201104772 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種膠材以及積體電路之檢測方法，尤其是 一種膠材貼附狀況以及積體電路破損狀況之檢測方泽。 【先前技術】 在液晶顯示面板中，驅動積體電路（Integrated Circuit，1C) 之作用為輸出所需電壓至圖元（Pixel)，控制液晶分子之扭轉程 φ 度。因此驅動積體電路與液晶顯示面板中其他電路是否能有良 好的電性連接，將會影響液晶顯示面板甚钜。 目前液晶顯示面板的製程中，常用的驅動積體電路封裝技 術為玻璃覆晶（Chip On Glass，COG)。玻璃覆晶是將驅動積體 電路直接設置於玻璃基板上，與早期將驅動積體電路設置於印 刷電路板（Printed Circuit Board，PCB)後再與玻璃基板電性連接 比較，具有使液晶顯示面板更加輕薄、減少材料使用及降低成 本的優點，因此玻璃覆晶為目前主要的驅動積體電路刼裝技 • 術。 在玻璃覆晶的封裝技術中，驅動積體電路透過異方性導電 膜（Anisotropic Conductive Film，ACF)與玻璃基板作垂直方向 的電性連接。玻璃覆晶的製程大致上如下：貼附異方性導電膜 在玻璃基板上、將驅動積齄電路預壓在異方性導電膜上及將驅 動積體電路進行本壓。 請同時參閱第1圖以及第2圖，係繪示習知技術中檢測異 方性導電膜150貼附狀況之示意圖。習知檢測方法是在異方性 導電膜150貼附在玻璃基板110後進行檢測.，藉由檢測框120 内之灰階（Gray-Level)圖案判斷異方性導電膜150之貼附狀 201104772 ’ 況。首先，將玻璃基板110放置於機台130上。接著將機台13〇 移動至電荷輕合元件（Charge Coupled Device，CCD)140下方， 使電荷耦合元件140涵蓋範圍包含待檢測區域。電荷耦合元件 140之檢測框120所拍攝之圖案如第2圖所示，利用灰階處理 後判斷檢測框120内的異方性導電膜貼附狀況是否良好。 然而上述檢測過程存在下述缺點；第一，檢測框丨為一 定點式的檢測框，當電荷耦合元件140或機台130晃動時，檢 測框120對應至異方性導電膜150會產生偏移，即無法正常包 # 含異方性導電膜150，存在漏檢問題，因而影響檢測判定；第 二，理論上驅動積體電路壓合區域必須涵蓋異方性導電膜 150，由於檢測框120的設定並無基準，無法得知驅動積體電 路壓合區域位置，因此可能造成後續驅動積體電路壓合區域未 涵蓋異方性導電膜15〇，造成漏檢問題。 因此需要對上述問題提出一種解決方法。 【發明内容】 • 本發明之一目的在於提供一種廢材以及積體電路之檢測 方法，能夠檢測膠材之貼附狀況及積體電路是否有破損 況。 、月201104772 VI. Description of the Invention: [Technical Field] The present invention relates to a method for detecting a glue material and an integrated circuit, and more particularly to a method for detecting the adhesion state of a glue material and the damage condition of an integrated circuit. [Prior Art] In the liquid crystal display panel, the integrated circuit (1C) is driven to output a desired voltage to a pixel (Pixel) to control the twisting degree of the liquid crystal molecules. Therefore, whether the integrated integrated circuit and other circuits in the liquid crystal display panel can have a good electrical connection will affect the liquid crystal display panel. At present, in the process of liquid crystal display panel, the commonly used driving integrated circuit packaging technology is Chip On Glass (COG). The glass flip chip is to directly mount the driving integrated circuit on the glass substrate, and the liquid crystal display panel is compared with the early mounting of the integrated circuit on the printed circuit board (PCB) and then electrically connected to the glass substrate. The advantages of thinner weight, reduced material use and lower cost are therefore the main driving integrated circuit mounting technology. In the glass flip chip packaging technology, the integrated circuit is electrically connected to the glass substrate through an anisotropic conductive film (ACF) in a vertical direction. The glass flip-chip process is roughly as follows: an anisotropic conductive film is attached. On the glass substrate, the driving stack circuit is pre-compressed on the anisotropic conductive film and the driving integrated circuit is subjected to the present pressing. Referring to Fig. 1 and Fig. 2, a schematic diagram of detecting the attachment state of the anisotropic conductive film 150 in the prior art is shown. The conventional detection method is performed after the anisotropic conductive film 150 is attached to the glass substrate 110. The adhesion of the anisotropic conductive film 150 is determined by the Gray-Level pattern in the detection frame 120. ' Condition. First, the glass substrate 110 is placed on the machine table 130. The machine 13 接着 is then moved under the Charge Coupled Device (CCD) 140 such that the charge coupled element 140 covers the area to be detected. As shown in Fig. 2, the pattern captured by the detection frame 120 of the charge coupled device 140 determines whether the adhesion of the anisotropic conductive film in the detection frame 120 is good by the gray scale processing. However, the above detection process has the following disadvantages. First, the detection frame is a fixed-point detection frame. When the charge-coupled element 140 or the machine 130 is shaken, the detection frame 120 is offset to the anisotropic conductive film 150. , that is, the package can not be normal #, the anisotropic conductive film 150, there is a problem of missing detection, thus affecting the detection determination; second, theoretically driving the integrated circuit nip area must cover the anisotropic conductive film 150, due to the detection frame 120 There is no reference in the setting, and it is impossible to know the position of the nip area of the driving integrated circuit. Therefore, the kinetic area of the subsequent driving integrated circuit may not cover the anisotropic conductive film 15 〇, causing a problem of missing detection. Therefore, it is necessary to propose a solution to the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for detecting a waste material and an integrated circuit, which can detect the adhesion state of the glue material and whether the integrated circuit is damaged. ,month
㈣本發明之膠材以及龍電路之制方法，包含以 驟： V ⑴疋義-第-基準框’其包含積體電路相對的部份第 緣以及部份第二邊緣、連接S部份第—邊緣以及部份第二邊 之間的第三邊緣和第-基準框之—邊緣所園成具有部份積體 電路的第-區域，以及鄰接區域的部份第—邊緣、部份 第一邊緣和第三邊緣之第二區域； 201104772 (2)儲存第—基準框内之灰階圖案； ()疋義第檢測框，其中第一檢測框對應於積體電路的 伤第一邊緣、部份第二邊緣以及第三邊緣；以及 (4) 檢測第—檢測框内之灰階圖案是否與第—基準框内之 灰階圖案相符合，主丨μ _ Α 才口判斷積體電路以及膠材的貼附狀況。 .本發明之一實施例中，當積體電路以及膠材貼附正常時， 該檢測方法更包含： (5) 藉由檢測第—檢測框内之灰階圖案對應於第—區域之 積體電路之邊緣判斷該積體電路是否破損。 本發明之又-實施例中，該檢測方法更包含： ⑹疋義-第二基準框相對於第—基準框，第二基準框中包 含積體電路相對的另一部份第一邊緣以及另一部份第二邊 緣、連接於另一部份第一邊緣以及另一部份第二邊緣之間的第 四邊緣和第一基準框之一邊緣所圍成且具有另一部份積體電 $以及鄰接於第三區域的另一部份第一邊緣、另一部份第二 邊緣和第四邊緣之第四區域； (7)儲存第二基準框内之灰階圖案； ⑻疋義—第二檢測框’其中第二檢測框對應於積體電路的 部份第-邊緣、另-部份第二邊緣以及第四邊緣； ⑼檢測第二檢測框内之灰階圖案是否與第二基準框内之 又階圖案相，合，判斷積體電路以及膠材的貼附狀況；以及 (10)計算第一檢測框内之灰階圖案對應於第一區域之第三 楚、、:中〜’以及第二檢測框内之灰階圖案對應於第三區域之 第四邊緣的中心’以作為定位基準。 = ㈣術相比’具有下述優點：⑴第—檢測框及 第一檢測框的定義可為動態式，不會受電荷叙合元件或機台晃 201104772 動影響；（2)由妓義的第—基準框及第二基準框包含積體電路 邊緣’因此能藉由第-檢測框及第二檢畴之灰階圖案判斷積 體電路壓合區域是否包含膠材；（3)第—區域之邊緣包含積體電 路的邊緣，因此可檢測出積體電路的邊緣是否有破損的情況發 生’以及（4)藉由„·}·异積體電路兩相對的邊緣中心後，兩邊緣中 心可作為後續本壓定位標示（Mark)，能省略設計本壓定位標示 的步驟，簡化玻璃覆晶製程的流程。 φ 【實施方式】 以下將參照所附圖式詳細說明本發明之技術内容。 請同時參閲第3圖以及第4圖，第3圖係繪示依據本發明 第一實施例之膠材400以及積體電路45〇之檢測方法之流程 圖，第4圖係繪示依據本發明第一實施例之膠材4〇〇以及積體 電路450之間壓合狀況是否良好之檢測方法之示意圖。本發明 之夥材以及積體電路之檢測方法是在積體電路45〇預壓在膠材 400上再開始進行檢測，以下將詳述該檢測方法之各步驟。 • 步驟（1)中，定義一第一基準框402,作為後續判斷的標準， 第一基準框402中包含由積體電路450相對的部份第一邊緣 452以及部份第二邊緣454、連接於部份第一邊緣452以及部 份第二邊緣454之間的第三邊緣456和第一基準框4〇2之一邊 緣472所圍成具有部份積體電路450的第一區域458，以及鄰 接於第一區域458的部份第一邊緣452、部份第二邊緣454和 第三邊緣456之第二區域460，即，第一基準框4〇2包含第一 區域458以及第二區域460,且第二區域460位於第一區域458 外側。其中第一區域458及第二區域460各具有不同的灰度， 即積體電路450及膠材400各具有不同的灰度。此外，第一基 201104772 ' 準框402之大小能視檢測需要調整。 步驟（2)中，儲存第一基準框402内之灰階圖案，由於第一 區域458及第二區域460各具有不同的灰度，因此儲存的灰階 圖案包含第一區域458之灰階圖案及第二區域460之灰階圖 案。 步驟（3)中，定義一第一檢測框404，其小於或等於第一基 準框402，且該第一檢測框404對應於積體電路450的部份第 一邊緣452、部份第二邊緣454以及連接於兩者之間的第三邊 φ 緣456。由於實際檢測時，是以一影像擷取裝置（未圖示）例如電 荷竊合元件拍攝玻璃基板（未圖示），即使在機臺和電荷搞合元 件晃動時，該第一檢測框404仍可動態調整以對應於積體電路 450的部份第一邊緣452、部份第二邊緣454以及連接於兩者 之間的第三邊緣456的位置，進而提高檢測之準確度。 步驟（4)中，檢測第一檢測框404内之灰階圖案是否與第一 基準框402内之灰階圖案相符合，判斷積體電路450以及膠材 400的貼附狀況。由於第一基準框402儲存的灰階圖案可被視 φ 為正常的貼附範例，因此當第一檢測框404的灰階圖案與第一 基準框402的灰階圖案相同時，代表膠材400與積體電路450 的貼附正常。 請參閱第5圖，係繪示膠材400短貼情況的示意圖。當膠 材400短貼時，即積體電路450之周圍未被膠材400環繞時， 第一檢測框404的灰階圖案與第4圖之第一基準框402的灰階 圖案不同，因此可判斷出膠材400與積體電路450的貼附不正 常0 請參閱第6圖，係繪示積體電路450破損的示意圖。當積 體電路450以及膠材400貼附正常時，本發明之檢測方法更包 201104772 含： 步驟（）中藉由檢測第一檢測框4〇4内之灰階圖案對應於 第一區域458之積體雷^ 電路450之邊緣判斷積體電路450是否破 K第6圖中可知積體電路450之部份第—邊緣452有不平 整的it況箱第—邊緣454及第三邊緣伙則為平整的情 =因此檢測時’可藉由第一檢測框4〇4之灰階圖案檢測出部 伤邊緣452不平整’代表積體電路450有破損的情況。 -月同時參閱第7圖至第9圖，第7圖以及第8圖係綠示依 #據本發明第二實施例之勝材4〇〇以及積體電路45〇之檢測方法 之流程®，^ 9圖騎核據本發明帛二實施狀膠材400以 及積體電路450之間壓合狀況是否良好之檢測方法之示意圖。 該檢測方法包含下述步驟。 , 步驟⑴中，定義一第一基準框402 ★作為後讀判斷的標準， 第一基準框402中包含積體電路450相對的部份第一邊緣452 以及部份第二邊緣454、連接於部份第一邊緣祝以及部份第 二邊緣454之間的第三邊緣456和第一基準框4〇2之一邊緣ο] 擊所圍成具有部份積體電路45〇的第一區域⑽，以及鄰接於第 一區域458的部份第一邊緣452、部份第二邊緣—和第三邊 緣456之第二區域46〇，其中第_區域㈣及第二區域4⑼各 具有不同的灰度，即積體電路45〇及膠材4〇〇各具有不同的灰 。步騾（2)中，儲存第一基準框4〇2内之灰階圖案，由於第一 區域458及第二區域46〇各具有不同的灰度，因此儲存的灰階 圖案包含第-區域458之灰階圖案及第二區域46。之灰 案。 步驟（3)中，定義一第一檢測框4〇4，其小於或等於第一基 201104772 準框402，且該第—檢測框4〇4對應於積體電路45〇的部份第 邊緣452、部份第二邊緣以及連接於兩者之間的第三邊 緣 456 〇 步驟（4)中，檢測第一檢測框4〇4内之灰階圖案是否與第— 基準框402内之灰階圖案相符合，判斷積體電路45〇以及膠材 400的貼附狀況’例如，可藉由計算機通過一圖案識別軟體， 檢測第一檢測框404内之灰階圖案是否與第一基準框4〇2内之 灰階圖案相符合。由於第一基準框4〇2儲存的灰階圖案可被視 • 為正常的貼附範例，因此當第一檢測框_4〇4的灰階圖案與第一 基準框402的灰階圖案相同時，代表膠材4〇〇與積體電路45〇 的貼附正常。 步驟（6)中，定義一第二基準框412，與第一基準框4〇2同 樣作為後續判斷的標準，第二基準框412相對於第一基準框4〇2 且包含由積體電路450相對的另一部份第一邊緣462以及另一 邛fzj第一邊緣464、連接於另一部份第一邊緣462以及另一部 份第二邊緣464之間的第四邊緣466和第二基準框412之一邊 # 緣474所圍成具有另一部份積體電路450的第三區域468，以 及鄰接第二區域468的另一部份第一邊緣462、另一部份第二 邊緣464和第四邊緣466之第四區域47〇，其中第三區域468 及第四區域470各具有不同的灰度，即積體電路450及膠材400 具有不同的灰度》 步驟（7)中’儲存第二基準框412内之灰階圖案，由於第三 區域468及第四區域47〇各具有不同的灰度，因此儲存的灰階 圖案包含第三區域468之灰階圖案及第四區域47〇之灰階圖 案。 步驟（8)中，定義一第二檢測框414，其小於或等於第二基 201104772 準框412 ’且該第二檢測框414對應於積體電路的另一部 份第一邊緣462、另一部份第二邊緣464以及連接於兩者之間 的第四邊緣466。 步驟（9)中，檢測第二檢測框4丨4内之灰階圖案是否與第二 基準框412内之灰階圖案相符合，例如，可藉由計算機通過一 圖案識別軟體，檢測第二檢測框414内之灰階圖案是否與第二 基準框412内之灰階圖案相符合，判斷積體電路45〇以及膠材 400的貼附狀況。由於第二基準框412儲存的灰階圖案可被視 • 為正常的貼附範例，因此當第二檢測框414的灰階圖案與第二 基準框412的灰階圖案相同時，代表膠材4〇〇與積體電路45〇 的貼附正常。 步驟（10)中，計算第一檢測框4〇4内之灰階圖案對應於第 一區域458之第三邊緣456的中心，以及第二檢測框4丨4内之 灰階圖案對應於第三區域468之第四邊緣466的中心。第三邊 緣456的中心以及第四邊緣466的中心可被視為後續本壓定位 標不，以作為定位基準。藉此，能省略另外設計本壓定位標示 φ 的步驟，簡化玻璃覆晶製程的流程。 要特別說明的是，膠材之一較佳實施例為異方性導電膜， 由於異方性導電膜與積體電路具有不同的灰度，因此能以本發 明之圖案匹配的方法判斷貼附狀況，舉凡其他與積體電路具有 灰度差異之璆材亦可利用本發明達成檢測的目的。 雖然本發明已以實施例揭露如上，然其並非用以限定本發 月任何具有本發明所屬技術領域之通常知識者，在不脫離本 發明之精神和範圍内，當可作各種更動與潤飾，並可思揣其他 不同的實施例’因此本發明之保護範圍當視後附申請專利範圍 所界定者為準。 1 201104772 【圖式簡單說明】 第1圖以及第2圖係繪示習知技術中檢測異方性導電膜貼 附狀況之示意圖； 第3圖係繪示依據本發明第一實施例之膠材以及積體電路 之檢測方法之流程圖； 第4圖係繪示依據本發明第一實施例之膠材以及積體電路 之間壓合狀況是否良好之檢測方法之示意圖； 第5圖係繪示膠材短貼情況的示意圖； 第6圖係繪示積體電路破損的示意圖； 第7圖以及第8圖係繪示依據本發明第二實施例之膠材以 及積體電路之檢測方法之流程圖；以及 第9圖係繪示依據本發明第-管 乐—貫施例之膠材以及積體電路 之間壓合狀況是否良好之檢測方法之示意圖。 【主要元件符號說明】 1-1〇 步驟 110 120 檢測框 130 140 電荷耦合元件 150 400 膠材 402 404 第一檢測框 412 414 第二檢測框 450 452 部份第一邊緣 454 456 第三邊緣 458 460 第二區域 462 464 另一部份第二邊緣 466(4) The method for manufacturing the rubber material and the dragon circuit of the present invention comprises the following steps: V (1) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - the third edge between the edge and the second side and the edge of the first reference frame are formed into a first region having a partial integrated circuit, and a portion of the adjacent region is edge-part, first portion a second region of the edge and the third edge; 201104772 (2) storing the grayscale pattern in the first reference frame; () the first detection frame, wherein the first detection frame corresponds to the first edge of the integrated circuit And the fourth edge and the third edge; and (4) detecting whether the gray scale pattern in the first detection frame is consistent with the gray scale pattern in the first reference frame, and the main 丨 μ _ 判断 is used to determine the integrated circuit and the glue The attachment status of the material. In an embodiment of the present invention, when the integrated circuit and the glue are attached normally, the detecting method further comprises: (5) detecting the integrated body corresponding to the first region by detecting the gray scale pattern in the first detecting frame The edge of the circuit determines whether the integrated circuit is broken. In still another embodiment of the present invention, the detecting method further comprises: (6) a second reference frame relative to the first reference frame, the second reference frame including another portion of the first edge of the integrated circuit and the other a portion of the second edge, the fourth edge connected between the other portion of the first edge and the other portion of the second edge, and one edge of the first reference frame are enclosed and have another portion of the body And a fourth portion adjacent to the first portion of the third region, another portion of the second edge, and the fourth edge; (7) storing the gray scale pattern in the second reference frame; (8) 疋 meaning - a second detection frame ′ wherein the second detection frame corresponds to a partial edge of the integrated circuit, another portion of the second edge, and a fourth edge; (9) detecting whether the grayscale pattern in the second detection frame is related to the second reference The second-order pattern in the frame is combined to determine the attachment state of the integrated circuit and the glue; and (10) the gray-scale pattern in the first detection frame is calculated to correspond to the third region of the first region, and: 'and the grayscale pattern in the second detection frame corresponds to the middle of the fourth edge of the third region 'As a positioning reference. = (4) Compared with 'has the following advantages: (1) the first - detection frame and the first detection frame can be defined as dynamic, not affected by the charge rendezvous component or the machine swaying 201104772; (2) by the derogatory The first reference frame and the second reference frame include the integrated circuit edge. Therefore, it is possible to determine whether the integrated circuit nip area contains the glue material by the gray scale pattern of the first detection frame and the second detection domain; (3) the first region The edge of the integrated circuit includes the edge of the integrated circuit, so that it can detect whether the edge of the integrated circuit is damaged or not. And (4) by the opposite edge center of the multiplexed circuit, the center of the two edges can be As a subsequent step of the pressure positioning mark (Mark), the step of designing the pressure positioning mark can be omitted, and the flow of the glass flip chip process can be simplified. φ [Embodiment] The technical contents of the present invention will be described in detail below with reference to the accompanying drawings. Referring to FIG. 3 and FIG. 4, FIG. 3 is a flow chart showing a method for detecting a rubber material 400 and an integrated circuit 45A according to a first embodiment of the present invention, and FIG. 4 is a diagram showing a method according to the present invention. The adhesive material of one embodiment is A schematic diagram of a method for detecting whether the press-fit condition between the integrated circuit 450 and the integrated circuit 450 is good. The method for detecting the battalion and the integrated circuit of the present invention is performed by pre-pressing the integrated circuit 45 在 on the adhesive material 400, and then detecting The steps of the detection method will be described in detail. • In step (1), a first reference frame 402 is defined as a criterion for subsequent determination, and the first reference frame 402 includes a portion of the first edge opposite to the integrated circuit 450. 452 and a portion of the second edge 454, a third edge 456 connected between the portion of the first edge 452 and the portion of the second edge 454, and an edge 472 of the first reference frame 4〇2 are surrounded by a partial product a first region 458 of the body circuit 450, and a portion of the first edge 452 adjacent to the first region 458, a portion of the second edge 454, and a second region 460 of the third edge 456, ie, the first reference frame 4〇2 The first region 458 and the second region 460 are disposed, and the second region 460 is located outside the first region 458. The first region 458 and the second region 460 each have different gray levels, that is, the integrated circuit 450 and the adhesive material 400 Have different gray levels. In addition, the first base 201104772 The size of the quasi-frame 402 can be adjusted according to the detection. In the step (2), the gray scale pattern in the first reference frame 402 is stored, since the first area 458 and the second area 460 each have different gray scales, so the stored The grayscale pattern includes a grayscale pattern of the first region 458 and a grayscale pattern of the second region 460. In the step (3), a first detection frame 404 is defined, which is less than or equal to the first reference frame 402, and the first The detection frame 404 corresponds to a portion of the first edge 452 of the integrated circuit 450, a portion of the second edge 454, and a third edge φ edge 456 connected therebetween. Since the actual detection is an image capturing device (not shown), for example, a charge stealing element photographing a glass substrate (not shown), the first detecting frame 404 can be dynamically adjusted to correspond to the portion of the integrated circuit 450 even when the stage and the charge engaging element are shaken. The first edge 452, the partial second edge 454, and the position of the third edge 456 connected therebetween further improve the accuracy of the detection. In the step (4), it is detected whether the gray scale pattern in the first detection frame 404 matches the gray scale pattern in the first reference frame 402, and the attached state of the integrated circuit 450 and the adhesive material 400 is determined. Since the gray scale pattern stored by the first reference frame 402 can be regarded as a normal attachment example, when the gray scale pattern of the first detection frame 404 is the same as the gray scale pattern of the first reference frame 402, the representative glue 400 is represented. The attachment to the integrated circuit 450 is normal. Please refer to FIG. 5, which is a schematic diagram showing the shortness of the adhesive material 400. When the glue 400 is short-circuited, that is, when the circumference of the integrated circuit 450 is not surrounded by the glue 400, the gray-scale pattern of the first detection frame 404 is different from the gray-scale pattern of the first reference frame 402 of FIG. 4, and thus It is judged that the attachment of the glue material 400 and the integrated circuit 450 is not normal. Referring to Fig. 6, a schematic diagram showing the damage of the integrated circuit 450 is shown. When the integrated circuit 450 and the adhesive material 400 are attached normally, the detection method of the present invention further includes 201104772. The step () detects that the gray scale pattern in the first detection frame 4〇4 corresponds to the first region 458. The edge of the integrated body ^ circuit 450 determines whether the integrated circuit 450 is broken. In the sixth figure, it can be seen that part of the first edge 452 of the integrated circuit 450 has an uneven condition box - the edge 454 and the third edge are The situation of flatness = therefore, the detection of the unevenness of the edge 452 by the gray scale pattern of the first detection frame 4〇4 during the detection means that the integrated circuit 450 is damaged. - month at the same time, referring to FIG. 7 to FIG. 9 , FIG. 7 and FIG. 8 are the flow of the detection method according to the second embodiment of the present invention, and the detection method of the integrated circuit 45〇, Fig. 9 is a schematic view showing a method of detecting whether or not the press-fit condition between the adhesive material 400 and the integrated circuit 450 is good according to the present invention. The detection method comprises the following steps. In the step (1), a first reference frame 402 is defined as a standard for the post-reading determination. The first reference frame 402 includes a portion of the first edge 452 and a portion of the second edge 454 opposite to the integrated circuit 450. a first edge 456 and a third edge 456 between the second edge 454 and one edge of the first reference frame 4〇2 are surrounded by a first region (10) having a partial integrated circuit 45〇, And a portion of the first edge 452 adjacent to the first region 458, a portion of the second edge - and a second region 46 of the third edge 456, wherein the first region (four) and the second region 4 (9) each have a different gray level, That is, the integrated circuit 45 and the adhesive 4 have different ash. In step (2), the gray scale pattern in the first reference frame 4〇2 is stored. Since the first region 458 and the second region 46 have different gray scales, the stored gray scale pattern includes the first region 458. Gray scale pattern and second region 46. Gray case. In step (3), a first detection frame 4〇4 is defined, which is smaller than or equal to the first base 201104772 quasi-frame 402, and the first detection frame 4〇4 corresponds to a partial edge 452 of the integrated circuit 45〇. And detecting a grayscale pattern in the first detection frame 4〇4 and a grayscale pattern in the first reference frame 402 in a step (4), a part of the second edge and a third edge 456 connected between the two edges In accordance with the determination, the integrated circuit 45〇 and the attachment condition of the adhesive material 400 are determined. For example, whether the grayscale pattern in the first detection frame 404 is compared with the first reference frame 4〇2 can be detected by a computer through a pattern recognition software. The grayscale pattern inside matches. Since the grayscale pattern stored in the first reference frame 4〇2 can be regarded as a normal attachment example, when the grayscale pattern of the first detection frame_4〇4 is the same as the grayscale pattern of the first reference frame 402 , on behalf of the glue 4 〇〇 and the integrated circuit 45 〇 attached normally. In the step (6), a second reference frame 412 is defined, which is the same as the first reference frame 4〇2, and the second reference frame 412 is relative to the first reference frame 4〇2 and includes the integrated circuit 450. The opposite portion of the first edge 462 and the other 邛fzj first edge 464, the fourth edge 466 and the second reference between the other portion of the first edge 462 and the other portion of the second edge 464 A side edge 474 of the frame 412 encloses a third region 468 having another partial integrated circuit 450, and another portion of the first edge 462 adjacent the second region 468, another portion of the second edge 464, and The fourth region 47 of the fourth edge 466, wherein the third region 468 and the fourth region 470 each have different gray levels, that is, the integrated circuit 450 and the glue 400 have different gray levels. The gray scale pattern in the second reference frame 412, since the third region 468 and the fourth region 47 each have different gray scales, the stored gray scale pattern includes the gray scale pattern of the third region 468 and the fourth region 47〇 Grayscale pattern. In step (8), a second detection block 414 is defined, which is smaller than or equal to the second base 201104772 quasi-frame 412' and the second detection frame 414 corresponds to another part of the integrated circuit first edge 462, another A portion of the second edge 464 and a fourth edge 466 coupled therebetween. In step (9), it is detected whether the gray scale pattern in the second detection frame 4丨4 matches the gray scale pattern in the second reference frame 412. For example, the second detection may be detected by a computer through a pattern recognition software. Whether the gray scale pattern in the frame 414 matches the gray scale pattern in the second reference frame 412 determines the attachment state of the integrated circuit 45A and the glue 400. Since the gray scale pattern stored by the second reference frame 412 can be regarded as a normal attachment example, when the gray scale pattern of the second detection frame 414 is the same as the gray scale pattern of the second reference frame 412, the representative glue 4 is The attachment of the 〇〇 and the integrated circuit 45〇 is normal. In step (10), the grayscale pattern in the first detection frame 4〇4 is calculated to correspond to the center of the third edge 456 of the first region 458, and the grayscale pattern in the second detection frame 4丨4 corresponds to the third The center of the fourth edge 466 of the region 468. The center of the third edge 456 and the center of the fourth edge 466 can be considered as subsequent positioning targets as a positioning reference. Thereby, the step of additionally designing the pressure positioning mark φ can be omitted, and the flow of the glass flip chip process can be simplified. It should be particularly noted that one preferred embodiment of the rubber material is an anisotropic conductive film. Since the anisotropic conductive film and the integrated circuit have different gradations, the pattern matching method of the present invention can be used to judge the attachment. In the case, other materials having a gray scale difference from the integrated circuit can also be used for the purpose of detection by the present invention. The present invention has been disclosed in the above embodiments, and it is not intended to limit the scope of the present invention, and it is possible to make various changes and modifications without departing from the spirit and scope of the invention. It is to be understood that the scope of the invention is defined by the scope of the appended claims. 1 201104772 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 are schematic views showing the detection of the attachment state of the anisotropic conductive film in the prior art; FIG. 3 is a view showing the rubber material according to the first embodiment of the present invention. And a flow chart of the method for detecting the integrated circuit; FIG. 4 is a schematic view showing a method for detecting whether the press-fit condition between the glue material and the integrated circuit is good according to the first embodiment of the present invention; FIG. 6 is a schematic view showing the damage of the integrated circuit; FIG. 7 and FIG. 8 are diagrams showing the flow of the detection method of the rubber material and the integrated circuit according to the second embodiment of the present invention; Fig. 9 and Fig. 9 are schematic views showing a method of detecting whether the press-fit condition between the glue material and the integrated circuit according to the first embodiment of the present invention is good. [Description of main component symbols] 1-1〇Step 110 120 Detection frame 130 140 Charge coupled component 150 400 Adhesive 402 404 First detection frame 412 414 Second detection frame 450 452 Partial first edge 454 456 Third edge 458 460 Second region 462 464 another portion second edge 466
玻璃基板 機台 異方姓導電膜 第一基準框 第二基準框 積體電路 部份第二邊緣 第一區域 另一部份第一邊緣 第四邊緣 201104772 第四區域 468 第三區域 470 472、474 邊緣Glass substrate machine heterosexual film first reference frame second reference frame integrated circuit portion second edge first region other portion first edge fourth edge 201104772 fourth region 468 third region 470 472, 474 edge
1212