TWI487811B - Etching solution capable of effectively reducing galvanic effect - Google Patents

Description

An etchant that effectively slows the Giovanni effect

The present invention relates to an etching solution, and more particularly to an etching solution containing a nitrogen-containing five-membered heterocyclic compound which can effectively alleviate the Giovanni effect.

In the back-end process of a printed circuit board or an integrated circuit, in order to produce a metal layer (ie, a wire or a solder pad) having a specific pattern on a printed circuit board or a germanium wafer, it is usually transmitted through a lithography technique. This is done in combination with a specific etching solution, such as a ferric chloride-based etching solution, a copper chloride-based etching solution, an alkaline etching solution, or the like. However, among these etching liquids, there is a problem called undercut.

Please refer to the first and second figures, which are schematic diagrams of the process of fabricating a copper layer with a specific pattern on a printed circuit board. In a general printed circuit board copper wire process, as shown in the first figure, an etch-resisting layer 12' having a specific pattern is formed on the copper layer 11' on the substrate 10'; Then, the copper layer 11' not covered by the resist layer 12' is removed by wet etching; finally, after removing the etch-resisting layer 12', for example, the copper wire or the copper pad has a specific A patterned copper layer 11' is formed over the substrate 10'. However, with the new generation of products For the requirement of the line width of the printed circuit board wires, as shown in the second figure, when the ultrafine copper wires are fabricated, the copper layer 11' covered by the resist layer 12' also begins to produce lateral etching. This phenomenon is called undercut.

In addition, due to the high popularity of consumer electronic products such as smart phones and tablet PCs, traditional printed circuit boards using copper wires as signal transmissions have been unable to load the high-frequency, high-speed applications of these consumer electronic products; therefore, copper/gold Hybrid printed circuit boards have been proposed and applied to such consumer electronic products as described above. Please refer to the third figure for a top view of a copper/gold hybrid printed circuit board. As shown in the third figure, the substrate 10" is formed with a copper wire 11" and a gold wire 12", wherein the reduction potential of the gold wire 12" is lower than that of the copper wire 11", and thus, by wet etching When the copper wire 11" and the gold wire 12" are formed on the substrate 10", the copper wire 11" connected to the gold wire 12" is excessively etched.

Therefore, in combination with the above description of the solution for over-etching copper wires of conventional copper/gold hybrid printed circuit boards, it can be known that the solutions currently in use still have many shortcomings and deficiencies; in view of this, the inventor of the present invention The invention was vigorously studied, and finally an etchant which can effectively slow down the Giovanni effect of the present invention was developed.

The main purpose of the present invention is to provide an effective slowing down of Jia An etchant for a Fanny effect, which is mainly prepared by dissolving a specific ratio of an etchant and a nitrogen-containing five-membered heterocyclic compound in water; thus, when the user applies the etchant pair to at least When a first metal (such as gold) and a substrate of at least one second metal (such as copper) are wet etched, the nitrogen-containing five-membered heterocyclic compound will be in a first metal having a higher reduction potential (ie, gold) An organic protective film is formed thereon, thereby effectively preventing the second metal from being excessively etched due to the influence of the galvanic effect.

Therefore, in order to achieve the above object of the present invention, the inventors of the present invention have proposed an etching solution capable of effectively alleviating the Giovanni effect, which is applied to wet etching a substrate including at least a first metal and a second metal. The etching solution includes: a solvent; an etchant dissolved in the solvent to form an etchant; and a nitrogen-containing five-membered heterocyclic compound dissolved in the etchant to serve as the etchant An organic film in the wet etching process, wherein the etchant is contained in the solvent in a range of from 5 g/L to 250 g/L, and the nitrogen-containing five-membered heterocyclic compound is in the solvent The content is between 0.01 g/L and 50 g/L.

In the above etching solution, the nitrogen-containing five-membered heterocyclic compound may be a chemical structure as shown in the following Chemical Formula 1 or Chemical Formula 2, wherein R1 is a first group, and the first group is selected from Any of the following groups: ether, alcohol, acid, alkane, alkene, alkyne, benzene, phenol, benzoic acid or hydrogen.

Further, one or two second organic groups or hydrogen may be added to the chemical formula 2 such that the nitrogen-containing five-membered heterocyclic compound becomes a positive ion, and the nitrogen-containing five-membered heterocyclic compound is brought At least one negative ion, and its chemical formula reaches a charge balance; wherein the nitrogen-containing five-membered heterocyclic compound having a second organic group or hydrogen is represented by the following Chemical Formula 3 or Chemical Formula 4; The nitrogen-containing five-membered heterocyclic compound in which the second organic group or hydrogen is represented by the following Chemical Formula 5:

Wherein R 2 is the second organic group or hydrogen, and the second organic group is optionally selected from any one of the group consisting of ethers, alcohols, acids, alkanes, alkenes, alkynes, benzene, Phenol, and benzoic acid; and the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), bromide ion (Br ^- ), iodide ion (I ^- ), Boron tetrafluoride ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ).

Further, in the etching liquid which can effectively alleviate the Giovanni effect, the chemical structure of the nitrogen-containing five-membered heterocyclic compound is as shown in the following Chemical Formula 6 or Chemical Formula 7, wherein R1 is a first organic group or Is hydrogen, and the first organic group is selected from any of the group consisting of ethers, alcohols, acids, alkanes, alkenes, alkynes, benzenes, phenols, and benzoic acids.

Further, one or two second organic groups or hydrogen may be added to the chemical formula 7, such that the nitrogen-containing five-membered heterocyclic compound becomes a positive ion, and the nitrogen-containing five-membered heterocyclic compound is brought At least one negative ion, and its chemical formula reaches a charge balance; wherein the nitrogen-containing five-membered heterocyclic compound having a second organic group or hydrogen is represented by the following Chemical Formula 8 or Chemical Formula 9, and two The nitrogen-containing five-membered heterocyclic compound in which the second organic group or hydrogen is represented by the following Chemical Formula 10: [Chemical Formula 8] [Chemical Formula 9]

Wherein R 2 is the second organic group or hydrogen, and the organic group is arbitrarily selected from any one of the group consisting of ethers, alcohols, acids, alkanes, alkenes, alkynes, benzenes, phenols, And benzoic acid; and the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), bromide ion (Br ^- ), iodide ion (I ^- ), tetrafluoro Boron ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ).

Further, in the etching liquid capable of effectively alleviating the Giovanni effect, the chemical structure of the nitrogen-containing five-membered heterocyclic compound is as shown in the following Chemical Formula 11, wherein R1 is a first organic group or hydrogen And the first organic group is selected from any one of the group consisting of an ether, an alcohol, an acid, an alkane, an alkene, an alkyne, a benzene, a phenol, and a benzoic acid; and the chemical formula 11 The nitrogen-containing five-membered heterocyclic compound is a 1,5-R1-tetrazole.

[Chemical Formula 11]

Further, one, two or three second organic groups or hydrogen may be added to the chemical formula 11 such that the nitrogen-containing five-membered heterocyclic compound becomes a positive ion, and the nitrogen-containing five-membered heterocyclic ring is obtained. The compound has at least one negative ion and its chemical formula reaches a charge balance; wherein the nitrogen-containing five-membered heterocyclic compound having an organic group or hydrogen is represented by the following Chemical Formula 12, Chemical Formula 13 or Chemical Formula 14; The nitrogen-containing five-membered heterocyclic compound having two organic groups or hydrogen is represented by the following Chemical Formula 15, Chemical Formula 16 or Chemical Formula 17; further, the nitrogen-containing nitrogen having three organic groups or hydrogen is added. The five-membered heterocyclic compound is represented by the following Chemical Formula 18:

Wherein R 2 is a second organic group or hydrogen, and the second organic group is selected from any one of the group consisting of ethers, alcohols, acids, alkanes, alkenes, alkynes, benzenes, phenols And benzoic acid; and the negative ion group is any one of the following groups: fluoride ion (F ^- ), chloride ion (Cl ^- ), bromide ion (Br ^- ), iodide ion (I ^- ), Boron tetrafluoride ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ).

<present invention>

10‧‧‧Substrate

11‧‧‧ gold layer

12‧‧‧ copper layer

<知知>

10'‧‧‧Substrate

11’‧‧‧ copper layer

12'‧‧‧Corrosion layer

10"‧‧‧Substrate

11”‧‧‧ copper wire

12"‧‧‧ Gold wire

The first and second figures are schematic diagrams of a process for fabricating a copper layer having a specific pattern on a printed circuit board; the third drawing is a top view of a copper/gold hybrid printed circuit board; and the fourth figure has a copper layer and a gold layer. Upper view of one of the layers of the substrate; The fifth figure is a three-dimensional diagram of the copper layer; the sixth picture is a microscopic image of the copper layer of the experiment one; and the seventh picture is a microscopic image of the copper layer of the experiment two.

In order to more clearly describe an etching solution of the present invention which can effectively alleviate the Giovanni effect, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

The etchant system of the present invention effective for slowing down the Jaffany effect is applied to a wet etching process for a substrate comprising at least a first metal and at least a second metal; wherein, due to a reduction potential of the first metal (Reduction) The potential is greater than the reduction potential of the second metal. Therefore, the first metal may be gold (Au), platinum (Pt), silver (Ag), copper (Cu), tin (Sn), nickel (Ni), And aluminum (Al); and correspondingly, the second metal may be aluminum (Al), nickel (Ni), tin (Sn), copper (Cu), silver (Ag), platinum (Pt), titanium (Ti) Iron (Fe), cobalt (Co) and chromium (Cr); as for the substrate, it is a common printed circuit board, germanium wafer, glass substrate, gallium arsenide and aluminum oxide.

Continuing to explain the etching solution of the present invention which can effectively alleviate the Giovanni effect, the method mainly comprises: a solvent, an etchant and a nitrogen-containing five-membered heterocyclic compound; wherein the solvent is water, and the etchant, It is dissolved in the solvent to form an etchant. In the present invention, the form of the etchant is not particularly limited, and thus the etchant may be hydrogen peroxide-sulfuric acid (H ₂ O ₂ -H ₂ SO ₄ ), hydrogen peroxide-phosphoric acid (H ₂ O ₂ -H ₃ PO ₄ ), copper chloride-hydrochloric acid (CuCl ₂ -HCl), ferric chloride-hydrochloric acid (FeCl ₂ -HCl), hydrochloric acid-nitric acid (HCl-HNO ₃ ), sodium persulfate (Na ₂ S ₂ O ₈ ), Or a persulfate complex (such as KHSO ₅ ̇KHSO ₄ ̇K ₂ SO ₄ ).

In the present invention, in particular, the nitrogen containing five-member heterocyclic compounds are dissolved in the etchant as a metal film in the wet etching process (especially As the organic film of the first metal having a higher reduction potential); and, in terms of content (concentration), the content of the aforementioned etchant in the solvent (ie, water) is from 5 g/L to 250 g/L. The content of the nitrogen-containing five-membered heterocyclic compound in the solvent is between 0.01 g/L and 50 g/L. Further, it must be emphasized that in the etching solution of the present invention which can effectively alleviate the Giovanni effect, the nitrogen-containing five-membered heterocyclic compound may be a three-nitrogen five-membered heterocyclic compound (i.e., a triazole compound), and the basis thereof The chemical structure is as shown in the following Chemical Formula 1 or Chemical Formula 2:

In Chemical Formula 1 and Chemical Formula 2, R1 is a first organic group or hydrogen, and the first organic group is selected from any one of the group consisting of ethers, alcohols, acids, and alkane. Alkene, alkyne, benzene, phenol, and benzoic acid. Further, the nitrogen-containing five-membered heterocyclic compound represented by Chemical Formula 2 is a 1,3,5-R1-1,2,4-triazole.

In the present invention, one or two second organic groups or hydrogen may be added to the 1,3,5-R1-1,2,4-triazole to make the nitrogen-containing five-membered impurity. The cyclic compound becomes a positive ion, and the chemical formula reaches a charge balance by causing the nitrogen-containing five-membered heterocyclic compound to carry at least one negative ion; wherein the nitrogen-containing five-membered impurity having an organic group or hydrogen is added The ring compound is represented by the following Chemical Formula 3 or Chemical Formula 4; and the nitrogen-containing five-membered heterocyclic compound having two organic groups or hydrogen is represented by the following Chemical Formula 5:

In the above Chemical Formula 3 to Chemical Formula 5, R 2 is the second organic group or hydrogen, and the second organic group is arbitrarily selected from any one of the following groups: ether, alcohol, acid, An alkane, an alkene, an alkyne, a benzene, a phenol, and a benzoic acid; and the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), and bromide ion (Br ^- ) Iodine ion (I ^- ), boron tetrafluoride ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ).

Further, in the etching liquid of the present invention which can effectively alleviate the Giovanni effect, the chemical structure of the trinitrogen five-membered heterocyclic compound (i.e., triazole compound) may also be as shown in the following Chemical Formula 6 or Chemical Formula 7:

In Chemical Formula 6 and Chemical Formula 7, R1 is a first organic group or hydrogen, and the first organic group is selected from any one of the group consisting of ethers, alcohols, acids, and alkane. The alkene, alkyne, benzene, phenol, and benzoic acid; and the nitrogen-containing five-membered heterocyclic compound represented by Chemical Formula 7 is a 1,4,5-R1-1,2,3-triazole.

In addition, in the present invention, one or two second organic groups or hydrogen may be added to the 1,4,5-R1-1,2,3-triazole, such that the nitrogen-containing five The metacyclic heterocyclic compound becomes a positive ion, and the chemical formula reaches a charge balance by causing the nitrogen-containing five-membered heterocyclic compound to carry at least one negative ion; wherein the addition of a second organic group or hydrogen The nitrogen five-membered heterocyclic compound is represented by the following Chemical Formula 8 or Chemical Formula 9, and the nitrogen-containing five-membered heterocyclic compound having two second organic groups or hydrogen is represented by the following Chemical Formula 10:

In the above Chemical Formula 8 to Chemical Formula 10, R 2 is a second organic group or hydrogen, and the second organic group is arbitrarily selected from any one of the following groups: ether, alcohol, acid, An alkane, an alkene, an alkyne, a benzene, a phenol, and a benzoic acid; and the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), and bromide ion (Br ^- ) Iodine ion (I ^- ), boron tetrafluoride ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ).

In addition, it is to be noted that although the chemical structural units represented by the above Chemical Formulas 1 to 10 are all a three-nitrogen five-membered heterocyclic compound, the nitrogen-containing five-membered heterocyclic compound in the etching solution of the present invention is not limited thereby. In a practical application, the nitrogen-containing five-membered heterocyclic compound may also be a tetra-nitrogen five-membered heterocyclic compound (ie, a tetrazole compound), and its chemical structure is represented by the following chemical formula 11; Medium, R1 is one The organic group is either hydrogen and the organic group is selected from any one of the group consisting of ethers, alcohols, acids, alkanes, alkenes, alkynes, benzenes, phenols, and benzoic acids; and, Formula 11 The nitrogen-containing five-membered heterocyclic compound represented is a 1,5-R1-tetrazole.

Furthermore, one, two or three second organic groups or hydrogen may be added to the 1,5-R1-tetrazole such that the nitrogen-containing five-membered heterocyclic compound becomes a positive ion with at least An anion to bring the chemical formula to charge balance; wherein the nitrogen-containing five-membered heterocyclic compound having an organic group or hydrogen is represented by the following Chemical Formula 12, Chemical Formula 13 or Chemical Formula 14; The nitrogen-containing five-membered heterocyclic compound of the group is represented by the following Chemical Formula 15, Formula 16 or Chemical Formula 17; further, the nitrogen-containing five-membered heterocyclic compound having three organic groups or hydrogen is as follows 18 said:

In the above Chemical Formula 12 to Chemical Formula 18, R 2 is a second organic group or hydrogen, and the organic group is selected from any one of the following groups: an ether, an alcohol, an acid, an alkene, an alkene. , alkyne, benzene, phenol, and benzoic acid; and, the negative ion group is any one of the following groups: fluoride ion (F ^- ), chloride ion (Cl ^- ), bromide ion (Br ^- ), iodine Ions (I ^- ), boron tetrafluoride ions (BF ₄ ^- ), sulfate ions (SO ₄ ^2- ), and hydrogen sulfate ions (HSO ₄ ^- ).

Thus, through the above, the etchant of the present invention which can effectively alleviate the Giovanni effect has its composition and chemical structure clearly and completely disclosed; next, various experimental data will be presented below to prove the hair. It can effectively reduce the applicability of the etchant solution of the Jaffany effect. Please refer to the fourth figure, which is a top view of a substrate having a copper layer and a gold layer. As shown in the figure (a) of the fourth figure, it comprises an experimental group and a control group, and the substrate 10 in the figure has a gold layer 11 and a copper layer 12 connected to each other, wherein the gold layer 11 and the copper layer 12 The area ratio is 1000:1. Moreover, as shown in the perspective view of the copper layer shown in FIG. 5, the diameter and height of the copper layer 12 on the substrate 10 are 40 μm and 20 μm, respectively.

In the above description, and as shown in the figure (b) of the fourth figure, it also includes an experimental group and a control group, and the substrate 10 in the figure has a gold layer 11 and a copper layer 12 connected to each other, wherein The area ratio of the gold layer 11 to the copper layer 12 is 500:1; further, as shown in the figure (c) of the fourth figure, it also includes an experimental group and a control group, and the substrate 10 in the figure has a connection with each other. The gold layer 11 and the copper layer 12, wherein the area ratio of the gold layer 11 to the copper layer 12 is 250:1; further, as shown in the figure (d) of the fourth figure, it also includes an experimental group and a control group. The substrate 10 in the figure has a gold layer 11 and a copper layer 12 connected to each other, wherein the area ratio of the gold layer 11 to the copper layer 12 is 100:1.

[Experiment 1] In the first experiment, 10% sulfuric acid + 3% hydrogen peroxide was dissolved in water to prepare a first control etchant; and 10% sulfuric acid + 3% hydrogen peroxide and 5 g/L of 1,5- Diphenyltetrazole (ie, a tetrakis five-membered heterocyclic compound) is dissolved in water to prepare a first experimental group etching solution, wherein the chemical structure of the 1,5-diphenyltetrazole is the following chemical formula 19 Expressed

Please refer to the sixth figure, which is a microscopic image of the copper layer of Experiment 1. The figure (a1) and (b1) of the sixth figure show the wet etching of the copper layer 12 of the control group and the experimental group. Front microscopic image. Further, the first control etchant prepared in the above manner and the first experimental etchant are wet etched respectively on the fourth graph (a) and the control group and the experimental group as shown; After wet etching for 30 seconds and 60 seconds, as shown in the second figure (a2) and (a3), the copper layer 12 of the control group was significantly over-etched due to the influence of the galvanic effect. The phenomenon, even the entire copper surface is almost etched out. In contrast, the copper layer 12 of the experimental group, as shown in the sixth figure (b2), the figure (b3) and the figure (b4), still maintains a complete copper surface after 30 seconds, 90 seconds, and 150 seconds. The results show that the Giovanni effect can be effectively suppressed to slow the over-etching of the copper layer 12 of the experimental group.

[Experiment 2] Further, in Experiment 2, 10% sulfuric acid + 3% hydrogen peroxide was dissolved in water to prepare a second control etchant; and 10% sulfuric acid + 3% hydrogen peroxide and 7 g/L of 1 was prepared. - phenyl-1,2,4-triazole (i.e., trinitrogen five-membered heterocyclic compound) is dissolved in water to prepare a second experimental group etching solution, wherein the 1-phenyl-1, 2, The chemical structure of 4-triazole is represented by the following chemical formula 20;

Please refer to the seventh figure, which is a microscopic image of the copper layer of Experiment 2. The seventh layer (a1) and (b1) show the wet etching of the copper layer 12 of the control group and the experimental group. Front microscopic image. Further, the second control etchant prepared in the above manner and the second experimental etchant are wet etched respectively on the fourth graph (a) and the control group and the experimental group as shown; After wet etching for 30 seconds and 60 seconds, as shown in the seventh diagram (a2) and (a3), the copper layer 12 of the control group was significantly over-etched due to the influence of the galvanic effect. The phenomenon, even the entire copper surface is almost etched out. In contrast, the copper layer 12 of the experimental group, as shown in the seventh figure (b2), the figure (b3) and the figure (b4), still maintains a complete copper surface after 30 seconds, 90 seconds, and 150 seconds. The results show that the Giovanni effect can be effectively suppressed to slow the over-etching of the copper layer 12 of the experimental group.

Thus, the above system has completely and clearly illustrated the composition and chemical structure of the etching solution of the present invention which can effectively alleviate the Giovanni effect, and also verified the feasibility and effectiveness of the etching solution through experiments; The invention has the following technical features and advantages:

1. In the present invention, an etchant and a nitrogen-containing five-membered heterocyclic compound are dissolved in water in a specific ratio to form an etchant; thus, when the user applies the etchant pair to at least one When the first metal (for example, gold) and the substrate of at least one second metal (for example, copper) are wet-etched, the nitrogen-containing five-membered heterocyclic compound will be in the first metal (ie, gold) having a higher reduction potential. An organic film is formed thereon, thereby effectively preventing the second metal from being over-etched due to the influence of the galvanic effect.

2. In the above-mentioned first point, in addition, in the present invention, the etchant which is mixed with the nitrogen-containing five-membered heterocyclic compound to form an etching liquid is not used in the form and form, and may be copper chloride or may be used. Hydrogen peroxide - sulfuric acid, hydrogen peroxide - phosphoric acid, copper chloride - hydrochloric acid, ferric chloride - hydrochloric acid, hydrochloric acid - nitric acid, sodium persulfate, or persulfate complex. Therefore, since the etchant for dispensing the etching liquid of the invention can be in any form, it appears that the etching liquid of the present invention has a fairly wide application level.

It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to Both should be included in the scope of the patent in this case.

Claims (8)

An etching solution capable of effectively alleviating the Jaffany effect is applied to a wet etching process for a substrate including at least a first metal and a second metal, wherein the reduction potential of the first metal is greater than the first a reduction potential of the dimetal; the etching solution comprising: an etchant dissolved in the solvent to form an etchant; and a nitrogen containing five-member heterocyclic compound Dissolving in the etchant as a metal film in the wet etching process, wherein the etchant is contained in the solvent in a content of between 5g/L and 250g/L, and the nitrogen is contained The content of the five-membered heterocyclic compound in the solvent is between 0.01 g/L and 50 g/L, and the chemical structure of the nitrogen-containing five-membered heterocyclic compound is as shown in the following Chemical Formula 2: Wherein R1 in the above Chemical Formula 2 is a first organic group or hydrogen, and the first organic group is selected from any one of the group consisting of ethers, alcohols, acids, alkanes, alkenes , alkyne, benzene, phenol, and benzoic acid; and the nitrogen-containing five-membered heterocyclic compound represented by Chemical Formula 2 is a 1,3,5-R1-1,2,4-triazole: Adding one or two second organic groups or hydrogen to the 1,3,5-R1-1,2,4-triazole, such that the nitrogen-containing five-membered heterocyclic compound becomes positive Ion, and by subjecting said nitrogen-containing five-membered heterocyclic compound to further carrying at least one negative ion, thereby bringing its chemical structure to charge balance; wherein, adding said nitrogen having a second organic group or hydrogen The five-membered heterocyclic compound is represented by the following Chemical Formula 3 or Chemical Formula 4, and the nitrogen-containing five-membered heterocyclic compound having two organic groups or hydrogen is represented by the following Chemical Formula 5: Wherein R 2 in the above Chemical Formula 3, Chemical Formula 4 and Chemical Formula 5 is the second organic group or hydrogen, and the second organic group is selected from any one of the following groups: ether, Alcohol, acid, alkane, alkene, alkyne, benzene, phenol, and benzoic acid; and, the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), bromine Ions (Br ^- ), iodide ions (I ^- ), boron tetrafluoride ions (BF ₄ ^- ), sulfate ions (SO ₄ ^2- ), and hydrogen sulfate ions (HSO ₄ ^- ). An etching solution capable of effectively alleviating the Jaffany effect is applied to a wet etching process for a substrate including at least a first metal and a second metal, wherein the reduction potential of the first metal is greater than the first a reduction potential of the dimetal; the etching solution comprising: an etchant dissolved in the solvent to form an etchant; and a nitrogen containing five-member heterocyclic compound Dissolving in the etchant as a metal film in the wet etching process, wherein the etchant is contained in the solvent in a content of between 5g/L and 250g/L, and the nitrogen is contained The content of the five-membered heterocyclic compound in the solvent is between 0.01 g/L and 50 g/L, and the chemical structure of the nitrogen-containing five-membered heterocyclic compound is as shown in the following Chemical Formula 7: Wherein R1 in the above Chemical Formula 7 is a first organic group or hydrogen, and the first organic group is selected from any one of the following groups: ether, alcohol, acid, alkene, alkene , alkyne, benzene, phenol, and benzoic acid; and the nitrogen-containing five-membered heterocyclic compound represented by Chemical Formula 7 is a 1,4,5-R1-1,2,3-triazole; Adding one or two second organic groups or hydrogen to the 1,4,5-R1-1,2,3-triazole, such that the nitrogen-containing five-membered heterocyclic compound becomes positive Ion, and by subjecting said nitrogen-containing five-membered heterocyclic compound to further carrying at least one negative ion, thereby bringing its chemical structure to charge balance; wherein, adding said nitrogen having a second organic group or hydrogen The five-membered heterocyclic compound is represented by the following Chemical Formula 8 or Chemical Formula 9, and the nitrogen-containing five-membered heterocyclic compound having two organic groups or hydrogen is represented by the following Chemical Formula 10: Wherein R 2 in the above Chemical Formula 8, Chemical Formula 9 and Chemical Formula 10 is the second organic group or hydrogen, and the second organic group is selected from any one of the following groups: ether, Alcohol, acid, alkane, alkene, alkyne, benzene, phenol, and benzoic acid; and, the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), bromine Ions (Br ^- ), iodide ions (I ^- ), boron tetrafluoride ions (BF ₄ ^- ), sulfate ions (SO ₄ ^2- ), and hydrogen sulfate ions (HSO ₄ ^- ). An etching solution capable of effectively alleviating the Jaffany effect is applied to a wet etching process for a substrate including at least a first metal and a second metal, wherein the reduction potential of the first metal is greater than the first a reduction potential of the dimetal; the etching solution comprising: an etchant dissolved in the solvent to form an etchant; and a nitrogen containing five-member heterocyclic compound Dissolving in the etchant as a metal film in the wet etching process, wherein the etchant is contained in the solvent in a content of between 5g/L and 250g/L, and the nitrogen is contained The content of the five-membered heterocyclic compound in the solvent is between 0.01 g/L and 50 g/L, and the chemical structure of the nitrogen-containing five-membered heterocyclic compound is as shown in the following Chemical Formula 11: [Chemical Formula 11] Wherein R1 in the above Chemical Formula 11 is a first organic group or hydrogen, and the first organic group is selected from any one of the following groups: an ether, an alcohol, an acid, an alkene, an alkene. , alkyne, benzene, phenol, and benzoic acid; and, the nitrogen-containing five-membered heterocyclic compound represented by Chemical Formula 11 is a 1,5-R1-tetrazole: wherein one or two second organic substances may be added a group or hydrogen to the 1,5-R1-tetrazole, such that the nitrogen-containing five-membered heterocyclic compound becomes a positive ion, and by using the nitrogen-containing five-membered heterocyclic compound Further carrying at least one negative ion in such a manner that its chemical structure reaches a charge balance; wherein the nitrogen-containing five-membered heterocyclic compound having a second organic group or hydrogen is added to the following chemical formula 12, chemical formula 13 or chemical formula 14 And, the nitrogen-containing five-membered heterocyclic compound having two organic groups or hydrogen is represented by the following Chemical Formula 15, Formula 16 or Chemical Formula 17; further, three third organic groups are added or The nitrogen-containing five-membered heterocyclic compound of hydrogen is represented by the following Chemical Formula 18 :[Chemical Formula 12] [Chemical Formula 13] Wherein R 2 in the above Chemical Formula 12 to Chemical Formula 18 is the second organic group or hydrogen, and the second organic group is selected from any one of the following groups: ether, alcohol, acid , alkane, alkene, alkyne, benzene, phenol, and benzoic acid; and the negative ion is selected from any one of the group consisting of fluoride ion (F ^- ), chloride ion (Cl ^- ), and bromide ion (Br) ^- ), iodide ion (I ^- ), boron tetrafluoride ion (BF ₄ ^- ), sulfate ion (SO ₄ ^2- ), and hydrogen sulfate ion (HSO ₄ ^- ). An etchant capable of effectively alleviating the Giovanni effect, as described in claim 1, item 2, or item 3, wherein the solvent is water. An etchant capable of effectively alleviating the Giovanni effect as described in claim 1, item 2 or item 3, wherein the etchant is selected from any of the following groups: peroxidation Hydrogen-sulfuric acid (H ₂ O ₂ -H ₂ SO ₄ ), hydrogen peroxide-phosphoric acid (H ₂ O ₂ -H ₃ PO ₄ ), copper chloride-hydrochloric acid (CuCl ₂ -HCl), ferric chloride-hydrochloric acid ( FeCl ₂ -HCl), hydrochloric acid-nitric acid (HCl-HNO ₃ ), sodium persulfate (Na ₂ S ₂ O ₈ ), or persulfate complex (KHSO ₅ ‧KHSO ₄ ‧K ₂ SO ₄ ). An etching solution capable of effectively alleviating the Giovanni effect as described in claim 1, item 2 or item 3, wherein the first metal is selected from any one of the following groups: gold (Au), platinum (Pt), silver (Ag), copper (Cu), tin (Sn), nickel (Ni), and aluminum (Al). An etching solution capable of effectively alleviating the Giovanni effect, as described in claim 1, item 2 or item 3, wherein the second metal is selected from any of the following groups: aluminum (Al), nickel (Ni), tin (Sn), copper (Cu), silver (Ag), platinum (Pt), titanium (Ti), iron (Fe), cobalt (Co), and chromium (Cr). An etching solution capable of effectively alleviating the Giovanni effect as described in claim 1, item 2 or item 3, wherein the substrate is selected from any of the following groups: a printed circuit board , germanium wafers, glass substrates, gallium arsenide, and aluminum oxide.