[go: up one dir, main page]

TWI498546B - Defect inspection device and defect inspection method - Google Patents

Defect inspection device and defect inspection method Download PDF

Info

Publication number
TWI498546B
TWI498546B TW103100583A TW103100583A TWI498546B TW I498546 B TWI498546 B TW I498546B TW 103100583 A TW103100583 A TW 103100583A TW 103100583 A TW103100583 A TW 103100583A TW I498546 B TWI498546 B TW I498546B
Authority
TW
Taiwan
Prior art keywords
light
defect
inspected
transmitted
intensity
Prior art date
Application number
TW103100583A
Other languages
Chinese (zh)
Other versions
TW201435331A (en
Inventor
Koichi Ekawa
Masahiro Nakata
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW201435331A publication Critical patent/TW201435331A/en
Application granted granted Critical
Publication of TWI498546B publication Critical patent/TWI498546B/en

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Description

缺陷檢查裝置及缺陷檢查方法Defect inspection device and defect inspection method

本發明係有關於檢查被檢查物之內層缺陷的裝置及方法。The present invention relates to an apparatus and method for inspecting an inner layer defect of an object to be inspected.

已知一種對薄片狀物品照射光,再根據藉由相機接收其透過光或反射光所得之影像進行影像處理而檢測出缺陷之技術。在此,在被檢查物是液晶顯示器所使用之偏光薄膜(光學薄膜)等的情況,希望判別缺陷是存在於表面或存在於內層。這是因為偏光薄膜等係在表面黏貼保護片之狀態受檢查,因為最後會剝下保護片,所以即使表面具有缺陷,亦不成問題的緣故。A technique for detecting a defect by irradiating light to a sheet-like article and performing image processing based on an image obtained by receiving a transmitted light or reflected light by a camera is known. Here, in the case where the object to be inspected is a polarizing film (optical film) used in a liquid crystal display or the like, it is desirable to discriminate that the defect exists on the surface or exists in the inner layer. This is because the polarizing film or the like is inspected in a state in which the surface is adhered to the protective sheet, because the protective sheet is peeled off at the end, so that even if the surface has defects, it is not a problem.

專利文獻1記載有:在表層與內層錯開焦點位置後拍攝,再根據這些複數個影像,區別表面缺陷與內層缺陷。可是,需要在表層位置與內層位置進行複數次攝影,而具有檢查費時的問題。又,需要將焦點對準各個位置的機構,導致成本上揚。又,因為在焦點位置進行判別,所以焦點位置精度很重要,因而需要抑制被檢查物之位置變動,造成用以抑制位置變動之工作台成本上揚,而且為了抑制位置變動,需要使被檢查物靜止致使檢查週期變長。Patent Document 1 describes that a surface layer and an inner layer are shifted from a focus position, and then a surface defect and an inner layer defect are distinguished based on the plurality of images. However, it is necessary to perform a plurality of photographs at the surface position and the inner layer position, and it has a problem that the inspection takes time. Also, it is necessary to focus on the mechanism at each position, resulting in an increase in cost. Further, since the focus position is determined at the focus position, the accuracy of the focus position is important. Therefore, it is necessary to suppress the positional variation of the inspection object, thereby increasing the cost of the table for suppressing the positional change, and it is necessary to make the inspection object stationary in order to suppress the positional fluctuation. This causes the inspection cycle to become longer.

專利文獻2記載:根據在照射同軸照明下所 拍攝之影像、與在照射擴散照明下所拍攝之影像,區別表面缺陷與內層缺陷。可是,因為需要使照明系統滑動並拍攝2次,所以具有檢查費時的問題。且需要使照明滑動的機構而導致成本上揚。而且,因為要驅動如照明那樣的大型構件,故需維修驅動部。Patent Document 2 describes: according to illumination under coaxial illumination The image taken and the image taken under the illumination of the diffuse illumination distinguish the surface defect from the inner layer defect. However, since it is necessary to slide the illumination system and shoot twice, there is a problem that the inspection takes time. There is also a need for a mechanism that slides the illumination, resulting in an increase in cost. Moreover, since a large member such as illumination is to be driven, the drive unit needs to be repaired.

先行專利文獻Leading patent literature 專利文獻Patent literature

專利文獻1 日本國特開2005-98970號公報Patent Document 1 Japanese Patent Laid-Open Publication No. 2005-98970

專利文獻2 日本國特開2001-108639號公報Patent Document 2 Japanese Patent Laid-Open Publication No. 2001-108639

本發明係有鑑於上述的問題點而完成者,其目的在於低成本且高速進行可判別表面缺陷與內層缺陷之檢查。The present invention has been made in view of the above problems, and an object thereof is to perform inspection for discriminating surface defects and inner layer defects at low cost and at high speed.

為解決上述課題,本發明之一形態的缺陷檢查裝置係檢查薄片狀之被檢查物之缺陷的缺陷檢查裝置,該裝置係包括:第1照射手段,係對該被檢查物照射第1光;第2照射手段,係對該被檢查物照射第2光;攝影手段,係取得因應於該第1光之反射光及該第2光之透過光之強度的攝影資料;及檢測手段,係根據藉該攝影手段所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷;以 該攝影手段之拍攝該第2光之間接透過光的方式配置該攝影手段與該第2照射手段。In order to solve the above problems, a defect inspection device according to an aspect of the present invention is a defect inspection device for inspecting a defect of a sheet-like object to be inspected, the device comprising: a first irradiation means for irradiating the object to be inspected with the first light; The second illuminating means irradiates the object with the second light; and the photographic means obtains photographic data corresponding to the intensity of the reflected light of the first light and the transmitted light of the second light; and the detecting means is based on Detecting the inner layer defects of the object to be inspected by the intensity of the reflected light and the transmitted light at the same position of the object to be inspected by the photographing means; The photographing means and the second irradiation means are disposed such that the second light is transmitted between the photographing means.

即,第2照射手段與攝影手段之位置關係係 以作成從第2照射手段所照射之光的正透過光不會射入攝影手段,而間接透過光會射入攝影手段的位置關係較佳。間接透過光係指依存在於被檢查物之缺陷反射或散射而偏離正透過方向之透過光。藉此,可實現缺陷之暗視野攝影,而動態範圍提高。在此情況係檢測出已透過內層缺陷之間接透過光比已透過表面缺陷之間接透過光更強。That is, the positional relationship between the second irradiation means and the photographing means is It is preferable that the positive transmitted light which is the light irradiated from the second irradiation means is not incident on the photographing means, and the indirect transmitted light is incident on the photographing means. The indirect transmitted light refers to transmitted light that deviates from the positive transmission direction by reflection or scattering of defects existing in the object to be inspected. Thereby, dark field photography of defects can be realized, and the dynamic range is improved. In this case, it is detected that the transmitted light passing through the inner layer defect is stronger than the transmitted light through the transmitted surface defect.

藉由採用如上述的構成,可根據因應於反射 光強度之攝影資料與因應於間接透過光強度之攝影資料,判別內層缺陷。即,得知在被檢測出反射光或間接透過光強的部分有某種缺陷存在,對於相同的缺陷,若間接透過光強度比反射光強度更大,可判別該缺陷係內層缺陷。By adopting the composition as described above, it is possible to respond to reflection Photographic data of light intensity and photographic data in response to indirect transmitted light intensity are used to discriminate internal defects. That is, it is known that there is a certain defect in the portion where the reflected light or the indirectly transmitted light intensity is detected, and if the indirect transmitted light intensity is larger than the reflected light intensity for the same defect, the defect inner layer defect can be discriminated.

如同上述,在拍攝第2光之間接透過光的情 況,使第2光的波長變短較佳。波長愈短的光,在缺陷之散射效果愈大,因此,已透過缺陷之透過光強度會提高。此外,第2光係波長愈短,散射效果愈大,但是若考慮光源及受光元件之易取得性,使用藍光(波長450nm附近)較佳。As mentioned above, the second light is transmitted between the second light. In other words, it is preferable to shorten the wavelength of the second light. The shorter the wavelength, the greater the scattering effect of the defect, and therefore the transmitted light intensity of the transmitted defect increases. Further, the shorter the wavelength of the second light system, the larger the scattering effect, but it is preferable to use blue light (near the wavelength of 450 nm) in consideration of the ease of obtaining the light source and the light receiving element.

本發明其他形態的缺陷檢查裝置係一種檢查 薄片狀之被檢查物之缺陷的缺陷檢查裝置,該裝置係包含:第1照射手段,係對該被檢查物照射第1光;第2 照射手段,係對該被檢查物照射第2光;攝影手段,係取得因應於該第1光之反射光及該第2光之透過光之強度的攝影資料;及檢測手段,係根據藉該攝影手段所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷;以該攝影手段可拍攝該第2光之正透過光的方式配置該攝影手段與該第2照射手段;在該第2照射手段與該被檢查物之間、及該攝影手段與該第2照射手段之間,分別設置透過軸彼此正交之偏光濾光器。Another aspect of the defect inspection device of the present invention is an inspection A defect inspection device for a defect of a sheet-like object to be inspected, the device comprising: a first irradiation means for irradiating the object with the first light; The illuminating means irradiates the object with the second light; and the photographic means obtains photographic data corresponding to the intensity of the reflected light of the first light and the transmitted light of the second light; and the detecting means The intensity of the reflected light and the transmitted light at the same position of the object to be inspected by the photographing means detects the inner layer defect of the object to be inspected; and the photographing means can capture the positive transmitted light of the second light Disposing the imaging means and the second irradiation means; and providing polarization polarization orthogonal to each other between the second irradiation means and the inspection object and between the imaging means and the second irradiation means Device.

依此方式,第2照射手段與攝影手段之位置 關係亦是以作成從第2照射手段所照射之光的正透過光射入攝影手段較佳。即,亦可作成攝影手段拍攝在被檢查物內不會散射而直線前進之透過光的構成。在此情況,係將透過軸彼此正交之偏光濾光器分別設置於第2照射手段與被檢查物之間、及攝影手段與被檢查物之間。通過被檢查物內之無缺陷部分的光會被偏光濾光器所遮斷,相對地,因為通過缺陷部分的光會在通過缺陷部分時在偏光發生散射,所以通過偏光濾光器並射入攝影手段。根據這種構成,亦可實現缺陷之暗視野攝影。 且會檢測出已通過內層缺陷之正透過光比已通過表面缺陷之正透過光更強。In this way, the position of the second illumination means and the photographing means The relationship is also preferably a positive transmission light incident imaging means for producing light irradiated from the second irradiation means. In other words, it is also possible to form a configuration in which the transmitted light that does not scatter in the object to be inspected and that advances linearly can be imaged. In this case, the polarizing filters whose transmission axes are orthogonal to each other are provided between the second irradiation means and the inspection object, and between the imaging means and the inspection object. The light passing through the defect-free portion in the object to be inspected is blocked by the polarizing filter. In contrast, since the light passing through the defective portion is scattered in the polarized light when passing through the defective portion, it passes through the polarizing filter and is incident. Means of photography. According to this configuration, dark field photography of defects can also be realized. It is also detected that the positive transmitted light that has passed through the inner layer defect is stronger than the positive transmitted light that has passed through the surface defect.

藉由採用如上述的構成,可根據因應於來自 第1照射手段之反射光強度的攝影資料、與因應於正透過光強度的攝影資料,檢測出內層缺陷。即,得知在被檢測出反射光或正透過光強的部分存在某種缺陷,對於 相同之缺陷,若正反射光強度比反射光強度更大,可判別該缺陷係內層缺陷。By adopting the composition as described above, it can be based on The photographic data of the reflected light intensity of the first irradiation means and the photographic data corresponding to the intensity of the positive transmitted light are detected. That is, it is known that there is a certain defect in the portion where the reflected light or the transmitted light intensity is detected, For the same defect, if the intensity of the specular reflected light is greater than the intensity of the reflected light, the defect of the inner layer of the defect can be discriminated.

此外,缺陷包含異物、孔、皺紋、斑駁、瑕疵等。表面缺陷係存在於被檢查物之表面附近的缺陷,在被檢查物具有多層構造的情況係存在於最外側層的缺陷。內層缺陷係存在於被檢查物之內部的缺陷,在被檢查物具有多層構造的情況係存在於最外側層以外的缺陷。但,被檢查物係未必要具有多層構造。在被檢查物不具有多層構造的情況,位在自表面起算既定距離以內的缺陷屬於表面缺陷,而位在比其更內部的缺陷屬於內層缺陷。In addition, the defects include foreign matter, pores, wrinkles, mottles, mites, and the like. The surface defect is a defect existing in the vicinity of the surface of the test object, and in the case where the test object has a multilayer structure, it is a defect existing in the outermost layer. The inner layer defect is a defect existing inside the test object, and when the test object has a multilayer structure, it is a defect existing outside the outermost layer. However, it is not necessary for the object to be inspected to have a multilayer structure. In the case where the object to be inspected does not have a multi-layered structure, the defect located within a predetermined distance from the surface belongs to the surface defect, and the defect located further inside is the inner layer defect.

在本發明,藉由作成同時測量第1光在被檢查物所反射的反射光、與第2光透過被檢查物後之透過光的構成,可使檢查高速化。為了同時測量,在攝影手段方面,有採用2台相機之方法與採用1台相機之方法。在使用2台相機同時測量的情況,以將第1光之照射位置與第2光之照射位置設為不同位置較佳。在此情況,需要在缺陷檢查裝置設置進行關於反射光之攝影資料與關於透過光之攝影資料之位置對準位置對準的手段。在使用1台相機同時測量反射光與透過光的情況,使第1光與第2光之顏色(波長)相異,並以彩色相機拍攝較佳。因為任一種情況都不需要使照射手段等移動,所以可進行高速的檢查,而且裝置的構成變得簡易,而可抑制製造成本或維修成本。In the present invention, it is possible to increase the speed of the inspection by simultaneously measuring the configuration of the reflected light reflected by the first light in the test object and the transmitted light after the second light is transmitted through the test object. In order to measure at the same time, there are two methods of using a camera and a method of using one camera. In the case of simultaneously measuring with two cameras, it is preferable to set the irradiation position of the first light and the irradiation position of the second light to different positions. In this case, it is necessary to provide means for aligning the positional alignment of the photographic material of the reflected light with the photographic material of the transmitted light at the defect inspection device. When the reflected light and the transmitted light are simultaneously measured using one camera, the colors (wavelengths) of the first light and the second light are different, and it is preferable to take a color camera. Since it is not necessary to move the irradiation means or the like in either case, high-speed inspection can be performed, and the configuration of the apparatus can be simplified, and the manufacturing cost or the maintenance cost can be suppressed.

在採用1台相機作為攝影手段的情況,作成 第1照射手段係從被檢查物之一側照射光,第2照射手段係從被檢查物之另一側照射光,攝影手段係從該一側拍攝第1光之反射光與第2光之透過光。另一方面,在採用2台相機作為攝影手段的情況,亦可作成第1及第2照射手段從被檢查物之相同側照射光,並將拍攝第1光之反射光的第1攝影手段、及拍攝第2光之透過光(間接透過光或正透過光)的第2攝影手段分別配置於被檢查物之不同側。不過,即使是採用2台相機的情況,亦可作成將第1及第2照射手段配置於不同側,並將第1及第2攝影手段配置於相同側。In the case of using one camera as a means of photography, The first irradiation means irradiates light from one side of the inspection object, and the second irradiation means irradiates light from the other side of the inspection object, and the photographing means takes the reflected light of the first light and the second light from the side. Through the light. On the other hand, in the case where two cameras are used as the photographing means, the first photographing means for irradiating light from the same side of the object to be inspected by the first and second irradiation means, and for taking the reflected light of the first light, And the second imaging means for capturing the transmitted light of the second light (indirect transmitted light or positive transmitted light) is disposed on a different side of the object to be inspected. However, even in the case of using two cameras, the first and second irradiation means may be disposed on different sides, and the first and second imaging means may be disposed on the same side.

藉第1照射手段之第1光的照射位置與藉第 2照射手段之第2光的照射位置係亦可相同,亦可不同。Irradiation position and borrowing of the first light by the first irradiation means The irradiation position of the second light of the two irradiation means may be the same or different.

在照射位置不同的情況,只要使用拍攝各個 照射位置的2台相機即可。在此情況,更設置進行關於第1光之反射光的攝影資料、與關於第2光之透過光的攝影資料之位置對準的位置對準手段,並根據位置對準後的2個攝影資料,檢測出內層缺陷。In the case of different irradiation positions, as long as the use of shooting each Just 2 cameras in the irradiation position. In this case, a positioning means for aligning the image data of the reflected light of the first light with the position of the image data of the transmitted light of the second light is provided, and the two photographic materials after the alignment are arranged. , detection of inner defects.

另一方面,在將第1光與第2光之照射位置 設為相同的情況,使各個光之顏色(波長)不同。例如,可從紅光(波長650nm附近)、綠光(波長550nm附近)、藍光(波長450nm附近)之中選擇任一種光。在此,在是拍攝來自第2照射手段之間接透過光之構成的情況,因為第2照射手段如上述以採用藍光較佳,所以第1照射手段採用紅光或綠光即可。此外,在將第1光與第2光 之照射位置設為相同的情況,攝影手段可為具備接收各個光之複數個線狀之受光元件的一台彩色相機。又,攝影手段亦可以是具有對所射入之光進行分光的分光元件、與分別取得分光後之光強度之複數個受光元件的一台彩色相機。此外,在採用複數個線狀之受光元件的情況,因為攝影位置不同,所以需進行位置對準,相對地,在分光後進行受光的情況,因為攝影位置一致,所以無需進行位置對準。On the other hand, the irradiation position of the first light and the second light When the same is true, the color (wavelength) of each light is different. For example, any one of light can be selected from red light (near wavelength 650 nm), green light (near wavelength 550 nm), and blue light (near wavelength 450 nm). Here, in the case where the configuration of the transmitted light from the second irradiation means is taken, the second irradiation means is preferably blue light as described above, and therefore the first irradiation means may be red light or green light. In addition, the first light and the second light The irradiation means may be the same. The photographing means may be a color camera having a plurality of linear light receiving elements that receive the respective lights. Further, the photographing means may be a color camera having a spectroscopic element that splits the incident light and a plurality of light receiving elements that respectively obtain the light intensity after the splitting. Further, in the case where a plurality of linear light-receiving elements are used, since the photographing positions are different, it is necessary to perform alignment, and relatively, after receiving light, the light is received. Since the photographing positions are identical, it is not necessary to perform alignment.

此外,本發明係可理解為具有該手段的至少 一部分的缺陷檢查裝置。又,本發明係亦可理解為具有該處理的至少一部分的缺陷檢查方法,或用以實現該方法的程式。該手段及處理各個彼此可能的組合可構成本發明。Furthermore, the invention is understood to have at least the means Part of the defect inspection device. Furthermore, the invention is also to be understood as a defect inspection method having at least a portion of the process, or a program for implementing the method. This means and the processing of each possible combination of each other may constitute the invention.

作為本發明之一形態的缺陷檢查方法係一種 檢查薄片狀之被檢查物之缺陷的缺陷檢查方法,該方法係包含:照射步驟,係對該被檢查物照射第1光及第2光;攝影步驟,係取得因應於該第1光之反射光及該第2光之透過光之強度的攝影資料;及檢測步驟,係根據藉該攝影步驟所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷;在該攝影步驟,拍攝該第2光之間接透過光。A defect inspection method which is one embodiment of the present invention is a A defect inspection method for inspecting defects of a sheet-like test object, the method comprising: an irradiation step of irradiating the first light and the second light to the test object; and a photographing step of obtaining a reflection corresponding to the first light The photographic data of the intensity of the light and the transmitted light of the second light; and the detecting step of detecting the intensity of the reflected light and the transmitted light at the same position of the object to be inspected by the photographing step The inner layer defect of the object to be inspected; in the photographing step, the second light is photographed to transmit the transmitted light.

作為本發明之一形態的缺陷檢查方法係一種 檢查薄片狀之被檢查物之缺陷的缺陷檢查方法,該方法係包含:照射步驟,係對該被檢查物照射第1光及第2光;攝影步驟,係取得因應於該第1光之反射光及該第 2光之透過光之強度的攝影資料;及檢測步驟,係根據在該攝影步驟所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷;在該攝影步驟,係拍攝該第2光之正透過光;該第2光係在經由第1偏光濾光器對該被檢查物照射該第2光並透過該被檢查物後,經由透過軸是與該第1偏光濾光器正交之第2偏光濾光器所拍攝。A defect inspection method which is one embodiment of the present invention is a A defect inspection method for inspecting defects of a sheet-like test object, the method comprising: an irradiation step of irradiating the first light and the second light to the test object; and a photographing step of obtaining a reflection corresponding to the first light Light and the first The photographic data of the intensity of the transmitted light of the light; and the detecting step of detecting the detected object based on the intensity of the reflected light and the transmitted light at the same position of the object to be inspected at the photographing step An inner layer defect; in the photographing step, the second light is transmitted through the first light, and the second light is irradiated to the object to be inspected through the first polarizing filter and transmitted through the object to be inspected The image is captured by a second polarizing filter that is orthogonal to the first polarizing filter via the transmission axis.

若依據本發明,可高速且低成本地進行區別表面缺陷與內層缺陷之缺陷檢查。According to the present invention, it is possible to perform defect inspection for distinguishing between surface defects and inner layer defects at high speed and at low cost.

S‧‧‧被檢查物S‧‧‧Inspected objects

101‧‧‧光源(第1光源)101‧‧‧Light source (first light source)

102‧‧‧光源(第2光源)102‧‧‧Light source (2nd light source)

201‧‧‧相機201‧‧‧ camera

202‧‧‧相機202‧‧‧ camera

300‧‧‧信號處理單元300‧‧‧Signal Processing Unit

301‧‧‧反射光學系統信號處理部301‧‧‧Reflex Optical System Signal Processing Department

302‧‧‧透過光學系統信號處理部302‧‧‧Transmission through the optical system signal processing department

303‧‧‧位置對準處理部303‧‧‧ Position Alignment Processing Department

304‧‧‧缺陷檢測部304‧‧‧Defect Detection Department

305‧‧‧比較判定部305‧‧‧Comparative Decision Department

306‧‧‧輸出部306‧‧‧Output Department

401‧‧‧偏光濾光器401‧‧‧ polarizing filter

402‧‧‧偏光濾光器402‧‧‧Polarizing filter

第1圖係表示缺陷檢查系統之整體概要的圖。Fig. 1 is a view showing an overall outline of a defect inspection system.

第2圖係表示第1實施形態之缺陷檢查裝置的構成圖。Fig. 2 is a view showing the configuration of a defect inspection device according to the first embodiment.

第3圖係說明第1實施形態之在表面缺陷及內層缺陷之反射光(a)及間接透過光(b)的圖。Fig. 3 is a view for explaining reflected light (a) and indirect transmitted light (b) of surface defects and inner layer defects in the first embodiment.

第4圖係說明存在於被檢查物之缺陷(a)、拍攝了此被檢查物之情況的反射光(b)及間接透過光(c)之亮度比的圖。Fig. 4 is a view for explaining the luminance ratio of the reflected light (b) and the indirect transmitted light (c) which are present in the defect (a) of the test object and in the case where the test object is imaged.

第5圖係表示第1實施形態之缺陷檢查方法之流程的流程圖。Fig. 5 is a flow chart showing the flow of the defect inspection method of the first embodiment.

第6圖係表示第2實施形態之缺陷檢查裝置的構成圖。Fig. 6 is a view showing the configuration of a defect inspection device according to a second embodiment.

第7圖係說明第2實施形態之透過表面缺陷及內層缺陷之透過光的圖。Fig. 7 is a view for explaining transmitted light passing through surface defects and inner layer defects in the second embodiment.

第8圖係表示第3實施形態之缺陷檢查裝置的構成圖。Fig. 8 is a view showing the configuration of a defect inspection device according to a third embodiment.

第9圖係表示第4實施形態之缺陷檢查裝置的構成圖。Fig. 9 is a view showing the configuration of a defect inspection device according to a fourth embodiment.

第10圖係表示第3及第4實施形態之變形例的缺陷檢查裝置之光學系統的構成圖。Fig. 10 is a view showing the configuration of an optical system of a defect inspection device according to a modification of the third and fourth embodiments.

第11圖係說明第5實施形態之缺陷檢查方法的圖。Fig. 11 is a view for explaining a defect inspection method according to a fifth embodiment.

第12圖係表示第1及第2實施形態之變形例的缺陷檢查裝置之光學系統的構成圖。Fig. 12 is a view showing the configuration of an optical system of a defect inspection device according to a modification of the first and second embodiments.

以下,參照圖面,並根據實施例詳細地舉例說明本發明之實施形態。其中,在該實施例所記載之構成元件的尺寸、材質、形狀及其相對配置等只要無特別記載,本發明之範圍就不受該等所限定。Hereinafter, embodiments of the present invention will be described in detail by way of examples with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the constituent elements described in the examples are not intended to limit the scope of the present invention unless otherwise specified.

在第1圖表示本發明之缺陷檢查系統整體的示意構成。缺陷檢查系統係檢查藉搬運輥400所搬運之薄片狀之被檢查物S的系統。被檢查物S例如是用於液晶顯示器的偏光薄膜。偏光薄膜在檢查階段係具有於薄片狀之偏光元件設置有保護片的多層構造。本實施形態之缺陷檢查系統係進行適當的缺陷檢查,該缺陷檢查係藉由檢測出存在於被檢查物S之內層(偏光元件層)的缺陷,而進行避免誤看(缺陷的誤檢測)之適當的缺陷檢測。Fig. 1 shows a schematic configuration of the entire defect inspection system of the present invention. The defect inspection system is a system that inspects the sheet-like object S to be conveyed by the conveyance roller 400. The test object S is, for example, a polarizing film for a liquid crystal display. In the inspection stage, the polarizing film has a multilayer structure in which a sheet-like polarizing element is provided with a protective sheet. In the defect inspection system of the present embodiment, an appropriate defect inspection is performed, and the defect inspection is performed to detect a defect existing in the inner layer (polarizing element layer) of the inspection object S, thereby avoiding erroneous observation (false detection of defects). Proper defect detection.

在本實施形態之缺陷檢查系統,設置有對被檢查物S照射光之2個光源101、102。光源101係從與相機200相同之側對被檢查物S照射光。光源102係從 與相機200相反側對被檢查物S照射光。相機200拍攝從光源101所照射的光之在被檢查物表面的反射光、與從光源102所照射並透過被檢查物的透過光。此外,相機200係僅圖示一台,但是亦可採用分別拍攝反射光與透過光的2台相機。藉相機200所拍攝之攝影資料係被送至信號處理單元300,並檢測出被檢查物S中的缺陷。 在此時,信號處理單元300係根據反射光與透過光之強度,判別所檢測出之缺陷是存在於被檢查物S的內層或存在於表面。In the defect inspection system of the present embodiment, two light sources 101 and 102 that irradiate the object S with light are provided. The light source 101 irradiates the inspection object S with light from the same side as the camera 200. Light source 102 is from The object S is irradiated with light on the opposite side of the camera 200. The camera 200 captures the reflected light on the surface of the object to be inspected by the light emitted from the light source 101, and the transmitted light that is irradiated from the light source 102 and transmitted through the object to be inspected. Further, although only one camera 200 is illustrated, two cameras that respectively detect reflected light and transmitted light may be used. The photographic data taken by the camera 200 is sent to the signal processing unit 300, and the defect in the object S is detected. At this time, the signal processing unit 300 determines whether the detected defect exists in the inner layer of the test object S or exists on the surface based on the intensity of the reflected light and the transmitted light.

在此,簡單地說明了缺陷檢查系統之概要, 以下針對各個實施形態作詳細說明。Here, the outline of the defect inspection system is briefly explained. Hereinafter, each embodiment will be described in detail.

<第1實施形態><First embodiment>

第2圖係表示第1實施形態之缺陷檢查裝置的構成圖。缺陷檢查裝置由光源101、102、相機201、202及信號處理單元300所構成。Fig. 2 is a view showing the configuration of a defect inspection device according to the first embodiment. The defect inspection device is composed of the light sources 101, 102, the cameras 201, 202, and the signal processing unit 300.

光源101係從與相機201相同之側對被檢查物S照射光101a。光源101所照射之光101a的波長無特別限定,可以是可見光,亦可以是紫外光或紅外光等。又,光101a亦可以不是單一波長的光。在本實施形態,作為光101a,例如採用綠光。光源101係以光101a可斜向照射於被檢查物S之方式配置。相機201係線感測器相機,不論是彩色相機或是黑白相機都可。相機201係在配置與被檢查物S之搬運方向正交的方向,且配置成可從鉛垂方向拍攝光101a之照射位置。光源101與相機201之位置關係係設為光101a之正反射光不會射入而擴 散反射光101b會射入相機201的位置關係較佳。藉此,可對被檢查物S之缺陷進行暗視野攝影,能以高對比拍攝缺陷。此外,光源101與相機201之位置關係係只要是可實現暗視野攝影之配置即可,亦可以是上述以外的配置。在本專利說明書中將光源101與相機201稱為反射光學系統。The light source 101 irradiates the object S with the light 101a from the same side as the camera 201. The wavelength of the light 101a irradiated by the light source 101 is not particularly limited, and may be visible light, ultraviolet light or infrared light. Further, the light 101a may not be light of a single wavelength. In the present embodiment, for example, green light is used as the light 101a. The light source 101 is disposed such that the light 101a can be obliquely irradiated onto the object S to be inspected. The camera 201 is a line sensor camera, whether it is a color camera or a black and white camera. The camera 201 is disposed in a direction orthogonal to the conveyance direction of the inspection object S, and is disposed so as to be capable of photographing the irradiation position of the light 101a from the vertical direction. The positional relationship between the light source 101 and the camera 201 is such that the regular reflected light of the light 101a does not enter and expands. The positional relationship in which the scattered reflected light 101b is incident on the camera 201 is preferable. Thereby, it is possible to perform dark-field photography on the defect of the object S to be inspected, and it is possible to take a defect with high contrast. Further, the positional relationship between the light source 101 and the camera 201 may be any configuration as long as it is capable of realizing dark field photography. The light source 101 and the camera 201 are referred to as reflective optical systems in this patent specification.

光源102係從與相機202相反側對被檢查物 S照射光102a。光源102所照射之光102a的波長亦可與光源101的情況一樣係任意,但是在本實施形態以使用藍光較佳。關於藍光較佳之理由將於後面述及。光源102係配置成光102a可斜向照射於被檢查物S。在本實施形態,光101a與光102a之照射位置係在搬運方向錯開。 相機202係線感測器相機,不論是彩色相機或是黑白相機都可。相機202係配置在與被檢查物S之搬運方向正交的方向,並配置成可從鉛垂方向拍攝光102a之照射位置。光源102與相機202之位置關係係以設為光102a之正透過光不會射入而間接透過光102b會射入相機202的位置關係較佳。藉此,可對被檢查物S之缺陷進行暗視野攝影,而可高對比地拍攝缺陷。此外,光源102與相機202之位置關係係只要是可實現暗視野攝影之配置即可,亦可以是上述以外的配置。在本專利說明書中將光源102與相機202稱為間接透過光學系統。The light source 102 is from the opposite side of the camera 202 to the object to be inspected S illuminates light 102a. The wavelength of the light 102a irradiated by the light source 102 may be arbitrary as in the case of the light source 101. However, in the present embodiment, it is preferable to use blue light. The reason for the better Blu-ray will be described later. The light source 102 is arranged such that the light 102a can be obliquely irradiated onto the object S to be inspected. In the present embodiment, the irradiation positions of the light 101a and the light 102a are shifted in the conveyance direction. The camera 202 is a line sensor camera, whether it is a color camera or a black and white camera. The camera 202 is disposed in a direction orthogonal to the conveyance direction of the inspection object S, and is disposed so as to be capable of photographing the irradiation position of the light 102a from the vertical direction. The positional relationship between the light source 102 and the camera 202 is preferably such that the positive transmitted light of the light 102a is not incident and the indirect transmitted light 102b is incident on the camera 202. Thereby, dark-field photography can be performed on the defects of the object S to be inspected, and defects can be photographed with high contrast. Further, the positional relationship between the light source 102 and the camera 202 may be any configuration as long as it is capable of realizing dark field photography. Light source 102 and camera 202 are referred to as indirect transmission optical systems in this patent specification.

信號處理單元300係包括CPU(中央運算處理 裝置)、RAM(隨機存取記憶體)等之主記憶裝置、HDD(硬碟)或SSD(固態硬碟)等之輔助記憶裝置、滑鼠、鍵盤、 顯示器等之輸入輸出裝置等的電腦。藉由此電腦之CPU執行電腦程式,發揮作為反射光學系統信號處理部301、透過光學系統信號處理部302、位置對準處理部303、缺陷檢測部304、比較判定部305及輸出部306之功能。The signal processing unit 300 includes a CPU (Central Processing Processing) Main memory device such as device), RAM (random access memory), auxiliary memory device such as HDD (hard disk) or SSD (solid state hard disk), mouse, keyboard, A computer such as an input/output device such as a display. The computer program of the computer executes the computer program, and functions as the reflection optical system signal processing unit 301, the transmission optical system signal processing unit 302, the alignment processing unit 303, the defect detection unit 304, the comparison determination unit 305, and the output unit 306. .

反射光學系統信號處理部301係取得從相機 201所輸出之攝影資料,並從攝影資料求得亮度比。在本實施形態,因為採用綠色光源作為光源101,所以在相機201為彩色相機的情況只要求得G信號之亮度比即可。此外,亮度比係指將各受光元件之電荷(攝影資料)除以以無缺陷之被檢查物為對象時之各受光元件之電荷(攝影資料)後的值。即,預先求得無缺陷之被檢查物S的攝影資料,將檢查時之攝影資料相對於該值的比設為亮度比。「無缺陷時之各受光元件的電荷」係亦可作為在進行複數次攝像時之各受光元件之電荷的平均值。亮度比在無缺陷的情況係成為接近1的值,而在有缺陷的情況,因為在缺陷之擴散反射光射入,而成為比1更大的值。在本專利說明書中,將反射光學系統信號處理部301所算出之亮度比稱為反射光亮度比。The reflection optical system signal processing unit 301 acquires the slave camera 201 photographic data output, and the brightness ratio is obtained from the photographic data. In the present embodiment, since the green light source is used as the light source 101, only the luminance ratio of the G signal is required when the camera 201 is a color camera. In addition, the luminance ratio is a value obtained by dividing the charge (photographic data) of each light-receiving element by the charge (photographic data) of each light-receiving element when the object to be inspected is not intended. In other words, the photographic data of the object S to be inspected without defects is obtained in advance, and the ratio of the photographic data at the time of the inspection to the value is set as the luminance ratio. The "charge of each light-receiving element in the case of no defect" can also be used as an average value of charges of the respective light-receiving elements at the time of performing plural imaging. The luminance ratio is a value close to 1 in the case of no defect, and in the case of a defect, the diffused reflected light is incident on the defect, and becomes a value larger than 1. In this patent specification, the luminance ratio calculated by the reflection optical system signal processing unit 301 is referred to as a reflected light luminance ratio.

透過光學系統信號處理部302係取得從相機 202所輸出之攝影資料,並與上述一樣地從攝影資料求得亮度比。在本實施形態,因為採用藍色光源作為光源102,所以在相機202為彩色相機的情況,只要求得B信號之亮度比即可。在此所求得之亮度比亦與上述一樣,在無缺陷的情況成為接近1的值,而在有缺陷的情況,因為間接透過光射入,而成為比1更大的值。在本 專利說明書中,將透過光學系統信號處理部302所算出之亮度比稱為透過光亮度比。The optical system signal processing unit 302 acquires the slave camera The photographic data outputted by 202 is obtained from the photographic data in the same manner as described above. In the present embodiment, since the blue light source is used as the light source 102, when the camera 202 is a color camera, only the luminance ratio of the B signal is required. The luminance ratio obtained here is also a value close to 1 in the case of no defect, and a value larger than 1 in the case of a defect. In this In the patent specification, the luminance ratio calculated by the optical system signal processing unit 302 is referred to as a transmitted light luminance ratio.

位置對準處理部303係進行反射光亮度比與 透過光亮度比之資料的位置對準處理。因為相機201與相機202之攝影位置不同,所以被相機201拍攝的部位到達要被相機202拍攝之位置會耗費時間。為了比較從相機201與相機202所獲得之相同位置的亮度比,位置對準處理部303係根據被檢查物之搬運速度與攝影資料之取得時刻,進行位置對準處理。The position alignment processing unit 303 performs the brightness ratio of the reflected light The light is transmitted through the positional alignment of the data. Since the camera 201 is different from the photographing position of the camera 202, it takes time for the portion photographed by the camera 201 to reach the position to be photographed by the camera 202. In order to compare the luminance ratios of the same position obtained from the camera 201 and the camera 202, the alignment processing unit 303 performs the alignment processing based on the conveyance speed of the inspection object and the acquisition timing of the photograph data.

缺陷檢測部304係從反射光亮度比之資料與 透過光亮度比之資料的各資料,檢測出缺陷。缺陷檢測部304係在不區別缺陷是內層缺陷或是表面缺陷之下檢測出全部的缺陷。具體言之,缺陷檢測部304係在亮度比為既定臨限值以上的情況判斷有缺陷存在。此臨限值係作為檢測參數,可從外部設定。The defect detecting unit 304 is configured to reflect the brightness ratio of the reflected light. Defects were detected by various data of the brightness ratio data. The defect detecting unit 304 detects all the defects without distinguishing whether the defect is an inner layer defect or a surface defect. Specifically, the defect detecting unit 304 determines that a defect exists when the luminance ratio is equal to or greater than a predetermined threshold. This threshold is used as a detection parameter and can be set externally.

比較判定部305係對缺陷檢測部304所檢測 出之缺陷,根據在該缺陷部分之反射光亮度比與透過光亮度比,判別是內層缺陷或是表面缺陷。比較判定部305係將透過光亮度比是比反射光亮度比更大的缺陷判別為內層缺陷,而將反射光亮度比是比透過光亮度比更大的缺陷判別為表面缺陷。The comparison determination unit 305 detects the defect detection unit 304. The defect is determined as an inner layer defect or a surface defect based on the ratio of the reflected light luminance to the transmitted light luminance in the defective portion. The comparison determination unit 305 determines that the defect having the transmitted light luminance ratio greater than the reflected light luminance ratio is the inner layer defect, and the defect having the reflected light luminance ratio larger than the transmitted light luminance ratio as the surface defect.

參照第3圖及第4圖,說明根據上述之方法 可判別內層缺陷與表面缺陷的理由。Referring to Figures 3 and 4, the method according to the above is explained. Reasons for identifying inner defects and surface defects.

第3圖(a)係說明從光源101所照射的光101a 在缺陷中之反射光的圖。從光源101所照射的光101a係 在表面缺陷DS 及內層缺陷DI 進行擴散反射,並藉相機201拍攝該擴散反射光RS 、RI 。在此,具有在表面缺陷出現強的擴散反射,而相對地在內層缺陷DI 出現弱之擴散反射的特徵。因此,檢測出在表面缺陷DS 之反射光RS 的強度比在內層缺陷DI 之反射光RI 的強度更強。Fig. 3(a) is a view for explaining reflected light of the light 101a irradiated from the light source 101 in the defect. The light 101a irradiated from the light source 101 is diffused and reflected by the surface defect D S and the inner layer defect D I , and the diffused reflected light R S , R I is captured by the camera 201. Here, there is a feature that a strong diffusion reflection occurs on the surface defect, and a weak diffusion reflection occurs in the inner layer defect D I . Accordingly, the surface defects detected intensity of the reflected light R S D S of the intensity stronger than the inner defect of the reflected light R D I I,.

第3圖(b)係說明從光源102所照射的光102a 在缺陷中之間接透過光的圖。從光源102所照射的光102a係在表面缺陷DS 及內層缺陷DI 散射,而偏離正透過方向。藉相機202拍攝該間接透過光TS 、TI 。在此,具有在內層缺陷DI 散射強,而相對地在表面缺陷DS 散射弱之特徵。因此,檢測出在內層缺陷DI 之間接透過光TI 的強度比在表面缺陷DS 之間接透過光TS 的強度更強。Fig. 3(b) is a view for explaining that the light 102a irradiated from the light source 102 transmits light between the defects. The light 102a irradiated from the light source 102 is scattered by the surface defect D S and the inner layer defect D I and deviates from the forward transmission direction. The indirect transmitted light T S , T I is captured by the camera 202. Here, there is a feature that the inner layer defect D I is strongly scattered, and the surface defect D S is relatively weakly scattered. Therefore, it is detected that the intensity of the transmitted light T I between the inner layer defects D I is stronger than the intensity of the transmitted light T S between the surface defects D S .

此外,此散射效果係在光源102使用藍色光 源較佳的理由。光102a的波長愈短,在內層缺陷之散射效果愈強,因此,射入相機202之間接透過光亦愈強。 因此,從光源102所照射之光的波長係短的較佳。若考慮光源或受光元件之易取得性或成本,從光源102所照射之光102a係採用藍光較佳。In addition, this scattering effect is based on the use of blue light in the light source 102. The reason for the source is better. The shorter the wavelength of the light 102a, the stronger the scattering effect of the inner layer defects, and therefore the stronger the transmitted light entering the camera 202. Therefore, the wavelength of the light irradiated from the light source 102 is preferably short. In consideration of the availability or cost of the light source or the light receiving element, it is preferable to use blue light from the light 102a irradiated from the light source 102.

第4圖係說明內層缺陷與表面缺陷之亮度比 之差異的圖。第4圖(a)係從鉛垂方向表示被檢查物的圖,表示在相機201、202之攝影位置43存在有表面瑕疵(表面缺陷)41與內層異物(內層缺陷)42。第4圖(b)係在各像素位置表示相機201所拍攝之反射光亮度比(反射光學系統信號處理部301所算出之亮度比)的圖。如上述,因為在表面瑕疵41之反射光強度比在內層異物42 之反射光強度更大,所以在表面瑕疵41之位置的亮度比大,而在內層異物42之位置的亮度比小。另一方面,第4圖(c)係在各像素位置表示相機202所拍攝之間接透過光亮度比(透過光學系統信號處理部302所算出之亮度比)的圖。如上述所示,因為在內層異物42之間接透過光強度比在表面瑕疵41之間接透過光強度更大,所以在內層異物42之位置的亮度比大,而在表面瑕疵41之位置的亮度比小。Figure 4 illustrates the brightness ratio of inner and surface defects The map of the difference. Fig. 4(a) is a view showing the object to be inspected from the vertical direction, and shows that surface flaws (surface defects) 41 and inner layer foreign matter (inner layer defects) 42 are present at the photographing positions 43 of the cameras 201 and 202. Fig. 4(b) is a diagram showing the ratio of the reflected light luminance (the luminance ratio calculated by the reflection optical system signal processing unit 301) captured by the camera 201 at each pixel position. As described above, because the intensity of reflected light at the surface 瑕疵41 is higher than that of the inner layer of foreign matter 42 Since the intensity of the reflected light is larger, the luminance ratio at the position of the surface 瑕疵 41 is large, and the luminance ratio at the position of the inner layer foreign matter 42 is small. On the other hand, Fig. 4(c) is a diagram showing the ratio of the transmitted light luminance (the luminance ratio calculated by the transmission optical system signal processing unit 302) between the images captured by the camera 202 at each pixel position. As described above, since the transmitted light intensity between the inner layer foreign objects 42 is greater than the transmitted light intensity between the inner surface turns 41, the luminance ratio at the position of the inner layer foreign matter 42 is large, and at the position of the surface flaw 41. The brightness ratio is small.

如此,在內層異物42之位置的亮度比係為透 過光亮度比比起反射光亮度比還大。另一方面,在表面瑕疵41之位置的亮度比係反射光亮度比比起透過光亮度比更大。因此,比較判定部305係可將透過光亮度比比起反射光亮度比更大之缺陷判別為內層缺陷。Thus, the brightness ratio at the position of the inner layer foreign matter 42 is The over-light brightness ratio is larger than the reflected light brightness ratio. On the other hand, the brightness at the position of the surface 瑕疵41 is larger than the brightness ratio of the reflected light. Therefore, the comparison determination unit 305 can determine that the defect having the transmitted light luminance ratio larger than the reflected light luminance ratio is the inner layer defect.

此外,在第3圖及第4圖之說明中係為了簡 化說明而列舉表面缺陷是位於表側(光源101側)的面的情況,但是在背面側的面有缺陷的情況,相同的現象亦成立。又,即使是內層缺陷與表面缺陷存在於相同位置的情況,亦藉由適當地調整光源102之光量或缺陷檢測所需的臨限值,而可作成關於所檢測出之缺陷,透過光亮度比是比反射光亮度比還大。因此,即使是內層缺陷與表面缺陷存在於相同位置的情況,亦可根據上述之原理來判別有無內層缺陷。In addition, in the description of Figures 3 and 4, In the case where the surface defect is a surface located on the front side (the side of the light source 101), the same phenomenon may be satisfied in the case where the surface on the back side has a defect. Further, even in the case where the inner layer defect and the surface defect exist at the same position, by appropriately adjusting the amount of light of the light source 102 or the threshold required for defect detection, it is possible to make a difference with respect to the detected defect, transmitted light. The ratio is greater than the brightness ratio of the reflected light. Therefore, even if the inner layer defect and the surface defect exist at the same position, the presence or absence of the inner layer defect can be determined based on the above principle.

輸出部306係在檢測出缺陷的情況,將缺陷 所存在的位置、及該缺陷係內層缺陷和表面缺陷之哪一種的資訊輸出至顯示裝置等,或對其他的裝置傳送資 料。此外,輸出部306係亦可作成僅在內層缺陷存在的情況通知有缺陷存在。The output unit 306 is in the case where a defect is detected, and the defect is Information on the location and the defect of the inner layer defect and the surface defect of the defect are output to the display device or the like, or the other device is transmitted material. Further, the output unit 306 may be configured to notify that there is a defect only when the inner layer defect exists.

參照第5圖之流程圖,說明使用本實施形態 之缺陷檢查裝置的缺陷檢查方法。在步驟S51,藉相機201拍攝從光源101對被檢查物S所照射之光的反射光,而且藉相機202拍攝從光源102對被檢查物S所照射之光的透過光。進而,藉反射光學系統信號處理部301及透過光學系統信號處理部302算出反射光及透過光之亮度比。因為被檢查物S會被搬運,所以藉由攝影可得到二維之亮度比的分布。在步驟S52,位置對準處理部303進行反射光亮度比與透過光亮度比之位置對準處理,而得到在相同位置的反射光亮度比與透過光亮度比。在步驟S53,缺陷檢測部304從在相同攝影位置之反射光亮度比的資料與透過光亮度比的資料,檢測出缺陷。缺陷檢測部304係在亮度比比起被賦予作為攝影參數之臨限值更大的情況,判斷在該部位具有缺陷。此外,在此,係在進行位置對準處理後進行缺陷檢測,但是亦可在缺陷檢測後進行位置對準處理。Referring to the flowchart of FIG. 5, the use of this embodiment will be described. The defect inspection method of the defect inspection device. In step S51, the reflected light of the light irradiated from the light source 101 to the object S to be inspected is imaged by the camera 201, and the transmitted light of the light irradiated from the light source 102 to the object S to be inspected is captured by the camera 202. Further, the reflection optical system signal processing unit 301 and the transmission optical system signal processing unit 302 calculate the luminance ratios of the reflected light and the transmitted light. Since the object to be inspected S is transported, a two-dimensional distribution of luminance ratios can be obtained by photographing. In step S52, the alignment processing unit 303 performs a positional alignment process of the ratio of the reflected light luminance to the transmitted light luminance, thereby obtaining a ratio of the reflected light luminance ratio to the transmitted light luminance at the same position. In step S53, the defect detecting unit 304 detects a defect from the data of the ratio of the reflected light luminance at the same photographing position and the transmitted light luminance ratio. The defect detecting unit 304 determines that there is a defect in the portion when the luminance ratio is larger than the threshold value as the imaging parameter. Further, here, defect detection is performed after performing the alignment process, but the alignment process may be performed after the defect detection.

在步驟S54,比較判定部305針對缺陷檢測 部304所檢測出之缺陷,判定透過光亮度比是否比反射光亮度比更大。在透過光亮度比是較大的情況,移至步驟S55,比較判定部305判定缺陷是內層缺陷。另一方面,在反射光亮度比是較大的情況,移至步驟S56,比較判定部305判定缺陷是表面缺陷。然後,在步驟S57,針對所檢測出之缺陷,輸出部306輸出其位置或缺陷種 類等。但,亦可作成僅在缺陷是內層缺陷的情況輸出關於缺陷之資訊,而不針對表面缺陷輸出資料。In step S54, the comparison determination section 305 detects the defect. The defect detected by the portion 304 determines whether the transmitted light luminance ratio is larger than the reflected light luminance ratio. When the transmitted light luminance ratio is large, the process proceeds to step S55, and the comparison determining unit 305 determines that the defect is an inner layer defect. On the other hand, when the reflected light luminance ratio is large, the process proceeds to step S56, and the comparison determining unit 305 determines that the defect is a surface defect. Then, in step S57, the output unit 306 outputs the position or the defect type for the detected defect. Classes, etc. However, it is also possible to output information about the defect only in the case where the defect is an inner layer defect, and not to output the data for the surface defect.

若依據本實施形態之缺陷檢查裝置,因為可 同時拍攝反射光與間接透過光2種,所以可實現高速的檢查。又,因為不需要用以使光學系統移動之驅動部,所以可抑制製造成本或維修成本。進而,藉由根據反射光強度與間接透過光強度之差異來判別缺陷,可實現精度佳之判別。尤其,藉由使用在缺陷中之散射效果高之如藍光的短波長的光作為透過光,因為間接透過光變成更強,所以種類判別之精度更提高。According to the defect inspection device of the embodiment, since At the same time, two kinds of reflected light and indirect transmitted light are photographed, so that high-speed inspection can be realized. Moreover, since the drive unit for moving the optical system is not required, the manufacturing cost or the maintenance cost can be suppressed. Further, by discriminating the defect based on the difference between the intensity of the reflected light and the intensity of the indirectly transmitted light, it is possible to achieve accurate discrimination. In particular, by using light of a short wavelength such as blue light having a high scattering effect in a defect as transmitted light, since the indirect transmitted light becomes stronger, the accuracy of the type discrimination is further improved.

<第2實施形態><Second embodiment>

在第6圖表示第2實施形態之缺陷檢查裝置的構成。本實施形態之缺陷檢查裝置基本上與第1實施形態一樣,但是用在透過光攝影之光學系統的構成不同。第1實施形態中係拍攝間接透過光,相對地在本實施形態中係拍攝正透過光。Fig. 6 shows the configuration of the defect inspection device of the second embodiment. The defect inspection apparatus of this embodiment is basically the same as that of the first embodiment, but the configuration of the optical system for transmitting light is different. In the first embodiment, the indirect transmitted light is captured, and in the present embodiment, the forward transmitted light is relatively photographed.

在本實施形態,因為是拍攝正透過光,所以將光源102與相機202配置成光源102之照射方向與相機202之拍攝方向一致。例如,光源102係從下方垂直地對被檢查物S照射光,相機202係從上方垂直地拍攝被檢查物S較佳。In the present embodiment, since the forward light is captured, the light source 102 and the camera 202 are arranged such that the irradiation direction of the light source 102 coincides with the imaging direction of the camera 202. For example, the light source 102 directly irradiates the inspection object S with light from below, and the camera 202 preferably images the inspection object S vertically from above.

在本實施形態,為了進行暗視野攝影,將偏光濾光器401配置於光源102與被檢查物S之間,並將偏光濾光器402配置於相機202與被檢查物S之間。在此,偏光濾光器401與偏光濾光器402係配置成透過軸 彼此正交[尼科耳正交(cross-nicol)]配置。因此,從光源102所照射之光係於被檢查物S內在偏光未發生散射的情況下被偏光濾光器402所遮斷,而不會到達相機202。In the present embodiment, in order to perform dark-field imaging, the polarizing filter 401 is disposed between the light source 102 and the inspection object S, and the polarizing filter 402 is disposed between the camera 202 and the inspection object S. Here, the polarizing filter 401 and the polarizing filter 402 are configured to transmit a shaft. Orthogonal to each other [nico-cross-nicol] configuration. Therefore, the light irradiated from the light source 102 is blocked by the polarizing filter 402 when the polarized light is not scattered in the object S, and does not reach the camera 202.

第7圖係說明從光源102照射之光透過被檢 查物S的情況之透過光強度的圖。透過無缺陷之部分的透過光T0 係因為在被檢查物S內的偏光不會發生散射,所以被偏光濾光器402所遮斷。另一方面,透過內層缺陷DI 或表面缺陷DS 的透過光TI 或TS 係因為在透過缺陷時偏光發生散射,所以通過偏光濾光器402。在此,具有透過內層缺陷時之偏光的散射比透過表面缺陷時之偏光之散射更大的特徵。因此,在相機202,檢測出已透過內層缺陷DI 之透過光TI 的強度比已透過表面缺陷DS 之透過光TS 的強度更強。此外,因為缺陷所造成之偏光之散射程度不與光的波長相依存,所以從光源102所照射之光的波長(顏色)亦可以是任意。Fig. 7 is a view for explaining the transmitted light intensity in the case where the light irradiated from the light source 102 passes through the object S to be inspected. The transmitted light T 0 passing through the defect-free portion is blocked by the polarizing filter 402 because the polarized light in the test object S does not scatter. On the other hand, the transmitted light T I or T S transmitted through the inner layer defect D I or the surface defect D S passes through the polarizing filter 402 because the polarized light is scattered when the defect is transmitted. Here, the scattering of the polarized light when the inner layer defect is transmitted is larger than the scattering of the polarized light when the surface defect is transmitted. Therefore, in the camera 202, it is detected that the intensity of the transmitted light T I that has passed through the inner layer defect D I is stronger than the transmitted light T S that has passed through the surface defect D S . Further, since the degree of scattering of the polarized light due to the defect does not depend on the wavelength of the light, the wavelength (color) of the light irradiated from the light source 102 may be arbitrary.

在本實施形態,亦與第1實施形態一樣,可 根據藉相機201所拍攝之反射光強度與藉相機202所拍攝之透過光強度,判別缺陷是內層缺陷或是表面缺陷。 因為信號處理單元300的構成係與第1實施形態一樣,所以省略說明。This embodiment is also the same as the first embodiment. The defect is determined to be an inner layer defect or a surface defect based on the intensity of the reflected light taken by the camera 201 and the transmitted light intensity captured by the camera 202. Since the configuration of the signal processing unit 300 is the same as that of the first embodiment, the description thereof is omitted.

本實施形態之效果係與第1實施形態之效果 一樣。The effect of the embodiment is the same as the effect of the first embodiment. same.

<第3實施形態><Third embodiment>

在上述之第1及第2實施形態,使用2台相機拍攝,但是在本實施形態,使用1台相機拍攝。In the first and second embodiments described above, two cameras are used for imaging. However, in the present embodiment, one camera is used for imaging.

在第8圖表示本實施形態之缺陷檢查裝置的 構成。第8圖之構成係根據第1實施形態之構成加以變更者。如第8圖所示,缺陷檢查裝置係僅藉1台相機200拍攝。因此,將光源101之照射位置與光源102之照射位置設為相同,並使從光源101所照射之光與從光源102所照射之光的波長(顏色)相異。如在第1實施形態之說明所示,在拍攝間接透過光的情況,因為使用藍色光源作為光源102較佳,所以只要將光源102設為藍色光源,並將光源101設為紅色光源或綠色光源即可。Fig. 8 shows the defect inspection device of the embodiment. Composition. The configuration of Fig. 8 is modified according to the configuration of the first embodiment. As shown in Fig. 8, the defect inspection device is photographed by only one camera 200. Therefore, the irradiation position of the light source 101 and the irradiation position of the light source 102 are made the same, and the light emitted from the light source 101 is different from the wavelength (color) of the light irradiated from the light source 102. As described in the first embodiment, in the case of photographing indirect transmitted light, it is preferable to use a blue light source as the light source 102. Therefore, the light source 102 is a blue light source, and the light source 101 is a red light source or A green light source is all right.

在第8圖亦表示本實施形態之相機200的細 部構成。相機200係具備分別接收不同波長的光之線狀的受光元件200R、200G、200B的彩色相機。線狀的受光元件都配置在與被檢查物S之搬運方向正交的方向。 在第8圖中係表示分別接收R、G、B之光的3個受光元件,但是只要具有與光源101及光源102對應的2種光學元件就夠了。Also shown in Fig. 8 is the detail of the camera 200 of the present embodiment. Department composition. The camera 200 includes a color camera that receives linear light receiving elements 200R, 200G, and 200B of light of different wavelengths. Each of the linear light receiving elements is disposed in a direction orthogonal to the conveyance direction of the inspection object S. In the eighth drawing, three light receiving elements that respectively receive light of R, G, and B are shown. However, it suffices to have two types of optical elements corresponding to the light source 101 and the light source 102.

第8圖係根據第1實施形態施以變更後的構 成,但是對第2實施形態亦可施以相同之變更。將該情況的構成顯示於第10圖。在該情況亦是,光源101與光源102以波長相異的光照射相同之位置,並藉1台相機200拍攝。而且,在光源102與被檢查物S之間有設置偏光濾光器401,在相機200與被檢查物S之間設有偏光濾光器402。此外,相機200的構成或從光源所發出之光係與上述一樣。Fig. 8 is a diagram showing a modified configuration according to the first embodiment. However, the second embodiment can be modified in the same manner. The configuration of this case is shown in Fig. 10. In this case as well, the light source 101 and the light source 102 illuminate the same position with light having different wavelengths, and are taken by one camera 200. Further, a polarizing filter 401 is provided between the light source 102 and the test object S, and a polarizing filter 402 is provided between the camera 200 and the test object S. Further, the configuration of the camera 200 or the light system emitted from the light source is the same as described above.

若依據本實施形態之缺陷檢查裝置,因為可將相機設為1台,所以可省空間化。According to the defect inspection apparatus of the present embodiment, since the number of cameras can be set to one, space can be saved.

<第4實施形態><Fourth embodiment>

本實施形態與第3實施形態一樣是使用1台相機拍攝的構成。This embodiment is a configuration that is imaged using one camera as in the third embodiment.

在第9圖表示本實施形態之缺陷檢查裝置的構成。第9圖之構成係與第3實施形態一樣,根據第1實施形態之構成施以變更者,與第3實施形態相比,除相機200的構成不同外,其餘大致相同。本實施形態之相機200具有二向分光鏡211與212、及R、G、B各目的受光元件210R、210G、210B。在第9圖的構成,二向分光鏡211係僅反射藍光,並使其他的光透過。二向分光鏡212係僅反射綠光,並使其他的光透過。(對)藉這些二向分光鏡211、212分光後的紅光(R)、綠光(G)及藍光(B)分別以受光元件210R、210G、210B受光。Fig. 9 shows the configuration of the defect inspection device of the present embodiment. The configuration of the ninth embodiment is the same as that of the third embodiment, and the configuration of the first embodiment is modified in the same manner as in the third embodiment, except that the configuration of the camera 200 is different. The camera 200 of the present embodiment includes the dichroic beamsplitters 211 and 212, and the R, G, and B target light receiving elements 210R, 210G, and 210B. In the configuration of Fig. 9, the dichroic beam splitter 211 reflects only blue light and transmits other light. The dichroic mirror 212 reflects only green light and transmits other light. The pair of red (R), green (G), and blue (B) beams split by the dichroic mirrors 211 and 212 are received by the light receiving elements 210R, 210G, and 210B, respectively.

此外,在此是表示分光成3色光的構成,但是亦可採用能分光成光源101及光源102所照射之2色光的構成。又,亦可採用二向分光稜鏡或光柵等作為分光元件,以替代二向分光鏡。In addition, although it is a structure which shows the light of the three colors of light, it is set as the structure which can isolate|separate the light of the light- Further, a dichroic beam splitter or a grating or the like may be employed as the spectroscopic element instead of the dichroic beam splitter.

第9圖係根據第1實施形態施以變更後的構成,但是對第2實施形態亦可施以相同之變更,能採用如第10圖所示之光學系統的構成。In the ninth embodiment, the configuration is changed according to the first embodiment. However, the second embodiment can be modified in the same manner, and the configuration of the optical system shown in Fig. 10 can be employed.

若依據本實施形態,與第3實施形態一樣,因為能以1台相機拍攝,所以具有可省空間化的優點。進而,因為在完全相同之位置拍攝反射光與透過光,所 以在信號處理單元300不需要位置對準處理部303。再者,因為不會發生位置偏差,所以即使是在被檢查物S之搬運速度發生變化的情況亦可進行無位置偏差之精度佳的缺陷檢測。According to the present embodiment, as in the third embodiment, since it can be imaged by one camera, there is an advantage that space can be saved. Furthermore, because the reflected light and the transmitted light are taken at exactly the same position, The signal processing unit 300 does not require the alignment processing unit 303. Further, since the positional deviation does not occur, even when the conveyance speed of the inspection object S changes, the defect detection with high accuracy without positional deviation can be performed.

<第5實施形態><Fifth Embodiment>

本實施形態係在信號處理單元300中之用以檢測出缺陷的處理與其他的實施形態不同,除此之外的部分之構成係相同。具體言之,反射光學系統信號處理部301、透過光學系統信號處理部302、缺陷檢測部304及比較判定部305之處理內容不同。The processing for detecting a defect in the signal processing unit 300 in this embodiment is different from the other embodiments, and the other components are the same. Specifically, the processing contents of the reflection optical system signal processing unit 301, the transmission optical system signal processing unit 302, the defect detection unit 304, and the comparison determination unit 305 are different.

在第1~第4實施形態,係根據亮度比是否比臨限值更大來檢測出缺陷,而在本實施形態,係根據亮度比之直方圖來檢測出缺陷。對藉線相機所拍攝之一條線份量的像素算出亮度比之直方圖時,在缺陷存在的情況,在亮度比1(無缺陷部分)以外之部分亦會出高峰。因此,可根據在直方圖所出現之高峰檢測出缺陷。In the first to fourth embodiments, the defect is detected based on whether or not the luminance ratio is larger than the threshold value. In the present embodiment, the defect is detected based on the histogram of the luminance ratio. When a histogram of a luminance ratio is calculated for a pixel of a line amount taken by a line camera, in the case where a defect exists, a portion other than the luminance ratio 1 (non-defective portion) also peaks. Therefore, defects can be detected based on the peaks appearing in the histogram.

本實施形態之反射光學系統信號處理部301及透過光學系統信號處理部302係從反射光與透過光之攝影資料算出亮度比的直方圖。在第11圖表示所算出之直方圖的例子。The reflection optical system signal processing unit 301 and the transmission optical system signal processing unit 302 of the present embodiment calculate a luminance ratio histogram from the photographic data of the reflected light and the transmitted light. An example of the calculated histogram is shown in Fig. 11 .

第11圖(a)、(b)係從拍攝自光源101照射之光的攝影資料所得之直方圖。第11圖(a)係存在表面缺陷之情況的直方圖,第11圖(b)係存在內層缺陷之情況的直方圖。此外,第11圖中亮度比1之高峰係省略。如第11圖所示,高峰的寬度W係為表面缺陷的情況比內層缺陷的情況更寬。Fig. 11 (a) and (b) are histograms obtained from photographing data of light irradiated from the light source 101. Fig. 11(a) is a histogram in the case of a surface defect, and Fig. 11(b) is a histogram in the case where an inner layer defect exists. Further, the peak of the luminance ratio 1 in Fig. 11 is omitted. As shown in Fig. 11, the width W of the peak is a case where the surface defect is wider than the case of the inner layer defect.

第11圖(c)、(d)係從拍攝自光源102照射之光的攝影資料所得之直方圖。第11圖(c)係存在有表面缺陷之情況的直方圖,第11圖(d)係存在有內層缺陷之情況的直方圖。此情況之高峰的寬度W係為內層缺陷的情況比表面缺陷的情況更寬。Fig. 11 (c) and (d) are histograms obtained from photographing data of light irradiated from the light source 102. Fig. 11(c) is a histogram in the case where there is a surface defect, and Fig. 11(d) is a histogram in the case where an inner layer defect exists. The width W of the peak of this case is wider for the case of the inner layer defect than for the surface defect.

本實施形態之缺陷檢測部304係在從攝影資料所得之直方圖之高峰的寬度是既定臨限值以上的情況,判斷在被檢查物S存在有缺陷。此臨限值係作為檢測參數,可從外部設定。In the defect detecting unit 304 of the present embodiment, when the width of the peak of the histogram obtained from the photographic data is equal to or greater than the predetermined threshold value, it is determined that the object S is defective. This threshold is used as a detection parameter and can be set externally.

比較判定部305係針對缺陷檢測部304所檢測出之缺陷,比較在該缺陷部分之反射光之直方圖的寬度與透過光之直方圖的寬度。如上述,若透過光之直方圖之高峰的寬度比較寬,可判斷是內層缺陷,若相反,可判斷是表面缺陷。The comparison determination unit 305 compares the width of the histogram of the reflected light and the width of the histogram of the transmitted light with respect to the defect detected by the defect detecting unit 304. As described above, if the width of the peak of the histogram of transmitted light is relatively wide, it can be judged that it is an inner layer defect, and if it is reversed, it can be judged to be a surface defect.

此外,在此係根據在直方圖所出現之高峰的寬度進行缺陷檢測及種類判別,但是根據高峰之面積亦可一樣地檢測出缺陷。即,缺陷檢測部304係在存在具有既定臨限值以上之面積之高峰的情況,判斷存在有缺陷,比較判定部305係若在透過光之直方圖之高峰的面積較大,則判定是內層缺陷。Further, in this case, defect detection and type discrimination are performed based on the width of the peak appearing in the histogram, but the defect can be detected in the same manner according to the area of the peak. In other words, the defect detecting unit 304 determines that there is a defect when there is a peak having an area equal to or greater than a predetermined threshold, and the comparison determining unit 305 determines that the area is large when the peak of the histogram of the transmitted light is large. Layer defects.

根據在本實施形態所採用之直方圖的缺陷檢測及種類判別係可用以替代在第1~第4實施形態之根據亮度比的缺陷檢測及種類判別,但是亦可將兩手法組合。藉由同時使用這兩手法,可實現精度更佳之缺陷檢測及種類判別。The defect detection and the type discrimination based on the histogram used in the present embodiment can be used instead of the defect detection and the type determination based on the luminance ratios in the first to fourth embodiments, but the two methods can be combined. By using both methods at the same time, it is possible to achieve better defect detection and type discrimination.

<其他><Other>

在上述之說明,舉例說明了作為被檢查物在液晶顯示器等所使用之偏光薄膜,但是因為只要根據反射光強度或透過光強度進行處理即可,所以不是根據亮度比,而是根據亮度值本身,亦可進行相同的處理。In the above description, a polarizing film used as a test object in a liquid crystal display or the like is exemplified, but since it is only required to be processed according to the intensity of reflected light or the intensity of transmitted light, it is not based on the brightness ratio but on the brightness value itself. The same processing can be performed.

又,在上述之說明,根據反射光或透過光之亮度比,進行缺陷之檢測或缺陷種類的判別,但是因為只要根據反射光或透過光強度進行處理即可,所以根據亮度值本身而不是亮度比,亦可進行相同之處理。Further, in the above description, the detection of the defect or the determination of the type of the defect is performed based on the luminance ratio of the reflected light or the transmitted light. However, since the processing is performed based on the reflected light or the transmitted light intensity, the brightness value itself is not the brightness. The same can be done.

又,在上述所說明之光學系統配置只不過為一例,只要是該業者,將可易於理解可在本發明之技術性構想的範圍內進行各種變形。例如,在使用2台相機之第1及第2實施形態,將各個相機對被檢查物配置於相同側,但是未必要作成這種方式。只要可拍攝反射光與透過光,任何配置都可。例如,作為第1實施形態之變形例,如第12圖(a)所示,亦可作成將光源101與光源102配置於被檢查物S之相同側,並將相機201與相機202配置於被檢查物S之不同側。同樣地,作為第2實施形態之變形例,亦可採用如第12圖(b)所示的構成。Further, the optical system configuration described above is merely an example, and various modifications can be made without departing from the scope of the technical idea of the present invention. For example, in the first and second embodiments in which two cameras are used, the respective objects are placed on the same side with respect to the object to be inspected, but this is not necessarily the case. Any configuration is acceptable as long as it can take both reflected and transmitted light. For example, as a modification of the first embodiment, as shown in Fig. 12(a), the light source 101 and the light source 102 may be disposed on the same side of the object S, and the camera 201 and the camera 202 may be placed in the same. Check the different sides of the object S. Similarly, as a modification of the second embodiment, a configuration as shown in Fig. 12(b) may be employed.

300‧‧‧信號處理單元300‧‧‧Signal Processing Unit

301‧‧‧反射光學系統信號處理部301‧‧‧Reflex Optical System Signal Processing Department

302‧‧‧透過光學系統信號處理部302‧‧‧Transmission through the optical system signal processing department

303‧‧‧位置對準處理部303‧‧‧ Position Alignment Processing Department

304‧‧‧缺陷檢測部304‧‧‧Defect Detection Department

305‧‧‧比較判定部305‧‧‧Comparative Decision Department

306‧‧‧輸出部306‧‧‧Output Department

201‧‧‧相機201‧‧‧ camera

202‧‧‧相機202‧‧‧ camera

102‧‧‧光源102‧‧‧Light source

101a‧‧‧光101a‧‧‧Light

102a‧‧‧光102a‧‧‧Light

101b‧‧‧擴散反射光101b‧‧‧Diffuse reflected light

102b‧‧‧間接透過光102b‧‧‧Indirect transmission of light

101‧‧‧光源101‧‧‧Light source

S‧‧‧被檢查物S‧‧‧Inspected objects

Claims (12)

一種缺陷檢查裝置,係檢查薄片狀之被檢查物之缺陷的缺陷檢查裝置,其包含:第1照射手段,係對該被檢查物照射第1光;第2照射手段,係對該被檢查物照射第2光;第1、第2攝影手段,係取得因應於該第1光之反射光及該第2光之透過光的強度的攝影資料;及檢測手段,係根據藉該第1、第2攝影手段所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷,該第1照射手段係從該被檢查物之一側對該被檢查物照射該第1光,該第2照射手段係從與該一側相異之另一側對該被檢查物照射該第2光,該第1、第2攝影手段係配置於該被檢查物之該一側,該第1攝影手段係以射入該第1光的反射光之方式配置,該第2照射手段與該第2攝影手段之位置關係設成該第2光的正透過光不射入而是間接透過光射入該第2攝影手段的位置關係。 A defect inspection device for inspecting a defect of a sheet-like object to be inspected includes: a first irradiation means for irradiating the object with the first light; and a second irradiation means for the object to be inspected Irradiating the second light; the first and second imaging means obtain imaging data corresponding to the intensity of the reflected light of the first light and the transmitted light of the second light; and detecting means are based on the first and the second (2) The intensity of the reflected light and the transmitted light at the same position of the object to be inspected by the photographing means detects an inner layer defect of the test object, and the first irradiation means is from one side of the object to be inspected The first light is irradiated onto the inspection object, and the second irradiation means irradiates the inspection object with the second light from the other side different from the one side, and the first and second imaging means are disposed on the second light. On the one side of the object to be inspected, the first imaging means is disposed to reflect the reflected light of the first light, and the positional relationship between the second irradiation means and the second imaging means is set to be the second light. The positional relationship of the second imaging means is transmitted through the light indirectly through the light. 如請求項1之缺陷檢查裝置,其中該第2光係藍光。 The defect inspection device of claim 1, wherein the second light is blue light. 一種缺陷檢查裝置,係檢查薄片狀之被檢查物之缺陷的缺陷檢查裝置,其包含: 第1照射手段,係對該被檢查物照射第1光;第2照射手段,係對該被檢查物照射第2光;第1、第2攝影手段,係取得因應於該第1光之反射光及該第2光之透過光的強度的攝影資料;及檢測手段,係根據藉該第1、第2攝影手段所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷,該第1照射手段係從該被檢查物之一側對該被檢查物照射該第1光,該第2照射手段係從與該一側相異之另一側對該被檢查物照射該第2光,該第1、第2攝影手段係配置於該被檢查物之該一側,該第1攝影手段係以射入該第1光的反射光之方式配置,該第2照射手段與該第2攝影手段之位置關係設成該第2光的正透過光射入該第2攝影手段的位置關係,在該第2照射手段與該被檢查物之間設置第1偏光濾光器、及在該第2攝影手段與該被檢查物之間設置第2偏光濾光器,且該第1與該第2偏光濾光器以透過軸彼此正交之方式配置。 A defect inspection device is a defect inspection device for inspecting a defect of a sheet-like object to be inspected, comprising: The first irradiation means irradiates the first light with the first light, and the second irradiation means irradiates the second light with the second light, and the first and second imaging means obtain the reflection corresponding to the first light. The photographic data of the intensity of the light and the transmitted light of the second light; and the detecting means are the reflected light and the transmitted light at the same position of the object to be inspected obtained by the first and second imaging means Intensity is detected in the inner layer defect of the test object, and the first irradiation means irradiates the test object with the first light from one side of the test object, and the second irradiation means is from the one side The other side of the object is irradiated with the second light, and the first and second imaging means are disposed on the side of the object to be inspected, and the first imaging means is configured to inject the first light. In a manner of reflecting light, a positional relationship between the second irradiation means and the second imaging means is set such that a position of the second light passing through the second imaging means is incident on the second imaging means, and the second irradiation means and the A first polarizing filter is disposed between the inspection objects, and a second bias is disposed between the second imaging means and the inspection object. Filter, and the first and the second polarization filter in a manner orthogonal to the transmission axis of another configuration. 如請求項1至3中任一項之缺陷檢查裝置,其中 該第1光之照射位置及該第2光之照射位置係不同,該攝影手段係由拍攝該第1光之照射位置的相機與拍攝該第2光之照射位置之相機的2台相機所構成。 The defect inspection device according to any one of claims 1 to 3, wherein The first light irradiation position and the second light irradiation position are different, and the imaging means is composed of two cameras that capture the irradiation position of the first light and the camera that captures the irradiation position of the second light. . 如請求項1至3中任一項之缺陷檢查裝置,其中該第1光之照射位置及該第2光之照射位置係相同,該第1光及該第2光係彼此波長不同的光;該攝影手段係一彩色相機,其具有分別接收不同波長光之複數個線狀受光元件。 The defect inspection device according to any one of claims 1 to 3, wherein the first light irradiation position and the second light irradiation position are the same, and the first light and the second light are different in wavelength from each other; The photographing means is a color camera having a plurality of linear light receiving elements that respectively receive light of different wavelengths. 如請求項1至3中任一項之缺陷檢查裝置,其中該第1光之照射位置及該第2光之照射位置係相同,該第1光及該第2光係彼此波長不同的光;該攝影手段係一彩色相機,其具有對射入該攝影手段之光進行分光的分光元件、與分別取得分光後之光強度之複數個受光元件。 The defect inspection device according to any one of claims 1 to 3, wherein the first light irradiation position and the second light irradiation position are the same, and the first light and the second light are different in wavelength from each other; The photographing means is a color camera having a spectroscopic element that splits light incident on the photographing means and a plurality of light receiving elements that respectively obtain light intensity after splitting. 如請求項1至3中任一項之缺陷檢查裝置,其中該第2光係藍光;該第1光係紅光或綠光。 The defect inspection device according to any one of claims 1 to 3, wherein the second light is blue light; the first light is red light or green light. 如請求項4之缺陷檢查裝置,其中更具有位置對準手段,該位置對準手段係進行關於該反射光之攝影資料、與關於該透過光之攝影資料的位置對準; 該檢測手段係根據位置對準後之攝影資料,檢測出該被檢查物的內層缺陷。 The defect inspection device of claim 4, further comprising a position aligning means for performing aligning with the photographic material of the reflected light and the photographic material relating to the transmitted light; The detecting means detects the inner layer defect of the object to be inspected based on the photographic data after the alignment. 如請求項1至3中任一項之缺陷檢查裝置,其中該檢測手段係具有:缺陷檢測手段,係根據該反射光之強度檢測出缺陷,而且根據該透過光之強度檢測出缺陷;及判別手段,係判定該透過光之強度比該反射光之強度更大的缺陷是內層缺陷。 The defect inspection device according to any one of claims 1 to 3, wherein the detection means has: a defect detecting means for detecting a defect based on the intensity of the reflected light, and detecting a defect based on the intensity of the transmitted light; and discriminating The means is that the defect that the intensity of the transmitted light is greater than the intensity of the reflected light is an inner layer defect. 一種缺陷檢查方法,係檢查薄片狀之被檢查物之缺陷的缺陷檢查方法,其包含:照射步驟,係對該被檢查物照射第1光及第2光;攝影步驟,係取得因應於該第1光之反射光及該第2光之透過光之強度的攝影資料;及檢測步驟,係根據在該攝影步驟所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷;在該攝影步驟,拍攝該第2光之間接透過光,從該被檢查物之一側對該被檢查物照射該第1光;從與該一側相異之另一側對該被檢查物照射該第2光;將第1、第2攝影部配置於該被檢查物之該一側,以射入該第1光的反射光之方式配置該第1攝影手段,以該第2光的正透過光不射入而是間接透過光射 入之方式配置該第2攝影手段。 A defect inspection method for inspecting a defect of a sheet-like object to be inspected, comprising: an irradiation step of irradiating the object with the first light and the second light; and a photographing step of obtaining the first The photographic data of the intensity of the reflected light of the light and the transmitted light of the second light; and the detecting step of the reflected light and the intensity of the transmitted light at the same position of the object to be inspected obtained in the photographing step Detecting an inner layer defect of the inspection object; in the photographing step, the second light is photographed to transmit the transmitted light, and the first light is irradiated to the inspection object from one side of the inspection object; The other side of the side is irradiated with the second light, and the first and second imaging units are disposed on the side of the test object, and are arranged to enter the reflected light of the first light. In the first imaging means, the positive transmitted light of the second light is not incident but indirectly transmitted through the light. The second photographing means is arranged in the manner of entering. 一種缺陷檢查方法,係檢查薄片狀之被檢查物之缺陷的缺陷檢查方法,其包含:照射步驟,係對該被檢查物照射第1光及第2光;攝影步驟,係取得因應於該第1光之反射光及該第2光之透過光之強度的攝影資料;及檢測步驟,係根據在該攝影步驟所取得之在該被檢查物之相同位置之該反射光及該透過光的強度,檢測出該被檢查物之內層缺陷,在該攝影步驟拍攝該第2光之正透過光,從該被檢查物之一側對該被檢查物照射該第1光;從與該一側相異之另一側對該被檢查物照射該第2光;將第1、第2攝影部配置於該被檢查物之該一側,以射入該第1光的反射光之方式配置該第1攝影手段,以該第2光的正透過光射入該第2攝影手段之方式配置該第2攝影手段,該第2光為,在該第2光經由第1偏光濾光器對該被檢查物照射並透過該被檢查物後,經由透過軸是與該第1偏光濾光器正交之第2偏光濾光器而被拍攝。 A defect inspection method for inspecting a defect of a sheet-like object to be inspected, comprising: an irradiation step of irradiating the object with the first light and the second light; and a photographing step of obtaining the first The photographic data of the intensity of the reflected light of the light and the transmitted light of the second light; and the detecting step of the reflected light and the intensity of the transmitted light at the same position of the object to be inspected obtained in the photographing step Detecting an inner layer defect of the object to be inspected, and capturing the positive light transmitted by the second light in the photographing step, and irradiating the object with the first light from one side of the object to be inspected; The other side of the object is irradiated with the second light; the first and second imaging units are disposed on the side of the object to be inspected, and the reflected light of the first light is incident on the object. In the first imaging means, the second imaging means is disposed such that the positive transmitted light of the second light is incident on the second imaging means, and the second light is applied to the second light via the first polarizing filter. After the object to be inspected is irradiated and transmitted through the object to be inspected, the first polarizing filter is passed through the transmission axis. The second quadrature polarization filters that have been taken. 如請求項10或11之缺陷檢查方法,其中該缺陷檢測步驟係由以下之步驟所構成:檢測步驟,係根據該第1光之反射光強度檢測出缺陷; 檢測步驟,係根據該第2光之透過光強度檢測出缺陷;及判定步驟,係將該第2光之透過光強度比該第1光之反射光強度更大的缺陷判定為內層缺陷。The defect inspection method of claim 10 or 11, wherein the defect detection step is constituted by a step of detecting a defect according to the intensity of the reflected light of the first light; The detecting step detects a defect based on the transmitted light intensity of the second light, and the determining step determines that the defect having the transmitted light intensity of the second light greater than the reflected light intensity of the first light is an inner layer defect.
TW103100583A 2013-02-21 2014-01-08 Defect inspection device and defect inspection method TWI498546B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013032332A JP5825278B2 (en) 2013-02-21 2013-02-21 Defect inspection apparatus and defect inspection method

Publications (2)

Publication Number Publication Date
TW201435331A TW201435331A (en) 2014-09-16
TWI498546B true TWI498546B (en) 2015-09-01

Family

ID=51367872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103100583A TWI498546B (en) 2013-02-21 2014-01-08 Defect inspection device and defect inspection method

Country Status (3)

Country Link
JP (1) JP5825278B2 (en)
CN (1) CN104007116B (en)
TW (1) TWI498546B (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104483319B (en) * 2014-10-08 2017-06-16 清华大学 Sandwich biscuits defect detecting device and method
JP6500518B2 (en) * 2015-03-10 2019-04-17 オムロン株式会社 Sheet inspection device
JP6541491B2 (en) 2015-07-29 2019-07-10 株式会社Screenホールディングス Falling determination method, falling determination device and discharge device
JP6784540B2 (en) * 2015-09-30 2020-11-11 日東電工株式会社 Polarizing plate inspection method and inspection equipment
JP6604805B2 (en) * 2015-09-30 2019-11-13 日東電工株式会社 Polarizer inspection method and polarizing plate manufacturing method
CN108351310B (en) * 2015-10-28 2021-05-18 日本碍子株式会社 End face inspection method and end face inspection device of honeycomb structure
CN206583816U (en) * 2015-12-15 2017-10-24 住友化学株式会社 Defect inspection filming apparatus, defect inspecting system and film manufacturing device
WO2017104575A1 (en) * 2015-12-16 2017-06-22 株式会社リコー Testing system and testing method
TWI577986B (en) * 2016-01-07 2017-04-11 Aperture detection system
JP2018009800A (en) * 2016-07-11 2018-01-18 住友化学株式会社 Defect inspection imaging device, defect inspection system, film manufacturing apparatus, defect inspection imaging method, defect inspection method, and film manufacturing method
JP6759812B2 (en) * 2016-07-29 2020-09-23 オムロン株式会社 Defect inspection equipment and defect inspection method
CN107688248A (en) * 2016-08-05 2018-02-13 豪威科技股份有限公司 liquid crystal on silicon test platform
JP2018059772A (en) * 2016-10-04 2018-04-12 オムロン株式会社 Sheet inspection device
JP7005930B2 (en) * 2017-04-21 2022-01-24 オムロン株式会社 Sheet inspection equipment and inspection system
JP7045147B2 (en) * 2017-07-19 2022-03-31 Juki株式会社 sewing machine
JP6924645B2 (en) * 2017-07-31 2021-08-25 日東電工株式会社 Polarizing film imaging device, inspection device, and inspection method
JP6948215B2 (en) * 2017-10-11 2021-10-13 住友化学株式会社 Defect inspection equipment, defect inspection method, and film manufacturing method
US11060980B2 (en) 2017-11-29 2021-07-13 Taiwan Semiconductor Manufacturing Co., Ltd. Broadband wafer defect detection
CN108362702A (en) * 2017-12-14 2018-08-03 北京木业邦科技有限公司 A kind of defect of veneer detection method, system and equipment based on artificial intelligence
CN108174098A (en) * 2017-12-29 2018-06-15 武汉大学 A dust detection device and method
AT521297B1 (en) * 2018-05-24 2021-06-15 Eyyes Gmbh Method for the detection of discontinuities in a translucent workpiece
JP7173763B2 (en) * 2018-06-20 2022-11-16 株式会社日本マイクロニクス Image generation device and image generation method
JP7063181B2 (en) * 2018-08-09 2022-05-09 株式会社Sumco Wafer inspection method and inspection equipment
CN109900716A (en) * 2019-04-12 2019-06-18 中民筑友科技投资有限公司 A kind of system and method detecting PC component presentation quality
CN109901355B (en) * 2019-04-19 2020-11-10 深圳市当智科技有限公司 Automatic focusing method of diversified projector based on contrast and histogram
JP7298333B2 (en) * 2019-06-25 2023-06-27 オムロン株式会社 Visual inspection management system, visual inspection management device, visual inspection management method and program
JP7293907B2 (en) * 2019-06-25 2023-06-20 オムロン株式会社 Visual inspection management system, visual inspection management device, visual inspection management method and program
TWI712788B (en) * 2019-11-14 2020-12-11 勝麗國際股份有限公司 Defect detection method for sensor package structure
JP6901806B1 (en) * 2020-05-22 2021-07-14 株式会社メック Defect inspection equipment and defect inspection method
TWI762271B (en) 2020-08-13 2022-04-21 日商名南製作所股份有限公司 Defect detection system, defect detection method and defect detection program for panel wood
CN115989407A (en) * 2020-08-31 2023-04-18 日东电工株式会社 Inspection method of optical laminated body
CN112945984A (en) * 2021-02-01 2021-06-11 深圳市华星光电半导体显示技术有限公司 Detection method and detection device for display panel
KR20230067759A (en) * 2021-11-08 2023-05-17 삼성디스플레이 주식회사 optical inspection device and inspecting method using the same
US12260534B2 (en) 2022-04-26 2025-03-25 Communications Test Design, Inc. Method to detect camera blemishes
CN116872032B (en) * 2023-08-07 2025-10-24 浙江先导微电子科技有限公司 Boron nitride processing and polishing device and method
WO2025215901A1 (en) * 2024-04-10 2025-10-16 コニカミノルタ株式会社 Feature point extraction method, control program, and information processing system
WO2025215902A1 (en) * 2024-04-12 2025-10-16 コニカミノルタ株式会社 Information processing system, control method, and control program

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200702656A (en) * 2005-05-25 2007-01-16 Olympus Corp Surface defect inspection apparatus
TW200834063A (en) * 2006-10-11 2008-08-16 Nitto Denko Corp Test data processing apparatus and test data processing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087163B2 (en) * 1987-05-29 1996-01-29 日本板硝子株式会社 Defect data acquisition circuit
JPH03122556A (en) * 1989-10-04 1991-05-24 Nikka Densoku Kk Method and apparatus of checking translucent sheet-like material
JPH0611457A (en) * 1992-06-26 1994-01-21 Gunze Ltd Method and device for sensing foreign matter in film
JPH08152416A (en) * 1994-09-28 1996-06-11 Toray Ind Inc Defect detecting device for sheet-shaped object
JP2000113191A (en) * 1998-10-07 2000-04-21 Nippon Avionics Co Ltd Pattern inspection equipment
JP2001165865A (en) * 1999-12-14 2001-06-22 Sony Corp Inspection method and inspection device for functional film
US7030400B2 (en) * 2003-12-30 2006-04-18 Xerox Corporation Real-time web inspection method and apparatus using combined reflected and transmitted light images
JP2006275843A (en) * 2005-03-30 2006-10-12 Nitto Denko Corp Foreign matter inspection method for insulation film for printed circuit boards
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
JP2010151479A (en) * 2008-12-24 2010-07-08 Ushio Inc Wiring pattern inspecting device
JP5225064B2 (en) * 2008-12-26 2013-07-03 花王株式会社 Inspection device
CN101887030A (en) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 Method and system for detecting defects on the surface and/or inside of a transparent substrate
KR20110026920A (en) * 2009-09-09 2011-03-16 주식회사 매크론 Defect inspection device and method of sheet
WO2012153718A1 (en) * 2011-05-12 2012-11-15 コニカミノルタホールディングス株式会社 Method for testing end face of glass sheet and device for testing end face of glass sheet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200702656A (en) * 2005-05-25 2007-01-16 Olympus Corp Surface defect inspection apparatus
TW200834063A (en) * 2006-10-11 2008-08-16 Nitto Denko Corp Test data processing apparatus and test data processing method

Also Published As

Publication number Publication date
CN104007116A (en) 2014-08-27
JP2014163694A (en) 2014-09-08
JP5825278B2 (en) 2015-12-02
TW201435331A (en) 2014-09-16
CN104007116B (en) 2017-08-08

Similar Documents

Publication Publication Date Title
TWI498546B (en) Defect inspection device and defect inspection method
CN107615049B (en) Inspection illumination device and inspection system
US7957636B2 (en) Illumination apparatus and appearance inspection apparatus including the same
JP6040930B2 (en) Surface defect detection method and surface defect detection apparatus
US9140545B2 (en) Object inspection system
JP5909751B2 (en) Flat glass foreign matter inspection apparatus and inspection method
CN105973909A (en) Sheet inspection device
KR20160090359A (en) Surface defect detection method and surface defect detection device
CN110691966A (en) Inspection system and inspection method
TW201632868A (en) Substrate examination device
KR101078404B1 (en) Camera for detecting metal surface defects. Metal surface defect detection apparatus comprising a camera, and metal surface defect detection method.
CN115809978B (en) Optical inspection method, optical inspection program, processing device, and optical inspection device
KR20130109365A (en) Surface defect detecting apparatus and control method thereof
JP6149990B2 (en) Surface defect detection method and surface defect detection apparatus
KR20100053687A (en) Inspection method based on captured image and inspection device
TW201800744A (en) Photographic apparatus for defect inspection, defect inspection system, film manufacturing apparatus, photographing method for defect inspection, defect inspection method, and film manufacturing method
TWI786522B (en) Surface inspection device, surface inspection method, steel manufacturing method, steel quality control method, and steel manufacturing equipment
JP7413234B2 (en) Optical imaging device, optical inspection device, and optical inspection method
JP6387909B2 (en) Surface defect detection method, surface defect detection apparatus, and steel material manufacturing method
JP2012083125A (en) End face inspection device
JP2012163533A (en) Defect inspection apparatus and method for lenticular sheet
JP5787668B2 (en) Defect detection device
KR101745764B1 (en) Apparatus and Method for Optically Inspecting Surface of Plate Member
JP2007327896A (en) Inspection device
JP6870262B2 (en) Flat glass inspection method and flat glass inspection equipment