion is the contact portion of the second probe portion during use. It is in the position which protruded rather than.

  A resistance measuring apparatus for measuring a resistance value of a measurement object according to the present invention includes a current generation unit that generates a current for measurement, a voltage measurement unit, and a pair of measurements electrically connected to both ends of the measurement target. Each probe includes first and second probe portions each having a contact portion that comes into contact with the measurement target, and the second probe unit generates current to supply current to the measurement target. A pair of measuring probes connected to the voltage measuring unit in order to measure the voltage generated between both ends of the measurement object, and a value of the supplied current. A processing device for obtaining a resistance value from the measured voltage value, a main body portion formed so that the second probe portion surrounds the first probe portion, a head portion including a contact portion, and a head portion Axially contacts the contact portion of the first probe And having biasing means for resiliently biased so as to protrude, the contact portion of the head portion is characterized in that it is in the position protruding than the contact portion of the first probe unit when not in use.

  In addition, a resistance measuring apparatus for measuring a resistance value of a measurement object according to the present invention includes a current generation unit that generates a current for measurement, a voltage measurement unit, and a pair of measurement devices disposed at both ends of the measurement object. Each of the measurement probes includes first and second probe portions each having a contact portion that comes into contact with the measurement target, and the second probe unit supplies a current to the measurement target to generate a current. A pair of measuring probes connected to the voltage measuring unit to measure a voltage generated between both ends of the measuring object, and a value and measurement of the supplied current. A processing device for determining a resistance value from the value of the measured voltage, the second probe unit including a main body unit surrounding the first probe unit, the first probe unit including a contact unit, 2 is arranged inside the main body of the probe unit And a biasing means that elastically biases the body portion and the contact portion of the first probe so as to protrude in the axial direction, and the contact portion of the head portion is more in use than the contact portion of the second probe portion in use. It is in a protruding position.

  The measurement probe according to the present invention includes first and second probe parts that are in contact with the measurement object in order to measure the resistance value of the measurement object, and the second probe part surrounds the first probe part. Is formed. In this measurement probe, the first probe part includes a probe pin and an enlarged part to which the probe pin is attached, the enlarged part has a contact part having an outer diameter larger than the diameter of the probe pin, and the contact part Has a taper portion formed in a tapered shape toward the tip.

  Further, a measurement probe according to the present invention includes a probe that is in conductive contact with a predetermined measurement position of a substrate to be inspected, a first plate having a guide hole that guides one end of the probe to the predetermined measurement position, A second plate having a guide hole for guiding the other end to an electrode portion that receives an electrical signal from the probe, and a predetermined interval between the first and second plates and supporting the probe and the probe And a substrate inspection jig having a third plate connected to be conductive. The probe has first and second probe parts each having a contact part that comes into contact with the measurement object in order to measure the resistance value of the measurement object, and the second probe part surrounds the first probe part. The one end of the 2nd probe is connected with the 3rd plate so that conduction is possible, It is characterized by the above-mentioned.

  Furthermore, the measurement probe according to the present invention has first and second contact portions that are in contact with the measurement target in order to measure the resistance value of the measurement target, one of which is used for voltage measurement and the other is used for current application. The probe part is provided. In this measurement probe, the first probe is formed in an elastic rod shape or needle shape, and the second probe surrounds the first probe with a space portion that allows the first probe to bend. It is formed by the cylindrical member arrange | positioned in this way.

  According to the present invention, a method of manufacturing a measurement probe manufactures a measurement probe including first and second probe units each having a contact portion that comes into contact with the measurement target in order to measure the resistance value of the measurement target. . The manufacturing method includes a step of forming a first probe portion, a step of forming an insulating layer covering the first probe portion around the formed first probe portion, and a step of forming an insulating layer around the insulating layer. A step of forming a layer of the second probe portion and a step of forming an urging means having elasticity at the tip portion having the contact portion of the second probe portion, wherein the contact portion is in contact with the first probe portion. Forming a biasing means so as to protrude from the portion.

  Further, according to the present invention, a method of manufacturing a measurement probe includes: a measurement probe including first and second probe parts each having a contact part that contacts a measurement object in order to measure a resistance value of the measurement object. To manufacture. The manufacturing method includes a step of forming a pin-shaped first probe portion, a step of forming an insulating layer covering the first probe portion around the formed pin-shaped first probe portion, The step of forming the cylindrical second probe portion, the step of inserting the pin-shaped first probe portion on which the insulating layer is formed into the cylindrical second probe portion, and the contact of the second probe portion Forming an urging means having elasticity at a tip portion having a portion, and forming the urging means so that the contact portion protrudes from the contact portion of the first probe portion.

  According to the present invention, it is possible to reliably perform four-terminal measurement even on a flip chip surface on which a high-density wiring pattern is formed, simply by holding the probe located outside and pressing the contact portion at the tip thereof against the measurement target. A measurement probe that can be performed can be provided.

  In addition, according to the present invention, it is possible to provide a measurement probe that can be in good contact with the solder surface and reliably contact the measurement object regardless of the unevenness or inclination of the solder surface of the wiring pattern. .

  Furthermore, according to the present invention, it is possible to provide a probe that can be in close contact with a through-hole of a test board regardless of the diameter of the through-hole and perform four-terminal measurement.

  In addition, the present invention can provide a resistance measuring device using the above-described measuring probe.

  Furthermore, the present invention can provide a method for producing the measurement probe as described above.

Hereinafter, preferred embodiments of a probe according to the present invention will be described with reference to the accompanying drawings. In addition, in the figure, the same code | symbol is attached | subjected to the same element and the overlapping description is abbreviate | omitted.
[Four-terminal measurement method]
FIG. 1 is a diagram for illustrating the measurement principle of a four-terminal measuring device. This apparatus includes a current generation unit 10 and a voltage measurement unit 12. The current generation unit 10 is connected to first and second current probes 10F1 and 10F2 for supplying current, and the voltage measurement unit 12 is connected to first and second voltage probes 12S1 and 12S2 for voltage measurement.

As shown in FIG. 1, when the resistance 14 of the wiring of the circuit board 16 is measured, the first and second voltage probes 12S1 and 12S2 and the first and second current probes 10F1 and 10F2 are connected to the wiring 14 as shown in FIG. A current of a predetermined magnitude for measurement is supplied from the current generator 10 to the wiring 14 via the first and second current probes 10F1 and 10F2. As a result, a potential difference is generated at both ends of the wiring 14, and the voltage measurement unit 12 measures the potential difference between the two points via the first and second voltage probes 12S1 and 12S2. When the potential difference, that is, the voltage value is obtained, the resistance value of the wiring 14 can be obtained from the current value for measurement and the measured voltage value.
[First Embodiment of Probe]
2a, 2b and 2c show a probe 20 according to a first embodiment of the present invention. As will be described in detail below, FIGS. 2 a and 2 b are exploded views showing the individual components when the probe is disassembled, and FIG. 2 c is an assembly view of the probe 20.

  FIG. 2a shows a cylindrical voltage probe 20S (first probe portion) for voltage measurement and a cylindrical current probe 20F (second probe portion) arranged coaxially so as to surround it. The voltage probe 20S and the current probe 20F have conductivity. The tip of the voltage probe 20S protrudes from the current probe 20F and is exposed. The periphery of the voltage probe 20S is covered with an insulating layer (not shown), and the current probe 20F is fitted and fixed to the outside. Except for the tip of the voltage probe 20S, it is covered with insulation.

  FIG. 2b shows the tip 22 that is wrapped around the exposed portion of the voltage probe 20S shown in FIG. 2a. The distal end portion 22 includes an attachment portion 22a, a connection portion 22b, and a contact portion 22c constituting a head portion, and both end portions of the connection portion 22b are fixed to the attachment portion 22a and the contact portion 22c, respectively. Further, the attachment portion 22a and the contact portion 22c constitute an urging means, and the connection portion 22b is formed in the shape of a stretchable conductive coil spring having elasticity, and the attachment portion 22a and the contact portion 22c are electrically connected. Can be connected. The connecting portion 22b is attached by urging the contact portion 22c outward (downward in the drawing).

  The attachment portion 22a is fixed to and electrically connected to the lower end portion of the current probe 20F that fits outside the voltage probe 20S shown in FIG. 2a. For example, the attachment portion 22a is the lower end of the current probe 20F. It can be detachably fixed by press-fitting into the part. The contact portion 22c comes into contact with a copper bump or the like on the circuit board to be measured, and has a contact surface 22c 'that comes into contact with the copper bump or the like. The contact surface 22 c ′ may be processed to be slightly rough in order to reliably contact the measurement target, thereby making it possible to make good contact with the unevenness and inclination of the surface of the measurement target.

  FIG. 2c shows a state in which the tip 22 is mounted on the exposed portion of the voltage probe 20S. In this case, the attachment portion 22a is fixed to the end portion of the current probe 20F to form an electrical connection state with the current probe 20F. The contact portion 22c is movable in the axial direction together with the connection portion 22b with respect to the attachment portion 22a fixed to the end portion of the current probe 20F. As shown in the figure, the distal end portion of the voltage probe 20S is normally in a position slightly retracted from the position of the contact surface 22c 'at the lower end of the contact portion 22c. In other words, the contact portion of the current probe 20F is in a position protruding from the contact portion of the voltage probe.

  FIG. 3 shows a state in which the measurement probe 20 of FIG. 2c is brought into contact with, for example, the wiring pattern portion 30 of the circuit board 32 to be measured. As shown in the figure, the contact surface 22 c ′ of the contact portion 22 c of the head 22 is pressed against the upper surface of the wiring pattern portion 30. Further, the coil spring-shaped connecting portion 22 b is contracted, and the tip of the voltage probe 20 </ b> S is in contact with the upper surface of the wiring pattern portion 30. In this state, the tip of the voltage probe 20S is pressed against the upper surface of the wiring pattern portion 30, and the contact surface 22c ′ of the contact portion 22c electrically connected to the current probe 20F is also elastic of the coil spring-shaped connection portion 22b. Therefore, good contact between the wiring pattern portion and the probe is achieved.

  Although details will be described later with reference to FIG. 4, in FIG. 3, the current probe 20 </ b> F is connected to the current generator 40 (FIG. 4), and when a current is supplied from the current generator 40, Current is supplied from the contact surface 22c ′ to the wiring pattern portion 30 to be measured via the 20F, the attachment portion 22a, the connection portion 22b, and the contact portion 22c. Moreover, the voltage probe 20S is connected to the voltage measurement part 42 (FIG. 4).

  FIG. 4 shows a resistance measuring apparatus that performs four-terminal measurement using a pair of measuring probes 20 according to the present invention shown in FIG. In this embodiment, the object to be measured is the resistance value of the wiring pattern between wiring patterns formed in the wiring pattern portions 45 and 46 having a relatively small wiring pitch on the substrate 44 and a high density. The substrate 44 also has a wiring pattern portion 48 of a ball grid surface on the other surface.

  The pair of probes 20-1 and 20-2 has the same structure. The probe 20-1 is a first probe and includes a first current probe 20F1 (second probe unit) for supplying current and a first voltage probe 20S1 (second probe unit) for measuring voltage. A tip 22 is connected to the lower end of the first current probe 20F1. In the front end portion 22, the contact portion 22c is pressed against the wiring pattern portion 45 on the measurement target substrate 44 by the inactive force of the connection portion 22b, and the connection portion 22b contracts, as shown in FIG. Similarly to the case, the tip of the voltage probe 20S2 is pressed against the surface of the wiring pattern portion 45.

  The probe 20-2 is a second probe, and includes a second current probe 20F2 (second probe unit) for supplying current and a second voltage probe 20S2 (first probe unit) for measuring voltage. . The end 22 is connected to the end of the second current probe 20F2 in the same manner as the first probe 20-1. The contact portion 22c of the distal end portion 22 is pressed against the wiring pattern portion 46 on the measurement target substrate 44, whereby the connection portion 22b contracts, and the distal end of the second voltage probe 20S becomes the wiring pattern portion. 46 is pressed against the surface.

  The first current probe 20F1 of the first probe 20-1 and the second current probe 20F2 of the second probe 20-2 are connected to a current generator 40 for supplying a measurement current. The first voltage probe 20S1 of the first probe 20-1 and the second voltage probe 20S2 of the second probe 20-2 are connected to a voltage measurement unit 42 for voltage measurement.

  The case where the resistance value is measured by the four-terminal measurement method using this resistance measuring apparatus will be described. When a current is supplied from the current generator 40, the first current probe 20F1 and the second probe of the first probe 20-1. Current is supplied to the wiring pattern portions 45 and 46 from the second current probe 20F2 of 20-2 through the respective distal end portions 22. Since a potential difference is generated at both ends of a predetermined measurement object due to the current, the potential difference, that is, via the distal ends of the first voltage probe 20S1 and the second voltage probe 20S2 in contact with the wiring pattern portions 45 and 46, that is, The voltage value is measured by the voltage measuring unit 42. The data of the measured voltage value and the supplied current value are supplied to a processing device (not shown), and the resistance value is obtained from these values by the processing device.

  When measuring the resistance values at other locations, the drive mechanism causes the first probe 20-1 and the second probe 20-2 to move along the X and Y axes defined on the wiring pattern surface and Z in the direction perpendicular thereto. The probe is moved by a predetermined distance along the axial direction, and the probe is brought into contact with the next wiring pattern surface to be measured. Then, a current is supplied from the current generation unit to the wiring pattern via the current probe, and the voltage of the predetermined wiring pattern is measured by the voltage measurement unit via the voltage probe. The resistance value is obtained by calculation processing from

In the above-described embodiment, the current supply probe is provided with a tip including a stretchable component having the shape of a spring coil. Instead of the spring coil, an elastic conductive rubber is used. It is also possible to form a cylindrical shape and expand and contract it like a bellows around the exposed tip of the voltage probe, and fix one end to the end of the current probe. In this case, when the end of the cylindrical conductive rubber is pressed against the measuring object so that the tip of the voltage probe is slightly retracted from the open end of the cylindrical one, The portion is contracted so that the tip of the voltage probe comes into contact with the object to be measured.
[Second Embodiment of Probe]
5a and 5b show a probe 50 according to a second embodiment of the present invention. The probe 50 includes a voltage probe S and a current probe F. The voltage probe 50S includes a voltage probe fixing portion 54S and a tip portion 52. Around them, a cylindrical current probe 50F for supplying current is provided. An insulating layer (not shown) is covered around the fixing portion 54S of the voltage probe, and an insulating layer (not shown) is also formed on the surface of the tip portion 52.

  The distal end portion 52 includes attachment portions 52a and 52c, a connection portion 52b having a shape made of a conductive coil spring, and a contact portion 55S. The attachment part 52a fixes the fixing part 54S and the connection part 52b, and the attachment part 52c fixes the contact part 55S and the connection part 52b. Electrical connection is formed between the fixing portion 54S and the contact portion 55S via attachment portions 52a and 52c and a coil spring-shaped connection portion 52b.

  The fixing portion 54S is fitted and fixed to the current probe 50F, but the contact portion 55S is movable in the axial direction with respect to the current probe 50F. The connection part 52b holds the contact part 55S in a predetermined position in a normal state. At that position, as shown in FIG. 5a, the tip of the contact portion 55S protrudes from the end of the current probe 50F.

  Although not shown, the current probe 50F is connected to a current generator for supplying a measurement current, and the voltage probe fixing unit 54S is connected to a voltage measurement unit for voltage measurement.

  FIG. 5 b shows a state in which the tip of the contact portion 55 </ b> S is pressed against the upper surface of the wiring pattern portion 56 of the circuit board 58 to be measured. This is because the tip of the contact portion 55S is pressed against the upper surface of the wiring pattern portion 56 of the circuit board 58 to be measured against the urging force of the coil spring of the connection portion 52b, and the contact portion 55S is placed in the space of the current probe 50F. This is achieved by pushing the inside inward. In that case, the inner wall of the current probe 50F forming the space functions as a guide for the movement of the contact portion 55S.

  When measuring the resistance value of the measurement object, a pair of probes according to the second embodiment in the state shown in FIG. 5B are used, and they are arranged at both ends of the measurement object. In this state, when a current is supplied from a current generation source (not shown) via the current probe 50F, the current is supplied to the wiring pattern portion 56 from the end of the current probe 50F. An electrical connection is formed between the tip of the contact portion 55S and the wiring pattern portion 56, and an electrical connection is also formed between the contact portion 55S and the fixing portion 54S. And a voltage measuring unit measures a voltage generated between the contact portion of another voltage probe (not shown). The data of the measured voltage value and the supplied current value are supplied to a processing device (not shown), and the resistance value is obtained from these values by the processing device.

In the above-described embodiment, the coil spring-like connection portion 52 is provided between the voltage probe fixing portion 54S and the contact portion 55S. However, instead of the coil spring-like connection portion 52, an elastic conductive material is provided. You may use what formed rubber in the shape of a cylinder and made it bellows-like. In that case, the cylindrical conductive rubber is disposed in the space of the current probe 50F between the fixing portion 54S and the contact portion 55S, and both ends thereof are fixed to the fixing portion 54S and the contact portion 55S, respectively. Thereby, an electrical connection state is formed from the fixing portion 54S to the contact portion 55S.
[Third Embodiment of Probe]
6a and 6b show a probe 60 according to a third embodiment of the present invention. The probe 60 includes a columnar voltage probe 60S for measuring voltage and a cylindrical current probe 60F arranged coaxially so as to surround the voltage probe 60S. An insulating film (not shown) is formed on the surface of the voltage probe 60S. Further, a tip end portion 62 that contacts the wiring circuit pattern portion 66 of the circuit board 68 is provided at the lower end portion of the current probe 60F in FIG. The front end 62 functions as an urging means, and is composed of a conductive coil spring having elasticity. The tip 62 is coupled to the end of the main body of the current probe 60F so as to form an electrical connection state, and is wrapped around a portion exposed from the current probe 60F of the voltage probe 60S. As shown in FIG. 6a, the lower end portion of the distal end portion 62 of the current probe 60F is located below the lower end portion of the voltage probe 60S. In other words, the lower end portion of the distal end portion 62 of the current probe 60F protrudes from the lower end portion of the voltage probe 60S.

  In FIG. 6a, a base end portion of the voltage probe 60S and a base end portion 64 of the current probe 60F are provided above, and are connected to a voltage measurement unit and a current generation unit (not shown), respectively. The configuration of these base end portions is the same as that of the tip end portion 62.

  FIG. 6b shows a state in which the voltage probe 60S and the current probe 60F are in contact with the portion 66 of the wiring circuit pattern. In this state, first, the lower end portion of the distal end portion 62 of the current probe 60F is brought into contact with the wiring circuit pattern portion 66 and pressed to contract the coil spring-shaped distal end portion 62, thereby causing the distal end of the voltage probe 60S to This is achieved by contacting the portion 66 of the wiring circuit pattern. In the state of FIG. 6B, the tip of the voltage probe 60S is pressed against the portion 66 of the wiring circuit pattern, and the tip portion 62 is pressed against the portion 66 by elasticity, so that the voltage probe 60S and current probe 60F and the wiring circuit pattern are pressed. Good electrical contact is formed with the portion 66.

When measuring the resistance of the measurement target, the measurement probes shown in FIG. 6a are arranged at both ends of the measurement target one by one, and each current probe as in the case of the probes of the other embodiments described above. 60F is connected to a current generator (not shown) to supply current to the measurement target, and each voltage probe 60S is connected to a voltage measurement unit (not shown) to measure the voltage generated at both ends of the measurement target.
[Fourth Embodiment of Probe]
7a and 7b show a probe 70 according to a fourth embodiment of the present invention. This probe 70 includes a columnar voltage probe 70S for voltage measurement, and a cylindrical current probe 70F arranged coaxially so as to surround it. An insulating film (not shown) is formed on the surface of the voltage probe 70S. In FIG. 7a, a contact portion 72 that contacts the wiring circuit pattern portion 76 of the circuit board 78 is provided at the lower end of the current probe 70F. A conductive coil spring portion 74 having elasticity is formed between the contact portion 72 and the main body portion of the current probe 70F.

  The coil spring portion 74 functions as an urging means, and can be formed, for example, by removing the slit portion 74b in a part of the current probe 70F with a laser and leaving the coil spring-shaped portion 74a. The coil spring-shaped part 74a thus formed electrically connects the main body part of the current probe 70F and the contact part 72.

  Further, the contact portion 72 and the coil spring portion 74 are mounted on a portion exposed from the current probe 70F of the voltage probe 70S. As shown in FIG. 7a, the lower end portion of the contact portion 72 of the current probe 70F is positioned below the lower end portion of the voltage probe 70S. In other words, the lower end of the tip of the contact portion 72 of the current probe 70F protrudes from the lower end of the voltage probe 70S.

  In FIG. 7a, the base end portion of the voltage probe 70S and the base end portions 73 and 75 of the current probe 70F are provided above, and are connected to a voltage measurement unit and a current generation unit (not shown), respectively. The structure of these base end parts is the same as the part which provided the contact part and the coil spring part.

  FIG. 7 b shows a state in which the voltage probe 70 </ b> S and the current probe 70 </ b> F are in contact with the wiring circuit pattern portion 76. In this state, the lower end portion of the contact portion 72 of the current probe 70F is pressed against the wiring circuit pattern portion 76 to contract the coil spring-shaped portion 74, and the tip of the voltage probe 70S is applied to the wiring circuit pattern portion 76. Achieved by abutting. In the state of FIG. 7B, the tip of the voltage probe 70S is pressed against the portion 76 of the wiring circuit pattern, and the contact portion 72 is pressed against the portion 76 by the elasticity of the coil spring portion 74. Good electrical contact is formed between the probe 70F and the wiring circuit pattern portion 76.

When measuring the resistance to be measured, the measurement probes shown in FIG. 7a are arranged at both ends of the measurement apparatus, and each current probe is arranged in the same manner as in the probes of the other embodiments described above. 70F is connected to a current generator (not shown) to supply current to the measurement target, and each voltage probe 70S is connected to a voltage measurement unit (not shown) to measure the voltage generated at both ends of the measurement target.
[Fifth Embodiment of Probe]
FIG. 8 shows a probe 80 according to a fifth embodiment of the present invention.

  As shown in FIG. 8, the measurement probe 80 includes a columnar voltage probe 80S for voltage measurement, and a cylindrical current probe 80F arranged coaxially so as to surround the voltage probe 80S. An insulating film (not shown) is formed on the surface of the voltage probe 80S, and the voltage probe 80S can move inside the current probe 80F. As is clear from FIG. 8, the length of the current probe 80F is shorter than the length of the voltage probe 80S, and the contact portion 83 at the tip of the voltage probe 80S protrudes from the voltage probe 80F. Further, the current probe 80F and the voltage probe 80S are formed of a material having flexibility and elasticity. As a result, as will be described later, the current probe 80F and the voltage probe 80S can bend and bend between the base plate and the circuit board to be measured, and the tip portions thereof can be appropriately brought into contact with the circuit board.

  FIG. 9 shows a measuring apparatus 90 including probes 80-1, 80-2, 80-3 having the same structure as the probe 80 shown in FIG. In the measuring apparatus 90, the portions near the upper ends of the current probes 80F of the probes 80-1, 80-2, 80-3 are fixed to the intermediate plate 94, but the lower ends thereof are formed on the guide plate 92. It is movably inserted into the formed hole. The intermediate plate 94 may not only fix the current probe 80F but also function as an electrode for supplying a current to all of the current probes 80F fixed thereto by forming the current probe 80F from a conductive material.

  Next, based on FIG. 9, the operation of the measuring device 90 when the tips of the measuring probes 80-1, 80-2, 80-3 are brought into contact with the wiring circuit pattern 86 to be measured will be described.

  First, the base plate 82 to which the voltage probe 80S is fixed and the intermediate plate 94 to which the upper end portion of the current probe 80F is fixed are simultaneously lowered while keeping the distance between them, so that the contact portion 83 of the voltage probe 80S is moved. The wiring circuit pattern 86 on the circuit board 88 is brought into contact with the wiring circuit pattern 86. At this time, the current probe 80F and the voltage probe 80S are straight. Portions 80S 'and 80F' indicated by broken lines indicate a state in which each probe is not bent.

  Next, with the contact portion 83 in contact with the wiring circuit pattern 86, the base plate 82 and the intermediate plate 94 are further lowered to press the contact portion 83 against the wiring circuit pattern 86. Then, since the distance between the base plate 82 and the wiring circuit pattern 86 becomes smaller than the length of the voltage probe 80S, the voltage probe 80S having elasticity starts to bend. When the lowering of the base plate 82 and the intermediate plate 94 continues, the tip of the current probe 80F comes into contact with the wiring circuit pattern 86. The state corresponds to the state of the measurement probe 80-1 shown in FIG. 9, and the current probe 80F remains straight.

  On the other hand, the surface of the substrate 88 or the wiring circuit pattern 86 may be uneven. For this reason, before the tip of the measurement probe 80-1 comes into contact with the surface of the wiring circuit pattern 86, the tip of another measurement probe is already in contact with the surface of the corresponding wiring circuit pattern 86. Sometimes. In this case, when the base plate 82 and the intermediate plate 94 continue to descend, the measurement probe that is already in contact with the tip starts to bend and bend because it has flexibility. Thereafter, when the tips of the voltage probes 80S and the current probes 80F of all the measurement probes come into contact with the surface of the corresponding wiring circuit pattern 86, the lowering of the base plate 82 and the intermediate plate 94 is stopped. At that time, as shown in FIG. 9, the current probes 80 </ b> F of the measurement probes 80-2 and 80-3 that have been in contact with the wiring circuit pattern 86 previously are bent and curved. The reason why the current probe 80F bends in this way is that the interval between the intermediate plate 94 to which the current probe 80F is attached and the surface of the wiring circuit pattern 86 corresponding thereto may be different among a plurality of measurement probes. This is to absorb the difference.

  Next, in the state shown in FIG. 9, current is supplied to the current probe 80F from a current supply device (not shown) via the connection portion 82a and the line 82b. Further, the voltage probe 80S is connected to a voltage measuring unit (not shown). Thereby, while supplying required electric current with respect to a measuring object, the voltage which generate | occur | produced at the both ends of those measuring objects is measured.

  As described above, according to the embodiment of FIGS. 8 and 9, the tip portions of both the voltage probe 80 </ b> S and the current probe 80 </ b> F can be brought into firm contact with the measurement object simply by pressing the current probe 80 </ b> F against the measurement object.

  In the description of the operation of the measuring apparatus 90, the tip of the voltage probe 80S is first brought into contact with the surface of the wiring circuit pattern 86 while keeping the base plate 82 and the intermediate plate 94 constant. The tip of the current probe 80F was brought into contact with the wiring circuit pattern 86. Instead, the measuring device 90 may be operated as follows.

  That is, in the measuring apparatus 90, first, the intermediate plate 94 and the current probe 80F having the upper end fixed thereto are lowered, and the tip of the current probe 80F is brought into contact with the surface of the wiring circuit pattern 86. At this time, since the surface of the substrate 88 or the wiring circuit pattern 86 may be uneven, the tips of all the current probes 80F may not be in contact with the surface of the wiring circuit pattern 86 at the same time. For this reason, the lowering of the intermediate plate 94 is continued until the tips of all the current probes 80F come into contact with the surface of the wiring circuit pattern 86. Along with the lowering, the current probe 80F previously abutting on the surface of the wiring circuit pattern 86 is bent as the intermediate plate 94 is lowered. The lowering of the intermediate plate 94 is stopped when the tips of all the current probes 80F are in contact with the surface of the wiring circuit pattern 86.

  Next, the base plate 82 is lowered together with the voltage probe 80S. As a result, the tip of the voltage probe 80S comes into contact with the surface of the wiring circuit pattern 86. At that time, due to the unevenness of the surface of the substrate 88 or the wiring circuit pattern 86, the tips of the plurality of voltage probes 80S may not contact the surface of the wiring circuit pattern 86 at the same time as in the case of the current probe 80F. Therefore, the lowering of the base plate 82 is continued until the tip portions of all the voltage probes 80S come into contact with the surface of the wiring circuit pattern 86. Along with the lowering, the voltage probe 80S that has previously contacted the surface of the wiring circuit pattern 86 is bent. At the stage where the tips of all the voltage probes 80S come into contact with the surface of the wiring circuit pattern 86, the descent of the base plate 82 is stopped.

As described above, when the measuring device 90 is operated, the difference in height and the length of the probe due to the unevenness of the surface to be measured are absorbed by the bending of the current probe 80F and the voltage probe 80S, and all the probes are absorbed. The tip of each can properly contact the surface to be measured, and the tip can be pressed against the surface with an appropriate force to form a good electrical contact.
[Sixth Embodiment of Probe]
FIG. 10 shows a probe 100 according to a sixth embodiment of the present invention. The probe 100 includes a columnar voltage probe 100S for voltage measurement, and a cylindrical current probe 100F arranged coaxially so as to surround it. The voltage probe 100S and the current probe are flexible and elastic, and an insulating film (not shown) is formed on the surface thereof. Protruding locking portions 110 and 111 are formed near both end portions 130 and 131 of the voltage probe 100S, respectively. The both end portions 130 and 131 function as a contact portion for contacting the wiring circuit pattern 160 to be measured and a base end portion for connecting to the base plate 170, respectively.

  A space is formed inside the cylindrical current probe 100F, in which the voltage probe 100S can bend as shown by a broken line 100S 'in FIG. Further, both end portions 120 and 121 of the cylindrical current probe 100F are narrowed so that the protruding locking portions 110 and 111 of the voltage probe 100S are engaged, whereby the voltage probe 100S comes out of the current probe 100F. Is prevented. The both end portions 120 and 121 function as a contact portion for contacting the measurement object and a base end portion for connecting to the current supply portion, respectively.

  As shown in FIG. 10, when the contact part 130 of the voltage probe 100S is pressed against the wiring circuit pattern 160 on the substrate 180, the locking part 111 on the base end part 130 side of the voltage probe 100S becomes the base end part of the current probe 100F. Engage with the narrowed portion of 121 and stop. Therefore, the entire force of the voltage probe 100S bends as indicated by a broken line 100S ′ due to the drag when the contact portion 130 of the voltage probe 100S is pressed, and accordingly, the contact portion 130 of the voltage probe 100S retracts into the current probe 100F. Therefore, the contact portions 130 and 120 of both the voltage probe 100S and the current probe 100F come into contact with the wiring circuit pattern 160.

  By the way, as described above with reference to the embodiments of FIGS. 8 and 9, the height of the surface of the wiring circuit pattern 160 of the circuit board to be measured may vary depending on the location. When attached to the base plate and brought close to the surface of the wiring circuit pattern, the tips of all of the probes may not be able to contact the surface of those wiring circuit patterns at the same time. This can be dealt with by bending the voltage probe 100S as shown in FIG. That is, when the current probe 100F and the voltage probe 100S of the probe 100 are pressed against the wiring circuit pattern 160 as the base plate 170 is lowered, the voltage probe 100S can be bent and curved. As described above, when the probe 100 that has previously contacted the wiring circuit pattern 160 is curved, the base plate continues to descend, so that the probe 100 that has not yet contacted can be contacted to the wiring circuit pattern. Thereby, the difference in height of the wiring circuit pattern 160 can be absorbed.

As described above, according to the embodiment of FIG. 10, the contact portions 130 and 120 of both the voltage probe 100S and the current probe 100F are firmly brought into contact with the measurement object simply by pressing the contact portion 130 of the voltage probe 100S against the measurement object. be able to.
[Seventh Embodiment of Probe]
FIG. 12 shows a seventh embodiment of a probe according to the present invention that can be used as a current probe or a voltage probe. The probe includes a probe pin 200 and a columnar enlarged portion 210 that is detachably attached thereto.

  The enlarged portion 210 includes a main body portion 220 and a contact portion 230, and a space portion 240 that accommodates the distal end portion of the probe pin 200 is formed in the main body portion 220. A female screw is formed in the space, and is screwed with a male screw formed at the tip of the probe pin 200. The contact portion 230 includes a tapered portion 250 having an outer diameter larger than the diameter of the through hole of the inspection board and tapering toward the tip. In order to cope with the difference in the diameters of the through holes, the contact portions 250 of various sizes are prepared and prepared in advance.

  In use, the enlarged portion 210 having an appropriate size is selected according to the diameter of the through hole, and the probe pin 60 is screwed and fixed thereto.

When the probe according to this embodiment is used as a voltage probe, the periphery of the voltage probe is coaxially covered with a cylindrical current probe, and a tip 22 as shown in FIG. 2 is formed on the current probe, for example. . Alternatively, the probe pin 200 or the main body 210 is cut and a coil spring-like connection portion as shown in FIG. 5 is arranged between them, and a cylindrical current probe is provided so as to surround them as shown in FIG. You may make it form.
[Probing method]
The probe shown in the above embodiment has a configuration in which a cylindrical voltage probe is provided at the center and a cylindrical current probe is coaxially disposed around the probe. Such a coaxial probe may be manufactured by laminating a current probe around an insulated voltage probe, and a cylindrical insulation coating in a cylindrical current probe. May be manufactured by inserting a voltage probe.
[Alternative examples]
As mentioned above, although several embodiment of the probe which concerns on this invention was described, this invention is not restrained by these embodiment. It should be understood that additions, deletions, modifications, and the like that can be easily made by those skilled in the art are included in the present invention. The technical scope of the present invention is defined by the description of the appended claims.

FIG. 1 is a diagram for explaining the concept of the four-terminal measurement method. 2a and 2b are exploded views of the probe according to the first embodiment of the present invention, and FIG. 2c is an assembly view of the probe. FIG. 3 is a side view showing a state in which the probe of FIG. 2 is brought into contact with the wiring pattern portion of the circuit board to be measured. FIG. 4 is a schematic diagram for explaining a resistance measuring apparatus for performing four-terminal measurement using the probe of FIG. FIG. 5 is a partial cross-sectional side view of a probe according to the second embodiment of the present invention. 6a and 6b are side views of a probe according to the third embodiment of the present invention. 7a and 7b are side views of a probe according to the fourth embodiment of the present invention. FIG. 8 is a side view of a probe according to the fifth embodiment of the present invention. FIG. 9 is a partial cross-sectional side view for explaining a resistance measuring apparatus using the probe of FIG. FIG. 10 is a partial cross-sectional side view of a probe according to a sixth embodiment of the present invention. FIG. 11 is a partial cross-sectional side view for explaining the function of the probe shown in FIG. FIG. 12 is a partial cross-sectional side view of a probe according to a seventh embodiment of the present invention.

Explanation of symbols

20: Probe, 20S, 60S, 70S, 80S, 100S: Voltage probe, 20F, 60F, 70F, 80F, 100F: Current probe, 22, 62: Tip portion, 22a: Mounting portion, 22b: Connection portion, 22c, 55S , 72, 83, 120, 130: contact part, 22c ′: contact surface, 20-1: first probe, 20-2: second probe, 40: current generation part, 42: voltage measurement part, 52: connection part , 200: probe pin, 210: enlarged portion, 220: body portion, 230: contact portion, 250: taper portion

Claims (29)

In order to measure the resistance value of the measurement object, each of the measurement probes has a contact portion that contacts the measurement object, one of which is a voltage measurement and the other is a first and a second probe part that are used for current application. The second probe part is formed so as to surround the first probe part, a head part including the contact part, and the head part is the contact part of the first probe part. And a biasing means for elastically biasing so as to protrude in the axial direction, and the contact portion of the head portion is in a position protruding from the contact portion of the first probe portion when not in use. probe. 2. The measurement probe according to claim 1, wherein the first probe portion is formed in a cylindrical shape, and the second probe portion is formed in a cylindrical shape so as to surround the columnar first probe portion. Probe. The measurement probe according to claim 1, wherein the biasing means comprises a compression spring. 4. The measurement probe according to claim 3, wherein the main body, the biasing means, and the contact portion are formed from a single cylindrical member, and the biasing means provides a predetermined notch in the cylindrical member. A probe for measurement formed by The measurement probe according to claim 1, wherein the head portion and the urging means are formed in an integral type having elasticity. 6. The measurement probe according to claim 5, wherein the head portion and the biasing means are formed by a coil spring. 2. The measurement probe according to claim 1, wherein the biasing means is formed of an elastic conductive rubber. 8. The measurement probe according to claim 7, wherein the biasing means is formed in a bellows shape that expands and contracts in the axial direction. A measurement probe having first and second probe parts each having a contact part that contacts the measurement object in order to measure the resistance value of the measurement object, one for voltage measurement and the other for current measurement The second probe portion includes a main body portion surrounding the first probe portion, and the first probe portion includes a head portion including the contact portion, and a main body portion of the second probe portion. A main body portion disposed inside, and a biasing means that elastically biases the contact portion of the first probe so as to protrude in the axial direction, and the contact portion of the head portion is used when the second contact portion is in use. A measurement probe in a position protruding from the contact portion of the probe portion. The measurement probe according to claim 9, wherein the first probe portion is formed in a cylindrical shape, and the second probe portion is formed in a cylindrical shape so as to surround the columnar first probe portion. Probe. The measurement probe according to claim 9, wherein the biasing means has elasticity. 12. The measurement probe according to claim 11, wherein the biasing means is a coil spring (compression spring). The measurement probe according to claim 9, wherein the head portion and the biasing means are formed in an integral type having elasticity. 14. The measurement probe according to claim 13, wherein the head portion and the biasing means are coil springs. A resistance measuring device for measuring a resistance value of a measurement object,
A current generator for generating a current for measurement;
A voltage measurement unit;
A pair of measurement probes electrically connected to both ends of the measurement object, each measurement probe comprising first and second probe parts each having a contact part that contacts the measurement object; Two probe units are connected to the current generation unit to supply current to the measurement target, and the first probe unit measures voltage to measure a voltage generated between both ends of the measurement target. A pair of measuring probes connected to each other, and
A processing device for obtaining a resistance value from the value of the supplied current and the value of the measured voltage,
A main body portion formed so that the second probe portion surrounds the first probe portion, a head portion including the contact portion, and the head portion pivots on the contact portion of the first probe portion. A resistance measuring device having biasing means for elastically biasing so as to protrude in a direction, and in which the contact portion of the head portion protrudes from the contact portion of the first probe portion when not in use. A resistance measuring device for measuring a resistance value of a measurement object,
A current generator for generating a current for measurement;
A voltage measurement unit;
A pair of measurement probes arranged at both ends of the measurement object, wherein each measurement probe includes first and second probe parts each having a contact part in contact with the measurement object, A probe unit is connected to the current generation unit to supply current to the measurement target, and the first probe unit is connected to the voltage measurement unit to measure a voltage generated between both ends of the measurement target. A pair of connected measuring probes; and
A processing device for obtaining a resistance value from the value of the supplied current and the value of the measured voltage,
The second probe portion includes a main body portion that surrounds the first probe portion, and the first probe portion is disposed inside a main body portion of the second probe portion and a head portion including the contact portion. And a biasing means that elastically biases the contact portion of the first probe so as to protrude in the axial direction, and the contact portion of the head portion is in contact with the second probe portion during use. Resistance measuring device in a position protruding from the part. In order to measure the resistance value of the measurement object, the first and second probe parts that come into contact with the measurement object are provided, and the second probe part is formed so as to surround the first probe part. A probe, wherein the first probe portion includes a probe pin and an enlarged portion to which the probe pin is attached, and the enlarged portion has a contact portion having an outer diameter larger than the diameter of the probe pin, A measurement probe, wherein the contact portion has a tapered portion formed in a tapered shape toward the tip. 18. The measurement probe according to claim 17, wherein a space is formed in the enlarged portion, and the probe can be attached to the enlarged portion by inserting the probe pin into the space. 18. The measurement probe according to claim 17, wherein a male screw is formed at a tip portion of the probe pin, a female screw is formed at the enlarged portion, and the enlarged portion can be attached by screwing the probe pin. A probe that is in conductive contact with a predetermined measurement position of a substrate to be inspected as a measurement target, a first plate having a guide hole that guides one end of the probe to the predetermined measurement position, and the other end of the probe from the probe A second plate having a guide hole for guiding an electrode for receiving a signal, and a predetermined interval between the first and second plates, and supporting the probe and being conductive with the probe. A probe used in a substrate inspection jig having a third plate to be connected,
The probe is
In order to measure the resistance value of the measuring object, the first and second probe parts each having a contact part in contact with the measuring object are provided, and the second probe part surrounds the first probe part. The measurement probe, wherein one end of the second probe is connected to the third plate so as to be conductive. 21. The measurement probe according to claim 20, wherein the length of the second probe is substantially the same as that of the first plate to the third plate. 21. The measurement probe according to claim 20, wherein the first and second probes have elasticity. 21. The measurement probe according to claim 20, wherein a space is formed between the first probe portion and the second probe portion in a portion where the second probe portion surrounds the first probe portion. The measurement probe capable of bending the first probe portion in the space. In order to measure the resistance value of the measurement object, each of the measurement probes has a contact portion that comes into contact with the measurement object, one of which is a first and a second probe part that is used for voltage measurement and the other is used for current application. And
The first probe is formed in an elastic rod shape or needle shape,
The measurement probe, wherein the second probe has a space that allows the first probe to bend and is formed so as to surround the first probe. 25. The measurement probe according to claim 24, wherein both ends of the cylindrical member are formed in a tapered shape. 26. The measurement probe according to claim 24 or 25, wherein a protrusion for preventing removal is formed at a tip of the first probe. A method of manufacturing a measurement probe comprising first and second probe parts each having a contact part that contacts the measurement object in order to measure the resistance value of the measurement object,
Forming the first probe portion;
Forming an insulating layer covering the first probe portion around the formed first probe portion;
Forming a layer of the second probe portion around the insulating layer;
Forming a resilient biasing means at a tip of the second probe portion having a contact portion, wherein the contact portion is biased so as to protrude beyond the contact portion of the first probe portion; Forming a measuring probe. A method of manufacturing a measurement probe comprising first and second probe parts each having a contact part that contacts the measurement object in order to measure the resistance value of the measurement object,
Forming a pin-shaped first probe portion;
Forming an insulating layer covering the first probe portion around the formed pin-shaped first probe portion;
Forming a cylindrical second probe portion;
Inserting the pin-shaped first probe part formed with the insulating layer into the cylindrical second probe part;
Forming a resilient biasing means at a tip of the second probe portion having a contact portion, wherein the contact portion is biased so as to protrude beyond the contact portion of the first probe portion; Forming a measuring probe. 29. The method of manufacturing a measurement probe according to claim 27 or 28, wherein in the step of forming the head portion, the biasing means is made elastic by forming a slit in the biasing means with a laser. A method for manufacturing a measurement probe, comprising:

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