TWI491085B - Complex heat dissipater and manufacturing method thereof - Google Patents

Description

Composite heat sink and manufacturing method thereof

The invention relates to a composite heat dissipating body and a manufacturing method thereof, in particular to a composite heat dissipating body which combines a temperature equalizing material and a heat radiating material to achieve heat radiation enhancement.

In the rapid progress of technological innovation, along with the trend of miniaturization of semiconductor components, small-sized high-power semiconductors (such as high-power LEDs, high-frequency components, etc.) due to insufficient congenital conditions of small heat dissipation surface area. High-power transistor components must pass through the conduction of multiple layers to conduct heat generated by their own operation to the heat-dissipating components (or heat-dissipating fins) having a sufficient heat-dissipating area to be dispersed. Therefore, the small-sized semiconductor (small volume) Electronic components) External heat transfer efficiency is an important factor affecting the overall heat dissipation. Therefore, a metal circuit ceramic circuit board made of copper or aluminum is formed on the surface of a ceramic substrate having high insulating properties and high thermal conductivity, such as an aluminum nitride substrate or a tantalum nitride substrate, and therefore, the heat dissipation plate as the inside thereof is used. A substrate formed of a copper or aluminum substrate is used, for example, as a substrate for a power module. In general, the heat dissipation performance of metal materials accounts for more than 50% of heat conduction, about 30% of heat convection, and about 20% of heat radiation. In the heat dissipation performance of tantalum carbide material, heat radiation accounts for more than 50% and heat conduction is about It accounts for less than 30% and thermal convection accounts for less than 20%. Therefore, How to combine the heat dissipation performance of different materials is an urgent task for many researchers.

A typical heat dissipation structure of a conventional ceramic circuit board is generally formed of a solder substrate of a ceramic circuit board, and the bottom plate is generally copper or aluminum. However, if the structure has a thermal load, the thermal expansion coefficient of the bottom plate and the ceramic circuit substrate is inferior, and cracks in the solder layer are caused. As a result, heat dissipation is insufficient, and the semiconductor on the circuit is malfunctioning or broken.

Therefore, Japanese Patent Publication No. Hei 05-507030 proposes an aluminum alloy-carbonized tantalum composite having a coefficient of expansion similar to that of a ceramic circuit board as a base plate.

The bottom plate is mostly locked with a heat dissipating fin or a heat dissipating component, and a high thermal conductive heat dissipating paste is applied to the gap of the lock to reduce the thermal conductivity, and the ceramic circuit substrate, the bottom plate, the heat dissipating fin or the heat dissipating component are present. The problem of the heat dissipation of the entire module is reduced.

In the case of the "Aluminum-Carbide Composite" of the Republic of China Invention Patent Publication No. I357788, in order to solve the above problems, it is disclosed that a flat carbonized tantalum porous body is impregnated with aluminum metal, and an aluminum layer is provided on both main surfaces, and aluminum on the heat dissipating surface side is provided. The layer is formed by mechanical processing to reduce voids and has good heat dissipation properties after solder ceramic circuit board.

In the case of the Republic of China new patent announcement M355006 "heat dissipation module structure" and the announcement M395821 "ceramic heat sink", it is disclosed that the SiC sintered body having the heat dissipation fins is directly formed.

In the case of the Republic of China Invention Patent Publication No. 432027 "Recrystallized SiC sintered body of high electrical resistance and high thermal conductivity and a method for producing the same", the formation pressure and temperature of the SiC sintered body are as high as 2 atm and 2500 °C.

In light of the above-mentioned conventional techniques, the inventors believe that the problems in which the respective techniques still have considerable difficulty in the application of niobium carbide must be overcome. First of all, the formation pressure of the SiC sintered body is quite high compared with the temperature, which deviates from the concept of the current green process of energy saving and carbon reduction, and at the same time, the yield of the SiC sintered body with the fins is formed by the difficulty of sintering. Improvement is extremely difficult. Furthermore, impregnation of aluminum metal also requires a large amount of energy to maintain the state of the aluminum melt, and additional machining still affects heat dissipation.

In view of the above shortcomings, the inventor feels that he has not perfected it, exhausted his mind and researched and overcome it, and based on his accumulated years of industrial experience, he proposed a composite heat sink and its manufacturing method to achieve the utilization of heat. Radiation heat dissipation, and the customization of various forms of application, while reducing energy consumption.

In order to achieve the above object, the present invention provides a composite heat dissipating body mainly comprising a carrier plate containing carbon elements, a plurality of thermal dispersing elements containing carbon elements, a temperature equalizing block material and at least one temperature equalizing strip, wherein the first surface of the carrier plate The heat dissipating component is arranged, the second surface is integrated with the temperature equalizing block, and the temperature equalizing bar is combined with the temperature equalizing block material, and penetrates the carbon-containing hot diverging element and the carbon-containing carrier plate.

Meanwhile, the present invention further provides a method for manufacturing a composite heat dissipating body, which comprises the following processes: providing a carbonaceous material in a first atmospheric pressure low temperature environment, using a carrier mold Forming a carrier plate containing carbon elements; providing a carbonaceous material in the first atmospheric low temperature environment described above, forming a heat dissipating component containing a carbon element by using a heat dissipating component mold; and arranging a heat dissipating component containing a carbon element in combination with the carrier plate a first surface; providing a temperature equalizing block that is integrated with the second surface of the carrier.

The carrier and the heat dissipating component are separately manufactured to reduce the chance of occurrence of a defect rate.

One of the objects of the present invention is to provide a suitable temperature-average intermediate to enhance the efficiency of heat radiation. Therefore, it is further provided with a heat-distributing element and a carbon-containing element which are combined with a temperature-averaging block and a carbon-containing element. The carrier of the elements.

One of the objects of the present invention is to complete the manufacture of a composite heat sink in a low-temperature environment at normal pressure, thereby achieving social responsibility for reducing energy consumption. The manufacturing method can be completed in an environment not higher than 1000 ° C or below 800 ° C. The production method is not particularly limited, and hot press forming, extrusion molding, casting molding, or the like can be used.

One of the objects of the present invention is to improve overall yield while combining multiple items, while reducing the reimbursement cost of scrap.

The carbonaceous carrier may be a carbonized carbide carrier, a graphite carrier, or a diamond-like carrier. Further, the carbon-containing thermal dispersion component may generally be a tantalum carbide thermal diverging component or a graphite thermal diffusion component, or A diamond-like heat-dissipating component, and a carbon-containing carrier plate, a carbon-containing heat-dissipating component, or an interface between the temperature-sensitive materials is integrated into a sintering method, a gluing method, or both. Further, you can The shape of the heat dissipating component containing carbon element is made into a sphere, a hemisphere, a round cake body, or a cone cylinder to increase the surface area of heat radiation, and the radiation direction can be adjusted according to the heat distribution state, and the heat dissipating component can also be a single Layer or multilayer stacking increases the margin of adjustment.

However, the above description is only an overview of some of the features of the present invention. In order to enable the reviewing committee and the professionals who read this specification to have a better understanding and understanding of the technical features and effects of the present invention, The invention is not limited to the scope of the invention, and any modifications or alterations to the invention in the spirit of the invention should be included in the protection of the invention. range.

Hereinafter, the composite heat dissipating body and the manufacturing method thereof according to the preferred embodiment of the present invention will be described with reference to the related drawings. For the sake of understanding, the same components in the following embodiments are denoted by the same reference numerals.

Please refer to the first figure for a cross section of the composite heat sink. In the figure, the composite heat sink 1 mainly comprises a carrier plate 11 containing carbon elements, a plurality of thermal diffusing elements 12 containing carbon elements, a temperature equalizing block 13 and a temperature equalizing strip 14, wherein the first surface 111 of the carrier plate 11 is arranged There is a heat dissipating element 12, the second surface 112 is integrated with the temperature equalizing block 13, and the temperature equalizing strip 14 is combined with the temperature equalizing block 13, and penetrates the carbon-containing heat radiating element 12 and the carbon-containing carrier plate. 11.

Among them, the carbon-containing carrier plate can generally be a ruthenium carbide carrier plate or a graphite carrier plate. Or a diamond-like carrier, and the carbon-containing heat-dissipating component can generally be a carbonized tantalum heat-dissipating component, a graphite heat-dissipating component, or a diamond-like heat-dissipating component, and the temperature-average block or the uniform temperature bar can generally be aluminum. a metal or alloy having better thermal conductivity such as copper, and a carrier plate containing a carbon element, a heat dissipating element containing a carbon element, or a sintering method in which an interface between the temperature equalizing materials is integrated, a gluing method, or a combination thereof Gluing method generally uses inorganic glue as needed. Further, the shape of the carbon-containing element of the heat-dissipating element can be made into a sphere, a hemisphere, a round cake, or a cone-shaped body to increase the surface area of the heat radiation, and the radiation direction can be adjusted according to the heat distribution state, and at the same time, the heat is diverged. The component can also increase the margin of adjustment for single or multi-layer stacking. Furthermore, the composite heat dissipating body can be manufactured in an environment not higher than 1000 ° C or below, or can be completed under 800 ° C. The forming method is not particularly limited, and hot press forming, extrusion molding, casting molding, etc. can be used. .

Please refer to the second figure for a flow chart of the manufacturing method of the composite heat sink. The steps are as follows: Step S11: providing a carbonaceous material in a first atmospheric pressure low temperature environment, using a carrier mold to form a carbonaceous carrier; step S12: providing a carbonaceous material in the first atmospheric low temperature In the environment, the hot diverging element mold is used to mold the carbon-containing element of the heat-dissipating element; step S13: the heat-distributing element arranging the carbon-containing element is coupled to the first surface of the carrier; and step S14: providing the temperature-average block and the carrier The second surface is integrated into one.

Step S141 may be added before step S14: combining the temperature equalization bar and the temperature equalization block The material allows the temperature equalization strip to pass through the carbon-containing thermal diverging element and the carbon-containing carrier.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. The invention has the above-mentioned numerous performances and practical values, and can effectively improve the overall economic benefit. Therefore, the present invention is indeed an innovative invention, and the same or similar products are not publicly used in the same technical field, and should have been In accordance with the requirements of the invention patent, the application is made in accordance with the law, and the invention patent is granted.

1‧‧‧Composite heat sink

111‧‧‧ first surface

112‧‧‧ second surface

11‧‧‧Carbon board with carbon

12‧‧‧Heat-emitting elements with carbon

13‧‧‧All temperature block

14‧‧‧All temperature bars

S11~S14‧‧‧ Process steps

The first figure is a cross-sectional view of the composite heat sink; and the second figure is a flow chart of the manufacturing method of the composite heat sink.

1‧‧‧Composite heat sink

111‧‧‧ first surface

112‧‧‧ second surface

11‧‧‧Carbon board with carbon

12‧‧‧Heat-emitting elements with carbon

13‧‧‧All temperature block

14‧‧‧All temperature bars

Claims (9)

A composite heat dissipating body comprising: a carbonaceous carrier plate having a first surface and a second surface; a plurality of carbon-containing elements having a heat dissipating component arranged on the first surface of the carrier; a uniform temperature block integrally integrated with the second surface of the carrier; and at least one uniform temperature strip extending through the carbon-containing thermal diverging element and the carbon-containing carrier, and Warm block material for bonding. The composite heat dissipating body according to claim 1, wherein the carbon-containing carrier plate is a tantalum carbide carrier plate, a graphite carrier plate, or a diamond-like carrier plate. The composite heat dissipating body according to claim 1, wherein the carbon-containing thermal dissipating component is a tantalum carbide thermal diverging component, a graphite thermal diverging component, or a diamond-like thermal diverging component. A method for manufacturing a composite heat dissipating body, comprising: providing a carbonaceous material in a first atmospheric pressure low temperature environment, forming a carbonaceous carrier by using a carrier mold; providing a carbonaceous material in the foregoing In the first atmospheric low temperature environment, a heat dissipating component mold is used to mold a carbon-containing thermal dissipating component; the thermal dispersing component arranging the carbon-containing element is coupled to one of the first surfaces of the carrier; and providing a uniform temperature The block is integrated with the second surface of one of the carrier plates. The method for manufacturing a composite heat sink according to claim 4, wherein The method further includes bonding at least one temperature equalizing strip to the temperature-average block, and passing through the carbon-containing element of the heat-dissipating element and the carbon-containing carrier. The method for manufacturing a composite heat sink according to claim 4, wherein the carbon-containing carrier is a tantalum carbide carrier, a graphite carrier, or a diamond-like carrier. The method for manufacturing a composite heat sink according to the fourth aspect of the invention, wherein the carbon-containing heat-dissipating component is a tantalum carbide heat-dissipating component, a graphite heat-dissipating component, or a diamond-like heat-emitting component. The method for manufacturing a composite heat sink according to claim 4, wherein the first atmospheric low temperature environment is not higher than 1000 degrees Celsius at 1 atm. The method for manufacturing a composite heat sink according to claim 4, further comprising providing a carrier for the carbon-containing element, the carbon-containing element of the heat-dissipating element, or the interface between the temperature-averaging blocks One-piece sintering method, gluing method, or both.