TWI404833B - Electroplate system and method for using the same - Google Patents

Abstract

An electroplate system includes a plating tank, a power supply, an anode rod, an anode, a cathode rod, a plating rack, an auxiliary cathode rod, and an auxiliary cover. The anode rod, the cathode rod and the auxiliary cathode rod are all connected with the power supply. The anode is fixed to the anode rod. The plating rack is fixed to the cathode. The plating rack has a plurality of electrically conductive pins. The auxiliary cathode cover is fixed to the auxiliary cathode rod, and is arranged between the plating rack and the anode. The auxiliary cathode cover has a cover opposite to a printed circuit board. The cover has a peripheral portion and a central portion. The electrically conductive pins are opposite to the peripheral portion. The peripheral portion defines a number of first through holes, the central portion defines a second through hole. The first through holes and the second through are used to control the density distribution of the metal ion released by the anode after running through the auxiliary cathode cover. A plating method using the above electroplate system is also provided.

Description

Plating system and plating method

The invention relates to electroplating technology, in particular to an electroplating system and a plating method.

With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, electroplating, exposure, development, etching, pressing, printing, molding, and the like. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).

Among them, the electroplating system is an important process for the production of circuit boards, which mainly uses an electroplating system to selectively plate copper on the surface of the circuit board and copper plating on the through hole walls. Previous plating systems included a plating bath, power supply, anode rod, plated anode, cathode rod and pylon. A plating solution is placed in the etching bath for plating the board. The positive and negative poles of the power supply device are electrically connected to the anode rod and the cathode rod, respectively. The electroplated anode is connected to the anode rod, and the hanger is connected to the cathode rod. The electroplated anode and the pylon are both disposed in the plating bath and immersed in the plating bath of the plating bath. The electroplated anodes are respectively opposed to the pylons. The pylon is used to suspend the circuit board to be plated so that the surface of the board is opposite to the plated anode. After the power supply device is energized, the metal ions deposited by the electroplating anode are deposited and plated on the circuit board under the action of a current. At this time, the circuit board is equivalent to the cathode. However, since the current of the circuit board is introduced by the conductive pinch of the pylon, the current density of the two edge regions of the circuit board to be plated close to the conductive pinch is higher, and the central area of the circuit board far from the conductive pinch is The current density is low. Moreover, since the deposition amount of the metal ions is proportional to the current density, the metal deposited on the two edge regions of the circuit board and the conductive pinch is thicker, and the metal deposited in the central region of the circuit board is thinner, causing metal deposition. Uneven thickness affects plating quality.

In view of the above, in view of the above problems, it is necessary to provide an electroplating system and a plating method which can improve the uniformity of metal deposition thickness of a circuit board during electroplating, thereby improving plating quality.

An electroplating system and a plating method will be described below by way of specific examples.

An electroplating system for electroplating at least one circuit board. The electroplating system includes a plating bath, a power supply device, an anode rod, a plated anode, a cathode rod, a pylon, an auxiliary cathode rod and an auxiliary cathode cover. The plating bath is loaded with a plating solution. The power supply device has a positive electrode and a negative electrode. The anode rod is connected to the anode, and the cathode rod is connected to the anode. The electroplated anode and the pylon are both disposed in the plating bath and immersed in the plating solution. The plated anode is fixed to the anode rod, and the plated anode is used to supply metal ions required for plating of the circuit board. The pylon is fixed to the cathode rod and opposite the plated anode, the pylon having a plurality of conductive pinch points. The plurality of conductive clips are used to clamp the at least one circuit board and power the at least one circuit board for electroplating. The auxiliary cathode rod is connected to the negative electrode. The auxiliary cathode cover is fixed to the auxiliary cathode rod. The auxiliary cathode cover is opposite to the hanger and located between the hanger and the plating anode. The auxiliary cathode cover includes at least one cover opposite the at least one circuit board. The at least one cover includes a first edge region, a second edge region, and a central region, the central region being located between the first edge region and the second edge region. The plurality of conductive clips of the pylon are opposite the first edge region and the second edge region. The first edge region and the second edge region of the at least one cover are respectively provided with a plurality of first through holes. The diameter of the plurality of first through holes increases as the distance from the central portion decreases. A central portion of the at least one cover is provided with a second through hole, and the second through hole has a larger diameter than any of the first through holes.

An electroplating method comprising the steps of: providing at least one circuit board and a plating system as described above, the at least one circuit board having a first surface to be plated; clamping the at least one circuit board to the pylon with a plurality of conductive pinch points and Immersing in the plating solution of the plating bath, so that the first surface is opposite to the auxiliary cathode cover; and the power supply device supplies power to the plating anode, the pylon and the auxiliary cathode cover, so that the metal ions are precipitated in the plating anode, and the metal ions deposited by the plating anode pass through A plurality of first via holes and a second via hole of the auxiliary cathode cover are reduced and deposited on the first surface to plate the at least one circuit board.

An electroplating system for electroplating at least one circuit board. The electroplating system includes a plating bath, a power supply device, an anode rod, a plated anode, a cathode rod, a pylon, two auxiliary cathode rods, and two auxiliary cathode hoods. The plating bath is loaded with a plating solution. The power supply device has a positive electrode and a negative electrode. The anode rod is connected to the anode, and the cathode rod is connected to the anode. The electroplated anode and the pylon are both disposed in the plating bath and immersed in the plating solution. The plated anode is fixed to the anode rod, and the plated anode is used to supply metal ions required for plating of the circuit board. The pylon is fixed to the cathode rod and opposite the plating anode. The pylon has a plurality of conductive clips for clamping and securing the at least one circuit board and powering the at least one circuit board for electroplating. The two auxiliary cathode rods are respectively connected to the negative electrode. The two auxiliary cathode covers are respectively fixed to the two auxiliary cathode rods. The number of the plated anodes is two, and the two plated anodes are respectively disposed on opposite sides of the hanger. The two auxiliary cathode covers are respectively disposed on opposite sides of the hanger, and each auxiliary cathode cover is located between the hanger and a plating anode. Each of the auxiliary cathode covers includes at least one cover opposite the at least one circuit board. The at least one cover includes a first edge region, a second edge region, and a central region, the central region being located between the first edge region and the second edge region. The plurality of conductive clips of the pylon are opposite the first edge region and the second edge region. The first edge region and the second edge region of the at least one cover are respectively provided with a plurality of first through holes. The diameter of the plurality of first through holes increases as the distance from the central portion decreases. A central portion of the at least one cover is provided with a second through hole, and the second through hole has a larger diameter than any of the first through holes.

An electroplating method comprising the steps of: providing at least one circuit board and a plating system as described above, the at least one circuit board having a first surface and a second surface to be plated; clamping the at least one circuit board by a plurality of conductive pinch points And immersing in the electroplating bath of the electroplating bath, so that the first surface and the second surface are respectively opposite to the two auxiliary cathode covers; and the power supply device supplies power to the two electroplating anodes, the pylon and the two auxiliary cathode covers, And causing the two electroplating anodes to precipitate metal ions, and the metal ions deposited by the electroplating anode pass through the plurality of first through holes and the second through holes of the two auxiliary cathode covers and are reduced and deposited on the first surface and the second surface to At least one of the boards is plated.

An electroplating system for electroplating at least one circuit board. The electroplating system includes a plating tank, a power supply device, an anode rod, a plated anode, a cathode rod, a pylon, an auxiliary cathode rod, and an auxiliary cathode cover. The plating bath is loaded with a plating solution. The power supply device has a positive electrode and a negative electrode. The anode rod is connected to the anode, and the cathode rod is connected to the anode. The electroplated anode and the pylon are both disposed in the plating bath and immersed in the plating solution. The plated anode is fixed to the anode rod, and the plated anode is used to supply metal ions required for plating of the circuit board. The pylon is fixed to the cathode rod and opposite the plating anode. The pylon has a plurality of conductive pinch points. The plurality of conductive clips are used to clamp the at least one circuit board and power the at least one circuit board for electroplating. The auxiliary cathode rod is connected to the anode, and the auxiliary cathode cover is fixed to the auxiliary cathode rod. The auxiliary cathode cover is located between the hanger and the plating anode. The auxiliary cathode cover includes at least one cover opposite the at least one circuit board. The at least one cover includes a peripheral zone and a central zone that is opposite the plurality of conductive pinch points of the pylon. The peripheral portion of the at least one cover is provided with a plurality of first through holes, and the diameter of the plurality of first through holes decreases as the distance from the central portion increases. The central area defines a plurality of second through holes, wherein the sum of the cross-sectional areas of the plurality of second through holes occupies a larger proportion of the cross-sectional area of the central area than the cross-sectional area of the plurality of first through holes occupies the peripheral area The ratio of the cross-sectional area.

Compared with the prior art, the electroplating system and the electroplating method of the present technical solution can utilize an auxiliary cathode cover to control the amount of metal ions passing through the first through hole and the second through hole, so that the metal ions pass through the auxiliary cathode cover. The density distribution is relatively uniform, which improves the uniformity of the thickness of the metal layer deposited on the circuit board, thereby improving the plating quality of the circuit board.

The electroplating system and the electroplating method of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 to FIG. 2 , the first embodiment of the present technical solution provides an electroplating system 10 for electroplating at least one circuit board 20 . The plating system 10 includes a plating tank 11, a power supply device 12, an anode rod 13, a plating anode 14, a cathode rod 15, a pylon 16, an auxiliary cathode rod 17, and an auxiliary cathode cover 18. The plating anode 14, the pylon 16 and the auxiliary cathode cover 18 are both disposed in the plating tank 11. The auxiliary cathode cover 18 is located between the plating anode 14 and the hanger 16.

Specifically, the plating tank 11 has a bottom wall 111, a first side wall 112, and a second side wall 113. The first sidewall 112 and the second sidewall 113 are perpendicularly connected to the bottom wall 111, respectively. The first sidewall 112 is parallel to the second sidewall 113. The plating bath 11 is loaded with a plating solution 101.

The power supply device 12 has a positive electrode 121 and a negative electrode 122. The power supply device 12 is used to provide the direct current required for the plating of the circuit board 20.

The anode rod 13 is connected to the positive electrode 121 of the power supply device 12. The cathode rod 15 and the auxiliary cathode rod 17 are both connected to the negative electrode 122 of the power supply device 12.

The plating anode 14 is fixed to the anode rod 13 so that the power supply unit 12 can supply the plating anode 14 with the anode rod 13. The plating anode 14 is immersed in the plating solution 101 of the plating bath 11. The plated anode 14 is used to supply metal ions, such as copper ions, required for plating of the circuit board 20. In this embodiment, the number of the plating anodes 14 is two, and the two plating anodes 14 are respectively parallel to the first side wall 112 and the second side wall 113 of the plating tank 11. In addition, when only one surface of the circuit board 20 needs to be plated, the number of the plating anodes 14 may be one, and the one plating anode 14 is opposed to the first side wall 112 of the plating tank 11.

The pylon 16 is fixed to the cathode rod 15 and opposite to the plating anode 14. The power supply device 12 can supply power to the pylon 16 by the cathode rod 15. The pylon 16 is located between the plating anode 14 and the second sidewall 113 of the plating tank 11. The pylon 16 is immersed in the plating solution 101 of the plating tank 11. In this embodiment, the two plating anodes 14 are respectively disposed on opposite sides of the hanger 16.

The pylon 16 includes two vertical bars 161, two cross bars 162, hooks 163 and a plurality of conductive clips 164. The two vertical rods 161 are parallel to each other, and the two horizontal rods 162 are parallel to each other and are respectively movably connected to the two ends of the two vertical rods 161, so that the distance between the two vertical rods 161 can be separated by the two horizontal rods The 162 is adjusted to clamp the circuit board 20 having different sizes. The hook 163 can be attached to the vertical rod 161 or the crossbar 162. In this embodiment, the number of the hooks 163 is two, and the two hooks 163 are fixedly connected to the two vertical rods 161, respectively. The plurality of conductive clips 164 are disposed on the two vertical rods 161. The plurality of conductive clips 164 are used to clamp the at least one circuit board 20 and power the at least one circuit board 20 for electroplating.

The auxiliary cathode cover 18 is fixed to the auxiliary cathode rod 17. The auxiliary cathode cover 18 is opposite the pylon 16 and is located between the pylon 16 and the plating anode 14. The number of the auxiliary cathode rod 17 and the auxiliary cathode cover 18 may be one or two. In this embodiment, the number of the auxiliary cathode rods 17 and the auxiliary cathode cover 18 is two, and the two auxiliary cathode covers 18 are respectively fixed to the two auxiliary cathode rods 17. The two auxiliary cathode covers 18 are respectively disposed on opposite sides of the pylon 16, and each auxiliary cathode cover 18 is located between the pylon 16 and a plating anode 14.

Referring to FIGS. 3 and 4 together, each of the auxiliary cathode covers 18 includes at least one cover 182. The at least one cover 182 is opposite the at least one circuit board 20. The shape of the cover 182 corresponds to the shape of the circuit board 20, and the at least one cover 182 includes a first edge region 1821, a second edge region 1822, and a central region 1825. The central zone 1825 is located between the first edge zone 1821 and the second edge zone 1822. The two vertical rods 161 of the pylon 16 are respectively opposite to the first edge area 1821 and the second edge area 1822, that is, the plurality of conductive clips 164 of the pylon 16 and the first edge area 1821 and the second The edge regions 1822 are opposite. In this embodiment, the cover 182 has a rectangular shape.

The first edge region 1821 and the second edge region 1822 of the at least one cover 182 are each provided with a plurality of first through holes 102. The diameter of the plurality of first through holes 102 increases as the distance from the central portion 1825 decreases, that is, the diameter of the first through holes 102 located between the first edge region 1821 and the second edge region 1822 is the largest. Moreover, a central portion 1825 of the at least one cover 182 defines a second through hole 103. In this embodiment, the second through hole 103 is located at the center of the central area 1825. The diameter of the second through hole 103 is larger than the diameter of any of the first through holes 102. The shapes of the first through hole 102 and the second through hole 103 may be circular, elliptical, square, rectangular, polygonal or other irregular shapes.

In this embodiment, the shape of the first through hole 102 and the second through hole 103 are both circular. One of the diameters of the first through holes 102 is arranged as follows: the cover 182 is disposed in the X direction in a direction perpendicular to the vertical rod 161 of the pylon 16, and in the Y direction in a direction parallel to the vertical rod 161. The cover body 182 has a length X ₀ in the X direction and a Y ₀ length in the Y direction. The length of the cover 182 in the X direction is divided into five equal portions, and the length X ₁ of each portion is X ₀ /5. The cover 182 is provided with nine rows of first through holes 102 parallel to the X direction. There are nine first through holes 102 in each row. The two first through holes 102 of the nine first through holes 102 located at the outermost sides of the first edge region 1821 and the second edge region 1822 have a diameter A1, and the two first through holes 102 having the diameter A1 are oriented. The diameters of the three pairs of first through holes 102 are A2, A3 and A4, and the diameter of the first one of the first through holes 102 is A5, and A1=0.2X ₁ , A2=1.2A1, A3=1.2A2, A4 =1.2A3, A5=1.2A4.

Further, the cover 182 further includes an opposite third edge region 1823 and a fourth edge region 1824. The first edge region 1821, the third edge region 1823, the second edge region 1822 and the fourth edge region 1824 are sequentially connected and surround the central region 1825. The material of the first edge region 1821, the second edge region 1822, the third edge region 1823 and the fourth edge region 1824 is made of metal, and the material of the central region 1825 is non-metal. The central area 1825 is circular in shape. The distance between the central portion 1825 of the circle and the circuit board 20 gradually changes, and the distance between the circumference of the central portion 1825 and the circuit board 20 is smaller than the distance between the center of the central portion 1825 and the circuit board 20.

Preferably, the auxiliary cathode cover 18 has a rectangular shape, and the peripheral edges of the auxiliary cathode cover 18 respectively extend toward the circuit board 20 to form a bent portion 184. The bent portion 184 has an extension length of 10 mm to 20 mm. The distance between the bent portion 184 and the circuit board 20 to be plated is 2 mm to 5 mm. In this embodiment, the bent portion 184 has an extension length of 15 mm. The distance between the bent portion 184 and the circuit board 20 to be plated is 5 mm.

Moreover, in other embodiments, the auxiliary cathode cover can also be designed in other configurations. details as follows:

In a second embodiment, referring to FIG. 5, the auxiliary cathode cover 28 includes at least one cover 282. The cover 282 is different from the cover 182 of the first embodiment in that the distance between the cover 282 and the circuit board is gradually changed, and the first edge region 2821, the second edge region 2822, and the third edge region 2823 and The distance between the four edge regions 2824 and the circuit board is less than the distance between the central region 2825 and the circuit board.

In a third embodiment, referring to FIG. 6, the auxiliary cathode cover 38 includes at least one cover 382. The cover 382 is different from the cover 182 in the first embodiment in that the distance between the cover 382 and the circuit board is gradually changed, and the distance between the first edge region 3821 and the second edge region 3822 and the circuit board is smaller than the central region. The distance between the 3825 and the board.

In the fourth embodiment, referring to FIG. 7, the auxiliary cathode cover 48 includes at least one cover 482. The cover 482 differs from the cover 182 of the first embodiment in that the cover 482 includes a peripheral zone 4821 and a central zone 4825. The peripheral zone 4821 is opposite the plurality of conductive pinch points of the pylon. The peripheral portion 4482 of the cover 482 is provided with a plurality of first through holes 402. The diameter of the plurality of first through holes 402 decreases as the distance from the central portion 4825 increases. The central portion 4825 of the cover 482 has a flat shape. The central area 4825 defines a plurality of second through holes 403. The ratio of the total cross-sectional area of the plurality of second through holes 403 to the cross-sectional area of the central portion 4825 is greater than the ratio of the cross-sectional area of the plurality of first through holes 402 to the cross-sectional area of the peripheral portion 4821. .

Referring to FIG. 8 , an embodiment of the present technical solution further provides an electroplating method for electroplating the circuit board 20 by using the electroplating system 10 described above. When the circuit board 20 only needs to electroplate one surface, the electroplating method includes the following steps:

Step 110, providing at least one circuit board 20 and an electroplating system 10 as described above, the at least one circuit board 20 having a first surface 21 to be electroplated.

Specifically, each of the circuit boards 20 has a first surface 21 and a second surface 22 opposite thereto. Wherein, the first surface 21 is a surface to be plated. At this time, the plating system 10 may include only one plating anode 14, one auxiliary cathode rod 17, and one auxiliary cathode cover 18.

In step 120, the at least one circuit board 20 is clamped and fixed to the pylon 16 by the plurality of conductive clips 164 and immersed in the plating solution 101 of the plating bath 11, so that the first surface 21 is opposed to the auxiliary cathode cover 18.

Specifically, the at least one circuit board 20 can be first fixed to the pylon 16 by the conductive pinch 164; then, the auxiliary cathode cover 18 is fixed on the auxiliary cathode rod 17, the auxiliary cathode cover 18 and the at least one The first surface 21 of the circuit board 20 is opposed; then, the pylon 16, the at least one circuit board 20 and the auxiliary cathode cover 18 are immersed in the plating solution 101 of the plating bath 11. At this time, the auxiliary cathode cover 18 is opposed to the plating anode 14 , and the auxiliary cathode cover 18 is located between the plating anode 14 and the hanger 16 .

In step 130, the power supply device 12 supplies power to the plating anode 14, the pylon 16 and the auxiliary cathode cover 18 to cause metal ions to be deposited in the plating anode 14. The metal ions deposited by the plating anode 14 pass through the plurality of first through holes 102 of the auxiliary cathode cover 18. And a second via 103 and is deposited on the first surface 21 to plate the at least one circuit board 20.

Specifically, the positive electrode 121 of the power supply device 12 is positively charged to the plating anode 14, and the negative electrode 122 is negatively charged to the pylon 16 and the auxiliary cathode cover 18. The plating anode 14 is immersed in the plating solution 101 to deposit metal ions, and the metal ions move from the plating anode 14 to the auxiliary cathode cover 18 and the pylon 16 by the action of current. The metal ions are passed through the first through hole 102 and the second through hole 103 of the auxiliary cathode cover 18 with the plating solution 101, and then deposited on the first surface 21 of the circuit board 20 to form a plating layer.

After the plating is completed, the at least one circuit board 20 can be taken out of the plating tank 11. Specifically, the pylon 16 and at least one circuit board 20 fixed on the pylon 16 are taken out from the plating tank 11, and then the at least one circuit board 20 is removed from the pylon 16, the circuit board 20 The plating is completed. After the plating is completed, the circuit board 20 proceeds to the next production process to continue production.

Referring to FIG. 9 , an embodiment of the present technical solution further provides a second plating method for plating the circuit board 20 by using the electroplating system 10 described above. When the opposite surfaces of the circuit board 20 need to be electroplated, the electroplating is performed. The method includes the following steps:

Step 210, providing at least one circuit board 20 and an electroplating system 10 as described above, the at least one circuit board 20 having a first surface 21 and a second surface 22 to be electroplated.

Specifically, each of the circuit boards 20 has a first surface 21 and a second surface 22 opposite thereto. Wherein, the first surface 21 and the second surface 22 are surfaces to be plated. At this time, the plating system 10 includes two plated anodes 14, two auxiliary cathode rods 17, and two auxiliary cathode covers 18.

Step 220, the at least one circuit board 20 is clamped and fixed to the pylon 16 by the plurality of conductive clips 164 and immersed in the plating solution 101 of the plating bath 11, so that the first surface 21 and the second surface 22 respectively and the two auxiliary The cathode cover 18 is opposite.

Specifically, the at least one circuit board 20 can be first fixed to the pylon 16 by the conductive pinch 164; then, the two auxiliary cathode hoods 18 are respectively fixed on the two auxiliary cathode rods 17, respectively. The auxiliary cathode cover 18 is respectively opposite to the first surface 21 and the second surface 22 of the at least one circuit board 20; then, the hanger 16, the at least one circuit board 20 and the two auxiliary cathode covers 18 are immersed in the plating tank 11 In the plating solution 101. At this time, the two auxiliary cathode covers 18 are respectively opposed to the two plating anodes 14, and each of the auxiliary cathode covers 18 is located between the plating anode 14 and the hanger 16.

Step 230, the power supply device 12 supplies power to the two electroplating anodes 14, the pylons 16, and the two auxiliary cathode hoods 18, so that the two electroplating anodes 14 deposit metal ions, and the metal ions deposited by the electroplating anode 14 pass through two auxiliary The plurality of first vias 102 and one of the second vias 103 of the cathode cover 18 are reduced and deposited on the first surface 21 and the second surface 22 to plate the at least one circuit board 20.

Specifically, the positive electrode 121 of the power supply device 12 is positively charged to the two plating anodes 14, and the negative electrode 122 is negatively charged to the pylon 16 and the two auxiliary cathode covers 18. The two plating anodes 14 are immersed in the plating solution 101 to deposit metal ions, and the metal ions are moved from the two plating anodes 14 to the two auxiliary cathode covers 18 by the action of current. The metal ions are passed through the first through holes 102 and the second through holes 103 of the two auxiliary cathode covers 18 with the plating solution 101, and then deposited on the first surface 21 and the second surface 22 of the circuit board 20 to form a plating layer, respectively.

After the plating is completed, at least one of the circuit boards 20 after plating is taken out from the plating tank 11. Specifically, the pylon 16 and at least one circuit board 20 fixed on the pylon 16 are taken out from the plating tank 11, and then the at least one circuit board 20 is removed from the pylon 16, the circuit board 20 The plating is completed. After the plating is completed, the circuit board 20 proceeds to the next production process to continue production.

Compared with the prior art, the electroplating system and the electroplating method of the present technical solution can utilize an auxiliary cathode cover to control the amount of metal ions passing through the first through hole and the second through hole, so that the metal ions pass through the auxiliary cathode cover. The density distribution is relatively uniform, which improves the uniformity of the thickness of the metal layer deposited on the circuit board, thereby improving the plating quality of the circuit board.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. In the prior art, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Electroplating system

11‧‧‧ plating bath

12‧‧‧Power supply unit

13‧‧‧Anode rod

14‧‧‧Electroplating anode

15‧‧‧ cathode rod

16‧‧‧ hanging rack

17‧‧‧Auxiliary cathode rod

18, 28, 38, 48‧‧‧Auxiliary cathode cover

111‧‧‧ bottom wall

112‧‧‧First side wall

113‧‧‧ second side wall

101‧‧‧ plating solution

121‧‧‧ positive

122‧‧‧negative

161‧‧‧ Vertical rod

162‧‧‧crossbar

163‧‧‧ hook

164‧‧‧conductive pinch

182, 282, 382, 482 ‧ ‧ cover

184‧‧‧Bend

1821, 2821, 3821‧‧‧ first marginal zone

1822, 2822, 3822‧‧‧ second marginal zone

1823, 2823, 4823‧‧‧ third marginal zone

1834, 2824‧‧‧ fourth marginal zone

1825, 2825, 3825, 4825‧‧‧ central area

4821‧‧‧The surrounding area

102, 402‧‧‧ first through hole

103, 403‧‧‧ second through hole

20‧‧‧ boards

21‧‧‧ first surface

22‧‧‧ second surface

1 is a schematic view of an electroplating system provided by a first embodiment of the present technical solution.

2 is a schematic view of a rack of an electroplating system according to a first embodiment of the present technical solution.

3 is a schematic view of an auxiliary cathode cover of the electroplating system provided by the first embodiment of the present technical solution.

Figure 4 is a cross-sectional view of the auxiliary cathode cover of Figure 3 taken along the line IV-IV.

FIG. 5 is a schematic diagram of an auxiliary cathode cover of an electroplating system according to a second embodiment of the present technical solution.

6 is a schematic diagram of an auxiliary cathode cover of a plating system provided by a third embodiment of the present technical solution.

FIG. 7 is a schematic diagram of an auxiliary cathode cover of an electroplating system according to a fourth embodiment of the present technical solution.

FIG. 8 is a flow chart of a plating method provided by the first embodiment of the present technical solution.

FIG. 9 is a flow chart of a plating method provided by a second embodiment of the present technical solution.

10‧‧‧Electroplating system

11‧‧‧ plating bath

12‧‧‧Power supply unit

13‧‧‧Anode rod

14‧‧‧Electroplating anode

15‧‧‧ cathode rod

16‧‧‧ hanging rack

17‧‧‧Auxiliary cathode rod

18‧‧‧Auxiliary cathode cover

111‧‧‧ bottom wall

112‧‧‧First side wall

113‧‧‧ second side wall

101‧‧‧ plating solution

121‧‧‧ positive

122‧‧‧negative

20‧‧‧ boards

21‧‧‧ first surface

22‧‧‧ second surface

Claims (15)

An electroplating system for electroplating at least one circuit board, the electroplating system comprising a plating tank, a power supply device, an anode rod, a plating anode, a cathode rod and a hanger, the plating tank being loaded with a plating solution, the power supply device having a positive electrode and a negative electrode, the anode rod is connected to the positive electrode, the cathode rod is connected to the negative electrode, the plating anode and the pylon are disposed in the plating tank and immersed in the plating solution, the plating anode is fixed on the anode rod, and the plating anode is used Providing metal ions required for electroplating of the circuit board, the pylon is fixed on the cathode rod and opposite to the plating anode, the pylon has a plurality of conductive pin points, and the plurality of conductive pin points are used for clamping and fixing the at least one circuit board And supplying power to the at least one circuit board, wherein the plating system further includes an auxiliary cathode rod and an auxiliary cathode cover, the auxiliary cathode rod is connected to the negative electrode, and the auxiliary cathode cover is fixed to the auxiliary cathode rod, An auxiliary cathode cover is opposite to the hanger and located between the hanger and the plating anode, the auxiliary cathode cover includes at least one cover, the at least one The cover body is opposite to the at least one circuit board, and the at least one cover body comprises a first edge area, a second edge area and a central area, the central area being located between the first edge area and the second edge area, the rack The plurality of conductive pin points are opposite to the first edge area and the second edge area, and the first edge area and the second edge area of the at least one cover are respectively provided with a plurality of first through holes, and the diameter of the plurality of first through holes is The distance between the central portion and the central portion is increased. The central portion of the at least one cover is provided with a second through hole having a larger diameter than any of the first through holes. The electroplating system of claim 1, wherein the at least one cover further comprises a third edge zone and a fourth edge zone, the first edge zone, the third edge zone, and the second edge zone. The fourth edge region is connected in sequence and both surround the central region. The material of the first edge region, the second edge region, the third edge region and the fourth edge region is metal, and the material of the central region is non-metal. The electroplating system of claim 2, wherein the central area has a circular shape, the distance between the central area and the circuit board gradually changes, and the distance between the circumference of the central area and the circuit board is smaller than the center of the central area. The distance from the board. The electroplating system of claim 2, wherein the distance between the cover and the circuit board is gradually changed, and the first edge region, the second edge region, the third edge region and the fourth edge region and the circuit board The distance is less than the distance between the central area and the board. The electroplating system of claim 1, wherein the distance between the cover and the circuit board is gradually changed, and the distance between the first edge region and the second edge region and the circuit board is smaller than the distance between the central region and the circuit board. . The electroplating system of claim 1, wherein the auxiliary cathode cover is rectangular, and the peripheral edges of the auxiliary cathode cover respectively extend toward the circuit board to form a bent portion. The electroplating system of claim 6, wherein the bent portion has an extension length of 10 mm to 20 mm, and the distance between the bent portion and the circuit board to be plated is 2 mm to 5 mm. An electroplating method comprising the steps of:
Providing at least one circuit board and the electroplating system according to claim 1, wherein the at least one circuit board has a first surface to be electroplated;
The at least one circuit board is clamped and fixed to the pylon by a plurality of conductive clips and immersed in the plating solution of the plating tank so that the first surface is opposite to the auxiliary cathode cover; and the power supply device supplies power to the plating anode, the pylon and the auxiliary cathode cover In order to cause the electroplating anode to precipitate metal ions, the metal ions deposited by the electroplating anode pass through the plurality of first through holes and the second through holes of the auxiliary cathode cover and are reduced and deposited on the first surface to plate the at least one circuit board. An electroplating system for electroplating at least one circuit board, the electroplating system comprising a plating tank, a power supply device, an anode rod, a plating anode, a cathode rod and a hanger, the plating tank being loaded with a plating solution, the power supply device having a positive electrode and a negative electrode, the anode rod is connected to the positive electrode, the cathode rod is connected to the negative electrode, the plating anode and the pylon are disposed in the plating tank and immersed in the plating solution, the plating anode is fixed on the anode rod, and the plating anode is used Providing metal ions required for electroplating of the circuit board, the pylon is fixed on the cathode rod and opposite to the plating anode, the pylon has a plurality of conductive pin points, and the plurality of conductive pin points are used for clamping and fixing the at least one circuit board And supplying the at least one circuit board for electroplating, wherein the electroplating system further comprises two auxiliary cathode rods and two auxiliary cathode covers, wherein the two auxiliary cathode rods are respectively connected to the negative pole, and the two auxiliary cathode covers are respectively Fixed to the two auxiliary cathode rods, the number of the electroplating anodes is two, and the two electroplating anodes are respectively disposed on opposite sides of the rack, the two A cathode hood is respectively disposed on opposite sides of the pylon, and each auxiliary cathode cover is located between the pylon and a plating anode, each auxiliary cathode cover includes at least one cover, the at least one cover and the at least one cover A circuit board is directly opposite, the at least one cover body comprises a first edge area, a second edge area and a central area, the central area is located between the first edge area and the second edge area, and the plurality of conductive pinch points of the pylon The first edge region is opposite to the second edge region, and the first edge region and the second edge region of the at least one cover are respectively provided with a plurality of first through holes, and the diameter of the plurality of first through holes is distance from the central region The central portion of the at least one cover is open with a second through hole having a larger diameter than any of the first through holes. The electroplating system of claim 9, wherein the at least one cover further comprises a third edge zone and a fourth edge zone, the first edge zone, the third edge zone, and the second edge zone. The fourth edge region is connected in sequence and both surround the central region. The material of the first edge region, the second edge region, the third edge region and the fourth edge region is metal, and the material of the central region is non-metal. The electroplating system according to claim 10, wherein the central area has a circular shape, the distance between the central area and the circuit board gradually changes, and the distance between the circumference of the central area and the circuit board is smaller than the center of the central area. The distance from the board. The electroplating system of claim 9, wherein the auxiliary cathode cover is rectangular, and the peripheral edges of the auxiliary cathode cover respectively extend toward the circuit board to form a bent portion. The electroplating system of claim 12, wherein the bent portion has an extension length of 10 mm to 20 mm, and the distance between the bent portion and the circuit board to be plated is 2 mm to 5 mm. An electroplating method comprising the steps of:
Providing at least one circuit board and the electroplating system according to claim 9, wherein the at least one circuit board has a first surface and a second surface to be electroplated;
Holding and fixing at least one circuit board to the pylon by using a plurality of conductive pinch points and immersing in the plating solution of the plating tank, so that the first surface and the second surface are respectively opposite to the two auxiliary cathode covers; and the power supply device gives two plating The anode, the pylon and the two auxiliary cathode covers are powered to cause metal ions to be deposited in the two electroplating anodes, and the metal ions deposited by the electroplating anode pass through the plurality of first through holes and the second through holes of the two auxiliary cathode covers. The reduction is deposited on the first surface and the second surface to plate the at least one circuit board. An electroplating system for electroplating at least one circuit board, the electroplating system comprising a plating tank, a power supply device, an anode rod, a plating anode, a cathode rod and a hanger, the plating tank being loaded with a plating solution, the power supply device having a positive electrode and a negative electrode, the anode rod is connected to the positive electrode, the cathode rod is connected to the negative electrode, the plating anode and the pylon are disposed in the plating tank and immersed in the plating solution, the plating anode is fixed on the anode rod, and the plating anode is used Providing metal ions required for electroplating of the circuit board, the pylon is fixed on the cathode rod and opposite to the plating anode, the pylon has a plurality of conductive pin points, and the plurality of conductive pin points are used for clamping and fixing the at least one circuit board And supplying power to the at least one circuit board, wherein the plating system further comprises an auxiliary cathode rod and an auxiliary cathode cover, the auxiliary cathode rod is connected to the negative electrode, and the auxiliary cathode cover is fixed to the auxiliary cathode rod, the auxiliary cathode a cover is disposed between the pylon and the plated anode, the auxiliary cathode cover includes at least one cover, the at least one cover and the at least one circuit Aligning, the at least one cover body includes a peripheral area and a central area, the peripheral area is opposite to the plurality of conductive pinch points of the pylon, and the plurality of first through holes are opened in the peripheral area of the at least one cover body, the plurality of first through holes The diameter of the hole decreases as the distance from the central area increases. The central area defines a plurality of second through holes, and the sum of the cross-sectional areas of the plurality of second through holes accounts for a larger proportion of the cross-sectional area of the central area. The sum of the cross-sectional areas of the plurality of first vias occupies a ratio of the cross-sectional area of the peripheral region.