TW200845838A - Unit for acquiring align image information and apparatus and method for bonding printed circuit on FPD panel - Google Patents

Abstract

An apparatus for bonding a printed circuit includes a stage having an upper surface supporting a substrate to which the printed circuit is to be bonded and transferring and drawing out the substrate to a bonding process position. a pressure head provided at the bonding process position capable of elevating, absorbing the printed circuit, and pressing the absorbed printed circuit against the substrate to bond the printed circuit to the substrate, and a unit for acquiring align image information photographing at least one chip mark formed on the printed circuit absorbed and at least one glass mark formed on the substrate together to acquire align image information of marks. Thus, the printed circuit is bonded to the substrate in a simple and convenient method and simultaneously a tact time for the bonding process is reduced and a high speed of the bonding process is embodied.

Description

200845838 IX. Description of the Invention: [Technical Field] The present invention relates to an apparatus and method for acquiring a calibration image information device and for pressing a printed circuit on a flat panel display panel, in particular, a simple And a convenient method to simultaneously shorten the processing time of a pressure welding process to obtain a high-speed pressure welding process for obtaining a calibration image information device and a device and method for pressure-welding the printed circuit on the flat panel display panel. [Prior Art] In general, for example, a plasma display panel (PDP), a liquid crystal display (iiqUid crystal display, 匕(3)), and an organic light emiuing di〇de (OLED) Flat panel displays (panei diSpiay, fpd) are gradually made thinner and lighter. Thus, different printed circuits are connected directly to the flat panel display and fabricated into an integrated product. In the following description, the flat panel display indicates a liquid crystal display substrate (lcd substrate) ° The printed circuit includes a flexible printed circuit (flexible printed circuit (flexible) Printed circuit (FPC), tape-and-roll wafer carrier (tape package), and general batches of flexible boards, and driver integrated circuits (driver 1C). These printed circuits are directly connected to a substrate. In order to avoid the need for a complicated wiring, and thus make assembly, maintenance and repair, and to make it easy and 'both (without the need for separate wiring space, the printed circuit can be adapted to miniaturize and (4) the product, in order to obtain The quality of the production of 5 roads has different wirings, so the printing is not affected by the use and specifications of the substrate.

200845838 products. Furthermore, since the printed circuit can be widely used, it is loud. The printing is used to directly bond the printed circuit to the substrate. Especially the 'welding process. - The complete automatic module method in the real process, the introduction of the following elementary automatic module material flow of the welding side = Kao Tubu said that "the general self-pure group of fresh pressure rogue (five) 1 towel ' The phase-complete automatic module soldering process is divided into a chip-on-glass (c〇G) pressure welding process and a film-on-glass (F〇G) pressure welding process. In the description of the daytime (COG) pressure welding process, the printed circuit is represented by a drive integrated circuit. In the glass flip-chip (10) pressure welding process, the substrate of the 1, t flow target is placed on the platform, and an anisotropic conductive filra (ACF) is patterned and connected to the substrate. The position on which the drive integrated circuit is connected. The driving integrated circuit is grasped from a supply tray for accommodating the driving integrated circuit by using a conveying device such as the same carrier, and the driving integrated circuit is pre-positioned at a position where the anisotropic conductive film is patterned. Pressure welding (after this, it means pre-pressing or pre-welding). Thereafter, the integrated integrated circuit is completely pressure-bonded by heating and pressurizing the substrate and driving the integrated circuit (hereinafter, it is mainly referred to as pressing). In order to confirm whether or not the driving integrated circuit is properly soldered to the substrate, it is realized by a crack inspection for confirming the driving product 6 200845838 and an indentation inspection for confirming whether or not the body circuit is properly connected. : The welding process is the same after the glass flip-chip welding. That is to say; it is generally connected to the broken crystal pressure circuit to recognize the substrate, and the film process is Ο

Pressurization, for example, a flexible printed circuit formed of a film or a process of a conductive bond film, and this can be replaced or a conductive film connected to a driving integrated body in a glass flip chip bonding process. Circuit and printed circuit board (printed ci plus tb〇咐, (4). In the glass film bonding process, the printed circuit is represented by a printable printed circuit. Please refer to Figure 1, in the anisotropic conductive film. After being adhered to the substrate, the flexible printed circuit that has been calibrated on the substrate is pre-pressed on the anisotropic conductive film. Therefore, the flexible printed circuit and the substrate are already calibrated. After the pre-pressing is completed, the substrate is The flexible printed circuit is completely pressure-bonded (mainly pressed) to each other by heating and pressurization. Thereafter, an indentation inspection for confirming whether the substrate and the flexible printed circuit are properly combined is performed. And the crack inspection to confirm whether the crack is generated on the substrate. When the glass flip chip bonding process and the glass film bonding welding process are completed, an auxiliary process such as an electrical test is performed. And then performing a final packaging process, thereby completing the fully automatic module pressure welding process. In the liquid crystal display substrate completed by the pressure welding process as described above, the liquid crystal display of the glass flip chip bonding process has been performed. The substrate comprises an upper glass or a color filter glass, and a lower glass or a thin film electro-crystal 7 200845838. The surface of the portion is configured such that the liquid crystal is infused between the upper glass and the lower glass, and the upper polarizer is The lower polarizers are respectively adhered to the outer surfaces of the upper glass and the lower glass. The area for forming a color image in the upper glass is smaller than the area where the image is formed by (10) in the lower image, but not overlapped with the upper glass. The non-heavy & section is placed on the side of the upper surface of the lower glass, which corresponds to the above-mentioned driving body circuit. ^ The programming of the body is based on the welding process of the electric board, in order to I & (4) the wire body circuit must be Placed in a material position on the substrate. Under this condition, when a pressure head is lowered and pressed to drive the body circuit, the desired quality can be obtained. Therefore, before the pressure welding process A corresponding calibration process is required between the driving body circuit and the substrate. The calibration process of the surface power consumption circuit board, the conventional pressure welding equipment includes two cameras. The two cameras are used to capture and acquire the formation. Driving the two wafer marks on the body circuit, and after the image of the mark formed on the substrate, the platform supporting the substrate is calibrated on the χ, γ axis and corresponding to the two wafer marks. Finally, the body is driven by the indenter. The circuit is pressure-welded to the substrate. Figure 2 is a diagram showing the square of a conventional pressure-welded printed circuit. As shown in Figure 2, when used to provide a driving body circuit, the white supplier supplies The arm is transported into the lower portion of the indenter at the position of the pressure welding. The pressure head is lowered to a take-up position (step sm). The press head is lifted so that the pressure can be taken to drive the body circuit (step 12). . When picking up the drive body circuit, the pressure head rises to an exit position (step 1 卩) 〇 8 200845838 • When the static rise _ open position 'moves the supply arm, meaning that the lower area leaves (step _. , ξι, ' After the delivery arm is transported, the indenter is lowered to the white camera position (step S115). The second camera captures the two wafer marks of the straight body circuit by the indenter (step su6). After the completion of the shooting' The head that has been lowered to the shooting position is raised back to the leaving position (step SI 17). 运送 A platform supporting the substrate is transported to the position of the pressure welding process (the non-heavy "section" of the bull It is set at the position of the welding process. Although it is flat, the (four) scale flow residual material is supported by the table and the auxiliary tool (step S119). The board is composed of thousands of cameras = large: 'two cameras are formed on the substrate Two glass ^ ^ (force S12G). In the completion of the two broken glass substrate platform is in the Χ, γ axis and Θ angle, = support sheet mark for calibration (step S121). When calibrating, the hoe is lowered to (step S122) and performed. The pre-welding process (after the step of the welding process, the indenter is raised __ = , after the platform is moved upward (step S125), the platform is removed; step = when the supply arm moves (step S127), Then ~ S127 operation. Step sill to step glass two == technology 'because the shooting of the two wafer marks and two ==:;=;r to step (10) per-subscription ❿疋 alone, so in the 200845838 body There is a certain limit to the reduction of the processing time of the circuit to the substrate. Therefore, an improved method is needed. Moreover, in the conventional pressure welding equipment, since the support surface of the platform is supported and adhered to the lower surface of the lower glass. The lower polarizer area, and the support surface of the auxiliary tool directly support the area where the lower glass is not adhered to the lower polarizer, such as the non-overlapping section, so the support surface of the platform and the support #surface of the auxiliary tool are not On the same surface, in order to produce the same height difference as the thickness of the lower polarizer A. In other words, the substrate is not substantially supported in a completely flat state. When the pressure welding device presses the driving body on the substrate In the circuit area, and the substrate is not supported in a completely flat state, a bending power is generated on the substrate. In an important case, the substrate may be damaged or cracked due to excessive bending power. Damage or cracks are generated on the substrate, and the support surface of the platform and the support surface of the auxiliary tool need to be disposed on the same plane as much as possible. However, the support of the platform is not easily achieved due to the thickness of the lower polarizer. The support surfaces are on the same plane. Even if the support surface of the platform and the support surface of the auxiliary tool are not located on the same plane, when the thickness of the substrate is not too thin, damage or cracks may occur on the substrate. In fact, since each of the upper glass and the lower glass of the liquid crystal display substrate of the mobile terminal is used with a thickness of 〇5 mm, when the driving body circuit is pressure-welded on the substrate having the above thickness, even the supporting surface of the platform and the auxiliary The support surfaces of the tool are not located on the same plane, and damage or cracks may occur on the substrate. 200845838 However, according to the user specifications that are being developed or hoped to develop in the future, the known thickness of each of the upper and lower glass will be 〇·25mm. When the thickness of the substrate is reduced to such a degree, if the supporting surface of the platform and the auxiliary tool of the supporting substrate of the slave plate are not substantially in the same plane, during the pressure welding process of driving the body circuit, There is a high possibility of damage or cracks on the substrate, and thus the quality in the pressure welding process cannot be obtained. Therefore, when the friction of the substrate is gradually reduced and thinned, a measuring device for calibrating the surface of the platform of the platform and the auxiliary tool is required. However, not only because the product manufacturer does not want to purchase the measuring device of the technically complicated structure, but also because the time of the supporting surface of the calibration platform and the supporting surface of the auxiliary tool increases, the processing time is inevitably increased. In order to solve the above problems, the present invention provides a device for acquiring calibration image information and a device and method for pressure welding a printed circuit on a flat display state, which is a simple and convenient method. A printing package is pressure welded to a substrate while reducing the processing time of the pressure welding process to achieve a high speed pressure welding process. The present invention provides an apparatus for acquiring calibration image information and an apparatus and method for pressure welding a printed circuit on a flat panel display, which can effectively support the substrate by using a simple structure and method to avoid the printed circuit. During the pressure welding process, damage or cracks are generated on the substrate. Even when the thickness of the substrate is thinner than the thickness of the substrate used in the technique, the damage or crack on the substrate can be avoided. ^m Kangben & Ming's purpose 'in the crack between the printed circuit and the substrate = the obtained printed circuit and the calibration image information on the substrate, the device for acquiring image information is formed and formed. At the imprinting = at least - the wafer marks are formed with at least the glass marks η on the substrate to obtain the calibrated image information of the marks. The other purpose of the device ΓΓ ― ― 种 种 种 用以 用以 用以 压 压 压 压 压 压 压 压 压 压 压 压 压 印刷 印刷 印刷 印刷 印刷 印刷 印刷 — 印刷 印刷 — 印刷 印刷 印刷 印刷 印刷 印刷 — — — — — — — — — — The printed circuit is pressure-welded to the printing=1 S head, and is disposed at the position of the pressure welding process, and the board can be sucked up by i, and the circuit voltage of the sucked printed circuit is pressed to the base information. a substrate; and - obtaining a calibration image; and placing, at least one of the formed printed circuits is photographed together with at least one glass mark formed on the substrate, Calibrate image information. Method root t The purpose of the invention is to use a pressure welding-printing circuit position. The support is used to support the substrate of the substrate to be transported to - the pressure welding flow is taken up - the pressure of the printed circuit The head is lowered to a photographing position; at least one of the wafers formed on the printed circuit is marked and formed with the substrate; at least one of the glass marks is used to obtain the calibration image of the marks, and the base handle is at the mark The calibration image information obtained thereon calibrates the selected descending platform relative to the wafer mark; and press-bonds the printed circuit to the substrate by the indenter. , 12 200845838 Ο

According to still another object of the present invention, an apparatus for pressure welding a printed circuit 'includes a flat m to transport a substrate, and the substrate is taken out to a flow of the printed circuit to a position and the county plate is removed from the The position of the pressure welding process of the printed circuit is taken out, the substrate has an upper glass and a lower glass, and a plurality of upper polarizing sheets and a lower polarizing film are respectively adhered to the outer glass and the outer surface of the lower glass. At the material flow position, it can be raised, and the sub-batter can press the printed circuit to the substrate by pressing the printed circuit on the upper surface of the non-heavy & region # of the glass under the substrate. The non-overlapping section of the glass is not overlapped with the upper glass at the position of the pressure welding process; and an auxiliary tool is separately disposed away from the platform, and the auxiliary tool is located at the position of the pressure welding process The non-overlapping section of the low side support and having at least one vacuum aperture to draw the substrate during the bonding of the bonding tool. According to still another object of the present invention, a method of embossing a printed circuit includes drawing a substrate onto a platform that generates a vacuum and transports the drawn substrate to a pressure welding process location of the printed circuit The substrate has an upper glass and a lower glass, and the upper polarizer and the lower polarizer are respectively adhered to the outer surfaces of the upper glass and the lower glass; and a non-overlapping section in which the lower glass is not overlapped with the upper glass is provided And causing it to be on a support surface of an auxiliary tool disposed at the position of the pressure welding process; generating a vacuum on the auxiliary tool and sucking the non-overlapping section from the lower side of the non-overlapping section; removing the generated on the platform The vacuum and the printed circuit are pressure bonded to the upper surface of the non-overlapping section by lowering the pressure tool onto the substrate. The detailed description of the present invention and the details of the technology of the present invention will be described in detail in the following description of the present application, and the content of the present invention is sufficient to enable anyone skilled in the art to implement and implement the present invention. According to the scope and illustrations disclosed in the specification, it is possible to understand the purpose and advantages of those skilled in the art. [Embodiment] The drawings are based on the same component numbers in order to be able to review and achieve the present invention.

The present invention is intended to illustrate the invention, its advantages, and the objects of the invention. DETAILED DESCRIPTION OF THE INVENTION In the following description, preferred embodiments of the invention are described in detail. Where, represents the same component. According to an embodiment of the invention, a device and a material are used for printing a _== 电路 电路 电路 电路 平板 FP FP 匕 匕 匕 匕 匕 匕 匕 匕 匕 匕 匕 匕 匕 匕 ι ι ι ι ι ι ι ι ι ι ι ι ι ι ι To circuit (FPC), coil; earth circuit such as flexible printed electric coiled wafer carrier package (τF circuit board (CBF) and drive integrated circuit uriv, two batches of soft display system such as electric display Panel (PDP), Nightingale/), and Flat: and Organic Light Emitters). = Instructor on the mobile terminal SC: Drive the integrated circuit to be used up to the β Α from the display substrate, such as a mobile phone. 3 is a perspective view of a second display substrate of the present invention. Such as = road pressure welding to - = include: upper glass (or - color 2: crystal == Dian crystal panel) 3, liquid crystal (not shown ^ and one: glass (or J-line perfusion in the upper glass 2 14 200845838 and Between a part of the surface of the lower glass 3, and an upper polarizer 4 and a lower polarizer 5 are respectively adhered to the outer surfaces of the upper glass 3 and the lower glass 3. The area where the upper glass 2 forms a color image is smaller than the lower The area of the glass 3. Therefore, a non-overlapping section in which the upper glass 2 is not overlapped is present on one side of the upper surface of the lower glass 3. A driving integrated circuit 6 is pressure-bonded to the non-overlapping section. In the present embodiment, although a single driving integrated circuit is pressure-welded to the non-overlapping section, it is not limited thereto, that is, two or more driving products may be pressure-welded. As shown in Fig. 3, the upper polarizer 4 is substantially adhered to the upper surface of most of the upper glass 2. However, the lower polarizer 5 is adhered to the lower surface of the lower glass 3 except for the non-overlapping section. The driving integrated circuit 6 needs to be correctly placed on the substrate 1, that is, placed in the non-overlapping area. A proper position on the upper surface of the crucible. Under this condition, a ram 30, which will be described in detail later, is lowered to press the driving integrated circuit 6 to obtain a desired quality. Therefore, in a pressure welding process Previously, there was a need for a comparative calibration process between the drive integrated circuit 6 and the substrate 1. Although the comparison calibration process will be detailed later, in order to perform this process, as shown in Figure 3, the two glass marks are shown. 1 a, 1 b are formed on the substrate 1 , and the two wafer marks 6 a , 6 b are stroked on the driving integrated circuit 6 . Referring to FIG. 4 , it is one of the device structures of the present invention for pressure welding a printed circuit. BRIEF DESCRIPTION OF THE DRAWINGS Referring to Figure 5, there is shown a perspective view of the apparatus for obtaining calibration image information of Figure 4 of the present invention. Referring to Figure 6, there is shown a plan view of the apparatus for obtaining calibration image information of Figure 5 of the present invention. Referring to Figures 7 through 9, there is shown an exploded view of the operational steps of the apparatus for pressure welding a printed circuit of Figure 4 of the present invention. 15 200845838 A pressure welding according to an embodiment of the present invention is shown in Figures 4 through 9. Equipment, including a platform 10, a a spare tool 20, a ram 30, a calibration image information acquiring device 40, a supply arm 50, and a control unit (not shown) for controlling the above components. The substrate 1 includes an upper glass 2 and a lower glass 3, and The upper polarizer 4 and the lower polarizer 5 are respectively adhered to the upper glass 2 and the lower glass 3. The platform 10 transports the substrate 1 to a pressure welding process position W of the driving integrated circuit 6, or will have completed one The substrate 1 of the pressure welding process is taken out. That is, the platform 10 is substantially the same function as a transport device for transporting the substrate 1. In some cases, when the pressure welding process has been performed, the platform 10 supports the substrate. A portion of the lower portion of the platform 1. The platform 10 includes a support surface 11 having a region at least larger than the substrate 1, and the substrate 1 is easily supported in a flat state. However, as described above, although the stage 10 supports the substrate 1, the stage 10 supports other areas of the substrate 1 except for the non-overlapping sections. Therefore, it can be said that the support surface 11 of the stage 10 supports the region k domain of the lower polarizer 5 of the substrate 1. Although not illustrated in detail, a plurality of vacuum holes (not shown) for sucking the substrate 1 are provided on the support surface 11 of the stage 10. A vacuum control device (not shown) for controlling the on/off and intensity of the vacuum generated in the platform 10 can be further disposed on the platform 10. The spare tool 20 supports the substrate 1 together with the platform 10 during the pressure welding process. When the support surface 11 of the platform 10 supports most of the area of the substrate 1, the support surface 21 of the spare tool 20 partially supports only the non-16 200845838 overlap section Η. A support surface 21 of a vacuum hole for suctioning b) can be formed in the non-overlapping section 备用 of the spare tool 20 when formed in the standby state of the spare tool 2. The vacuum hole suction of the non-overlapping section, the crucible, and the support surface 21 in the empty state is advantageous, for the reason that the vacuum formed on the stage 10 is removed when the surface of the substrate 1 is flat.

When the suction surface is not sucked, and the support surface 11 of the non-tongue of the substrate 1 is mostly raised by the true surface 21, if the pressure f section is pulled from the support surface area of the spare tool 20, the integrated circuit is driven by pressing in the flat state. Between the support surfaces 21 of 6 is: the opposite cut/face 11 and the damage of the spare tool 2 或是 or secret. The difference in orientation, riding on the substrate 1 is produced. However, as described above, when only the L-L, the vacuum is applied, and the non-overlapping section 11 of the substrate is only used to prepare the vacuum of the support surface 21 of 1/2G. When the substrate i is held in a state of rising from the support surface u of the stage iG, if the embossing head 30 is lowered and the driving integrated circuit 6 is pressure-welded to the substrate 丨, the embossing is performed. The pressing head 30, the insulting tool 2, and the supporting surface 21 of the spare tool 2 are formed on a flat surface so that damage and cracks generated in the substrate 1 can be avoided. However, the invention is not limited thereto. The spare tool 20 is separately disposed away from the platform 1〇. In the present embodiment, the spare tool 2 (M system is provided to be raised to the region of the pressure welding process position W of the drive integrated circuit 6. However, since the present invention is not limited thereto, the spare tool 20 can be fixed. It is disposed at any area of the pressure welding process position 1. 200845838 The indenter 30 is substantially pressure welded to the drive integrated circuit 6 to the upper surface of the non-overlapping section 基板 of the substrate 1. Thus, the ram 20 is placed in the pressure welding The flow position W can be raised at this position. Due to the rise of the ram 30, the ram 30 requires a roller for raising and a heating wire for hot pressing. However, the nip 30 is omitted here. A detailed description of the method disclosed in the applicant's patent application filed by the applicant. The calibration image information acquisition device 40 is not formed in the drive integrated circuit by photographing as shown in FIG. Two wafer marks 6a, 6b' on 6 and two glass marks la, lb formed on the substrate 1 as shown in FIG. 3 to obtain calibration image information corresponding between the marks la, lb, 6a, and 6b. According to the traditional pressure welding equipment, The photographing of the two wafer marks la, lb and the photographing of the two glass marks 6a, 6b are performed separately using two cameras (not shown), except for the time when the marks 1 a, 1 b, 6a, 6b are separately photographed. It is further required that the ram 30 is raised and the time when the platform 10 is moved to take the marks 1 a, 1 b, 6a, 6b, and thus there is a limit in reducing the processing time. However, in comparison with the conventional technology, In this embodiment, the processing time can be reduced by using the calibration image information device 40. The calibration image information device 40 can simultaneously capture the two wafer marks 6a formed on the driving integrated circuit 6 as shown in FIG. 6b, and two glass marks la, lb formed on the substrate 1 as shown in Fig. 3. Therefore, when the marks 1a, 1b, 6a, 6b are simultaneously photographed, the portion in which the indenter 30 is raised can be reduced and The moving operation of the platform 10 for taking the marks la, lb, 6a, 6b so that the processing time can be reduced. 18 200845838. The calibration image information acquiring device 40 shown in FIG. 5 and FIG. 6 includes a block of blocks. 41, with four A photographing window 41a for photographing the two wafer marks 6a, 6b and the two glass marks la, lb; four empty facing blocks 42, wherein each of the two empty coupling blocks 42 is connected to the opposite side of the meandering block 41, respectively. A plurality of turns (not shown) are disposed in the meandering block 41 and the four empty coupling blocks 42 to refract the direction of the light to the four shot windows 41a; the four cylinders 43 are coupled separately The four vacant coupling blocks 42 and the four photographic lens units 44 are respectively coupled to the ends of the four cylinders 43. The cymbal block 41 is formed by two mutually separated sub-blocks. They are placed next to each separated sub-block at the same interval. A lens support 45 for supporting each of the photographing lens units 44 is disposed between the four photographing lens units 44 and the four cylinders 43 , in other words, between the two photographing lens units 44 and the two cylinders 43 . . The lens holder 45 is a structure in which each lens unit 44 is combined with each barrel 43. Four illumination units 46, respectively coupled to the four cylinders 43 to emit light to the four cylinders 43, are disposed below the four cylinders 43. In the present embodiment, since the four photographing windows 41a are adjacently disposed adjacent to each other at the same interval, the two formed on the driving integrated circuit 6 as shown in FIG. 3 can be simultaneously photographed. Wafer marks 6a, 6b, and two glass marks 6a, 6b formed on the substrate 1 as shown in FIG. That is, due to the structural characteristics of the meandering block 41, the four-space coupling block 42, the four cylinders 43, the four lens unit 44, the two lens holders 45, and the four illumination units 46, even when the four shot windows 41a They are placed in close proximity to each other, so that the marks la, lb, 6a, 6b which are placed very close to each other can be sufficiently photographed at the same time. However, if it is simple to set up four cameras 19 200845838, the four marks la, lb, 6a, 6b which are very close to each other are due to the volume of the camera itself, and cannot be taken at the same time. In detail, the four markers la, lb, 6a, 6b can be photographed using a separately provided camera. In this state, in order to avoid mutual interference between the cameras, the wafer marks 6a, 6b and the glass marks la, lb must be separated from each other by a considerable distance. Therefore, since the platform 10 needs to move a considerable distance to simultaneously capture the four marks 1 a, 1 b, 6a, 6b, it takes a lot of time due to the movement of the platform 10, and thus the processing time cannot be substantially reduced, or Because the path along the platform 10 is complex, it is not possible to calibrate. However, as in the present embodiment, when the wafer image marks 6a, 6b and the glass marks 1a, 1b can be simultaneously captured, and the four image capturing windows 41a are disposed in close proximity to the calibration image information device 40 disposed in a single body, , the movement time of the platform 10 can be reduced, and the path of the movement is not complicated, and therefore the calibration is not difficult. The supply arm 50 supplies the drive integrated circuit 6 to the lower region of the ram 30 so that the ram 30 can pick up or suck up the drive integrated circuit 6. Therefore, the supply arm 50 can be regarded as a mechanical device that supplies the integrated circuit 6. The control unit controls the ram 30, the platform 10, the spare tool 20, and the calibration image information acquiring device 40. In particular, in the present embodiment, the control unit controls the substrate 1 relative to the drive according to the corresponding calibration image information acquired between the marks la, lb, 6a, and 6b by the calibration image information device 40. The corresponding calibration of the integrated circuit 6. That is, the control unit calibrates the platform 10 for supporting the substrate 1 at the X, Y axis and the corner to control the corresponding calibration of the substrate 1 with respect to the drive integrated circuit 6. 20 200845838 - However, in the process of using the control unit to calibrate the platform 10, before the platform 10 is transported to the pressure welding process position w and lowered, the platform 1 is controlled at the X, γ axis and 0 angle. The calibration is such that a portion of the substrate 1 can be supported by the support surface of the spare tool 20. According to the method of the pressure welding driving integrated circuit 6 of the present embodiment, as shown in FIG. 7 to FIG. 10, the control flow of the control unit is described. First, FIG. 7 is used to transport the integrated circuit. When the supply arm of 6 is moved to the lower portion of the indenter 30 at the position W of the welding process, the indenter 30 is lowered to a take-up position u (step S11). When the vacuum is supplied from the ram 30, the ram 30 is taken from the supply arm 5 to drive the integrated circuit 6 (step S12). When the drive integrated circuit 6 is picked up, the keeper 30 is raised to an exit position L2 (step S13). The operation of the value to the current user is substantially the same as the technique of the technique shown in Fig. 2. When the indenter 30 is raised to the exit position L2, the supply arm 5 is moved to the original position. In the prior art, although the supply arm 5 is operated here (I: separately moving, in the present embodiment, the platform 10 of the support substrate 1 is moved by the supply arm 50 to the pressure welding flow position f (step S14). Further, as shown in Fig. 8, the indenter 30 is lowered to a shooting position L3. According to the white technology, in this operation, only the indenter is lowered to the shooting position = two and the other operations are not performed together. However, in the present embodiment, when the indenter 30 is lowered to the photographing position L3, the platform 1 is lowered by a predetermined distance (step S15). When the Litian flat σ is lowered by a predetermined distance, the non-overlapping section η of the substrate 1 The sub-section can be supported on the support surface 21 of the spare tool 2〇 at the position of the press-welding process w. In this state, in the operation of step S15, the base 21 200845838 board 1 is not completely calibrated in a proper Position, and the platform 10 still needs to move left, right, up, and down toward the spare tool 20. When the ram 30 is lowered to the shooting position L3, and the platform 1 〇 is lowered to align the non-overlapping sections of the substrate 1 Part of the support surface of the spare tool 20 At 21 o'clock, the calibration image information acquiring device 4 simultaneously photographs the two wafer marks 6a, 6b formed on the driving integrated circuit 6 as shown in FIG. 3, and the two broken glass formed on the substrate as shown in FIG. Marks la, lb (step S16) 〇 then, the platform 10 is further moved a predetermined distance toward the spare tool 2 to be fully positioned at the pressure welding process position w. Simultaneously, the platform 10 supporting the substrate i is acquired by photographing The image information of la, lb, 6a, 6b is marked to perform calibration with respect to image information at the X, Y axis and 0 angle (step S17), and the platform 10 is lowered so that the substrate 1 can be completely supported on the platform 10. Support surface U and support surface 21 of spare tool 2G (step

:S18). In the operation of step S18, when the spare tool 2 can be moved up to an empty state, it is advantageous to remove the non-(four) segment ^ and refer to FIG. 9 for an empty state of 1 = 1 〇. When the calibration process is lowered to the stage 1〇, the indenter 'drys (step 9) and a pre-welded steam is performed (step S20). When completing the pre-streaming D = leave the position L2. In the conventional technology, the 3G system has risen back to L2, 3〇, and has not entered the same. However, in the example of the embodiment 22 200845838, when the head 30 is raised to the leaving position [2, the operation of raising the platform ί or the operation of lowering the spare tool 20 is performed (step s2i). The platform 10 is taken out. In this operation, unlike the prior art, since the platform 10 has been taken out of the 'supply arm 5', a new drive integrated circuit (not shown) is simultaneously transported to the lower region of the indenter 3G (step S22). ). Then repeat the above steps su to the operation along step 2. According to the above-mentioned pressure welding method, compared with the prior art, since the operation of the plurality of steps does not need to be performed after the completion of the previous step operation and the individual step operations, the press welding process can be shortened and the pressure welding process can be shortened. Going faster. According to the present embodiment, the driving integrated circuit 6 can be simple and convenient. The two sides = the welding substrate 1, and the processing time for the pressure welding process can be shortened, and the high-speed welding process can be realized. The head can also be in the middle. Although the welding process is under pressure, the pressure head is also used in the main pressure welding process. And the acquisition device is suitable for pressing _ c

Gas selection 卩 卩 _ equipment, calibration image 1 can also be applied to different (four) preparation, for example - inspection equipment. The two final phase 1W wire shows the schematic of the structure of the apparatus for performing a pressure-pressed flow = v for welding a printed circuit. Please refer to the "2" county to show the other embodiment of the invention during the pressure welding process, [for the purpose of the dry printed circuit device structure *. Please refer to Fig. 13 for a schematic diagram of the structure of the auxiliary tool shown in Figs. 11 and 12. Figure 1 is a flow chart showing a method of pressure welding a printed circuit in accordance with another embodiment of the present invention. As shown in FIG. 11 to FIG. 14, a pressure welding apparatus according to this embodiment includes a platform 10a, a spare tool 20a, a pressure bonding tool 30, and a control unit for controlling the above components (not shown). Show). The substrate 1 includes an upper glass 2 and a lower glass 3, and as described above, the upper polarizer 4 and the lower polarizer 5 are adhered to the outer surfaces of the upper glass and the lower glass, respectively. The stage 10a moves the substrate 1 to a pressure welding process position W of the drive integrated circuit 6, or takes out the substrate 1 from which a pressure welding process has been completed. That is, the platform 10a operates substantially like a mobile unit for moving the substrate 1. The stage 10a includes a support surface 11a having a region at least larger than the substrate 1 to easily support the substrate 1 in a flat state. However, as described above, although the stage 10a supports the substrate 1, the stage 10a also supports an area on the substrate 1 other than the non-overlapping section 。. Therefore, it can be said that the support surface 11a of the stage 10a is a region that supports the polarizer 5 under the substrate 1. Although not illustrated in detail, a plurality of vacuum holes (not shown) for sucking up the substrate 1 are provided on the support surface 11a of the stage 10a. A vacuum control unit 12 can be further disposed on the platform 10a to control the on/off and intensity of the vacuum generated at the platform 10a. The vacuum control unit 12 is controlled by the control unit. Only when the platform l〇a moves the substrate 1 to the pressure welding flow position W of the drive integrated circuit 6, or when the substrate 1 that has completed the pressure welding process is taken out, it can be vacuumed under the control of the control unit. The holes create a vacuum. That is, when the pressure welding process is actually performed by the pressure welding tool 30, the vacuum is removed. When supporting most of the area of the substrate 1, the spare tool 20a only partially supports the non-overlapping sections Η. The spare tool 20a is separated from the platform 10a 24 200845838. In the present embodiment, the spare tool 20a is fixedly disposed in the region where the welding process position W of the integrated circuit 6 is driven. Since the present invention is not limited thereto, the spare tool 20a can be formed to be movable as the platform 10a. The spare tool 20a includes a main body 25, a support surface 21a formed on the surface of the main body 25 and supporting the non-overlapping section 从 from the lower side of the main body 25, a plurality of formed on the support surface 21a and classified into three groups G1, G2. The vacuum hole 22 of G3 and the three vacuum lines 23 respectively corresponding to the three groups G1, G2, and G3, and three openings respectively disposed on the three vacuum lines 23 and optionally each vacuum line 23 The detection valve 24 is opened/closed. In the present embodiment, the reason for classifying the vacuum holes 22 formed in the support surface 21a into three groups G1, G2, G3 is to conform to the size at which the substrate 1 can be supported on the support surface 21a. For example, as shown in FIG. 13, when the size of the substrate 1 is smaller than the support surface 21a, and the non-overlapping sections 基板 of the substrate 1 are only enough to be supported by the second group G2, if the first group G1 and the first group Flow loss occurs when all vacuum holes 22 in other parts of the three groups G3 generate a vacuum. In the present embodiment, three vacuum lines 23 are provided in each of the groups G1, G2, G3 such that the openings of the three vacuum lines 23 are selectively opened or closed by the three detection valves 24. Since the present invention is not limited thereto, the number of groups of the vacuum holes 22 may be the number "2" or the number "4" or more, or the vacuum holes 22 may not be classified if necessary. Into different groups. In the prior art, as shown in FIG. 11, since most of the surface of the substrate 1 is substantially vacuumed by the support surface 11a of the stage 10a and supported by 25 200845838, and the non-overlapping regions of the substrate 1 are The backup work surface 21a is raised, and if it is in this state, the pressure welding tool 3 is stepped down to drive the area of the integrated circuit 6, because of the support surface of the platform 1A and the supporting surface of the spare tool 20a. A relatively high bud formation between 21a may cause damage and cracks on the substrate 1. Ah is bad

^ However, in the present embodiment, as shown in Fig. 12, the substrate tether is lifted from the support surface 11a of the stage 10a (because the vacuum has been removed), = there is a non-overlapping area of the substrate 1 by the spare tool 20a The vacuum is sucked up and supported. In this state, when the pressure welding tool is lowered and the pressure welding process for driving the integrated circuit β is performed with respect to the substrate, the pressure-welding tool 30, the substrate 1, and the support surface of the spare tool 2A are provided. Since 21a is formed substantially on the same plane, damage and cracks on the substrate 1 can be avoided. The pressure bonding tool 3 is used to roughly weld the drive integrated circuit 6 to the upper surface of the non-overlapping section 基板 of the substrate. The bonding tool 3 is placed at the pressing position [and can be raised to a predetermined position. It is recognized that "the jade is used for the ascending operation of the pressure-welding tool 30, a roller device for ascending, and a heating wire for hot pressing are disposed on the pressure-welding tool 3. The technique of the pressure-welding tool 30 is disclosed in a certain In some patents, the detailed description of the pressing tool #3 is omitted. The control unit l〇a and the spare tool 2〇a are controlled, and the pressure welding tool 30 can be controlled. In particular, In this embodiment, the control unit can selectively control the state of the vacuum, for example, the opening/closing of the vacuum and the strength of the vacuum, etc., and the vacuum is generated according to the rising operation of the pressure welding tool 3〇. A platform l〇a and a spare tool 2〇a. 26 200845838 The special control unit is controlled by the substrate 1 to move the disk to take out the turn, and the vacuum generated by the vacuum hole 13 of the platform is used to suck up the substrate; During the pressing of the bonding tool 30, the vacuum hole 13 of the platform 10a is moved to a vacuum. When the vacuum state generated in each of the platforms 1a and the spare tool suit is appropriately controlled by the (4) unit, the driving product is During the pressure welding process of the body circuit 6, Damage and cracking on the substrate 1 can be avoided. Under the operation of the control unit, when the substrate i is moved for the first time in the welding process position 1, the control unit generates a vacuum on the platform i〇a. Thus, the platform is located. The substrate 1 on the support surface 11a of 0a, particularly the lower film 5, is vacuumed by the support surface na of the stage 10a. Therefore, even when the platform l〇a moves, the substrate 避免 can be prevented from being separated from the platform. Port When the platform 10a reaches the pressure welding process position w, the platform 1〇a is positioned adjacent to the spare tool 2〇a fixed at the pressure welding process position w. The non-overlapping region of the moving substrate 1 is mounted on the support surface 21a of the spare tool 2A. When the non-overlapping region of the substrate 1 is mounted on the support surface 21a of the spare tool 2A, the control unit reduces the vacuum intensity generated at the stage 1a to form a weak empty state. Conversely, the control unit generates a vacuum at the spare tool 20a to suck the non-overlapping section H of the substrate i from the lower surface of the substrate 1. The control unit then removes the vacuum created at the platform. As a result, the substrate 1 is sucked up substantially only by the support surface 21a of the spare tool 2A. In this state, when the pressure welding tool 3 is lowered to perform the pressure welding process corresponding to the driving integrated circuit 6 of the substrate 1, the pressure bonding tool 30, the substrate 丨, and the spare tool 2 are provided as a result of 27 200845838. The support surfaces 21a of the 〇& are formed substantially in the same plane, so that damage and cracks on the substrate 1 can be avoided. ^ When the pressure welding process is completed and the bonding tool 3 is raised, the control unit removes the vacuum generated in the spare tool 20a, and generates a vacuum on the stage 1〇a, as in the initial state, in order to suck up the substrate and take out the substrate. 1. Referring to Fig. 14, a method for pressure welding the drive integrated circuit 6 D of the above structure will be described in detail below. When the substrate 丨 in the pressure welding process is loaded on the stage 10a, a vacuum is generated on the stage 10a (step S31). The substrate 1 is firmly and fixedly sucked up on the stage 10a. When the substrate 1 is firmly and fixedly sucked up on the stage 1A, the stage i〇a is moved to the pressure welding flow position W by the separate moving unit for moving the platform 10a (step S32). . As shown in Fig. u, when the platform l〇a reaches the position W of the pressure welding process, the platform 1〇a is positioned in the standby tool 2〇a immediately adjacent to the position E of the pressure welding process. The non-overlapping section of the substrate 丄 to be moved is mounted on the support surface 21a of the spare tool (S33). When the non-overlapping section of the substrate 1 is mounted on the support surface 21a of the spare tool, the control unit reduces the vacuum intensity generated at the stage i〇a to form a weak empty state (step S34). Conversely, a vacuum is generated at the standby tool 20a to suck up the non-overlapping region from the lower side of the non-overlapping section η (step S35). The vacuum generated at the platform i〇a is removed (step 836). Further, the bonding tool 30 is lowered (step S37) and a pressure welding process for pressing the driving integrated circuit 6 to the upper surface of the non-overlapping section η is performed (step S38). 28 200845838 The drive integrated circuit 6 is pressure-bonded to the substrate 1 by supplying heat and pressure to drive the integrated circuit. In the prior art, as shown in FIG. 11, since most of the surface of the substrate , is vacuumed and supported by the support surface Ua of the platform 10a, and the non-overlapping regions of the substrate 1 are tied Lifting from the support surface 21a of the spare tool 2A, in this state, if the pressure welding tool is lowered and pressed to drive the area of the integrated circuit 6, it will be due to the support surface 1 la and standby on the platform 1A A relative height difference between the support surfaces 21a of the tool 2A is such that damage and cracks are likely to occur on the substrate 1. Door (. ^ However, in the present embodiment, as shown in Fig. 12, the substrate 1 is lifted from the support surface 11a of the flat surface, and only the non-overlapping section # of the substrate 藉 is provided by the spare tool 2 The table support surface 2ia of 〇a is vacuumed up and supported. In this state, when the pressure welding tool 3〇 is lowered and the pressure welding process of the integrated circuit 6 is driven relative to the substrate, the pressure is supplied. The welder 30, the substrate, and the support surface 21& of the spare tool 2〇a form the same H, so that damage and cracks on the substrate can be avoided. δ When the pressure welding process is performed, the pressure welding tool 30 is raised. Go to the original position (step S39). When the pressure welding tool 3 is raised, the vacuum of the spare tool 2〇a can be correspondingly removed (step S4〇). When the control unit, the detection unit 24 When it is time, the vacuum generated at the standby = can be removed. When the vacuum is generated in the vacuum of the spare tool 2 〇a, the platform 10a is again erected to suck up the substrate 1 by the platform 10a (step S41). When the mobile platform l〇a, the substrate that has completed the pressure welding process is taken out (step 29)

And the above mentioned 200845838 (S42). In the above method, the welding process of another substrate (not shown) can be continuously performed. As described above, according to the present invention, since the substrate 1 is efficiently supported by a simple and convenient structure and method, since the substrate has a thinner thickness than the conventional technique, the pressure welding of the integrated circuit 6 is driven. Damage and cracks on the substrate can be avoided during the process. In particular, in the present embodiment, even when the thickness of the upper polarizer 2 and the lower polarizer 3 is not more than 0.25, it is possible to avoid damage to fish cracks on the substrate i and to be easily driven. The method of the integrated circuit 6 is pressure-bonded to the substrate, and at the same time, it is reduced in the application process of the pressure welding process, thereby realizing a high-speed pressure welding process. Even when compared with conventional techniques, it has a thinner thickness; = two effectively supports the substrate, 3 early damage and cracks during the pressure welding process of the printed circuit by using a simple structure and method. On the W Weijie board, J惶圮 惶圮 惶圮 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为That is to say, the scope of the invention is not limited to the scope of the patent for the invention, or the variation of the scope of the invention according to the scope of the invention. _ white for this [simplified description]

A method for pressure welding a printed circuit (4) full automatic module pressure welding; a conventional 30 200845838 FIG. 2 shows a conventional method for pressure welding a printed circuit; FIG. 3 shows the present invention FIG. 4 is a schematic view showing an embodiment of an apparatus structure for pressure welding a printed circuit of the present invention; FIG. 5 is a schematic view showing the calibration of the apparatus for controlling a printed circuit of the present invention; FIG. 6 is a plan view showing the apparatus for acquiring calibration image information in FIG. 5 of the present invention, and FIGS. 7 to 9 are diagrams showing the operation of the apparatus for pressure welding a printed circuit of FIG. 4 of the present invention. Figure 10 is a flow chart showing a consistent embodiment of a method for pressure welding a printed circuit board according to the present invention, and Figure 11 is a view showing a pressure welding process prior to performing a pressure welding process according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 12 is a schematic view showing the structure of an apparatus for pressure welding a printed circuit during a pressure welding process according to another embodiment of the present invention, and FIG. 13 is a view showing the present invention. It is not intended to aid the structure shown in FIGS. 11 and 12, and 14 are diagrams of another embodiment of the present invention, a flow chart of a method of bonding a printed circuit. [Main component symbol description] 5111 The pressure head is lowered to a take-up position 5112. The vacuum is formed at the pressure head so that the pressure head can take the driver 31 200845838 The body circuit SI 13 The pressure head rises to an exit position 5114 The movement supply arm 5115 pressure The head is lowered to a shooting position 5116. The second camera is photographed by the indenter to vacuum the drive body circuit. The second wafer mark 5117 is raised back to the exit position 5118. A platform supporting the substrate is transported to a pressure welding process position 5119. Lowering the 5120 camera, the two glass markers formed on the substrate are mounted on the substrate. The platform is calibrated at the X, Y axis and 6» angle. 5122 The pressure head is lowered to the pressure welding process position 5123. The pre-welding process 5124 is used to raise the pressure head. Position 5125 Lift the platform 5126 Remove the platform 5127 Move the supply arm 1 LCD display is not the substrate la Glass mark lb Glass mark 2 Upper glass 3 Lower glass 4 Upper polarizer 5 Lower polarizer 6 Drive integrated circuit 32 200845838 6a Wafer mark 6b Wafer mark 10 platform 11 support surface 20 spare tool 21 support #surface 30 indenter / pressure welding 40 calibrated image information acquiring device Ο 41 稜鏡 block 41a shooting window 42 vacant coupling block 43 cylinder 44 photographic lens unit 45 lens support 46 illumination unit 50 supply arm (丨H non-overlapping section LI take position L2 Leaving position L3 Shooting position L4 Pressure welding position W Pressure welding flow position Sll Indenter down to a picking position S12 The indenter provides vacuum to pick up S13 to raise the indenter to a dead position 33 200845838 514 Platform to support the substrate Move the supply arm to the pressure welding process position 515 to lower the pressure head to the shooting position, and lower the platform 516 to simultaneously capture the two wafer marks and the two glass marks 517. When the platform performs the calibration process, move the platform to the pressure welding process position 518 to lower the platform. Or raise the spare tool 519 to lower the indenter to a pressure welding position 520 to perform a pre-welding process 521. The indenter rises to the exit position/lower platform or raises the spare tool 522. The platform is removed and the supply arm 10a platform 11a is supported. Surface 12 vacuum control unit 13 vacuum hole 20a spare tool 21a 22 Vacuum hole 23 Vacuum line 24 Detection valve 25 Main body G1 Group G2 Group G3 Group 34 200845838 S31 Vacuum is generated on the platform S32 Move the platform to the pressure welding flow position S33 Mount the non-heavy section of the substrate to be moved S34 on the support surface of the spare tool reduces the vacuum strength generated on the platform S35. The vacuum is generated in the spare tool. S36 is removed. The vacuum generated on the platform is lowered. S37 is lowered. The pressure welding tool S38 is pressed. The welding process S39 is raised. The pressure welding tool S40 is removed. The vacuum S41 of the spare tool generates a vacuum on the platform S42. The substrate 35 that has completed the freshening process is taken out.

Claims (1)

200845838 h, the scope of application for patents: . A device for printing circuit and image information, 1 is integrated with the calibration of the soil ▲ & and will be at least = the device for calibrating the image information, and at least A wafer mark on the printed circuit is obtained from the β t into a calibrated image of the mark on the substrate. 〕 Langtong shooting, to €). According to the scope of the patent application scope, further includes:, the heart of the right to take the calibration image information installed ^ (four) at least - W standard multiple two-heart surface and set up each other ^ ^ Each relative number of 私 of the private mirror block is set in & to separate the direction of the light and the block of the space into a plurality of cylinders, respectively, with the gentleman, Facing the shooting windows; a plurality of photographic lens units are coupled by a hollow coupling block; and a portion. The end of the cylinder is coupled to the end of the cylinder according to the second item of the patent application scope, and further includes: I. Acquiring a plurality of lens support seats for obtaining calibration image information, and connecting the cylinders between the cylinders: j sighs in the photographic lens unit and the plurality of illumination units, and the sub-line is emitted to the tubes ^. The ground is connected to the cylinders, and the light is placed according to item 2 of the scope of the patent application, wherein the block is formed by the sub-blocks that are used to obtain the image information of the calibration, and are separated from each other by 200845838. And each of the two photographic windows is disposed at a same interval between the photographic windows, respectively, on each of the separate sub-blocks. 5. An apparatus for pressure welding a printed circuit, the apparatus comprising: a platform having an upper surface supporting a substrate for pressure welding the printed circuit, and transporting and removing the substrate to a pressure welding process position An indenter is disposed at the position of the bonding process, and the printed circuit can be raised and sucked, and the printed circuit that has been sucked is pressed against the substrate to press-weld the printed circuit on the substrate And a device for obtaining calibration image information, wherein at least one component mark formed on the sucked printed circuit is photographed together with at least one glass mark formed on the substrate to obtain the The calibration image information of the mark. 6. The device of claim 5, wherein the means for obtaining calibration image information is integrally formed. 7. The device according to claim 5, wherein each of the at least one wafer in the printed circuit is marked with at least one glass on the substrate, the number of which is two, and the information for obtaining calibration image is obtained. The device simultaneously captures two wafer marks and two glass marks. 8. The device of claim 5, wherein the means for obtaining calibration image information comprises: a plurality of blocks having a plurality of at least one wafer mark and the at least one glass mark Shooting window; 37 200845838. A plurality of empty coupling blocks are connected to each opposite surface of the prism block and arranged opposite each other; a plurality of 稜鏡 are arranged in the 稜鏡 block and the space Coupling the light in the coupling block toward the shooting window; a plurality of cylinders respectively coupled to the air-combining blocks; and a plurality of photographic lens units coupled to the respective photographic lens units The end of the barrel. 9. The device of claim 8, wherein the means for obtaining C calibration image information comprises: a plurality of lens holders disposed in the photographic lens and the cylinders And a plurality of lighting units respectively connected to the cylinders and emitting light to the cylinders. 10. The apparatus of claim 8, wherein the 稜鏡 block is formed by a group of mutually separated sub-blocks, and each of the two photographic windows is respectively The photographic windows are separated by an identical interval t and placed adjacent to each other on each of the separated sub-blocks. 11. The device of claim 5, further comprising a control unit for controlling the platform relative to the printing based on the calibration image information obtained by the calibration image device The circuit is calibrated. 12. The apparatus of claim 11, further comprising a spare tool disposed away from the platform and at a position from the underside of the substrate to support a portion of the substrate at the bonding flow location, wherein Before the platform moves to the position of the pressure welding process and a portion of the substrate supports 38 200845838 on a support surface of the spare tool, the control unit controls the image information of the device for acquiring calibration image information. The platform is calibrated on the X, γ and 0 angles. The device according to claim 5, wherein the substrate is used in a liquid crystal display (LCD) substrate of a mobile terminal, and the printing % circuit is a driving integrated circuit. 14. A method for pressure welding a printed circuit, the method comprising: moving a platform supporting a substrate to a pressure welding process position; taking a printed circuit to a pressing position of a shooting position; Capturing at least one of the wafers formed on the printed circuit board and at least one of the glass marks formed on the substrate to obtain calibration image information on the marks; according to the calibration obtained on the marks Image information, aligning the platform supporting the substrate to the wafer mark; and 15 pressing the printed circuit to the substrate by lowering the ram. The method of claim 14, wherein the step of taking the brush circuit to a position of a photographic head is simultaneously lowered by a predetermined distance from the second, or the substrate is supported. a non-overlapping section of the overseas Chinese tool, and the operation of lifting from the lower side of the substrate - the method described in claim 14 of the patent application, wherein the second level = the same level as the platform Move towards the alternate guard. Pre- & π. According to the ship's pure position to find the pressure welding process. Included in the method of claim 14, after further step-by-step welding of the printed circuit, the indenter is raised to - leave position 39 200845838, wherein the head is to the exit position The rise is carried out simultaneously with the lifting of the platform or the operation of lowering the spare tool. 18. The method of claim 14, further comprising removing the platform after the raising of the indenter to the exit position, wherein the removal of the platform is performed using a supply arm, The operation of a new printed circuit to move the lower portion of the indenter is performed simultaneously. 19. A device for pressing a printed circuit'. The device comprises: a platform for moving a substrate to a bonding process location of a printed circuit, and a bonding process of the substrate from the printed circuit Positioning, and the substrate has at least one upper glass and at least one lower glass, wherein at least one upper polarizer and at least one lower polarizer are respectively adhered to the upper surface of the upper glass and the lower glass; Provided at a position of the pressure welding process, and can be raised, and the printed circuit is pressed to an upper surface of a non-overlapping section of the lower glass, and the printed circuit is pressure-bonded to the bonding welding process. a substrate, where the non-overlapping section of the lower glass is not overlapped with the upper glass; and a spare tool disposed separately away from the platform to support the non-overlapping section from a lower side of the non-overlapping section And the spare tool has at least one vacuum hole for sucking up the substrate during pressing of the bonding tool. 20. The apparatus of claim 19, wherein a plurality of vacuum holes are formed in the platform to pick up the substrate during movement and removal of the substrate. The apparatus of claim 19, wherein the spare tool is in the form of a plurality of vacuum holes, and the spare tool comprises: a body; a support surface formed on the body The support surface has a plurality of vacuum holes divided into at least two groups; a plurality of vacuum lines are disposed in the body, each vacuum line system With respect to each group setting, and each group individually produces a true vacancy; and a detection valve is provided at each vacuum line, and the opening of each vacuum line can be selectively opened and closed. 22. The apparatus according to claim 20, further comprising a control unit for controlling the opening/closing and strength of the vacuum generated on the platform and the spare tool to avoid the pressure welding tool A crack is generated on the substrate during pressing. 23. The apparatus according to claim 22, wherein the control unit is configured to control the generation of a vacuum in the vacuum hole of the platform during the movement and removal of the substrate to suck up the substrate, and During the pressure welding of the pressure welding tool, the vacuum of the vacuum hole of the platform is controlled. 24. The apparatus of claim 19, wherein the spare tool is attached to an area of the pressure welding process location. 25. A method for pressure welding a printed circuit, the method comprising: sucking a substrate on a vacuum generating platform and moving the picked up substrate to a bonding process of the printed circuit Positioning, the substrate has at least one upper glass and at least one lower glass, wherein in the upper surface of the upper glass and the lower glass, at least one upper polarizer and at least one lower polarizer are respectively adhered to the substrate; a non-overlapping section mounted on a support surface of the spare tool disposed at the position of the press-welding process, the non-overlapping section of the lower glass is not overlapped with the upper glass; a vacuum is generated in the spare tool, and a lower side of the non-overlapping section aspirating the non-overlapping section; removing a vacuum on the platform; and pressure welding the printed circuit board to the non-overlapping section by lowering a pressure bonding tool positioned above the substrate One of the upper surfaces. 26. The method of claim 25, further comprising reducing the intensity of the vacuum generated on the platform prior to creating a vacuum in the spare tool. 27. The method of claim 27, further comprising: removing the vacuum generated in the spare tool when the pressure welding tool is raised after the completion of the pressure welding process; generating a vacuum on the platform, and Aspirating the substrate; and removing the substrate by the platform. 42