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TWI470885B - Sheathing method of solder terminal with solder and sheathing structure therof - Google Patents

Sheathing method of solder terminal with solder and sheathing structure therof Download PDF

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Publication number
TWI470885B
TWI470885B TW101132863A TW101132863A TWI470885B TW I470885 B TWI470885 B TW I470885B TW 101132863 A TW101132863 A TW 101132863A TW 101132863 A TW101132863 A TW 101132863A TW I470885 B TWI470885 B TW I470885B
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Taiwan
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soldering
terminal
solder
soldering terminal
covering portion
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TW101132863A
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Chinese (zh)
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TW201411972A (en
Inventor
Chung Nan Pao
Sun Wu Chou
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Chief Land Electronic Co Ltd
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Priority to TW101132863A priority Critical patent/TWI470885B/en
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Publication of TWI470885B publication Critical patent/TWI470885B/en

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Description

焊料件與焊接端子之套設方法及其套設結構Soldering device and welding terminal arranging method and arranging structure thereof

本發明是有關於一種焊料件的套設方法及其套設結構,尤指一種焊料件與焊接端子之套設方法及其套設結構。The invention relates to a method for arranging a soldering member and a sheathing structure thereof, in particular to a method for arranging a soldering member and a soldering terminal and a sheathing structure thereof.

隨著科技的進步,電子元件日益的微型化,為了使這些日益微型化的電子元件被精確地焊接於電路板上,表面黏著技術(Surface Mount Technology,SMT)亦面臨著越來越大的挑戰。With the advancement of technology, electronic components are becoming more and more miniaturized. In order to make these increasingly miniaturized electronic components accurately soldered to the circuit board, Surface Mount Technology (SMT) is also facing increasing challenges. .

為了將焊料件固著於焊接端子上,習知的手法不外乎利用焊接端子的尖端插接一焊料球,然而此法卻存在著焊料球極易掉落的隱憂,而導致焊接品質不佳或漏焊的問題。In order to fix the soldering member to the soldering terminal, the conventional method is to insert a solder ball by the tip of the soldering terminal. However, this method has the hidden problem that the solder ball is easily dropped, resulting in poor soldering quality. Or the problem of missing soldering.

另外亦有透過側掛的方式,將焊料設置於焊接端子側邊平面,然而此舉將導致焊料的實際位置偏離於焊接端子,進而造成焊接時準確定位的不便、需要重新設定定位以及微調。更有甚者,在現今電子元件微型化的趨勢下,如遇到欲焊位置附近有其他零件阻礙時,礙於失之毫釐,差之千里,故透過此法將在焊接作業進行時感受到極大的不方便。In addition, the solder is placed on the side surface of the soldering terminal by means of a side-hanging method. However, this will cause the actual position of the solder to deviate from the soldering terminal, thereby causing inconvenience in accurate positioning during soldering, requiring repositioning and fine adjustment. What's more, in today's trend of miniaturization of electronic components, if there are other parts in the vicinity of the location to be soldered, it will be a thousand miles away, so this method will be felt during the welding operation. Great inconvenience.

緣是,本發明人有感上述之課題,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。The reason is that the present inventors have felt the above-mentioned problems, and have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is rational in design and effective in improving the above-mentioned defects.

本發明之主要目的,在於提供一種焊料件與焊接端子之套設方法及其套設結構,以解決習知焊接方法容易遭遇焊料脫落或是焊料因為側掛而造成定位偏移上的不便。The main object of the present invention is to provide a soldering method and a soldering terminal arranging method and a framing structure thereof, so as to solve the inconvenience that the conventional soldering method is susceptible to solder detachment or soldering due to side suspension.

為達上述目的,本發明提供一種焊料件與焊接端子之套設方法,包含以下步驟:提供一焊接端子,該焊接端子形成有一固定部;提供一焊料件,該焊料件成形為一套設前驅結構,該套設前驅結構圍成一套設空間,該套設空間用以對應於該焊接端子的末端;以及使成形為該套設前驅結構的焊料件套設於該焊接端子以完成焊料件的套設,對套設有該焊料件的焊接端子施予一外力,且使該焊料件干涉連接於該固定部。In order to achieve the above object, the present invention provides a soldering method for a soldering member and a soldering terminal, comprising the steps of: providing a soldering terminal, the soldering terminal is formed with a fixing portion; and providing a soldering member, the soldering member is formed as a set of precursors a structure, the set front drive structure encloses a set of spaces for corresponding to the end of the soldering terminal; and a soldering member formed as the sheathed precursor structure is sleeved on the soldering terminal to complete the soldering piece The sleeve is applied with an external force to the soldering terminal provided with the solder member, and the solder member is interference-coupled to the fixing portion.

為達上述目的,本發明另提供一種焊料件與焊接端子之套設結構,包含:一焊接端子,該焊接端子具有一固定部;以及一焊料件,該焊料件具有一套設前驅結構,該套設前驅結構進一步圍設有一套設空間,利用該套設空間對應於該焊接端子,而使該焊料件套設於該焊接端子,且該焊料件包覆性地設置於該固定部。In order to achieve the above object, the present invention further provides a sleeve structure for a solder member and a solder terminal, comprising: a solder terminal having a fixing portion; and a solder member having a set of precursor structures, The sheathing structure further includes a set of space, and the soldering member is sleeved on the soldering terminal, and the soldering member is coverably disposed on the fixing portion.

綜上所述,本發明可有效提升焊料件與焊接端子之間連接上的穩定性,大量減少焊料件自焊接端子脫落的機率,理所當然具有更可靠的連接效果。In summary, the present invention can effectively improve the stability of the connection between the solder member and the solder terminal, and greatly reduce the probability of the solder member falling off from the solder terminal, and of course has a more reliable connection effect.

為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[第一實施例][First Embodiment]

請參閱圖1A以及圖1B所繪示,本發明提供一種焊料件與焊接端子之套設結構,包含:一焊接端子10以及一焊料件20。Referring to FIG. 1A and FIG. 1B , the present invention provides a sleeve structure for a solder member and a solder terminal, comprising: a solder terminal 10 and a solder member 20 .

焊接端子10在其端部可為一方形的結構(未標號),且該方形的結構具有一端部通孔(未標號),在焊接端子10更設置有一固定部A,因此當焊料件20套設於焊接端子10時,固定部A可負責加強焊料件20對焊接端子10的干涉連接。The soldering terminal 10 may have a square structure (not numbered) at its end, and the square structure has one end through hole (not numbered), and the soldering terminal 10 is further provided with a fixing portion A, so when the soldering member 20 is sleeved When the solder terminal 10 is provided, the fixing portion A can be responsible for enhancing the interference connection of the solder member 20 to the solder terminal 10.

焊料件20較佳地可為各種形式的焊料,包含焊錫條、焊料塊或焊料片等,焊料件20在對焊接端子10進行套設之前,較佳地需要使焊料件20事先形成一套設前驅結構201,而套設前驅結構201進一步圍設有一套設空間202,套設空間202用以對應於焊接端子10,而使焊料件20(此時或稱套設前驅結構201)的套設空間202可被焊接端子10對應而套設於焊接端子10,且同時焊料件20包覆性地設置於該固定部A。然而,當焊料件20為焊料塊的形式時,套設空間202亦可因為焊料塊套設於焊接端子10時而連帶地被同時擠壓而形成。The solder member 20 is preferably in various forms of solder, including solder strips, solder bumps or solder bumps. The solder member 20 preferably needs to form the solder member 20 in advance before the solder terminal 10 is sheathed. The precursor structure 201, and the sheathing structure 201 further encloses a set of a space 202 for corresponding to the soldering terminal 10, and the soldering member 20 (hereinafter referred to as the sheathing structure 201) is sleeved. The space 202 can be sleeved on the soldering terminal 10 corresponding to the soldering terminal 10, and at the same time, the soldering member 20 is coverably disposed on the fixing portion A. However, when the solder member 20 is in the form of a solder bump, the sleeve space 202 may also be formed by being simultaneously pressed while the solder bumps are sleeved on the solder terminal 10.

較佳地,焊接端子10更具有一第一正視面11、一第二正視面12、兩側邊13以及一底邊14,上述之固定部A進一步可為一凸出部131,且凸出部131凸設於兩側面13上,使得當焊料件20包覆性地設置於凸出部131時,此時凸出部131扮演著干涉件的角色,因此使焊料件20可穩固地套設於焊接端子10,而不至於讓焊料件20掉落。Preferably, the soldering terminal 10 further has a first front view surface 11, a second front view surface 12, two side edges 13 and a bottom side 14. The fixing portion A may further be a protrusion portion 131 and protrude. The portion 131 is protruded from the two side faces 13 such that when the solder member 20 is cover-coated on the protruding portion 131, the protruding portion 131 acts as an interference member, thereby allowing the solder member 20 to be stably set. The terminal 10 is soldered so as not to drop the solder member 20.

較佳地,焊接端子10具有一寬度W,而凸出部131寬於焊接端子10的寬度W;焊接端子10的兩側邊13更可凹設有側凹部132。而焊料件20形成套設前驅結構201後除形成有套設空間202外,更形成有包覆部203、接縫部204、上端部205或下端部206,包覆部203在本實施例較佳地可為一柱形包覆部2031,而且套設空間202自上而下連通上端部205以及下端部206。Preferably, the soldering terminal 10 has a width W, and the protruding portion 131 is wider than the width W of the soldering terminal 10; the side edges 13 of the soldering terminal 10 are more recessed with the side recess 132. The soldering member 20 is formed with the front structure 201, and is formed with a covering portion 202, a covering portion 204, an upper end portion 205 or a lower end portion 206. The covering portion 203 is compared in this embodiment. Preferably, the cylindrical cover portion 2031 is provided, and the sleeve space 202 connects the upper end portion 205 and the lower end portion 206 from top to bottom.

因此當焊接端子10朝套設空間202之方向與焊料件20結合,此時下端部206可與焊接端子10的底邊14齊平,或下端部206可凸設於底邊14,而進一步詳細地說,下端部206可微略地凸設於底邊14,使下端部206可略超出於焊接端子10的底邊14。Therefore, when the solder terminal 10 is combined with the solder member 20 in the direction of the sleeve space 202, the lower end portion 206 can be flush with the bottom edge 14 of the solder terminal 10, or the lower end portion 206 can be protruded from the bottom edge 14, and the details are further detailed. In other words, the lower end portion 206 can be slightly protruded from the bottom edge 14 such that the lower end portion 206 can slightly extend beyond the bottom edge 14 of the solder terminal 10.

較佳地,在進行完焊料件20對焊接端子10的套設後,可對包覆部203周遭施予一外力F(圖未繪示),以加強焊料件20對凸出部131或對凸出部131及側凹部132的干涉性連接。Preferably, after the soldering member 20 is sleeved on the soldering terminal 10, an external force F (not shown) may be applied to the covering portion 203 to strengthen the soldering member 20 to the protruding portion 131 or the pair. The protruding portion 131 and the side recess portion 132 are connected by interference.

[第二實施例][Second embodiment]

請參閱圖2A、2B、2C以及2D所繪示,本實施例與第一實施主要不同之處在於上述之固定部A進一步可為一鏤空部15,鏤空部15連通於第一正視面11及該第二正視面12,焊料件20部分地內陷於鏤空區15以在鏤空區15中形成一內陷部207,藉由內陷部207內陷於鏤空區15中,而加強焊料件20對焊接端子10的干涉連接。2A, 2B, 2C, and 2D, the present embodiment is mainly different from the first embodiment in that the fixing portion A is further a hollow portion 15, and the hollow portion 15 is connected to the first front surface 11 and The second front view surface 12, the solder member 20 is partially trapped in the hollow region 15 to form an indentation portion 207 in the hollow region 15, by the trap portion 207 being trapped in the hollow region 15, and the solder member 20 is soldered. Interference connection of the terminals 10.

承上,本實施例中的包覆部203因為具有內陷於鏤空部15的內陷部207,故包覆部203較佳地可為一內陷式柱形包覆部2032。The covering portion 203 in the present embodiment has a recessed portion 207 that is recessed in the hollow portion 15, so that the covering portion 203 is preferably an indented cylindrical covering portion 2032.

較佳地,焊料件20在形成套設前驅結構201之前,可事先進行剪裁,以便在形成套設前驅結構201時,可在下端部206進一步凹設出一下端缺口2061,如此移除掉下端缺口2061原有的焊料件20,可在接縫部204接受外力F時,使下端部206不至於因為應力的關係而翹起,可避免影響日後的焊接流程,以及焊接位置的定位問題。Preferably, the soldering member 20 can be cut in advance before forming the sheathing structure 201, so that when the front structure 201 is formed, the lower end portion 206 can be further recessed at the lower end portion 206, so that the lower end is removed. The original solder material 20 of the notch 2061 can prevent the lower end portion 206 from being lifted due to the stress when the external force F is received by the joint portion 204, thereby avoiding the influence of the welding process in the future and the positioning problem of the welding position.

較佳地,承上,下端部206亦可齊平於焊接端子的底邊14,或下端部206可凸設於底邊14,而進一步詳細地說,下端部206可微略地凸設於底邊206,使下端部206略超出於底邊14。Preferably, the lower end portion 206 can also be flush with the bottom edge 14 of the soldering terminal, or the lower end portion 206 can be protruded from the bottom edge 14, and in further detail, the lower end portion 206 can be slightly convexly protruded from The bottom edge 206 is such that the lower end portion 206 extends slightly beyond the bottom edge 14.

[第三實施例][Third embodiment]

請參閱圖3A以及圖3B所繪示,本實施例與前二實施例不同之處在於,包覆部203為一子彈形包覆部2033,且子彈形包覆部2033進一步延伸而使原來套設前驅結構201的下端部206呈圓弧封閉狀態,僅剩上端部205,而套設空間202則開口、開設於上端部205,纇似地,包覆部203或子彈形包覆部2033的週遭可接受一外力F(圖未繪示),以促進焊料件20對凸出部131的干涉連接。Referring to FIG. 3A and FIG. 3B , the difference between the embodiment and the first embodiment is that the covering portion 203 is a bullet-shaped covering portion 2033 , and the bullet-shaped covering portion 2033 is further extended to make the original sleeve. The lower end portion 206 of the precursor structure 201 is in a closed arc state, and only the upper end portion 205 is left, and the sleeve space 202 is opened and opened at the upper end portion 205, similarly, the covering portion 203 or the bullet-shaped covering portion 2033 An external force F (not shown) can be received around to facilitate the interference connection of the solder member 20 to the projections 131.

[第四實施例][Fourth embodiment]

請參閱圖4A以及圖4B所繪示,本實施例與前三實施例不同之處在於,焊料件20為一條狀焊料件,在經由一適當的設備沖壓成形後,即使得套設前驅結構201的包覆部203呈一螺紋形包覆部2034之結構,因此藉由本實施例,本發明之焊料件20以可以採用常見的焊錫條,以形成包覆部203為螺紋形包覆部2034的套設前驅結構201。而套設前驅結構201同樣具有套設空間202、上端部205以及下端部206, 下端部206亦可齊平於焊接端子的底邊14,或下端部206可凸設於底邊14,而進一步詳細地說,下端部206可微略地凸設於底邊206,使下端部206略超出於底邊14,類似地,包覆部203或螺紋形包覆部2034的週遭可接受一外力F(圖未繪示),以促進焊料件20對凸出部131的干涉連接。Referring to FIG. 4A and FIG. 4B, the present embodiment is different from the first three embodiments in that the solder member 20 is a strip-shaped solder member, and after being formed by a suitable device, the precursor structure 201 is sheathed. The covering portion 203 has a structure of a thread-shaped covering portion 2034. Therefore, with the present embodiment, the solder member 20 of the present invention can adopt a common solder bar to form the covering portion 203 as a thread-shaped covering portion 2034. The precursor structure 201 is sheathed. The sleeve precursor structure 201 also has a sleeve space 202, an upper end portion 205 and a lower end portion 206. The lower end portion 206 can also be flush with the bottom edge 14 of the soldering terminal, or the lower end portion 206 can be protruded from the bottom edge 14, and in further detail, the lower end portion 206 can be slightly protruded from the bottom edge 206 so that the lower end portion 206 is slightly beyond the bottom edge 14, and similarly, the periphery of the covering portion 203 or the threaded covering portion 2034 can receive an external force F (not shown) to facilitate the interference connection of the solder member 20 to the protruding portion 131.

請參閱圖5並對照圖1A以及圖1B所繪示,本發明提供一種焊料件與焊接端子之套設方法,包含以下步驟:提供一焊接端子10,焊接端子10形成有一固定部A(步驟S101);提供一焊料件20,焊料件20成形為一套設前驅結構201,套設前驅結構201圍成一套設空間202,套設空間202用以對應於焊接端子10的末端(步驟S103);以及使成形為套設前驅結構201的焊料件20套設於焊接端子10以完成焊料件20的套設,對套設有焊料件20的焊接端子10施予一外力F(圖未繪示),且使焊料件20干涉連接於固定部A(步驟S105)。Referring to FIG. 5 and FIG. 1B and FIG. 1B, the present invention provides a method for arranging a soldering member and a soldering terminal, comprising the steps of: providing a soldering terminal 10, wherein the soldering terminal 10 is formed with a fixing portion A (step S101). Providing a soldering member 20, the soldering member 20 is formed as a set of precursor structure 201, and the sheathing structure 201 surrounds a set of space 202, and the sleeve space 202 is corresponding to the end of the soldering terminal 10 (step S103) And the soldering member 20 formed into the sheathing structure 201 is sleeved on the soldering terminal 10 to complete the sheathing of the soldering member 20, and an external force F is applied to the soldering terminal 10 on which the soldering member 20 is placed (not shown) And the solder member 20 is interference-coupled to the fixed portion A (step S105).

較佳地,上述之方法更包含有一使該套設前驅結構201形成一包覆部203的步驟,所形成的包覆部203可為柱形包覆部2031(圖1A)、內陷式柱形包覆部2032(圖2C)、子彈形包覆部2033(圖3A)或螺紋形包覆部2034(圖4A),其中較佳地,柱形包覆部2031及內陷式柱形包覆部2032為形成自一片狀焊料件;子彈形包覆部2033為形成自一塊狀焊料件;螺紋形包覆部2034為形成自一條狀焊料件,如:焊錫條,經由一適當的工具、設備,對焊錫條沖折而形成如上所述之螺紋形包覆部2034。Preferably, the method further includes a step of forming the covering structure 201 to form a covering portion 203, and the formed covering portion 203 can be a cylindrical covering portion 2031 (FIG. 1A) and a trapped column. a shaped cladding portion 2032 (Fig. 2C), a bullet-shaped cladding portion 2033 (Fig. 3A) or a threaded cladding portion 2034 (Fig. 4A), wherein preferably, the cylindrical cladding portion 2031 and the indented cylindrical package The covering portion 2032 is formed from a piece of solder material; the bullet-shaped covering portion 2033 is formed from a piece of solder material; the threaded covering portion 2034 is formed from a strip of soldering member, such as a solder strip, via a suitable The tool and the device are formed by punching the solder strip to form a thread-shaped covering portion 2034 as described above.

使焊料件20形成套設前驅結構201後,套設前驅結構201 除形成套設空間202、包覆部203外,在柱形包覆部2031及內陷式柱形包覆部2032而言,還可形成接縫部204、上端部205以及下端部206;在子彈形包覆部2033而言則不具有接縫部204以及下端部206,故子彈形包覆部2033的套設空間202僅開口於上端部205之處;而螺紋形包覆部2034則亦可不具有接縫部204,但是仍具有套設空間202,且套設空間202連通上端部205以及下端部206。After the solder member 20 is formed into the sheath structure 201, the precursor structure 201 is sheathed. In addition to forming the sleeve space 202 and the cladding portion 203, the seam portion 204, the upper end portion 205, and the lower end portion 206 may be formed in the cylindrical cladding portion 2031 and the indented cylindrical cladding portion 2032; The bullet-shaped covering portion 2033 does not have the seam portion 204 and the lower end portion 206. Therefore, the sleeve space 202 of the bullet-shaped covering portion 2033 is opened only at the upper end portion 205, and the thread-shaped covering portion 2034 is also There may be no seam portion 204, but still have a nesting space 202, and the sleeve space 202 communicates with the upper end portion 205 and the lower end portion 206.

較佳地,上述之焊接端子10具有一第一正視面11、一第二正視面12、兩側邊13以及一底邊14,固定部A可為凸設於兩側面13的凸出部131,此外所述之外力F一般可施加於包覆部203上任何部位,以幫助使焊料件20包覆性地設置於上述之固定部A。Preferably, the soldering terminal 10 has a first front view surface 11, a second front view surface 12, two side edges 13 and a bottom side 14. The fixing portion A can be a protrusion 131 protruding from the two side surfaces 13. In addition, the external force F can be generally applied to any portion of the covering portion 203 to help cover the solder member 20 to the fixing portion A described above.

較佳地,固定部A亦可為連通第一正視面11及第二正視面12之鏤空部15,外力F使焊料件20於鏤空部15形成一內陷部207,內陷部207可包覆性地設置於鏤空部15;或者固定部A亦可為凸設於兩側面13之凸出部131,而外力F使焊料件20可包覆性地設置於凸出部131,此外兩側面13亦可凹設有側凹部132,側凹部132可配合凸出部131共同幫助焊料件20對焊接端子10的干涉連接。Preferably, the fixing portion A can also be a hollow portion 15 that communicates with the first front view surface 11 and the second front view surface 12. The external force F causes the solder member 20 to form an indented portion 207 in the hollow portion 15, and the indented portion 207 can be wrapped. The fixing portion A may be provided on the protruding portion 131 protruding from the side surfaces 13 , and the external force F may make the solder member 20 coverably disposed on the protruding portion 131 , and the other sides The recesses 132 may also be recessed, and the side recesses 132 may cooperate with the projections 131 to assist the interference connection of the solder members 20 to the solder terminals 10.

較佳地,請參閱圖2A、2B、2C以及2D,本發明之方法所提供的外力F,亦可使焊料件20內陷於鏤空部15並於鏤空部15形成內陷部207,進一步地,外力F可施加於接縫部204對應於鏤空部15之處,目的在於接縫部15是焊料件20中,結構強度較弱的部位,如此可較輕易地對焊料件20造成形變,以更有效率地讓焊料件20干涉連接於焊接端子10上,以加強兩者之結合。2A, 2B, 2C, and 2D, the external force F provided by the method of the present invention can also cause the solder member 20 to be trapped in the hollow portion 15 and form an indentation portion 207 in the hollow portion 15. Further, The external force F can be applied to the seam portion 204 corresponding to the hollow portion 15, and the purpose is that the seam portion 15 is a portion of the solder member 20 which is weak in structural strength, so that the solder member 20 can be deformed relatively easily, thereby The solder member 20 is efficiently interference-coupled to the solder terminal 10 to enhance the combination of the two.

綜上所述,本發明之焊料件與焊接端子之套設方法及其套設結構,可使焊料件有效地設置於焊接端子之上,不佔過大的空間體積,亦不會需要於焊接時另外調整定位,可有效簡化焊接的步驟,因此可有效確保焊接的效率。惟以上所述僅為本發明之較佳實施例,非意欲侷限本發明的專利保護範圍,故舉凡運用本發明說明書或圖式內容所為的等效變化,均同理皆包含於本發明的權利保護範圍內,合予陳明。In summary, the soldering member and the soldering terminal of the present invention and the sheathing method thereof can effectively place the soldering member on the soldering terminal without occupying an excessive space volume and without being required for soldering. In addition, the adjustment of the positioning can effectively simplify the welding step, thus effectively ensuring the efficiency of the welding. However, the above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents thereof are all included in the scope of the present invention. Within the scope of protection, it is given to Chen Ming.

10‧‧‧焊接端子10‧‧‧ soldering terminal

11‧‧‧第一正視面11‧‧‧First front view

12‧‧‧第二正視面12‧‧‧Second front view

13‧‧‧兩側邊13‧‧‧Side sides

131‧‧‧凸出部131‧‧‧protrusion

132‧‧‧側凹部132‧‧‧ undercut

14‧‧‧底邊14‧‧‧Bottom

15‧‧‧鏤空部15‧‧‧镂空部

20‧‧‧焊料件20‧‧‧Solders

201‧‧‧套設前驅結構201‧‧‧Set the precursor structure

202‧‧‧套設空間202‧‧‧Set space

203‧‧‧包覆部203‧‧‧Covering Department

2031‧‧‧柱形包覆部2031‧‧‧Cylindrical cladding

2032‧‧‧內陷式柱形包覆部2032‧‧‧Inset cylindrical cover

2033‧‧‧子彈形包覆部2033‧‧‧Bullet-shaped cladding

2034‧‧‧螺紋形包覆部2034‧‧‧Threaded cladding

204‧‧‧接縫部204‧‧‧Seam

205‧‧‧上端部205‧‧‧Upper end

206‧‧‧下端部206‧‧‧Bottom

2061‧‧‧下端缺口2061‧‧‧ lower end gap

207‧‧‧內陷部207‧‧‧Incuffed

A‧‧‧固定部A‧‧‧Fixed Department

F‧‧‧外力F‧‧‧External force

W‧‧‧寬度W‧‧‧Width

圖1A為本發明焊料件與焊接端子之套設結構第一實施例之分解示意圖;圖1B為本發明焊料件與焊接端子之套設結構第一實施例之立體圖;圖2A為本發明焊料件與焊接端子之套設結構第二實施例之分解示意圖;圖2B為本發明焊料件與焊接端子之套設結構第二實施例之組合圖(一);圖2C為本發明焊料件與焊接端子之套設結構第二實施例之組合圖(二);圖2D為本發明焊料件與焊接端子之套設結構組合圖(二)之橫向剖視圖;圖3A為本發明焊料件與焊接端子之套設結構第三實施例之分解示意圖;圖3B為本發明焊料件與焊接端子之套設結構第三實施例之組合圖; 圖4A為本發明焊料件與焊接端子之套設結構第四實施例之分解示意圖圖4B為本發明焊料件與焊接端子之套設結構第四實施例之組合圖;以及圖5為本發明焊料件與焊接端子之套設方法的方法流程圖。1A is an exploded perspective view showing a first embodiment of a sheathing structure of a soldering member and a soldering terminal according to the present invention; FIG. 1B is a perspective view showing a first embodiment of a sheathing structure of a soldering member and a soldering terminal according to the present invention; 2A is a schematic exploded view of a second embodiment of a sheathing structure of a soldering terminal; FIG. 2B is a combined view of a second embodiment of a sheathing structure of a soldering member and a soldering terminal according to the present invention; FIG. 2C is a soldering member and a soldering terminal of the present invention; FIG. 2D is a transverse cross-sectional view of the combined structure of the soldering member and the soldering terminal of the present invention; FIG. 3A is a set of the soldering member and the soldering terminal of the present invention; 3 is a schematic exploded view of the third embodiment of the structure; FIG. 3B is a combination view of the third embodiment of the sheathing structure of the soldering member and the soldering terminal of the present invention; 4A is a schematic exploded view of a fourth embodiment of a sheathing structure of a soldering member and a soldering terminal according to the present invention; FIG. 4B is a combination view of a fourth embodiment of a sheathing structure of a soldering member and a soldering terminal according to the present invention; and FIG. Flow chart of the method for arranging the piece and the welding terminal.

10‧‧‧焊接端子10‧‧‧ soldering terminal

20‧‧‧焊料件20‧‧‧Solders

203‧‧‧包覆部203‧‧‧Covering Department

2032‧‧‧內陷式柱形包覆部2032‧‧‧Inset cylindrical cover

205‧‧‧上端部205‧‧‧Upper end

206‧‧‧下端部206‧‧‧Bottom

2061‧‧‧下端缺口2061‧‧‧ lower end gap

207‧‧‧內陷部207‧‧‧Incuffed

Claims (8)

一種焊料件與焊接端子之套設方法,包含以下步驟:提供一焊接端子,該焊接端子形成有一固定部;提供一焊料件,該焊料件成形為一套設前驅結構,該套設前驅結構圍成一套設空間,該套設空間用以對應於該焊接端子的末端;以及使成形為該套設前驅結構的焊料件套設於該焊接端子以完成焊料件的套設,對套設有該焊料件的焊接端子施予一外力,且使該焊料件干涉連接於該固定部,其中該焊接端子具有一第一正視面、一第二正視面、兩側邊以及一底邊,該固定部為連通該第一正視面及該第二正視面之鏤空部,該外力使該焊料件於該鏤空部形成一內陷部,該內陷部包覆性地設置於該鏤空部。 A soldering method for soldering a soldering terminal and a soldering terminal, comprising the steps of: providing a soldering terminal, wherein the soldering terminal is formed with a fixing portion; and providing a soldering member, the soldering member is formed as a set of precursor structure, and the sleeve is provided with a front structure a set space for the end of the soldering terminal; and a soldering member formed as the sheathing precursor structure is sleeved on the soldering terminal to complete the soldering of the soldering member, and the sleeve is provided The soldering terminal of the soldering member applies an external force, and the soldering member is interference-connected to the fixing portion, wherein the soldering terminal has a first front view surface, a second front view surface, two side edges, and a bottom edge. The portion is a hollow portion connecting the first front view surface and the second front view surface, and the external force causes the solder member to form an indented portion in the hollow portion, and the indented portion is coverably disposed on the hollow portion. 一種焊料件與焊接端子之套設方法,包含以下步驟:提供一焊接端子,該焊接端子形成有一固定部;提供一焊料件,該焊料件成形為一套設前驅結構,該套設前驅結構圍成一套設空間,該套設空間用以對應於該焊接端子的末端;以及使成形為該套設前驅結構的焊料件套設於該焊接端子以完成焊料件的套設,對套設有該焊料件的焊接端子施予一外力,且使該焊料件干涉連接於該固定部,其中該焊接端子具有一第一正視面、一第二正視面、兩側邊以及一底邊,該固定部為一凸設於該兩側面之凸出部,該外力使該焊料件包覆性地設置於該凸出部。 A soldering method for soldering a soldering terminal and a soldering terminal, comprising the steps of: providing a soldering terminal, wherein the soldering terminal is formed with a fixing portion; and providing a soldering member, the soldering member is formed as a set of precursor structure, and the sleeve is provided with a front structure a set space for the end of the soldering terminal; and a soldering member formed as the sheathing precursor structure is sleeved on the soldering terminal to complete the soldering of the soldering member, and the sleeve is provided The soldering terminal of the soldering member applies an external force, and the soldering member is interference-connected to the fixing portion, wherein the soldering terminal has a first front view surface, a second front view surface, two side edges, and a bottom edge. The portion is a protrusion protruding from the two sides, and the external force causes the solder member to be coverably disposed on the protrusion. 一種焊料件與焊接端子之套設結構,包含:一焊接端子,該焊接端子具有一固定部;以及一焊料件,該焊料件具有一套設前驅結構,該套設前驅結構 進一步圍設有一套設空間,該套設空間對應於該焊接端子,而使該焊料件套設於該焊接端子,且該焊料件包覆性地設置於該固定部,其中該焊接端子更具有一第一正視面、一第二正視面、兩側邊以及一底邊,該固定部進一步為一鏤空部,該鏤空部連通於該第一正視面及該第二正視面,該焊料件於該鏤空區形成一內陷部。 A sleeve structure for a solder member and a solder terminal, comprising: a solder terminal having a fixing portion; and a solder member having a set of precursor structures, the sleeve pre-structure Further, a set of space is disposed, the sleeved space corresponding to the soldering terminal, and the soldering member is sleeved on the soldering terminal, and the soldering member is coverably disposed on the fixing portion, wherein the soldering terminal further has a first front view surface, a second front view side, two side edges, and a bottom side, the fixing portion is further a hollow portion, the hollow portion is connected to the first front view surface and the second front view surface, and the solder member is The hollowed out area forms an inset. 如申請專利範圍第3項所述之焊料件與焊接端子之套設結構,其中該套設前驅結構具有一包覆部,該包覆部為一內陷式柱形包覆部,該內陷式柱形包覆部更具有一下端部,該下端部開設有一下端缺口,該下端部齊平於該底邊或該下端部凸設於該底邊。 The arranging structure of the soldering piece and the soldering terminal according to claim 3, wherein the sheathing precursor structure has a covering portion, and the covering portion is an indented cylindrical covering portion, the indentation The cylindrical cap portion further has a lower end portion, and the lower end portion is provided with a lower end notch, and the lower end portion is flush with the bottom edge or the lower end portion is protruded from the bottom edge. 一種焊料件與焊接端子之套設結構,包含:一焊接端子,該焊接端子具有一固定部;以及一焊料件,該焊料件具有一套設前驅結構,該套設前驅結構進一步圍設有一套設空間,該套設空間對應於該焊接端子,而使該焊料件套設於該焊接端子,且該焊料件包覆性地設置於該固定部,其中該焊接端子更具有一第一正視面、一第二正視面、兩側邊以及一底邊,該固定部進一步為一凸出部,該凸出部凸設於該兩側面,該焊料件包覆性地設置於該凸出部。 A sleeve structure for a solder member and a soldering terminal, comprising: a soldering terminal having a fixing portion; and a soldering member having a set of precursor structures, the sleeved precursor structure further enclosing a set a space for the soldering terminal is disposed on the soldering terminal, and the soldering member is coverably disposed on the fixing portion, wherein the soldering terminal further has a first front surface The second front view surface, the two side edges, and the bottom side, the fixing portion is further a protruding portion, and the protruding portion is protruded from the two side surfaces, and the soldering member is coverably disposed on the protruding portion. 如申請專利範圍第5項所述之焊料件與焊接端子之套設結構,其中該套設前驅結構具有一包覆部,該包覆部為柱形包覆部,該柱形包覆部包含一上端部、一下端部及一接縫部,該下端部齊平於該底邊或該下端部凸設於該底邊。 The arranging structure of the soldering piece and the soldering terminal according to the fifth aspect of the invention, wherein the sheathing precursor structure has a covering portion, the covering portion is a cylindrical covering portion, and the cylindrical covering portion comprises An upper end portion, a lower end portion and a seam portion, the lower end portion being flush with the bottom edge or the lower end portion protruding from the bottom edge. 如申請專利範圍第5項所述之焊料件與焊接端子之套設結構,其中該套設前驅結構具有一包覆部,該包覆部為子彈形包覆部,該子彈形包覆部的上端為一上端部,該子彈形包覆部的下端 呈圓弧封閉狀態。 The arranging structure of the soldering piece and the soldering terminal according to claim 5, wherein the sheathing precursor structure has a covering portion, and the covering portion is a bullet-shaped covering portion, and the bullet-shaped covering portion is The upper end is an upper end, and the lower end of the bullet-shaped cladding portion It is closed in an arc. 如申請專利範圍第5項所述之焊料件與焊接端子之套設結構,其中該套設前驅結構具有一包覆部,該包覆部為螺紋形包覆部,該柱形包覆部包含一上端部及一下端部,該下端部齊平於該底邊或該下端部凸設於該底邊。 The arranging structure of the soldering piece and the soldering terminal according to the fifth aspect of the invention, wherein the sheathing precursor structure has a covering portion, the covering portion is a thread-shaped covering portion, and the cylindrical covering portion comprises An upper end portion and a lower end portion, the lower end portion being flush with the bottom edge or the lower end portion protruding from the bottom edge.
TW101132863A 2012-09-07 2012-09-07 Sheathing method of solder terminal with solder and sheathing structure therof TWI470885B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813648B1 (en) * 1969-07-31 1973-04-28
TW556372B (en) * 2002-09-17 2003-10-01 Lotes Co Ltd Solder ball fixing and manufacturing method for electrical connector and IC
TWM366773U (en) * 2009-03-31 2009-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
CN102044773A (en) * 2009-10-23 2011-05-04 东莞市奕东电子有限公司 Electric connector terminal and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4813648B1 (en) * 1969-07-31 1973-04-28
TW556372B (en) * 2002-09-17 2003-10-01 Lotes Co Ltd Solder ball fixing and manufacturing method for electrical connector and IC
TWM366773U (en) * 2009-03-31 2009-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
CN102044773A (en) * 2009-10-23 2011-05-04 东莞市奕东电子有限公司 Electric connector terminal and manufacturing method thereof

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