TWI400762B - Method of inspecting film and integrated circuit - Google Patents

Description

Rubber and integrated circuit detection method

The invention relates to a method for detecting a glue material and an integrated circuit, in particular to a method for detecting the adhesion state of the glue material and the damage condition of the integrated circuit.

In the liquid crystal display panel, an integrated circuit (IC) is used to output a desired voltage to a pixel (Pixel) to control the degree of twist of the liquid crystal molecules. Therefore, whether the integrated integrated circuit and other circuits in the liquid crystal display panel can have a good electrical connection will affect the liquid crystal display panel.

At present, in the process of liquid crystal display panel, the commonly used driving integrated circuit packaging technology is Chip On Glass (COG). The glass flip chip is to directly mount the driving integrated circuit on the glass substrate, and the liquid crystal display panel is compared with the early mounting of the integrated circuit on the printed circuit board (PCB) and then electrically connected to the glass substrate. The advantages of thinner and lighter, reduced material use and lower cost, therefore, glass flip chip is currently the main driver integrated circuit packaging technology.

In the glass flip chip packaging technology, the drive integrated circuit is electrically connected to the glass substrate through an anisotropic conductive film (ACF) in a vertical direction. The process of the glass flip chip is roughly as follows: the anisotropic conductive film is attached to the glass substrate, the driving integrated circuit is pre-compressed on the anisotropic conductive film, and the driving integrated circuit is subjected to the present pressing.

Referring to FIG. 1 and FIG. 2 together, a schematic diagram of detecting the attachment state of the anisotropic conductive film 150 in the prior art is shown. The conventional detection method is performed after the anisotropic conductive film 150 is attached to the glass substrate 110, and the adhesion state of the anisotropic conductive film 150 is determined by the Gray-Level pattern in the detection frame 120. First, the glass substrate 110 is placed on the machine table 130. The machine 130 is then moved under a Charge Coupled Device (CCD) 140 such that the charge coupled element 140 covers the area to be detected. As shown in FIG. 2, the pattern captured by the detection frame 120 of the charge coupled device 140 determines whether the adhesion of the anisotropic conductive film in the detection frame 120 is good by the gray scale processing.

However, the above detection process has the following disadvantages. First, the detection frame 120 is a fixed-point detection frame. When the charge-coupled element 140 or the machine 130 is shaken, the detection frame 120 is offset to the anisotropic conductive film 150. That is, the anisotropic conductive film 150 cannot be normally included, and there is a problem of missing detection, thereby affecting the detection determination. Second, the theoretically driving the integrated circuit nip area must cover the anisotropic conductive film 150 due to the setting of the detection frame 120. Without the reference, it is impossible to know the position of the nip area of the driving integrated circuit, and thus the kinetic area of the subsequent driving integrated circuit may not cover the anisotropic conductive film 150, causing a problem of missing detection.

Therefore, it is necessary to propose a solution to the above problems.

An object of the present invention is to provide a method for detecting a glue material and an integrated circuit, which can detect the adhesion state of the glue material and whether the integrated circuit is damaged.

The method for detecting a rubber material and an integrated circuit according to the present invention comprises the following steps:

(1) defining a first reference frame including a first portion of the opposite side of the integrated circuit and a portion of the second edge, a third edge connected between the portion of the first edge and a portion of the second edge An edge of one of the reference frames is surrounded by a first region having a partial integrated circuit, and a portion of the first edge, a portion of the second edge, and a second region adjacent to the first region;

(2) storing a gray scale pattern in the first reference frame;

(3) defining a first detection frame, wherein the first detection frame corresponds to a portion of the first edge, a portion of the second edge, and the third edge of the integrated circuit;

(4) Detecting whether the gray scale pattern in the first detection frame conforms to the gray scale pattern in the first reference frame, and judging the attachment state of the integrated circuit and the glue material.

In an embodiment of the present invention, when the integrated circuit and the glue are attached normally, the detecting method further comprises:

(5) determining whether the integrated circuit is broken by detecting that the gray scale pattern in the first detection frame corresponds to the edge of the integrated circuit of the first region.

In still another embodiment of the present invention, the detecting method further comprises:

(6) defining a second reference frame relative to the first reference frame, the second reference frame including another portion of the first edge opposite the integrated circuit and another portion of the second edge, connected to the other portion a fourth edge between one edge and another portion of the second edge and one edge of the second reference frame are enclosed and have another partial integrated circuit, and another portion adjacent to the third region is first a fourth region of the edge, another portion of the second edge, and the fourth edge;

(7) storing a gray scale pattern in the second reference frame;

(8) defining a second detection frame, wherein the second detection frame corresponds to another portion of the first edge, another portion of the second edge, and the fourth edge of the integrated circuit;

(9) detecting whether the gray scale pattern in the second detection frame is consistent with the gray scale pattern in the second reference frame, and judging the attachment state of the integrated circuit and the glue material;

(10) calculating that the grayscale pattern in the first detection frame corresponds to the center of the third edge of the first region, and the grayscale pattern in the second detection frame corresponds to the center of the fourth edge of the third region as a positioning Benchmark.

Compared with the prior art, the present invention has the following advantages: (1) the definition of the first detection frame and the second detection frame can be dynamic, and is not affected by charge coupling elements or machine shaking; (2) due to definition The first reference frame and the second reference frame include the edge of the integrated circuit, so that the gray-scale pattern of the first detection frame and the second detection frame can be used to determine whether the nip area of the integrated circuit includes the glue material; (3) the first The edge of the region includes the edge of the integrated circuit, so that the edge of the integrated circuit can be detected to be damaged; and (4) by calculating the opposite edge centers of the integrated circuit, the center of the two edges can be used as a follow-up The pressure positioning mark (Mark) can omit the step of designing the pressure positioning mark and simplify the flow of the glass flip chip process.

The technical contents of the present invention will be described in detail below with reference to the accompanying drawings.

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a flow chart showing the method for detecting the rubber material 400 and the integrated circuit 450 according to the first embodiment of the present invention, and FIG. 4 is a diagram showing the method according to the present invention. A schematic diagram of a method of detecting whether the press-fit condition between the glue material 400 and the integrated circuit 450 of one embodiment is good. The method for detecting the glue material and the integrated circuit of the present invention is to perform the detection by pre-pressing the integrated circuit 450 on the adhesive material 400. The steps of the detection method will be described in detail below.

In the step (1), a first reference frame 402 is defined as a criterion for subsequent determination. The first reference frame 402 includes a portion of the first edge 452 and a portion of the second edge 454 opposite to the integrated circuit 450. A third edge 456 between a portion of the first edge 452 and a portion of the second edge 454 and an edge 472 of the first reference frame 402 enclose a first region 458 having a partial integrated circuit 450, and adjacent to the first a portion of the first edge 452 of a region 458, a portion of the second edge 454, and a second region 460 of the third edge 456, ie, the first reference frame 402 includes a first region 458 and a second region 460, and the second region 460 is located outside of the first region 458. The first region 458 and the second region 460 each have different gradations, that is, the integrated circuit 450 and the glue 400 each have different gradations. In addition, the size of the first reference frame 402 can be adjusted as needed for detection.

In step (2), the gray scale pattern in the first reference frame 402 is stored. Since the first region 458 and the second region 460 each have different gray scales, the stored gray scale pattern includes the gray scale pattern of the first region 458. And a gray scale pattern of the second region 460.

In the step (3), a first detection frame 404 is defined, which is smaller than or equal to the first reference frame 402, and the first detection frame 404 corresponds to a portion of the first edge 452 and a portion of the second edge of the integrated circuit 450. 454 and a third edge 456 connected between the two. Since the glass substrate (not shown) is photographed by an image capturing device (not shown) such as a charge coupled device during actual detection, the first detecting frame 404 can be dynamic even when the machine and the charge coupled device are shaken. The adjustment is performed to correspond to a portion of the first edge 452 of the integrated circuit 450, a portion of the second edge 454, and a position of the third edge 456 connected therebetween, thereby improving the accuracy of the detection.

In step (4), it is detected whether the gray scale pattern in the first detection frame 404 matches the gray scale pattern in the first reference frame 402, and the attachment state of the integrated circuit 450 and the glue 400 is determined. Since the gray scale pattern stored by the first reference frame 402 can be regarded as a normal attachment example, when the gray scale pattern of the first detection frame 404 is the same as the gray scale pattern of the first reference frame 402, the representative glue 400 is The attachment of the integrated circuit 450 is normal.

Please refer to FIG. 5, which is a schematic diagram showing the shortness of the adhesive material 400. When the glue 400 is short-circuited, that is, when the circumference of the integrated circuit 450 is not surrounded by the glue 400, the gray-scale pattern of the first detection frame 404 is different from the gray-scale pattern of the first reference frame 402 of FIG. 4, and thus It is judged that the attachment of the glue material 400 and the integrated circuit 450 is abnormal.

Please refer to FIG. 6 , which is a schematic diagram showing the damage of the integrated circuit 450 . When the integrated circuit 450 and the adhesive material 400 are attached normally, the detecting method of the present invention further includes: in step (5), detecting that the gray scale pattern in the first detecting frame 404 corresponds to the integrated body of the first region 458. The edge of the circuit 450 determines whether the integrated circuit 450 is broken. It can be seen from Fig. 6 that part of the first edge 452 of the integrated circuit 450 is uneven, and some of the second edge 454 and the third edge 456 are flat. Therefore, when the detection is performed, a portion of the first edge 452 may be unevenly detected by the gray scale pattern of the first detection frame 404, indicating that the integrated circuit 450 is damaged.

Please refer to FIG. 7 to FIG. 9 at the same time. FIG. 7 and FIG. 8 are flowcharts showing the method for detecting the rubber material 400 and the integrated circuit 450 according to the second embodiment of the present invention, and FIG. 9 is a schematic diagram showing A schematic diagram of a method for detecting whether the press-fit condition between the rubber material 400 and the integrated circuit 450 is good according to the second embodiment of the present invention. The detection method comprises the following steps.

In the step (1), a first reference frame 402 is defined as a criterion for subsequent determination. The first reference frame 402 includes a portion of the first edge 452 and a portion of the second edge 454 of the integrated circuit 450. The first edge 452 and the third edge 456 between the partial second edge 454 and one edge 472 of the first reference frame 402 enclose a first region 458 having a partial integrated circuit 450, and adjacent to the first a portion of the first edge 452, a portion of the second edge 454, and a second region 460 of the third edge 456, wherein the first region 458 and the second region 460 each have a different gray level, that is, the integrated circuit 450 and The glues 400 each have a different gray scale.

In step (2), the gray scale pattern in the first reference frame 402 is stored. Since the first region 458 and the second region 460 each have different gray scales, the stored gray scale pattern includes the gray scale pattern of the first region 458. And a gray scale pattern of the second region 460.

In the step (3), a first detection frame 404 is defined, which is smaller than or equal to the first reference frame 402, and the first detection frame 404 corresponds to a portion of the first edge 452 and a portion of the second edge of the integrated circuit 450. 454 and a third edge 456 connected between the two.

In step (4), it is detected whether the gray scale pattern in the first detection frame 404 matches the gray scale pattern in the first reference frame 402, and the attachment state of the integrated circuit 450 and the glue 400 is determined, for example, A pattern recognition software is detected by the computer to detect whether the gray scale pattern in the first detection frame 404 matches the gray scale pattern in the first reference frame 402. Since the gray scale pattern stored by the first reference frame 402 can be regarded as a normal attachment example, when the gray scale pattern of the first detection frame 404 is the same as the gray scale pattern of the first reference frame 402, the representative glue 400 is The attachment of the integrated circuit 450 is normal.

In step (6), a second reference frame 412 is defined, which is the same as the first reference frame 402, and the second reference frame 412 is opposite to the first reference frame 402 and includes another one opposite to the integrated circuit 450. One of the first edge 462 and the other portion of the second edge 464, the fourth edge 466 and the second reference frame 412 connected between the other portion of the first edge 462 and the other portion of the second edge 464 The edge 474 encloses a third region 468 having another partial integrated circuit 450, and another portion of the first edge 462 adjacent the third region 468, another portion of the second edge 464 and the fourth edge 466 The fourth region 470, wherein the third region 468 and the fourth region 470 each have different gray levels, that is, the integrated circuit 450 and the glue 400 have different gray levels.

In step (7), the gray scale pattern in the second reference frame 412 is stored. Since the third region 468 and the fourth region 470 each have different gray scales, the stored gray scale pattern includes the gray scale pattern of the third region 468. And a grayscale pattern of the fourth region 470.

In the step (8), a second detection frame 414 is defined, which is smaller than or equal to the second reference frame 412, and the second detection frame 414 corresponds to another portion of the first edge 462 of the integrated circuit 450 and another portion. A second edge 464 and a fourth edge 466 connected therebetween.

In step (9), it is detected whether the grayscale pattern in the second detection frame 414 matches the grayscale pattern in the second reference frame 412. For example, the second detection frame 414 can be detected by a computer through a pattern recognition software. Whether the gray scale pattern in the interior matches the gray scale pattern in the second reference frame 412 determines the attachment state of the integrated circuit 450 and the glue 400. Since the gray scale pattern stored by the second reference frame 412 can be regarded as a normal attachment example, when the gray scale pattern of the second detection frame 414 is the same as the gray scale pattern of the second reference frame 412, the representative glue 400 is The attachment of the integrated circuit 450 is normal.

In step (10), the grayscale pattern in the first detection frame 404 is calculated to correspond to the center of the third edge 456 of the first region 458, and the grayscale pattern in the second detection frame 414 corresponds to the third region 468. The center of the four edges 466. The center of the third edge 456 and the center of the fourth edge 466 can be considered as a subsequent local pressure positioning indicator as a positioning reference. Thereby, the step of additionally designing the pressure positioning mark can be omitted, and the flow of the glass flip chip process can be simplified.

It should be particularly noted that one preferred embodiment of the rubber material is an anisotropic conductive film. Since the anisotropic conductive film and the integrated circuit have different gradations, the pattern matching method of the present invention can be used to judge the attachment. In the case, other materials having a gray scale difference from the integrated circuit can also be used for the purpose of detection by the present invention.

While the present invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. Other different embodiments are contemplated, and the scope of the present invention is defined by the scope of the appended claims.

1-10‧‧‧Steps

110‧‧‧ glass substrate

120‧‧‧Check box

130‧‧‧ machine

140‧‧‧Charge-coupled components

150‧‧‧ anisotropic conductive film

400‧‧‧Stained materials

402‧‧‧First reference frame

404‧‧‧First detection frame

412‧‧‧ second reference frame

414‧‧‧second detection frame

450‧‧‧Integrated circuit

452‧‧‧ part of the first edge

454‧‧‧ part of the second edge

456‧‧‧ third edge

458‧‧‧First area

460‧‧‧Second area

462‧‧‧ another part of the first edge

464‧‧‧ another part of the second edge

466‧‧‧ fourth edge

468. . . Third area

470. . . Fourth area

472, 474. . . edge

1 and 2 are schematic views showing the detection of the attachment state of the anisotropic conductive film in the prior art; and FIG. 3 is a view showing the detection method of the rubber material and the integrated circuit according to the first embodiment of the present invention. FIG. 4 is a schematic view showing a method for detecting whether the press-fit condition between the glue material and the integrated circuit is good according to the first embodiment of the present invention; FIG. 5 is a schematic view showing the short stick condition of the glue material; 6 is a schematic diagram showing damage of an integrated circuit; FIGS. 7 and 8 are flowcharts showing a method for detecting a rubber material and an integrated circuit according to a second embodiment of the present invention; and FIG. A schematic view showing a method of detecting whether the press-fit condition between the glue material and the integrated circuit according to the second embodiment of the present invention is good.

1-5. . . step

Claims (14)

A method for detecting a rubber material and an integrated circuit includes: (1) defining a first reference frame, the first reference frame including a first portion of the opposite side of the integrated circuit and a portion of the second edge, connected to a third edge between the first edge and the second edge of the portion and an edge of the first reference frame enclosing a first region having a partial integrated circuit, and adjacent to the first region a portion of the first edge, the second portion of the portion, and the second region of the third edge; (2) storing a grayscale pattern in the first reference frame; (3) defining a first detection frame, the first a detection frame corresponding to the portion of the first edge of the integrated circuit, the portion of the second edge, and the third edge; and (4) detecting whether the grayscale pattern in the first detection frame is related to the first reference The gray scale pattern in the frame is matched, and the integrated circuit and the attached state of the glue are judged. The detection method of claim 1, wherein the first region and the second region each have a different gray scale. The detection method according to the first aspect of the invention, wherein the detection method further comprises: (5) detecting a gray scale pattern corresponding to the first detection frame when the integrated circuit and the glue are attached normally; Whether the integrated circuit is damaged is determined at the edge of the integrated circuit of the first region. The detection method of claim 1, wherein in the step (3), the position of the first detection frame can be dynamically adjusted. The detection method of claim 1, wherein in the step (3), the first detection frame is less than or equal to the first reference frame. The detection method of claim 1, wherein in the step (4), the determining method is: comparing the first detection frame and the grayscale pattern in the first reference frame, if they are the same, Define the integrated circuit to be attached properly. The detection method of claim 6, wherein the comparison is performed by a computer through a pattern recognition software. The detection method of claim 1, further comprising: (6) defining a second reference frame, the second reference frame is opposite to the first reference frame, and the second reference frame includes the integrated circuit a further portion of the first edge and another portion of the second edge, a fourth edge connected between the other portion of the first edge and the second portion of the other portion, and the second reference frame An edge enclosing a third region surrounded by another portion of the integrated circuit, and the other portion of the first edge adjacent to the third region, the other portion of the second edge, and the fourth a fourth region of the edge; (7) storing a grayscale pattern in the second reference frame; (8) defining a second detection frame, the second detection frame corresponding to the other portion of the integrated circuit first The edge, the other portion of the second edge, and the fourth edge; (9) detecting whether the grayscale pattern in the second detection frame matches the grayscale pattern in the second reference frame, and determining the integrated circuit And the attaching condition of the glue; and (10) calculating a gray scale pattern in the first detection frame corresponding to the first area The center of the third edge, and the second frame detection pattern corresponding to the gray level of the center of the fourth edge of the third area, as a positioning reference. The detection method of claim 8, wherein the third region and the fourth region each have a different gray scale. The detection method of claim 8, wherein in the step (8), the position of the second detection frame can be dynamically adjusted. The detection method of claim 8, wherein in the step (8), the second detection frame is less than or equal to the second reference frame. The detection method of claim 8, wherein in the step (9), the judging method compares the second detection frame with the gray scale pattern in the first reference frame, and if they are the same, Define the integrated circuit to be attached properly. The detection method of claim 12, wherein the comparison is performed by a computer through a pattern recognition software. The detection method according to claim 1, wherein the rubber material is an anisotropic conductive film.