TWI407261B - Fabrication methods of patterned structures - Google Patents

Abstract

Fabrication methods of patterned structures are presented. A layer of material is provided and formed a patterned region and a non-patterned region using a multiple thermal writing heads, wherein the patterned region and the non-patterned region have different physical properties. Alternatively, the layer of material is formed on a substrate. After the layer of material is transferred into the patterned and non-patterned regions, the non-patterned region is removed.

Description

Method of manufacturing patterned structure

The present invention relates to a method of fabricating a patterned structure, and more particularly to a method of fabricating a patterned structure using a thermal transfer device.

Display panels continue to evolve toward greater size and flexibility. In order to achieve rapid and precise manufacturing results, manufacturing methods include a yellow light developing process, a laser process, an inkjet printing process, and a thermal print head printing process.

The advantage of the traditional yellow light development process is the mature semiconductor mainstream technology, which has complicated process and high automation production cost. Furthermore, the advantage of the CO ₂ laser process is the process technology currently in use. However, it must consist of a pattern of several patterns, with traces of traces between the patterns, and the production speed is slow, the laser heat source Unstable and not easy to control. On the other hand, the advantage of the inkjet printing process is that the manufacturing cost is low, but the inkjet droplets are not easy to coat all the materials, and the droplets are volatile and easily skewed, resulting in a problem of unstable pattern quality.

U.S. Patent No. US 6,498,679, discloses the use of an infrared CO ₂ laser heating source, patterning of the phase retardation film. Each laser scan processes only one thin line, and the adjacent plurality of thin lines form a pattern with a phase delay difference.

Figure 1 is a layered schematic diagram showing a conventional micro retarder structure. In Fig. 1, a microphase retarder 14 includes two regions 14a (blank regions) and 14b (hatched regions) of different phase retardation, wherein the oblique region 14b is subjected to infrared CO ₂ laser heat treatment, and the blank region 14a Then, without laser processing, a phase retardation plate in which different phases are delayed in different regions is formed. The upper and lower sides of the microphase retardation plate 14 each include a protective layer 10 and 18 which are bonded to the microphase retardation plate 14 by bonding layers 12 and 16, respectively. The oblique line region 14b of the conventional microphase retardation plate 14 is formed by scanning a plurality of lines in sequence, so that the formation rate is slow and the laser heat source is unstable, and moreover, there are traces of lines and bubbles remaining.

Therefore, there is a need in the industry for a method of manufacturing a patterned structure that is fast, concentrated in thermal energy, and has clear images.

The present invention provides a method of fabricating a patterned structure, comprising: providing a material layer; and forming the material layer into a patterned region and a non-patterned region by a multiple thermal writing head, wherein the patterned region and the non-patterned The regions have different physical properties.

The present invention further provides a method of fabricating a patterned structure, comprising: providing a material layer; and transferring the material layer to a substrate by a multiple thermal writing head to form a patterned region on the substrate, wherein the pattern The region and the substrate have different compositions.

In order to make the invention more apparent, the following detailed description of the embodiments and the accompanying drawings are as follows:

The following examples, which are accompanied by the accompanying drawings, are intended to be the basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. And in the drawings, the shape of the embodiment is either thick or thick The degree can be expanded and simplified or conveniently marked. In addition, the components of the drawings will be described separately, and it is noted that the components not shown or described in the drawings are known to those of ordinary skill in the art, and in particular, The examples are merely illustrative of specific ways of using the invention and are not intended to limit the invention.

The invention can apply the thermal transfer technology to the field of large-size soft boards and large-size display technologies. The thermal transfer technique of various embodiments of the present invention utilizes a thermal transfer device system to form a patterned flexible board structure and display panel.

Fig. 2 is a schematic view showing a system of a thermal transfer device used in an embodiment of the present invention. Referring to FIG. 2, the thermal transfer device system 100 includes a support platform 130 disposed on a base 110. The support platform 130 uses a precision bearing motor to precisely control the moving position of a thermal transfer chuck 140. The substrate or film to be patterned is fixed to the thermal transfer chuck 140. The two vertical shafts 115a and 115b fix a beam and the beam is fixed by the height fixing means 116. A multiple thermal transfer head 120 is erected and secured under the beam that is in microcontact with the substrate or film to be patterned on the thermal transfer chuck 140. The contact surface of the multiple thermal transfer head 120 with the substrate or film to be patterned is fine tuned by a thermal head autoleveling adjustment mechanism 125. The thermal transfer device system 100 further includes a microprocessor and a controller (not shown) for controlling the output of the multiple thermal transfer heads 120.

In accordance with an embodiment of the invention, the thermal transfer device system 100 can adjust the relative height of the pattern to be patterned (e.g., a layer of material on the substrate) to the thermal write head module 120 (in the Z-axis direction). The thermal write head module 120 can automatically adjust the flatness of the thermal write head to contact the pattern to be patterned by the adjustment mechanism 125. When patterned The pattern to be patterned may be fixed to the chuck 140 by vacuum or other fixing means. The pattern to be patterned fixed to the suction cup 140 is fixed by the support platform 130 using a precision bearing motor for a precision motor drive bearing. When the pattern to be patterned is driven to move by a precision motor bearing (the pattern to be drawn by the vacuum), a good pattern can be obtained.

The thermal transfer device system of the embodiment of the present invention uses a special circular thermal write head to arrange the thermal write heads, and each thermal write head unit concentrates the energy to the desired patterned display panel or On the soft board. Above the thermal write head module, a vertical height control mechanism is provided to control and adjust the distance between the thermal write head module and the patterned display panel or soft board. In addition, the temperature on the pattern to be patterned can also be changed by controlling the moving speed of the pattern to be patterned. In the design of the thermal writing head, the hot writing head with a relatively easy patterning surface can be selected to perform multi-point printing, which is suitable for large-area printing. Moreover, the energy provided by each heating unit on the thermal writing head module is stable and concentrated. Furthermore, the thermal write head can be fixed (not moved) and printed in a manner very close to the pattern to be patterned. The edges of the printed pattern are clear.

3A is a flow chart showing a method of fabricating a phase delay plate in accordance with an embodiment of the present invention. First, a film to be patterned (for example, a polymer film) is fixed on a heat transfer chuck (step S310). Next, the multiple thermal transfer head is moved from one end of the film to be patterned to the other end to form a patterned region and a non-patterned region (step S312), wherein the patterned region and the non-patterned region have Different phase delay characteristics are used as the phase delay plate of the three-dimensional (3D) image display (step S314).

FIG. 3B shows an indium tin oxide according to another embodiment of the present invention. A flow chart of a method for producing an (ITO) electrode substrate. First, a substrate is provided having a film to be patterned, such as an indium tin oxide (ITO) electrode (step S320). Next, the substrate is fixed on the thermal transfer chuck (step S322), and the multiple thermal transfer head is moved from one end of the film to be patterned to the other end to form a patterned region and a non-patterned region (step S324). The non-patterned area is removed (step S326), leaving the patterned ITO electrode area, completing the fabrication step of the ITO conductive line (step S328).

FIG. 3C is a flow chart showing a method of fabricating a color filter according to still another embodiment of the present invention. First, a substrate is provided having a film to be patterned thereon (step S330), and the substrate is fixed on the thermal transfer chuck (step S332). On the other hand, a material layer is provided (step S334), for example, a donor film is provided on the substrate. Next, the multiple thermal transfer head is moved from one end of the substrate to the other end, and a portion of the contribution layer is transferred onto the substrate to form a patterned region and a non-patterned region (step S336). Next, the step of fabricating the color filter is completed (step S328)

It should be noted that the above-mentioned embodiments of the present invention are fast by heat transfer, high in patterning speed, high in efficiency, good in quality, easy to control, stable in heat source, easy to achieve large-area process production, and can be applied to an automated reel to reel (roll -to-roll) Process.

Figure 4 is a schematic diagram showing a roll-to-roll process in accordance with an embodiment of the present invention. In FIG. 4, the flexible substrate 410, for example, the polymer substrate, is in the form of a reel 430 to a reel 440, and is fixed to a specific position by a thermal transfer head module 420, thereby controlling the rotation speed of the reel. The production of a continuous large-area patterned structure is achieved.

According to the embodiment of the present invention, the heat energy of the heating body on the thermal print head is concentrated, stable, and individually controllable, and can be applied to fields such as a 3D phase retardation plate, an ITO electrode substrate, and a soft plate photoresist. . Solve the shortcomings of traditional laser scanning speed and pattern quality. Furthermore, the ITO electrode substrate is fabricated by a thermal transfer process instead of the conventional yellow photolithography process. And, directly transfer the photoresist to the soft board to replace the yellow lithography process.

Figures 5A and 5B show schematic diagrams of a 3D image phase retardation plate fabricated using a thermal transfer device. Referring to FIG. 5A, a patterned film (eg, a polymer film) 500a is heated by a multiple thermal transfer head to form a patterned region 520 and a non-patterned region 510 as a phase retardation plate for a three-dimensional (3D) image display. . The patterned regions 520 may be periodic stripes or stripes 520a and 520b of different widths as shown in FIG. 5B. Alternatively, the patterned regions may be in other shapes such as a grid.

6A-6C is a schematic cross-sectional view showing the steps of the ITO electrode substrate manufactured by the thermal transfer device. Referring to FIG. 6A, first, a substrate 610 is provided, and an ITO electrode layer 620 is formed thereon. The multiple thermal transfer head 630 is moved from one end (left end) of the substrate 610 to the other end (right end) to form a patterned ITO electrode region 622, for example, heat converted into a crystallized material, as shown in FIG. 6B. .

Referring to FIG. 6C, the non-patterned region 620 is removed, leaving the patterned ITO electrode region 622 to complete the fabrication of the ITO electrode substrate.

7A-7C is a schematic cross-sectional view showing the steps of a donor film substrate fabricated using a thermal transfer device. Referring to FIG. 7A, a substrate 710 is provided, and a donor film 720 is disposed thereon. square. The donor film 720 can be a dry photoresist film or a colored layer. The multiple thermal transfer head 730 is moved from one end (left end) of the substrate 710 to the other end (right end), and is transferred into a patterned region 722a on the substrate 710 as shown in FIG. 7B.

Then, another contribution film (not shown) may be disposed on the substrate 710, the thermal transfer step is repeated, and another patterned region 722b is transferred onto the substrate 710 as shown in FIG. 7C.

The invention has the advantages of adopting multiple thermal transfer heads, which have the characteristics of concentrated and stable energy, and can be applied to the ITO soft board structure instead of the traditional yellow light process manufacturing method. Furthermore, the combination of thermal transfer technology and roll-to-roll soft board process and the transfer of ribbon material to the flexible board is excellent.

The present invention has been disclosed in the above embodiments, but it is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Conventional part (Figure 1)

10 and 18‧‧‧ protective layers

12 and 16‧‧‧bonded layers

14‧‧‧Microphase retardation board

14a and 14b‧‧‧ regions with different phase delays

Part of this case (Fig. 2~7C)

100‧‧‧Hot transfer device system

110‧‧‧Base

115a and 115b‧‧‧ vertical axis

116‧‧‧High fixture

120‧‧‧Multiple thermal transfer heads

125‧‧‧Automatic leveling adjustment mechanism

130‧‧‧Support platform

140‧‧‧Hot transfer cups

S310-S314‧‧‧Process steps

S320-S328‧‧‧Process steps

S330-S338‧‧‧Process steps

410‧‧‧Soft substrate

420‧‧‧Heat transfer head module

430 and 440‧‧‧ reels

500a‧‧‧ patterned film

510‧‧‧Unpatterned area

520‧‧‧ patterned area

520a and 520b‧‧‧ stripes with different widths

610, 710‧‧‧ substrate

620‧‧‧ITO electrode layer

622‧‧‧ patterned area

630, 730‧‧‧Multiple thermal transfer head module

720‧‧‧donor film

722a, 722b‧‧‧ patterned area

1 is a layered schematic diagram showing a conventional micro retarder structure; FIG. 2 is a schematic view showing a thermal transfer device system used in an embodiment of the present invention; and FIG. 3A is a view showing an embodiment according to the present invention. A flowchart of a method of fabricating a phase retardation plate; FIG. 3B is a flow chart showing a method of fabricating an indium tin oxide (ITO) electrode substrate according to another embodiment of the present invention; and FIG. 3C is a view showing still another embodiment of the present invention. A flow chart of a method of fabricating a color filter; FIG. 4 is a schematic view showing a roll-to-roll process according to an embodiment of the present invention; and FIGS. 5A and 5B are diagrams showing a process using a thermal transfer device; 3D image phase retardation plate; 6A-6C is a schematic cross-sectional view showing the steps of the ITO electrode substrate manufactured by the thermal transfer device; and 7A-7C shows the contribution film manufactured by the thermal transfer device (donor) Film) A schematic cross-sectional view of each step of the substrate.

100‧‧‧Hot transfer device system

110‧‧‧Base

115a and 115b‧‧‧ vertical axis

116‧‧‧High fixture

120‧‧‧Multiple thermal transfer heads

125‧‧‧Automatic leveling adjustment mechanism

130‧‧‧Support platform

140‧‧‧Hot transfer cups

Claims (9)

A method of fabricating a patterned structure, comprising: providing a material layer, wherein the material layer comprises a polymer material, an indium tin oxide or a contribution film; forming a pattern of the material layer by a multiple thermal writing head a region and a non-patterned region; and wherein the patterned region and the non-patterned region have different physical properties. The method of fabricating a patterned structure according to claim 1, wherein the multiple thermal writing head is moved from a section of the material layer to the other end of the material layer to pattern the material layer. The method of fabricating a patterned structure according to claim 1, wherein the material layer is a reel-to-reel substrate. The method of fabricating a patterned structure according to claim 1, wherein the patterned region and the non-patterned region have different phase retardation characteristics. The method of fabricating a patterned structure according to claim 1, wherein the material layer is formed on a substrate. The method of fabricating the patterned structure of claim 1, further comprising removing the non-patterned region. A method of fabricating a patterned structure, comprising: providing a material layer, wherein the material layer comprises a color layer; and transferring the material layer to a substrate by a multiple thermal writing head to form a patterned region on the substrate Upper to form a color filter. The method of fabricating a patterned structure according to claim 7, wherein the multiple thermal writing head is moved from a section of the material layer to the other end of the material layer to pattern the material layer. The method of fabricating a patterned structure according to claim 7, wherein the material layer is a reel-to-reel substrate.