200944948 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種圖案化結構的製造方法，特別有 關於一種利用熱轉寫裝置製造圖案化結構的方法。 【先前技術】 板制朝大尺寸化及可撓性發展。為 ❿速且精確製造效果，製造方法包括黃光顯影製程、雷射製 程喷墨印刷製程和熱寫頭(thermal如加)印刷製程。 傳統黃光顯影製程的優點為成熟的半導體主流技術， 其製程複雜且自動化生產成本高。再者，C02雷射製程的 優點為目前實際採用的製程技術，然而，其必須由一條圖 案_t㈣由數條圖帛組成，各條圖案之間有線痕跡，且生 產速度慢，雷射熱源不穩定且品質不易控制。另一方面， 參喷墨P刷裝程的優點為製造成本低，然而喷墨液滴不易塗 佈所有材質’且液滴易揮發與易歪斜，導致圖案品質不穩 之問題。 美國專利US 6,498,679，揭露使用紅外線c〇2雷射源 加熱，製作圖案化位相延遲膜。每次雷射掃描只加工-條 細線，由相鄰的複數條細線構成具相延遲差異的圖紋。 第1圖係顯示傳統微位相延遲(microretarder)結構的 分層不意圖。於第！圖中，—微位相延遲板14包括兩個不 同位相延遲的區域14a(空白區域)和14b(斜線區域），其中 斜線區域14b是經過紅外線c〇2雷射加熱處理，而空/白區 5 200944948 域14a則未經過雷射處理，形成交替相延遲不同區域的位 相延遲板。微位相延遲板14的上、下侧各包括一保護層 10和18,分別藉由黏結層12和16與微位相延遲板14貼 合。傳統微位相延遲板14的斜線區域Mb是由雷射依序掃 描多線形成，因而形成速率慢且雷射熱源不穩定，更有甚 者’有線條痕跡及氣泡殘留。 因此，業界亟需一種速度快、熱能源集中以及影像清 ❿晰的圖案化結構的製造方法。 【發明内容】 本發明提供一種圖案化結構的製造方法，包括：提供 一材料層；以及以一多重熱寫頭將該材料層形成一圖案化 區域和一非圖案化區域，其中該圖案化區域和該非圖案化 區域具有不同的物理性質。 本發明另提供一種圖案化結構的製造方法，包括：提 ❿供一材料層；以及以一多重熱寫頭將該材料層轉移至一基 板，以形成一圖案化區域於該基板上，其中該圖案化區域 和該基板具有不同的組成。 為使本發明能更明顯易僅，下文特舉實施例，並配合 所附圖式，作詳細說明如下： 【實施方式】 以下以各實施例並伴隨者圖式說明之範例，做為木絡 明之參考依據。在圖式或說明書描述中，相似或相 i 分皆使用相同之圖號。且在圖式中，實施例之形狀或β = 6 200944948 度可擴大，並以簡化或是方便標示。再者，圖式中一 之部分將以分別描述說明之，值得注意的是，圖中元件 或描述之元件，為所屬技術領域中具有通常知識者所:不 形式，另外，特定之實施例僅為揭示本發明使用之二的 式’其並非用以限定本發明。 、疋方 本發明可將熱轉寫技術應用在大尺寸軟板和大尺寸顯 示器技術領域。本發明各實施例之熱轉寫技術利用一熱 ❹寫裝置系統形成圖案化軟板結構及顯示面板。 、 第2圖係顯示本發明實施例所使用的熱轉寫裴置系統 的示意圖。請參閱第2圖，熱轉寫裝置系統1〇〇包括一支 撐平台130設置於一基座11〇上。支撐平台13〇利用精密 軸承馬達，精確控制一熱轉寫吸盤14〇的移動位置。待圖 案化的基板或膜固定於熱轉寫吸盤14〇。兩垂直軸115&和 115b固定一橫樑，並由高度固定裝置116固定橫樑。一多 重熱轉寫頭120架設並固定在橫樑下，其可與熱轉寫吸盤 © 上的待圖案化的基板或膜微接觸(micro contact)。多重 熱轉寫頭120與待圖案化的基板或膜的接觸面由一熱寫頭 自動平整調整機構125微調。熱轉寫裝置系統1〇〇更包括 微處理器及控制器（未繪示）具以控制多重熱轉寫頭12〇的 輸出。 根據本發明實施例’熱轉寫裝置系統1〇〇可調整待圖 案化物(例如基板上的材料層）的高度與熱寫頭模組120的 相對位置（沿Z-軸方向）。熱寫頭模組12〇可藉由調整機構 125 ’自動調整熱寫頭接觸待圖案化物時平整度。當圖案化 7 200944948 時，待圖案化物可由 上。固定於…。上二圓=方 ,^違為一精密馬達驅動軸承所固定。者待圖奢 承驅動移動時(待圖案化物 J獲件良好的圖紋(pattern)。 頭，轉寫裝置系統使用特殊圓形熱寫 量(_議中精準到所需^^^一面熱寫頭單元將能 ㈣宜模 設有—垂直高度控職構，以控制並, „模組和待圖案化顯示面板或軟板之間距離。= 化物工控案化物的移動速度，而改變待圖案 Ο 實施多點印刷，適合大面積印刷。並且，熱寫項 將熱單元所提供能源穩定又集中。再者，可 :寫頭固疋（不移動），以極接近待圖案化物的方式印 。如此印刷出來的圖案邊緣清晰。 贺你第3A圖顯*根據本發明之—實施例的位相延遲板的 膜^法的流程圖。首先，將一待圖案化膜（例如一高分子 頭白固定於熱轉寫吸盤上（步驟S310)。接著，將多重熱轉寫 區該待圖案化膜的—端移向另—端，使其形成—圖案化 和-非圖案化區域(步驟S3l2)，其中該圖案化區域和 影俊圖案化區域具有不同的位相延遲特性，以做為三維(3D) ly顯示器的位相延遲板（步驟S314)。 第3B圖顯示根據本發明另一實施例的銦錫氧化物 8 200944948 (ITO)電極基板的製作方法的流程圖。首先，提供一基板， 其上具有一待圖案化膜’例如銦錫氧化物(汀0)電極(步驟 S320)。接著，將基板固定於熱轉寫吸盤上（步驟s322)，將 多重熱轉寫頭自該待圖案化膜的一端移向另一端，使其形 成一圖案化區域和一非圖案化區域（步驟S324)。移除非圖 案化區域(步驟S326)，留下圖案化的肋冑極區域，完成 IT0導電線路的製作步驟(步驟S328)。 〇 第3C圖顯示根據本發明又一實施例的彩色遽光板的 J乍方法的流程圖。首先，提供—基板，其上具有一待圖 、化膜（步驟S330)，並將基板固定於熱轉寫吸盤上（步驟 f32)。另一方面，提供一材料層（步驟S334)，例如設置一 膜(donor film)於該基板上。接著，將多重熱轉寫頭自 板的—端移向另—端，使部分的貢獻層轉移至該基板 —形，一圖案化區域和一非圖案化區域（步驟幻36)。接 者，完成彩色濾光板的製作步驟(步驟S328)。 ® 應>主意的是，上述本發明實施例藉由熱轉寫法，圖案 的速度快、效率高、品質佳、易控制且熱源穩定、易達 、大面積化製程生產且可應用自動化捲軸至捲軸 〇 ，製程。 第4圖係顯示根據本發明實施例之捲軸至捲軸(r〇u_t〇 製程的示意圖。於第4圖中，將軟性基板410，例如 子基板，以捲軸430至捲軸440的型式，並利用一熱 速率頭^組420，固定於特定位置，因此控制捲轴的轉動 ，即可達成連續式大面積化的圖案化結構的製作。 9 200944948 根據本發明實施例，#由熱轉寫頭(thermal printhead) 上的加熱體熱能集中、穩定及可個別控制的特性，可應用 在3D位相延遲板、IT〇電極基板及軟板光阻等領域。解決 傳統雷射掃描速度慢及圖案品質的缺陷。再者，應用熱轉 寫製程製作ΙΤ〇電極基板，取代傳統黃絲刻製仏以及， 直接轉印光阻至軟板上取代黃光微影製程。 第5Α和5Β圖係顯示利用熱轉寫裝置製造的3D影像 ❹位，延遲板的示意圖。請參閱第5A圖，待圖案化膜(例如 1分子膜）5GGa被多重熱轉寫頭加熱形成一圖案化區域 520和一非圖案化區域51〇，做為三維(3D)影像顯示器的位 相延遲板。圖案化區域520可為週期的條紋，亦可為寬度 不同的條紋520a和520b，如第5B圖所示。又或者，圖案 化區域可為其他形狀如格子狀。 第6A-6C圖係顯示利用熱轉寫裝置製造的IT〇電極基 板各步驟的剖面示意圖。請參閱第6Α圖，首先，提供一 ❿基板61〇，並形成一 ΙΤΟ電極層62〇於其上。將多重熱轉 寫頭630自該基板610的一端（左端）移向另一端（右端），使 其形成一圖案化ΙΤΟ電極區域622，例如加熱轉變成結晶 化的材質，如第6Β圖所示。 請參閱第6C圖，移除非圖案化區域62〇，留下圖案化 的ΙΤΟ電極區域622 ’完成ΙΤΟ電極基板的製作。 第7A-7C圖係顯示利用熱轉寫裝置製造的貢獻膜 (donor film)基板各步驟的剖面示意圖。請參閱第7Α圖， 提供一基板710 ’並設置一貢獻膜（d〇nor film) 720於其上 10 200944948 方。貢獻膜（donor film) 72Q可為乾式光阻膜或彩色層。將 多重熱轉寫頭730自該基板710的一端（左端）移向另一端 (右端）’轉移成一圖案化區域722a於基板710上，如第7B 圖所示。 接著，可選擇設置另一貢獻膜（未繪示）於基板71〇上， 重複熱轉寫步驟，轉移另一圖案化區域722b於基板71〇 上，如第7C圖所示。200944948 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of fabricating a patterned structure, and more particularly to a method of fabricating a patterned structure using a thermal transfer device. [Prior Art] The plate system has been developed toward large size and flexibility. For idling and precise manufacturing, manufacturing methods include a yellow light development process, a laser process inkjet printing process, and a thermal write process. The advantages of the traditional yellow light development process are mature semiconductor mainstream technologies, which are complicated in process and high in automation production cost. Furthermore, the advantage of the C02 laser process is the process technology currently in use. However, it must consist of a pattern _t (four) consisting of several patterns, with traces between the patterns, and the production speed is slow, and the laser heat source is not Stable and not easy to control. On the other hand, the advantage of the inkjet P brushing process is that the manufacturing cost is low, but the inkjet droplets are not easy to coat all the materials' and the droplets are volatile and easily skewed, resulting in an unstable pattern quality. U.S. Patent No. 6,498,679, the disclosure of which is incorporated herein by reference to the entire entire entire entire entire entire entire entire entire entire portion Each laser scan processes only a thin line, and a plurality of adjacent thin lines form a pattern with a phase difference difference. Figure 1 shows the stratification of the conventional microretarder structure. In the first! In the figure, the micro phase retardation plate 14 includes two regions 14a (blank regions) and 14b (hatched regions) of different phase retardation, wherein the oblique region 14b is subjected to infrared c〇2 laser heat treatment, and the empty/white region 5 200944948 Domain 14a is not subjected to laser processing, forming a phase retardation plate with alternating phase delays in different regions. The upper and lower sides of the microphase retardation plate 14 each include a protective layer 10 and 18 which are bonded to the microphase retardation plate 14 by bonding layers 12 and 16, respectively. The oblique line region Mb of the conventional microphase retardation plate 14 is formed by scanning a plurality of lines in sequence, so that the formation rate is slow and the laser heat source is unstable, and there are more cases where there are line marks and bubble residues. Therefore, there is a need in the industry for a method of manufacturing a patterned structure that is fast, concentrated in thermal energy, and clear in image. SUMMARY OF THE INVENTION The present invention provides a method of fabricating a patterned structure, comprising: providing a material layer; and forming the material layer into a patterned region and a non-patterned region by a multiple thermal writing head, wherein the patterning The region and the non-patterned region have different physical properties. The present invention further provides a method of fabricating a patterned structure, comprising: lifting a material layer; and transferring the material layer to a substrate by a multiple thermal writing head to form a patterned region on the substrate, wherein The patterned region and the substrate have different compositions. In order to make the present invention more obvious, the following specific embodiments, together with the accompanying drawings, are described in detail below: [Embodiment] Hereinafter, examples of the embodiments and accompanying drawings are used as the wood system. The reference basis of Ming. In the description of the drawings or the description, the same figure numbers are used for similar or similar parts. And in the drawings, the shape of the embodiment or β = 6 200944948 degrees can be expanded and simplified or conveniently marked. Furthermore, a part of the drawings will be described separately, and it is noted that the elements in the figures or the elements of the description are those of ordinary skill in the art: no form, and in addition, the specific embodiments only The invention is not intended to limit the invention. The present invention can be applied to the field of large-size flexible boards and large-size display technologies. The thermal transfer technique of various embodiments of the present invention utilizes a thermal writing device system to form a patterned flexible board structure and display panel. Figure 2 is a schematic diagram showing a thermal transfer system used in an embodiment of the present invention. Referring to Fig. 2, the thermal transfer device system 1 includes a support platform 130 disposed on a base 11A. The support platform 13〇 uses a precision bearing motor to precisely control the moving position of a heat transfer chuck 14〇. The substrate or film to be patterned is attached to the thermal transfer chuck 14A. Two vertical axes 115 & and 115b secure a beam and the beam is secured by a height fixture 116. A plurality of reheat transfer heads 120 are erected and secured under the beam, which can be in micro contact with the substrate or film to be patterned on the thermal transfer chuck ©. The contact surface of the multiple thermal transfer head 120 with the substrate or film to be patterned is fine tuned by a thermal head autoleveling adjustment mechanism 125. The thermal transfer device system 1 further includes a microprocessor and a controller (not shown) for controlling the output of the multiple thermal transfer heads 12A. According to an embodiment of the present invention, the thermal transfer device system 1 can adjust the height of the pattern to be patterned (e.g., the material layer on the substrate) and the relative position of the thermal write head module 120 (in the Z-axis direction). The thermal write head module 12 can automatically adjust the flatness of the thermal write head to contact the pattern to be patterned by the adjustment mechanism 125'. When patterning 7 200944948, the pattern to be patterned can be applied. Fixed at... The upper two circles = square, ^ is fixed by a precision motor drive bearing. When the image is driven by the luxury drive (the pattern to be obtained is good for the pattern J. The head, the transfer device system uses a special circular heat write amount (_ negligence to the required ^^^ side hot write) The head unit will be able to (4) be modeled with a vertical height control structure to control and, „module and the distance between the panel or the soft panel to be patterned. = The moving speed of the chemical control solution, and the pattern to be changedΟ Multi-point printing is suitable for large-area printing. Moreover, the hot writing item stabilizes and concentrates the energy provided by the thermal unit. Furthermore, the writing head can be fixed (not moving) and printed in a manner very close to the pattern to be patterned. The edge of the printed pattern is clear. Hehe 3A shows a flow chart of the film of the phase retardation plate according to the embodiment of the present invention. First, a film to be patterned (for example, a polymer head white is fixed on The heat transfer onto the chuck (step S310). Next, the end of the multiple thermal transfer zone of the film to be patterned is moved to the other end to form a patterned and non-patterned area (step S3122), wherein The patterned area and the shadow patterning area have no The phase delay characteristic is used as a phase retardation plate of a three-dimensional (3D) ly display (step S314). FIG. 3B shows a method for fabricating an indium tin oxide 8 200944948 (ITO) electrode substrate according to another embodiment of the present invention. First, a substrate is provided having a film to be patterned, such as an indium tin oxide (Ten 0) electrode (step S320). Next, the substrate is fixed on the thermal transfer chuck (step s322), The multiple thermal transfer head moves from one end of the pattern to be patterned to the other end to form a patterned area and a non-patterned area (step S324). The non-patterned area is removed (step S326), leaving a pattern The ribbed pole region completes the manufacturing step of the IT0 conductive line (step S328). 〇 Figure 3C shows a flow chart of the J乍 method of the color phosphor plate according to still another embodiment of the present invention. First, a substrate is provided. There is a film, a film (step S330), and the substrate is fixed on the thermal transfer chuck (step f32). On the other hand, a material layer is provided (step S334), for example, a donor film is provided. On the substrate. Next, it will be multiple The thermal transfer head moves from the end of the plate to the other end, so that part of the contribution layer is transferred to the substrate-shaped, a patterned region and a non-patterned region (step 36). The color filter is completed. The manufacturing step (step S328). ® It should be understood that the above embodiment of the present invention has a high speed, high efficiency, good quality, easy control, stable heat source, easy access, and large area by the thermal transfer method. Process manufacturing and application of automated reel-to-reel 〇, process. Figure 4 is a schematic view showing a reel-to-reel process according to an embodiment of the present invention. In Figure 4, a flexible substrate 410, such as a sub-substrate, is used. The pattern of the reel 430 to the reel 440 is fixed to a specific position by a thermal rate head set 420, so that the rotation of the reel is controlled to achieve the production of a continuous large-area patterned structure. 9 200944948 According to an embodiment of the present invention, the heat energy of the heating body on the thermal printhead is concentrated, stable, and individually controllable, and can be applied to a 3D phase retardation plate, an IT〇 electrode substrate, and a soft plate photoresist. And other fields. Solve the shortcomings of traditional laser scanning speed and pattern quality. Furthermore, the thermal transfer process is used to fabricate the tantalum electrode substrate, instead of the conventional yellow wire engraving and direct transfer of the photoresist to the soft board to replace the yellow light lithography process. Figures 5 and 5 show schematic diagrams of 3D image clamps and retardation plates fabricated using thermal transfer devices. Referring to FIG. 5A, a patterned film (eg, a molecular film) 5GGa is heated by a multiple thermal transfer head to form a patterned region 520 and an unpatterned region 51〇 as a phase delay of a three-dimensional (3D) image display. board. The patterned regions 520 may be periodic stripes or stripes 520a and 520b of different widths as shown in FIG. 5B. Alternatively, the patterned regions may be in other shapes such as a grid. Figures 6A-6C are schematic cross-sectional views showing the steps of an IT crucible electrode substrate fabricated using a thermal transfer device. Referring to Figure 6, first, a substrate 61 is provided and a germanium electrode layer 62 is formed thereon. The multiple thermal transfer head 630 is moved from one end (left end) of the substrate 610 to the other end (right end) to form a patterned germanium electrode region 622, for example, heated to a crystallized material, as shown in FIG. . Referring to Fig. 6C, the non-patterned region 62 is removed, leaving the patterned germanium electrode region 622' to complete the fabrication of the germanium electrode substrate. 7A-7C is a schematic cross-sectional view showing the steps of a donor film substrate manufactured by a thermal transfer device. Referring to Figure 7, a substrate 710' is provided and a contribution film 720 is disposed thereon. The donor film 72Q may be a dry photoresist film or a color layer. The multiple thermal transfer head 730 is transferred from one end (left end) of the substrate 710 to the other end (right end) to be transferred into a patterned region 722a on the substrate 710 as shown in Fig. 7B. Then, another contribution film (not shown) may be disposed on the substrate 71, the thermal transfer step is repeated, and another patterned region 722b is transferred onto the substrate 71A as shown in FIG. 7C.
❹ —本發明的優點在於採用多重熱轉寫頭 ，其具有集中穩 疋能重的特性，i m丄 贺作方 ]應用在IT0軟板結構取代傳統黃光製程 奸你锢扭再者’結合熱轉寫技術和捲轴至捲轴(roll-to-ro11) 軟板H並將色帶材料轉印至軟板上的效果極佳。 明的範;月::::例揭露如上’然其並非用以限定本發 離本發明之精神 ^領域中具有通常知識者’在不脫 此本發明之保護騎内，當可做些許的更動與潤飾，因 準。 'w 當视後附之申請專利範圍所界定者為 200944948 【圖式簡單說明】 第1圖係顯示傳統微位相延遲㈣以。retarder)結構的 分層示意圖； 第2圖係顯示本發明實施例所使用的熱轉寫裝置系統 的示意圖； 第3A圖顯示根據本發明之一實施例的位相延遲板的 製作方法的流程圖； 第3B圖顯示根據本發明另一實施例的銦錫氧化物 (ITO)電極基板的製作方法的流程圖； 第3C圖顯示根據本發明又一實施例的彩色滤光板的 製作方法的流程圖； 第4圖係顯示根據本發明實施例之捲軸至捲轴 (roll-to-roll)製程的示意圖； 第5A和5B圖係顯示利用熱轉寫裝置製造的3D影像 位相延遲板的示意圖； 第6A-6C圖係顯示利用熱轉寫裝置製造的IT〇電極基 板各步驟的剖面示意圖；以及 第7A-7C圖係顯示利用熱轉寫裝Ϊ製造的貝獻膜 (donor film)基板各步驟的剖面示意圖。 【主要元件符號說明】 習知部分(第1圈） 10和18〜保護層； 12和16〜黏結層； 12 200944948 14〜微位相延遲板； 14a和14b〜不同位相延遲的區域。 本案部分(第2〜7C圈） 1〇〇〜熱轉寫裝置系統； 110〜基座； 115a和115b〜垂直軸； 116〜高度固定裝置； 120〜多重熱轉寫頭； 125〜自動平整調整機構； 130〜支撐平台； 140〜熱轉寫吸盤； S310-S314〜製程步驟； S320-S328〜製程步驟； S330-S338〜製程步驟； 410〜軟性基板； 420〜熱轉寫頭模組； 430和440〜捲軸； 500a〜待圖案化膜； 510〜非圖案化區域； 520〜圖案化區域； 520a和520b〜寬度不同的條紋； 610、710〜基板； 620〜ITO電極層； 13 200944948❹—The invention has the advantages of adopting multiple thermal transfer heads, which have the characteristics of concentrated and stable weight, and the application of the IT0 soft board structure in place of the traditional yellow light process, and the combination of the heat transfer Technology and roll-to-ro11 soft board H and transfer of ribbon material to the soft board is excellent. The following is a description of the above; however, it is not intended to limit the scope of the present invention to the general knowledge of the present invention. Change and refine, as accurate. 'w As defined in the attached patent application scope is 200944948 [Simple description of the diagram] Figure 1 shows the traditional microphase delay (four). FIG. 2 is a schematic diagram showing a thermal transfer device system used in an embodiment of the present invention; FIG. 3A is a flow chart showing a method of fabricating a phase retardation plate according to an embodiment of the present invention; 3B is a flow chart showing a method of fabricating an indium tin oxide (ITO) electrode substrate according to another embodiment of the present invention; FIG. 3C is a flow chart showing a method of fabricating a color filter according to still another embodiment of the present invention; 4 is a schematic view showing a roll-to-roll process according to an embodiment of the present invention; FIGS. 5A and 5B are views showing a 3D image phase retardation plate manufactured by using a thermal transfer device; The -6C diagram shows a schematic cross-sectional view of each step of the IT crucible electrode substrate manufactured by the thermal transfer device; and the 7A-7C diagram shows the cross section of each step of the donor film substrate manufactured by the thermal transfer device. schematic diagram. [Main component symbol description] Conventional part (1st circle) 10 and 18~ protective layer; 12 and 16~ bonding layer; 12 200944948 14~micro phase phase retardation plate; 14a and 14b~ different phase retardation areas. Part of this case (2nd ~ 7C circle) 1〇〇 ~ thermal transfer device system; 110 ~ pedestal; 115a and 115b ~ vertical axis; 116 ~ height fixture; 120 ~ multiple thermal transfer head; 125 ~ automatic leveling adjustment Mechanism; 130~ support platform; 140~ hot transfer suction cup; S310-S314~ process step; S320-S328~ process step; S330-S338~ process step; 410~soft substrate; 420~ thermal transfer head module; And 440 ~ reel; 500a ~ to be patterned film; 510 ~ non-patterned area; 520 ~ patterned area; 520a and 520b ~ different width stripes; 610, 710 ~ substrate; 620 ~ ITO electrode layer; 13 200944948
622〜圖案化區域； 630、730〜多重熱轉寫頭模組； 720〜貢獻膜（donor film); 722a、722b〜圖案化區域。 14622~patterned area; 630, 730~multiple thermal transfer head module; 720~donor film; 722a, 722b~patterned area. 14