TWI492975B - Active energy line hardening resin - Google Patents
Active energy line hardening resin Download PDFInfo
- Publication number
- TWI492975B TWI492975B TW101106049A TW101106049A TWI492975B TW I492975 B TWI492975 B TW I492975B TW 101106049 A TW101106049 A TW 101106049A TW 101106049 A TW101106049 A TW 101106049A TW I492975 B TWI492975 B TW I492975B
- Authority
- TW
- Taiwan
- Prior art keywords
- acrylate
- active energy
- curable resin
- energy ray
- meth
- Prior art date
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- 239000011347 resin Substances 0.000 title claims description 42
- 229920005989 resin Polymers 0.000 title claims description 42
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 39
- 239000002216 antistatic agent Substances 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 claims description 4
- 239000012788 optical film Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- -1 phosphate ester Chemical class 0.000 description 35
- 239000005056 polyisocyanate Substances 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 230000000977 initiatory effect Effects 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
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- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AHBNSOZREBSAMG-UHFFFAOYSA-N 1,5-diisocyanato-2-methylpentane Chemical compound O=C=NCC(C)CCCN=C=O AHBNSOZREBSAMG-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- BRBMYNGGGPTKKL-UHFFFAOYSA-N 1,9-decanediol Chemical compound CC(O)CCCCCCCCO BRBMYNGGGPTKKL-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
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- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 229940044652 phenolsulfonate Drugs 0.000 description 1
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- 229920001748 polybutylene Polymers 0.000 description 1
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- Macromonomer-Based Addition Polymer (AREA)
Description
本發明是有關一種活性能量線硬化性樹脂用抗靜電劑、及含有該抗靜電劑之活性能量線硬化性樹脂。 The present invention relates to an antistatic agent for an active energy ray-curable resin and an active energy ray-curable resin containing the antistatic agent.
能量線硬化性樹脂,係用於各種基材的塗佈和接著等。這樣的能量線硬化性樹脂,由於容易帶靜電而容易附著灰塵或塵埃,根據用途的不同,有要求抗靜電性能的情形。 The energy ray-curable resin is used for coating, bonding, and the like of various substrates. Such an energy ray-curable resin tends to adhere to dust or dust due to the tendency to carry static electricity, and may have antistatic properties depending on the application.
於是,為了提高能量線硬化性樹脂的抗靜電性能,而提出各種提案。已揭示有例如:一種被覆組成物(專利文獻1)及一種紫外線硬化性樹脂(專利文獻2),該被覆組成物含有單體,該單體是在分子中含有磷酸酯以及丙烯醯氧基及/或甲基丙烯醯氧基,該紫外線硬化性樹脂含有單體,該單體具有四級銨鹽基及(甲基)丙烯醯基。然而,雖能夠確認此等組成物有降低一定的表面電阻值的功效,但仍要求一種能量線硬化性樹脂用的抗靜電劑,其具有更優異的抗靜電性能。 Therefore, various proposals have been made in order to improve the antistatic performance of the energy ray-curable resin. There is disclosed, for example, a coating composition (Patent Document 1) and an ultraviolet curable resin (Patent Document 2), the coating composition containing a monomer containing a phosphate ester and an acryloxy group in a molecule and / or methacryloxyloxy group, the ultraviolet curable resin contains a monomer having a quaternary ammonium salt group and a (meth) acrylonitrile group. However, although it has been confirmed that these compositions have an effect of lowering a certain surface resistance value, there is still a demand for an antistatic agent for an energy ray-curable resin which has more excellent antistatic properties.
專利文獻1:日本國特開昭63-006064號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. SHO 63-006064
專利文獻2:日本國特開2010-285480號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-285480
本發明是鑒於上述實情而研創,目的在於提供一種活性能量線硬化性樹脂用抗靜電劑、及含有該抗靜電劑之活性能量線硬化性樹脂,該抗靜電劑能夠較習知的具有抗靜電性的活性能量線硬化性樹脂更加降低表面電阻值。 The present invention has been made in view of the above circumstances, and an object of the invention is to provide an antistatic agent for an active energy ray-curable resin and an active energy ray-curable resin containing the antistatic agent, which can be antistatic with a known antistatic agent. The active active energy ray-curable resin further reduces the surface resistance value.
本發明人等反覆致力進行研究後,結果著眼於下述事實,發現當使用特定的磷酸酯化合物時,該磷酸酯化合物會局部存在於樹脂表面而顯示優異的表面電阻值,而完成本發明,該事實為:針對習知的具有抗靜電性能之活性能量線硬化性樹脂,因發揮抗靜電性能之磷酸酯基和四級銨鹽基分散在樹脂中,而使表面電阻值增加亦即抗靜電性能降低。 The inventors of the present invention have repeatedly made efforts to carry out research, and have found out that when a specific phosphate compound is used, the phosphate compound is locally present on the surface of the resin to exhibit an excellent surface resistance value, and the present invention has been completed. The fact is that, in view of the conventional active energy ray-curable resin having antistatic property, the phosphate resistance group and the quaternary ammonium salt group exhibiting antistatic properties are dispersed in the resin, and the surface resistance value is increased, that is, antistatic. Performance is reduced.
換言之,本發明的第一要旨為一種活性能量線硬化性樹脂用抗靜電劑,其特徵在於以下述通式(1)及/或(2)來表示:
本發明之第二要旨為一種活性能量線硬化性樹脂,其特徵在於:含有前述活性能量線硬化性樹脂用抗靜電劑。 According to a second aspect of the invention, there is provided an active energy ray-curable resin comprising the antistatic agent for an active energy ray-curable resin.
並且,本發明的前述活性能量線硬化性樹脂的表面電阻,較佳是1012Ω以下。 Further, the surface resistance of the active energy ray-curable resin of the present invention is preferably 10 12 Ω or less.
繼而,說明本發明的實施形態。 Next, an embodiment of the present invention will be described.
本發明之活性能量線硬化性樹脂用抗靜電劑(以下稱為抗靜電劑),是以下述通式(1)及/或(2)來表示的化合物。 The antistatic agent for an active energy ray-curable resin of the present invention (hereinafter referred to as an antistatic agent) is a compound represented by the following general formula (1) and/or (2).
通式(1)及/或(2)中,R為碳數8~13之烷基。此等取代 基無特別限定,能夠表示:辛基、壬基、癸基、十二烷基、十一烷基、十三烷基等直鏈狀之烷基;或三甲基己基、甲基庚基、二甲基庚基、三甲基庚基、四甲基庚基、乙基庚基、甲基辛基、甲基壬基、甲基癸基、甲基十二烷基、甲基十一烷基、甲基十三烷基等分支狀之烷基。 In the formula (1) and/or (2), R is an alkyl group having 8 to 13 carbon atoms. Such substitution The group is not particularly limited and can represent a linear alkyl group such as an octyl group, a decyl group, a decyl group, a dodecyl group, an undecyl group or a tridecyl group; or a trimethylhexyl group or a methylheptyl group; Dimethylheptyl, trimethylheptyl, tetramethylheptyl, ethylheptyl, methyloctyl, methyl decyl, methyl decyl, methyldodecyl, methylundecane a branched alkyl group such as a methyl group or a tridecyl group.
通式(1)及/或(2)中,n為0以上且6以下。當n超過6時,會發生下述問題:抗靜電性能會不充分,亦即表面電阻會成為1013Ω以上。 In the general formulae (1) and/or (2), n is 0 or more and 6 or less. When n exceeds 6, the following problem occurs: the antistatic property may be insufficient, that is, the surface resistance may become 10 13 Ω or more.
通式(1)與(2)之化合物的調配比例無特別限定,其莫耳比較佳是60:40~40:60。 The compounding ratio of the compounds of the formulae (1) and (2) is not particularly limited, and the molar ratio thereof is preferably 60:40 to 40:60.
本發明之抗靜電劑,可單獨使用1種,或亦可混合2種以上使用。 The antistatic agent of the present invention may be used singly or in combination of two or more.
本發明之抗靜電劑能夠使用市售之烷基(醚)磷酸酯型界面活性劑。例如:東邦化學股份有限公司製「Phosphanol(註冊商標)系列」、股份有限公司ADEKA製「ADEKA COL(註冊商標)PS/CS/TS系列」、第一工業製藥股份有限公司製「PLYSURF(註冊商標)系列」等。 A commercially available alkyl (ether) phosphate type surfactant can be used as the antistatic agent of the present invention. For example, "Phosphanol (registered trademark) series" manufactured by Toho Chemical Co., Ltd., "ADEKA COL (registered trademark) PS/CS/TS series manufactured by ADEKA Co., Ltd., and "PLYSURF" (registered trademark) manufactured by Daiichi Kogyo Co., Ltd. ) series" and so on.
本發明之抗靜電劑的調配量無特別限定,相對於活性能量線硬化性樹脂100重量份,較佳是3~15重量份,更佳是5~10重量份。若未達3重量份,則無法獲得充分的導電性能,若超過15重量份,則會發生滲出的問題。 The compounding amount of the antistatic agent of the present invention is not particularly limited, and is preferably from 3 to 15 parts by weight, more preferably from 5 to 10 parts by weight, per 100 parts by weight of the active energy ray-curable resin. If it is less than 3 parts by weight, sufficient electrical conductivity cannot be obtained, and if it exceeds 15 parts by weight, the problem of bleeding may occur.
本發明之活性能量線硬化性樹脂,無特別限定,能夠使用至今用於本發明的目標用途之活性能量線硬化性樹脂。 The active energy ray-curable resin of the present invention is not particularly limited, and an active energy ray-curable resin which has hitherto been used for the intended use of the present invention can be used.
前述活性能量線硬化性樹脂的較佳例,可舉例如含有丙烯酸系聚合物之活性能量線硬化性樹脂,該丙烯酸系聚合物係以下述化合物作為主成分:具有碳數1~14的烷基之丙烯酸酯及/或甲基丙烯酸酯之一種或兩種以上。 A preferred example of the active energy ray-curable resin is an active energy ray-curable resin containing an acrylic polymer having a compound having a carbon number of 1 to 14 as a main component. One or more of acrylate and/or methacrylate.
此外,亦可舉例如:一液型或二液型之胺酯(urethane)樹脂;或是能夠藉由熱聚合或放射線聚合來進行聚合的丙烯酸系樹脂或環氧樹脂等。 Further, for example, a one-liquid type or a two-liquid type urethane resin; or an acrylic resin or an epoxy resin which can be polymerized by thermal polymerization or radiation polymerization may be mentioned.
本發明之丙烯酸系聚合物無特別限定,係藉由熱聚合或放射線聚合來使下述習知慣用之單體進行聚合而得。前述單體之代表物可舉例如:(甲基)丙烯酸2-乙基己酯、苯乙烯、甲基丙烯酸甲酯、丙烯醯基嗎啉、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯氧基丙酯、(甲基)丙烯酸聚乙氧基苯酯、(甲基)丙烯酸苯基苯甲酯、鄰苯基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸鄰苯基苯氧基乙氧酯、(甲基)丙烯酸聚乙氧基鄰苯基苯氧基乙氧酯、(甲基)丙烯酸異佛酮酯、鄰苯二甲酸單(甲基)丙烯醯氧基乙酯、乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、1,4丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、EO(環氧乙烷,以下皆同)改質雙酚二(甲基)丙烯酸酯、PO(環氧丙烷,以下皆同)改質雙酚二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、EO改質三羥甲基丙烷三(甲基)丙烯酸酯、PO改質三羥甲基丙烷三(甲基)丙 烯酸酯、季戊四醇三(甲基)丙烯酸酯、((甲基)丙烯醯氧基乙基)異氰脲酸酯、季戊四醇四(甲基)丙烯酸酯、EO改質季戊四醇四(甲基)丙烯酸酯、PO改質季戊四醇四(甲基)丙烯酸酯、雙(三羥甲基丙烷)四(甲基)丙烯酸酯、EO改質雙(三羥甲基丙烷)四(甲基)丙烯酸酯、PO改質雙(三羥甲基丙烷)四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、EO改質二季戊四醇六(甲基)丙烯酸酯、PO改質二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯等。此等可單獨使用、或併用複數種。 The acrylic polymer of the present invention is not particularly limited, and is obtained by polymerizing a conventional monomer which is conventionally known by thermal polymerization or radiation polymerization. Representative examples of the above monomers include 2-ethylhexyl (meth)acrylate, styrene, methyl methacrylate, acryloylmorpholine, tetrahydrofurfuryl (meth)acrylate, and (methyl). Phenyloxyethyl acrylate, phenoxypropyl (meth)acrylate, polyethoxyphenyl (meth)acrylate, phenylbenzyl (meth)acrylate, o-phenylphenol (methyl) Acrylate, o-phenylphenoxyethoxy(meth)acrylate, polyethoxyethoxyphenoxyethoxy(meth)acrylate, isophorone (meth)acrylate, phthalate Mono(meth) propylene methoxyethyl formate, ethylene glycol di(meth) acrylate, propylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (a) Acrylate, polytetramethylene glycol di(meth)acrylate, 1,4 butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1 , 9-decanediol di(meth)acrylate, EO (ethylene oxide, the same as below) modified bisphenol di(meth)acrylate, PO (propylene oxide, all of the same) modified double Phenol di(meth)acrylate, trimethylolpropane tri Methyl) acrylate, EO modified trimethylolpropane tri(meth) acrylate, PO modified trimethylolpropane tri(methyl) propyl Ethyl ester, pentaerythritol tri(meth)acrylate, ((meth)acryloxyethyl)isocyanurate, pentaerythritol tetra(meth)acrylate, EO modified pentaerythritol tetra(meth)acrylic acid Ester, PO modified pentaerythritol tetra(meth)acrylate, bis(trimethylolpropane)tetra(meth)acrylate, EO modified bis(trimethylolpropane)tetra(meth)acrylate, PO Modified bis(trimethylolpropane)tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, EO modified dipentaerythritol hexa(meth) acrylate, PO modified dipentaerythritol hexa(methyl) ) acrylate, dipentaerythritol penta (meth) acrylate, and the like. These may be used alone or in combination.
此外,能夠藉由熱聚合或放射線聚合來進行聚合的胺酯樹脂,具體而言可舉例如胺酯(甲基)丙烯酸酯。 Further, an amine ester resin which can be polymerized by thermal polymerization or radiation polymerization is specifically, for example, an amine ester (meth) acrylate.
胺酯(甲基)丙烯酸酯,係使下述化合物進行反應而得:(A)多元醇、(B)多異氰酸酯、及(C)分子中具有羥基之(甲基)丙烯酸酯。 The amine ester (meth) acrylate is obtained by reacting the following compounds: (A) a polyhydric alcohol, (B) a polyisocyanate, and (C) a (meth) acrylate having a hydroxyl group in the molecule.
上述(A)多元醇無特別限定,具體而言能夠使用:聚酯多元醇、聚碳酸酯多元醇、聚醚多元醇、脂肪族烴系多元醇、脂環族烴系多元醇。 The (A) polyol is not particularly limited, and specifically, a polyester polyol, a polycarbonate polyol, a polyether polyol, an aliphatic hydrocarbon polyol, or an alicyclic hydrocarbon polyol can be used.
上述(B)多異氰酸酯無特別限定,具體而言可舉例如:脂肪族多異氰酸酯、脂環族多異氰酸酯、芳香族多異氰酸酯、芳香脂肪族多異氰酸酯。脂肪族多異氰酸酯可舉例如:四亞甲基二異氰酸酯、十亞甲基二異氰酸酯、六亞甲基二異氰酸酯、2,2,4-三甲基六亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯、離胺酸二異氰酸酯、2-甲基戊烷-1,5-二異氰酸酯、3-甲基戊烷-1,5-二異氰酸酯。脂環族多 異氰酸酯可舉例如:異佛酮二異氰酸酯、氫化二甲苯二異氰酸酯、4,4’-二環己基甲烷二異氰酸酯、1,4-環己烷二異氰酸酯、甲基伸環己基二異氰酸酯、1,3-雙(異氰酸基甲基)環己烷等。芳香族多異氰酸酯可舉例如:甲苯二異氰酸酯、2,2’-二苯基甲烷二異氰酸酯、2,4’-二苯基甲烷二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯(MDI)、4,4’-二苯甲基二異氰酸酯、1,5-萘二異氰酸酯、二甲苯二異氰酸酯、1,3-苯二異氰酸酯、1,4-苯二異氰酸酯等。芳香脂肪族多異氰酸酯可舉例如:二烷基二苯基甲烷二異氰酸酯、四烷基二苯基甲烷二異氰酸酯、α,α,α,α-四甲基二甲苯二異氰酸酯等。此外,可舉例如:此等有機多異氰酸酯之二聚物、三聚物、和縮二脲化異氰酸酯等改質體。此等亦能夠單獨使用、或併用兩種以上。 The (B) polyisocyanate is not particularly limited, and specific examples thereof include an aliphatic polyisocyanate, an alicyclic polyisocyanate, an aromatic polyisocyanate, and an aromatic aliphatic polyisocyanate. The aliphatic polyisocyanate may, for example, be tetramethylene diisocyanate, decamethyl diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4 Trimethyl hexamethylene diisocyanate, quaternary acid diisocyanate, 2-methylpentane-1,5-diisocyanate, 3-methylpentane-1,5-diisocyanate. Alicyclic The isocyanate may, for example, be isophorone diisocyanate, hydrogenated xylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, 1,4-cyclohexane diisocyanate, methylcyclohexyl diisocyanate, 1,3 - bis(isocyanatomethyl)cyclohexane or the like. Examples of the aromatic polyisocyanate include toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, and 4,4'-diphenylmethane diisocyanate (MDI). 4,4'-Diphenylmethyl diisocyanate, 1,5-naphthalene diisocyanate, xylene diisocyanate, 1,3-benzene diisocyanate, 1,4-phenylene diisocyanate or the like. The aromatic aliphatic polyisocyanate may, for example, be dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate or α,α,α,α-tetramethylxylene diisocyanate or the like. Further, for example, modified bodies such as dimers, trimers, and biuretized isocyanates of such organic polyisocyanates may be mentioned. These can also be used alone or in combination of two or more.
上述(C)分子中具有羥基之(甲基)丙烯酸酯無特別限定,具體而言可舉例如:丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、甲基丙烯酸2-羥基丙酯、丙烯酸4-羥基丁酯、己內酯改質丙烯酸2-羥基乙酯、聚乙二醇單丙烯酸酯、聚丙二醇單丙烯酸酯、聚丁二醇單丙烯酸酯、季戊四醇三丙烯酸酯、二季戊四醇五丙烯酸酯等。並且,也能夠使用:雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚酚醛型環氧樹脂等經由使環氧基進行(甲基)丙烯酸化而得之環氧丙烯酸酯。此等能夠單獨使用、或併用複數種。 The (meth) acrylate having a hydroxyl group in the above (C) molecule is not particularly limited, and specific examples thereof include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, and A. 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, caprolactone modified 2-hydroxyethyl acrylate, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, polybutylene glycol monoacrylate, pentaerythritol Triacrylate, dipentaerythritol pentaacrylate, and the like. Further, an epoxy acrylate obtained by (meth)acrylating an epoxy group, such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolak epoxy resin, can also be used. These can be used alone or in combination.
本發明之胺酯(甲基)丙烯酸酯能夠以習知方法來合 成。能夠以下述方式合成,例如:一次饋入預定量的(A)成分及(B)成分,並在70~80℃使其進行反應直到成為預定的游離異氰酸酯量為止後,再在氫醌單甲基醚等聚合抑制劑存在下一次饋入(C)成分,並在70~80℃加熱、攪拌直到游離異氰酸酯消失為止。此時,亦能夠為了促進反應而添加二月桂酸二丁錫等錫系觸媒。 The amine ester (meth) acrylate of the present invention can be combined by a conventional method to make. It can be synthesized by, for example, feeding a predetermined amount of the component (A) and the component (B) once, and reacting it at 70 to 80 ° C until it reaches a predetermined amount of free isocyanate, and then hydroquinone The polymerization inhibitor such as a group ether is fed to the component (C) in the next step, and heated and stirred at 70 to 80 ° C until the free isocyanate disappears. At this time, a tin-based catalyst such as dibutyltin dilaurate can also be added in order to promote the reaction.
上述放射線可舉例如:紫外線、雷射線、α射線、β射線、γ射線、X射線、電子束等。再者,當使用紫外線作為放射線時,添加光聚合起始劑。光聚合起始劑只要為下述物質即可:經由因應放射線反應成分的種類,來照射能夠引發其聚合反應之適當波長的紫外線,即能夠生成自由基或陽離子。 Examples of the radiation include ultraviolet rays, thunder rays, alpha rays, beta rays, gamma rays, X rays, electron beams, and the like. Further, when ultraviolet rays are used as the radiation, a photopolymerization initiator is added. The photopolymerization initiator may be any one that is capable of generating a radical or a cation by irradiating an ultraviolet ray of an appropriate wavelength capable of initiating a polymerization reaction thereof depending on the type of the radiation reaction component.
光自由基聚合起始劑可舉例如:安息香、安息香甲基醚、安息香乙基醚、鄰苯甲醯基苯甲酸甲酯-對安息香乙基醚、安息香異丙基醚、α-甲基安息香等安息香類;苯甲基二甲基縮酮、三氯苯乙酮、2,2-二乙氧基苯乙酮、1-羥基環己基苯基酮等苯乙酮類;2-羥基-2-甲基苯丙酮、2-羥基-4’-異丙基-2-甲基苯丙酮等苯丙酮類;二苯甲酮、甲基二苯甲酮、對氯二苯甲酮、對二甲基胺基二苯甲酮等二苯甲酮類;2-氯噻噸酮(2-chlorothioxanthone)、2-乙基噻噸酮、2-異丙基噻噸酮等噻噸酮類;雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物、2,4,6-三甲基苯甲醯基二苯基膦氧化物、2,4,6-三甲基苯甲醯基-乙氧基-苯基膦氧化物等醯基膦氧化物類;苯偶醯(benzil);二苯并環庚烯酮(dibenzosuberone);α-醯基 肟酯等。 The photoradical polymerization initiator may, for example, be benzoin, benzoin methyl ether, benzoin ethyl ether, methyl ortho-benzoylbenzoate-benzoic acid ethyl ether, benzoin isopropyl ether, α-methylbenzoin Benzoin; benzyl ketal, trichloroacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone and other acetophenones; 2-hydroxy-2 -propiophenone such as methyl phenyl ketone or 2-hydroxy-4'-isopropyl-2-methylpropiophenone; benzophenone, methyl benzophenone, p-chlorobenzophenone, p-dimethylene a benzophenone such as a carbamide benzophenone; a thioxanthone such as 2-chlorothioxanthone, 2-ethylthioxanthone or 2-isopropylthioxanthone; 2,4,6-trimethylbenzylidene)-phenylphosphine oxide, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, 2,4,6-trimethyl Tertylphosphine oxides such as benzamidine-ethoxy-phenylphosphine oxide; benzil; dibenzosuberone; α-fluorenyl Ester ester and the like.
光陽離子聚合起始劑可舉例如:芳香族重氮鎓鹽、芳香族錪鹽、芳香族鋶鹽等鎓鹽;鐵-丙二烯錯合物、二茂鈦錯合物、芳基矽醇-鋁錯合物等有機金屬錯合物類;硝基苯甲酯;磺酸衍生物;磷酸酯;苯酚磺酸酯;重氮萘醌;N-羥基醯亞胺磺酸鹽等。 The photocationic polymerization initiator may, for example, be an anthracene salt such as an aromatic diazonium salt, an aromatic onium salt or an aromatic onium salt; an iron-propadiene complex, a titanocene complex, or an aryl sterol; - an organic metal complex such as an aluminum complex; nitrobenzyl ester; a sulfonic acid derivative; a phosphate; a phenolsulfonate; a diazonaphthoquinone; an N-hydroxy quinone sulfonate;
相對於活性能量線硬化性樹脂100重量份,光聚合起始劑通常在0.1~10重量份之範圍內調配,以0.2~7重量份為佳。 The photopolymerization initiator is usually formulated in an amount of 0.1 to 10 parts by weight, preferably 0.2 to 7 parts by weight, based on 100 parts by weight of the active energy ray-curable resin.
亦能夠進一步併用胺類等光聚合起始助劑。前述光聚合起始助劑可舉例如:苯甲酸2-二甲基胺基乙酯、二甲基胺基苯乙酮、對二甲基胺基苯甲酸乙酯、對二甲基胺基苯甲酸異戊酯等。上述光聚合起始助劑亦能夠併用2種以上。 It is also possible to further use a photopolymerization initiation aid such as an amine. The photopolymerization initiation aid may, for example, be 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, ethyl p-dimethylaminobenzoate or p-dimethylaminobenzene. Isoamyl formate and the like. Two or more kinds of the above-mentioned photopolymerization initiation aids can also be used in combination.
本發明之活性能量線硬化性樹脂能夠藉由下述方式來獲得:在前述活性能量線硬化性樹脂的原料中調配預定量的抗靜電劑並使其進行聚合。 The active energy ray-curable resin of the present invention can be obtained by disposing a predetermined amount of an antistatic agent in a raw material of the active energy ray-curable resin and polymerizing it.
在本發明之活性能量線硬化性樹脂中,除了前述聚合起始劑和聚合起始助劑以外,亦能夠因應需要而添加:稀釋溶劑、潤滑劑、塗平(leveling)劑、填料等。 In addition to the above-mentioned polymerization initiator and polymerization initiation aid, the active energy ray-curable resin of the present invention may be added as needed: a diluent solvent, a lubricant, a leveling agent, a filler, and the like.
本發明之活性能量線硬化性樹脂的表面電阻,較佳是1012Ω以下,更佳是1010Ω以下。當表面電阻值超過1012Ω時,會發生塵埃因帶電而附著等之問題。 The surface resistance of the active energy ray-curable resin of the present invention is preferably 10 12 Ω or less, more preferably 10 10 Ω or less. When the surface resistance value exceeds 10 12 Ω, there is a problem that dust adheres due to charging.
以下,列舉實施例來更其體說明本發明,但本發明並不受此等實施例所限定。再者,實施例、比較例中,只要未特別說明,份及%即為重量基準。 Hereinafter, the present invention will be described by way of examples, but the present invention is not limited by the examples. In the examples and comparative examples, the parts and % are based on weight unless otherwise specified.
1.活性能量線硬化性樹脂之合成 1. Synthesis of active energy ray-curable resin
[合成例1] [Synthesis Example 1]
在燒瓶中饋入雙酚A型環氧丙基醚(環氧當量=450)之丙烯酸酯3445g(3.3mol)、氫醌單甲基醚1.81g、二甲苯二異氰酸酯188g(1mol),在70~80℃之條件下使其進行反應直到殘留異氰酸酯濃度成為0.1%為止,而獲得活性能量線硬化性樹脂。 In the flask, 3445 g (3.3 mol) of acrylate of bisphenol A type epoxy propyl ether (epoxy equivalent = 450), 1.81 g of hydroquinone monomethyl ether, and 188 g (1 mol) of xylene diisocyanate were fed at 70 The reaction was carried out under the conditions of ~80 ° C until the residual isocyanate concentration became 0.1%, and an active energy ray-curable resin was obtained.
[合成例2] [Synthesis Example 2]
在燒瓶中饋入雙酚A型環氧丙基醚(環氧當量=450)之丙烯酸酯3445g(3.3mol)、氫醌單甲基醚1.81g、丙烯酸苯氧基乙酯2422g、二甲苯二異氰酸酯188g(1mol),在70~80℃之條件下使其進行反應直到殘留異氰酸酯濃度成為0.1%為止,而獲得活性能量線硬化性樹脂。 In the flask, 3,455 g (3.3 mol) of acrylate of bisphenol A type epoxy propyl ether (epoxy equivalent = 450), 1.81 g of hydroquinone monomethyl ether, 2422 g of phenoxyethyl acrylate, and xylene were fed. 188 g (1 mol) of an isocyanate was reacted at 70 to 80 ° C until the residual isocyanate concentration became 0.1%, and an active energy ray-curable resin was obtained.
2.活性能量線硬化性樹脂之調整 2. Adjustment of active energy ray-curable resin
在上述中所得之合成例1或2中,分別以表2所示之比例(重量份)來調配下述表1所示之抗靜電劑,並且調配作為光聚合起始劑之α-羥基烷基苯基酮(製品名:Irgacure 184,BASF公司製)3重量%、作為稀釋劑的乙酸乙酯50重量%並混合,而獲得活性能量線硬化性樹脂。 In the synthesis example 1 or 2 obtained above, the antistatic agents shown in the following Table 1 were formulated in the proportions (parts by weight) shown in Table 2, and the α-hydroxyalkane as a photopolymerization initiator was formulated. A phenyl ketone (product name: Irgacure 184, manufactured by BASF Corporation) was added in an amount of 3 wt%, and ethyl acetate was 50 wt% as a diluent to obtain an active energy ray-curable resin.
3.活性能量線硬化性樹脂之評估 3. Evaluation of active energy ray-curable resin
<評估樣品之製作> <Production of evaluation samples>
將由上述所得之活性能量線硬化性樹脂旋轉塗佈(500rpm、5sec1500rpm、15sec)於PET薄膜(Toray製LUMIRROR)(電暈處理面)上,並以80℃乾燥10分鐘後,藉由高壓水銀燈來照射200mJ/cm2的紫外線,而製作成評估樣品。 The active energy ray-curable resin obtained above was spin-coated (500 rpm, 5 sec) 1500 rpm, 15 sec) on a PET film (LUMIRROR manufactured by Toray) (corona treated surface), and dried at 80 ° C for 10 minutes, and then irradiated with ultraviolet rays of 200 mJ/cm 2 by a high pressure mercury lamp to prepare an evaluation sample.
<表面電阻測定條件> <Surface resistance measurement conditions>
使用股份有限公司ADVANTEST製R8340 ULTRA HIGH RESISTANCE METER,在溫度20℃、濕度65%的條件下進行測定。評估結果如上述表1所示。 The measurement was carried out under the conditions of a temperature of 20 ° C and a humidity of 65% using R8340 ULTRA HIGH RESISTANCE METER manufactured by ADVANTEST Co., Ltd. The evaluation results are shown in Table 1 above.
由表2所示之結果可知,當通式(1)中的R、n超出預 定範圍外時(比較例2~3)、當構造與通式(1)不同時(比較例5~7),抗靜電劑的表面電阻值會超過1012Ω。 As is clear from the results shown in Table 2, when R and n in the general formula (1) are outside the predetermined range (Comparative Examples 2 to 3) and when the structure is different from the general formula (1) (Comparative Examples 5 to 7) The surface resistance of the antistatic agent will exceed 10 12 Ω.
本發明的抗靜電劑、及使用該抗靜電劑而成之活性能量線硬化性樹脂,能夠適合地用於光學薄膜用硬塗膜、光學膜、抗靜電保護膜。 The antistatic agent of the present invention and the active energy ray-curable resin obtained by using the antistatic agent can be suitably used for a hard coat film for an optical film, an optical film, and an antistatic protective film.
以上,參照特定實施態樣來詳細地說明本發明,但對本發明所屬技術領域中具有通常知識者而言,能夠在不脫離本發明的精神及範圍的情形下加以各種變更和修正,係屬顯而易知。 The present invention has been described in detail above with reference to the specific embodiments of the present invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. And easy to know.
本申請案係依據在2011年4月7日所申請之日本專利申請案(日本特願2011-085008),並將其內容援用於此作為參照。 The present application is based on a Japanese patent application filed on Apr. 7, 2011 (Japanese Patent Application No. 2011-085008).
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