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TWI489055B - 發光二極體燈條 - Google Patents

發光二極體燈條 Download PDF

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Publication number
TWI489055B
TWI489055B TW101123948A TW101123948A TWI489055B TW I489055 B TWI489055 B TW I489055B TW 101123948 A TW101123948 A TW 101123948A TW 101123948 A TW101123948 A TW 101123948A TW I489055 B TWI489055 B TW I489055B
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Prior art keywords
light
electrode
emitting diode
substrate
cover
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TW101123948A
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English (en)
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TW201400742A (zh
Inventor
Ming Ta Tsai
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Advanced Optoelectronic Tech
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)

Description

發光二極體燈條
本發明涉及一種發光二極體燈條。
發光二極體(Light Emitting Diode，LED)是一種可將電流轉換成特定波長範圍的光電半導體元件。發光二極體以其亮度高、工作電壓低、功耗小、易與積體電路匹配、驅動簡單、壽命長等優點，從而可作為光源而廣泛應用於照明領域。
發光二極體燈條通常包括基板以及設置於基板之上的發光二極體晶粒。基板上設置有導電結構，發光二極體晶粒與導電結構相連接。一上蓋體與一下蓋體覆蓋在基板的兩相反表面而形成燈條結構。然而，在上述燈條結構中，水氣容易進入燈條結構的內部而對基板導電結構的電性能造成影響。
有鑒於此，有必要提供密封性能較好的發光二極體燈條。
一種發光二極體燈條，包括：基板，具有第一表面與第二表面，基板的第一表面設置有第一電極與第二電極；發光二極體晶粒，設置於基板的第一表面之上且分別與第一電極與第二電極電連接； 封裝材料層，覆蓋所述發光二極體晶粒；保護層，覆蓋所述第一電極與第二電極；以及第一蓋體與第二蓋體，分別覆蓋在基板的第一表面與第二表面之上。
在上述發光二極體燈條中，由於第一電極與第二電極暴露在封裝材料層之外的部分為保護層所覆蓋，因此，即使水氣藉由基板與第一蓋體或第二蓋體之間的間隙進入到燈條的內部時，其亦不容易貼附在第一電極與第二電極之上而對第一電極與第二電極的導電性能造成影響。
10、20‧‧‧發光二極體燈條
110‧‧‧基板
111‧‧‧第一表面
112‧‧‧第二表面
113‧‧‧第一電極
114‧‧‧第二電極
115‧‧‧第一凹槽
116‧‧‧第二凹槽
120‧‧‧發光二極體晶粒
130‧‧‧封裝材料層
140、240‧‧‧保護層
150‧‧‧第一蓋體
160‧‧‧第二蓋體
170‧‧‧驅動裝置
圖1係本發明第一實施例所提供的發光二極體燈條的結構示意圖。
圖2係本發明第二實施例所提供的發光二極體燈條的結構示意圖。
以下參照圖示，對本發明的發光二極體燈條進行進一步的說明。
請參見圖1，本發明第一實施例提供的發光二極體燈條10包括基板110、設置於基板110上的發光二極體晶粒120、封裝材料層130、保護層140、第一蓋體150以及第二蓋體160。
基板110具有第一表面111與第二表面112。第一表面111上設置有第一電極113與第二電極114。第一電極113與第二電極114之間相互絕緣。在本實施例中，基板110的第一表面111上設置有第一凹槽115與第二凹槽116。第一凹槽115用於容置第一電極113，第二 凹槽116用於容置第二電極114，從而使第一電極113與第二電極114的上表面與第一表面相平齊。所述第一電極113與第二電極114的材料選自金、銀、鋁、鎳、銅或者其合金。
發光二極體晶粒120設置於基板110的第一表面111之上。發光二極體晶粒120分別與第一電極113與第二電極114電連接。藉由在第一電極113與第二電極114之間施加一驅動電壓以驅動發光二極體晶粒120發光。所述發光二極體晶粒120的製作材料可以是氮化鎵(GaN)、氮化鋁鎵(AlGaN)、氮化銦鎵(InGaN)以及氮化鋁鎵銦(AlInGaN)等。
封裝材料層130覆蓋在發光二極體晶粒120之上，用於防止發光二極體晶粒120受外界水氣或者灰塵的影響。根據需要，在封裝材料層130中可以填充螢光粉粒子。所述螢光粉粒子吸收發光二極體晶粒120所發出的光線，並將其轉換成另一波長的光線。所述螢光粉粒子的材料選自釔鋁石榴石、硫化物、矽酸鹽、氮化物與氮氧化物其中之一或其混合物。
保護層140覆蓋在第一電極113與第二電極114之上，用於防止水氣貼附在第一電極113與第二電極114之上而對第一電極113與第二電極114的導電性能造成影響。所述保護層140由透明材料製成。在本實施例中，保護層140的上表面為平面。保護層140的製作材料包括樹脂(epoxy)，矽膠(silicone)，聚鄰苯二甲醯胺(polyphthalamide，PPA)，以及聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)。
第一蓋體150覆蓋在基板110的第一表面111之上，第二蓋體160覆蓋在基板110的第二表面112之上。發光二極體晶粒120所發出的 光線藉由封裝材料層130後，經由第一蓋體150出射到外界。在本實施例中，第一蓋體150與第二蓋體160為圓弧狀結構，第一蓋體150與第二蓋體160分別貼附在基板110的第一表面111與第二表面112之上而形成燈條結構。第一蓋體150由透光材料製成，其製作材料包括玻璃、聚碳酸酯以及聚甲基丙烯酸甲酯。第二蓋體160由金屬材料製成，發光二極體晶粒120在發光過程中所產生的熱量可有效藉由基板110傳遞到第二蓋體160上，然後藉由第二蓋體160散發到外界環境。
根據需要，所述發光二極體燈條10還可以進一步包括驅動裝置170。所述驅動裝置設置於基板110的第二表面112之上，用以將外界電壓轉換為適合於驅動發光二極體晶粒120發光的驅動電壓。所述第二蓋體覆蓋所述驅動裝置170。
可以理解的是，所述保護層的形狀與結構並不限於以上實施方式。請參閱圖2，為本發明第二實施方式所提供的發光二極體燈條20。在本實施例中，所述保護層240的上表面為凸曲面，且保護層240的厚度沿遠離封裝材料層130的方向上逐漸減小。由於保護層240的上表面為凸曲面，發光二極體晶粒120所發出的光線在經過封裝材料層130而進入保護層240時，所述凸曲面可以使光線朝向發光二極體晶粒120的光軸方向偏轉，從而使發光二極體燈條20具有更好的光分佈情況。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10‧‧‧發光二極體燈條
110‧‧‧基板
111‧‧‧第一表面
112‧‧‧第二表面
113‧‧‧第一電極
114‧‧‧第二電極
115‧‧‧第一凹槽
116‧‧‧第二凹槽
120‧‧‧發光二極體晶粒
130‧‧‧封裝材料層
140‧‧‧保護層
150‧‧‧第一蓋體
160‧‧‧第二蓋體
170‧‧‧驅動裝置

Claims (8)

  1. 一種發光二極體燈條，包括：基板，具有第一表面與第二表面，基板的第一表面設置有第一電極與第二電極；發光二極體晶粒，設置於基板的第一表面之上且分別與第一電極與第二電極電連接；封裝材料層，覆蓋所述發光二極體晶粒；保護層，覆蓋所述第一電極與第二電極，所述保護層的上表面為凸曲面，所述保護層的厚度沿遠離封裝材料層的方向上逐漸減小；以及第一蓋體與第二蓋體，分別覆蓋在基板的第一表面與第二表面之上。
  2. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述保護層由透明材料製成。
  3. 如申請專利範圍第2項所述之發光二極體燈條，其中，所述保護層的製作材料選自樹脂、矽膠、聚鄰苯二甲醯胺以及聚甲基丙烯酸甲酯。
  4. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述保護層的上表面為平面。
  5. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述發光二極體燈條進一步包括驅動裝置，所述驅動裝置設置於基板的第二表面之上，所述第二蓋體覆蓋所述驅動裝置。
  6. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述基板的第一表面上形成有第一凹槽與第二凹槽，第一電極設置於第一凹槽之中，第二電極設置於第二凹槽之中，且第一電極與第二電極的上表面與第一表面相平齊。
  7. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述第一蓋體的製作材料選自玻璃、聚碳酸酯以及聚甲基丙烯酸甲酯其中之一。
  8. 如申請專利範圍第1項所述之發光二極體燈條，其中，所述第二蓋體由金屬材料製成。
TW101123948A 2012-06-29 2012-07-03 發光二極體燈條 TWI489055B (zh)

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CN203697831U (zh) 2013-11-04 2014-07-09 宁波米德兰电子制造有限公司 一种新型圣诞老人像
JP6375140B2 (ja) * 2014-04-30 2018-08-15 日東電工株式会社 熱伝導性ポリマー組成物及び熱伝導性成形体
KR20170001390A (ko) 2015-06-26 2017-01-04 위-난 왕 스트립 조명 및 이를 응용한 조명 장치
AT521023B1 (de) * 2018-05-16 2019-10-15 Pavani Christoph Zierleiste

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