TWI402933B - Vacuum chuck seat for semiconductor component cutting equipment capable of supplying cooling water - Google Patents

Description

Vacuum chuck seat for semiconductor component cutting equipment capable of supplying cooling water Cross-references to related applications

The priority of Korean New Application No. 2009-15344, which is incorporated by reference in its entirety, is hereby incorporated by reference.

Field of invention

The present invention relates to a vacuum chuck holder for a semiconductor element cutting apparatus which can supply cooling water and, more particularly, relates to the use of cooling water for cooling the heat generated when a semiconductor element body is cut using a cutting blade in a semiconductor element mold body. A vacuum chuck holder for a semiconductor component cutting apparatus.

Background of the invention

Generally, a semiconductor device mold system is a wiring bonding process of bonding a semiconductor wafer to a circuit board or a lead frame mounting board by an adhesive, and a wiring bonding process of connecting a wafer pad and a lead frame or a circuit board lead provided on the semiconductor wafer, A molding process is performed for internal circuits and other components around the semiconductor wafer.

The resulting semiconductor component phantom is transferred to a semiconductor component dicing apparatus and then diced into semiconductor components (i.e., individual semiconductor wafer units). An apparatus for cutting a semiconductor element is provided with a vacuum chuck holder configured to attract and support a semiconductor element mold body to cut a semiconductor element mold body into a semiconductor wafer using a dicing blade.

However, in the semiconductor element mold body having the lead formed on the side thereof, when the semiconductor element mold body is cut with the dicing blade, heat is generated from the side surface of the semiconductor element phantom. The existing vacuum chuck seat does not have the function of cooling the semiconductor element body. Therefore, the metal lead is melted by the heat generated by the semiconductor element phantom, and overlaps with other leads, resulting in a defect such as staining or melting.

Summary of invention

Accordingly, the present invention has been made in view of the above problems occurring in the prior art, and an object of the present invention is to provide a vacuum chuck holder for a semiconductor element cutting apparatus which can use cooling water for cooling to use a cutting blade in a semiconductor element mold body. The heat generated when the semiconductor element body is cut.

To achieve the above object, according to the present invention, there is provided a vacuum chuck holder which is provided in an apparatus for cutting a semiconductor element mold body and which is configured to support a semiconductor element mold body. The vacuum chuck holder includes a chuck base; a support unit attached to the top surface of the chuck base and configured to support the semiconductor element mold body; and a cooling water supply unit configured to supply cooling water. A plurality of vacuum holes are formed in the support unit. Air is absorbed through the vacuum holes, and the semiconductor element body is attracted to the support unit. The cooling water is supplied through the cooling water supply unit, thereby removing heat generated when the semiconductor element body is cut.

The support unit can be made of rubber.

The cooling water supply unit may include a plurality of horizontal cooling water lines formed parallel to the chuck base; and a plurality of vertical cooling water lines respectively formed in a vertical direction on the horizontal cooling water line side and configured to supply cooling water.

The support unit grooves may be formed on the upper side of the individual support unit. The support groove allows the cutting blade of the apparatus for cutting a semiconductor element to enter and cut the semiconductor element body. The cooling water is supplied via the support grooves, thereby removing heat generated when the semiconductor element body is cut.

The vacuum collet holder may further include a collet base support having a vacuum hole formed in the center and supporting the collet base.

The support unit may have a hardness of Hs10 to Hs55.

The support unit may have a hardness of Hs60 to Hs95.

To achieve the above object, according to the present invention, there is provided a vacuum chuck holder which is provided in an apparatus for cutting a semiconductor element mold body and which is configured to support a semiconductor element mold body. The vacuum collet holder includes a collet base; a second supporting unit attached to the top surface of the collet base; and a first supporting unit attached to the top surface of the second supporting unit and configured to support the semiconductor component body, The first support unit is made of a material having a lower hardness than the second support unit material; and a cooling water supply unit configured to supply cooling water. A plurality of vacuum holes are formed in the first and second support units. Air is absorbed through the vacuum holes, and the semiconductor element body is attracted to the first support unit. The cooling water is supplied through the cooling water supply unit, thereby removing heat generated when the semiconductor element body is cut.

The first support unit and the second support unit may be made of a rubber material.

The cooling water supply unit may include a plurality of horizontal cooling water lines formed parallel to the chuck base; and a plurality of vertical cooling water lines respectively formed in a vertical direction on the horizontal cooling water line side and configured to supply cooling water.

The support unit grooves are formed on the upper side of the individual support units. The support groove allows the cutting blade of the apparatus for cutting a semiconductor element to enter and cut the semiconductor element body. The cooling water is supplied via the support grooves, thereby removing heat generated when the semiconductor element body is cut.

The vacuum collet holder may further include a collet base support having a vacuum hole formed in the center and supporting the collet base.

The first support unit may have a hardness of Hs10 to Hs55.

The second support unit may have a hardness of Hs60 to Hs95.

Simple illustration

Other objects and advantages of the present invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a vacuum chuck showing a semiconductor element cutting device capable of supplying cooling water according to a first specific example of the present invention. 2 is a plan view showing a vacuum chuck holder of a semiconductor element cutting apparatus according to a first embodiment of the present invention; and FIG. 3 is a sectional view of the vacuum chuck holder taken along line DD of FIG. 4 is a top plan view of a support unit in a vacuum chuck holder according to a first embodiment of the present invention; FIG. 5 is a cross-sectional view of the first support unit taken along line KK of FIG. 4; FIG. A perspective view of a vacuum chuck holder for a semiconductor element cutting apparatus capable of supplying cooling water according to a second embodiment of the present invention; and FIG. 7 is a sectional view of the vacuum chuck holder taken along line BB of FIG. 6; 8 is a view showing an embodiment of a vacuum chuck holder using the semiconductor element cutting apparatus according to the first specific example of the present invention.

Detailed description of the preferred embodiment

Hereinafter, some specific examples of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting apparatus which can supply cooling water according to a first embodiment of the present invention. Fig. 2 is a plan view showing a vacuum chuck holder of a semiconductor element cutting apparatus according to a first specific example of the present invention. Figure 3 is a cross-sectional view of the vacuum chuck seat taken along line D-D of Figure 2;

As shown in FIGS. 1 to 3, the vacuum chuck holder 200 includes a chuck base 220, a top surface of the chuck base 220, and a support unit 240 for supporting the semiconductor element mold body 110, and is configured to supply cooling water. The cooling water supply unit 210, and the collet base support body 230 formed to support the collet base 220 and having a large vacuum hole 400 formed in the center thereof.

The collet base 220 constitutes the body of the vacuum collet holder 200 and has a plurality of vacuum holes 400 formed therein. The vacuum aperture 400 is configured to penetrate the collet base 220.

A plurality of vacuum holes 400 are formed in the support unit 240. A vacuum inhaler (not shown) draws air through the vacuum hole 400 to cause the semiconductor element mold body 110 to be sucked to the support unit 240.

The support unit 240 provides vacuum chuck seat stability such that the semiconductor component phantom is not pushed by the lateral cutting pressure.

The support units 240 are each configured to have a vacuum hole 400 formed therein and coupled to the collet base 220. The vacuum holes 400 of the support unit 240 correspond to the individual vacuum holes 400 of the chuck base 220. The support unit groove 241 is formed on the upper side of the support unit 240. The support groove 241 allows the cutting blade of the semiconductor element cutting device to enter and cut the semiconductor element mold body 110. Further, the cooling water is supplied via the support groove 241, thereby removing heat generated when the semiconductor element body 110 is cut.

The collet base 220 is preferably made of iron, and the support unit 240 may be made of rubber. The support unit 240 may have a hardness of Hs10 to Hs55 or Hs60 to Hs95.

The cooling water supply unit 210 includes a plurality of horizontal cooling water lines 211 formed parallel to the collet base 220 and a plurality of vertical cooling water lines 212 formed perpendicular to the collet base 220. A vertical cooling water line 212 is formed on the upper side of the individual horizontal cooling water line 211 and configured to supply cooling water. A vertical cooling water line 212 is formed in the collet base 220 and the support unit 240. The cooling water supplied via the cooling water supply unit 210 is for removing heat generated when the semiconductor element body 110 is cut.

Fig. 4 is a detailed plan view of a support unit in a vacuum chuck holder according to a first embodiment of the present invention, and Fig. 5 is a cross-sectional view of the first support unit taken along line K-K of Fig. 4.

As shown in FIGS. 4 and 5, the cooling water is supplied via the horizontal cooling water line 211 and reaches the support unit groove 241 via the vertical cooling water line 212. The cooling water reaching the support unit groove 241 is for removing heat generated when the cutting blade of the semiconductor element cutting device cuts the semiconductor element mold body 110. As shown in FIG. 4, the support unit grooves 241 are formed to surround the respective vacuum holes 400.

Figure 6 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting device capable of supplying cooling water according to a second embodiment of the present invention, and Figure 7 is a sectional view of the vacuum chuck holder taken along line BB of Figure 6 .

As shown in FIGS. 6 and 7, the vacuum chuck holder of the semiconductor element cutting apparatus according to the second specific example further includes the second supporting unit 250 as compared with the first specific example. The vacuum collet holder 200 according to the second embodiment includes a collet base 220, a second supporting unit 250 coupled to the top surface of the collet base 220, and is attached to the top surface of the second supporting unit 250, respectively, and configured to support the semiconductor component mold body. The first supporting unit 240 of the 110, the cooling water supply unit 210 configured to supply cooling water, and the collet base supporting body 230 formed to have a large vacuum hole 400 formed in the center thereof and supporting the collet base 220. Here, the material constituting the first support unit 240 has a lower hardness than the material constituting the second support unit 250.

The chuck base 220, the first support unit 240, the cooling water supply unit 210, and the collet base support body 230 have the same configuration as the first specific example, and the description thereof is omitted for simplicity. A plurality of vacuum holes 400 are formed in the respective second support units 250. The vacuum hole 400 of the second supporting unit 250 is coupled to the individual vacuum hole 400 of the first supporting unit 240. A vacuum inhaler (not shown) draws air through the vacuum hole 400 to cause the semiconductor element mold body 110 to be sucked to the first support. Unit 240. Further, a plurality of vertical cooling water lines 212 for supplying cooling water are formed in the respective second supporting units 250. Vertical horizontal cooling water lines 212 are formed in respective first support units 240 and coupled to individual horizontal cooling water lines 211. Therefore, the cooling water is supplied via the horizontal cooling water line 211 and the vertical horizontal cooling water line 212.

The second support unit 250 is made of a hard rubber having a hardness of preferably - Hs60 to Hs95. The second support unit 250 is coupled to the lower side of the first support unit 240, respectively, to attract and support the semiconductor element mold body 110. Therefore, the second support unit 250 provides stability of the vacuum collet holder 200 to prevent the semiconductor element mold body 110 from being pushed by the lateral cutting pressure.

The first support unit 240 is made of a soft rubber having a hardness of preferably - Hs10 to Hs55. The semiconductor element mold body 110 is disposed on the top surface of the first support unit 240. The first supporting unit 240 sucks and supports the semiconductor element mold body 110. Since the first supporting unit 240 is made of a soft material, the vibration generated when the semiconductor element body is seated and sucked to the first supporting unit 240 can be minimized.

Furthermore, the first support unit 240 and the second support unit 250 are attached together by a resin adhesive material. Therefore, the adhesion when the first supporting unit 240 and the second supporting unit 250 are attached together can be enhanced because the same is made of the same rubber material.

At the same time, the semiconductor element mold body 110 is made of plastic or the like and can be bent by about 1 mm. When the semiconductor element mold body 110 bent as described above is attracted to the flat surface, the bent semiconductor element mold body 110 is restored to its original position and subjected to bending in the opposite direction to the bending direction of the semiconductor element mold body 110. force. In other words, assuming that the semiconductor element phantom is bent by about 1 mm, when it is attracted to a flat surface, the semiconductor element phantom returns to its original position by about 1 mm. Therefore, there is a possibility that the semiconductor element phantom 110 is damaged by the external force applied thereto during the recovery process.

However, in the specific example of the present invention, when the semiconductor element mold body is sucked, the first supporting unit 240 made of a soft material withstands some bending phenomenon of the semiconductor element mold body 110. Therefore, it is possible to prevent the external force from being applied to the semiconductor element mold body 110 at the time of absorbing.

In more detail, assuming that the semiconductor element mold body 110 is bent by 1 mm, the semiconductor element mold body 110 can be slid to a state in which the semiconductor element mold body 110 is bent by about 0.5 mm because of the flexibility of the first support unit 240. The top surface of the first support unit 240. Therefore, although the semiconductor element mold body 110 is bent by 1 mm, if the semiconductor element mold body 110 can be restored to its original position with only about 0.5 mm when being attracted to the top surface of the first support unit 240, the semiconductor element mold The body 110 does not experience external forces.

Further, the semiconductor element mold body 110 bent as described above is placed on a flat surface. When the bent semiconductor element mold body 110 starts to be attracted to the top surface of the first support unit 240, a specific portion of the semiconductor element mold body 110 comes into contact with the flat surface. In this state, when the semiconductor element mold body 110 is restored to its original position, a part of the semiconductor element mold body 110 which is in contact with the flat surface and has less friction with the flat surface may slide, so the semiconductor element mold body position May change. If the arrangement state of the semiconductor element mold body 110 is broken due to the change in the position of the semiconductor element mold body 110, the cutting accuracy may be lowered at the time of the cutting process performed after the semiconductor element mold body 110 is sucked to the flat surface.

The first support unit 240 is made of a soft material as described above. Therefore, the first supporting unit 240 has a small amount of restoring property and high frictional force to the semiconductor element mold body 110 before absorbing. Since the semiconductor element mold body 110 can be prevented from slipping while being sucked to the first support unit 240, the positional change of the semiconductor element mold body 110 can be prevented. If the positional change of the semiconductor element mold body 110 is prevented as described above, the cutting accuracy can be improved.

At the same time, the first support unit 240 has a thickness of preferably -0.1 mm to 1.0 mm. As described above, the first supporting unit 240 is made of a rubber material having a hardness of Hs10 to Hs55. The thickness of the first support unit 240 preferably increases as the hardness of the rubber material increases.

However, if the first supporting unit 240 has a thickness of more than 1.0 mm, although having a hardness of Hs55, when the dicing and supporting semiconductor element phantom is subjected to a cutting process, since the first supporting unit 240 is made of a soft material For this reason, the semiconductor element mold body 110 may be pushed by the lateral cutting pressure of the cutting blade. Therefore, the cutting accuracy may be lowered.

Further, in the case where the first supporting unit 240 has a thickness of less than 0.1 mm, the bending of the semiconductor element mold body 110 cannot be sufficiently withstood despite the hardness of Hs10, and the semiconductor element molded body 110 cannot be stably placed and the semiconductor element molded body The absorption shock of 110 cannot be fully absorbed.

The plurality of vacuum holes 400 are formed to penetrate the top surface and the bottom surface of the chuck base 220 and the second support unit 250 to absorb and support the semiconductor element mold body 110 disposed on the top surface of the first support unit 240. The plurality of vacuum holes 400 are formed such that the semiconductor element mold body 110 is cut by the dicing blade and the vacuum holes 400 can smother individual semiconductor elements of the semiconductor wafer unit. That is, the position and number of vacuum holes 400 correspond to the position and number of individual semiconductor elements of the semiconductor wafer unit.

The plurality of vacuum holes 400 formed in the first support unit 240 are in communication with a plurality of individual vacuum holes 400 formed in the second support unit 250. Since the vacuum hole 400 formed in the first supporting unit 240 communicates with the plurality of individual vacuum holes 400 formed in the second supporting unit 250, the bottom surface of the first supporting unit 240 is formed from the bottom surface of the chuck base 220. Multiple air ducts.

In a preferred embodiment of the present invention, the plurality of vacuum holes 400 formed in the second support unit 250 are formed to penetrate the top surface and the bottom surface of the chuck base 220 and the second support unit 250. The large vacuum hole 400 formed at the center of the chuck base support body 230 is coupled to the vacuum hole 400 formed in the second support unit 250. Although a vacuum inhaler (not shown) is illustrated coupled to the vacuum port 400 formed in the collet base support 230, the invention is not limited to the case where the vacuum port 400 is coupled to a vacuum inhaler (not shown).

Fig. 8 is a view showing an embodiment of a vacuum chuck holder using the semiconductor element cutting apparatus according to the first specific example of the present invention. As shown in Fig. 8, the semiconductor element mold body 110 can be cut by the cutting blade 300 of the semiconductor element cutting device. If the cutting process generates heat, the cooling water 500 is ejected, so that the heated semiconductor element body 110 and the heated cutting blade 300 of the semiconductor element cutting device are cooled.

As described above, the present invention is advantageous in that the heat generated when the cutting blade of the semiconductor element cutting device cuts the semiconductor element mold body can be removed using the cooling water.

Since the heated semiconductor element body is cooled, the missing portion, such as the stain or melt caused by the overlapping of the thermally melted metal lead and other leads, can be greatly reduced.

Furthermore, the yield can be increased because the number of missing sites is reduced.

Therefore, the present invention is extremely advantageous in the industry because the heated semiconductor element phantom is cooled, so that the missing portion, such as the stain or melt caused by the overlapping of the heat-fused metal lead and other leads, can be greatly reduced.

Although certain preferred embodiments of the invention have been described, the invention is not limited to the specific examples, but is limited to the scope of the appended claims. It will be appreciated that those skilled in the art can modify or modify the specific embodiments without departing from the scope and spirit of the invention.

110. . . Semiconductor component phantom

200. . . Vacuum chuck seat

210. . . Cooling water supply unit

211. . . Horizontal cooling water line

212. . . Vertical cooling water line

220. . . Chuck base

230‧‧‧Chuck base support

240, 250‧‧‧ support unit

241‧‧‧Support unit groove

300‧‧‧Cutting Blade

400‧‧‧vacuum hole

500‧‧‧cooling water

1 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting device capable of supplying cooling water according to a first specific example of the present invention;

2 is a plan view showing a vacuum chuck holder of a semiconductor element cutting apparatus according to a first specific example of the present invention;

Figure 3 is a cross-sectional view of the vacuum chuck seat taken along line D-D of Figure 2;

Figure 4 is a top plan view showing a detail of a support unit in a vacuum chuck holder according to a first embodiment of the present invention;

Figure 5 is a cross-sectional view of the first supporting unit taken along line K-K of Figure 4;

Figure 6 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting device which can supply cooling water according to a second embodiment of the present invention;

Figure 7 is a cross-sectional view of the vacuum chuck seat taken along line B-B of Figure 6;

Fig. 8 is a view showing an embodiment of a vacuum chuck holder using the semiconductor element cutting apparatus according to the first specific example of the present invention.

200. . . Vacuum chuck seat

210. . . Cooling water supply unit

212. . . Vertical cooling water line

220. . . Chuck base

230. . . Chuck base support

240. . . Support unit

400. . . Vacuum hole

Claims (14)

A vacuum chuck holder disposed in an apparatus for cutting a semiconductor component mold body and assembled to support the semiconductor component mold body, the vacuum chuck holder comprising: a chuck base; a support unit attached to the a top surface of the chuck base and assembled to support the semiconductor element mold body; and a cooling water supply unit assembled to supply cooling water, wherein a plurality of vacuum holes are formed in the support unit through which the air passes After being absorbed, the semiconductor element body is attracted to the supporting units, and the cooling water is supplied through the cooling water supply units, thereby removing heat generated when the semiconductor element body is cut. A vacuum chuck holder according to claim 1, wherein the support units are made of rubber. The vacuum chuck seat of claim 1 or 2, wherein the cooling water supply unit comprises: a plurality of horizontal cooling water lines formed parallel to the chuck base; and a plurality of vertical cooling water lines, respectively The upper side of the horizontal cooling water line is formed in a vertical direction and assembled to supply the cooling water. A vacuum chuck holder according to claim 1, wherein a plurality of support unit grooves are formed on an upper side of the individual support unit, wherein the support unit grooves allow a cutting blade for a device for cutting a semiconductor element The semiconductor element body is cut into and cut, and the cooling water is supplied through the support unit grooves, thereby removing heat generated when the semiconductor element body is cut. The vacuum collet holder of claim 1, further comprising a collet base support body having a vacuum hole formed in the center and supporting the collet base. A vacuum chuck holder according to claim 1, wherein the support unit has a hardness of Hs10 to Hs55. A vacuum chuck holder according to claim 1, wherein the support unit has a hardness of Hs60 to Hs95. A vacuum chuck holder disposed in an apparatus for cutting a semiconductor component mold body and assembled to support the semiconductor component mold body, the vacuum chuck holder comprising: a chuck base; and a second support unit attached a top surface of the chuck base; a first support unit attached to a top surface of the second support unit and assembled to support the semiconductor component mold body, the first support unit being lower than And a cooling water supply unit configured to supply cooling water, wherein a plurality of vacuum holes are formed in each of the first and second support units Air is absorbed through the vacuum holes to cause the semiconductor element body to be attracted to the first support units, and The cooling water is supplied through the cooling water supply units, thereby removing heat generated when the semiconductor element body is cut. The vacuum chuck holder of claim 8, wherein the first support unit and the second support unit are made of a rubber material. The vacuum chuck seat of claim 8 or 9, wherein the cooling water supply unit comprises: a plurality of horizontal cooling water pipelines formed parallel to the chuck base, and a plurality of vertical cooling water pipelines, respectively The upper side of the horizontal cooling water line is formed in a vertical direction and assembled to supply the cooling water. A vacuum chuck holder according to claim 8 wherein a plurality of support unit grooves are formed on an upper side of the individual support unit, wherein the support unit grooves allow the cutting blade of the apparatus for cutting the semiconductor element to enter the inside And cutting the semiconductor element body, and the cooling water is supplied through the support cell grooves, thereby removing heat generated when the semiconductor element body is cut. A vacuum collet holder according to claim 8 further comprising a collet base support body having a vacuum hole formed in the center and supporting the collet base. A vacuum chuck holder according to claim 8 wherein the first support unit has a hardness of Hs10 to Hs55. A vacuum chuck holder according to claim 8 wherein the second support unit has a hardness of Hs60 to Hs95.