TWI494210B - 壓印組件及其製備方法以及導光板壓印成型方法 - Google Patents
壓印組件及其製備方法以及導光板壓印成型方法 Download PDFInfo
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Description
本發明涉及一種壓印組件及其製備方法，以及應用該壓印組件之導光板壓印成型方法。
背光模組係LCD顯示器、行動電話、PDA、數位相機等採用之液晶顯示模組之重要元件。隨著顯示行業之迅速發展，輕量型、超薄型、低能耗之背光模組成為該領域研究之發展趨勢。導光板作為背光模組中重要之光學元件，其結構及性能優劣直接影響背光源之品質。一種習知導光板加工方法係：先採用微切削加工，即用切削工具，如鑽石於模具上切削出微結構；再經射出成型製得導光板。採用該方法不可避免地會產生射出料頭，造成材料之浪費，且其成型效率較低。
滾對滾成型方法(roll-to-roll process)將具有撓性之軟板(或者薄膜)，從圓筒狀之料卷卷出之後，於軟板表面進行加工形成預設結構，然後再一次把軟板卷成圓筒狀或直接成品裁切。採用滾對滾成型方法成型導光板，可提高效能、降低成本，實現連續生產，還可減少材料浪費。上述預設結構之加工方法主要係精密壓印法，即將形成於壓印滾筒圓週表面之壓印結構對軟板表面
進行壓印。習知之形成該壓印結構方法係對滾筒進行切削加工，於滾筒圓週表面形成該壓印結構。然，當壓印結構形狀較為複雜，於壓印滾筒圓週表面上進行加工變得尤其困難，加工成本較高。
鑒於上述狀況，有必要提供一種可形成複雜壓印結構之壓印組件製備方法，利用該方法製得之壓印組件，以及利用該壓印組件進行壓印之導光板壓印成型方法。
一種壓印組件，包括滾筒及由電鑄成型之壓印層，該壓印層首尾相連地捲繞於該滾筒，並藉由焊接或鉚接的方式結合於滾筒圓週面，且該壓印層之外表面形成壓印結構。
一種壓印組件製備方法，其包括以下步驟：於可作為電鑄原模之基材表面形成預設結構；以該基材為電鑄原模，藉由電鑄形成具有壓印結構之壓印層；剝離該壓印層；提供一滾筒；將該壓印層首尾相連地捲繞於該滾筒並藉由焊接或鉚接的方式結合於滾筒圓週面。
一種導光板壓印成型方法，其採用滾對滾成型工藝進行成型，且採用上述壓印組件進行印花。
上述壓印組件之製備方法藉由電鑄形成具有壓印結構之壓印層，並將該壓印層捲繞於滾筒圓週面形成壓印組件，從而不用直接於滾筒表面，即圓週面上加工出壓印結構，可便於形成結構複雜之壓印結構。
100‧‧‧壓印組件
11‧‧‧滾筒
12‧‧‧壓印層
121‧‧‧壓印結構
21‧‧‧基材
212‧‧‧表面
213‧‧‧預設結構
311‧‧‧電鑄溶液
312‧‧‧電鑄槽
圖1係本發明實施方式之壓印組件之立體示意圖。
圖2係圖1所示壓印組件之製備方法流程圖。
圖3係圖2所示壓印組件之製備過程示意圖。
下面將結合附圖及具體實施方式對本發明之壓印組件及其製備方法以及導光板成型方法作進一步詳細說明。
請參閱圖1，本發明實施方式之壓印組件100包括滾筒11及捲繞並結合於滾筒11圓週面之壓印層12。壓印層12由電鑄成型，其外表面形成有壓印結構121。壓印結構121可為複雜之微結構，如水滴型微結構、金字塔型微結構以及沿曲線延伸之凸起或凹槽結構中任一種或幾種之結合，採用該壓印組件100進行印花，可壓印形成與壓印結構121形狀互補之微結構。
滾筒11可由傳導性材質製成，如金屬鋁、銅、鋅、鎳、鐵、鈦、鈷等，或者前述金屬中任一材質之合金或不銹鋼。壓印層12之材質可為鎳、鉑鎳鈷合金、鈷鎢合金、金或銀等電鑄用材質。
下面以製備壓印組件100為例，說明本發明實施方式之壓印組件製備方法。請同時參閱圖2及圖3，該壓印組件製備方法包括以下步驟：
S21：於可作為電鑄原模之基材21表面212形成預設結構213。
基材21由塑膠、不銹鋼、蠟或者鋁等可作為電鑄原模之材質製成。作為較佳方案，基材21呈板狀，其表面212為平面，從而便於對基材21進行定位以及對表面212進行加工。
預設結構213可為水滴型微結構、金字塔型微結構以及沿曲線延伸之凸起或凹槽結構中任一種或幾種結合，以與壓印組件100壓印形成之結構相應。預設結構213可藉由多軸機床切削加工形成，如藉由多軸刨床進行平面切削加工形成。預設結構213亦可藉由澆注、雕刻或照相製版形成。因預設結構213可於平面上加工形成，其加工較為便利，易於形成形狀複雜之結構。
S23：以該基材21為電鑄原模，藉由電鑄形成具有壓印結構121之壓印層12。
將成型預設結構213之基材21置於盛有電鑄溶液311之電鑄槽312中進行電鑄。基材21之表面212逐漸沈積形成金屬電鑄層，即壓印層12。同時壓印層12與基材21表面212相貼近之表面形成壓印結構121。壓印結構121與預設結構213形狀互補。壓印層12材質為鎳、鉑鎳鈷合金、鈷鎢合金、金或銀等電鑄用材質。壓印層12厚度應較薄，以使其可順利捲曲變形。
S25：剝離壓印層12。
將壓印層12與基材21分離。為便於壓印層12之剝離，電鑄前可於基材21之表面212形成氧化膜或塗石墨粉。
S27：提供一滾筒11。
S29：將該壓印層12捲繞並結合於滾筒11圓週面。
滾筒11具有一預設之外徑，壓印層12捲繞於滾筒11後首尾相連，並與滾筒11緊密結合形成壓印組件100。滾筒11與壓印層12之結合方式可為焊接、鉚接等。
本發明實施方式之導光板成型方法，採用滾對滾成型工藝進行成型，其包括下列步驟：將導光板基片從料卷出料；於導光板基片上形成熱塑性樹脂層；利用壓印組件100進行熱滾壓印花，以於導光板基片之熱塑性樹脂層上形成微結構；固化微結構，如利用UV乾燥裝置對微結構進行乾燥固化；以及將連續之導光板基片進行裁切，以得到具有所需尺寸之導光板。上述導光板成型方法可連續生產，效能較高，且可實現薄型化。相較於射出成型，可減少料頭之產生，從而減少材料之浪費。壓印組件100易於形成結構複雜之壓印結構121，與之相應，利用壓印組件100可於導光板上壓印出結構複雜之微結構，從而提升導光板之光學特性。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之請求項。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下請求項內。
Claims (10)
- 一種壓印組件，包括滾筒，其改良在於：該壓印組件還包括由電鑄成型之壓印層，該壓印層首尾相連地捲繞於該滾筒，並藉由焊接或鉚接的方式結合於滾筒圓週面，且該壓印層之外表面形成壓印結構。
- 如請求項第1項所述之壓印組件，其中該壓印結構包括水滴型微結構、金字塔型微結構以及沿曲線延伸之凸起或凹槽結構中任一種或幾種結合。
- 如請求項第1項所述之壓印組件，其中該壓印層材質為鎳、鉑鎳鈷合金、鈷鎢合金、金或銀。
- 一種壓印組件製備方法，其包括以下步驟：於可作為電鑄原模之基材表面形成預設結構；以該基材為電鑄原模，藉由電鑄形成具有壓印結構之壓印層；剝離該壓印層；提供一滾筒；將該壓印層首尾相連地捲繞於該滾筒並藉由焊接或鉚接的方式結合於滾筒圓週面。
- 如請求項第4項所述之壓印組件製備方法，其中該基材形成預設結構之表面為平面。
- 如請求項第4或5項所述之壓印組件製備方法，其中該基材之預設結構藉由多軸機床切削加工形成。
- 如請求項第4或5項所述之壓印組件製備方法，其中該基材之預設結構藉由澆注、雕刻或照相製版形成。
- 如請求項第4項所述之壓印組件製備方法，其中該基材材質為塑膠、不銹鋼、蠟或者鋁。
- 一種導光板壓印成型方法，採用滾對滾成型工藝進行成型，其改良在於：在所述滾對滾成型工藝中採用專利範圍第1項所述之壓印組件進行印花。
- 如請求項第9項所述之導光板壓印成型方法，其中該導光板表面形成與該壓印層之壓印結構形狀互補之微結構，該微結構包括水滴型微結構、金字塔型微結構以及沿曲線延伸之凸起或凹槽結構中任一種或幾種結合。
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| TW098144652A TWI494210B (zh) | 2009-12-24 | 2009-12-24 | 壓印組件及其製備方法以及導光板壓印成型方法 |
| US12/822,313 US20110156293A1 (en) | 2009-12-24 | 2010-06-24 | Embossing assembly, manufacturing method thereof, and embossing method using the same |
| JP2010283143A JP2011131595A (ja) | 2009-12-24 | 2010-12-20 | エンボス加工装置、その製造方法及び導光板のエンボス成形方法 |
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| TW098144652A TWI494210B (zh) | 2009-12-24 | 2009-12-24 | 壓印組件及其製備方法以及導光板壓印成型方法 |
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| TW201121769A TW201121769A (en) | 2011-07-01 |
| TWI494210B true TWI494210B (zh) | 2015-08-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWM429700U (en) * | 2012-01-19 | 2012-05-21 | Benq Materials Corp | Engraving device |
| CN106273399A (zh) * | 2016-08-29 | 2017-01-04 | 重庆鑫翎创福光电科技股份有限公司 | 一种生产导光板的辊 |
| CN106182728B (zh) * | 2016-08-29 | 2019-01-01 | 重庆鑫翎创福光电科技股份有限公司 | 一种用于生产导光板的辊 |
| CN107526130A (zh) * | 2017-08-18 | 2017-12-29 | 苏州天禄光科技股份有限公司 | 制造导光板的网点的方法和设备 |
| CN116774341B (zh) * | 2023-02-07 | 2025-06-17 | 四川龙华光电薄膜股份有限公司 | 一种导光板及导光板制备方法 |
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| US3671405A (en) * | 1970-12-07 | 1972-06-20 | Budd Co | Method of electroforming on surfaces having projections |
| US3712706A (en) * | 1971-01-04 | 1973-01-23 | American Cyanamid Co | Retroreflective surface |
| US3935359A (en) * | 1972-06-23 | 1976-01-27 | Rowland Development Corporation | Retroreflective sheeting and method and apparatus for producing same |
| TW562755B (en) * | 1999-12-31 | 2003-11-21 | Ibm | Stamp device for printing a pattern on a surface of a substrate |
| TWI255471B (en) * | 2004-12-29 | 2006-05-21 | Ind Tech Res Inst | Manufacturing method of planar coils |
| TWM340414U (en) * | 2008-03-11 | 2008-09-11 | Hann Yu Technology Co Ltd | Electrolysis etching structure of light guide core |
| TW200917333A (en) * | 2007-10-11 | 2009-04-16 | Univ Nat Cheng Kung | Manufacturing method of micro-structured stamping mold |
| TWI316466B (en) * | 2007-03-09 | 2009-11-01 | Ind Tech Res Inst | Mold structure and the manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4478769A (en) * | 1982-09-30 | 1984-10-23 | Amerace Corporation | Method for forming an embossing tool with an optically precise pattern |
| ES2382895T3 (es) * | 2001-03-29 | 2012-06-14 | Georgia-Pacific Consumer Products Lp | Rodillo de estampación grabado con láser |
-
2009
- 2009-12-24 TW TW098144652A patent/TWI494210B/zh not_active IP Right Cessation
-
2010
- 2010-06-24 US US12/822,313 patent/US20110156293A1/en not_active Abandoned
- 2010-12-20 JP JP2010283143A patent/JP2011131595A/ja not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3671405A (en) * | 1970-12-07 | 1972-06-20 | Budd Co | Method of electroforming on surfaces having projections |
| US3712706A (en) * | 1971-01-04 | 1973-01-23 | American Cyanamid Co | Retroreflective surface |
| US3935359A (en) * | 1972-06-23 | 1976-01-27 | Rowland Development Corporation | Retroreflective sheeting and method and apparatus for producing same |
| TW562755B (en) * | 1999-12-31 | 2003-11-21 | Ibm | Stamp device for printing a pattern on a surface of a substrate |
| TWI255471B (en) * | 2004-12-29 | 2006-05-21 | Ind Tech Res Inst | Manufacturing method of planar coils |
| TWI316466B (en) * | 2007-03-09 | 2009-11-01 | Ind Tech Res Inst | Mold structure and the manufacturing method thereof |
| TW200917333A (en) * | 2007-10-11 | 2009-04-16 | Univ Nat Cheng Kung | Manufacturing method of micro-structured stamping mold |
| TWM340414U (en) * | 2008-03-11 | 2008-09-11 | Hann Yu Technology Co Ltd | Electrolysis etching structure of light guide core |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011131595A (ja) | 2011-07-07 |
| US20110156293A1 (en) | 2011-06-30 |
| TW201121769A (en) | 2011-07-01 |
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