TWI462327B - Positioning system - Google Patents
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- TWI462327B TWI462327B TW101103760A TW101103760A TWI462327B TW I462327 B TWI462327 B TW I462327B TW 101103760 A TW101103760 A TW 101103760A TW 101103760 A TW101103760 A TW 101103760A TW I462327 B TWI462327 B TW I462327B
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- 239000000758 substrate Substances 0.000 claims description 118
- 239000007921 spray Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 238000005507 spraying Methods 0.000 description 12
- 239000013078 crystal Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000254158 Lampyridae Species 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Description
本發明係有關於一種定位系統,尤指一種可以準確地將遮罩放置且定位於基板上的定位系統。The present invention relates to a positioning system, and more particularly to a positioning system that can accurately position and position a mask on a substrate.
在製作LED(發光二極體)封裝結構的製程中,習知通常可用點膠或噴塗的方式以將混有螢光粉的螢光膠體形成於LED晶片上。在某些噴塗製程中,LED晶片會先進行固晶打線後,再進行螢光膠體的噴塗。由於習知噴塗製程是採用手動置入遮罩的方式來與承載LED晶片的LED基板做定位配合,所以遮罩容易碰觸到已完成打線的金線而造成塌線的情況,進而導致LED封裝結構的信賴性失效機率上升。再者,倘若僅對部分LED晶片進行噴塗製程,由於遮罩和LED基板之間存在微間隙的關係,導致遮罩和LED基板之間為非完全互相緊貼的狀況,進而使得在噴塗製程時的螢光膠體非常容易滲漏到未進行噴塗且亦尚未固晶打線的區域內,造成後續在上述尚未固晶打線區域內進行固晶打線時的打線良率下降,因此LED封裝結構在後續做冷熱循環信賴性時的斷線機率非常的高。In the process of fabricating an LED (Light Emitting Diode) package structure, it is conventional to form a phosphor paste mixed with phosphor powder on a LED wafer by dispensing or spraying. In some spraying processes, the LED wafers are first bonded and then sprayed with a fluorescent colloid. Since the conventional spraying process uses a manual insertion mask to position and match the LED substrate carrying the LED chip, the mask easily touches the gold wire that has been completed and causes the wire to collapse, thereby leading to the LED package. The probability of structural reliability failure increases. Furthermore, if only a part of the LED wafer is subjected to the spraying process, the relationship between the mask and the LED substrate is not completely adhered to each other due to the micro-gap relationship between the mask and the LED substrate, thereby making the spraying process The fluorescent colloid is very easy to leak into the area where it has not been sprayed and has not been bonded by the solid crystal, which causes the subsequent wire bonding yield to decrease in the above-mentioned unfixed wire bonding region, so the LED package structure is subsequently implemented. The probability of disconnection during the thermal cycle reliability is very high.
本發明實施例在於提供一種定位系統,其可以準確地將遮罩放置且定位於基板上。Embodiments of the present invention provide a positioning system that can accurately position and position a mask on a substrate.
本發明其中一實施例所提供的一種定位系統,其用以定位至少一用於承載多個發光單元的基板及至少一對應於上述至少一基板的遮罩,該定位系統包括:一第一工作機台、一第二工作機台、及一承載座。該第二工作機台相距該第一工作機台一預定距離。該承載座定位於該第一工作機台與該第二工作機台兩者中的其中一個上,其中該承載座具有至少一固定式定位件,上述至少一基板係透過上述至少一固定式定位件以定位於該承載座上,且上述至少一遮罩係透過上述至少一固定式定位件以定位於上述至少一基板上。上述至少一基板具有至少一對應於上述至少一固定式定位件的基板定位孔,上述至少一遮罩具有至少一對應於上述至少一基板定位孔的遮罩定位孔,且上述至少一固定式定位件依序穿過上述至少一基板定位孔與上述至少一遮罩定位孔。A positioning system according to an embodiment of the present invention is configured to locate at least one substrate for carrying a plurality of light emitting units and at least one mask corresponding to the at least one substrate, the positioning system comprising: a first work A machine table, a second working machine, and a carrier. The second work machine is a predetermined distance from the first work machine. The carrier is positioned on one of the first working machine and the second working machine, wherein the carrier has at least one fixed positioning component, and the at least one substrate is through the at least one fixed positioning The member is positioned on the carrier, and the at least one mask is positioned on the at least one substrate through the at least one fixed positioning member. The at least one substrate has at least one substrate positioning hole corresponding to the at least one fixed positioning member, the at least one mask has at least one mask positioning hole corresponding to the at least one substrate positioning hole, and the at least one fixed positioning And sequentially passing through the at least one substrate positioning hole and the at least one mask positioning hole.
本發明另外一實施例所提供的一種定位系統,其用以定位至少一用於承載多個發光單元的基板及至少一對應於上述至少一基板的遮罩,該定位系統包括:一第一工作機台、一第二工作機台、及一承載座。該第一工作機台包括至少一用於吸取上述至少一遮罩的吸取頭。該第二工作機台相距該第一工作機台一預定距離。該承載座定位於該第一工作機台與該第二工作機台兩者中的其中一個上,其中該承載座具有至少兩個固定式定位件,且上述至少一基板係透過上述至少兩個固定式定位件以定位於該承載座上,上述至少一遮罩係透過上述至少兩個固定式定位件以定位於上述至少一基板上。A positioning system is provided for positioning at least one substrate for carrying a plurality of light emitting units and at least one mask corresponding to the at least one substrate, the positioning system comprising: a first work A machine table, a second working machine, and a carrier. The first working machine includes at least one suction head for sucking the at least one mask. The second work machine is a predetermined distance from the first work machine. The carrier is positioned on one of the first working machine and the second working machine, wherein the carrier has at least two fixed positioning members, and the at least one substrate passes through the at least two The fixed positioning member is positioned on the carrier, and the at least one mask is positioned on the at least one substrate through the at least two fixed positioning members.
綜上所述,本發明實施例所提供的定位系統,其可透過非人工的方式,將至少一遮罩透過至少兩個固定式定位件以定位於至少一基板上,進而有效提升發光二極體晶粒的一次打線與二次打線的打線良率。In summary, the positioning system provided by the embodiment of the present invention can transmit at least one mask through at least two fixed positioning members to at least one substrate in a non-manual manner, thereby effectively improving the light emitting diode. The line rate of the primary and secondary lines of the body grain.
為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
請參閱圖1A至圖1J所示,圖1A至圖1J依序顯示本發明第一實施例的定位系統的操作流程示意圖。以下將配合圖式,依序說明本發明第一實施例的定位系統的相關操作流程,但此操作流程只是用來舉例而已,當然包括下述全部有關數量的界定也都是用來舉例而已,其並非用來限制本發明,特此說明。Referring to FIG. 1A to FIG. 1J, FIG. 1A to FIG. 1J are sequential diagrams showing the operation flow of the positioning system according to the first embodiment of the present invention. Hereinafter, the related operation flow of the positioning system of the first embodiment of the present invention will be described in sequence with reference to the drawings, but the operation flow is only used as an example, and of course all the related quantity definitions described below are also used as examples. It is not intended to limit the invention, but is hereby described.
首先,配合圖1A與圖1B所示,先將一承載座1放置並定位於一第一工作機台2上(如圖1A所示),然後再將至少一用於承載多個發光單元L的基板S放置並定位於承載座1上(如圖1B所示)。First, as shown in FIG. 1A and FIG. 1B, a carrier 1 is first placed and positioned on a first working machine 2 (as shown in FIG. 1A), and then at least one is used to carry a plurality of light-emitting units L. The substrate S is placed and positioned on the carrier 1 (as shown in FIG. 1B).
舉例來說,承載座1可以透過多個定位凸塊B(例如襯套或軸襯之類的定件元件)以定位於第一工作機台2上。另外,承載座1具有至少兩個大約設置在對角線上的固定式定位件10,且基板S具有至少兩個大約設置在對角線上且分別對應於上述至少兩個固定式定位件10的基板定位孔S10。配合圖1A與圖1B所示,當基板S被放置在一形成於承載座1上的凹槽12內時,由於承載座1的至少兩個固定式定位件10可以分別穿過基板S的至少兩個基板定位孔S10,所以基板S可以輕易且方便地透過凹槽12的收納與上述至少兩個固定式定位件10的使用,以準確地定位於承載座1上。For example, the carrier 1 can be positioned on the first work machine 2 through a plurality of positioning tabs B (eg, spacer elements such as bushings or bushings). In addition, the carrier 1 has at least two fixed positioning members 10 disposed approximately on the diagonal, and the substrate S has at least two substrates disposed approximately on the diagonal and corresponding to the at least two fixed positioning members 10, respectively. Positioning hole S10. As shown in FIG. 1A and FIG. 1B, when the substrate S is placed in a recess 12 formed in the carrier 1, at least two fixed positioning members 10 of the carrier 1 can pass through at least the substrate S, respectively. The two substrates are positioned in the hole S10, so that the substrate S can be easily and conveniently transmitted through the accommodation of the groove 12 and the use of the at least two fixed positioning members 10 to be accurately positioned on the carrier 1.
再者,配合圖1C與圖1D所示,第一工作機台2包括至少一可移動單元20,其中可移動單元20可包括至少兩個可移動定位件20A及多個可移動支撐件20B,兩個可移動定位件20A可大約設置在對角線上,可移動定位件20A和可移動支撐件20B均可收容於第一工作機台2中,並可依需要選擇性伸出或縮回第一工作機台2。當上述至少兩個可移動定位件20A及上述多個可移動支撐件20B同時向上移動且分別穿過承載座1的開孔11後,每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部可同時被設置於一“用於使遮罩M定位於基板S上方”的第一位置。換言之,當基板S被定位於承載座1上後(如圖1B所示),第一工作機台2會先將可移動單元20的至少兩個可移動定位件20A及多個可移動支撐件20B同時從第一工作機台2伸出(向上移動),以分別穿過承載座1的開孔11(如圖1C所示),然後再將至少一對應於基板S的遮罩M放置且定位於可移動單元20上(如圖1D所示)。Furthermore, as shown in FIG. 1C and FIG. 1D, the first working machine 2 includes at least one movable unit 20, wherein the movable unit 20 can include at least two movable positioning members 20A and a plurality of movable supporting members 20B. The two movable positioning members 20A can be disposed on the diagonal line, and the movable positioning member 20A and the movable supporting member 20B can be accommodated in the first working machine 2, and can be selectively extended or retracted as needed. A working machine 2. When the at least two movable positioning members 20A and the plurality of movable supporting members 20B are simultaneously moved upward and respectively pass through the opening 11 of the carrier 1, the end portions of each of the movable positioning members 20A are movable with each The end portion of the support member 20B can be simultaneously disposed at a first position "for positioning the mask M over the substrate S". In other words, after the substrate S is positioned on the carrier 1 (as shown in FIG. 1B ), the first working machine 2 firstly moves at least two movable positioning members 20A and a plurality of movable supports of the movable unit 20 . 20B simultaneously protrudes from the first working machine 2 (moves upward) to respectively pass through the opening 11 of the carrier 1 (as shown in FIG. 1C), and then at least one mask M corresponding to the substrate S is placed and It is positioned on the movable unit 20 (as shown in FIG. 1D).
舉例來說,遮罩M可由含碳量較高且不易生鏽的磁性物質所製成。遮罩M具有一對應於基板S的罩體M10、多個貫穿罩體M10的噴塗開口M11、至少兩個貫穿罩體M10且分別對應於上述至少兩個可移動定位件20A的第一遮罩定位孔M12、及至少兩個貫穿罩體M10且分別對應於上述至少兩個固定式定位件10的第二遮罩定位孔M13。此外,每一個可移動定位件20A具有一穿過承載座1以向上頂抵罩體M10底面的可移動定位本體201A及一從可移動定位本體201A向上延伸且穿過相對應的第一遮罩定位孔M12的定位柱202A,且每一個可移動支撐件20B具有一穿過承載座1以向上頂抵罩體M10底面的可移動支撐本體200B。此外,上述可移動定位件20A所界定的末端部包括可移動定位本體201A的頂端與整個定位柱202A,且上述可移動支撐件20B所界定的末端部即為可移動支撐本體200B的頂端。換言之,遮罩M不但可經由每一個可移動定位本體201A的頂端與每一個可移動支撐本體200B的頂端的支撐而得到較平衡的支撐效果,並且遮罩M也可以經由每一個連接於相對應可移動定位本體201A頂端的定位柱202A與每一個第一遮罩定位孔M12的配合而得到穩固的定位效果。藉此,由於遮罩M可放置在上述多個可移動支撐件20B上,所以即使遮罩M的厚度非常的薄,遮罩M依然可以透過上述多個可移動支撐件20B的使用而得到較多且均勻的支撐力,進而使得遮罩M可以被有效維持在不產生彎曲或彎折的水平狀態。另外,由於每一個可移動定位件20A的定位柱202A可以穿過遮罩M的相對應第一遮罩定位孔M12,所以遮罩M可輕易且方便地透過上述多個可移動支撐件20B使用,以準確地定位於可移動單元20上。For example, the mask M can be made of a magnetic material that has a high carbon content and is not easily rusted. The mask M has a cover M10 corresponding to the substrate S, a plurality of spray openings M11 penetrating the cover M10, at least two first masks penetrating the cover M10 and corresponding to the at least two movable positioning members 20A, respectively. The positioning hole M12 and the at least two second mask positioning holes M13 penetrating the cover M10 and corresponding to the at least two fixed positioning members 10 respectively. In addition, each of the movable positioning members 20A has a movable positioning body 201A that passes through the carrier 1 to press up against the bottom surface of the cover M10 and a first extending from the movable positioning body 201A and through the corresponding first mask. The positioning post 202A of the hole M12 is positioned, and each of the movable supporting members 20B has a movable supporting body 200B that passes through the carrier 1 to press up against the bottom surface of the cover M10. In addition, the distal end portion defined by the movable positioning member 20A includes the top end of the movable positioning body 201A and the entire positioning post 202A, and the end portion defined by the movable supporting member 20B is the top end of the movable supporting body 200B. In other words, the mask M can obtain a more balanced support effect not only through the support of the top end of each movable positioning body 201A and the top end of each movable support body 200B, but also the mask M can be connected via each one. The positioning post 202A at the top end of the movable positioning body 201A cooperates with each of the first mask positioning holes M12 to obtain a stable positioning effect. Thereby, since the mask M can be placed on the plurality of movable supporting members 20B, even if the thickness of the mask M is extremely thin, the mask M can be obtained through the use of the plurality of movable supporting members 20B. The multiple and uniform supporting force, in turn, allows the mask M to be effectively maintained in a horizontal state where no bending or bending occurs. In addition, since the positioning post 202A of each movable positioning member 20A can pass through the corresponding first mask positioning hole M12 of the mask M, the mask M can be easily and conveniently used through the plurality of movable supporting members 20B. To be accurately positioned on the movable unit 20.
此外,配合圖1D與圖1E所示,每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部可同時被設置於一“用於使遮罩M透過上述至少兩個固定式定位件10以定位於基板S上”的第二位置。換言之,當遮罩M已放置且定位於可移動單元20上後(如圖1D所示),將可移動單元20的至少兩個可移動定位件20A及多個可移動支撐件20B同時縮回第一工作機台2(向下移動)以脫離遮罩M,此時遮罩M即可順勢透過上述至少兩個第二遮罩定位孔M13與上述至少兩個固定式定位件10的配合,以將遮罩M定位於基板S上(如圖1E所示)。In addition, as shown in FIG. 1D and FIG. 1E, the distal end portion of each of the movable positioning members 20A and the distal end portion of each of the movable supporting members 20B can be simultaneously disposed at one time for "passing the mask M through the at least two The fixed positioning member 10 is positioned at a second position on the substrate S. In other words, after the mask M has been placed and positioned on the movable unit 20 (as shown in FIG. 1D), at least two movable positioning members 20A and a plurality of movable supports 20B of the movable unit 20 are simultaneously retracted. The first working machine 2 (moving downward) is disengaged from the mask M, and the mask M can be matched with the at least two fixed positioning members 10 through the at least two second mask positioning holes M13. The mask M is positioned on the substrate S (as shown in FIG. 1E).
舉例來說,由於上述至少兩個第二遮罩定位孔M13分別對應於上述至少兩個固定式定位件10,且上述至少兩個第二遮罩定位孔M13分別對應於上述至少兩個基板定位孔S10(如圖1C或圖1D所示),所以當上述至少兩個可移動定位件20A與上述多個可移動支撐件20B同時向下移動以脫離遮罩M時,上述至少兩個固定式定位件10將可以分別準確地穿過上述至少兩個第二遮罩定位孔M13,以使得遮罩M可以輕易透過上述至少兩個固定式定位件10的使用,以準確地定位於基板S上。換言之,由於“上述至少兩個第二遮罩定位孔M13分別準確地對應於上述至少兩個固定式定位件10”的關係,所以上述至少兩個可移動定位件20A與上述多個可移動支撐件20B在脫離遮罩M的一瞬間,上述至少兩個第二遮罩定位孔M13自然可以分別準確地被上述至少兩個固定式定位件10所穿過,以使得遮罩M可以在不碰觸到發光單元L中已完成打線的藍色發光二極體晶粒L11及其導線W(參考圖1H所示)的情況下,自然且順勢地透過上述至少兩個固定式定位件10,以準確地定位在基板S上,亦即可以避免藍色發光二極體晶粒L11的導線W發生塌線,進而使得藍色發光二極體晶粒L11的一次打線良率可以有效被提升。For example, the at least two second mask positioning holes M13 respectively correspond to the at least two fixed positioning members 10, and the at least two second mask positioning holes M13 respectively correspond to the at least two substrate positioning positions. a hole S10 (as shown in FIG. 1C or FIG. 1D), so when the at least two movable positioning members 20A and the plurality of movable supporting members 20B are simultaneously moved downward to disengage the mask M, the at least two fixed types are The positioning member 10 will be able to accurately pass through the at least two second mask positioning holes M13, respectively, so that the mask M can be easily transmitted through the use of the at least two fixed positioning members 10 to be accurately positioned on the substrate S. . In other words, since the “at least two second mask positioning holes M13 respectively correspond to the relationship of the at least two fixed positioning members 10 respectively”, the at least two movable positioning members 20A and the plurality of movable supports are At a moment when the member 20B is disengaged from the mask M, the at least two second mask positioning holes M13 can naturally be accurately passed by the at least two fixed positioning members 10, respectively, so that the mask M can be touched without being touched. When the blue light-emitting diode die L11 and its wire W (shown in FIG. 1H) have been touched in the light-emitting unit L, the at least two fixed positioning members 10 are naturally and naturally penetrated. Accurately positioning on the substrate S can also prevent the wire W of the blue light-emitting diode die L11 from collapsing, so that the primary wire yield of the blue light-emitting diode die L11 can be effectively improved.
另外,配合圖1E與圖1F所示,當遮罩M透過上述至少兩個固定式定位件10以準確地定位於基板S上後(如圖1E所示),可將一上壓板P蓋在承載座1上,以壓住遮罩M的外圍邊緣(如圖1F所示)。舉例來說,上壓板P包括一可移動地設置於承載座1上的板體P10及至少一貫穿板體P10的窗口P11。當上壓板P蓋在承載座1上時,上壓板P的板體P10可用來壓住遮罩M的外圍邊緣(亦即罩體M10的外圍邊緣),且上壓板P的窗口P11可用來裸露上述多個噴塗開口M11。此外,當上壓板P蓋在承載座1上時,上述至少兩個固定式定位件10可分別露出於板體P10的兩個對角線缺口。In addition, as shown in FIG. 1E and FIG. 1F, when the mask M is accurately positioned on the substrate S through the at least two fixed positioning members 10 (as shown in FIG. 1E), an upper pressing plate P can be covered. The carrier 1 is pressed to press against the peripheral edge of the mask M (as shown in FIG. 1F). For example, the upper platen P includes a plate body P10 movably disposed on the carrier 1 and at least one window P11 penetrating the plate body P10. When the upper platen P is placed on the carrier 1, the plate P10 of the upper platen P can be used to press the peripheral edge of the mask M (that is, the peripheral edge of the cover M10), and the window P11 of the upper platen P can be used for bareness. The plurality of spray openings M11 described above. In addition, when the upper pressing plate P is covered on the carrier 1, the at least two fixed positioning members 10 can be respectively exposed to the two diagonal notches of the board P10.
再者,配合圖1F與圖1G所示,當上壓板P蓋在承載座1上後(如圖1F所示),可先將承載座1從第一工作機台2取下,然後再將承載座1定位於一相距第一工作機台2一預定距離的第二工作機台3上(如圖1G所示)。舉例來說,承載座1也可以透過多個定位凸塊B以定位於第二工作機台3上。另外,第二工作機台3包括一用於產生磁性吸引力的電磁力產生模組30及一用於開啟或關閉電磁力產生模組30的電磁力控制模組31。藉此,當承載座1被定位於第二工作機台3上時,可透過電磁力產生模組30所產生的磁性吸引力(此時電磁力控制模組31被切換到ON的狀態,如圖1G所示),以使得具有磁力吸附功能的遮罩M可經由電磁力產生模組30所產生的磁性吸引力的吸引而被緊密吸附在基板S上。換言之,當電磁力控制模組31被切換到ON的狀態時(如圖1G所示),透過電磁力控制模組31開啟電磁力產生模組30後所產生的磁性吸引力,不僅遮罩M將可完全緊密貼附在基板S上,以使得罩體M10與基板S之間不易產生讓後續製程所噴塗的螢光膠體滲入的微間隙,而且同一時間上壓板P也會被電磁力產生模組30所產生的磁性吸引力所吸引,以避免後續製程所噴塗的螢光膠體因滲入板體P10和遮罩M之間的間隙而使得第二工作機台3受到汙染的情況發生。Furthermore, as shown in FIG. 1F and FIG. 1G, when the upper pressure plate P is placed on the carrier 1 (as shown in FIG. 1F), the carrier 1 can be removed from the first working machine 2, and then The carrier 1 is positioned on a second working machine 3 at a predetermined distance from the first working machine 2 (as shown in FIG. 1G). For example, the carrier 1 can also be positioned on the second working machine 3 through a plurality of positioning protrusions B. In addition, the second working machine 3 includes an electromagnetic force generating module 30 for generating magnetic attraction and an electromagnetic force control module 31 for turning on or off the electromagnetic force generating module 30. Thereby, when the carrier 1 is positioned on the second working machine 3, the magnetic attraction force generated by the electromagnetic force generating module 30 can be transmitted (at this time, the electromagnetic force control module 31 is switched to the ON state, such as FIG. 1G) is such that the mask M having the magnetic attraction function can be closely adsorbed on the substrate S by the attraction of the magnetic attraction force generated by the electromagnetic force generation module 30. In other words, when the electromagnetic force control module 31 is switched to the ON state (as shown in FIG. 1G), the magnetic attraction force generated by the electromagnetic force control module 31 after the electromagnetic force generating module 30 is turned on is not only the mask M. It can be completely adhered to the substrate S so that the micro-gap between the cover M10 and the substrate S is less likely to infiltrate the phosphor colloid sprayed in the subsequent process, and at the same time, the platen P is also electromagnetically generated. The magnetic attraction generated by the group 30 is attracted to avoid contamination of the second working machine 3 by the phosphor colloid sprayed in the subsequent process due to penetration into the gap between the plate P10 and the mask M.
此外,配合圖1G、圖1H及圖1I所示,當承載座1被定位於第二工作機台3上,且遮罩M經由電磁力產生模組30所產生的磁性吸引力的吸引而被緊密吸附在基板S上後(如圖1G與圖1H所示,其中圖1H為遮罩M被緊密吸附在基板S上的部份放大示意圖),即可將螢光膠體C噴塗在被上述多個噴塗開口M11所裸露的位置上(如圖1I所示),其中發光單元L被噴塗開口M11所裸露的區域定義為“一次固晶打線區域R1”,而發光單元L未被噴塗開口M11所裸露的區域定義為“二次固晶打線區域R2”。In addition, as shown in FIG. 1G, FIG. 1H, and FIG. 1I, when the carrier 1 is positioned on the second working machine 3, and the mask M is attracted by the magnetic attraction generated by the electromagnetic force generating module 30, After being closely adsorbed on the substrate S (as shown in FIG. 1G and FIG. 1H, wherein FIG. 1H is a partially enlarged schematic view of the mask M being closely adsorbed on the substrate S), the phosphor colloid C can be sprayed on the above-mentioned multiple A position where the spray opening M11 is exposed (as shown in FIG. 1I), wherein a region where the light-emitting unit L is exposed by the spray opening M11 is defined as a “primary-bonded wire region R1”, and the light-emitting unit L is not sprayed with the opening M11. The bare area is defined as "secondary bonding line area R2".
舉例來說,如圖1H與圖1I所示,每一個發光單元L包括兩個被置放在基板S的置晶層S11上且分別被其中兩個相對應的噴塗開口M11所裸露的藍色發光二極體晶粒L11,且每一個藍色發光二極體晶粒L11可透過兩條相對應的導線W,以電性連接於基板S的其中兩個電極S12。藉此,當螢光膠體C噴塗在被上述兩個相對應的噴塗開口M11所裸露的“一次固晶打線區域R1”上時,螢光膠體C將只會覆蓋在上述兩個藍色發光二極體晶粒L11及其相對應的兩條導線W上。再者,因為遮罩M可以完全緊密貼附在基板S上的關係,使得罩體M10與基板S之間不易產生讓螢光膠體C滲入的微間隙,所以螢光膠體C將不易滲入已被罩體M10所遮住地方,進而有效提升後續二次打線的打線良率。換言之,在進行螢光膠體C的噴塗過程中,螢光膠體C將只會覆蓋在上述兩個藍色發光二極體晶粒L11及其相對應的兩條導線W上,而不易滲入罩體M10與基板S之間而溢膠到“二次固晶打線區域R2”上,進而使得後續二次打線的良率可以有效被提升。For example, as shown in FIG. 1H and FIG. 1I, each of the light-emitting units L includes two blues which are placed on the seed layer S11 of the substrate S and are respectively exposed by two corresponding spray openings M11. The light-emitting diode crystal grains L11 are disposed, and each of the blue light-emitting diode crystal grains L11 is electrically connected to the two electrodes S12 of the substrate S through two corresponding wires W. Thereby, when the phosphor colloid C is sprayed on the "primary solid wire bonding region R1" exposed by the above two corresponding spray openings M11, the phosphor colloid C will only cover the above two blue light emitting two The polar body L11 and its corresponding two wires W. Moreover, since the mask M can be completely adhered to the relationship on the substrate S, the micro-gap between the cover M10 and the substrate S is less likely to be infiltrated by the phosphor colloid C, so the fluorescent colloid C will not easily penetrate into the covered cover. The body M10 covers the place, thereby effectively improving the wire yield of the subsequent secondary line. In other words, during the spraying process of the phosphor colloid C, the phosphor colloid C will only cover the two blue LED dipoles L11 and their corresponding two wires W, and will not easily penetrate into the cover. Between the M10 and the substrate S, the glue overflows to the "secondary solid crystal wiring region R2", so that the yield of the subsequent secondary bonding can be effectively improved.
再者,當完成上述噴塗螢光膠體C的步驟後,需先將電磁力控制模組31切換為OFF狀態,以消除電磁力產生模組30對承載座1的磁力吸引,接著將已完成螢光膠體C噴塗的承載座1從第二工作機台3取下,然後再將承載座1再次定位於第一工作機台2上,並且打開上壓板P(可參考圖1F與圖1E所示),接著在可移動單元20向上移動以頂起遮罩M後取下遮罩M(可參考圖1D與圖1C所示),最後在可移動單元20向下移動後,即可順利取下上述已完成螢光膠體C噴塗製程的基板S(可參考圖1B與圖1A所示)。Furthermore, after the step of spraying the phosphor colloid C is completed, the electromagnetic force control module 31 is first switched to the OFF state to eliminate the magnetic attraction of the electromagnetic force generating module 30 to the carrier 1, and then the firefly has been completed. The photocolloid C sprayed carrier 1 is removed from the second working machine 3, and then the carrier 1 is again positioned on the first working machine 2, and the upper pressing plate P is opened (refer to FIG. 1F and FIG. 1E). Then, after the movable unit 20 is moved upward to lift the mask M, the mask M is removed (refer to FIG. 1D and FIG. 1C), and finally, after the movable unit 20 is moved downward, the mask can be smoothly removed. The substrate S of the above-mentioned fluorescent colloidal C spraying process has been completed (refer to FIG. 1B and FIG. 1A).
最後,配合圖1J所示,將兩個紅色發光二極體晶粒L12分別置放在基板S的置晶層S11上,且透過兩條相對應的導線W,以電性連接於基板S的另外兩個電極S12。由於在噴塗過程中的螢光膠體C不易溢膠到“二次固晶打線區域R2”內,所以使得後續紅色發光二極體晶粒L12的二次打線良率可以有效被提升。Finally, as shown in FIG. 1J, two red LED dipoles L12 are respectively placed on the seed layer S11 of the substrate S, and are passed through two corresponding wires W to be electrically connected to the substrate S. The other two electrodes S12. Since the phosphor colloid C during the spraying process is not easily spilled into the "secondary solid crystal wiring region R2", the secondary bonding yield of the subsequent red LED dipole L12 can be effectively improved.
綜上所述,本發明第一實施例主要在於提供一種定位系統,其可用以分別定位至少一用於承載多個發光單元L的基板S(配合圖1A至圖1B所示)及定位至少一對應於基板S的遮罩M(配合圖1C至圖1E),其中定位系統包括:一第一工作機台2、一第二工作機台3、及一承載座1。第一工作機台2包括至少一可移動單元20,其中可移動單元20包括至少兩個可移動定位件20A及至少兩個可移動支撐件20B。第二工作機台3相距第一工作機台2一預定距離。承載座1可選擇性地定位於第一工作機台2與第二工作機台3兩者中的其中一個上,其中承載座1具有至少兩個固定式定位件10,基板S係可透過上述至少兩個固定式定位件10以定位於承載座1上,且遮罩M係可透過上述至少兩個固定式定位件10以定位於基板S上。In summary, the first embodiment of the present invention mainly provides a positioning system, which can be used to respectively locate at least one substrate S for carrying a plurality of light-emitting units L (shown in FIG. 1A to FIG. 1B) and to locate at least one. A mask M corresponding to the substrate S (in conjunction with FIG. 1C to FIG. 1E), wherein the positioning system comprises: a first working machine 2, a second working machine 3, and a carrier 1. The first working machine 2 includes at least one movable unit 20, wherein the movable unit 20 includes at least two movable positioning members 20A and at least two movable supporting members 20B. The second working machine 3 is at a predetermined distance from the first working machine 2. The carrier 1 is selectively positionable on one of the first working machine 2 and the second working machine 3, wherein the carrier 1 has at least two fixed positioning members 10, and the substrate S is permeable to the above At least two fixed positioning members 10 are positioned on the carrier 1, and the mask M is permeable to the substrate S through the at least two fixed positioning members 10.
首先,舉例來說,當承載座1被定位於第一工作機台2上時,每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部可同時被設置於一“用於使遮罩M定位於基板S上方”的第一位置上(如圖1D所示)、或可同時被設置於一“用於使遮罩M透過上述至少兩個固定式定位件10以定位於基板S上”的第二位置上(如圖1E所示)。First, for example, when the carrier 1 is positioned on the first work machine 2, the end portion of each of the movable positioning members 20A and the end portion of each of the movable support members 20B can be simultaneously disposed at one a first position for positioning the mask M above the substrate S (as shown in FIG. 1D), or may be simultaneously disposed at a direction for the mask M to pass through the at least two fixed positioning members 10 Positioned on the second position on the substrate S (as shown in FIG. 1E).
再者,舉例來說,當每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部同時被設置於第一位置時(如圖1D所示),每一個可移動定位件20A的可移動定位本體201A可穿過承載座1以向上頂抵罩體M10底面,每一個可移動定位件20A的定位柱202A可從相對應的可移動定位本體201A向上延伸且穿過相對應的第一遮罩定位孔M12,且每一個可移動支撐件20B的可移動支撐本體200B可穿過承載座1以向上頂抵罩體M10底面。Further, for example, when the distal end portion of each of the movable positioning members 20A is simultaneously disposed at the first position with the distal end portion of each of the movable supporting members 20B (as shown in FIG. 1D), each of the movable positioning The movable positioning body 201A of the piece 20A can pass through the carrier 1 to press up against the bottom surface of the cover M10, and the positioning post 202A of each movable positioning member 20A can extend upward from the corresponding movable positioning body 201A and pass through the phase. Corresponding first mask positioning holes M12, and the movable support body 200B of each movable support 20B can pass through the carrier 1 to face up against the bottom surface of the cover M10.
另外,舉例來說,當每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部同時被設置於第二位置時(如圖1E所示),每一個可移動定位件20A的末端部與每一個可移動支撐件20B的末端部皆同時脫離遮罩M,以使得每一個固定式定位件10可依序穿過相對應的基板定位孔S10與相對應的第二遮罩定位孔M13,以達到本發明可分別定位基板S與遮罩M的目的。Further, for example, when the distal end portion of each of the movable positioning members 20A is simultaneously disposed at the second position with the distal end portion of each of the movable supporting members 20B (as shown in FIG. 1E), each of the movable positioning members The end portion of the 20A and the end portion of each movable support member 20B are simultaneously separated from the mask M, so that each of the fixed positioning members 10 can sequentially pass through the corresponding substrate positioning hole S10 and the corresponding second cover. The cover is positioned to the positioning hole M13 to achieve the purpose of separately positioning the substrate S and the mask M.
值得一提的是,配合1A與1B所示,若是將固定式定位件10與基板定位孔S10都設計成相互對應的防呆形狀時(例如皆為矩形或任何的多邊形),本發明亦可只透過單一個固定式定位件10與單一個基板定位孔S10的配合,即可將基板S準確地定位在承載座1上。當然,若是採用單一個固定式定位件10再搭配凹槽12在形狀上的防呆設計的話,更能確保基板S被擺放在正確的位置上。另外,配合圖1C至圖1E所示,由於本發明也可以只使用單一個固定式定位件10,所以遮罩M亦可只使用單一個第二遮罩定位孔M13。當第二遮罩定位孔M13被設計成對應於單一個固定式定位件10的防呆形狀時,遮罩M亦可只使用單一個第二遮罩定位孔M13來達到準確地定位遮罩M於基板S上的效果。It should be noted that, as shown in FIG. 1A and FIG. 1B, if both the fixed positioning member 10 and the substrate positioning hole S10 are designed to have mutually corresponding foolproof shapes (for example, all rectangular or any polygonal shape), the present invention can also The substrate S can be accurately positioned on the carrier 1 only by the cooperation of a single fixed positioning member 10 and a single substrate positioning hole S10. Of course, if a single fixed positioning member 10 is used together with the anti-slipping design of the groove 12, it is more ensured that the substrate S is placed in the correct position. In addition, as shown in FIG. 1C to FIG. 1E, since the present invention can also use only a single fixed positioning member 10, the mask M can also use only a single second mask positioning hole M13. When the second mask positioning hole M13 is designed to correspond to the foolproof shape of the single fixed positioning member 10, the mask M can also use only a single second mask positioning hole M13 to accurately position the mask M. The effect on the substrate S.
換言之,承載座1亦可具有至少一固定式定位件10,基板S亦可具有至少一對應於上述至少一固定式定位件10的基板定位孔S10,且上述至少一遮罩M亦可具有至少一對應於上述至少一基板定位孔S10的遮罩定位孔M13。因此,當上述至少一固定式定位件10依序穿過上述至少一基板定位孔S10與上述至少一遮罩定位孔M13時,由於上述的防呆設計,所以基板S即可透過上述至少一固定式定位件10以定位於承載座1上,且上述至少一遮罩M即可透過上述至少一固定式定位件10以定位於上述至少一基板S上。In other words, the carrier 1 can also have at least one fixed positioning member 10, and the substrate S can have at least one substrate positioning hole S10 corresponding to the at least one fixed positioning member 10, and the at least one mask M can also have at least one mask M. A mask positioning hole M13 corresponding to the at least one substrate positioning hole S10. Therefore, when the at least one fixed positioning member 10 sequentially passes through the at least one substrate positioning hole S10 and the at least one mask positioning hole M13, the substrate S can pass through the at least one fixing due to the above-mentioned foolproof design. The positioning member 10 is positioned on the carrier 1 , and the at least one mask M can be positioned on the at least one substrate S through the at least one fixed positioning member 10 .
請參閱圖2A至圖2E所示,圖2A至圖2E依序顯示本發明第二實施例的定位系統的操作流程示意圖。以下將配合圖式,依序說明本發明第二實施例的定位系統的相關操作流程,但此操作流程只是用來舉例而已,當然包括下述全部有關數量的界定也都是用來舉例而已,其並非用來限制本發明,特此說明。Referring to FIG. 2A to FIG. 2E , FIG. 2A to FIG. 2E are schematic diagrams showing the operation flow of the positioning system according to the second embodiment of the present invention. The related operation flow of the positioning system of the second embodiment of the present invention will be described in the following with reference to the drawings, but the operation flow is only used as an example, and of course all the related quantity definitions described below are also used as examples. It is not intended to limit the invention, but is hereby described.
首先,配合圖2A所示,先將一承載座1放置並定位於一第一工作機台2上(其放置與定位方式可與第一實施例所示類似),然後再將至少一用於承載多個發光單元L的基板S放置並定位於承載座1上,接著再透過至少一吸取頭21來預備吸取至少一事先被定位於一第一定位框22內的遮罩M。舉例來說,上述吸取遮罩M的方式可為真空吸取或磁力吸取…等等。吸取頭21可透過一設置於第一工作機台2上的三維工作平台(圖未示)來進行X方向或Y方向的任意移動(當然三維工作平台也可以不用放置在第一工作機台2上,而是改放置在距離第一工作機台2的一預定位置上),且第一定位框22可由至少四個分別對應於遮罩M的相對應轉角的第一邊框220所組成。First, as shown in FIG. 2A, a carrier 1 is first placed and positioned on a first working machine 2 (the placement and positioning manner can be similar to that shown in the first embodiment), and then at least one is used. The substrate S carrying the plurality of light-emitting units L is placed and positioned on the carrier 1, and then the at least one pick-up head 21 is used to prepare for picking up at least one mask M previously positioned in a first positioning frame 22. For example, the manner in which the mask M is sucked up may be vacuum suction or magnetic suction... and the like. The suction head 21 can perform any movement in the X direction or the Y direction through a three-dimensional working platform (not shown) disposed on the first working machine 2 (of course, the three-dimensional working platform can also be placed on the first working machine 2 Up, but placed at a predetermined position from the first working machine 2), and the first positioning frame 22 may be composed of at least four first frames 220 respectively corresponding to the corresponding corners of the mask M.
再者,配合圖2A與圖2B所示,當上述事先被定位於第一定位框22內的遮罩M被吸取頭21吸取後,遮罩M可透過吸取頭21的帶動以放置於基板S上,此時遮罩M即可順勢透過上述至少兩個固定式定位件10以定位於基板S上(如圖2B所示)。舉例來說,換言之,由於“上述至少兩個遮罩定位孔M13’(其設計的位置與作用可與第一實施例的第二遮罩定位孔M13相同)分別準確地對應於上述至少兩個固定式定位件10”的關係,所以在遮罩M被吸取頭21帶動以放置於基板S上的一瞬間,上述至少兩個遮罩定位孔M13’自然可以分別準確地被上述至少兩個固定式定位件10所穿過,以使得遮罩M可以在不碰觸到發光單元L中已完成打線的發光二極體晶粒及其導線(參考圖1H所示)的情況下,自然且順勢地透過上述至少兩個固定式定位件10以定位在基板S上。Furthermore, as shown in FIG. 2A and FIG. 2B, when the mask M previously positioned in the first positioning frame 22 is sucked by the suction head 21, the mask M can be driven by the suction head 21 to be placed on the substrate S. In this case, the mask M can be placed on the substrate S through the at least two fixed positioning members 10 (as shown in FIG. 2B). For example, in other words, since "the above at least two mask positioning holes M13" (the position and function of which are designed may be the same as the second mask positioning hole M13 of the first embodiment) respectively correspond to the above at least two The relationship of the fixed positioning member 10", so that the at least two mask positioning holes M13' can be accurately fixed by the at least two at least two moments when the mask M is driven by the suction head 21 to be placed on the substrate S. The locating member 10 is passed through so that the mask M can naturally and naturally follow without touching the illuminating diode dies of the illuminating unit L and the wires thereof (refer to FIG. 1H). The ground is passed through the at least two fixed positioning members 10 to be positioned on the substrate S.
另外,配合圖2B與圖2C所示,當遮罩M放置且定位於基板S上後(如圖2B所示),可先將承載座1從第一工作機台2取下,然後再將承載座1定位於一相距第一工作機台2一預定距離的第二工作機台3上(如圖2C所示),以進行後續螢光膠體(可參考圖1H所示)的噴塗。舉例來說,第二工作機台3包括一用於產生磁性吸引力的電磁力產生模組30及一用於開啟或關閉電磁力產生模組30的電磁力控制模組31。藉此,當承載座1被定位於第二工作機台3上時,可透過電磁力產生模組30所產生的磁性吸引力,以使得遮罩M被緊密吸附在基板S上。換言之,透過電磁力控制模組31開啟電磁力產生模組30後所產生的磁性吸引力,遮罩M將可完全緊密貼附在基板S上,以使得遮罩M與基板S之間不易產生讓後續製程所噴塗的螢光膠體滲入的微間隙,進而避免第二工作機台3受到螢光膠體的汙染。In addition, as shown in FIG. 2B and FIG. 2C, after the mask M is placed and positioned on the substrate S (as shown in FIG. 2B), the carrier 1 can be first removed from the first working machine 2, and then The carrier 1 is positioned on a second working machine 3 (shown in FIG. 2C) at a predetermined distance from the first working machine 2 for spraying the subsequent fluorescent colloid (refer to FIG. 1H). For example, the second working machine 3 includes an electromagnetic force generating module 30 for generating magnetic attraction and an electromagnetic force control module 31 for turning on or off the electromagnetic force generating module 30. Thereby, when the carrier 1 is positioned on the second working machine 3, the magnetic attraction force generated by the module 30 can be generated by the electromagnetic force so that the mask M is closely adsorbed on the substrate S. In other words, the magnetic attraction force generated by the electromagnetic force control module 31 after the electromagnetic force generating module 30 is turned on, the mask M can be completely adhered to the substrate S so that the mask M and the substrate S are less likely to be generated. The micro-gap penetrated by the fluorescent colloid sprayed by the subsequent process, thereby preventing the second working machine 3 from being contaminated by the fluorescent colloid.
此外,參閱圖2C與2D所示,先將已完成螢光膠體噴塗製程的承載座1從第二工作機台3取下,然後再將承載座1再次定位於第一工作機台2上,接著透過吸取頭21以將遮罩M從基板S上吸取。In addition, referring to FIG. 2C and FIG. 2D, the carrier 1 of the completed fluorescent colloid spraying process is first removed from the second working machine 3, and then the carrier 1 is again positioned on the first working machine 2. The mask M is then sucked from the substrate S through the suction head 21.
再者,參閱圖2D與2E所示,當遮罩M被吸取頭21從基板S上吸取後,先將被吸取的遮罩M放置在可由至少四個分別對應於遮罩M的相對應轉角的第二邊框230所組成的第二定位框23內,最後即可從承載座1上順利取下已完成螢光膠體噴塗製程的基板S。2D and 2E, after the mask M is sucked from the substrate S by the pick-up head 21, the sucked mask M is first placed at at least four corresponding corners respectively corresponding to the mask M. In the second positioning frame 23 composed of the second frame 230, the substrate S on which the fluorescent colloid spraying process has been completed can be smoothly removed from the carrier 1.
綜上所述,本發明第二實施例主要在於提供一種定位系統,其可用以分別定位至少一用於承載多個發光單元L的基板S(配合圖2A所示)及定位至少一對應於基板S的遮罩M(配合圖2B所示),其中定位系統包括:一第一工作機台2、一第二工作機台3、及一承載座1。第一工作機台2包括至少一用於吸取遮罩M的吸取頭21。第二工作機台3相距第一工作機台2一預定距離。承載座1可選擇性定位於第一工作機台2與第二工作機台3兩者中的其中一個上,其中承載座1具有至少兩個固定式定位件S10,基板S係可透過上述至少兩個固定式定位件S10以定位於承載座1上,且遮罩M係可透過上述至少兩個固定式定位件S10以定位於基板S上。In summary, the second embodiment of the present invention mainly provides a positioning system, which can be used to respectively locate at least one substrate S for carrying a plurality of light-emitting units L (shown in FIG. 2A) and at least one corresponding to the substrate. The mask M of S (shown in FIG. 2B), wherein the positioning system comprises: a first working machine 2, a second working machine 3, and a carrier 1. The first working machine 2 includes at least one suction head 21 for sucking the mask M. The second working machine 3 is at a predetermined distance from the first working machine 2. The carrier 1 is selectively positionable on one of the first working machine 2 and the second working machine 3, wherein the carrier 1 has at least two fixed positioning members S10 through which the substrate S can pass Two fixed positioning members S10 are positioned on the carrier 1, and the mask M is permeable to the substrate S through the at least two fixed positioning members S10.
綜上所述,本發明實施例所提供的定位系統,其可將至少一遮罩透過至少兩個固定式定位件以定位於至少一基板上,進而有效提升發光二極體晶粒的一次打線與二次打線的打線良率。In summary, the positioning system provided by the embodiment of the present invention can transmit at least one mask through at least two fixed positioning members to be positioned on at least one substrate, thereby effectively improving the primary wiring of the LED die. The line rate with the secondary line.
以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術變化,均包含於本發明之範圍內。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.
1...承載座1. . . Carrier
10...固定式定位件10. . . Fixed positioning piece
11...開孔11. . . Opening
12...凹槽12. . . Groove
B...定位凸塊B. . . Positioning bump
2...第一工作機台2. . . First working machine
20...可移動單元20. . . Movable unit
20A...可移動定位件20A. . . Movable positioning member
201A...可移動定位本體201A. . . Movable positioning body
202A...定位柱202A. . . Positioning column
20B...可移動支撐件20B. . . Movable support
200B...可移動支撐本體200B. . . Movable support body
21...吸取頭twenty one. . . Suction head
22...第一定位框twenty two. . . First positioning frame
220...第一邊框220. . . First border
23...第二定位框twenty three. . . Second positioning frame
230...第二邊框230. . . Second border
3...第二工作機台3. . . Second working machine
30...電磁力產生模組30. . . Electromagnetic force generation module
31...電磁力控制模組31. . . Electromagnetic force control module
P...上壓板P. . . Upper plate
P10...板體P10. . . Plate body
P11...窗口P11. . . window
S...基板S. . . Substrate
S10...基板定位孔S10. . . Substrate positioning hole
S11...置晶層S11. . . Crystal layer
S12...電極S12. . . electrode
M...遮罩M. . . Mask
M10...罩體M10. . . Cover
M11...噴塗開口M11. . . Spray opening
M12...第一遮罩定位孔M12. . . First mask positioning hole
M13...第二遮罩定位孔M13. . . Second mask positioning hole
M13’...遮罩定位孔M13’. . . Mask positioning hole
L...發光單元L. . . Light unit
L11...藍色發光二極體晶粒L11. . . Blue light emitting diode grain
L12...紅色發光二極體晶粒L12. . . Red light emitting diode grain
W...導線W. . . wire
C...螢光膠體C. . . Fluorescent colloid
R1...一次固晶打線區域R1. . . One-time bonding line
R2...二次固晶打線區域R2. . . Secondary solid crystal bonding area
圖1A至圖1J依序顯示本發明第一實施例的定位系統的操作流程立體示意圖。1A to 1J are schematic perspective views showing the operation flow of the positioning system of the first embodiment of the present invention.
圖2A至圖2E依序顯示本發明第二實施例的定位系統的操作流程立體示意圖。2A to 2E are schematic perspective views showing the operation flow of the positioning system of the second embodiment of the present invention.
1...承載座1. . . Carrier
10...固定式定位件10. . . Fixed positioning piece
11...開孔11. . . Opening
2...第一工作機台2. . . First working machine
20...可移動單元20. . . Movable unit
20A...可移動定位件20A. . . Movable positioning member
201A...可移動定位本體201A. . . Movable positioning body
202A...定位柱202A. . . Positioning column
20B...可移動支撐件20B. . . Movable support
200B...可移動支撐本體200B. . . Movable support body
S...基板S. . . Substrate
S10...基板定位孔S10. . . Substrate positioning hole
M...遮罩M. . . Mask
M10...罩體M10. . . Cover
M11...噴塗開口M11. . . Spray opening
M12...第一遮罩定位孔M12. . . First mask positioning hole
M13...第二遮罩定位孔M13. . . Second mask positioning hole
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103760A TWI462327B (en) | 2012-02-06 | 2012-02-06 | Positioning system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101103760A TWI462327B (en) | 2012-02-06 | 2012-02-06 | Positioning system |
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| Publication Number | Publication Date |
|---|---|
| TW201334216A TW201334216A (en) | 2013-08-16 |
| TWI462327B true TWI462327B (en) | 2014-11-21 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI272731B (en) * | 2005-03-22 | 2007-02-01 | Integrated Crystal Technology | A wire-bonding free packaging structure of light emitted diode |
| TWI318279B (en) * | 2007-12-07 | 2009-12-11 | Gigno Technology Co Ltd | Light emitting unit |
| TW201010133A (en) * | 2008-08-28 | 2010-03-01 | Genius Electronic Optical Co Ltd | Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof |
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2012
- 2012-02-06 TW TW101103760A patent/TWI462327B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI272731B (en) * | 2005-03-22 | 2007-02-01 | Integrated Crystal Technology | A wire-bonding free packaging structure of light emitted diode |
| TWI318279B (en) * | 2007-12-07 | 2009-12-11 | Gigno Technology Co Ltd | Light emitting unit |
| TW201010133A (en) * | 2008-08-28 | 2010-03-01 | Genius Electronic Optical Co Ltd | Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof |
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