TWI464826B - Processing device (a) - Google Patents

Description

Processing device (1) Field of invention

The present invention relates to a processing apparatus for processing a semiconductor wafer, and more particularly to a mechanism for aligning a processing unit of a processing apparatus.

Background of the invention

In the semiconductor device process, a plurality of fields are separated by a channel (a predetermined line to be cut) arranged in a lattice shape on the surface of a substantially disk-shaped semiconductor wafer, and are separated along the channel. A semiconductor wafer in which an element such as an IC or an LSI is formed in each field is divided into each element to manufacture each semiconductor wafer.

The cutting of the semiconductor wafer along the channel is performed by a cutting device generally referred to as a cutter. In addition to the method of cutting by a cutting device, a laser cutting method using a pulsed laser having a wavelength that is transparent to a semiconductor wafer has been developed.

In the laser cutting method, a focused spot of a pulsed laser having a wavelength of transparency of a workpiece (workpiece) such as a semiconductor wafer is focused on the inside of the workpiece, and is irradiated along the channel. In this case, an altered layer is formed in the inside of the workpiece, and an external force is applied to the channel which is reduced in strength due to the formation of the altered layer, so as to be divided into individual wafers (refer to Japanese Patent Laid-Open No. 3408805, Japanese Patent Laid-Open No. Hei. -305420).

When the workpiece is processed by using the processing device, the surface of the workpiece (the surface on which the circuit pattern is formed) faces upward, the workpiece is placed on the chuck table, and the workpiece is placed on the chuck table. The alignment mechanism of the photographing mechanism such as the visible light camera above detects the channel and performs alignment, and the cutting blade or the laser irradiation head is positioned in the channel to perform processing.

However, there is a case where the surface of the workpiece is faced downward and the inside faces upward, and the workpiece is placed on the chuck table for processing. For example, when processing an LED chip or the like which forms a light-emitting element on a sapphire substrate by using a laser, the characteristics of the light-emitting element layer are deteriorated. Therefore, it is preferable that the laser beam is incident from the back side where the element is not formed.

Further, in a MEMS (microelectro mechanical system) in which a fine structure is formed on the surface, there is a fear that the surface water is damaged by the cutting water in the processing by the blade cutting, and therefore the structure is also damaged. The side is attached to the holding tape and processed from the inside side.

Further, when the cutting debris adheres to an element such as an image pickup device such as a CCD or a CMOS, and the workpiece is defective in the blade cutting, the surface is attached to the holding tape in the same manner, and the workpiece is processed from the back side.

Therefore, in the case where the formation surface of the circuit pattern or the channel is kept downward and processed from the back side, a method using an IR camera is also proposed as a method for performing alignment (Japanese Patent Laid-Open No. Hei 6-232255 and Japanese Patent Laid-Open Publication No. Hei 10-312979).

[Patent Document 1] Japanese Patent Gazette Patent No. 3408805

[Patent Document 2] Japanese Patent Laid-Open Publication No. 10-305420

[Patent Document 3] Japanese Patent Laid-Open Publication No. Hei 6-232255

[Patent Document 4] Japanese Patent Laid-Open Publication No. 10-312979

However, when the workpiece having the opaque layer such as the metal layer on the layer having the alignment pattern is processed, or when the workpiece having the metal layer inside is processed from the inside, even if IR is used The camera is photographed by a metal layer, and the alignment pattern or channel cannot be detected, and alignment cannot be performed.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a processing apparatus that places a surface of a workpiece having an opaque layer between a processing mechanism and an object to be downloaded. On the chuck table, when it is machined from the inside side, it is not affected by the structure or material of the workpiece, and the alignment can be implemented.

The present invention can provide a processing apparatus having a susceptor, comprising: a holding table having a holding pad formed by a transparent body for holding a workpiece; and a processing mechanism for processing and holding The processing conveyance mechanism transmits the holding table and the processing mechanism in a direction opposite to an X-axis direction parallel to a surface of the holding table and a Y-axis direction perpendicular to the X-axis direction. And a photographing mechanism mounted on the pedestal and photographing the workpiece held by the holding table through the transparent holding mat, and being located below the holding mat; and when the workpiece is photographed, the holding table is processed by the foregoing The transport mechanism moves on the photographing mechanism.

Preferably, the processing apparatus further has a support port that supports the holding table to be rotatable and loaded on the processing conveyor. The holding table includes a retaining pad and an annular support member for supporting the retaining pad.

The support 匣 includes: an upper plate having an opening for rotatably fitting the annular support member of the holding table; a lower plate placed on the processing transfer mechanism; and a connection for the upper plate and the lower plate, and supporting the 匣At least a part of the outer circumference is divided into a connecting plate that enters the opening of the imaging mechanism, and when the workpiece is photographed, the holding stage is moved by the processing transport mechanism, whereby the photographing mechanism enters the opening through the photographing mechanism and enters the supporting jaw. And positioned directly below the holding table.

Preferably, the holding mat is composed of a material selected from the group consisting of quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride. Preferably, the holding mat has a field of forming a suction path with a plurality of suction paths, and a field of not forming a suction path in which a suction path is not formed, and the imaging means performs an image capturing of the workpiece through the non-forming suction path field. .

According to the present invention, it is possible to provide a processing apparatus which can perform alignment on all workpieces without being affected by the structure or material of the workpiece. The photographing mechanism is mounted on the susceptor, and the holding stage is positioned on the photographing mechanism by the processing conveyance mechanism only when detecting the division planned line, so that a complicated structure is not required, and the apparatus can be simplified.

Detailed description of the preferred embodiment

Embodiments of the present invention will be described in detail below with reference to the drawings. Fig. 1 is a schematic block diagram showing a laser processing apparatus having a photographing mechanism (first photographing means) of the present invention in which a wafer is photographed under a chuck table (holding stage).

The laser processing apparatus 2 includes a first slider 6 that is mounted on the stationary base 4 and movable in the X-axis direction. The first slider 6 is moved in the X-axis direction along the pair of guide rails 14 by the X-axis transmission mechanism 12 including the ball screw 8 and the pulse motor 10.

The first slider 6 is loaded with a support weir 16 that is movable in the Y-axis direction. The support cymbal 16 is moved in the Y-axis direction along the pair of guide rails 24 by a Y-axis transfer mechanism (displacement transfer mechanism) 22 composed of a ball screw 18 and a pulsed laser 20.

The support cymbal 16 is loaded with a rotatable chuck base 28. Fig. 2 clearly shows that the support cymbal 16 is formed in a substantially U shape and includes: an upper plate 16a; a lower plate 16b mounted on the guide rail 24; and a coupling plate 16c connecting the upper plate 16a and the lower plate 16b. The upper plate 16a is formed with a circular opening 17 to which the fitting projections to be described later of the chuck table 28 are rotatably attached.

The chuck table 28 has an annular support member 62 and a holding pad 74. The annular support member 62 has a fitting convex portion 64, a tape winding portion 66 having a larger diameter than the fitting convex portion 64, and an annular receiving portion 68 which is substantially the same as the diameter of the fitting convex portion 64.

The annular housing portion 68 has an inner diameter 68a (refer to FIG. 4) that is substantially the same as the outer shape of the holding pad 74, and an annular support portion 70 that supports the holding pad 74 is formed at the inner bottom portion of the annular housing portion 68.

The holding pad 74 is formed of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride, and has a plurality of fine pores 76 that open toward the surface (holding surface 74a).

Referring to Fig. 4, each of the fine holes 76 communicates with the suction groove 78, and the annular support portion 70 of the annular support member 62 is formed with a communication passage 72 that communicates with the suction groove 78 of the holding mat 74. The communication path 72 is connected to the vacuum suction source 80.

The holding pad 74 is mounted on the annular support portion 70 of the annular support member 62, and when the fitting convex portion 64 of the annular support member 62 is fitted into the circular opening 17 of the support weir 16, as shown in FIG. As shown, the chuck table 28 is rotatably mounted on the support weir 16.

The motor 26 is attached to the web 16c supporting the crucible 16, and the belt 30 is wound around a belt winding portion 66 that is coupled to the belt 27 of the output shaft of the motor 26 and the annular support member 62. When the motor 26 is driven, the chuck table 28 is rotated through the belt 30.

The motor 26 is constituted by, for example, a pulse motor. When the motor 26 is driven by a predetermined pulse, the chuck table 28 is rotated by a predetermined amount (θ rotation), and the wafer 1 can be divided as shown in FIG. The alignment of the predetermined line (channel) 3 is made.

The support 匣16 upper plate 16a is formed with a plurality of frame support tables 29 (four in the present embodiment), and these frame support tables 29 are supported by the annular frame described later.

Referring again to Fig. 1, the X-axis transfer mechanism 12 and the Y-axis transfer mechanism 22 constitute a process transfer mechanism 23. Thereby, the chuck table 28 can be moved in the X-axis direction and the Y-axis direction by the machining conveyance mechanism 23.

A column 32 is erected on the stationary base 4, and the column 32 is mounted with a housing 35 that houses the laser beam emitting mechanism 34. The laser beam emitted by the laser beam emitting mechanism 34 is condensed by the objective lens mounted to the concentrator (laser head) 36 at the front end of the casing 35, and then irradiated on the chuck table 28 A workpiece (work piece) such as a semiconductor wafer.

A second imaging mechanism 38 that is aligned with the concentrator 36 in the X-axis direction and detects a laser processing field by laser beam is disposed at the front end of the casing 35. The second imaging unit 38 includes, in addition to an imaging element such as a general CCD that is imaged by visible light, an infrared irradiation unit that irradiates infrared rays to the workpiece, and an optical system that detects infrared rays that are irradiated by the infrared irradiation unit; The captured image is transmitted to the controller 40 by an infrared imaging mechanism including an imaging member such as an infrared CCD that outputs an electrical signal of infrared rays detected by the optical system.

The controller 40 is composed of a computer and has a central processing unit (CPU) 42 for performing arithmetic processing by a control program, a read only memory (ROM) 46 for storing a control program, a calculator 48, and an input interface 50. And the output interface 52.

The 56-series processing conveyance amount detecting means is constituted by a linear scale 54 disposed along the guide rail 14 and a reading head (not shown) disposed in the second slider 16, and the detection signal of the processing conveyance amount detecting means 60 is processed. Input to input interface 50 of controller 40.

The 60-series displacement conveyance detecting means is constituted by a linear scale 58 disposed along the guide rail 24, and a reading head (not shown) disposed in the second slide block 16, and the displacement conveyance amount detecting mechanism 60 The detection signal is input to the input interface 50 of the controller 40.

The image signal captured by the second imaging unit 38 is input to the input interface 50 of the controller 40. On the other hand, the control signal is output from the output interface 52 of the controller 50 to the pulse motor 10, the pulse motor 20, the laser beam emitting mechanism 34, and the like.

At a predetermined position of the susceptor 4 of the laser processing apparatus 2, a photographing mechanism (first photographing means) 82 for photographing and holding a semiconductor wafer or the like held by the chuck table 28 from the lower side of the transparent holding pad 74 is attached. Processed material.

As shown in FIG. 5, the photographing mechanism 82 includes a camera unit 84 having a low magnification camera 86 and a high magnification camera 88. Mounted on the side of the camera unit 84 are two illumination devices 90, 92 that are illuminated at the time of shooting using the camera unit 84.

The camera unit 84 is supported by the support plate 94, and the base end portion of the support plate 94 is fixed to the Z-axis moving block 98. The column body 96 is erected on the base 4 of the laser processing apparatus 2, and the camera unit 84 constituting the photographing mechanism 82 can be along the pair of guide rails 106 by the Z-axis moving mechanism 104 constituted by the ball screw 100 and the pulse motor 102. Move in the Z-axis direction (up and down direction).

Referring to Fig. 6, there is shown a front side perspective view of the semiconductor wafer 1 to be processed by the laser processing apparatus 2. The surface 1a of the wafer 1 is formed with elements 5 in various fields separated by a lattice-shaped channel (divided line). Each element 5 is formed with a target pattern 7 which is a detection target at the time of alignment.

When the laser processing apparatus shown in Fig. 1 is processed, the surface 1a of the wafer 1 is directed downward, and is attached to a dicing tape (adhesive tape) T, and the outer periphery of the dicing tape T is as shown in Fig. 7. Attached to the ring frame F as shown. Therefore, the inside 1b of the semiconductor wafer 1 is made upward, and is loaded on the chuck table 28 in the state of Fig. 7.

Referring to Fig. 8, there is shown a rear side perspective view of another type of semiconductor wafer 1A mounted on the ring frame F by the dividing tape T. A metal layer 9 is formed inside the semiconductor wafer 1A. Therefore, the imaging of the target pattern 7 of the semiconductor wafer 1A is impossible even if the second imaging mechanism 38 includes an IR camera.

However, since the first imaging unit 82 is disposed on the lower side of the chuck table 28 and passes through the transparent holding pad 74 of the chuck table 28 to image the semiconductor wafer 1A, even the semiconductor crystal having the metal layer 9 therein is formed. With a circle of 1A, the target pattern 7 can also be easily photographed.

The workpiece (workpiece) to be processed by the processing apparatus of the present invention is not limited to the semiconductor wafer shown in FIGS. 6 to 8, and may be, for example, mounted on the wafer for wafer mounting. Adhesive members such as DAF (die attach film), or semiconductor case, ceramic, glass or cerium oxide substrate, various electronic parts, various driving devices, and various processing materials requiring micron-level precision.

Referring to Fig. 9, a partial cross-sectional side view showing the support cymbal and the chuck stage portion is shown. Since the support cymbal 16 has a substantially U-shape, the imaging mechanism enters the opening 19 on the side opposite to the coupling plate 16c for connecting the upper plate 16a and the lower plate 16b. In the figure, the processing transport mechanism 23 is schematically shown.

Fig. 10 is an enlarged partial cross-sectional view of a portion A of Fig. 9, in which the surface 1a of the semiconductor wafer 1 is on the lower side, attached to the dicing tape T, and the annular frame F is placed on the frame stage 29.

As described above, the holding pad 74 of the chuck table 28 is formed of a transparent material such as glass and has a plurality of suction grooves 78. The suction groove 78 is connected to the vacuum suction source through the communication path 72 formed in the annular support member 62 (refer to FIG. 4).

As shown in Fig. 11, the holding mat 74 has a suction path region 74a in which a plurality of suction paths such as pores or suction grooves are formed, a cross-shaped suction channel region 74b in which a suction path is not formed, and an unformed suction path region 74b. Attracting the road outside the field 74c. The photographing of the target pattern of the first photographing mechanism 82 is preferably performed by not forming the attracting path region 74b to accurately capture the target pattern.

Referring to Fig. 12, there is shown a longitudinal sectional view of a holding pad 74A of another embodiment. The holding pad 74A is formed of a transparent material such as glass, and has a plurality of lateral suction grooves 75 and a plurality of longitudinal suction grooves 77 perpendicular to the lateral suction grooves 75. 79 is a suction groove connected to the communication path 72.

Hereinafter, the alignment operation using the first imaging mechanism 82 will be described. As shown in FIG. 9, the annular frame F is placed on the frame mounting table 29, and the vacuum suction source 80 is actuated, and the semiconductor wafer 1 is sucked and held by the holding mat 74 of the chuck table 28.

In this state, the X-axis transmission mechanism 12 and the Y-axis transmission mechanism 22 are driven, and as shown in FIG. 9, the first imaging mechanism 82 is caused to enter the opening portion 19 through the imaging mechanism, and enters the support cymbal 16, and the first imaging is performed. The mechanism 82 is positioned directly below the semiconductor wafer 1.

The image used by the first imaging mechanism 82 for detecting the alignment of the channel to be processed must be obtained before the cutting process. Therefore, when the first photographing mechanism 82 is positioned directly under the semiconductor wafer 1 held by the chuck table 28, the illumination device 90 or 92 lights up, the semiconductor wafer 1 is illuminated by the lower surface, and the low magnification camera 86 or The high-magnification camera 88 images the surface of the semiconductor wafer 1 through the transparent holding pad 74, and causes the captured image to be displayed on a display such as an LCD (not shown).

The operator of the laser processing apparatus 2 drives the X-axis transfer mechanism 12 or the Y-axis transfer mechanism 22 by operating an operation panel (not shown) to search for the target pattern 7 to be the target of the pattern alignment.

When the operator determines the target pattern 7, the image including the target pattern is recorded in the RAM 46 provided to the controller 40 of the laser processing apparatus 2. Further, the distance between the target pattern 7 and the center line of the channel 3 is obtained by the coordinate value or the like, and the value is also first stored in the RAM 46. Further, the interval between the adjacent channels and the channel (channel pitch) is obtained by the coordinate value or the like, and the value of the channel pitch is also first stored in the RAM 46 of the controller 40.

When the channel 3 is cut along the semiconductor wafer 1, the image of the recorded target pattern is compared with the pattern of the image actually captured by the first imaging unit 82. This pattern is aligned at two points A and B which are spaced apart from each other in the X-axis direction and are spaced apart from each other.

When the pattern alignment at point A ends, the chuck table 28 is moved in the X-axis direction, and the pattern of the point A is shifted from the point B away from the X-axis direction. At this time, instead of moving the pattern from point A to point B for pattern comparison, the pattern comparison is performed at a plurality of points on the way to point B, and then the motor that should correct the deviation in the Y-axis direction is driven. 26, the chuck table 28 is slightly rotated to perform θ correction, and finally the pattern alignment at point B is performed.

When the pattern alignment at points A and B ends, the straight line connecting the two target patterns 7 becomes parallel to the channel 3, and the chuck table 28 is moved in the Y-axis direction only the center of the target pattern 7 and the channel 3. The distance of the line is divided by the pre-cutting of the channel 3 and the concentrator (laser irradiation head) 36 to complete the alignment.

When the first imaging unit 82 is inserted into the support 匣16, in order to prevent the first imaging unit 82 from coming into contact with the connecting plate 16c of the support cymbal 16, it is preferable to attach a surface of the connecting plate 16c to the inner surface of the connecting plate 16c, for example, manufactured by Tokyo Sensor Co., Ltd. Tape switch. The tape opening relationship constitutes a contact preventing mechanism for detecting contact by conduction.

The processing apparatus of the present invention is not limited to the laser processing apparatus 2 shown in Fig. 1, and the first imaging unit 82 of the present invention can also be applied to the cutting apparatus (cutting apparatus) 110 as shown in Fig. 13.

The vertical cylinder 112 is erected on the base 4 of the cutting device 110, and the cutting unit (cutting mechanism) 114 is mounted on the vertical cylinder 112 and movable in the Z-axis direction. That is, the casing 116 of the cutting unit 114 moves in the Z-axis direction along the pair of guide rails 126 by the Z-axis transmission mechanism 124 constituted by the ball screw 120 and the pulse motor 112.

A housing (not shown) and a motor for rotating the rotary shaft are housed in the housing 116, and a detachable cutting insert 118 is attached to the front end of the rotary shaft.

The other configuration of this embodiment is the same as that of the laser processing apparatus 2 shown in Fig. 1, and therefore the description thereof will be omitted.

1. . . Semiconductor wafer

1A. . . Semiconductor wafer

1a. . . surface

1b. . . inside

2. . . Laser processing device

4. . . Stationary abutment

5. . . element

6. . . First sliding block

7. . . Target pattern

8. . . Ball screw

10. . . Pulse motor

12. . . X-axis transmission mechanism

14. . . Y-axis transmission mechanism

16. . . Support 匣

16a. . . On board

16b. . . Lower plate

16c. . . Link board

17. . . Round opening

18. . . Ball screw

19. . . The shooting mechanism enters the opening

20. . . Pulse motor

twenty two. . . Y-axis transmission mechanism

twenty three. . . Processing conveyor

twenty four. . . guide

26. . . motor

28. . . Chuck table

29. . . Frame support

30. . . band

32. . . Cylinder

34. . . Laser beam emitting mechanism

35. . . case

36. . . Concentrator

38. . . Second shooting mechanism

40. . . Controller

42. . . Central processing unit

44. . . Read only memory

46. . . Random access memory

48. . . Calculator

50. . . Input interface

52. . . Output interface

54. . . Linear scale

56. . . Processing transfer amount detecting mechanism

58. . . Linear scale

60. . . Displacement transmission amount detecting mechanism

62. . . Annular support member

64. . . Fitting convex

66. . . Winding section

68. . . Ring housing

68a. . . the inside diameter of

70. . . Ring support

72. . . Connected road

74. . . Hold pad

74A. . . Hold pad

74a. . . Keep the surface of the pad to form a field of attraction

74b. . . No attraction road

74c. . . Peripheral field

75. . . Horizontal attraction ditch

76. . . Fine hole

77. . . Longitudinal attraction

78. . . Attraction hole

79. . . Attracting ditch

80. . . Vacuum suction source

82. . . Shooting agency

84. . . Camera unit

86. . . Low magnification camera

88. . . High magnification camera

90,92. . . Lighting device

94. . . Support board

96. . . Cylinder

98. . . Z-axis moving block

100. . . Ball screw

102. . . Pulse motor

104. . . Z-axis moving mechanism

106. . . guide

110. . . Cutting insert

112. . . Vertical cylinder

114. . . Cutting unit (cutting mechanism)

116. . . case

118. . . Cutting insert

120. . . Ball screw

122. . . Pulse motor

124. . . X-axis transmission mechanism

126. . . guide

F. . . Ring frame

T. . . Cutting tape

Fig. 1 is a schematic perspective view of a laser processing apparatus according to a first embodiment of the present invention.

Figure 2 is an exploded perspective view of the support and the chuck stage.

Figure 3 is a perspective view of a chuck table mounted on a support raft.

Figure 4 is an exploded perspective view of the chuck table.

Fig. 5 is a perspective view of the first photographing mechanism and its supporting structure.

Figure 6 is a perspective view of the surface side of the semiconductor wafer.

Fig. 7 is a perspective view showing the inside of a semiconductor wafer mounted on a ring frame by dicing tape.

Fig. 8 is a perspective view showing the inside of a semiconductor wafer having a metal layer mounted on a ring frame through a dicing tape.

Figure 9 is a partial cross-sectional side view of the chuck table loaded on the support raft.

Fig. 10 is an enlarged cross-sectional view showing a portion of a portion A of Fig. 9.

Figure 11 is a plan view of the retaining pad.

Figure 12 is a longitudinal cross-sectional view of another embodiment of the retaining pad.

Figure 13 is a schematic perspective view of a cutting device according to a second embodiment of the present invention.

2. . . Laser processing device

4. . . Stationary abutment

6. . . First sliding block

8. . . Ball screw

10. . . Pulse motor

12. . . X-axis transmission mechanism

14. . . Y-axis transmission mechanism

16. . . Support 匣

18. . . Ball screw

20. . . Pulse motor

twenty two. . . Y-axis transmission mechanism

twenty three. . . Processing conveyor

twenty four. . . guide

26. . . motor

28. . . Chuck table

30. . . band

32. . . Cylinder

34. . . Laser beam emitting mechanism

35. . . case

36. . . Concentrator

38. . . Second shooting mechanism

40. . . Controller

42. . . Central processing unit

44. . . Read only memory

46. . . Random access memory

48. . . computer

50. . . Input interface

52. . . Output interface

54. . . Linear scale

56. . . Processing transfer amount detecting mechanism

58. . . Linear scale

60. . . Displacement transmission amount detecting mechanism

82. . . Shooting agency

Claims (6)

A processing device comprising a susceptor, comprising: a holding table having a holding pad formed by a transparent body for holding a workpiece; and a processing mechanism for processing and holding the holding table The processing conveyance mechanism transmits the holding table and the processing mechanism in the X-axis direction parallel to the surface of the holding table and the Y-axis direction perpendicular to the X-axis direction; and shooting The mechanism is attached to the susceptor at a position lower than the holding pad, and the workpiece held by the holding table is imaged through the transparent holding pad; when the workpiece is photographed, the holding table is processed by the foregoing Moving to the photographing mechanism, the processing device further has a support for supporting the holding table to be rotatable and loaded on the processing transport mechanism, and the holding table includes the holding mat and supporting the An annular support member for holding the pad, and the support 匣 includes: an opening having an opening that is rotatably fitted to the annular support member of the holding table a lower plate disposed on the processing conveyance mechanism; and a connecting plate for connecting the upper plate and the lower plate to at least a portion of the outer periphery of the supporting bead to enter the opening portion of the photographing mechanism, and When the workpiece is photographed, the aforementioned holding table is processed by the foregoing The transport mechanism moves, whereby the photographing mechanism enters the opening through the photographing mechanism, enters the support cymbal, and is positioned directly below the holding table. The processing apparatus according to claim 1, further comprising a photographing and transporting mechanism that causes the photographing mechanism to move the holding mat in a vertical direction. The processing apparatus according to claim 1, further comprising a second imaging means that can image the workpiece held by the holding table from above the holding pad. The processing device of claim 1, wherein the holding mat is made of a material selected from the group consisting of quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, and magnesium fluoride. Composition. The processing device of claim 1, wherein the holding mat comprises: a field of forming a suction path having a plurality of suction paths, and an area of an unformed suction path in which a suction path is not formed, and the object to be processed by the photographing mechanism The shooting is performed through the field in which the attraction path is not formed. The processing apparatus of claim 1, wherein the processing mechanism has any one of a laser irradiation head or a cutting insert.