TWI466225B - Suspended air float working platform - Google Patents
Suspended air float working platform Download PDFInfo
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- TWI466225B TWI466225B TW098115833A TW98115833A TWI466225B TW I466225 B TWI466225 B TW I466225B TW 098115833 A TW098115833 A TW 098115833A TW 98115833 A TW98115833 A TW 98115833A TW I466225 B TWI466225 B TW I466225B
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- bottom plate
- plate body
- negative pressure
- working platform
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- H10P72/78—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2703/00—Work clamping
- B23Q2703/02—Work clamping means
- B23Q2703/04—Work clamping means using fluid means or a vacuum
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Description
本發明是有關於一種氣浮平台,特別是指一種利用氣壓而能吸附工件呈懸吊狀態的懸吊式氣浮工作平台。The invention relates to an air floating platform, in particular to a suspended air floating working platform capable of adsorbing a workpiece in a suspended state by using air pressure.
在現代科技的產品製程中,諸多電子零組件是容易因觸碰而受損的,例如:用於液晶顯示器(LCD)製程之玻璃基板、用於IC晶片製程之晶圓或者是可廣泛應用的印刷電路板(PCB)等,因此,在加工或檢測的過程中必須十分小心,要避免觸碰而造成電子零組件的損害。In the modern technology product process, many electronic components are easily damaged by touch, such as glass substrates for liquid crystal display (LCD) processes, wafers for IC wafer processes, or widely used. Printed circuit boards (PCBs), etc., therefore, care must be taken during processing or inspection to avoid damage to electronic components caused by touch.
有鑑於此,參閱圖1,目前已發展出一種氣浮式平台1,是可以將欲處理之物件91懸空地撐於氣浮式平台1上方,以非接觸的方式進行加工或檢測,氣浮式平台1包括一本體11、一形成在本體11內部之氣室12、複數形成本體11上且與氣室12連通之吹氣孔13及一連通氣室12之送氣孔14,並搭配一連接於送氣孔14之正壓輸出機92,藉由正壓輸出機92經由送氣孔14將氣體送入氣室12,再由氣室12將氣體分配至連通的吹氣孔14,進而產生向上之吹力支撐物件91,使得物件91懸空地被撐於氣浮式平台1上方。In view of this, referring to FIG. 1 , an air floating platform 1 has been developed, which can suspend the object to be processed 91 above the air floating platform 1 and process or detect it in a non-contact manner. The platform 1 includes a body 11 , a gas chamber 12 formed inside the body 11 , a plurality of air blowing holes 13 forming the body 11 and communicating with the air chamber 12 , and a gas supply hole 14 connecting the air chamber 12 , and being connected with the air supply hole 14 The positive pressure output device 92 of the air hole 14 feeds the gas into the air chamber 12 through the air supply hole 14 through the positive pressure output machine 94, and then distributes the gas to the communicating air blowing hole 14 through the air chamber 12, thereby generating an upward blowing force support. The object 91 is such that the object 91 is suspended above the air floating platform 1 in a suspended manner.
因此,本發明之目的,即在提供一種懸吊式氣浮工作平台,懸吊式氣浮工作平台能將一工件間隔地吸附於平台下方而使工件呈懸吊狀態。Therefore, the object of the present invention is to provide a suspended air floating working platform capable of absorbing a workpiece at a position below the platform to suspend the workpiece.
於是,本發明懸吊式氣浮工作平台適於連接一正壓源與一負壓源,用以將一工件吸附於平台下方。懸吊式氣浮工作平台包含一底板及一氣室座。底板包括一底板本體、複數上下貫穿底板本體之第一氣孔及第二氣孔,底板本體具有一底板本體頂面及一底板本體底面,而氣室座疊置於底板本體頂面並且可供該正壓源及負壓源連接。氣室座形成一連通第一氣孔與正壓源之正壓氣室及一連通第二氣孔與負壓源之負壓氣室,藉由負壓源提供之負壓,能於底板本體底面之第二氣孔產生吸附工件之負壓,以及藉正壓源提供之正壓,能於底板本體底面之第一氣孔產生正壓,使工件與底板本體底面懸空地保持一間隔。Therefore, the suspended air floating working platform of the present invention is adapted to connect a positive pressure source and a negative pressure source for adsorbing a workpiece under the platform. The suspended air floating work platform comprises a bottom plate and a gas chamber seat. The bottom plate comprises a bottom plate body, a plurality of first air holes and a second air hole extending through the bottom plate body. The bottom plate body has a bottom surface of the bottom plate body and a bottom surface of the bottom plate body, and the air chamber seat is stacked on the top surface of the bottom plate body and is available for the positive The pressure source and the negative pressure source are connected. The gas chamber seat forms a positive pressure air chamber connecting the first air hole and the positive pressure source and a negative pressure air chamber connecting the second air hole and the negative pressure source, and the negative pressure provided by the negative pressure source can be on the bottom surface of the bottom plate body The two pores generate a negative pressure for adsorbing the workpiece, and the positive pressure provided by the positive pressure source can generate a positive pressure on the first air hole of the bottom surface of the bottom plate body, so that the workpiece and the bottom surface of the bottom plate body are suspended at a distance.
本發明懸吊式氣浮工作平台的一特點在於第一氣孔於底板本體底面之孔徑小於第二氣孔於底板本體底面之孔徑。A feature of the suspended air-floating working platform of the present invention is that the aperture of the first air hole on the bottom surface of the bottom plate body is smaller than the aperture of the second air hole on the bottom surface of the bottom plate body.
本發明懸吊式氣浮工作平台的一特點在於氣室座包括一蓋板及一氣流分配板,藉由蓋板、氣流分配板及底板由上而下相互疊置,而於蓋板與氣流分配板間界定出一負壓氣室,氣流分配板與底板間界定出一正壓氣室,並且負壓氣室與正壓氣室互不連通。A feature of the suspended air floating working platform of the present invention is that the air chamber seat comprises a cover plate and an air distribution plate, and the cover plate, the air distribution plate and the bottom plate are superposed on each other from top to bottom, and the cover plate and the air flow are A negative pressure air chamber is defined between the distribution plates, a positive pressure air chamber is defined between the air distribution plate and the bottom plate, and the negative pressure air chamber and the positive pressure air chamber are not in communication with each other.
本發明之功效在於藉由氣室座與底板的氣室配置以及孔洞的配合,而能在平台的底板底面產生能吸附工件的負壓力以及小於負壓力的正壓力,其中,負壓力能使工件被吸附在平台的底板底面,以便於能在工件下方進行檢測或加工等作業,而正壓力則能將工件推離底板底面,使工件與底板底面之間仍留有間隔,避免工件表面直接與底板底面接觸而造成刮傷。The effect of the invention is that by the air chamber arrangement of the air chamber seat and the bottom plate and the cooperation of the holes, a negative pressure capable of adsorbing the workpiece and a positive pressure lower than the negative pressure can be generated on the bottom surface of the bottom plate of the platform, wherein the negative pressure can make the workpiece It is adsorbed on the bottom surface of the bottom plate of the platform so that it can be tested or processed under the workpiece, while the positive pressure can push the workpiece away from the bottom surface of the bottom plate, leaving a gap between the workpiece and the bottom surface of the bottom plate to avoid direct contact with the surface of the workpiece. The bottom surface of the bottom plate is in contact with it and causes scratches.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
參閱圖2與圖3,本發明懸吊式氣浮工作平台2適用於連接一正壓源21與一負壓源22(圖未示),用以將一工件8吸附於平台2下方,本發明之較佳實施例包含一底板3及一氣室座4,氣室座4疊置於底板3上且供連接正壓源21(如打氣幫浦)及負壓源22(如鼓風機),而且,藉由底板3與氣室座4相互配合形成一正壓氣室23與一負壓氣室24,使得底板3底面產生負壓及正壓,而其他詳細構造說明如下。Referring to FIG. 2 and FIG. 3, the suspended air floating working platform 2 of the present invention is adapted to connect a positive pressure source 21 and a negative pressure source 22 (not shown) for adsorbing a workpiece 8 under the platform 2, The preferred embodiment of the invention comprises a bottom plate 3 and a gas chamber seat 4, and the gas chamber seat 4 is stacked on the bottom plate 3 for connecting a positive pressure source 21 (such as a gas pump) and a negative pressure source 22 (such as a blower), and The bottom plate 3 and the air chamber seat 4 cooperate to form a positive pressure air chamber 23 and a negative pressure air chamber 24, so that the bottom surface of the bottom plate 3 generates negative pressure and positive pressure, and other detailed configurations are as follows.
在本實施例中,懸吊式氣浮工作平台2係架設於一支撐架6上,用以使平台2之底板3下方形成一操作空間,該操作空間可供被平台2吸附之工件8進行加工或檢測,但該平台2之架設並不以該支撐架6為限,懸吊式氣浮工作平台2亦可與其他製程平台或機具裝置結合而進行加工或檢測。In the present embodiment, the suspended air floating work platform 2 is mounted on a support frame 6 for forming an operation space below the bottom plate 3 of the platform 2, and the operation space is available for the workpiece 8 adsorbed by the platform 2. Processing or testing, but the erection of the platform 2 is not limited to the support frame 6, and the suspended air floating work platform 2 can also be processed or detected in combination with other process platforms or implement devices.
參閱圖4與圖5,底板3包括一大致呈方形的底板本體31、複數第一氣孔32及複數第二氣孔33,底板本體31具有一底板本體頂面311及一底板本體底面312,第一氣孔32與第二氣孔33上下貫穿底板本體31的頂面311與底面312且均勻間隔分佈於底板本體31上。Referring to FIG. 4 and FIG. 5, the bottom plate 3 includes a substantially square bottom plate body 31, a plurality of first air holes 32, and a plurality of second air holes 33. The bottom plate body 31 has a bottom plate body top surface 311 and a bottom plate body bottom surface 312. The air hole 32 and the second air hole 33 penetrate the top surface 311 and the bottom surface 312 of the bottom plate body 31 up and down and are evenly spaced on the bottom plate body 31.
氣室座4包括一蓋板41及一氣流分配板42。蓋板41疊置於氣流分配板42上,參閱圖6與圖7,蓋板41包括一頂壁411、一圍繞壁412、複數導氣管段415、複數貫穿頂壁411的輸氣孔416與一抽氣孔417。圍繞壁412係由頂壁411邊緣向下延伸形成,且圍繞壁412與頂壁411相互配合形成一氣室空間413,而導氣管段415係呈中空管狀由頂壁411底面對應輸氣孔416地往下延伸而連通輸氣孔416,輸氣孔416供連接正壓源21,而抽氣孔417供連接負壓源22,此外,蓋板41更包括複數由頂壁411底面往下延伸且連接圍繞壁412的肋片414,該等肋片414縱橫向地交錯連結而能使得整個蓋板41具有較佳結構強度,在本實施例中,該抽氣孔417設置於該頂壁411中央而該等輸氣孔416圍繞該抽氣孔417而設置,當然輸氣孔416與抽氣孔417設置位置與數量不以此為限,亦可僅設置一輸氣孔416與一抽氣孔417即可,而抽氣孔417上設置一抽氣管座7,以便於連接負壓源22。The air chamber seat 4 includes a cover plate 41 and an air distribution plate 42. The cover plate 41 is stacked on the air distribution plate 42. Referring to FIG. 6 and FIG. 7, the cover plate 41 includes a top wall 411, a surrounding wall 412, a plurality of air guiding tube segments 415, and a plurality of air holes 416 extending through the top wall 411. A suction hole 417. The surrounding wall 412 is formed by extending downward from the edge of the top wall 411, and the surrounding wall 412 and the top wall 411 cooperate to form a plenum space 413, and the air guiding tube section 415 is hollow tubular. The bottom surface of the top wall 411 corresponds to the air vent 416. The cover hole 416 extends downwardly, and the air supply hole 416 is connected to the positive pressure source 21, and the air suction hole 417 is connected to the negative pressure source 22. In addition, the cover plate 41 further includes a plurality of bottom surfaces extending from the bottom surface of the top wall 411 and connected. Around the ribs 414 of the wall 412, the ribs 414 are vertically and horizontally staggered to provide a better structural strength of the entire cover plate 41. In the present embodiment, the air venting holes 417 are disposed at the center of the top wall 411. The air vent 416 is disposed around the air vent 417. The position and number of the air vent 416 and the air vent 417 are not limited thereto, and only one air vent 416 and one air vent 417 may be disposed. An exhaust pipe socket 7 is disposed on the air suction hole 417 to facilitate connection of the negative pressure source 22.
氣流分配板42疊置於蓋板41下方而介於蓋板41與底板3之間。參閱圖8與圖9,氣流分配板42具有一板體420、複數導氣槽421、複數第一通氣孔422及複數第二通氣孔423,板體420具有一板體頂面426及一板體底面427,導氣槽421係由板體底面427凹陷形成,並且具有複數第一槽道424及複數第二槽道425,第一槽道424與第二槽道425設計成相互垂直連通且均勻地分佈於板體底面427,而第一通氣孔422及第二通氣孔423貫穿板體420,且第二通氣孔423底端係連通導氣槽421。The air distribution plate 42 is stacked under the cover plate 41 between the cover plate 41 and the bottom plate 3. Referring to FIG. 8 and FIG. 9, the air distribution plate 42 has a plate body 420, a plurality of air guiding slots 421, a plurality of first ventilation holes 422, and a plurality of second ventilation holes 423. The plate body 420 has a plate top surface 426 and a plate. The bottom surface 427 of the body is formed by the bottom surface 427 of the plate body, and has a plurality of first channels 424 and a plurality of second channels 425. The first channel 424 and the second channel 425 are designed to communicate with each other vertically. The first vent hole 422 and the second vent hole 423 penetrate the plate body 420, and the bottom end of the second vent hole 423 communicates with the air guiding groove 421.
參閱圖10與圖11,當蓋板41、氣流分配板42及底板3由上而下相互疊置時,在蓋板41與氣流分配板42之間,蓋板41之氣室空間413與氣流分配板42之板體頂面426形成負壓氣室24,而蓋板41頂壁411的抽氣孔417則是藉由負壓氣室24與氣流分配板42的第一通氣孔422相連通,而氣流分配板42的第一通氣孔422是與底板3之第二氣孔33相連通。在氣流分配板42與底板3之間,氣流分配板42之導氣槽421與底板3之底板本體頂面311形成正壓氣室23,蓋板41的導氣管段415底端分別對應連通氣流分配板42的第二通氣孔423,因而使得蓋板41頂壁411的輸氣孔416藉由導氣管段415與氣流分配板42的第二通氣孔423相連通,而藉由氣流分配板42的第二通氣孔423連通導氣槽423,使得正壓氣室23與底板3的第一氣孔32相連通。Referring to FIG. 10 and FIG. 11, when the cover 41, the air distribution plate 42 and the bottom plate 3 are stacked from top to bottom, between the cover 41 and the air distribution plate 42, the air chamber space 413 and the air flow of the cover 41 The plate top surface 426 of the distribution plate 42 forms a negative pressure air chamber 24, and the air suction hole 417 of the top wall 411 of the cover plate 41 communicates with the first ventilation hole 422 of the air distribution plate 42 through the negative pressure air chamber 24. The first venting opening 422 of the air distribution plate 42 is in communication with the second air hole 33 of the bottom plate 3. Between the air distribution plate 42 and the bottom plate 3, the air guiding groove 421 of the air distribution plate 42 and the bottom surface 311 of the bottom plate 3 form a positive pressure air chamber 23, and the bottom end of the air guiding tube portion 415 of the cover plate 41 respectively correspond to the communication airflow distribution. The second venting opening 423 of the plate 42 thus causes the air venting opening 416 of the top wall 411 of the cover plate 41 to communicate with the second venting opening 423 of the air distribution plate 42 by the air guiding tube section 415, and by the air distribution plate 42 The second vent hole 423 communicates with the air guiding groove 423 such that the positive pressure air chamber 23 communicates with the first air hole 32 of the bottom plate 3.
當正壓源21與負壓源22設置在氣室座4並且被啟動時,負壓源22所提供的負壓經由負壓氣室24連通氣流分配板42之第一通氣孔422,再經由第一通氣孔422連通底板3之第二氣孔33,因而於底板3的第二氣孔33產生具有吸附力的負壓力,因此,便能將工件8吸附在底板3下方,而正壓源21提供的正壓,則經由蓋板41之導氣管段415連通氣流分配板42之第二通氣孔423,再經由第二通氣孔423連通正壓氣室23及底板3的第一氣孔32,因而於底板3的第一氣孔32產生吹氣的正壓力,在工件8被吸附在底板3底面的同時,能對工件8吹氣,將工件8推離底板本體底面312,使工件8與底板3底面之間懸空地保持一間隔。When the positive pressure source 21 and the negative pressure source 22 are disposed in the chamber 4 and are activated, the negative pressure provided by the negative pressure source 22 communicates with the first vent 422 of the air distribution plate 42 via the negative pressure plenum 24, and then The first vent hole 422 communicates with the second air hole 33 of the bottom plate 3, so that the second air hole 33 of the bottom plate 3 generates a negative pressure having an adsorption force, so that the workpiece 8 can be adsorbed under the bottom plate 3, and the positive pressure source 21 provides The positive pressure is connected to the second venting hole 423 of the air distribution plate 42 via the air guiding tube section 415 of the cover plate 41, and then communicates with the positive pressure plenum 23 and the first air hole 32 of the bottom plate 3 via the second venting hole 423, thereby being on the bottom plate. The first air hole 32 of 3 generates a positive pressure of blowing, and while the workpiece 8 is adsorbed on the bottom surface of the bottom plate 3, the workpiece 8 can be blown, and the workpiece 8 is pushed away from the bottom surface 312 of the bottom plate body, so that the workpiece 8 and the bottom surface of the bottom plate 3 are Keep a gap between the open spaces.
如上所述,利用設計蓋板41、氣流分配板42以及底板3相互疊置形成互不干擾的正壓氣室23與負壓氣室24,使得第一氣孔32能產生正壓並且不干擾第二氣孔33產生負壓,將可以使平台2保持一間隔地吸附設置於平台2下方之工件8。As described above, the design cover plate 41, the air distribution plate 42 and the bottom plate 3 are stacked on each other to form a positive pressure air chamber 23 and a negative pressure air chamber 24 which do not interfere with each other, so that the first air hole 32 can generate positive pressure and does not interfere with the second. The vent 33 creates a negative pressure that will allow the platform 2 to adsorb the workpiece 8 disposed below the platform 2 at an interval.
值得注意的是,為了使得工件8能間隔地被吸附於平台2下方,本發明設計蓋板41與氣流分配板42之板體頂面426形成的負壓氣室容積大於氣流分配板42之導氣槽421與底板本體頂面311形成的正壓氣室容積,以及抽氣孔417之孔徑大於輸氣孔416之孔徑,不僅如此,第一氣孔32與第二氣孔33位在底板本體頂面311的孔徑是設計成相同的,而位在底板本體底面312的孔徑是設計成第一氣孔32之孔徑小於第二氣孔33之孔徑,都是用以使正壓小於負壓,達成工件8能間隔地被吸附於平台2下方。It should be noted that in order to allow the workpiece 8 to be adsorbed under the platform 2 at intervals, the negative pressure chamber volume formed by the cover plate 41 of the present invention and the plate top surface 426 of the air distribution plate 42 is larger than that of the air distribution plate 42. The volume of the positive pressure chamber formed by the gas groove 421 and the top surface 311 of the bottom plate body, and the diameter of the suction hole 417 are larger than the diameter of the gas transmission hole 416. Moreover, the first gas hole 32 and the second gas hole 33 are located on the top surface 311 of the bottom plate body. The apertures are designed to be the same, and the apertures located on the bottom surface 312 of the bottom plate body are designed such that the apertures of the first air holes 32 are smaller than the apertures of the second air holes 33, and are used to make the positive pressure smaller than the negative pressure, so that the workpiece 8 can be spaced apart. It is adsorbed below the platform 2.
此外,參閱圖4~9,懸吊式氣浮工作平台2由上而下於蓋板41、氣流分配板42以及底板3設置複數相對應連通的連接孔5,再藉由複數能與連接孔5配合的鎖栓件(圖未示),用以連接蓋板41、氣流分配板42以及底板3,在本實施例中,使用許多尺寸不同的連接孔5,且廣泛相對應地分佈於蓋板41、氣流分配板42以及底板3,將使得蓋板41、氣流分配板42以及底板3緊密連接,當懸吊式氣浮工作平台2使用時,將不易發生漏氣的情形。In addition, referring to FIGS. 4-9, the suspended air-floating work platform 2 is provided with a plurality of corresponding connecting holes 5 from the top to the bottom of the cover plate 41, the air distribution plate 42 and the bottom plate 3, and by the plurality of energy and the connecting holes. 5 mating latching members (not shown) for connecting the cover plate 41, the air distribution plate 42 and the bottom plate 3. In the present embodiment, a plurality of connecting holes 5 of different sizes are used, and are widely distributed correspondingly to the cover. The plate 41, the air distribution plate 42 and the bottom plate 3 will closely connect the cover plate 41, the air distribution plate 42 and the bottom plate 3. When the suspended air floating work platform 2 is used, air leakage will not easily occur.
附帶說明的是,在本實施例中,正壓氣室23是位在負壓氣室24下方,但在其他的實施態樣中,正壓氣室23與負壓氣室24的相對位置並不以此為限,此外,該平台2在使用時,亦可搭配其他治具或擋塊等,設置在平台2的邊緣以供工件8靠抵或輔助定位,避免工件8被吸附於底板3底面時,位置游離不定,影響檢測或加工作業的進行。Incidentally, in the present embodiment, the positive pressure air chamber 23 is located below the negative pressure air chamber 24, but in other embodiments, the relative positions of the positive pressure air chamber 23 and the negative pressure air chamber 24 are not In addition, when the platform 2 is in use, it can be matched with other jigs or stoppers, etc., and is disposed at the edge of the platform 2 for the workpiece 8 to abut or assist the positioning, so as to prevent the workpiece 8 from being adsorbed on the bottom surface of the bottom plate 3 The position is erratic, affecting the progress of inspection or processing operations.
綜上所述,本發明懸吊式氣浮工作平台2藉由蓋板41、氣流分配板42以及底板3相互疊置而產生互不干擾的正壓氣室23與負壓氣室24,能於底板本體底面312之第一氣孔32產生正壓與第二氣孔33產生負壓,且利用設計第一氣孔32、第二氣孔33、輸氣孔416及抽氣孔417之孔徑大小,以及正壓氣室23與負壓氣室24之容積,調整負壓與正壓之大小,使得工件8能與底板本體底面312保持一間隔地被吸附於底板3底面而呈懸吊狀態,以便於能在工件8下方進行檢測或加工等作業,另一方面,藉由提供較小於吸附之負壓力的吹氣正壓力,也能讓工件8與底板本體底面312仍留有間隔,避免工件8表面因接觸平台2而導致刮傷,故確實能達成本發明之目的。In summary, the suspended air floating work platform 2 of the present invention is formed by stacking the cover plate 41, the air distribution plate 42 and the bottom plate 3 to each other to generate a positive pressure air chamber 23 and a negative pressure air chamber 24 which do not interfere with each other. The first air hole 32 of the bottom surface 312 of the bottom plate body generates a positive pressure and a negative pressure generated by the second air hole 33, and the aperture sizes of the first air hole 32, the second air hole 33, the air hole 416 and the air suction hole 417 are designed, and the positive pressure air chamber is used. 23 and the volume of the negative pressure gas chamber 24, the negative pressure and the positive pressure are adjusted, so that the workpiece 8 can be adsorbed on the bottom surface of the bottom plate 3 at a distance from the bottom surface 312 of the bottom plate body to be suspended, so that the workpiece 8 can be suspended. The operation of detecting or processing is performed below, and on the other hand, by providing a positive blowing pressure which is smaller than the negative pressure of adsorption, the workpiece 8 and the bottom surface 312 of the bottom plate body are still spaced apart to prevent the surface of the workpiece 8 from contacting the platform. 2, resulting in scratching, it is indeed possible to achieve the object of the present invention.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
2...懸吊式氣浮工作平台2. . . Suspended air floating work platform
21...正壓源twenty one. . . Positive pressure source
22...負壓源twenty two. . . Negative pressure source
23...正壓氣室twenty three. . . Positive pressure chamber
24...負壓氣室twenty four. . . Negative pressure chamber
3...底板3. . . Bottom plate
31...底板本體31. . . Base plate body
311...底板本體頂面311. . . Top surface of the bottom plate body
312...底板本體底面312. . . Bottom plate body
32...第一氣孔32. . . First vent
33...第二氣孔33. . . Second air hole
4...氣室座4. . . Gas chamber seat
41...蓋板41. . . Cover
411...頂壁411. . . Top wall
412...圍繞壁412. . . Around the wall
413...氣室空間413. . . Air chamber space
414...肋片414. . . Rib
415...導氣管段415. . . Air duct segment
416...輸氣孔416. . . Air hole
417...抽氣孔417. . . Venting hole
42...氣流分配板42. . . Air distribution plate
420...板體420. . . Plate body
421...導氣槽421. . . Air guide
422...第一通氣孔422. . . First vent
423...第二通氣孔423. . . Second vent
424...第一槽道424. . . First channel
425...第二槽道425. . . Second channel
426...板體頂面426. . . Top surface of the plate
427...板體底面427. . . Bottom of the plate
5...連接孔5. . . Connection hole
6...支撐架6. . . Support frame
7...抽氣管座7. . . Pumping socket
8...工件8. . . Workpiece
圖1是一剖面示意圖,說明習知的氣浮平台;Figure 1 is a schematic cross-sectional view showing a conventional air floating platform;
圖2是一立體示意圖,說明本發明之懸吊式氣浮工作平台;Figure 2 is a perspective view showing the suspended air floating working platform of the present invention;
圖3是一立體分解圖,說明該懸吊式氣浮工作平台之各組件的連結關係;Figure 3 is an exploded perspective view showing the connection relationship of the components of the suspended air floating work platform;
圖4是一立體示意圖,說明說明底板之頂面;Figure 4 is a perspective view showing the top surface of the bottom plate;
圖5是一立體示意圖,說明該說明該底板之底面;Figure 5 is a perspective view showing the bottom surface of the bottom plate;
圖6是一立體示意圖,說明蓋板之頂面;Figure 6 is a perspective view showing the top surface of the cover;
圖7是一立體示意圖,說明該蓋板之底部;Figure 7 is a perspective view showing the bottom of the cover;
圖8是一立體示意圖,說明氣流分配板之頂面;Figure 8 is a perspective view showing the top surface of the air distribution plate;
圖9是一立體示意圖,說明該氣流分配板之底面;Figure 9 is a perspective view showing the bottom surface of the air distribution plate;
圖10是一俯視示意圖,說明該懸吊式氣浮工作平台之頂面;及Figure 10 is a top plan view showing the top surface of the suspended air floating work platform;
圖11是圖10中10-10之剖面示意圖,說明該懸吊式氣浮工作平台的孔洞連接關係。Figure 11 is a cross-sectional view taken along line 10-10 of Figure 10, illustrating the hole connection relationship of the suspended air floating work platform.
2...懸吊式氣浮工作平台2. . . Suspended air floating work platform
23...正壓氣室twenty three. . . Positive pressure chamber
24...負壓氣室twenty four. . . Negative pressure chamber
3...底板3. . . Bottom plate
4...氣室座4. . . Gas chamber seat
41...蓋板41. . . Cover
42...氣流分配板42. . . Air distribution plate
6...支撐架6. . . Support frame
7...抽氣管座7. . . Pumping socket
8...工件8. . . Workpiece
Claims (14)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098115833A TWI466225B (en) | 2009-05-13 | 2009-05-13 | Suspended air float working platform |
| KR1020090084732A KR20100122839A (en) | 2009-05-13 | 2009-09-09 | Non-contact type holding and storing method and device for workpiece |
| JP2009215673A JP2010264584A (en) | 2009-05-13 | 2009-09-17 | Non-contact holding method and non-contact holding apparatus of workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098115833A TWI466225B (en) | 2009-05-13 | 2009-05-13 | Suspended air float working platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201041075A TW201041075A (en) | 2010-11-16 |
| TWI466225B true TWI466225B (en) | 2014-12-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098115833A TWI466225B (en) | 2009-05-13 | 2009-05-13 | Suspended air float working platform |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2010264584A (en) |
| KR (1) | KR20100122839A (en) |
| TW (1) | TWI466225B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102672695B (en) * | 2011-12-25 | 2018-12-25 | 河南科技大学 | A kind of precision stage |
| CN107855667A (en) * | 2017-11-29 | 2018-03-30 | 深圳市冰海科技有限公司 | For cutting the laser cutting device of FPC |
| CN110554574B (en) * | 2018-05-31 | 2021-03-19 | 上海微电子装备(集团)股份有限公司 | Workpiece table, automatic material posture adjusting device and method for adjusting material posture |
| CN108639758A (en) * | 2018-07-04 | 2018-10-12 | 江苏东旭亿泰智能装备有限公司 | A kind of air supporting transition apparatus and liquid crystal display conveying device |
| EP3736164B1 (en) | 2019-05-07 | 2023-04-05 | Volvo Car Corporation | System and method for fault handling in a propulsion system for an electric vehicle |
| EP3736167A1 (en) | 2019-05-07 | 2020-11-11 | Volvo Car Corporation | System and method for fault handling in a propulsion system for an electric vehicle |
| EP3736166A1 (en) | 2019-05-07 | 2020-11-11 | Volvo Car Corporation | System and method for balancing state of charge in a propulsion system for an electric vehicle |
| CN111589791A (en) * | 2020-05-21 | 2020-08-28 | 沈阳维用精密机械有限公司 | Recovery device for cooling, dewatering and removing residues of workpiece and working method |
| CN113126451A (en) * | 2021-04-01 | 2021-07-16 | 三河建华高科有限责任公司 | Marble precision workbench air-flotation jacking mechanism |
| CN114857172A (en) * | 2022-05-30 | 2022-08-05 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Air supporting mechanism |
| CN115890288B (en) * | 2022-11-28 | 2025-10-10 | 先导薄膜材料(安徽)有限公司 | Target processing and positioning device |
| CN119750218A (en) * | 2024-12-26 | 2025-04-04 | 广东国创科光电装备有限公司 | An air flotation device involving a substrate working area |
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|---|---|---|---|---|
| JPH03102850A (en) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | Wafer holder |
| JP2004025330A (en) * | 2002-06-24 | 2004-01-29 | Japan Science & Technology Corp | Suction jig for micro parts |
| JP2008166359A (en) * | 2006-12-27 | 2008-07-17 | Tokyo Electron Ltd | Substrate processing equipment |
| JP2009051654A (en) * | 2007-08-29 | 2009-03-12 | Toppan Printing Co Ltd | Substrate transfer device and substrate inspection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637291A (en) * | 1986-06-24 | 1988-01-13 | 松下電器産業株式会社 | holding device |
| JPH04336990A (en) * | 1991-05-08 | 1992-11-25 | Hitachi Electron Eng Co Ltd | Noncontact holding mechanism with work detecting function |
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2009
- 2009-05-13 TW TW098115833A patent/TWI466225B/en active
- 2009-09-09 KR KR1020090084732A patent/KR20100122839A/en not_active Ceased
- 2009-09-17 JP JP2009215673A patent/JP2010264584A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102850A (en) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | Wafer holder |
| JP2004025330A (en) * | 2002-06-24 | 2004-01-29 | Japan Science & Technology Corp | Suction jig for micro parts |
| JP2008166359A (en) * | 2006-12-27 | 2008-07-17 | Tokyo Electron Ltd | Substrate processing equipment |
| JP2009051654A (en) * | 2007-08-29 | 2009-03-12 | Toppan Printing Co Ltd | Substrate transfer device and substrate inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100122839A (en) | 2010-11-23 |
| JP2010264584A (en) | 2010-11-25 |
| TW201041075A (en) | 2010-11-16 |
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