TWI471339B - Paste composition for printing - Google Patents
Paste composition for printing Download PDFInfo
- Publication number
- TWI471339B TWI471339B TW96113328A TW96113328A TWI471339B TW I471339 B TWI471339 B TW I471339B TW 96113328 A TW96113328 A TW 96113328A TW 96113328 A TW96113328 A TW 96113328A TW I471339 B TWI471339 B TW I471339B
- Authority
- TW
- Taiwan
- Prior art keywords
- printing
- phenyl
- acrylate
- paste composition
- boiling point
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 61
- 238000007639 printing Methods 0.000 title claims description 52
- 238000000034 method Methods 0.000 claims description 41
- 238000009835 boiling Methods 0.000 claims description 30
- 239000002904 solvent Substances 0.000 claims description 29
- 238000007645 offset printing Methods 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 21
- 239000002952 polymeric resin Substances 0.000 claims description 18
- 229920000058 polyacrylate Polymers 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229940116411 terpineol Drugs 0.000 claims description 5
- -1 2-hydroxyoctyl Chemical group 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- RHFOYRRUVLOOJP-UHFFFAOYSA-N ethoxyethane;propanoic acid Chemical compound CCOCC.CCC(O)=O RHFOYRRUVLOOJP-UHFFFAOYSA-N 0.000 claims description 4
- PMKLERKUFSEASW-UHFFFAOYSA-N methyl propanoate;propane-1,2-diol Chemical compound CC(O)CO.CCC(=O)OC PMKLERKUFSEASW-UHFFFAOYSA-N 0.000 claims description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 3
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229940116333 ethyl lactate Drugs 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- OLMLGLBGDSQSDB-UHFFFAOYSA-N phenyl 2-chloroprop-2-enoate Chemical compound ClC(=C)C(=O)OC1=CC=CC=C1 OLMLGLBGDSQSDB-UHFFFAOYSA-N 0.000 claims description 2
- ZFFYKWNFIPKDLY-UHFFFAOYSA-N phenyl 2-nitroprop-2-enoate Chemical compound [O-][N+](=O)C(=C)C(=O)OC1=CC=CC=C1 ZFFYKWNFIPKDLY-UHFFFAOYSA-N 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims 2
- VWVZFHRDLPHBEG-UHFFFAOYSA-N 1-(chloromethyl)-4-methylsulfanylbenzene Chemical group CSC1=CC=C(CCl)C=C1 VWVZFHRDLPHBEG-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims 1
- 239000001530 fumaric acid Substances 0.000 claims 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 claims 1
- VQSLYBNAHOGNCE-UHFFFAOYSA-N pentan-3-yl propanoate Chemical compound CCC(CC)OC(=O)CC VQSLYBNAHOGNCE-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/22—Electrodes
- H01J2211/225—Material of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/446—Electromagnetic shielding means; Antistatic means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Electric Cables (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Printing Methods (AREA)
Description
本發明係關於一種供印刷用之糊組成物,特別來說,是關於一種特別適合於凹版膠印(gravure offset printing)之供印刷用的糊組成物,其可解決使用習知光微影法來製作供遮蔽電磁波用之篩網濾波器電極或供電漿顯示器用之電極圖案時所發生的材料再處理問題,且同時,可以滿足作為糊組成物所需之各種特性,該特性的每一者均為印刷程序上所需要因而可發揮適當的膠印性能者。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a paste composition for printing, and more particularly to a paste composition for printing which is particularly suitable for gravure offset printing, which can be solved by using conventional photolithography. The material reprocessing problem that occurs when shielding the screen filter electrode for electromagnetic waves or the electrode pattern for the power supply slurry display, and at the same time, satisfies various characteristics required as a paste composition, each of which is printed Those who are procedurally needed to achieve proper offset performance.
最近,隨著顯示器在大尺寸、高密度、高精確性及高可信度上的需求增加,數種圖案處理技術已被研發出來,且關於用來形成精細電極俾可適用於各種圖案處理技術之多種組成物的研究已被積極地進行。Recently, as display displays have increased in demand for large size, high density, high accuracy, and high reliability, several pattern processing techniques have been developed, and with respect to forming fine electrodes, various pattern processing techniques can be applied. Studies of various compositions have been actively conducted.
與液晶面板相比,由於電漿顯示器面板(PDP)有快速反應率且容易製成大尺寸,它們現在能應用在各類領域上。一般而言,使用網版印刷法來圖案化電極材料的方法已被使用來形成PDP上的電極。然而,習知網版印刷法需要有高水準技術,在網版印刷時,糊組成物因其低黏性而可能跑出基板,其造成網版精確度降低,而致使在習知之網版印刷法上難以得到PDP所需要之高精確度的大型網版圖案。此外,習知網版印刷法,在印刷時,網版上亦可能發生缺損或破洞。Compared with liquid crystal panels, plasma display panels (PDPs) can now be used in various fields due to their rapid response rate and easy fabrication into large sizes. In general, a method of patterning an electrode material using screen printing has been used to form an electrode on a PDP. However, the conventional screen printing method requires a high level of technology. In the screen printing, the paste composition may run out of the substrate due to its low viscosity, which causes the screen accuracy to be lowered, resulting in conventional screen printing. It is difficult to obtain a large-scale screen pattern of high precision required for PDP. In addition, the conventional screen printing method may cause defects or holes in the screen when printing.
最近,已發展出使用光敏型樹脂組成物的光微影蝕刻技術,用以形成適合大區域的高精確電極電路。這些方法的進行是透過使用光敏型樹脂組成物之印刷方法形成其上分散著細密導電粉末的均勻厚度的薄膜,使用具有所欲構形之遮罩下將所形成的薄膜暴露在光下,以及接著使用鹼性顯影溶液顯現出需要的圖案。Recently, photolithographic etching techniques using photosensitive resin compositions have been developed to form highly accurate electrode circuits suitable for large areas. These methods are carried out by forming a film of a uniform thickness on which a fine conductive powder is dispersed by using a photosensitive resin composition printing method, and exposing the formed film to light using a mask having a desired configuration, and The desired pattern is then developed using an alkaline developing solution.
然而,使用上述的光微影法形成圖案時,為節省製造成本,在顯影過程時被移除的材料需要再處理,且有許多爭論在進展中。However, when the pattern is formed by the photolithography method described above, in order to save manufacturing costs, the material to be removed during the development process needs to be reprocessed, and there is much debate in progress.
為解決上述的問題,研究有關在基板上直接形成所欲圖案的方法,如先前印刷業中已廣泛被使用的凹版膠印法或者噴墨印刷法,現在已被進行。In order to solve the above problems, a method for directly forming a desired pattern on a substrate, such as a gravure offset printing method or an inkjet printing method which has been widely used in the printing industry, has been studied.
本發明的目的係為解決上述之習知技藝的問題,而提供一種供印刷用之糊組成物,其特別適合於凹版膠印模式,且可在使用習知光微影法形成供電漿顯示器面板用或供遮蔽電磁波之篩網濾波器用之電極圖案時,解決在顯影過程時移除的材料需要再處理的問題以節省製作成本,以及提供在使用上述糊組成物下,一種形成電漿面板顯示器電極之方法或一種製備遮蔽電磁波用篩網濾波器之電極的方法。The object of the present invention is to solve the above problems of the prior art, and to provide a paste composition for printing, which is particularly suitable for a gravure offset printing mode, and can be used for forming a power supply slurry display panel by using a conventional photolithography method. When the electrode pattern for the screen filter of the electromagnetic wave is shielded, the problem that the material removed during the development process needs to be reprocessed is solved to save the manufacturing cost, and a method for forming the electrode of the plasma panel display under the use of the above paste composition is provided. Or a method of preparing an electrode for shielding a screen filter for electromagnetic waves.
再者,本發明的另一目的,係提供一種供印刷用之糊組成物,可以滿足作為組成物所需要之各種特性,該特性的每一者皆為印刷程序上所需因而可發揮適當的膠印性能者,以及提供在使用上述糊組成物下,一種形成電漿面板顯示器電極之方法或一種備製遮蔽電磁波用篩網濾波器之電極的方法。Further, another object of the present invention is to provide a paste composition for printing which satisfies various characteristics required as a composition, each of which is required for a printing process and thus can be suitably used. An offset printing performance, and a method of forming an electrode of a plasma panel display or a method of preparing an electrode for shielding a screen filter for electromagnetic waves, using the above paste composition.
為了達成上述的目的,本發明提供一種供印刷用之糊組成物,其包含有:a)5到30 wt%的一丙烯酸聚合物樹脂;b)5到35 wt%的一高沸點溶劑,其沸點至少200℃;c)5到35 wt%的一低沸點溶劑,其沸點低於200℃;以及d)50到85 wt%的金屬粉末。In order to achieve the above object, the present invention provides a paste composition for printing comprising: a) 5 to 30 wt% of an acrylic polymer resin; b) 5 to 35 wt% of a high boiling point solvent, a boiling point of at least 200 ° C; c) 5 to 35 wt% of a low boiling point solvent having a boiling point of less than 200 ° C; and d) 50 to 85 wt % of metal powder.
並且,本發明提供一種形成一電漿面板顯示器電極的方法,其包含有藉由凹版膠印法使用上述供印刷用之糊組成物來形成圖案。Further, the present invention provides a method of forming a plasma panel display electrode comprising forming a pattern by using the above-described paste composition for printing by gravure offset printing.
並且,本發明提供一種形成一遮蔽電磁波用篩網濾波器之電極的方法,其包含有藉由凹版膠印法使用上述供印刷用之糊組成物來形成圖案。Further, the present invention provides a method of forming an electrode for shielding a screen filter for electromagnetic waves, which comprises forming a pattern by using the above-described paste composition for printing by gravure offset printing.
第1圖為顯示凹版膠印後之最小線寬的照片,其係使用依據本發明的實施例及比較實施例所製備供印刷用之糊組成物。Fig. 1 is a photograph showing the minimum line width after gravure offset printing, which was prepared using a paste composition for printing according to an embodiment of the present invention and a comparative example.
本發明將有進一步之詳細記述。The invention will be described in further detail.
發明人發現為便於製備能滿足各種印刷程序上所需之組成物性質的供凹版膠印用之糊組成物,使用有適當分子量的丙烯酸聚合物以發揮在關閉(OFF)模式所需之適度彈性特性,以及使用適當的揮發性溶劑以於設定(SET)模式提供優良鍛燒特性,結果適合於凹版膠印法的供印刷用之糊組成物可被製備,且因而完成了本發明。The inventors have found that in order to facilitate the preparation of a paste composition for gravure offset printing which satisfies the properties of the composition required for various printing procedures, an acrylic polymer having an appropriate molecular weight is used to exert a moderate elastic property required in an OFF mode. And using a suitable volatile solvent to provide excellent calcination characteristics in a set (SET) mode, as a result, a paste composition suitable for printing for gravure offset printing can be prepared, and thus the present invention has been completed.
本發明供印刷用之糊組成物包含有a)5到30wt%的一丙烯酸聚合物樹脂;b)5到35wt%的一高沸點溶劑,其沸點至少為200℃;c)5到35wt%的一低沸點溶劑,其沸點低於200℃;以及d)50到85wt%的金屬粉末。The paste composition for printing of the present invention comprises a) 5 to 30% by weight of an acrylic polymer resin; b) 5 to 35 wt% of a high boiling solvent having a boiling point of at least 200 ° C; c) 5 to 35% by weight a low boiling point solvent having a boiling point of less than 200 ° C; and d) 50 to 85% by weight of the metal powder.
用於本發明之a)所使用的丙烯酸酯聚合物樹脂,可使用傳統的丙烯酸酯聚合物樹脂,且較佳地,其可藉由聚合不飽和羧酸單體、芳香族單體及其他單體來製備。As the acrylate polymer resin used in a) of the present invention, a conventional acrylate polymer resin can be used, and preferably, it can be polymerized by unsaturated carboxylic acid monomer, aromatic monomer and other singles. Body preparation.
該不飽和羧酸單體的功用是經由該聚合物內的氫鍵增加該聚合物的彈性,且特別是,可使用丙烯酸,甲基丙烯酸、衣康酸、順丁烯二酸、反丁烯二酸、醋酸乙烯酯、其一酸酐形式等。The function of the unsaturated carboxylic acid monomer is to increase the elasticity of the polymer via hydrogen bonding in the polymer, and in particular, acrylic acid, methacrylic acid, itaconic acid, maleic acid, and antibutene can be used. Diacid, vinyl acetate, its mono-acid anhydride form, and the like.
較佳地,該不飽和羧酸單體被包含之量係為製備該丙烯酸聚合物樹脂中所用之全部單體之20到50wt%,且當含量於上述範圍內時,該聚合物的彈性特性、聚合作用中凝膠化之預防,及聚合作用程度之控制均令人滿意。Preferably, the unsaturated carboxylic acid monomer is contained in an amount of 20 to 50% by weight based on the total monomers used in the preparation of the acrylic polymer resin, and when the content is within the above range, the elastic properties of the polymer The prevention of gelation during polymerization and the control of the degree of polymerization are satisfactory.
該芳香族單體的功用是在形成對基板的緊密黏著及穩定圖案;特別來說,可使用苯乙烯、甲基丙烯酸苄酯、 丙烯酸苄酯、丙烯酸苯酯、甲基丙烯酸苯酯、2-硝基丙烯酸苯酯、4-硝基丙烯酸苯酯、2-硝基甲基丙烯酸苯酯、4-硝基甲基丙烯酸苯酯、2-硝基甲基丙烯酸苄酯、4-硝基甲基丙烯酸苄酯、2-氯丙烯酸苯酯、4-氯丙烯酸苯酯、2-氯甲基丙烯酸苯酯、4-氯甲基丙烯酸苯酯等。The function of the aromatic monomer is to form a close adhesion and stable pattern on the substrate; in particular, styrene, benzyl methacrylate, Benzyl acrylate, phenyl acrylate, phenyl methacrylate, phenyl 2-nitroacrylate, phenyl 4-nitroacrylate, phenyl 2-nitromethyl methacrylate, phenyl 4-nitromethyl methacrylate, Benzyl 2-nitromethyl methacrylate, benzyl 4-nitromethyl methacrylate, phenyl 2-chloroacrylate, phenyl 4-chloroacrylate, phenyl 2-chloromethyl methacrylate, benzene 4-chloromethyl acrylate Ester and the like.
較佳地,該芳香族單體被包含之量係為製備該丙烯酸聚合物樹脂中所用全部單體的10到30wt%,其含量為15到20wt%為更佳。當含量於上述範圍內時,對基板的緊密黏著性、圖案的黏著強度、所形成之圖案的方向性、穩定圖案之形成、以及鍛燒過程中的易移除性均令人滿意。Preferably, the aromatic monomer is contained in an amount of 10 to 30% by weight, more preferably 15 to 20% by weight, based on the total of monomers used in the preparation of the acrylic polymer resin. When the content is within the above range, the adhesion to the substrate, the adhesion strength of the pattern, the directionality of the formed pattern, the formation of a stable pattern, and the ease of removal during calcination are satisfactory.
除了該不飽和羧酸單體及該芳香族單體之外,用於該丙烯酸聚合物樹脂之製備的其它單體,其功能在控制其玻璃轉化溫度以及聚合物的極性。In addition to the unsaturated carboxylic acid monomer and the aromatic monomer, other monomers used in the preparation of the acrylic polymer resin function to control the glass transition temperature and the polarity of the polymer.
該等其它單體,可使用2-羥乙基(甲)丙烯酸酯、2-羥辛基(甲)丙烯酸酯、甲基(甲)丙烯酸酯、乙基(甲)丙烯酸酯、或n-丁基丙烯酸酯,且其等較佳被包含之量,考慮到聚合物對基板的緊密黏著性、耐熱性及玻璃轉化溫度,係為製備該丙烯酸聚合物樹脂中所用之全部單體的20到60wt%為較佳。For these other monomers, 2-hydroxyethyl (meth) acrylate, 2-hydroxyoctyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, or n-butyl can be used. The acrylate, and the like, preferably contained in an amount of 20 to 60 wt% of the total monomers used in the preparation of the acrylic polymer resin in view of the close adhesion of the polymer to the substrate, heat resistance and glass transition temperature. % is preferred.
該丙烯酸聚合物樹脂可藉由在有溶劑存在下聚合上述單體來製備,使得能預防該不飽和羧酸單體、芳香族單體及其它單體的凝膠化,且能在膠版印刷過程中控制適當之揮發性。The acrylic polymer resin can be prepared by polymerizing the above monomer in the presence of a solvent, thereby preventing gelation of the unsaturated carboxylic acid monomer, aromatic monomer and other monomers, and can be in the offset printing process. Control the appropriate volatility.
就溶劑來說,丙二醇一甲醚、二丙二醇一甲醚、丙二醇一甲醚丙酸酯、乙醚丙酸酯、松油醇(terpineol)、丙二醇一甲醚乙酸酯、二甲基氨基甲醛、甲基乙基酮、丁基卡別妥、丁基卡別妥乙烯酯(butylcarbitol acetate)、γ -丁內酯,或乳酸乙酯,可被單獨或混合使用。In terms of solvent, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl propionate, diethyl ether propionate, terpineol, propylene glycol monomethyl ether acetate, dimethyl amino formaldehyde, Methyl ethyl ketone, butyl carbitol, butylcarbitol acetate, γ -butyrolactone, or ethyl lactate may be used singly or in combination.
在有溶劑存在下藉由上述單體之聚合作用所獲得的丙烯酸聚合物樹脂,其較佳的平均重量分子量為10,000到100,000,更佳地,為20,000到50,000。當平均重量分子量落於上述的範圍內時,可同時解決在OFF模式下由於聚合物樹脂之低玻璃轉化溫度所致之聚合物的流動性增加,而造成圖案由凹版膠印的字溝轉移到膠布可能會有困難的問題,以及由於聚合物樹脂的過度彈性特性而使該組成物注射進入凹版字溝可能有困難的問題。The acrylic polymer resin obtained by the polymerization of the above monomers in the presence of a solvent preferably has an average molecular weight of from 10,000 to 100,000, more preferably from 20,000 to 50,000. When the average weight molecular weight falls within the above range, the fluidity of the polymer due to the low glass transition temperature of the polymer resin in the OFF mode can be simultaneously solved, and the pattern is transferred from the gravure of the gravure offset to the tape. There may be a problem of difficulty, and the injection of the composition into the intaglio groove may be difficult due to the excessive elastic properties of the polymer resin.
該丙烯酸聚合物樹脂之含量係本發明供印刷用之糊組成物的5到30 wt%為較佳。當含量少於5 wt%時,會有在OFF模式時由於組成物彈性下降而可能發生問題,並且當含量超過30 wt%時,所形成之圖案的電阻會增加。The content of the acrylic polymer resin is preferably from 5 to 30% by weight of the paste composition for printing of the present invention. When the content is less than 5 wt%, there may be a problem in the OFF mode due to a decrease in the elasticity of the composition, and when the content exceeds 30 wt%, the resistance of the formed pattern may increase.
並且,本發明包含有該高沸點溶劑,其沸點至少為200℃。該高沸點溶劑並不侷限於特定溶劑,只要其沸點係為200℃或更高,且特別地,可使用γ -丁內酯、丁基卡別妥乙烯酯、卡別妥、甲氧基甲基醚丙酸酯及松油醇等。Further, the present invention encompasses the high boiling point solvent having a boiling point of at least 200 °C. The high boiling point solvent is not limited to a specific solvent as long as it has a boiling point of 200 ° C or higher, and in particular, γ -butyrolactone, butyl ketobutrol, vinyl, methoxy, and methoxy can be used. Ethyl ether propionate and terpineol.
較佳地,該高沸點溶劑係本發明供印刷用之糊組成物的5到35 wt%。當含量少於5 wt%時,溶劑的流動下降率變得非常快速,且因此在印刷過程的OFF模式中,圖案不易轉移,且當含量超過35 wt%時,因為難以控制在膠版印刷過程的SET模式中組成物之流動因此,圖案的方向性會下降,並且印刷時圖案擴大的現象會惡化。Preferably, the high boiling solvent is from 5 to 35 wt% of the paste composition for printing of the present invention. When the content is less than 5 wt%, the flow rate of the solvent becomes very fast, and thus the pattern is not easily transferred in the OFF mode of the printing process, and when the content exceeds 35 wt%, since it is difficult to control the offset printing process The flow of the composition in the SET mode, therefore, the directionality of the pattern is lowered, and the phenomenon of pattern enlargement during printing is deteriorated.
並且,本發明包含有低沸點溶劑,其沸點低於200℃。Further, the present invention contains a low boiling point solvent having a boiling point of less than 200 °C.
該低沸點溶劑並不侷限於特定溶劑,只要其沸點低於200℃,且特別地,可使用丙二醇一甲醚、二丙二醇一甲醚、丙二醇一甲醚丙酸酯、乙醚丙酸酯、丙二醇一甲醚乙酸酯、甲基乙基酮及乳酸乙酯等。The low boiling point solvent is not limited to a specific solvent as long as its boiling point is lower than 200 ° C, and in particular, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl propionate, diethyl ether propionate, propylene glycol can be used. Monomethyl ether acetate, methyl ethyl ketone and ethyl lactate.
較佳地,該低沸點溶劑之含量係本發明供印刷用之糊組成物的5到35 wt%。當含量少於5 wt%時,因為難以控制在膠版印刷過程的SET模式中組成物之流動,因此圖案的方向性會下降,並且印刷時圖案擴大的現象會惡化。當含量超過35 wt%時,流動下降率變得非常快速,且因此在印刷過程的OFF模式中,圖案不易轉移。Preferably, the low boiling point solvent is present in an amount of from 5 to 35 wt% of the paste composition for printing of the present invention. When the content is less than 5 wt%, since it is difficult to control the flow of the composition in the SET mode of the offset printing process, the directivity of the pattern is lowered, and the phenomenon of pattern enlargement at the time of printing is deteriorated. When the content exceeds 35 wt%, the flow rate of decrease becomes very fast, and thus the pattern is not easily transferred in the OFF mode of the printing process.
較佳地,該高沸點溶劑b)及該低沸點溶劑c)的組合量為本發明供印刷用之糊組成物的40 wt%或更少。當含量超過40 wt%時,該糊之黏性下降且印刷效能可能會惡化。此外,較佳係藉由適當地拌合高沸點溶劑及低沸點溶劑之揮發性溶劑,將供膠版印刷用的最終糊組成物的黏性控制在5000到20000 cP的範圍為較佳。Preferably, the combined amount of the high boiling point solvent b) and the low boiling point solvent c) is 40% by weight or less of the paste composition for printing of the present invention. When the content exceeds 40% by weight, the viscosity of the paste is lowered and the printing efficiency may be deteriorated. Further, it is preferred to control the viscosity of the final paste composition for offset printing to be in the range of 5,000 to 20,000 cP by appropriately mixing a volatile solvent having a high boiling point solvent and a low boiling point solvent.
用於本發明之d)的金屬粉末並不侷限於特定的金屬,只要其可以被用於PDP電極或遮蔽電磁波用篩網濾波器之電極的形成,且特別地,可用銀、銅、鎳或包含其等之合金等。The metal powder used in the d) of the present invention is not limited to a specific metal as long as it can be used for the formation of an electrode of a PDP electrode or a screen filter for shielding electromagnetic waves, and in particular, silver, copper, nickel or Contains alloys such as these.
較佳地,該金屬粉末之含量係本發明供印刷用之糊組成物的50到85 wt%。當含量少於50 wt%時,由於所形成之圖案的電阻增加,作為電極所需之效能及電磁遮蔽效能會惡化,且當含量超過85 wt%時,該組成物的黏性會增加且變得難以散開,因此印刷的效能會惡化。Preferably, the content of the metal powder is from 50 to 85 wt% of the paste composition for printing of the present invention. When the content is less than 50% by weight, the performance required for the electrode and the electromagnetic shielding effectiveness are deteriorated due to an increase in the resistance of the formed pattern, and when the content exceeds 85 wt%, the viscosity of the composition increases and becomes variable. It is difficult to spread, so the printing performance will deteriorate.
另外,本發明供印刷用的糊組成物可進一步包含有一用於分散電極之金屬粉末的分散劑、一用於控制對比的黑色顏料,以及一用來在鍛燒時增強對玻璃黏著強度的玻璃粉末,如果需要,其含量較佳為本發明供印刷用之糊組成物的0.01到10 wt%,0.1到3 wt%為更佳。Further, the paste composition for printing of the present invention may further comprise a dispersant for dispersing the metal powder of the electrode, a black pigment for controlling the contrast, and a glass for enhancing the adhesion strength to the glass during calcination. The powder, if necessary, is preferably from 0.01 to 10% by weight, more preferably from 0.1 to 3% by weight, based on the paste composition for printing of the present invention.
並且,本發明提供一種形成一電漿面板顯示器電極的方法,其包含有藉由凹版膠印法使用上述供印刷用之糊組成物來形成圖案,其特徵在於使用本發明供膠版印刷用之糊組成物取代已被用以形成電漿顯示器面板之電極的傳統糊組成物,以及採用凹版膠印法,並且任何其它已知的方法可被應用於形成電漿顯示器電極。Moreover, the present invention provides a method of forming a plasma panel display electrode comprising forming a pattern by using the above-described paste composition for printing by gravure offset printing, which is characterized by using the paste for offset printing of the present invention. The material replaces the conventional paste composition that has been used to form the electrodes of the plasma display panel, and uses gravure offset printing, and any other known method can be applied to form the plasma display electrodes.
並且,本發明提供一種形成一遮蔽電磁波用之篩網濾波器的電極的方法,其包含有藉由凹版膠印法使用上述供印刷用之糊組成物來形成圖案,其特徵在於使用本發明供膠版印刷用之糊組成物取代已被用以形成遮蔽電磁波用之篩網濾波器電極,以及採用凹版膠印法,並且任何其它已知的方法可被應用於形成遮蔽電磁波用之篩網濾波器電極。Moreover, the present invention provides a method of forming an electrode for shielding a screen filter for electromagnetic waves, comprising forming a pattern by using the above-described paste composition for printing by gravure offset printing, characterized in that the adhesive plate of the present invention is used. The paste composition for printing replaces the screen filter electrode which has been used to form a shielded electromagnetic wave, and uses a gravure offset method, and any other known method can be applied to form a screen filter electrode for shielding electromagnetic waves.
使用本發明供印刷用之糊組成物之電漿顯示器面板之電極形成方法以及遮蔽電磁波用之篩網濾波器之製備方法可提供極佳的印刷效能,所形成之圖案有極佳的方向性及穩定性,且特別地,當與光微影技術法比較時,因其等採直接印刷模式,而明顯地改善了成本節省效應。The electrode forming method of the plasma display panel using the paste composition for printing of the present invention and the method for preparing the screen filter for shielding electromagnetic waves can provide excellent printing performance, and the formed pattern has excellent directivity and Stability, and in particular, when compared to the photolithography technique, the cost saving effect is significantly improved by the direct printing mode.
為了更了解本發明,以下為較佳實施例。下列實施例僅為說明本發明,而不限制本發明的範圍。In order to better understand the present invention, the following is a preferred embodiment. The following examples are merely illustrative of the invention and are not intended to limit the scope of the invention.
15 wt%的聚合物樹脂(重量平均分子量為25,000),其中甲基丙烯酸(MA):丙烯酸苄酯(BA):2-羥乙基(甲)丙烯酸酯(2-HEMA):甲基(甲)丙烯酸酯(MMA)係以30:20:10:40的重量比例所聚合,為一丙烯酸聚合物樹脂,15 wt%的作為一高沸點溶劑之松油醇(α-,β-,γ-松油醇的混合物)、10 wt%的作為一低沸點溶劑之丙二醇一甲醚丙酸酯(PGMEP)、63 wt%的作為一電極用金屬粉末之銀,以及2 wt%的作為分散劑之含有一胺基的有機分散劑,在室溫下混合及攪拌,最後使用一三向攪拌器來製備一所需的供印刷用之糊組成物。15 wt% polymer resin (weight average molecular weight 25,000), wherein methacrylic acid (MA): benzyl acrylate (BA): 2-hydroxyethyl (meth) acrylate (2-HEMA): methyl (A) Acrylate (MMA) is polymerized in a weight ratio of 30:20:10:40, which is an acrylic polymer resin, 15 wt% of terpineol as a high boiling point solvent (α-, β-, γ- a mixture of terpineol), 10 wt% of propylene glycol monomethyl propionate (PGMEP) as a low boiling point solvent, 63 wt% of silver as a metal powder for an electrode, and 2 wt% as a dispersing agent An organic dispersant containing an amine group is mixed and stirred at room temperature, and finally a three-way stirrer is used to prepare a desired paste composition for printing.
除了將顯示於下列表1中之組成物使用於實施例1之外,進行相同於實施例1的程序以製備供印刷用之糊組成物。Except that the composition shown in the following Table 1 was used in Example 1, the procedure similar to that of Example 1 was carried out to prepare a paste composition for printing.
用於表1中的單位為wt%。The units used in Table 1 are wt%.
使用於實施例1至3及比較實施例1或2所製備的供印刷用之糊組成物,評估其用於凹版膠印上的印刷效能、最小線寬及圖案方向性,結果顯示在第1圖與下方表2中。The paste compositions for printing prepared in Examples 1 to 3 and Comparative Example 1 or 2 were evaluated for printing efficiency, minimum line width, and pattern directionality on gravure offset printing, and the results are shown in Fig. 1. Same as in Table 2 below.
其印刷效能的評估是用光學顯微鏡觀察在SET模式時仍殘留在膠布上而沒有被轉移到基板的組成物位準,其中,○表示無印刷組成物殘留在膠布上的情況,X表示在SET模式時有過量的印刷組成物殘留在膠布上且不可能將圖案轉移到基板的情況。最小線寬之評估,是測量由凹版膠印可形成之圖案的最小尺寸,且尺寸越小為越佳。就圖案方向性而言,使用一光學顯微鏡觀察印刷後形成於基板上圖案中方向性之程度,其中有優良方向性的情況表示為○,普通的情況為△及較差的情況為X。The printing performance was evaluated by observing the composition level remaining on the tape in the SET mode without being transferred to the substrate by an optical microscope, wherein ○ indicates that no printing composition remains on the tape, and X indicates that the SET is in the SET. In the mode, there is a case where an excessive amount of the printing composition remains on the tape and it is impossible to transfer the pattern to the substrate. The minimum line width is evaluated by measuring the minimum size of the pattern that can be formed by gravure offset printing, and the smaller the size, the better. Regarding the pattern directivity, the degree of directivity in the pattern formed on the substrate after printing was observed with an optical microscope, and the case where the excellent directivity was shown was ○, and the case where Δ was normal and X when it was poor.
如上方表2及第1圖中所見顯示,實施例1-3是使用本發明供印刷用之糊組成物以凹版膠印法形成圖案,與比較實施例1或2相比下,顯示出優良的印刷效能、20 μm及以下之狹窄最小線寬以及優良的圖案方向性。再者,比較實施例2無法印刷,導致無圖案。As shown in Table 2 and Figure 1 above, Examples 1-3 were formed by the gravure offset printing method using the paste composition for printing of the present invention, which showed superiority compared with Comparative Example 1 or 2. Print performance, narrow minimum line width of 20 μm and below, and excellent pattern directionality. Further, Comparative Example 2 could not be printed, resulting in no pattern.
本發明供印刷用之糊組成物適合於直接形成精細圖案的凹版膠印模式,且與習知以光微影技術為基礎的方法相比,具有著優異的成本節省效應,且同時,可以滿足作為組成物所需之各種特性,且該等特性的每一者為印刷程序上所需要因而可發揮適當的膠印性能者。The paste composition for printing of the present invention is suitable for a gravure offset printing mode in which a fine pattern is directly formed, and has an excellent cost saving effect compared with a conventional method based on photolithography technology, and at the same time, can be satisfied as The various properties required for the composition, and each of which is desirable for the printing process and thus exhibits suitable offset performance.
雖然本發明是以最佳實施例來詳細描述,對熟習本相關技術領域之人士而言,顯而易見地,在本發明的精神及領域之範圍內可做多種改變與修飾,且無庸置疑地,這些改變與修飾落在所附的申請專利範圍之範圍內。While the invention has been described in detail, the preferred embodiments of the present invention Changes and modifications are intended to fall within the scope of the appended claims.
第1圖為顯示凹版膠印後之最小線寬的照片,其係使用依據本發明的實施例及比較實施例所製備供印刷用之糊組成物。Fig. 1 is a photograph showing the minimum line width after gravure offset printing, which was prepared using a paste composition for printing according to an embodiment of the present invention and a comparative example.
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060035141A KR100871075B1 (en) | 2006-04-18 | 2006-04-18 | Paste composition for printing |
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| TW200745176A TW200745176A (en) | 2007-12-16 |
| TWI471339B true TWI471339B (en) | 2015-02-01 |
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| TW96113328A TWI471339B (en) | 2006-04-18 | 2007-04-16 | Paste composition for printing |
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| Country | Link |
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| JP (1) | JP5566686B2 (en) |
| KR (1) | KR100871075B1 (en) |
| CN (1) | CN101426867B (en) |
| TW (1) | TWI471339B (en) |
| WO (1) | WO2007119955A1 (en) |
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| KR100898518B1 (en) | 2006-04-25 | 2009-05-20 | 주식회사 동진쎄미켐 | Printing paste composition used to prepare a mesh filter for shielding electromagnetic waves using gravure offset printing |
| KR100978099B1 (en) * | 2008-02-18 | 2010-08-27 | 주식회사 에프피 | Conductive Paste Composition for Gravure Printing |
| JP5178279B2 (en) * | 2008-03-28 | 2013-04-10 | 積水化学工業株式会社 | Conductive paste for multilayer ceramic capacitors |
| KR20090108781A (en) * | 2008-04-14 | 2009-10-19 | 주식회사 동진쎄미켐 | Black conductive paste composition, electromagnetic shielding filter and display device comprising same |
| KR20090125393A (en) * | 2008-06-02 | 2009-12-07 | 주식회사 동진쎄미켐 | Black conductive paste composition, electromagnetic shielding filter and display device comprising same |
| WO2010117224A2 (en) * | 2009-04-08 | 2010-10-14 | 주식회사 엘지화학 | Printing paste composition and electrode prepared therefrom |
| TWI510372B (en) * | 2010-12-30 | 2015-12-01 | Lg Chemical Ltd | Electrode, electronic device comprising the same and manufacturing method thereof |
| KR101356896B1 (en) * | 2011-04-05 | 2014-02-06 | 주식회사 엘지화학 | Composition for printing and printing method using the same |
| JP6459261B2 (en) | 2013-09-11 | 2019-01-30 | 株式会社リコー | Ink and method for forming conductive pattern |
| WO2015151941A1 (en) * | 2014-04-01 | 2015-10-08 | 株式会社ダイセル | Silver-nano-particle-containing ink for intaglio offset printing, and production method for silver-nano-particle-containing ink for intaglio offset printing |
| CN107614630B (en) * | 2015-06-05 | 2021-03-30 | 昭和电工株式会社 | Composition for forming insulating protective film for forming insulating protective film by offset printing |
| JP6348241B1 (en) * | 2017-02-14 | 2018-06-27 | バンドー化学株式会社 | Conductive paste for gravure offset printing, method for forming conductive pattern, and method for manufacturing conductive substrate |
| WO2018150697A1 (en) * | 2017-02-14 | 2018-08-23 | バンドー化学株式会社 | Conductive paste for gravure offset printing, method for forming conductive pattern, and method for manufacturing conductive substrate |
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2007
- 2007-04-10 JP JP2009506404A patent/JP5566686B2/en not_active Expired - Fee Related
- 2007-04-10 CN CN2007800140715A patent/CN101426867B/en not_active Expired - Fee Related
- 2007-04-10 WO PCT/KR2007/001722 patent/WO2007119955A1/en not_active Ceased
- 2007-04-16 TW TW96113328A patent/TWI471339B/en not_active IP Right Cessation
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| JPS63227671A (en) * | 1987-03-17 | 1988-09-21 | Toyo Ink Mfg Co Ltd | Electron beam curing conductive paste |
| JPH05234424A (en) * | 1992-02-20 | 1993-09-10 | Murata Mfg Co Ltd | Binder for conductive paste |
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| TW363194B (en) * | 1997-03-26 | 1999-07-01 | Taiyo Ink Mfg Co Ltd | Alkali development type photocurable conductive paste composition and plasma display panels having electrodes formed thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100871075B1 (en) | 2008-11-28 |
| TW200745176A (en) | 2007-12-16 |
| CN101426867A (en) | 2009-05-06 |
| CN101426867B (en) | 2011-07-06 |
| JP5566686B2 (en) | 2014-08-06 |
| JP2009534498A (en) | 2009-09-24 |
| WO2007119955A1 (en) | 2007-10-25 |
| KR20070103262A (en) | 2007-10-23 |
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