TWI402014B - Mounting device and operating method thereof - Google Patents

Description

Pressing device and operating method thereof

The present invention relates to a press-fit device, and more particularly to a press-fit device for press-fitting a flexible circuit board.

FIG. 1 is a schematic view showing the engagement of a sensing film of a touch panel with a flexible circuit board. Referring to FIG. 1 , in the existing touch display technology, one of the methods is to apply a sensor film 210 on the liquid crystal panel as a touch signal sensing. The sensing signals of the touch display panel are transmitted from the flexible circuit board 220 to the printed circuit board (not shown) for signal processing, but the signal traces of the sensing film 210 are distributed on the sensing film 210. The positive and negative sides of the flexible circuit board 220 also need to be matched with the front and back sides of the sensing film 210 for bonding.

However, the related pressing device of the current flexible circuit board 220 can only press the flexible circuit board 220 to a target from a single direction, that is, in the case of FIG. 1, only by the pressing device. The flexible circuit board 220 is pressed against one side of the sensing film 210, and the flexible circuit board 220 cannot be simultaneously pressed on both the front and back sides of the sensing film 210 by double-sided actuation.

The present invention provides a press-fit device that simultaneously simultaneously presses a flexible circuit board on both the front and back sides of an electronic component.

The present invention provides a method of operating a press-fit device for shearing a flexible circuit board into two portions that can be pressed against both the front and back sides of an electronic component.

An embodiment of the invention provides a press-fit device adapted to press a flexible circuit board to an electronic component. The electronic component has an upper surface and a lower surface that face away from each other. The pressing device includes a platform and a pressing head. The electronic components are adapted to be placed on the platform. The indenter is movably disposed above the platform. The indenter includes a body and a shearing unit. The shearing unit can be assembled to the body in an open manner. After the shearing unit is closed relative to the body and the indenter is loaded with the flexible circuit board, the shearing unit is unfolded relative to the body to shear the flexible circuit board into a first portion and a second portion. When the indenter bears against the platform, the platform drives the shearing unit to be closed relative to the body to press the first portion and the second portion of the flexible circuit board to the upper and lower surfaces of the electronic component, respectively.

An embodiment of the invention provides a method of operating a press-fit apparatus as described above, comprising first driving a ram onto a carrier to load a flexible circuit board on the carrier. The ram is then moved away from the carrier and the shearing unit is deployed relative to the body to shear the flexible circuit board into the first portion and the second portion. The indenter is then moved and rested on the platform to drive the shearing unit to close relative to the body. Finally, the first portion and the second portion of the flexible circuit board are respectively pressed on the upper surface and the lower surface of the electronic component.

In an embodiment of the invention, the shearing unit comprises a pushing portion, a pivot and an elastic member. The pivot is disposed at one side of the pusher and is coupled to the body. The elastic member is disposed on the pivot and connects the pushing portion and the body, and the elastic member drives the pushing portion to rotate relative to the body.

In an embodiment of the invention, a vacuum unit is further included to connect the indenter. When the shearing unit is closed relative to the body, the indenter adsorbs the flexible circuit board on the body and the shearing unit by the vacuum unit.

In an embodiment of the invention, the body has a first adsorption surface, and the shearing unit has a second adsorption surface. When the shearing unit is closed relative to the body, the first adsorption surface and the second adsorption surface are in the same plane. When the shearing unit is deployed relative to the body, the first portion of the flexible circuit board is adapted to be adsorbed on the first adsorption surface, and the second portion of the flexible circuit board is adapted to be adsorbed on the second adsorption surface.

In an embodiment of the invention, when the second portion of the flexible circuit board is adsorbed on the second adsorption surface, the second portion substantially protrudes from the second adsorption surface.

In an embodiment of the invention, the body has a support portion. When the indenter bears against the platform, the support rests on the electronic component.

In an embodiment of the invention, the operating method further comprises: pressing the pressing head on the carrier to close the shearing unit relative to the body, and then vacuum-adsorbing the flexible circuit board by the vacuum unit; The method is loaded on the indenter.

In an embodiment of the invention, the method further includes: the flexible circuit board and the electronic component on the alignment head, so that the electronic component is located between the body and the shearing unit, and then drives the indenter and the electronic device. The component bears against the platform such that the platform drives the shearing unit to be closed relative to the body.

Based on the above, in the above-described embodiment of the present invention, the pressing device utilizes the indenter having the shearing unit, and after loading the flexible circuit board, separates it into two parts, and further the two parts The flexible circuit board is pressed against the front and back sides of the electronic component. This allows the press-fit device to be pressed onto the electronic component by double-acting the flexible circuit board by a simple member, thereby completing the action that can not be achieved by the press-fit device of the conventional flexible circuit board. .

The above described features and advantages of the present invention will be more apparent from the following description.

2 is a schematic view of a press-fit apparatus in accordance with an embodiment of the present invention. Only parts of the press-fit device are shown here to clearly identify the components to be described. Referring to FIG. 2 , in the embodiment, the pressing device 100 includes a pressing head 110 and a platform 120 , wherein the pressing head 110 is movably disposed above the platform 120 . The indenter 110 includes a body 112 and a shearing unit 114, wherein the shearing unit 114 is reconfigurably assembled to the body 112. In detail, the shearing unit 114 includes a pushing portion 114a, a pivot 114b, and an elastic member 114c. The pivot 114b is disposed on one side of the pushing portion 114a and is coupled to the body 112. The elastic member 114c is, for example, a torsion spring that is disposed on the pivot 114b and that connects the push portion 114a with the body 112. When the ram 110 is in a state of being unpressurized or not resting on the platform 120, the elastic force of the elastic member 114c drives the urging portion 114a to rotate relative to the body 112, so that the urging portion 114a is unfolded relative to the body 112. .

3A to 3F are schematic diagrams showing the operation of the pressing device of FIG. 1. Referring to FIG. 2 and FIG. 3A to FIG. 3B, the pressing device 100 further includes a vacuum unit 130 connected to the indenter 110. The body 112 has a first adsorption surface V1, and the pushing portion 114a of the shearing unit 114 has a The second adsorption surface V2 has a plurality of adsorption holes 116 on the first adsorption surface V1 of the body 112 and the second adsorption surface V2 of the shearing unit, and the adsorption holes 116 are connected to the vacuum unit 130. In FIG. 3A and FIG. 3B, when the driving ram 110 bears against a carrier 300, so that the shearing unit 114 is closed relative to the body 112 by being supported on the carrier 300, the first adsorption surface at this time V1 and the second adsorption surface V2 are located on the same plane, and then the vacuum unit 130 is turned on to remove the flexible circuit board 400 from the carrier 300 and load it to the indenter 110 by vacuum adsorption.

Next, referring to FIG. 3C, in the present embodiment, after the ram 110 is moved away from the carrier 300, the elastic member 114c (shown in FIG. 2) drives the urging portion 114a to rotate relative to the body 112 by its elastic force. The shearing unit 114 is brought into an unfolded state relative to the body 112. At the same time, the flexible circuit board 400 is sheared and separated into a first portion 410 and a second portion 420 by the moving portion 114a and the body 112 away from each other, wherein the first portion 410 is adsorbed to the first portion of the body 112. The second surface 420 is adsorbed on the second adsorption surface V2 of the moving portion 114a. Thereby, the indenter 110 completes the separation of the flexible circuit board 400 into two portions 410, 420 on different planes.

Next, referring to FIG. 3D, in the embodiment, the flexible circuit board 400 adsorbed on the indenter 110 is aligned with an electronic component 500, where the electronic component 500 is disposed, for example, on a liquid crystal display panel ( A sensing film on the unillustrated surface has an upper surface S1 and a lower surface S2 opposite to each other, but the embodiment does not limit this. In order to enable the flexible circuit board 400 and the electronic component 500 to be smoothly pressed, in this step, the two must be aligned to the position to be pressed, that is, the connection on the flexible circuit board 400. Points (not shown) are aligned with the contacts (not shown) on the electronic component 500 such that the contacts of the electronic component 500 are substantially at the first portion 410 and the second portion 420 of the flexible circuit board 400. Moreover, even if the electronic component 500 is located between the body 112 and the shearing unit 114, the subsequent pressing step is facilitated.

Finally, referring to FIG. 3E and FIG. 3F, the alignment completed electronic component 500 and the indenter 110 and the flexible circuit board 400 thereon are moved downward to support the indenter 110 against the platform 120. When the indenter 110 bears against the platform 120, the platform 120 drives the pushing portion 114a of the shearing unit 114 to rotate toward the body 112, so that the shearing unit 114 is in a closed state relative to the body 112. When the pushing portion 114a of the shearing unit 114 is closed relative to the body 112, the first portion 410 and the second portion 420 of the flexible circuit board 400 are simultaneously pressed on the first surface S1 of the electronic component 500, respectively. On the second surface S2. Thereby, the press-fit device 100 can connect the flexible circuit board 400 bidirectionally to the electronic component 500.

On the other hand, referring again to FIG. 2 and FIG. 3E, in the present embodiment, the body 112 has a support portion 112a located at a side edge of the second adsorption surface V2 of the body 112. When the ram 110 bears against the platform 120, the support portion 112a bears against the electronic component 500, thereby supporting the body 112 to complete the action of pressing the flexible circuit board 400 on the electronic component 500.

It is worth mentioning that when the second portion 420 of the flexible circuit board 400 is adsorbed on the second adsorption surface V2 of the pushing portion 114a, the second portion 420 substantially protrudes from the second adsorption surface V2. In other words, in order to allow the contacts of the second portion 420 to smoothly contact the corresponding contacts of the electronic component 500 during the pressing operation, when the ram 110 adsorbs the flexible circuit board 400 by the vacuum unit 130, The orthographic projection of the second portion 420 of the flexible circuit board 400 on the second adsorption surface V2 of the pushing portion 114a substantially protrudes from the second adsorption surface V2, so that the joint of the second portion 420 can be exposed to the indenter 110, and in the subsequent pressing action, the exposed second portion 420 is pressed against the contacts on the electronic component 500.

In summary, in the above embodiment of the present invention, the pressing device utilizes a pressing head having a shearing unit, and after loading the flexible circuit board, it is separated into two portions of different planes, and further The two parts of the flexible circuit board are pressed against the front and back sides of the electronic component. This allows the press-fit device to be pressed onto the electronic component by double-acting the flexible circuit board by a simple member, thereby completing the action that can not be achieved by the press-fit device of the conventional flexible circuit board. .

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ Pressing device

110‧‧‧Indenter

112‧‧‧Ontology

112a‧‧‧Support

114‧‧‧Shear unit

114a‧‧‧Shift

114b‧‧‧ pivot

114c‧‧‧elastic parts

116‧‧‧Adsorption holes

120‧‧‧ platform

130‧‧‧vacuum unit

210‧‧‧Sensing film

220, 400‧‧‧Flexible circuit board

300‧‧‧ Vehicles

410‧‧‧Part 1

420‧‧‧Part II

500‧‧‧Electronic components

S1‧‧‧ upper surface

S2‧‧‧ lower surface

V1‧‧‧ first adsorption surface

V2‧‧‧second adsorption surface

FIG. 1 is a schematic view showing the engagement of a sensing film of a touch panel with a flexible circuit board.

2 is a schematic view of a press-fit apparatus in accordance with an embodiment of the present invention.

3A to 3F are schematic diagrams showing the operation of the pressing device of FIG. 1.

100. . . Pressing device

110. . . Indenter

112. . . Ontology

112a. . . Support

114. . . Shear unit

114a. . . Shift

114b. . . Pivot

114c. . . Elastic part

116. . . Adsorption hole

120. . . platform

130. . . Vacuum unit

V1. . . First adsorption surface

V2. . . Second adsorption surface

Claims (8)

A pressing device adapted to press-fit a flexible circuit board to an electronic component having an upper surface and a lower surface opposite to each other, the pressing device comprising: a platform, the electronic component being adapted Arranging on the platform; and an indenter movably disposed above the platform, the indenter comprising: a body; a shear forcing unit that is removably assembled to the body, the shearing unit The utility model comprises: a pushing portion; a pivot shaft disposed on one side of the pushing portion and connecting the body; and an elastic member disposed on the pivot shaft and connecting the pushing portion and the body, the elastic member driving the pushing portion Rotating relative to the body; after the shearing unit is closed relative to the body, and the ram is loaded with the flexible circuit board, the swaying unit is unfolded relative to the body to the flexible circuit board The shearing is a first portion located at the body and the second portion is located at the pushing portion, the platform driving the shearing unit relative to the body when the pressing head bears against the platform Closed to make this flexible The first portion and the second portion are press-fitted to the upper surface and the lower surface of the electronic component, wherein the orthographic projection of the second portion of the transition portion protruding from the transition portion of the circuit board. The pressing device according to claim 1 of the patent application further includes a The vacuum unit is connected to the indenter. When the shearing unit is closed relative to the body, the indenter adsorbs the flexible circuit board on the body and the shearing unit by the vacuum unit. The pressing device of claim 2, wherein the body has a first adsorption surface, and the shearing unit has a second adsorption surface, when the shearing unit is closed relative to the body, The first adsorption surface is located on the same plane as the second adsorption surface. When the shearing unit is deployed relative to the body, the first portion of the flexible circuit board is adapted to be adsorbed on the first adsorption surface. The second portion of the flexible circuit board is adapted to be adsorbed on the second adsorption surface. The press-fit device of claim 3, wherein when the second portion of the flexible circuit board is adsorbed on the second adsorption surface, the second portion substantially protrudes from the second adsorption surface . The press-fit device of claim 1, wherein the body has a support portion that bears against the electronic component when the ram is supported on the platform. A method of operating a press-fit apparatus according to claim 1, comprising: driving the indenter against a carrier to load the flexible circuit board on the carrier; moving the indenter Off the carrier, and the shearing unit is unfolded relative to the body to shear the flexible circuit board into the first portion and the second portion, the first portion is located in the body, and the second portion is located in the pushing portion Wherein the orthographic projection of the second portion on the urging portion protrudes from the urging portion; Aligning the flexible circuit board on the indenter with the electronic component such that the electronic component is positioned between the body and the shearing unit; moving the indenter and bearing the platform to drive the shear The push unit is closed relative to the body; and the first portion and the second portion of the flexible circuit board are respectively pressed on the upper surface and the lower surface of the electronic component. The method of operation of claim 6, further comprising: bearing the indenter on the carrier to close the shearing unit relative to the body; and flexing the vacuum unit The circuit board is loaded onto the indenter by vacuum adsorption. The method of operation of claim 6, wherein the elastic member drives the urging portion to rotate relative to the body when the ram is not supported by the carrier or the ram is not supported by the platform So that the urging portion is unfolded relative to the body.