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TWI480304B - A hardened resin composition and a hardened product thereof - Google Patents

A hardened resin composition and a hardened product thereof Download PDF

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Publication number
TWI480304B
TWI480304B TW099118948A TW99118948A TWI480304B TW I480304 B TWI480304 B TW I480304B TW 099118948 A TW099118948 A TW 099118948A TW 99118948 A TW99118948 A TW 99118948A TW I480304 B TWI480304 B TW I480304B
Authority
TW
Taiwan
Prior art keywords
group
halogen atom
resin composition
carbon atoms
curable resin
Prior art date
Application number
TW099118948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201113305A (en
Inventor
Shunsuke Takahi
Hiroyuki Igarashi
Naomi Sato
Masaharu Gotoh
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW201113305A publication Critical patent/TW201113305A/zh
Application granted granted Critical
Publication of TWI480304B publication Critical patent/TWI480304B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW099118948A 2009-07-02 2010-06-10 A hardened resin composition and a hardened product thereof TWI480304B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009157942A JP5501679B2 (ja) 2009-07-02 2009-07-02 硬化性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
TW201113305A TW201113305A (en) 2011-04-16
TWI480304B true TWI480304B (zh) 2015-04-11

Family

ID=43410868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099118948A TWI480304B (zh) 2009-07-02 2010-06-10 A hardened resin composition and a hardened product thereof

Country Status (5)

Country Link
JP (1) JP5501679B2 (ja)
KR (1) KR101737458B1 (ja)
CN (1) CN102341428B (ja)
TW (1) TWI480304B (ja)
WO (1) WO2011001788A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698072B2 (ja) * 2011-05-18 2015-04-08 株式会社Adeka エポキシ化合物、及びこれを含有する重合性組成物
KR101959107B1 (ko) * 2012-10-18 2019-03-15 산아프로 가부시키가이샤 술포늄염, 광산 발생제, 경화성 조성물 및 레지스트 조성물
JP6071533B2 (ja) * 2012-12-25 2017-02-01 株式会社Adeka 光硬化性組成物
JP2016115779A (ja) * 2014-12-13 2016-06-23 株式会社ダイセル ナノインプリント用光硬化性組成物
JP6062107B1 (ja) * 2015-02-24 2017-01-18 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP2017171807A (ja) * 2016-03-24 2017-09-28 凸版印刷株式会社 フィルム及び画像表示装置
JP7012578B2 (ja) * 2018-03-29 2022-02-14 クミアイ化学工業株式会社 新規化合物及び該化合物の製造方法
JPWO2023063221A1 (ja) * 2021-10-12 2023-04-20

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665881A (zh) * 2002-05-08 2005-09-07 亨凯尔公司 光阳离子固化型环氧树脂组合物
TW200911774A (en) * 2007-05-09 2009-03-16 Adeka Corp Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080061329A (ko) * 2005-10-27 2008-07-02 도판 인사츠 가부시키가이샤 알칼리현상형 감광성 수지조성물, 그것을 이용하여 형성한액정분할배향제어용 돌기부착 기판, 및 액정표시장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665881A (zh) * 2002-05-08 2005-09-07 亨凯尔公司 光阳离子固化型环氧树脂组合物
TW200911774A (en) * 2007-05-09 2009-03-16 Adeka Corp Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition

Also Published As

Publication number Publication date
JP2011012182A (ja) 2011-01-20
JP5501679B2 (ja) 2014-05-28
KR101737458B1 (ko) 2017-05-18
WO2011001788A1 (ja) 2011-01-06
TW201113305A (en) 2011-04-16
KR20120046100A (ko) 2012-05-09
CN102341428B (zh) 2013-12-25
CN102341428A (zh) 2012-02-01

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