TWI459891B - Heat dissipation device and manufacture method thereof - Google Patents

Description

Heat sink and method of manufacturing same

The invention relates to a heat dissipating device and a manufacturing method thereof, in particular to a heat dissipating device for dissipating heat of an electronic component and a manufacturing method thereof.

As the electronic information industry continues to evolve, the frequency and speed of electronic components (especially central processing units) continue to increase. However, the high-frequency high-speed will increase the heat generated by the electronic components, causing the temperature to rise continuously, which seriously threatens the performance of the electronic components during operation. To ensure the normal operation of the electronic components, the heat generated by the electronic components must be discharged in time. .

To this end, the industry generally uses a heat sink composed of a heat sink and a heat pipe connected to the heat sink to dissipate heat from the electronic components. The heat sink has a flat surface that is joined to the surface by soldering. However, during the welding process of the heat pipe and the surface of the heat sink, the solder paste is usually applied to the surface of the heat sink by a visual means, and then the heat pipe is in contact with the solder paste to be soldered to the surface of the heat sink. Together. However, when the heat pipes of different shapes are combined with the heat sink, the coating paths of the solder paste on the heat sink are different, such as a linear shape, a curved shape, or the like, or a plurality of heat pipes are combined with the same heat sink to form a plurality of complicated The coating route makes it difficult to visually judge the application of the solder paste in the production, especially in the mass production, and it is easy to make the coating route of the solder paste and the actual welding position of the heat pipe greatly deviate, such as the solder paste being coated. Often in the process The position of the surface of the heat sink that needs to be in contact with the heat pipe is offset, so that part of the solder paste is applied outside the position where the surface of the heat sink is in contact with the heat pipe, thereby causing welding or adhesion offset in the process, The cause of the overflow is caused by the overflow and the like, and the solder paste is easily wasted.

In view of the above, it is necessary to provide a heat sink capable of guiding the solder paste accurately to prevent solder paste waste and increase product yield, and a method of manufacturing the same.

A heat dissipating device comprising a heat sink and at least one heat pipe, the heat pipe having a condensation section, the heat sink having a surface soldered to the condensation section of the heat pipe, the surface of the heat sink being provided with a solder paste for guiding a guiding trajectory line is coated on the surface of the heat sink, and the condensation section of the heat pipe is disposed on the surface of the heat sink and soldered with the solder paste, wherein the guiding trajectory line is The position near the left edge of the heat sink extends to a position close to the right edge of the heat sink and does not penetrate the left and right sides of the heat sink.

A method of manufacturing a heat dissipating device, comprising the steps of: providing a heat sink having a surface soldered to a condensation section of a heat pipe, and providing a surface of the heat sink for guiding solder paste on the heat sink a coated guide track line on the surface; a solder paste is applied on the surface of the heat sink along the guide track line; and at least one heat pipe is provided, the heat pipe having a condensation section for condensing the heat pipe Segment guiding the guiding track line is disposed on a surface of the heat sink and soldered with the solder paste, wherein the guiding track line extends from a position near a left edge of the heat sink to a position close to a right edge of the heat sink. And does not penetrate the left and right sides of the radiator.

Compared with the prior art, the heat dissipating device is provided with a guiding track line on the surface of the heat sink, which can accurately guide the solder paste to be applied to the position where the heat sink needs to be welded with the heat pipe. And to prevent the waste of solder paste.

10‧‧‧ radiator

12‧‧‧ Heat sink fins

14‧‧‧ Lower surface

15‧‧‧Guided trajectory

16‧‧‧ upper surface

18‧‧‧ Groove

19‧‧‧ bottom surface

20‧‧‧heat pipe

22‧‧‧Evaporation section

24‧‧‧Condensation section

120‧‧‧ body

122, 124, 126‧ ‧ hem

150‧‧‧ slitting

152‧‧‧closed end

1 is a perspective assembled view of an embodiment of a heat sink according to the present invention.

2 is an exploded perspective view of the heat sink of FIG. 1.

Figure 3 is an enlarged view of the portion of the circle III of Figure 2.

The heat sink of the present invention will be further described below with reference to the accompanying drawings.

As shown in FIG. 1, the heat sink includes a heat sink 10 and two heat pipes 20.

The heat sink 10 is formed by arranging a plurality of heat dissipation fins 12. The heat sink 10 includes a flat lower surface 14 and an upper surface 16 opposite the lower surface 14. The upper surface 16 is provided with a recess 18 extending through the left and right sides of the heat sink 10. The groove 18 is recessed by the upper surface 16 of the heat sink 10 in the direction in which the lower surface 14 is located, and extends in the direction in which the heat dissipation fins 12 of the heat sink 10 are arranged. The recess 18 is generally rectangular and has a flat bottom surface 19 at its bottom end.

Each of the heat dissipation fins 12 includes a body 120, a lower flange 122 vertically bent from a bottom end of the body 120 to a side, and a direction from the top end of the body 120 to the same direction as the lower flange 122 A first upper flange 124 and a second upper flange 126 are formed by vertical bending. The height of the central portion of the body 120 is smaller than the height of the front and rear end portions thereof. The first upper flange 124 is located at a top end of the front and rear end portions of the body 120. The second upper flange 126 is located in the groove 18 and is located at the top end of the central portion of the body 120. The lower flange 122 of each of the heat dissipation fins 12 and the body 120 of a heat dissipation fin 12 adjacent thereto are in contact with each other to form the lower surface 14 of the heat sink 10. The first upper flange 124 of each of the heat dissipation fins 12 and the body of a heat dissipation fin 12 adjacent thereto 120 opposes each other to form the upper surface 16 of the heat sink 10. The second upper flange 126 of each of the heat dissipation fins 12 and the body 120 of an adjacent one of the heat dissipation fins 12 abut against each other to form a bottom surface 19 of the recess 18 of the heat sink 10 .

Referring to FIG. 2 and FIG. 3, each of the heat dissipation fins 12 of the middle portion of the heat sink 10 is respectively provided with two slits 150 on the outer surface of the second upper flange 126 thereof, and each slit 150 is along The bending direction of the corresponding second upper flange 126 extends through the front and rear ends of the second upper flange 126, and the slits 150 on the second flange 126 between the adjacent two heat dissipation fins 12 are respectively connected end to end. Thereby two guiding track lines 15 are formed on the bottom surface 19 of the recess 18. In this embodiment, in addition to the two heat dissipation fins 12 located at the left and right ends of the heat sink 10, the second upper flange 126 of the other heat dissipation fins 12 is provided with a slit 150. The two guiding track lines 15 are parallel and spaced apart from each other, and extend from the left edge of the heat sink 10 in the extending direction of the groove 18 to the right edge of the heat sink 10. The two ends of the guide track 15 do not extend through the left and right sides of the heat sink 10. That is, the guide track 15 forms a closed end 152 near the left and right sides of the heat sink 10. The depth of the guiding trajectory line 15 is smaller than the thickness of each of the second upper hem 126, that is, the guiding trajectory line 15 is a groove that does not penetrate the second upper hem 126. The guiding track line 15 is formed by stamping or other means.

The heat pipe 20 is a flat heat pipe including an evaporation section 22 and a condensation section 24. The condensation sections 24 of the heat pipes 20 are received in the recesses 18 of the heat sink 10 and are respectively located on the respective guide track lines 15. The width of each condensation section 24 is much larger than the width of the guide track line 15.

When assembling, first, solder paste is applied on the bottom surface 19 of the groove 18 along the extending direction of each of the guiding track lines 15 of the heat sink 10; secondly, the middle of the lower surface of the condensation section 24 of each heat pipe 20 is provided. The positions are respectively aligned with the respective guiding trajectory lines 15, and the heat pipes 20 are The condensation section 24 is correspondingly disposed on the guiding track line 15 and is in contact with the solder paste; then, the condensation section 24 of the heat pipe 20 is positioned on the heat sink 10 by a positioning fixture to prevent the condensation section 24 from being The heat sink 10 slides relative to the guiding track 15; finally, the bonding portion of the heat sink 10 and the condensation section 24 of the heat pipe 20 is heated to melt the solder paste in the guiding track 15 into a liquid flow. Between the lower surface of the condensation section 24 of the heat pipe 20 and the bottom surface 19 of the groove 18 in contact therewith, the lower surface of the condensation section 24 of the heat pipe 20 and the bottom surface 19 of the groove 18 of the heat sink 10 are cooled. Solder together to get the required heat sink. The heating process during the assembly process can be carried out in a furnace that provides a higher temperature, such as a tin furnace, a reflow oven, an oven, a hot air chamber, and the like.

The guiding track line 15 is arranged to guide the solder paste to be applied in the correct direction to prevent the solder paste from being applied on the bottom surface 19 of the recess 18 outside the soldering portion 24 of the heat pipe 20, thereby avoiding When the solder paste is applied to the heat sink 10, the coating position deviation is too large due to a large error in the visual judgment of the operation, and the soldering offset, the overflow, and the like are caused to be defective, and the solder paste is applied by visual observation. The position corresponding to the guiding trajectory line 15 (ie, the position where the heat pipe 20 is attached according to the design) can not only improve the working efficiency of the visually applied solder paste, but also ensure the between the heat pipe 20 and the heat sink 10 in the process. The welding position is accurate, thereby ensuring product quality; at the same time, the closed end 152 of the guiding track line 15 formed at the left and right edges of the heat sink 10 prevents the solder paste applied in the guiding track line 15 from being heated. During the process, it flows outside the left and right edges of the heat sink 10 to avoid waste of solder paste.

The heat pipe 20 has at least one heat pipe 20, the number of which can be increased or decreased with the heat load, and the number of the guiding track lines 15 in the corresponding groove 18 is the same as the number of the heat pipes 20, and the guiding track line is The shape of 15 is not limited to the case of the above embodiment, and may correspond to the shape of the condensation section 24 of the heat pipe 20 in a specific implementation, such as when the heat pipe 20 is cold. When the condensing section 24 is in a bent shape, the guiding trajectory line 15 is also designed to be bent to match the shape of the condensing section 24.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator

15‧‧‧Guided trajectory

18‧‧‧ Groove

19‧‧‧ bottom surface

20‧‧‧heat pipe

150‧‧‧ slitting

152‧‧‧closed end

Claims (8)

A heat dissipating device includes a heat sink and at least one heat pipe having a condensation section, the heat sink having a surface soldered to the condensation section of the heat pipe, wherein the heat sink has a surface for guiding a solder paste is coated on the surface of the heat sink, and a condensation trace of the heat pipe is disposed on the surface of the heat sink and soldered to the solder paste. The trajectory line extends from a position near the left edge of the heat sink to a position near the right edge of the heat sink and does not extend through the left and right sides of the heat sink. The heat dissipating device of claim 1, wherein the guiding trajectory line is located at an intermediate position of the condensation section of the heat pipe. The heat dissipation device of claim 1, wherein the heat sink is formed by a plurality of heat dissipation fins, each heat dissipation fin comprising a body and a flange formed by vertically extending from one end of the body, each heat dissipation The folded edge of the fin interferes with the body of the adjacent heat sink fin to form a surface of the heat sink connected to the heat pipe. The heat sink of claim 3, wherein the guiding track line has a depth less than a thickness of the flange. The heat sink of claim 1, wherein the width of the condensation section of the heat pipe is much larger than the width of the guide track line. The heat dissipating device of claim 1, wherein the heat sink is provided with a groove, the bottom of the groove forming a bottom surface, and the guiding track line is disposed on the bottom surface, the heat pipe The condensation section is received in the recess. The heat dissipating device of claim 6, wherein the heat sink is formed by a plurality of heat dissipating fins, each fin comprises a body, and the bottom end of the body is vertically bent to form a folded edge, the body a first upper flange and a second upper flange formed by vertically bending the top end The first upper flange is located at the front and rear end portions of the body, and the second upper flange is located in the groove. A method of manufacturing a heat dissipating device, comprising the steps of: providing a heat sink having a surface soldered to a condensation section of a heat pipe, and providing a surface of the heat sink for guiding solder paste on the heat sink a coated guide track line on the surface; a solder paste is applied on the surface of the heat sink along the guide track line; and at least one heat pipe is provided, the heat pipe having a condensation section for condensing the heat pipe Segment guiding the guiding track line is disposed on a surface of the heat sink and soldered with the solder paste, wherein the guiding track line extends from a position near a left edge of the heat sink to a position close to a right edge of the heat sink. And does not penetrate the left and right sides of the radiator.