200917333 九、發明說明： 【發明所屬之技術領域】 本發明是㈣於-種製作具微結構㈣模具 =。’尤指-種可製作出具微米級圖案之金隸印模具 【先前技術】 廿声贫屬接具之製作方法係於一基材上，以 K光微影製程製作非導電之光阻圖 圖形，猎以定義出所 而模具之㈣’再利用t子束蒸財光 上蒸鍍一金屬薄膜，之後進行雷镱脫y跳/及基材 佼進仃電鑄脫杈離形而得到金 雖然上述習用金屬模具之製作方法可得到金 具，但是其製程設備之成本較高，且此製作方法之缺 點係於進行蒸鍍製程時’該薄膜在光阻侧壁之被覆性 不佳’造成部分區塊無法形成連續狀之導電薄膜，導 致電鑄後無法得到完整之金屬模具。 【發明内容】 可達到降低製程設備 、及晶種層被覆性較 本發明之主要目的係在於， 之成本、製程簡單、製程時間短 佳之功效。 的本毛明係一種製作具微結構壓 印模具之方法，俏於一萁4 ^ 糸於基板之一面上塗佈有光阻層； 200917333 利用-光源配合具有所需模具圖形之光罩於光阻層上 進行曝光及顯影，使光阻層於基板上形成與模具圖形 相反之光阻圖案層；再於光阻圖案層及基板上電鍍沉 積一導電薄膜層；之後於導電薄膜層上進行電鑄，使 該導電薄臈層上形成有所需厚度之電缚層；最後以化 學溶液浸泡將殘留之光阻圖案層移除，使該電缚層與 基材句離#以使電鑄層形成—具微結構之金屬模呈。 【實施方式】 "月參閱帛1〜6圖』所示’係分別為本發明步 驟-之：意圖、本發明步驟二之示意圖、本發明步驟 二之不意圖、本發明步驟四之示意圖及本發明步驟五 之不意圖。如圖所示：本發明係一 印模具之方法，其至少包含有下列步驟。、微4壓 步驟一.提供一基板1〇，並於該基板1〇之一 =佈光阻層2 〇，其中該基板i Q係可為石夕晶 玻璃基板，且該光阻層2 0係可為正型光阻或 為負型光阻。 步驟二：利用一 uv光源3 0配合具有所需模且 =…光罩40於光阻層20上進行 f所不）及顯影（如第4圖所示），使光阻層2 ◦於 土板1Q上形成與模具圖形相反之光阻圖案層η。、 用益：驟三：於上述光阻圖案層2 1及基板1 0上利 用無電極電鐘法電鑛沉積—導電薄膜層5〇。 200917333 步驟四：之後於導電薄膜層5 〇上進行電鑄，使 該導電薄膜層5 G上形成有所需厚度之電鑄層6 〇。 步驟五：最後以化學溶液7 〇浸泡將殘留之光阻 圖案層U移除，使該電鑄層6〇與基材1〇剝離， 猎以使電鑄層6 0形成·具微結構之金屬模具。 藉由上述之步驟可使本發明以無電極電鑛法於且 :光阻層2◦之基材10表面沉積一導電薄膜層； ’作為電鑄之電鑄晶種層，隨後進行電鑄製作出且 微米級圖案之金屬壓印模具，且可同時達到下列之優 1節省沉積電鑄晶種層之設備成本。 2 郎省沉積電鑄晶種層之時間。 3改善蒸鍍製程於母模側壁無法沉積晶種層之缺點£ 本發明在壓”財為了延長模具的制壽命， j利用輯法製作金屬模具取切基模具，以製程 備成本低之無電極電鍍的方式，取代傳統的 束洛鍍金屬薄臈製程來製作電鑄晶種層，可在非 及導體基材上同時沉積導電晶種層，且薄膜被覆 默二配合電鑄製程可用來製作具微結構之金屬模 」於1程具備成本低及可大面積生產之優勢，使 侍J：改良製程有著極大的發展優勢。 '斤述本發明製作具微結構壓印模具之方法200917333 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is (iv) a micro-structure (4) mold made in -. 'In particular, a gold-plated mold that can produce a micron-scale pattern. [Prior Art] The production method of the squeaky poor connection is based on a substrate, and a non-conductive photoresist pattern is produced by a K-light lithography process. , hunting to define the mold (4) 'reuse the t-beam steaming on the vapor deposited a metal film, then the Thunder y jump / and the substrate 佼 仃 electroforming cast off the shape to get gold although the above The manufacturing method of the conventional metal mold can obtain the metal fitting, but the cost of the processing equipment is high, and the disadvantage of the manufacturing method is that the partial coating of the thin film on the photoresist sidewall is poor when the vapor deposition process is performed. It is impossible to form a continuous conductive film, and it is impossible to obtain a complete metal mold after electroforming. SUMMARY OF THE INVENTION It is possible to achieve a reduction in process equipment and seed layer coverage. The main object of the present invention is to reduce the cost, process, and process time. Ben Maoming is a method for fabricating a micro-embossing mold, which is coated on a surface of a substrate with a photoresist layer; 200917333 uses a light source to match the light mask having the desired mold pattern to the light Exposing and developing on the resist layer, forming a photoresist pattern on the substrate opposite to the mold pattern; depositing a conductive film layer on the photoresist pattern layer and the substrate; and then performing electricity on the conductive film layer Casting, forming an electric binding layer of a desired thickness on the conductive thin layer; finally, removing the residual photoresist pattern layer by chemical solution so that the electrical binding layer is separated from the substrate to make the electroformed layer Formed - a metal mold with a microstructure. [Embodiment] "Monthly, see Fig. 1 to Fig. 6 is a step of the present invention: an intention, a schematic diagram of the second step of the present invention, a second step of the present invention, a schematic diagram of the fourth step of the present invention, and Step 5 of the present invention is not intended. As shown in the figure: The present invention is a method of printing a mold comprising at least the following steps. Step 4: providing a substrate 1 〇, and one of the substrates 1 布 = the photoresist layer 2 〇, wherein the substrate i Q can be a lithological glass substrate, and the photoresist layer 20 The system can be a positive photoresist or a negative photoresist. Step 2: using a uv light source 30 to match the desired mode and =... the reticle 40 is performed on the photoresist layer 20 and developed (as shown in FIG. 4), so that the photoresist layer 2 is smashed into the soil. A photoresist pattern layer η opposite to the mold pattern is formed on the board 1Q. Benefits: Step 3: On the above-mentioned photoresist pattern layer 2 1 and substrate 10, an electrodeless electric clock method is used to deposit a conductive thin film layer 5〇. 200917333 Step 4: Electroforming is then performed on the conductive film layer 5 to form an electroformed layer 6 所需 of a desired thickness on the conductive film layer 5 G. Step 5: Finally, the residual photoresist pattern layer U is removed by immersing in a chemical solution, so that the electroformed layer 6〇 is peeled off from the substrate 1〇, and the electroforming layer is formed to form a microstructured metal. Mold. By the above steps, the present invention can deposit an electroconductive thin film layer on the surface of the substrate 10 of the photoresist layer 2 by the electrodeless electrowinning method; 'as an electroformed seed layer of electroforming, followed by electroforming The metal imprinting mold of the micron-scale pattern can simultaneously achieve the following advantages: 1 saving the equipment cost of depositing the electroformed seed layer. 2 Lang's time to deposit electroforming seed layers. 3Improve the disadvantages of the evaporation process not being able to deposit the seed layer on the side wall of the master mold. The invention is based on the pressure to make the mold life of the mold, j is used to make the metal mold to take the cutting base mold, and the electrode has low preparation cost. The electroplating method replaces the traditional beam-plated metal thin tantalum process to make an electroformed seed layer, and the conductive seed layer can be simultaneously deposited on the non-conductor substrate, and the film is coated with a two-electron electroforming process. The micro-structured metal mold has the advantages of low cost and large-area production in one pass, which makes the service: the improved process has great development advantages. Method for producing a microstructured imprinting mold by the invention
可有效改善習用之插絲&田L 種種缺點，達到可降低製程設備之 ;程簡單、製程時間短、以及晶種層被覆性較 200917333 佳之功效’進而使本發明之產生 更符合消費者使用之所須，確已符更實用、 要件4依法提出專利申請。^轉利申請之 ^上料者，僅為本發明之較佳實施例而已， 二=Γ本發明實施之範圍4，凡依本發明 申明專利_及發明說明㈣容所作 化與修飾，皆應仍屬本發明專利涵蓋之範圍内 200917333 【圖式簡單說明】 第1圖’係本發明步驟一之不意圖。 第2圖，係本發明步驟二之示意圖。 第3圖，係本發明步驟二之示意圖。 第4圖，係本發明步驟三之示意圖。 第5圖，係本發明步驟四之示意圖。 第6圖，係本發明步驟五之示意圖。 【主要元件符號說明】 基板1 0 光阻層2 0 UV光源3 0 光罩4 0 圖形4 1 導電薄膜層5 0 電鑄層6 0 化學溶液7 0It can effectively improve the various shortcomings of conventional wire insertion and field L, and can reduce the process equipment; the process is simple, the process time is short, and the coverage of the seed layer is better than that of 200917333, which makes the invention more suitable for consumers. It must be more practical and necessary to file a patent application in accordance with the law. ^The application for the transfer is only the preferred embodiment of the present invention, and the scope of the present invention is as follows: 2, the invention and the description of the invention (4) It is still within the scope of the patent of the present invention 200917333 [Simple description of the drawing] Fig. 1 'is not intended to be the first step of the present invention. Figure 2 is a schematic diagram of the second step of the present invention. Figure 3 is a schematic diagram of the second step of the present invention. Figure 4 is a schematic view of the third step of the present invention. Figure 5 is a schematic view of the fourth step of the present invention. Figure 6 is a schematic diagram of the fifth step of the present invention. [Main component symbol description] Substrate 1 0 Photoresist layer 2 0 UV light source 3 0 Photomask 4 0 Pattern 4 1 Conductive film layer 5 0 Electroformed layer 6 0 Chemical solution 7 0