TWI497051B - An evaluation apparatus for a surface condition of a metallic material, a visibility evaluation apparatus for a transparent substrate, an evaluation program thereof, and a computer-readable recording medium on which a recording medium is recorded, and a method of detecting the same - Google Patents

Description

Evaluation device for surface state of metal material, visibility evaluation device for transparent substrate, evaluation program thereof, computer readable recording medium recorded thereon, and detection method thereof

The present invention relates to an apparatus for evaluating the surface state of a metal material, a visibility evaluation apparatus for a transparent substrate, an evaluation program thereof, and a computer readable recording medium recorded thereon.

In a small electronic device such as a smart phone or a tablet PC, a flexible printed wiring board (hereinafter referred to as FPC) is used because of the ease of wiring or the light weight. In recent years, with the high functionality of these electronic devices, the speed of signal transmission has progressed, and impedance matching in FPC has become an important factor. As a countermeasure against the impedance matching of the increase in the signal capacity, the thickening of the resin insulating layer (for example, polyimine) which becomes the base of the FPC is continually advanced. On the other hand, the FPC is processed by bonding to a liquid crystal substrate or mounting of an IC wafer, but the alignment is performed by etching a copper foil in a laminate of a copper foil and a resin insulating layer. Since the remaining resin insulating layer is formed by visually recognizing the positioning pattern, the visibility of the resin insulating layer and the surface state of the copper foil laminated on the resin insulating layer which are affected by the resin insulating layer become important.

In the method of evaluating the visibility of the resin insulating layer, Patent Document 1 observes an image taken by a CCD (charge-coupled device) camera with a resin insulating layer interposed therebetween. Further, in Patent Document 2, it is evaluated in an image photographed at an angle of 30° with respect to the horizontal plane of the resin insulating layer of the evaluation object by a CCD camera. Whether the pattern is strained and reflected.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-309336

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-001056

However, in fact, if the image is simply observed by the CCD camera as in Patent Document 1, the accuracy of the visibility evaluation is limited, and if it is not actually produced on the production line, it is impossible to determine whether or not the transparent substrate can be visually recognized. A mark provided for positioning or the like has a problem in terms of manufacturing cost. This is the same even in the case of evaluating whether or not the test pattern is strained in the image as in Patent Document 2. Further, if the accuracy of the visibility evaluation is so low, the accuracy of the evaluation of the surface state of the copper foil laminated on the resin insulating layer is also lowered.

The present invention provides an apparatus for evaluating the surface state of a metal material which can efficiently and accurately evaluate the surface state of a metal material, a visibility evaluation apparatus for a transparent substrate, an evaluation program thereof, and a computer readable recording medium recorded thereon.

The inventors of the present invention have conducted intensive research and found that after the metal material is bonded to at least one side of the transparent substrate, the metal material is removed by etching, and the metal material is removed by etching through a transparent substrate. The mark that exists behind the transparent substrate, focusing on the brightness curve near the end of the mark depicted in the observation point-luminance curve obtained from the image of the marked portion, evaluates the brightness curve, thereby not Efficiently and accurately evaluate the visibility of the transparent substrate by the type of the transparent substrate or the thickness of the transparent substrate, thereby The surface state of the metal material laminated on the transparent substrate is evaluated with high efficiency and accuracy.

The present invention, which is completed based on the above findings, is an apparatus for evaluating the surface state of a metal material, and the apparatus has the following means: a photographing means after attaching the surface of the metal material to at least one side of the transparent substrate And removing at least a part of the metal material by etching, and capturing a mark existing under the transparent substrate after the metal material is removed by etching through the transparent substrate; and observing the location-brightness curve drawing means, For the image obtained by the above-mentioned photographing, the observation point-brightness curve is prepared along the direction of the observed mark across the observed direction of the mark; and the surface condition evaluation means of the metal material is In the observation point-luminance graph, the visibility of the transparent substrate is evaluated based on the slope of the luminance curve generated from the end portion of the mark to the portion without the mark, and the metal material is evaluated based on the evaluation result of the visibility. Surface state; the above-mentioned metal material surface state evaluation means will be from the end of the above mark to the absence of the above-mentioned standard The difference between the top average Bt and the bottom average Bb of the luminance curve generated in part is ΔB (ΔB=Bt-Bb), and the visibility of the transparent substrate is evaluated using Sv, and based on the transparent substrate described above. The surface state of the metal material is evaluated by the evaluation result of the visibility, and the Sv is set to a value t1 indicating the position of the intersection of the brightness curve and Bt closest to the mark in the observation point-luminance curve. When the value from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt is set, the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, It is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides an apparatus for evaluating the surface state of a metal material, the apparatus having the following means: a photographing means for attaching the surface side of the surface of the metal material to at least one side of the transparent substrate And removing at least a part of the metal material by etching, and capturing a mark existing under the transparent substrate after the metal material is removed by etching through the transparent substrate; and observing the location-brightness curve drawing means, For The image obtained by the above-mentioned photographing is measured by measuring the brightness of each observation point in the direction across the observed mark to create an observation point-luminance curve; and a metal material surface state evaluation means at the above observation point - In the luminance graph, the visibility of the transparent substrate is evaluated based on the slope of the luminance curve generated from the end portion of the mark to the portion without the mark, and the surface state of the metal material is evaluated based on the evaluation result of the visibility; The surface condition evaluation means of the metal material uses ΔB (ΔB=Bt-Bb) and Sv to evaluate the visibility of the transparent substrate, and evaluates the surface state of the metal material based on the evaluation result of the visibility of the transparent substrate. The above ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the observation point - In the luminance graph, the value indicating the position of the intersection of the luminance curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed at the intersection of the self-luminance curve and Bt. In the depth range up to 0.1 ΔB based on Bt, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In still another aspect, the present invention is a program for causing a computer to function as an evaluation device for the surface state of the metal material of the present invention.

In another aspect, the invention is a computer readable recording medium on which the program of the invention is recorded.

In another aspect, the present invention is a method for evaluating the surface state of a metal material by bonding at least a portion of the metal material by etching after bonding the surface of the metal material to at least one side of the transparent substrate. And marking the underside of the transparent substrate after the metal material is removed by etching through the transparent substrate, and the image obtained by the above-mentioned photographing is observed along the traverse. The direction is measured by measuring the brightness of each observation point to create an observation point-brightness curve. In the above observation point-luminance curve, the slope of the brightness curve generated from the end portion of the mark to the portion without the mark is evaluated. Determining the visibility of the transparent substrate, and evaluating the surface state of the metal material based on the evaluation result of the visibility; the surface state of the metal material is evaluated from the end of the mark to the portion without the mark The difference between the top average value Bt of the luminance curve and the bottom average value Bb is ΔB (ΔB = Bt - Bb), and the visibility of the transparent substrate is evaluated using Sv, and based on the evaluation of the visibility of the transparent substrate described above. As a result, the surface state of the metal material was evaluated. The Sv is expressed in the observation point-luminance curve, and the value indicating the position closest to the intersection of the mark among the intersections of the brightness curve and Bt is t1, which indicates In the depth range from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt, when the value of the position closest to the intersection of the above marks in the intersection of the luminance curve and 0.1 ΔB is t2, (1) Formula is defined.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a method for evaluating the surface state of a metal material by adhering the surface side of the surface of the metal material to at least one side of the transparent substrate, and removing the metal by etching. At least a portion of the material is captured by the transparent substrate along a mark that is present under the transparent substrate after the metal material is removed by etching, and the image obtained by the above-mentioned photographing is traversed Observing the brightness of each observation point in the direction of the above-mentioned mark to prepare an observation point-brightness curve, in the above-mentioned observation place-brightness curve, the brightness generated from the end portion of the mark to the portion without the mark The slope of the curve is used to evaluate the visibility of the transparent substrate, and the surface state of the metal material is evaluated based on the evaluation result of the visibility; the surface state of the metal material is evaluated by using ΔB (ΔB=Bt-Bb) and Sv performs evaluation of the visibility of the transparent substrate, and evaluates the surface state of the metal material based on the evaluation result of the visibility of the transparent substrate The above ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the observation point - In the luminance graph, the value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the luminance curve and Bt is t1, which is expressed from the intersection of the self-luminance curve and Bt to 0.1 ΔB based on Bt. depth In the range, when the value of the position closest to the intersection of the above-mentioned marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a visual substrate evaluation device for a transparent substrate, the device comprising: a photographing means for photographing a mark existing under the transparent substrate via the transparent substrate; a graph creating means for producing an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark in the image obtained by the above-mentioned photographing; and a visual evaluation means In the above-mentioned observation point-brightness graph, the visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end portion of the mark to the portion without the mark; the visibility evaluation means will be from the mark The difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion to the portion without the above-mentioned mark is ΔB (ΔB = Bt - Bb), and the visibility is evaluated using Sv, and the above Sv system is used. In the above-mentioned observation point-luminance curve, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed in the self-brightness curve. In the depth range from Bt to Bt as the reference 0.1 ΔB, when the value of the position closest to the intersection of the above marks in the intersection of the luminance curve and 0.1 ΔB is t2, the following formula (1) Make a definition.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a visual substrate evaluation device for a transparent substrate, the device comprising: a photographing means for photographing a mark existing under the transparent substrate via the transparent substrate; a graph creating means for producing an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark in the image obtained by the above-mentioned photographing; and a visual evaluation means In the above-mentioned observation site-brightness graph, the visibility of the transparent substrate is evaluated based on the slope of the luminance curve generated from the end portion of the mark to the portion without the mark; the visibility evaluation means uses ΔB ( ΔB=Bt-Bb) and Sv are evaluated for visibility, and the above ΔB (ΔB=Bt-Bb) is derived from the above-mentioned mark The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion to the portion without the above-mentioned mark, the above Sv is in the above-mentioned observation point-brightness graph, and will represent the most intersection of the brightness curve and the Bt. The value of the position close to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the base of 0.1 ΔB, and the closest to the intersection of the brightness curve and 0.1 ΔB. When the value of the position of the intersection of the above marks is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In still another aspect, the present invention is a program for causing a computer to function as a visibility evaluation device for a transparent substrate of the present invention.

In still another aspect of the invention, a computer readable recording medium recording a program for causing a computer to function as a visibility evaluation device for a transparent substrate of the present invention.

In another aspect, the present invention is a positioning device for a laminate, which is used for positioning a laminate of a metal and a transparent substrate; and has the following means: a photographic means for the above-mentioned metal and transparent with a mark a laminated body of a substrate, the mark is imaged through the transparent substrate; and an observation point-brightness curve creating means for measuring an image obtained by the above-described photographing along a direction crossing the observed mark Observing the position-brightness curve for each brightness of the observation point; and positioning means for the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance curve Determining the position of the laminated body; the positioning means sets the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark to the portion without the mark as ΔB (ΔB=Bt -Bb), in the above-mentioned observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, It is shown in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB from Bt. When the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks is set to t2, When the Sv defined by the formula (1) is equal to or greater than a specific value, the mark is detected based on the position at which the Sv is measured. The position of the laminate of the metal and the transparent substrate is performed based on the position of the mark detected as described above.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a positioning device for a laminate, which is used for positioning a laminate of a metal and a transparent substrate; and has the following means: a photographic means for the above-mentioned metal and transparent with a mark a laminated body of a substrate, the mark is imaged through the transparent substrate; and an observation point-brightness curve creating means for measuring an image obtained by the above-described photographing along a direction crossing the observed mark Observing the position-brightness curve for each brightness of the observation point; and positioning means for the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance curve The position of the layered body is determined. The positioning means uses ΔB (ΔB=Bt-Bb) and Sv. When ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured. And positioning the laminated body of the metal and the transparent substrate based on the position of the mark detected as described above, wherein the ΔB (ΔB=Bt-Bb) is from the end of the mark to the absence of the above The difference between the top average value Bt of the brightness curve generated by the portion and the bottom average value Bb, wherein the Sv is in the above-mentioned observation point-brightness graph, and will represent the intersection of the brightness curve and the Bt closest to the above mark. The value of the position is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks. When the value is set to t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In still another aspect, the present invention is a program for causing a computer to function as a positioning device of the laminated body of the present invention.

In still another aspect, the present invention is a computer readable recording medium which records a program for causing a computer to function as a positioning device of the laminated body of the present invention.

In another aspect, the invention is a method of manufacturing a printed wiring board, the method The method comprises the steps of: positioning the printed wiring board using the positioning device of the present invention, and mounting the component on the printed wiring board positioned.

In another aspect, the present invention is a device for determining the presence or absence of a mark on a laminate of a metal and a transparent substrate, the device having the following means: a photographic means for laminating the metal and the transparent substrate having the mark a body, the mark is photographed through the transparent substrate; and an observation point-brightness curve creating means for measuring each of the observation points in a direction crossing the observed mark for the image obtained by the photographing described above Obtaining an observation point-brightness curve; and determining means for determining whether a mark exists according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance curve The determination means sets the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark as ΔB (ΔB=Bt-Bb). In the above-mentioned observation point-luminance graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is set to t1, which will be expressed in the self-luminance When the intersection of the curve and Bt reaches the depth range of 0.1 ΔB based on Bt, the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, and the following (1) When the Sv defined by the equation is equal to or greater than a specific value, it is determined that the above-mentioned flag exists.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a device for determining the presence or absence of a mark on a laminate of a metal and a transparent substrate, the device having the following means: a photographic means for laminating the metal and the transparent substrate having the mark a body, the mark is photographed through the transparent substrate; and an observation point-brightness curve creating means for measuring each of the observation points in a direction crossing the observed mark for the image obtained by the photographing described above Obtaining an observation point-brightness curve; and determining means for determining whether a mark exists according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance curve The above determination means uses ΔB (ΔB=Bt-Bb) and Sv, and becomes ΔB and Sv. When the specific value is equal to or greater than the specific value, it is determined that the mark is present, and the ΔB (ΔB = Bt - Bb) is the top average Bt and the bottom average of the brightness curve generated from the end of the mark to the portion without the mark. The difference between the values Bb and the Sv is in the observation point-luminance graph, and the value indicating the position of the intersection of the brightness curve and the Bt closest to the mark is set to t1, which is expressed in the self-luminance curve and When the value of the position of Bt is 0.1 ΔB based on Bt, and the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks is t2, the following formula (1) is performed. definition.

Sv=(△B×0.1)/(t1-t2) (1)

In still another aspect, the present invention is a program for causing a computer to function as a determination device described in the present invention.

In still another aspect, the present invention is a computer readable recording medium recording a program for causing a computer to function as a determination device described in the present invention.

In another aspect, the present invention is a device for detecting the position of a mark of a laminate of a metal and a transparent substrate, the device having the following means: a photographic means for laminating the metal and the transparent substrate having the mark a body, the mark is photographed through the transparent substrate; and an observation point-brightness curve creating means for measuring each of the observation points in a direction crossing the observed mark for the image obtained by the photographing described above Observing the position-brightness curve; and detecting means for detecting the position of the slope of the brightness curve generated from the end portion of the mark to the portion without the mark in the observation point-luminance curve The detection means sets the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark as ΔB (ΔB=Bt-Bb). In the above-mentioned observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed in the self-luminance curve. In the depth range from Bt to Bt as the reference 0.1 ΔB, when the value of the position closest to the intersection of the above marks in the intersection of the luminance curve and 0.1 ΔB is t2, the following formula (1) The defined Sv becomes specific When the value is equal to or greater than the value, the position of the mark is detected based on the position at which the Sv is measured.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a device for detecting the position of a mark of a laminate of a metal and a transparent substrate, the device having the following means: a photographic means for laminating the metal and the transparent substrate having the mark a body, the mark is photographed through the transparent substrate; and an observation point-brightness curve creating means for measuring each of the observation points in a direction crossing the observed mark for the image obtained by the photographing described above Observing a position-brightness curve; and detecting means for detecting the mark according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance curve Position: The detection means uses ΔB (ΔB = Bt - Bb) and Sv. When ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the ΔB (Δ) B=Bt-Bb) is the difference between the top average Bt and the bottom average Bb of the luminance curve generated from the end of the mark to the portion without the mark, and the above Sv is in the above view In the location-brightness graph, the value indicating the position of the intersection of the luminance curve and Bt closest to the above-mentioned mark is set to t1, which is expressed from the intersection of the self-luminance curve and Bt to the base of 0.1 ΔB based on Bt. In the depth range, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In still another aspect, the present invention is a program for causing a computer to function as a detecting device of the present invention.

In still another aspect, the present invention is a computer readable recording medium recording a program for causing a computer to function as a detecting device of the present invention.

In another aspect, the present invention is a method for evaluating the visibility of a transparent substrate, wherein the method is provided with a mark under the transparent substrate, and the mark is photographed by the photographic means across the transparent substrate, and the above-mentioned mark is taken by the above-mentioned transparent substrate. And the obtained image, along the above observed The direction of the mark is measured to determine the brightness of each observation point, and an observation point-brightness curve is prepared. In the above observation place-brightness curve, the slope of the brightness curve generated from the end portion of the mark to the portion without the mark is evaluated. The visibility of the transparent substrate; the difference between the top average Bt and the bottom average Bb of the brightness curve generated from the end of the mark to the portion without the mark is ΔB (ΔB=Bt-Bb) The Sv is used for the visibility evaluation of the transparent substrate, and the Sv is set to a value t1 indicating the position of the intersection of the brightness curve and the Bt closest to the mark in the observation point-luminance curve. When the value from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt is set, the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, It is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a method for evaluating the visibility of a transparent substrate, wherein the method is provided with a mark under the transparent substrate, and the mark is photographed by the photographic means across the transparent substrate, and the above-mentioned mark is taken by the above-mentioned transparent substrate. And obtaining the image, measuring the brightness of each observation point along the direction of the observed mark, and creating an observation point-luminance curve in the above-mentioned observation point-luminance curve according to the end from the above mark The slope of the brightness curve generated from the portion from the portion to the mark without the above-mentioned mark is evaluated for the visibility of the transparent substrate; the evaluation of the visibility of the transparent substrate is performed using ΔB (ΔB = Bt - Bb) and Sv, the above ΔB ( ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the above-mentioned observation point-luminance curve In the middle, the value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the marks is set to t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt. brightness When the value of the position closest to the intersection of the above marks in the intersection of the curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a method for evaluating the visibility of a transparent substrate by adhering at least one surface-treated surface-treated copper foil to the two sides of the transparent substrate from the side of the treated substrate. Etching and removing the copper foil on both sides, and printing the printed printed matter on the underside of the exposed transparent substrate, and photographing the printed matter through the transparent substrate by a photographing means, and obtaining an image obtained by the above-mentioned photographing by the photographing means An observation point-brightness curve is prepared by measuring the brightness of each observation point across the direction of the observed mark, and in the above-mentioned observation point-luminance curve, from the end of the mark to the absence of the above mark The slope of the brightness curve generated by the part is evaluated for the visibility of the transparent substrate; the visibility of the transparent substrate is evaluated by using ΔB (ΔB=Bt-Bb) and Sv, and the above ΔB (ΔB=Bt-Bb) Is the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion without the mark, and the Sv is in the above-mentioned observation point-brightness graph, The value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt, and the brightness curve and When the value of the position closest to the intersection of the above marks among the intersections of 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a method for positioning a laminated body, wherein the method is to position a laminate of a metal and a transparent substrate, and the laminated body of the metal and the transparent substrate has a mark, and is separated by a photographing means. The transparent substrate captures the mark, and for the image obtained by the above-mentioned photographing, the brightness of each observation point is measured along the direction of the observed mark to create an observation point-luminance curve; The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark to the portion without the above mark is set to ΔB (ΔB=Bt-Bb) in the above-mentioned observation point-brightness graph. The value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt. Curve and 0.1△B When the value of the position closest to the intersection of the above-mentioned marks is t2, when the Sv defined by the following formula (1) is equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and The positioning of the laminate of the metal and the transparent substrate is performed based on the position of the mark detected as described above.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a method for positioning a laminated body, wherein the method is to position a laminate of a metal and a transparent substrate, and the laminated body of the metal and the transparent substrate has a mark, and is separated by a photographing means. The transparent substrate captures the mark, and for the image obtained by the above-mentioned photographing, the brightness of each observation point is measured along the direction of the observed mark to create an observation point-luminance curve; using ΔB ( ΔB=Bt-Bb) and Sv, when ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the metal is transparent based on the position of the detected mark. The positioning of the laminate of the substrate, the above ΔB (ΔB=Bt-Bb) is the difference between the top average Bt and the bottom average Bb of the brightness curve generated from the end of the mark to the portion without the mark, The Sv is set in the observation point-luminance graph, and the value indicating the position closest to the intersection of the mark among the intersections of the brightness curve and Bt is t1, and is expressed at the intersection of the self-luminance curve and Bt. Bt In the depth range from the reference of 0.1 ΔB, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a method of locating a printed wiring board, wherein the method is to position a printed wiring board having an insulating resin board and a circuit provided on the insulating resin board, and the above is interposed by a photographing means The resin captures the above-mentioned circuit, and for the image obtained by the above-mentioned photographing, the brightness of each observation point is measured along the direction of the observed circuit, thereby producing an observation point-luminance curve; The difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion to the portion without the above circuit is set to ΔB (ΔB) =Bt-Bb), in the above-mentioned observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned circuit is set to t1, which will be expressed in the self-luminance curve and Bt. When the value of the intersection to the position where the intersection of the luminance curve and 0.1 ΔB is closest to the intersection of the above-mentioned circuits is t2, the SV is defined by the following formula (1). When the value is equal to or greater than a specific value, the position of the circuit is detected based on the position at which the Sv is measured, and the position of the printed wiring board is performed based on the position of the detected circuit.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention provides a method of locating a printed wiring board, wherein the method is to position a printed wiring board having an insulating resin board and a circuit provided on the insulating resin board, and the above is interposed by a photographing means Resin photographing the above-mentioned circuit, and measuring the brightness of each observation point along the direction of the above-mentioned circuit across the image obtained by the above-mentioned photographing to produce an observation point-luminance curve; using ΔB (ΔB) =Bt-Bb) and Sv, when ΔB and Sv are equal to or greater than a specific value, the position of the circuit is detected based on the position at which the Sv is measured, and the position of the printed wiring board is determined based on the position of the detected circuit. The above-mentioned ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the above circuit to the portion without the above-mentioned circuit, and the above Sv is in the above observation In the location-brightness graph, the value indicating the position of the intersection of the luminance curve and Bt closest to the above circuit is set to t1, which will be expressed from the intersection of the self-luminance curve and Bt to the reference of Bt 0.1 ΔB. Within the depth stop, the brightness curve and the intersection of the 0.1 △ B value closest to the position of the intersection point of the circuit is set to t2, is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect of the invention, there is provided a method for determining whether a mark of a layer of a metal and a transparent substrate is present, wherein the layer of the metal and the transparent substrate has a mark, and the transparent layer is separated by a photographing means The substrate is photographed with the above-mentioned marks, and for the image obtained by the above-described photographing, each observation point is measured along the direction crossing the observed mark. Observing the position-brightness curve of the brightness; the difference between the top average Bt and the bottom average Bb of the brightness curve generated from the end of the mark to the portion without the mark is set to ΔB (ΔB= Bt-Bb), in the above-mentioned observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed at the intersection of the self-luminance curve and Bt. When the value of the position closest to the intersection of the above marks in the intersection of the luminance curve and 0.1 ΔB is t2 in the depth range from 0.1 ΔB to Bt, the Sv defined by the following formula (1) becomes When the value is equal to or greater than the specific value, it is determined that the above-mentioned flag exists.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect of the invention, there is provided a method for determining whether a mark of a layer of a metal and a transparent substrate is present, wherein the layer of the metal and the transparent substrate has a mark, and the transparent layer is separated by a photographing means The substrate is photographed with the above-mentioned mark, and for the image obtained by the above-mentioned photographing, the observation point-brightness curve is prepared by measuring the brightness of each observation point in the direction across the observed mark; using ΔB (Δ) B=Bt-Bb) and Sv, when ΔB and Sv are equal to or greater than a specific value, it is determined that the mark exists, and the ΔB (ΔB=Bt-Bb) is from the end of the mark to the absence of the above The difference between the top average value Bt of the brightness curve generated by the portion of the mark and the bottom average value Bb, wherein the Sv is in the above-mentioned observation point-brightness graph, and will represent the intersection of the brightness curve and the Bt closest to the above mark. The value of the position is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks. Value setting When it is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a detection method for detecting a position of a mark of a metal and a transparent substrate, wherein the laminated body of the metal and the transparent substrate has a mark and is separated by a photographic means. The transparent substrate captures the mark, and for each image obtained by the above-mentioned photographing, each observation is measured along a direction crossing the observed mark The observation point-brightness curve is produced by the brightness of the dots; the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the above mark is set to ΔB (ΔB) =Bt-Bb), in the above-mentioned observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed in the self-luminance curve and Bt When the intersection point is in the depth range from 0.1 ΔB based on Bt, and the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, the Sv defined by the following formula (1) When the value is equal to or greater than the specific value, the position of the mark is detected based on the position at which the Sv is measured.

Sv=(△B×0.1)/(t1-t2) (1)

In another aspect, the present invention is a detection method for detecting a position of a mark of a metal and a transparent substrate, wherein the laminated body of the metal and the transparent substrate has a mark and is separated by a photographic means. The transparent substrate captures the mark, and for the image obtained by the above-mentioned photographing, the brightness of each observation point is measured along the direction of the observed mark to create an observation point-luminance curve; using ΔB (ΔB=Bt-Bb) and Sv, when ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the ΔB (ΔB=Bt-Bb) is The difference between the top mean value Bt and the bottom mean value Bb of the brightness curve generated by the end portion of the mark from the portion not marked, the Sv is expressed in the above-mentioned observation point-brightness graph, and the brightness curve and Bt are indicated. The value of the position of the intersection point closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the intersection of the brightness curve and 0.1 ΔB. Closest to The position of the intersection point of the value of said set of labeled t2, a defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

According to the present invention, the surface state of the metal material can be evaluated with high efficiency and accuracy.

10‧‧‧Evaluation device for the surface state of copper foil

11‧‧‧Photography

12‧‧‧Computer (observation location - means for producing brightness curve, means for evaluating surface state of copper foil, smoothing means)

13‧‧‧ Display means

14‧‧‧Lighting means

15‧‧‧ platform

16‧‧‧ mark

17‧‧‧Transparent substrate

20‧‧‧Layer-positioning device

21‧‧‧Photography

22‧‧‧Computer (observation location - means of brightness curve creation, positioning means, smoothing means)

23‧‧‧ Display means

24‧‧‧Lighting means

25‧‧‧ platform

26‧‧‧ mark

27‧‧‧Layer

Fig. 1 is a schematic view showing an apparatus for evaluating the surface state of a copper foil according to an embodiment of the present invention.

Fig. 2 is a flow chart showing a method of evaluating the surface state of the copper foil according to the embodiment of the present invention.

Fig. 3 is a schematic view showing Bt and Bb when the mark width is about 1.3 mm.

Fig. 4 is a schematic view showing Bt and Bb when the mark width is about 0.3 mm.

Figure 5 is a schematic diagram defining k1 and k2.

Fig. 6 is a schematic view showing a method of measuring the configuration of the photographing means and the method of measuring the slope of the luminance curve when evaluating the slope of the luminance curve when the mark width is 0.1 to 0.4 mm.

Fig. 7 is a schematic view showing a method of measuring the configuration of the imaging means and the slope of the luminance curve when evaluating the slope of the luminance curve when the mark width is 1.0 to 2.0 mm.

Fig. 8 is a flow chart showing a method for evaluating the visibility of a transparent substrate according to an embodiment of the present invention.

Fig. 9 is a schematic view showing a positioning device for a laminated body according to an embodiment of the present invention.

Fig. 10 is a flow chart showing a method of positioning a laminated body according to an embodiment of the present invention.

The apparatus for evaluating the surface state of the metal material of the present invention, the method for evaluating the surface state of the metal material, the evaluation program for the surface state of the metal material, and the recording medium will be described in detail using the drawings. The metal material to be evaluated in the present invention includes a metal foil, a metal plate, and a metal strip.

Moreover, examples of the metal foil, the metal plate, and the metal strip include copper foil, copper plate, copper bar, aluminum foil, aluminum plate, aluminum strip, aluminum alloy foil, aluminum alloy plate, aluminum alloy strip, nickel foil, nickel plate, and nickel strip. , nickel alloy foil, nickel alloy plate, nickel alloy strip, zinc foil, zinc plate, zinc strip, zinc alloy foil, zinc alloy plate, zinc alloy strip, iron foil, iron plate, iron bar, iron alloy foil, iron alloy plate, ferroalloy Strip, stainless steel foil, stainless steel sheet, stainless steel strip, mild steel foil, soft steel sheet, mild steel strip, Fe-Ni alloy foil, Fe-Ni alloy sheet, Fe-Ni alloy strip or nickel silver foil, nickel silver plate, nickel silver strip, and the like.

Specific examples of the aluminum foil, the aluminum plate, and the aluminum strip are aluminum foils and aluminum sheets represented by the alloy numbers 1085, 1080, 1070, 1050, 1100, 1200, 1N00, and 1N30 as described in JIS H4000: 99.00% by mass or more. , aluminum strips, etc.

Specific examples of the nickel foil, the nickel plate, and the nickel strip are Ni (Ni) foil, nickel plate, nickel strip, etc., which are represented by the alloy numbers NW2200 and NW2201, and Ni: 99.0 mass% or more.

Examples of the stainless steel foil, the stainless steel sheet, and the stainless steel strip include a stainless steel foil, a stainless steel sheet, a stainless steel strip, and the like which are composed of any of SUS301, SUS304, SUS316, SUS430, and SUS631 (both JIS specifications).

Examples of the soft steel foil, the soft steel sheet, and the soft steel strip include mild steel having a carbon content of 0.15% by mass or less. Further, a soft steel foil, a soft steel plate, a mild steel bar or the like which is produced from a steel sheet described in JIS G3141 can be cited.

Examples of the Fe-Ni alloy foil, the Fe-Ni alloy sheet, and the Fe-Ni alloy strip include 35 to 85% by mass of Ni, and the remainder is composed of Fe and unavoidable impurities, specifically, JIS C2531. An Fe-Ni alloy foil, an Fe-Ni alloy sheet, an Fe-Ni alloy strip, or the like, which is produced from an Fe-Ni alloy, is described.

Examples of the copper foil, the copper plate, and the copper strip include an electrolytic copper foil, an electrolytic copper plate, an electrolytic copper strip or a rolled copper foil, a rolled copper plate, a rolled copper strip, a copper foil produced by dry plating such as vapor deposition, or the like. Copper plate, copper strip, etc. The rolled copper foil, the rolled copper plate, and the rolled copper strip also contain more than one type of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V, B, Copper alloy foil, copper alloy plate, and copper alloy strip of elements such as Co. When the concentration of the elements is increased (for example, the total amount is 10% by mass or more), the electrical conductivity is lowered. The electrical conductivity of the rolled copper foil, the rolled copper plate, and the rolled copper strip is, for example, 50% IACS or more, for example, 60% IACS or more, for example, 80% IACS or more. Further, a copper foil, a copper plate, a copper strip, or the like produced by using copper (JIS H3100 C1100) or oxygen-free copper (JIS H3100 C1020) is also included in the rolled copper foil.

The metal material to be evaluated in the present invention may not be a metal foil, a metal plate, or a metal strip. The thickness, width, and size of the metal material to be evaluated in the present invention are not particularly limited, and may be any metal material having a thickness, a width, and a size. For example, the thickness of the metal material may be 1 μm to 1 m. In the present invention, a metal material having a thickness of 300 μm or less is used as a metal foil, and a metal material having a thickness of more than 300 μm is used as a metal plate. Further, the term "metal strip" as used in the present invention means a metal foil or a metal strip having a certain length. For example, in the present invention, the length of the metal strip has a length of, for example, 200 mm or more, or a length of 500 mm or more.

In the present embodiment, a case where a copper foil is used as a metal material to be evaluated is exemplified. Hereinafter, an evaluation device for the surface state of the copper foil, a method for evaluating the surface state of the copper foil, and a surface state of the copper foil are used. The evaluation program and the recording medium are explained in detail.

(Evaluation device for surface state of copper foil, evaluation method of surface state of copper foil, evaluation program of surface state of copper foil, and recording medium)

Fig. 1 is a schematic view showing an apparatus 10 for evaluating the surface state of a copper foil according to an embodiment of the present invention. The apparatus 10 for evaluating the surface state of the copper foil according to the embodiment of the present invention includes: the photographing means 11 for photographing the mark 16 existing under the transparent substrate 17 provided on the stage 15 via the transparent substrate 17, and the computer 12, It performs various processing based on the image signal from the photographing means 11; the display means 13 displays a specific image based on various signals from the computer 12, and the illumination means 14, which are transparent substrates 17 and marks 16 on the platform. Irradiation light. The transparent substrate 17 is not particularly limited, and may be a resin substrate such as glass or polyimide. Further, the term "transparent" as used in the present invention also includes light transmissivity.

Further, the mark in the present invention may be a mark printed on a printed matter such as paper, and may be in any form as long as it is a mark to be marked. Further, the mark may be a part of a metal material formed by etching. Specifically, for example, when the metal material is a copper foil, it may be a copper wiring formed by etching. Further, the mark may be a printed matter or a metal, and may be an inorganic substance or an organic substance as long as it is a mark. Furthermore, the mark can also It is a circuit and/or a part of a printed wiring board. If the mark is linear, it is easy to produce an observation point-luminance curve by measuring the brightness of each observation point in the direction across the observed mark for the image obtained by photographing, which is preferable. Further, the linear mark can be provided, for example, by bonding the copper foil to the transparent substrate 17, and then etching the copper foil into a linear shape.

The flexible printed wiring board (FPC) is processed by bonding to a liquid crystal substrate or mounting of an IC chip, but the positional alignment at this time is a resin remaining after being etched through the copper foil that has passed through the copper clad laminate. Since the insulating layer is formed by visually recognizing the positioning pattern, the visibility of the resin insulating layer becomes important. Further, it is necessary to evaluate the surface state of the copper foil which affects the visibility of the resin insulating layer. In order to perform high-efficiency and accurate visual evaluation of the resin insulating layer and evaluation of the surface state of the copper foil, the transparent substrate is obtained by etching the copper foil after bonding the copper foil to at least one surface of the transparent substrate. Made from at least a portion of the foil. Further, the transparent substrate may be formed by bonding the copper foil to at least one surface of the transparent substrate and then removing all of the copper foil by etching. Further, in the case where the copper foil is a surface-treated copper foil, the surface-treated copper foil obtained by subjecting at least one surface to a surface treatment such as roughening treatment is bonded to the transparent substrate from at least the surface side of the surface treatment such as roughening treatment. After a surface, it is produced by etching at least a part of the copper foil. Further, the transparent substrate may be formed by bonding the copper foil to at least one surface of the transparent substrate and then removing all of the copper foil by etching. Here, the thickness of the transparent substrate is preferably 10 to 1000 μm, 15 to 500 μm, 20 to 300 μm, 25 to 70 μm, and 25 to 50 μm.

The imaging device 11 includes an image processing unit including an image pickup device, an image processing circuit that outputs an image pickup device, and a control unit including a control circuit such as a control image processing unit, and an optical system including a lens or the like. Wait. As the photographing means 11, for example, a CCD camera or the like can be used. The photographing means 11 takes an image of the mark 16 existing under the transparent substrate 17 provided on the stage 15 via the transparent substrate 17 to obtain an image.

The computer 12 performs various processes based on the image signals from the photographing means 11. Electricity The brain 12 is provided with an observation point-luminance curve creation means for making an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark 16 with respect to the image signal from the photographing means 11. And a copper foil surface state evaluation means for evaluating the visibility of the transparent substrate 17 based on the slope of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16 in the observation point-luminance curve, and The surface state of the copper foil was evaluated based on the evaluation result of the visibility.

Furthermore, in the present invention, the "direction across the mark" may be a direction crossing the direction in which the mark extends. Further, the observation point-luminance curve can also be produced by measuring the brightness of each observation point in a direction perpendicular to the direction in which the observed mark extends. In the case where the observation point-luminance curve is produced by measuring the brightness of each observation point in a direction perpendicular to the direction in which the above-mentioned mark is extended, the brightness from the portion where the mark exists to the portion where the mark does not exist The value changes more violently, and therefore, the surface state of the copper foil can be evaluated more satisfactorily. Here, the direction in which the mark extends is a direction substantially parallel or parallel to the linear mark when the mark is linear. Further, the direction in which the mark is extended refers to a direction substantially parallel or parallel to the straight line when the mark is not linear, when a straight line tangential to the outer edge of the mark is drawn.

Further, the computer 12 may further include a smoothing processing means for alleviating luminance unevenness with respect to an image obtained by imaging by the photographing means 11, and the observation point-luminance graph generating means using smoothing processing Brightness production observation point - brightness curve.

Further, the mark 16 existing under the transparent substrate 17 may be printed on the linear mark 16 of the printed matter laid under the transparent substrate 17, and the observation point-brightness curve drawing means is obtained by photographing. The image is measured by measuring the brightness of each observation point in a direction transverse to the observed line-like mark 16 to produce an observation point-luminance curve.

The computer 12 has a memory as a means of memory. Recorded in the memory in a computer-readable manner (so-called storage), the image obtained from the photographing means 11 by digitization, the observation point-brightness curve pattern creation formula, the visibility evaluation formula, and the surface state of the copper foil Evaluation formula, And evaluation values in each stage, etc.

The display means 13 displays a specific image or numerical value such as an observation point-luminance curve, a visibility evaluation result, and an evaluation result of the surface state of the copper foil based on various signals from the computer 12.

Next, a method of evaluating the surface state of the copper foil using the evaluation apparatus 10 of the surface state of the copper foil of the above-described embodiment will be described with reference to the flowchart shown in FIG. In addition, the flow chart shown in FIG. 2 is an embodiment in which the surface state of the copper foil of the evaluation apparatus 10 of the surface state of the copper foil of the present invention is used, and the surface state of the copper foil of the present invention can be used. The evaluation method implemented by the evaluation device 10 is not limited to that shown in the flowchart of FIG. 2. In particular, the smoothing process is performed on the image obtained by photographing before the observation point-brightness graph is produced in FIG. 2, but is not limited thereto. For example, the observation point-brightness graph can also be produced. After that.

In the method for evaluating the surface state of the copper foil of the evaluation device 10 using the surface state of the copper foil, first, after the copper foil is bonded to at least one surface of the transparent substrate, at least the copper foil is removed by etching. A part of the transparent substrate 17 is produced. Further, a transparent substrate 17 which is formed by removing all of the copper foil by the above etching may be prepared. In the case where the copper foil is a surface-treated copper foil, the surface-treated copper foil prepared by subjecting at least one surface to a surface treatment such as roughening treatment is attached to the transparent substrate from the surface side of the surface treatment such as roughening treatment. After at least one surface, the transparent substrate 17 is formed by etching to remove at least a portion of the copper foil. Further, a transparent substrate 17 which is formed by removing all of the copper foil by the above etching may be prepared. Next, the mark 16 existing under the transparent substrate 17 is imaged by the photographing means 11 via the transparent substrate 17. The signal of the image taken by the photographing means 11 is sent to the computer 12. Observation Point of the Computer 12 - Luminance Profile Creation means For the image signal from the photographing means 11, the brightness of each observation point is measured along the direction across the observed mark 16 to create an observation point-luminance curve. The surface state evaluation means of the copper foil of the computer 12 is in the observation point-luminance curve diagram, according to The slope of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16 evaluates the visibility of the transparent substrate 17, and based on the evaluation result of the visibility, the surface state of the copper foil bonded to the transparent substrate 17 Conduct an evaluation. In the past, if it was not actually produced on the production line, it was impossible to determine whether or not the mark which is considered to be placed in alignment with the transparent substrate was considered to have a problem in terms of manufacturing cost. However, according to the above configuration, the visibility of the transparent substrate 17 can be easily and efficiently evaluated in the laboratory, and the visibility of the transparent substrate 17 can be easily and efficiently evaluated. The surface state of the copper foil was evaluated efficiently and accurately. For example, the evaluation result of the visibility of the transparent substrate 17 can be directly evaluated as a good surface condition of the copper foil.

The surface state evaluation means of the copper foil of the computer 12 sets the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16 as ΔB (ΔB = Bt - Bb), and the evaluation of the visibility is performed using Sv, and the surface state of the copper foil is evaluated using the evaluation result, and the Sv is the closest to the intersection of the brightness curve and the Bt in the observation point-luminance curve. The value at the position of the intersection of the marks 16 (the value of the above-mentioned observation point - the horizontal axis of the luminance graph) is set to t1, and is expressed in the depth range from the intersection of the luminance curve and Bt to the reference of 0.1 ΔB from Bt. When the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the mark (the value of the observation point-the horizontal axis of the brightness curve) is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In the past, if it was not actually produced on the production line, it was impossible to determine whether or not the mark which is considered to be placed in alignment with the transparent substrate was considered to have a problem in terms of manufacturing cost. However, according to the above configuration, the visibility of the transparent substrate 17 can be easily and efficiently evaluated in the laboratory, and the visibility of the transparent substrate 17 can be easily and efficiently evaluated. The surface state of the copper foil was evaluated efficiently and accurately. For example, the evaluation result of the visibility of the transparent substrate 17 can be directly evaluated as a good surface condition of the copper foil. Furthermore, In the above observation point-luminance graph, the horizontal axis represents position information (pixel × 0.1), and the vertical axis represents the value of brightness (gray scale).

In addition, the surface state evaluation means of the copper foil of the computer 12 evaluates the visibility of the transparent substrate 17 using ΔB (ΔB = Bt - Bb) and Sv, and evaluates the surface state of the copper foil using the evaluation result. The above ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16, and the above Sv is at the observation point - In the brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the mark 16 (the value of the above-mentioned observation point - the horizontal axis of the brightness curve) is set to t1, which will be expressed in the self-luminance curve and The value of the position closest to the intersection of the mark in the intersection of the brightness curve and 0.1 ΔB in the depth range from Bt to 0.1 ΔB (the value of the horizontal axis of the above observation point-luminance curve) When it is set to t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

According to this configuration, the visibility of the transparent substrate 17 can be easily and efficiently evaluated in the laboratory, and the surface state of the copper foil can be evaluated efficiently and accurately.

Preferably, the computer 12 further includes a smoothing processing means for smoothing the unevenness of the brightness of the image obtained by the imaging by the photographing means 11, and using the smoothing of the observation point-luminance graph creation means The processed brightness is used to create an observation point-brightness curve. The data including the noise (original waveform) obtained by the image obtained by the photographing by the photographing means 11 is smoothed by the smoothing processing means, whereby the unevenness of the brightness is alleviated, The visibility of the transparent substrate 17 can be more accurately evaluated, whereby the surface state of the copper foil can be evaluated with high efficiency and accuracy. As the smoothing processing by the smoothing processing means, various smoothing programs can be used. For example, smoothing processing by a 2nd and 3rd order polynomial matching method, smoothing processing by Fourier transform, or moving can be used. Smoothing of the average method, etc. Furthermore, the smoothing process can also be performed using various known smoothing programs. Moreover, the smoothing processing of the luminance data can be performed on the portion having the mark 16 and the portion having no mark 16 The two parts may be carried out either on the portion having the mark 16 or on the portion having no mark 16, or may be performed locally.

Further, for the image obtained by the photographing by the photographing means 11, the observation point-luminance curve of the data (original waveform) containing the noise may be performed in advance before the smoothing of the brightness is performed. Figure production.

Further, in the case where the visibility of the transparent substrate 17 is evaluated based on the Sv value alone, the copper foil surface state evaluation means may also produce brightness from the end of the mark 16 to the portion without the mark 16. The difference between the top mean Bt of the curve and the bottom mean Bb is set to ΔB (ΔB=Bt-Bb), which is the closest to the mark in the intersection of the brightness curve and Bt in the observation point-brightness graph. The value of the position of the intersection point (the value of the above observation point - the horizontal axis of the luminance curve) is set to t1, and is expressed in the depth range from the intersection of the luminance curve and Bt to the reference point of 0.1 ΔB from Bt. When the value of the position closest to the intersection of the marks 16 in the intersection of 0.1 ΔB (the value of the horizontal axis of the observation point-luminance graph) is t2, the case where Sv is 3.5 or more is determined as the surface state of the copper foil. good.

Further, in the case where the visibility of the transparent substrate 17 is evaluated based on the Sv value and the ΔB value in the visibility evaluation of the transparent substrate 17, the end portion from the mark 16 to the portion without the mark 16 may be used. The difference ΔB (ΔB=Bt-Bb) between the top average Bt and the bottom average Bb of the generated luminance curve is 40 or more, and in the observation point-luminance curve, it will represent the most intersection of the brightness curve and Bt. The value of the position close to the intersection of the mark (the above-mentioned observation point - the value of the horizontal axis of the brightness curve) is set to t1, and will be expressed in the depth range from the intersection of the brightness curve and Bt to the base of 0.1 ΔB based on Bt. When the value of the position of the intersection of the brightness curve and the 0.1 ΔB closest to the intersection of the marks 16 (the value of the horizontal axis of the observation point-luminance curve) is t2, the case where Sv is 3.5 or more is determined as copper foil. The surface is in good condition.

More preferably, when Sv is 3.9 or more, preferably 4.5 or more, preferably 5.0 or more, and more preferably 5.5 or more, it is judged that the visibility is good and the surface state of the copper foil is good. Again, the upper limit of Sv It is not particularly limited, and is, for example, 70 or less, 30 or less, 15 or less, or 10 or less.

When ΔB (ΔB=Bt-Bb) is 50 or more, it is determined that the visibility is good and the surface state of the copper foil is good, and more preferably 60 or more, it is judged that the visibility is good, and The surface of the copper foil is in good condition. The upper limit of ΔB is not particularly limited, and is, for example, 100 or less, or 80 or less, or 70 or less. According to such evaluation, the visibility of the transparent substrate 17 can be evaluated efficiently and more accurately, whereby the surface state of the copper foil can be evaluated more efficiently and accurately.

Here, the "top average value Bt of the luminance curve", the "bottom average value Bb of the luminance curve", and the following "t1", "t2", and "Sv" will be described using the map. Further, the "bottom average value Bb of the luminance curve" is increased by the width of the mark (for example, the width of the mark is 0.7 mm or more, for example, 0.8 mm or more, for example, 5 mm or less, 4 mm or less, for example, about 1.3 mm). And the width of the narrowing mark (for example, the width of the mark is 0.01 mm or more, 0.05 mm or more, 0.1 mm or more, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, for example, 0.3 mm), and the regulations are different. Explain the situation of each person.

A schematic diagram of Bt and Bb when the width of the mark is increased (set to about 1.3 mm) is shown in FIG. The "mark" in Fig. 3 indicates a linear mark (a width of about 1.3 mm) of the printed matter observed in the image obtained by the above-described CCD camera. The curve drawn in such a manner as to overlap the mark indicates the brightness curve generated from the end of the mark to the unmarked portion in the above-mentioned observation point-luminance curve. As shown in Fig. 3, the "top average value Bt of the brightness curve" indicates the average of the brightness when measuring five places (10 parts on both sides) at intervals of 30 μm from the position of the end position of the both sides of the mark from the position of 100 μm. value. The "bottom average value Bb of the luminance curve" indicates the average value of the luminance when 11 portions are measured at intervals of 100 μm from the position where the end portion of the mark enters the inside of 100 μm. Further, the interval between the observation points for measuring the average value of the luminance may be appropriately selected from the range of 1 μm to 500 μm in accordance with the shape of the luminance curve. In order to avoid deviations in the observation sites, the intervals of the observation sites are preferably substantially equally spaced or equally spaced. Furthermore, the intervals of the observation locations may not be substantially equally spaced, or may not be equally spaced. Also, think The wider the measurement interval, the more the influence of the specific observation site can be excluded, and the error due to the observation site can be alleviated.

4(a) and 4(b) are schematic diagrams showing the definitions of Bt and Bb when the width of the mark is set to about 0.3 mm. When the width of the mark is set to about 0.3 mm, there is a case where a V-shaped luminance curve is formed as shown in FIG. 4(a), and a case of about 1.3 mm as shown in FIG. 4(b). The same is true for the case of the brightness curve at the bottom. In either case, the "top average value Bt of the brightness curve" indicates that the position is 50 μm from the position of the end portion on both sides of the mark, and the width of the mark is set to be about 1.3 mm. The average of the brightness at the time of each part (the total of 10 parts on both sides). On the other hand, the "base value Bb of the brightness curve" indicates the lowest value of the brightness of the front end portion of the V-shaped valley when the brightness curve is V-shaped as shown in Fig. 4(a). (b) In the case of having a bottom, it means a value of a center portion of about 0.3 mm. Further, the interval between the observation points for measuring the average value of the brightness may be appropriately selected from the range of 1 μm to 500 μm in accordance with the shape of the luminance curve. In order to avoid deviations in the observation sites, the intervals of the observation sites are preferably substantially equally spaced or equally spaced. Furthermore, the intervals of the observation locations may not be substantially equally spaced, or may not be equally spaced. Further, it is considered that the wider the measurement interval, the more the influence of the specific observation point can be excluded, and the error due to the observation location can be alleviated.

A pattern diagram defining t1, t2, and Sv is shown in FIG. "t1 (pixel × 0.1)" indicates the intersection of the brightness curve and Bt closest to the above-mentioned linear mark and the value indicating the position of the intersection (the above-mentioned observation point - the value of the horizontal axis of the luminance graph). "t2 (pixel × 0.1)" is expressed in the range from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt, and the intersection of the luminance curve and 0.1 ΔB is closest to the intersection of the above-mentioned linear marks and The value indicating the position of the intersection (the above observation point - the value of the horizontal axis of the luminance graph). At this time, the slope of the luminance curve indicated by the line connecting t1 and t2 is Sv (gray scale/pixel × 0.1) calculated by using ΔA in the y-axis direction and (t1-t2) in the x-axis direction. Make a definition. Furthermore, one pixel on the horizontal axis corresponds to a length of 10 μm. Further, the Sv system is measured on both sides of the mark, and a smaller value is used. Furthermore, the shape of the brightness curve is unstable When there are a plurality of the above-mentioned "the intersection of the brightness curve and the Bt", the intersection closest to the mark is adopted.

Among the images captured by the photographing means 11, the portion not marked with the mark is high in brightness, but the brightness is suddenly lowered when reaching the end portion of the mark. When the visibility of the transparent substrate 17 is good, the state of the brightness reduction can be clearly observed. On the other hand, if the visibility of the transparent substrate 17 is poor, the brightness does not suddenly drop from "high" to "low" in the vicinity of the end portion of the mark, but the state of the decrease is slow, and the state of decrease in brightness becomes unclear. .

According to the present invention, the transparent substrate 17 is placed, for example, under the printed matter with the mark, and is controlled at an observation point obtained from the image of the mark portion photographed by the photographing means 11 via the transparent substrate 17. - the slope of the luminance curve near the end of the mark depicted in the luminance graph. More specifically, the difference ΔB (ΔB=Bt-Bb) between the top average value Bt of the luminance curve and the bottom average value Bb is set to 40 or more, and is evaluated in the observation point-luminance graph, which indicates the luminance curve. The value of the position closest to the intersection of the above-mentioned linear marks in the intersection with Bt (the value of the above-mentioned observation point - the horizontal axis of the luminance curve) is set to t1, which will be expressed at the intersection of the self-luminance curve and Bt to Bt. When the value of the position closest to the intersection of the mark in the depth range of 0.1 ΔB and the point of 0.1 ΔB (the value of the horizontal axis of the observation point-luminance curve) is t2, the following (1) The Sv defined by the formula, whereby the visibility of the transparent substrate can be accurately evaluated. It is preferable that the case where Sv is 3.5 or more is judged to be good in visibility. More preferably, it is determined that the Sv is 3.9 or more, preferably 4.5 or more, preferably 5.0 or more, and more preferably 5.5 or more. Further, ΔB is preferably 50 or more, and preferably 60 or more. The upper limit of ΔB is not particularly limited, and is, for example, 100 or less, or 80 or less, or 70 or less. Further, the upper limit of Sv is not particularly limited, and is, for example, 70 or less, 30 or less, 15 or less, or 10 or less. According to this configuration, the boundary between the mark and the non-marked portion becomes clearer, the positioning accuracy is improved, the error of the mark image recognition is reduced, and the positional alignment can be performed more accurately. Therefore, when the values of Sv and ΔB are within the range of the values of Sv and ΔB, it can be determined that the surface state of the copper foil is good.

Further, by executing the processing program as described above as a program, the surface state of the copper foil can be evaluated efficiently and accurately.

Further, by using the program to be recorded on a recording medium such as an optical or a magnetic disk in a computer readable manner, even if another computer can implement the program, the same effects as those of the above processing program can be obtained.

(Visual recognition device for transparent substrate, visual evaluation method, visual evaluation program, and recording medium)

As the visibility evaluation device for the transparent substrate of the embodiment of the present invention, a device having the configuration shown in Fig. 1 for explaining the surface state evaluation device of the copper foil can be used as it is. That is, the "visibility evaluation device for a transparent substrate" includes an imaging device 11 that captures a mark 16 existing under the transparent substrate 17 provided on the stage 15 via the transparent substrate 17, and a computer 12 based on The image signal of the photographing means 11 performs various processes; the display means 13 displays a specific image based on various signals from the computer 12, and the illumination means 14 which illuminates the transparent substrate 17 and the mark 16 on the stage. The transparent substrate 17 to be evaluated in the present invention is not particularly limited, and may be a glass substrate or a resin substrate as long as it is transparent. Further, in the present invention, the term "transparent" also includes the case of having light transmittance. Further, the mark in the present invention may be a mark printed on a printed matter such as paper, or may be a copper wire or a metal, and may be an inorganic substance or an organic substance, and may be in any form as long as it is a mark.

In this case, the computer 12 performs various processes based on the image signals from the photographing means 11. The computer 12 is provided with an observation point-luminance curve generating means for producing an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark 16 with respect to the image signal from the photographing means 11. In the observation point-brightness graph, the visibility of the transparent substrate 17 is evaluated based on the slope of the luminance curve generated from the end portion of the mark 16 to the portion without the mark 16.

Furthermore, in the present invention, the "crossing direction of the mark" may also be in the direction of extending the mark. The direction. Further, the observation point-luminance curve can also be produced by measuring the brightness of each observation point in a direction perpendicular to the direction in which the observed mark extends. In the case where the observation point-luminance curve is produced by measuring the brightness of each observation point in a direction perpendicular to the direction in which the above-mentioned mark is extended, the brightness from the portion where the mark exists to the portion where the mark does not exist The value changes more violently, so that the surface state of the copper foil can be evaluated more satisfactorily. Here, in the case where the mark is linear, the direction in which the mark extends is a direction substantially parallel or parallel to the linear mark. Further, in the case where the mark is not linear, the direction in which the mark extends is a direction substantially parallel or parallel to the straight line when a straight line tangential to the outer edge of the mark is drawn.

Next, a visibility evaluation method using the visibility evaluation device of the transparent substrate of the above embodiment will be described with reference to a flowchart shown in FIG. In addition, the flow chart shown in FIG. 8 is one embodiment of the visibility evaluation method using the visibility evaluation device of the transparent substrate of the present invention, and the evaluation method which can be realized by the visibility evaluation device of the present invention is not limited to The one shown in the flowchart of FIG. In particular, the smoothing process is performed on the image obtained by photographing before the observation point-brightness graph is created in FIG. 8, but is not limited thereto. For example, the observation point-brightness graph may be produced. After that.

In the visibility evaluation method of the visibility evaluation device using a transparent substrate, first, a mark existing under the transparent substrate is imaged by a photographing means via a transparent substrate. The signal of the image taken by the means of photography is sent to the computer. The observation point of the computer - the brightness curve drawing means creates an observation point-luminance curve for measuring the brightness of each observation point in the direction across the observed mark for the image signal from the photographing means. The visibility evaluation means of the computer evaluates the visibility of the transparent substrate based on the slope of the luminance curve generated from the end portion of the mark to the unmarked portion in the observation point-luminance curve.

The visual evaluation method of the computer sets the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the unmarked portion as ΔB (ΔB=Bt-Bb), and performs the use of Sv. According to the evaluation of visibility, the above Sv is based on the observation point - brightness curve In the middle, the value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the marks 16 (the value of the above-mentioned observation point - the horizontal axis of the brightness graph) is set to t1, which will be expressed at the intersection of the self-luminance curve and Bt. In the depth range up to 0.1 ΔB based on Bt, the value of the position closest to the intersection of the mark in the intersection of the brightness curve and 0.1 ΔB (the value of the horizontal axis of the above-mentioned observation point-luminance curve) is set to t2. The time is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

In the past, if it was not actually produced on the production line, it was impossible to determine whether or not the mark which is considered to be placed in alignment with the transparent substrate was considered to have a problem in terms of manufacturing cost. However, according to the visibility evaluation device of the transparent substrate of the present invention, the visibility of the transparent substrate can be easily and efficiently evaluated in the laboratory easily and efficiently. Furthermore, in the above-mentioned observation point-luminance graph, the horizontal axis represents position information (pixel × 0.1), and the vertical axis represents the value of luminance (gray scale).

Further, the visibility evaluation method of the computer uses ΔB (ΔB=Bt-Bb) and Sv to evaluate the visibility, and the above ΔB (ΔB=Bt-Bb) is from the end of the mark to the unmarked portion. The difference between the top average value Bt of the generated brightness curve and the bottom average value Bb, which is the value of the position closest to the intersection of the mark in the intersection of the brightness curve and Bt in the observation point-luminance curve ( The observation point-value of the horizontal axis of the brightness curve is set to t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the depth of 0.1 ΔB based on Bt, and the intersection of the brightness curve and 0.1 ΔB. The value closest to the position of the intersection of the marks (the value of the above-mentioned observation point - the horizontal axis of the luminance graph) is t2, and is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

According to this configuration, the visibility of the transparent substrate can be evaluated more easily and efficiently, even in the laboratory.

Preferably, the computer further includes a smoothing processing means for easing the unevenness of the brightness of the image obtained by the photographing by the photographing means, and observing the spot - The brightness graph creation means creates an observation point-luminance curve using the brightness after the smoothing process. The data (including the original waveform) including the noise obtained by the image obtained by the photographing by the photographing means is smoothed by the smoothing processing means, whereby the unevenness of the brightness is alleviated, and therefore, The visibility of the transparent substrate can be more accurately evaluated. As the smoothing processing by the smoothing processing means, various smoothing programs can be used. For example, smoothing processing by a 2nd and 3rd order polynomial matching method, smoothing processing by Fourier transform, or moving can be used. Smoothing of the average method, etc. Furthermore, the smoothing process can also be performed using various known smoothing programs. Moreover, the smoothing process of the brightness data may be performed on both the marked portion and the unmarked portion, or on the marked portion, or on the unmarked portion, or locally.

Further, for an image obtained by photographing by means of photographing, an observation point-luminance graph of data (original waveform) including noise of the luminance may be performed in advance before the smoothing of the luminance is performed. Production.

Further, when the visibility is evaluated based on the Sv value only in the visibility evaluation by the visibility evaluation means, the top average Bt of the luminance curve generated from the end portion of the mark to the unmarked portion may be The difference between the bottom mean values Bb is set to ΔB (ΔB=Bt-Bb), and in the observation point-brightness graph, the value of the position closest to the intersection of the marks among the intersections of the brightness curve and Bt will be indicated (the above) The observation point - the value of the horizontal axis of the brightness graph) is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt, and the intersection of the brightness curve and 0.1 ΔB. When the value of the position close to the intersection of the mark (the value of the observation point - the horizontal axis of the brightness graph) is t2, it is judged that Sv is 3.5 or more.

Further, when the visibility is evaluated based on the Sv value and the ΔB value in the visibility evaluation by the visibility evaluation means, the top of the luminance curve generated from the end portion of the mark to the unmarked portion may be averaged. The difference ΔB (ΔB=Bt-Bb) between the value Bt and the bottom average value Bb is 40 or more, which is the closest among the intersections of the brightness curve and Bt in the observation point-luminance curve. The value at the position of the intersection of the mark (the value of the above-mentioned observation point - the horizontal axis of the brightness curve) is set to t1, and will be expressed in the depth range from the intersection of the brightness curve and Bt to the depth of the range of 0.1 ΔB from Bt. When the value of the position closest to the intersection of the mark in the intersection of the curve and 0.1 ΔB (the value of the observation point-the horizontal axis of the luminance curve) is t2, it is judged that Sv is 3.5 or more.

More preferably, it is determined that the Sv is 3.9 or more, preferably 4.5 or more, preferably 5.0 or more, and more preferably 5.5 or more. Further, the upper limit of Sv is not particularly limited, and is, for example, 70 or less, 30 or less, 15 or less, or 10 or less.

ΔB (ΔB = Bt - Bb) is preferably 50 or more, more preferably 60 or more. The upper limit of ΔB is not particularly limited, and is, for example, 100 or less, or 80 or less, or 70 or less. According to such evaluation, the visibility of the transparent substrate can be evaluated efficiently and more accurately.

Further, by executing the processing program as described above as a program, the visibility of the transparent substrate can be evaluated efficiently and accurately.

Further, by using a recording medium such as an optical or a magnetic disk to record the program in a computer readable manner, the program can be realized by other computers, and the same effects as those of the above processing program can be obtained.

(Positioning device of laminated body, positioning method of laminated body, positioning program of laminated body, and recording medium)

Fig. 9 is a schematic view showing a positioning device 20 of a laminated body according to an embodiment of the present invention. The positioning device 20 of the laminated body according to the embodiment of the present invention includes: a photographing means 21 for photographing the mark 26 existing in the laminated body 27 of the metal and the transparent substrate provided on the stage 25 via the transparent substrate; the computer 22, It performs various processes based on the image signal from the photographing means 21; the display means 23 displays a specific image based on various signals from the computer 22, and the illumination means 24 which irradiates light to the laminated body 27 on the platform. Hereinafter, a resin will be described as an example of a transparent substrate. In the present invention, the form of the "metal" is not particularly limited, and may be, for example, a metal material such as a metal foil, a metal plate or a metal strip.

The layered body 27 of the metal and the resin is not particularly limited as long as it is formed by laminating a metal to the resin. Specific examples of the layered body 27 of the metal and the resin in the present invention include a laminate in which the main substrate and the attached circuit board are electrically connected to the polyimine. In an electronic device including a flexible printed circuit board in which at least one surface of the resin is formed with a metal wiring such as copper, the flexible printed circuit board is accurately positioned and pressed against the wiring end portion of the main substrate and the attached circuit substrate. The layered body produced. In other words, in this case, the laminated body 27 is a laminated body in which the wiring end portions of the flexible printed circuit board and the main substrate are bonded by pressure bonding, or the wiring ends of the flexible printed circuit board and the circuit board are used. A laminated body that is crimped and attached. The laminate 27 has indicia formed of a portion of the metal wiring or other material. The position of the mark is not particularly limited as long as it can be imaged by the image forming means 21 such as a CCD camera through the resin constituting the laminated body 27.

The imaging device 21 includes an image processing unit including an image pickup device, an image processing circuit that outputs an image pickup device, a control unit including a control circuit such as a control image processing unit, and the like, and an optical unit including a lens or the like. System, etc. As the photographing means 21, for example, a CCD camera or the like can be used. The photographing means 21 captures the mark 26 existing in the laminated body 27 provided on the stage 25 via the resin of the laminated body, and acquires an image.

The computer 12 performs various processes based on the image signals from the photographing means 21. The computer 22 is provided with an observation point-luminance graph creating means for measuring the brightness of each observation point in the direction across the observed mark 26 for the image signal from the photographing means 21 to create an observation point-luminance curve. And a positioning means for determining the position of the laminated body 27 based on the slope of the luminance curve generated from the end of the mark 26 to the portion without the mark 26 in the observation point-luminance curve.

Furthermore, in the present invention, the "direction across the mark" may be a direction crossing the direction in which the mark extends. Further, the observation point-luminance curve can also be produced by measuring the brightness of each observation point in a direction perpendicular to the direction in which the observed mark extends. At the observation site - brightness curve When the brightness of each observation point is measured in a direction perpendicular to the direction in which the above-mentioned mark is extended, the value of the brightness from the portion where the mark exists to the portion where the mark does not exist changes more drastically, so The surface state of the copper foil can be evaluated more satisfactorily. Here, in the case where the mark is linear, the direction in which the mark extends is a direction substantially parallel or parallel to the linear mark. Further, in the case where the mark is not linear, the direction in which the mark extends is a direction substantially parallel or parallel to the straight line when a straight line tangential to the outer edge of the mark is drawn.

Further, the computer 22 may further include a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the imaging by the photographing means 21, and using the smoothing processing for the observation point-luminance graph creation means. The brightness is then used to create an observation point-brightness graph.

The computer 22 has a memory as a means of memory. In the memory, the image from the photographing means 21, the observation point-brightness curve pattern creation form, the positioning type, and the evaluation in each stage are separately recorded (so-called stored) in a computer readable manner. Value, etc.

The display means 23 displays a specific image or numerical value such as an observation point-luminance graph, a position evaluation result, and the like based on various signals from the computer 22.

Next, a positioning method using the positioning device 20 of the laminated body of the above-described embodiment will be described with reference to a flowchart shown in FIG. Furthermore, the flowchart shown in FIG. 10 is an embodiment of the positioning method using the positioning device 20 of the laminated body of the present invention, and the evaluation method that can be realized by the positioning device 20 of the present invention is not limited to the flowchart of FIG. Shown in it. In particular, the smoothing process is performed on the image obtained by photographing before the observation point-brightness graph is created in FIG. 10, but is not limited thereto. For example, it is also possible to create an observation point-brightness graph. After that.

The positioning method using the positioning device 20 of the laminated body is to mark the mark 26 existing in the laminated body 27 of the metal and the resin provided on the stage 25 by the photographing means 21 via the resin. By photography The signal of the image taken by means 21 is sent to computer 22. Observation Point of the Computer 22 - Luminance Profile Creation means For the image signal from the photographing means 21, the brightness of each observation point is measured along the direction across the observed mark 26 to create an observation point-luminance curve. The positioning means of the computer 22 evaluates the position of the laminated body 27 based on the slope of the luminance curve generated from the end of the mark 26 to the portion without the mark 26 in the observation point-luminance graph.

The positioning means of the computer 22 sets the difference between the top average Bt and the bottom average Bb of the luminance curve generated from the end of the mark 26 to the portion without the mark 26 as ΔB (ΔB = Bt - Bb), using Sv The position of the mark 26 is detected, and the position of the metal-resin laminate 27 is performed based on the detected position of the mark 26, and the above Sv is expressed in the observation point-brightness graph, which represents the most intersection of the brightness curve and the Bt. The value of the position close to the intersection of the mark 26 (the value of the above-mentioned observation point - the horizontal axis of the brightness curve) is set to t1, and will be expressed in the depth range from the intersection of the brightness curve and Bt to the base of 0.1 ΔB based on Bt. When the value of the position closest to the intersection of the mark (the observation point - the value of the horizontal axis of the brightness graph) in the intersection of the brightness curve and 0.1 ΔB is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

Moreover, the positioning means of the computer 22 can also use the position of the ΔB (ΔB=Bt-Bb) and the Sv detection mark 26, and the positioning of the metal-resin laminate 27 based on the detected position of the mark 26, ΔB (ΔB=Bt-Bb) is the difference between the top average Bt and the bottom average Bb of the luminance curve generated from the end of the mark 26 to the portion without the mark 26, and the above Sv is at the observation point-brightness In the graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the marks 26 (the value of the above-mentioned observation point - the horizontal axis of the brightness curve) is set to t1, which will be expressed in the self-luminance curve and Bt. The intersection point to the depth range of 0.1 ΔB based on Bt, the value of the position closest to the intersection of the mark in the intersection of the brightness curve and 0.1 ΔB (the value of the horizontal axis of the above-mentioned observation point-luminance curve) is set. When it is t2, it is defined by the following formula (1).

Sv=(△B×0.1)/(t1-t2) (1)

The definitions of Bt, Bb, t1, and t2 are as described in the visibility evaluation of the transparent substrate described above, and according to such a positioning method, the boundary between the mark 26 and the portion other than the mark 26 becomes clear, and the positioning accuracy is improved, and the mark pattern is improved. The error in recognition is reduced, so that the alignment can be performed more accurately. For example, when the values of Sv and ΔB are equal to or greater than a specific value, the device for detecting the position can determine that the mark 26 exists at the position. Specifically, for example, when the determination is made only by the Sv value, when Sv is 3.5 or more, the device that detects the position can perform the determination that the mark exists at the position, or the Sv value and the ΔB value. In the case, when Sv is 3.5 or more and ΔB is 40 or more, the device for detecting the position can perform the determination that the mark exists at the position.

Preferably, the computer 22 further includes a smoothing processing means for smoothing the unevenness of the brightness of the image obtained by the imaging by the photographing means 21, and using the smoothing of the observation point-luminance graph creation means. The processed brightness is used to create an observation point-brightness curve. The data including the noise (the original waveform) obtained by the image obtained by the photographing by the photographing means 21 is smoothed by the smoothing processing means, whereby the unevenness of the brightness is alleviated, The position of the laminated body 27 can be more accurately evaluated. As the smoothing processing by the smoothing processing means, it can be performed by various smoothing programs, for example, smoothing processing by a 2nd and 3rd order polynomial fitting method, smoothing processing by Fourier transform, or by Smoothing of moving average method, etc.

Further, before the smoothing of the brightness of the image obtained by the photographing by the photographing means 21, the observation point-luminance curve of the data (original waveform) including the noise may be performed in advance. Production.

Furthermore, by executing the processing program as described above as a program, the positioning of the laminated body can be evaluated efficiently and accurately.

Further, by using a recording medium such as an optical or a magnetic disk to record the program in a computer readable manner, the program can be realized by other computers, and the same effects as those of the above processing program can be obtained.

When the positioning of the printed wiring board is performed using the program or the positioning device according to the embodiment of the present invention, the positioning of the printed wiring board can be performed more accurately. Therefore, it is considered that when one printed wiring board is connected to another printed wiring board or when a component is mounted on one printed wiring board, connection failure is reduced and the yield is improved. Furthermore, the positioning of the printed wiring board using the program may be performed by soldering or connection via an anisotropic conductive film (ACF), via an anisotropic conductive paste (ACP) or It is applied when a printed wiring board is connected to another printed wiring board by a known connection method such as connection of a conductive adhesive or when a printed wiring board is mounted on a part.

Further, the positioning device 20 of the laminated body according to the embodiment of the present invention may further include a positioning means (not shown) for moving the laminated body at the determined position to position the laminated body. As the position aligning means, a conveyor such as a belt conveyor or a chain conveyor may be used, or a moving device having an arm mechanism may be used, or a movement in which the laminated body is floated by using a gas may be used. The apparatus or the moving means may be a moving device or a moving means (including a roller or a bearing) that rotates an object such as a substantially cylindrical shape to move the laminated body, a moving device or a moving means using a hydraulic pressure as a power source, or Air moving device or moving means for power source, mobile device or moving means with motor as power source, and gantry mobile linear guide platform, overhead moving air guide platform, stacked linear guide platform, linear A mobile device or a moving means of a platform such as a motor drive platform. Further, a known moving means can also be used.

In the present invention, the laminate includes a laminate of copper and a transparent substrate or a printed wiring board. The printed wiring board may be a printed wiring board having an insulating resin board and a circuit provided on the insulating resin board.

Furthermore, the positioning device 20 according to the embodiment of the present invention may have a surface mounter or a chip mounter, or a positioning device according to an embodiment of the present invention may be provided in a surface mounter or a mounter.

Moreover, the laminated body of the metal and the transparent substrate of the positioning device according to the embodiment of the present invention is also It may be a printed wiring board having a transparent substrate and a circuit provided on the substrate of the transparent substrate. Moreover, in this case, the above-mentioned mark may be the above circuit.

The positioning device of the present invention can also be used to position the printed wiring board, and the components can be mounted on the positioned printed wiring board, thereby manufacturing the printed wiring board. Further, the positioning of the printed wiring board can be performed by using the positioning device of the printed wiring board of the present invention, and the position of the positioned printed wiring board can be aligned, and the printed wiring board can be mounted on the positionally aligned printed wiring board to manufacture the printing. Wiring board. Thereby, components such as electronic components can be mounted at the correct position on the printed wiring board.

Moreover, the positioning of the printed wiring board can be performed by the positioning device of the present invention, and the other printed wiring board can be connected to the positioned printed wiring board, thereby manufacturing the printed wiring board. Furthermore, the positioning of the printed wiring board can be performed by using the positioning device of the printed wiring board of the present invention, the positional alignment of the positioned printed wiring board can be performed, and the printed wiring board can be connected to another printed wiring board by the positional alignment. Thereby, a printed wiring board is manufactured. Thereby, another printed wiring board can be connected to the correct position on the printed wiring board to be connected. Here, the "connection" may be an electrical connection (for example, soldering), or may be a connection using a material or the like that is not electrically connected.

Furthermore, in the present invention, the "printed wiring board" also includes a printed wiring board on which components are mounted and a printed circuit board.

Further, the laminate of the metal and the transparent substrate to be positioned in the present invention may be a printed wiring board having a transparent substrate and a circuit provided on the substrate of the transparent substrate. Moreover, in this case, the above-mentioned mark may be the above circuit. Moreover, it is assumed that the circuit also includes wiring.

In the present invention, the "positioning" includes "detecting the position of a mark or an object". Further, in the present invention, the "positional alignment" includes "moving the mark or the object to a specific position based on the detected position after detecting the position of the mark or the object".

[Examples]

As Examples A1 to 29 and Examples B1 to 15, various copper foils were prepared, and one surface was subjected to a plating treatment as a roughening treatment under the conditions described in Table 1.

After the above roughening plating treatment, the following plating treatments for forming the heat-resistant layer and the rust-preventing layer were carried out for Examples A1 to 10, 12 to 27, and Examples B3, 4, 6, and 9 to 15. The formation conditions of the heat-resistant layer 1 are shown below.

Liquid composition: nickel 5~20g/L, cobalt 1~8g/L

pH: 2~3

Liquid temperature: 40~60°C

Current density: 5~20A/dm ²

Coulomb amount: 10~20As/dm ²

The heat-resistant layer 2 is formed on the copper foil on which the heat-resistant layer 1 described above is applied. For Examples B5, 7, and 8, the roughening plating treatment was not performed, and the heat-resistant layer 2 was directly formed on the prepared copper foil. The formation conditions of the heat-resistant layer 2 are shown below.

Liquid composition: nickel 2~30g/L, zinc 2~30g/L

pH: 3~4

Liquid temperature: 30~50°C

Current density: 1~2A/dm ²

Coulomb amount: 1~2As/dm ²

Further, a rustproof layer is formed on the copper foil on which the heat-resistant layers 1 and 2 are applied. The conditions for forming the rustproof layer are shown below.

Liquid composition: potassium dichromate 1~10g/L, zinc 0~5g/L

pH: 3~4

Liquid temperature: 50~60°C

Current density: 0~2A/dm ² (for impregnation chromate treatment)

Coulomb amount: 0~2As/dm ² (for impregnation chromate treatment)

A weather-resistant layer is further formed on the copper foil on which the heat-resistant layers 1 and 2 and the rust-preventing layer are applied. The formation conditions are shown below.

As a decane coupling agent having an amine group, N-2-(aminoethyl)-3-aminopropyltrimethoxydecane (Examples A17, 24-27), N-2-(aminoethyl) 3-aminopropyltriethoxydecane (Examples A1-16), N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane (Example A18, 28, 29), 3-aminopropyltrimethoxydecane (Example A19), 3-aminopropyltriethoxydecane (Examples A20, 21), 3-triethoxyindolyl-N- (1,3-Dimethyl-butylidene)propylamine (Example A22) and N-phenyl-3-aminopropyltrimethoxydecane (Example A23) were coated and dried to form a weather resistant Sex layer. These decane coupling agents may also be used in combination of two or more kinds. Similarly, in Examples B1 to 15, coating and drying were carried out using N-2-(aminoethyl)-3-aminopropyltrimethoxydecane to form a weather resistant layer.

Further, the rolled copper foil was produced in the following manner. A copper ingot having the composition shown in Table 2 was produced, and after hot rolling, annealing and cold rolling of a continuous annealing line of 300 to 800 ° C were repeated to obtain a rolled plate of 1 to 2 mm thick. The rolled plate was annealed in a continuous annealing line at 300 to 800 ° C to be recrystallized, and finally cold rolled to the thickness of Table 2 to obtain a copper foil. The "fine copper" in the "Category" column of Table 2 indicates the refined copper according to JIS H3100 C1100, and the "oxygen-free copper" indicates the oxygen-free copper according to JIS H3100 C1020. Further, "fine copper + Ag: 100 ppm" means that 100 parts by mass of Ag is added to the refined copper.

The electrolytic copper foil was an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metal Co., Ltd. In the case of electrolytic polishing or chemical polishing, the thickness of the plate after electrolytic polishing or chemical polishing is described.

In addition, in Table 2, the point of the copper foil preparation process before surface treatment is described. "High-gloss rolling" means final cold rolling (cold rolling after final recrystallization annealing) at the value of the oil film equivalent described. "Normal rolling" means final cold rolling (cold rolling after final recrystallization annealing) at the value of the oil film equivalent described. "Chemical polishing" and "electrolytic polishing" mean those carried out under the following conditions.

The "chemical polishing" is an etching solution in which H ₂ SO ₄ is 1 to 3% by mass, H ₂ O ₂ is 0.05 to 0.15 mass %, and the remainder is water, and the polishing time is 1 hour.

"Electrochemical polishing" is based on the conditions of phosphoric acid 67% + sulfuric acid 10% + water 23%, and the voltage is 10 V/cm ² and the time shown in Table 2 (if electrolytic polishing is performed for 10 seconds, the polishing amount becomes 1~) 2 μm).

Each of the samples of the examples produced in the above manner was subjected to various evaluations as follows using an evaluation apparatus for the surface state of the copper foil having the same configuration as that shown in Fig. 1 .

(1) slope of the brightness curve

The surface of the surface-treated side of the surface-treated copper foil was bonded to both sides of a polyimide film (25 μm thick, 50 μm, thickness 50 μm manufactured by Toray DuPont) by etching (aqueous solution of ferric chloride). The copper foil was removed to prepare a sample film. Then, the print having the printed black mark was laid under the sample film, and the printed matter was imaged by the CCD camera through the sample film. The width of the mark used here is 0.1 to 0.4 mm. Next, in the observation point-luminance curve prepared by measuring the brightness of each observation point in a direction perpendicular to the direction in which the observed linear mark extends perpendicularly by the computer, the image is obtained by the computer. The brightness curve generated from the end portion of the mark to the unmarked portion, and ΔB and t1, t2, and Sv are measured. A schematic diagram showing a method of measuring the configuration of the photographing means used at this time and the slope of the luminance curve is shown in Fig. 6.

Further, ΔB and t1, t2, and Sv were measured by the following imaging means as shown in Fig. 5 . Furthermore, one pixel on the horizontal axis corresponds to a length of 10 μm.

The photographing means includes: a CCD camera; a platform (white) for placing a polyimine substrate provided with a labelled paper underneath; a lighting power source for irradiating light to a photographing portion of the polyimide substrate; and a transporter (not shown), the evaluation polyimide substrate on which the paper with the mark of the photographic subject is attached is conveyed to the platform. The main specifications of the camera are shown below:

. Photographic means: sheet inspection device manufactured by NIRECO Co., Ltd. Mujiken

. CCD camera: 8192 pixels (160MHz), 1024 grayscale digits (10 bits)

. Lighting power supply: high-frequency lighting power supply (power supply unit × 2)

. Lighting: Fluorescent (30W)

Furthermore, for the brightness shown in Figure 6, 0 means "black", brightness 255 means "white", and the degree of gray from "black" to "white" (black and white, grayscale) is divided into 256. Displayed in grayscale.

Furthermore, since the width of the mark used is as small as 0.1 to 0.4 mm, the brightness curve produced becomes a V-shape as shown in Fig. 4(a) or a V-shaped bottom as shown in Fig. 4(b). .

(2) Evaluation of the visibility (resin transparency) and the surface state of the copper foil; the surface of the surface-treated copper foil surface-bonded to the polyimide film (25 μm, 50 μm, east by Kaneka) On both sides of a thickness of 50 μm manufactured by Li Dubang, a copper foil was removed by etching (aqueous solution of ferric chloride) to prepare a sample film. Further, in the copper foil subjected to the roughening treatment, the roughened surface of the copper foil was bonded to the polyimide film to prepare the sample film. A printed matter (a black circle having a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the printed matter was judged from the opposite surface via a resin layer. The outline of the black circle of the printed matter is clearly visible in the length of 90% or more of the circumference as "◎", and the outline of the black circle is clearly visible in the length of 80% or more of the circumference and less than 90% of the circumference. "○" (the above is acceptable), and the silhouette of the black circle is clearly marked as "×" (failed) in the case where the length of the circle is 0 to less than 80%. Moreover, the evaluation of the visibility was directly evaluated as the surface state of the copper foil.

(3) Yield

The surface of the surface-treated side of the surface-treated copper foil was bonded to both sides of a polyimide film (25 μm thick, 50 μm, thickness 50 μm manufactured by Toray DuPont), and the copper foil was etched (chlorinated). An aqueous solution of iron was used to prepare an FPC having a circuit width of L/S of 30 μm / 30 μm. Further, in the copper foil subjected to the roughening treatment, the roughened surface of the copper foil was bonded to the polyimide film. Thereafter, an attempt was made to detect a mark of 20 μm × 20 μm square by using a CCD camera through polyimide. It is set to "◎" when 9 or more times can be detected in 10 times, "○" when 7 to 8 times can be detected, and "△" when 6 times can be detected. , set to "X" when it is possible to detect 5 or less times.

The conditions and evaluation of each of the above tests are shown in Tables 1 to 5.

(Evaluation results)

For the polyimide substrate of the embodiment, it is not necessary to actually manufacture on the production line, and the visibility can be easily and accurately evaluated at the laboratory level, whereby the surface state of the copper foil can be easily and accurately evaluated. . The surface state of the copper foil is evaluated by "◎", "○" (above the above), and "x" (failed) of the visibility evaluation in the direct application table, whereby the copper foil surface can be easily and accurately evaluated. The surface state of the copper foil was evaluated.

Further, when the same test as in the above embodiment is carried out using a larger mark having a width of 1.0 to 2.0 mm instead of the above example, a bottom view shown in Fig. 3 is obtained as a luminance curve. FIG. 7 is a schematic view showing a method of measuring the configuration of the photographing means and the slope of the luminance curve when evaluating the slope of the luminance curve when the width of the mark is 1.0 to 2.0 mm. In this case as well, the same results as in the above examples were obtained, and similarly to the above examples, the polyimine group was used. The material can be easily and accurately evaluated on a production line, and the visibility can be easily and accurately evaluated at a laboratory level, whereby the surface state of the copper foil can be easily and accurately evaluated.

10‧‧‧Evaluation device for the surface state of copper foil

11‧‧‧Photography

12‧‧‧Computer (observation location - means for producing brightness curve, means for evaluating surface state of copper foil, smoothing means)

13‧‧‧ Display means

14‧‧‧Lighting means

15‧‧‧ platform

16‧‧‧ mark

17‧‧‧Transparent substrate

Claims (64)

An apparatus for evaluating a surface state of a metal material, comprising: a photographing means for removing at least a part of the metal material by etching after bonding a surface of the metal material to at least one surface of the transparent substrate, and interposing The transparent substrate is captured by a mark that is present under the transparent substrate after the metal material is removed by etching; and an observation point-brightness curve creation means for the image obtained by the above-mentioned photographing, along the horizontal Observing the brightness of each observation point by observing the direction of the above-mentioned mark to produce an observation point-luminance curve; and the surface condition evaluation means of the metal material, in the above-mentioned observation point-luminance curve, according to the end from the above mark The slope of the brightness curve generated from the portion from the portion to the mark without the above-mentioned mark is evaluated for the visibility of the transparent substrate, and the surface state of the metal material is evaluated based on the evaluation result of the visibility; the surface state evaluation means of the metal material is The top average value B of the brightness curve generated from the end of the above mark to the portion without the above mark The difference between t and the bottom average value Bb is ΔB (ΔB = Bt - Bb), and the visibility of the transparent substrate is evaluated by using Sv, and the surface of the metal material is evaluated based on the evaluation result of the visibility of the transparent substrate. The state is evaluated, and the Sv is expressed in the observation point-luminance graph, and the value indicating the position closest to the intersection of the mark among the intersections of the brightness curve and Bt is t1, which is expressed in the self-luminance curve and Bt. When the value of the intersection of the luminance curve and 0.1ΔB is the closest to the intersection of the above-mentioned marks in the depth range from 0.1 ΔB to Bt, the value is defined by the following formula (1). ; Sv = (ΔB × 0.1) / (t1 - t2) (1). An apparatus for evaluating a surface state of a metal material, comprising: a photographing means for removing at least one side of the metal material by etching after bonding the surface side of the surface of the metal material to at least one surface of the transparent substrate Part and separated by the above The bright substrate is taken on a mark which is present under the transparent substrate after the metal material is removed by etching; the observation point-brightness curve creation means for the image obtained by the above-mentioned photographing, along the crossing Observing the brightness of each observation point in the direction of the above-mentioned mark to prepare an observation point-luminance curve; and a metal material surface state evaluation means, in the above-mentioned observation point-luminance curve, according to the end from the above mark The visibility of the transparent substrate is evaluated by the slope of the luminance curve generated by the portion without the above-mentioned mark, and the surface state of the metal material is evaluated based on the evaluation result of the above visibility; the surface state evaluation means of the metal material is ΔB ( ΔB=Bt-Bb) and Sv are evaluated for the visibility of the transparent substrate, and the surface state of the metal material is evaluated based on the evaluation result of the visibility of the transparent substrate, and the above ΔB (ΔB=Bt- Bb) is the difference between the top average Bt and the bottom average Bb of the luminance curve generated from the end of the mark to the portion without the mark, and the above Sv is In the above-mentioned observation point-brightness graph, the value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the brightness curve and Bt is set to t1, which will be expressed from the intersection of the self-luminance curve and Bt to the reference of Bt. In the depth range from ΔB, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1ΔB is t2, it is defined by the following formula (1); Sv=(ΔB×0.1) ) / (t1-t2) (1). An apparatus for evaluating the surface state of a metal material according to the first aspect of the invention, wherein the mark is a part of a metal material formed by the etching. An apparatus for evaluating the surface state of a metal material according to the first aspect of the patent application, wherein the metal material is a copper foil. The apparatus for evaluating the surface state of the metal material according to the fourth aspect of the invention, wherein the copper foil is a surface-treated copper foil; and the photographing means applies the surface-treated surface side of the surface-treated copper foil to the transparent substrate. After at least one surface, at least a portion of the surface-treated copper foil is removed by etching, and a mark which is present under the transparent substrate after the surface-treated copper foil is removed by etching is imaged through the transparent substrate. The apparatus for evaluating the surface state of the metal material according to the first aspect of the patent application, further comprising a smoothing processing means for alleviating the unevenness of the brightness of the image obtained by the image capturing by the photographing means; The luminance profile creation means creates an observation point-luminance curve using the luminance after the smoothing process. An apparatus for evaluating the surface state of a metal material according to claim 1, wherein the mark present under the transparent substrate is printed on a linear mark of the printed matter laid under the transparent substrate; - Luminance graph creation means For the image obtained by the above-described photographing, the observation point-luminance graph is produced by measuring the brightness of each observation point in the direction across the observed linear mark. An apparatus for evaluating the surface state of a metal material according to the first aspect of the patent application, wherein in the visibility evaluation using the surface condition evaluation means of the metal material, in the observation point-luminance curve, the brightness curve and the Bt are indicated. The value of the position of the intersection point closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the intersection of the brightness curve and 0.1 ΔB. When the value of the position closest to the intersection of the above-mentioned marks is t2, it is judged that the above Sv is 3.5 or more. An apparatus for evaluating the surface state of a metal material as claimed in claim 2, wherein In the visibility evaluation of the surface condition evaluation means of the above-mentioned metal material, the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark is ΔB (ΔB = Bt-Bb) is 40 or more. In the observation point-brightness graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which will be expressed in the self-luminance curve and Bt. When the value of the position where the Sv is 3.5 or more, the value of the Sv is 3.5 or more, and the value of the position where the Sv is 3.5 or more is determined as the value of the position where the intersection of the brightness curve and the 0.1 ΔB is closest to the intersection of the mark is t2. good. In the apparatus for evaluating the surface state of the metal material according to the second aspect of the invention, the case where the above ΔB (ΔB = Bt - Bb) is 50 or more is judged to be good. In the apparatus for evaluating the surface state of the metal material according to the eighth aspect of the patent application, the case where the Sv is 3.9 or more is judged to be good. In the apparatus for evaluating the surface state of the metal material according to the eleventh aspect of the patent application, the case where the Sv is 5.0 or more is judged to be good. An apparatus for evaluating the surface state of a metal material according to claim 1, wherein the direction crossing the mark is a direction crossing a direction in which the mark extends, and the observation point-luminance curve is along the observed The direction in which the direction of the mark extends is perpendicular to the direction in which the brightness of each observation point is measured. A program for causing a computer to function as an evaluation device for the surface state of a metal material according to any one of claims 1 to 13. A computer readable recording medium recording a program of claim 14 of the patent application. A method for evaluating a surface state of a metal material, after bonding a surface of the metal material to at least one surface of the transparent substrate, removing at least a portion of the metal material by etching, and photographing the transparent material through the transparent substrate a mark existing under the transparent substrate after the metal material is removed by etching; For the image obtained by the above-mentioned photographing, the observation point-luminance curve is prepared by measuring the brightness of each observation point across the direction of the observed mark; in the above-mentioned observation point-brightness graph, according to The visibility of the transparent substrate is evaluated from the slope of the brightness curve generated from the end of the mark to the portion without the mark, and the surface state of the metal material is evaluated based on the evaluation result of the visibility; the surface of the metal material The evaluation of the state is performed by setting the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark as ΔB (ΔB=Bt-Bb), using Sv. The evaluation of the visibility of the transparent substrate is based on the evaluation result of the visibility of the transparent substrate, and the surface state of the metal material is evaluated. The Sv is expressed in the observation point-luminance curve, and the brightness curve is The value of the position closest to the intersection of the above marks in the intersection of Bt is set to t1, which will be expressed from the intersection of the brightness curve and Bt to 0.1 ΔB based on Bt. In the range of the degree, when the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks is t2, it is defined by the following formula (1); Sv=(ΔB×0.1)/(t1 -t2) (1). A method for evaluating the surface state of a metal material, after bonding the surface side of the surface treated surface of the metal material to at least one side of the transparent substrate, removing at least a portion of the metal material by etching, and interposing the transparent layer The substrate is photographed on a mark that is present under the transparent substrate after the metal material is removed by etching; for the image obtained by the above-described photographing, each of the marks is observed across the observed direction Observing the brightness of the spot to create an observation site-brightness curve; in the above-mentioned observation site-brightness graph, the visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end of the mark to the portion without the mark And evaluate the surface state of the metal material based on the evaluation results of the above-mentioned visibility; the evaluation of the surface state of the above metal material The visibility of the transparent substrate was evaluated by using ΔB (ΔB=Bt-Bb) and Sv, and the surface state of the metal material was evaluated based on the evaluation result of the visibility of the transparent substrate, and the above ΔB (Δ) B=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is in the above-mentioned observation point-brightness graph The value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt. When the value of the position closest to the intersection of the above marks in the intersection of the curve and 0.1 ΔB is t2, it is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1) ). A method for evaluating the surface state of a metal material according to claim 16 wherein said mark is a part of a metal material formed by said etching. The method for evaluating the surface state of a metal material according to claim 16 wherein the metal material is a copper foil. The method for evaluating the surface state of a metal material according to claim 19, wherein the copper foil is a surface-treated copper foil; and in the photographing, the surface of the surface-treated copper foil is surface-bonded to a transparent substrate. After at least one side, at least a portion of the surface-treated copper foil is removed by etching, and a mark which is present under the transparent substrate after the surface-treated copper foil is removed by etching is imaged through the transparent substrate. A method for evaluating the surface state of a metal material according to claim 16 wherein the mark present under the transparent substrate is printed on a linear mark of the printed matter laid under the transparent substrate; In the production of the location-brightness graph, the map obtained by the above shooting For example, an observation point-luminance curve is prepared by measuring the brightness of each observation point in a direction crossing the observed linear mark. The method for evaluating the surface state of the metal material according to claim 16 of the patent application, wherein in the evaluation of the visibility of the transparent substrate in the evaluation of the surface state of the metal material, in the observation point-luminance curve, The value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt, and the brightness curve and When the value of the position closest to the intersection of the above-mentioned marks in the intersection of 0.1 ΔB is t2, it is determined that the surface state of the metal material is good when the Sv is 3.5 or more. The method for evaluating the surface state of the metal material according to claim 17 of the patent application, wherein in the evaluation of the visibility of the transparent substrate in the evaluation of the surface state of the metal material, from the end of the mark to the absence of the above The difference between the top average Bt and the bottom average Bb of the brightness curve generated by the portion of the mark is ΔB (ΔB=Bt-Bb) is 40 or more, and in the observation point-luminance curve, the brightness curve and Bt will be indicated. The value of the position of the intersection point closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the intersection of the brightness curve and 0.1 ΔB. When the value of the position closest to the intersection of the above-mentioned marks is t2, it is determined that the surface state of the metal material is good when the Sv is 3.5 or more. In the method of evaluating the surface state of the metal material according to the seventeenth aspect of the invention, wherein the ΔB (ΔB = Bt - Bb) is 50 or more, it is determined that the surface state of the metal material is good. In the method of evaluating the surface state of the metal material of claim 22, the case where the Sv is 3.9 or more is determined to be that the surface state of the metal material is good. In the method of evaluating the surface state of the metal material of claim 25, it is determined that the surface state of the metal material is good when the Sv is 5.0 or more. The method for evaluating the surface state of a metal material according to claim 16 wherein the direction crossing the mark crosses the direction in which the mark extends, and the observation point-luminance curve is along the observed The direction in which the direction of the mark extends is perpendicular to the direction in which the brightness of each observation point is measured. A visibility evaluation device for a transparent substrate, comprising: a photographing means for photographing a mark existing under a transparent substrate via the transparent substrate; and an observation point-luminance graph creation means for An image obtained by photographing, an observation point-brightness curve is produced by measuring the brightness of each observation point in a direction crossing the observed mark; and a visual evaluation means at the above-mentioned observation point-luminance curve The visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end of the mark to the portion without the mark; the visibility evaluation means is from the end of the mark to the absence of the mark The difference between the top average value Bt and the bottom average value Bb of the partially generated luminance curve is ΔB (ΔB=Bt-Bb), and the visibility is evaluated using Sv, and the above Sv is at the above-mentioned observation point-luminance curve. In the middle, the value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is set to t1, which will be expressed from the intersection of the self-luminance curve and Bt to the reference of Bt. In the depth range up to .1 ΔB, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1); Sv=(ΔB ×0.1)/(t1-t2) (1). A visibility evaluation device for a transparent substrate, comprising: a photographing means for photographing a mark existing under a transparent substrate via the transparent substrate; and an observation point-luminance graph creation means for The image obtained by photographing is measured by measuring the brightness of each observation point in the direction across the observed mark. a location-brightness graph; and a visual evaluation method for evaluating the transparent substrate based on the slope of the luminance curve generated from the end of the mark to the portion without the mark in the observation point-luminance curve The above-mentioned visual evaluation means uses ΔB (ΔB=Bt-Bb) and Sv for evaluation of visibility, and the above ΔB (ΔB=Bt-Bb) is from the end of the mark to the absence of the above mark. The difference between the top average value Bt of the brightness curve generated by the portion and the bottom average value Bb, wherein the Sv is in the above-mentioned observation point-brightness graph, and will represent the intersection of the brightness curve and the Bt closest to the intersection of the above marks. The value of the position is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks. When the value is set to t2, it is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1). The visibility evaluation device for a transparent substrate according to claim 28, wherein the direction across the mark crosses the direction in which the mark extends, and the observation point-luminance curve is along the observed The direction in which the direction of the mark extends is perpendicular to the direction in which the brightness of each observation point is measured. A program for causing a computer to function as a visibility evaluation device for a transparent substrate according to any one of claims 28 to 30. A computer readable recording medium recording a program of claim 31 of the patent application. A positioning device for a laminated body for positioning a laminated body of a metal and a transparent substrate; and a means for photographing a transparent layer of the metal and the transparent substrate having the mark, which is transparent The substrate is photographed with the above mark; Observing point-brightness graph generating means for producing an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark in the image obtained by the above-mentioned photographing; and a positioning means for determining a position of the laminated body according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance curve; the positioning means is to be from the mark The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion to the portion without the above-mentioned mark is set to ΔB (ΔB=Bt-Bb), in the above-mentioned observation point-brightness graph, The value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the brightness curve and Bt is t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt. When the value of the position closest to the intersection of the above-mentioned marks in the intersection of 0.1 ΔB is t2, when the Sv defined by the following formula (1) becomes a specific value or more, the position detection based on the above Sv is determined. The position of the mark is measured, and the position of the laminate of the metal and the transparent substrate is performed based on the position of the mark detected as described above; Sv = (ΔB × 0.1) / (t1 - t2) (1). A positioning device for a laminated body for positioning a laminated body of a metal and a transparent substrate; and a means for photographing a transparent layer of the metal and the transparent substrate having the mark, which is transparent The substrate is photographed with the above-mentioned mark; the observation point-brightness curve creation means for producing an observation point by measuring the brightness of each observation point in a direction crossing the observed mark by the image obtained by the above-described photographing a brightness graph; and a positioning means for determining a position of the layered body based on a slope of a brightness curve generated from an end portion of the mark to a portion having no such mark in the observation point-luminance curve; system When ΔB (ΔB=Bt-Bb) and Sv are used, when ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and based on the position of the detected mark. Positioning the laminated body of the metal and the transparent substrate, the above-mentioned ΔB (ΔB=Bt-Bb) is the top average value Bt and the bottom average value of the brightness curve generated from the end portion of the mark to the portion without the mark The difference of Bb is that the Sv is in the above-mentioned observation point-brightness graph, and the value indicating the position closest to the intersection of the mark among the intersections of the brightness curve and Bt is t1, which will be expressed in the self-luminance curve and Bt. When the value of the intersection of the luminance curve and 0.1ΔB is the closest to the intersection of the above-mentioned marks in the depth range from 0.1 ΔB to Bt, the value is defined by the following formula (1). ; Sv = (ΔB × 0.1) / (t1 - t2) (1). The positioning device of the laminated body according to claim 33, wherein the direction crossing the mark intersects with the direction in which the mark extends, and the observation point-luminance curve extends along the observed mark The direction is perpendicular to the direction in which the brightness of each observation point is measured. A program for causing a computer to function as a positioning device for a laminate of any one of claims 33 to 35. A computer readable recording medium recording a program of claim 36. A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board using a positioning device according to any one of claims 33 to 35, and mounting the component on the printed wiring board positioned. An apparatus for determining whether or not a mark included in a laminate of a metal and a transparent substrate is present, comprising: a photographing means for photographing the laminated body of the metal and the transparent substrate having the mark on the transparent substrate; mark; Observing point-brightness graph generating means for producing an observation point-luminance curve by measuring the brightness of each observation point in a direction crossing the observed mark in the image obtained by the above-mentioned photographing; and a determining means for determining whether the mark is present based on a slope of a brightness curve generated from an end portion of the mark to a portion having no such mark in the observation point-luminance curve; the determining means is from the mark The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion to the portion without the above-mentioned mark is set to ΔB (ΔB=Bt-Bb), and in the above-mentioned observation point-brightness graph, The value indicating the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt, and the brightness curve and When the value of the position closest to the intersection of the above-mentioned marks in the intersection of 0.1 ΔB is t2, when the Sv defined by the following formula (1) becomes a specific value or more, it is determined that the above-mentioned mark exists; Sv=( B × 0.1) / (t1-t2) (1). An apparatus for determining whether or not a mark included in a laminate of a metal and a transparent substrate is present, comprising: a photographing means for photographing the laminated body of the metal and the transparent substrate having the mark on the transparent substrate; Marking; observation point-brightness graph creating means for making an observation point-luminance curve by measuring the brightness of each observation point in a direction transverse to the observed mark by the image obtained by the above-described photographing And determining means for determining whether the mark exists according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-luminance curve; the determining means using ΔB ( △B=Bt-Bb) and Sv, when ΔB and Sv become a specific value or more When it is determined that the mark exists, the ΔB (ΔB=Bt-Bb) is the difference between the top average Bt and the bottom average Bb of the brightness curve generated from the end of the mark to the portion without the mark. The Sv is set in the observation point-luminance graph, and the value indicating the position closest to the intersection of the mark among the intersections of the brightness curve and Bt is t1, and is expressed at the intersection of the self-luminance curve and Bt. When Bt is within the depth range of the reference 0.1 ΔB, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1); Sv=( ΔB × 0.1) / (t1 - t2) (1). The determining device of claim 39, wherein the direction crossing the mark intersects with a direction in which the mark extends, and the observation point-luminance curve is perpendicular to a direction in which the observed mark extends. The direction is measured by measuring the brightness of each observation point. A program for causing a computer to function as a determining device of any one of claims 39 to 41. A computer readable recording medium recording a program of claim 42 of the patent application. An apparatus for detecting a position of a mark of a laminate of a metal and a transparent substrate, comprising: a photographing means for photographing the laminated body of the metal and the transparent substrate having the mark on the transparent substrate; Marking; observation point-brightness graph creating means for making an observation point-luminance curve by measuring the brightness of each observation point in a direction transverse to the observed mark by the image obtained by the above-described photographing And detecting means for detecting the position of the mark according to the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance curve; The difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark is set to ΔB (ΔB=Bt-Bb) at the above observation point- In the luminance graph, the value indicating the position of the intersection of the luminance curve and Bt closest to the intersection of the above-mentioned markers is set to t1, and is expressed as the depth from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt. In the range, when the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above-mentioned marks is t2, when the Sv defined by the following formula (1) becomes a specific value or more, based on the above measurement The position of the above Sv is detected by the position of Sv; Sv = (ΔB × 0.1) / (t1 - t2) (1). An apparatus for detecting a position of a mark of a laminate of a metal and a transparent substrate, comprising: a photographing means for photographing the laminated body of the metal and the transparent substrate having the mark on the transparent substrate; Marking; observation point-brightness graph creating means for making an observation point-luminance curve by measuring the brightness of each observation point in a direction transverse to the observed mark by the image obtained by the above-described photographing And detecting means for detecting the position of the mark according to the slope of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-luminance curve; the detecting means using ΔB (ΔB=Bt-Bb) and Sv, when ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the ΔB (ΔB=Bt-Bb) is The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated by the end portion of the mark from the portion not marked, the Sv is in the above-mentioned observation point-brightness graph, The value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the brightness curve and Bt is t1, and is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt. With 0.1△B When the value of the position closest to the intersection of the above marks is set to t2, it is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1). The detecting device of claim 44, wherein the direction crossing the mark crosses the direction in which the mark extends, and the observation point-luminance curve is perpendicular to the direction in which the observed mark is extended. The direction is measured by measuring the brightness of each observation point. A program for causing a computer to function as a detecting device of any one of claims 44 to 46. A computer readable recording medium recording a program of claim 47. A method for evaluating the visibility of a transparent substrate, wherein a mark is provided under the transparent substrate, and the mark is imaged by the photographing means via the transparent substrate; and the image obtained by the photographing is traversed Observing the brightness of each observation point in the direction of the above-mentioned mark to prepare an observation point-brightness curve; in the above-mentioned observation place-brightness curve, the brightness generated from the end portion of the mark to the portion without the mark The visibility of the transparent substrate is evaluated by the slope of the curve; the difference between the top average Bt and the bottom average Bb of the luminance curve generated from the end of the mark to the portion without the mark is set to ΔB (ΔB) =Bt-Bb), using Sv to evaluate the visibility of the transparent substrate, the Sv is in the above-mentioned observation point-brightness graph, and will indicate the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks. The value is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to 0.1 ΔB based on Bt. The intersection of the brightness curve and 0.1 ΔB is closest to the above mark. When the value of the position of the intersection is t2, it is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1). A method for evaluating the visibility of a transparent substrate, A mark is disposed under the transparent substrate, and the mark is imaged by the photographing means via the transparent substrate; and for the image obtained by the photographing, each observation point is measured along a direction crossing the observed mark Observing the position-brightness curve according to the brightness; in the above-mentioned observation point-brightness graph, the visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end portion of the mark to the portion without the mark Using ΔB (ΔB=Bt-Bb) and Sv to evaluate the visibility of the transparent substrate, the above ΔB (ΔB=Bt-Bb) is generated from the end of the mark to the portion without the above mark The difference between the top average value Bt of the brightness curve and the bottom average value Bb, wherein the Sv is in the above-mentioned observation point-brightness graph, and will represent the value of the position of the intersection of the brightness curve and Bt closest to the intersection of the above marks. Let t1 be the depth range from the intersection of the luminance curve and Bt to the range of 0.1 ΔB from Bt, and the value of the position of the intersection of the luminance curve and 0.1 ΔB closest to the intersection of the above marks is set to T2 It is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1). The method for evaluating the visibility of a transparent substrate is characterized in that after at least one surface-treated surface-treated copper foil is adhered to both sides of the transparent substrate from the side of the treated surface, the copper foil on both sides is removed by etching; The marked printed matter is laid under the exposed transparent substrate, and the printed matter is imaged by the photographic means through the transparent substrate; and the image obtained by the above shooting is observed along the traversing The direction of each observation point is measured to produce an observation point-brightness curve; in the above observation point-luminance curve, the slope of the brightness curve generated from the end of the mark to the portion without the mark is evaluated. The visibility of the transparent substrate; the evaluation of the visibility of the transparent substrate using ΔB (ΔB=Bt-Bb) and Sv, The above ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the observation point - In the luminance graph, the value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the luminance curve and Bt is t1, which is expressed from the intersection of the self-luminance curve and Bt to 0.1 ΔB based on Bt. In the depth range, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1); Sv=(ΔB×0.1)/(t1 -t2) (1). The method for evaluating the visibility of claim 49, wherein the direction crossing the mark crosses the direction in which the mark extends, and the observation point-luminance curve extends along the observed mark. The direction is perpendicular to the direction in which the brightness of each observation point is measured. A method for positioning a laminated body, wherein the laminated body of the metal and the transparent substrate is positioned; the laminated body of the metal and the transparent substrate has a mark; and the mark is photographed by the photographic means across the transparent substrate; The image obtained by the above shooting, the brightness of each observation point is measured along the direction of the observed mark to create an observation point-brightness curve; from the end of the mark to the absence of the above mark The difference between the top average Bt and the bottom average Bb of the partially generated luminance curve is set to ΔB (ΔB=Bt-Bb), and in the above observation point-luminance graph, it will represent the intersection of the luminance curve and Bt. The value of the position closest to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt, and the brightness curve is closest to the intersection of 0.1 ΔB. When the value of the position of the intersection of the above-mentioned marks is t2, when the Sv defined by the following formula (1) is equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured. And positioning the laminated body of the metal and the transparent substrate based on the position of the mark detected above; Sv = (ΔB × 0.1) / (t1 - t2) (1). A method for positioning a laminated body, wherein the laminated body of the metal and the transparent substrate is positioned; the laminated body of the metal and the transparent substrate has a mark; and the mark is photographed by the photographic means across the transparent substrate; The image obtained by the above shooting is measured by measuring the brightness of each observation point in the direction across the observed mark; and using ΔB (ΔB=Bt-Bb) and Sv, When ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the position of the laminated body of the metal and the transparent substrate is performed based on the position of the detected mark. B(ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the above-mentioned observation point-brightness In the graph, the value indicating the position of the intersection of the brightness curve and Bt closest to the above-mentioned mark is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the reference of 0.1 ΔB from Bt. When the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks is t2, it is defined by the following formula (1); Sv=(ΔB×0.1)/(t1-t2 ) (1). The method for positioning a laminate according to claim 53 or 54, wherein the direction crossing the mark crosses the direction in which the mark extends, and the observation point-brightness curve is along the observed mark The direction in which the direction of the extension is perpendicular is measured by measuring the brightness of each observation point. A method for positioning a printed wiring board, which is a locator of a printed wiring board having an insulating resin board and a circuit provided on the insulating resin board; The circuit is photographed by the photographing means via the resin; and the image obtained by the photographing is used to measure the brightness of each observation point along the direction of the observed circuit, thereby producing an observation point-luminance curve; The difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the above circuit to the portion without the above circuit is ΔB (ΔB = Bt - Bb) at the above observation point - In the luminance graph, the value indicating the position closest to the intersection of the above-mentioned circuits among the intersections of the luminance curve and Bt is t1, which is expressed as the depth from the intersection of the luminance curve and Bt to the depth of 0.1 ΔB based on Bt. In the range where the value of the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above-mentioned circuits is t2, when the Sv defined by the following formula (1) becomes a specific value or more, based on the above measurement The position of the Sv detects the position of the above-mentioned circuit, and performs positioning of the printed wiring board based on the position of the detected circuit; Sv = (ΔB × 0.1) / (t1 - t2) (1). A method for positioning a printed wiring board, which is a positioner of a printed wiring board having an insulating resin board and a circuit provided on the insulating resin board; and the above-mentioned circuit is imaged by the photographing means via the resin; And obtaining the image, measuring the brightness of each observation point along the direction of the observed circuit, and making an observation point-luminance curve; using ΔB (ΔB=Bt-Bb) and Sv, △ When B and Sv are equal to or greater than a specific value, the position of the circuit is detected based on the position at which the Sv is measured, and the position of the printed wiring board is performed based on the position of the detected circuit, and the above ΔB (ΔB = Bt - Bb) is the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the circuit to the portion without the above circuit, and the Sv is expressed in the above-mentioned observation point-luminance curve The value of the position of the intersection of the curve and Bt closest to the intersection of the above circuit is set to t1, which will be expressed in the depth range from the intersection of the brightness curve and Bt to the reference point of 0.1 ΔB from Bt. And 0.1 △ B When the value of the position closest to the intersection of the above circuits is set to t2, it is defined by the following formula (1); Sv = (ΔB × 0.1) / (t1 - t2) (1). A method of manufacturing a printed wiring board, comprising the steps of: positioning a printed wiring board by positioning method of claim 56 or 57, and mounting the component on the printed wiring board positioned. A method for determining whether a mark of a layered body of a metal and a transparent substrate is present, wherein the layered body of the metal and the transparent substrate has a mark; and the mark is imaged by the photographic means across the transparent substrate; Taking an image obtained by photographing, measuring the brightness of each observation point in a direction crossing the observed mark to create an observation point-luminance curve; from the end of the mark to the portion without the above mark The difference between the top average value Bt and the bottom average value Bb of the generated brightness curve is set to ΔB (ΔB=Bt-Bb), and in the above-mentioned observation point-brightness graph, it will represent the most intersection of the brightness curve and Bt. The value of the position close to the intersection of the above marks is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the base of 0.1 ΔB, and the closest to the intersection of the brightness curve and 0.1 ΔB. When the value of the position of the intersection of the above-mentioned marks is t2, when the Sv defined by the following formula (1) becomes a specific value or more, it is determined that the above-mentioned mark exists; Sv = (ΔB × 0.1) / (t1 - t2 ) (1). A method for determining whether a mark of a layered body of a metal and a transparent substrate is present, wherein the layered body of the metal and the transparent substrate has a mark; and the mark is imaged by the photographic means across the transparent substrate; The image obtained by shooting, along the side of the above-mentioned mark observed across Observing the brightness of each observation point to create an observation point-luminance curve; when ΔB (ΔB=Bt-Bb) and Sv are used, when ΔB and Sv are equal to or greater than a specific value, it is determined that the above-mentioned mark exists. The above ΔB (ΔB=Bt-Bb) is the difference between the top average value Bt and the bottom average value Bb of the luminance curve generated from the end portion of the mark to the portion without the mark, and the Sv is at the observation point - In the luminance graph, the value indicating the position closest to the intersection of the above-mentioned marks in the intersection of the luminance curve and Bt is t1, which is expressed from the intersection of the self-luminance curve and Bt to 0.1 ΔB based on Bt. In the depth range, when the value of the position closest to the intersection of the above marks among the intersections of the luminance curve and 0.1 ΔB is t2, it is defined by the following formula (1); Sv=(ΔB×0.1)/(t1 -t2) (1). The method of determining the scope of claim 59 or 60, wherein the direction crossing the mark is in a direction intersecting the direction in which the mark extends, and the observation point-luminance curve is along a direction extending from the observed mark The direction of the vertical direction is measured by measuring the brightness of each observation point. A detecting method for detecting a position of a mark of a laminated body of a metal and a transparent substrate; wherein the laminated body of the metal and the transparent substrate has a mark; and the mark is photographed by the photographic means across the transparent substrate; An image obtained by the above-described photographing, an observation point-brightness curve is produced by measuring the brightness of each observation point in a direction crossing the observed mark; from the end of the mark to the absence of the mark The difference between the top average Bt and the bottom average Bb of the brightness curve generated by the part is set to ΔB (ΔB=Bt-Bb), and in the above observation point-luminance curve, the intersection of the brightness curve and Bt will be indicated. The value of the position closest to the intersection of the above marks is set to t1, which will be expressed at the intersection of the self-luminance curve and Bt. When the value of the position closest to the intersection of the above marks in the intersection of the luminance curve and 0.1 ΔB is t2 in the depth range from 0.1 ΔB to Bt, the Sv defined by the following formula (1) becomes When the value is equal to or greater than the specific value, the position of the mark is detected based on the position at which the Sv is measured; Sv = (ΔB × 0.1) / (t1 - t2) (1). A detecting method for detecting a position of a mark of a laminated body of a metal and a transparent substrate; wherein the laminated body of the metal and the transparent substrate has a mark; and the mark is photographed by the photographic means across the transparent substrate; An image obtained by the above-described photographing is measured along the direction of the observed mark to produce an observation point-luminance curve; using ΔB (ΔB=Bt-Bb) and Sv When ΔB and Sv are equal to or greater than a specific value, the position of the mark is detected based on the position at which the Sv is measured, and the ΔB (ΔB=Bt-Bb) is from the end of the mark to the absence of the mark. The difference between the top average value Bt of the brightness curve generated by the portion and the bottom average value Bb, wherein the Sv is in the above-mentioned observation point-brightness graph, and will represent the intersection of the brightness curve and the Bt closest to the intersection of the above marks. The value of the position is set to t1, which is expressed in the depth range from the intersection of the brightness curve and Bt to the range of 0.1 ΔB based on Bt, and the position of the intersection of the brightness curve and 0.1 ΔB closest to the intersection of the above marks. value When t2, a defined by the following formula (1); Sv = (△ B × 0.1) / (t1-t2) (1). The detection method of claim 62 or 63, wherein the direction crossing the mark is in a direction intersecting the direction in which the mark extends, and the observation point-luminance curve is along a direction extending from the observed mark The direction of the vertical direction is measured by measuring the brightness of each observation point.