TWI458039B - Device processor - Google Patents

Description

Device processor

The present invention relates to device handlers, and more particularly to device processors for loading qualified devices into a waffle pack in a device in a wafer state based on the results of the test.

A device (semiconductor wafer) refers to an integrated circuit composed of a semiconductor having a higher conductivity than a non-conductor and a conductor lower than a metal. The wafer originally refers to a sheet chip, but is now used as a term referring to a semiconductor circuit.

The device is formed by integrating various devices such as a transistor resistance capacitor on a thin silicon wafer having a width of about 1 cm.

As the basic component of modern computer manufacturing, the device is the core of performing functions such as computing, storing data, and controlling other chips. It is an important support for the electronics industry.

The devices described above are: CPU, SDRAM (memory semiconductor), flash RAM, etc. Recently, there are various types of DDI (Display Drive IC) such as COG (Chip On Glass) and COF (Chip On Film).

Before the device is shipped as described above, in order to improve the stability, the appearance state is detected, and after the defective device is picked out, only the qualified device is shipped.

In particular, in the manufacturing process of the device, the detecting process of the device can be performed a plurality of times: in particular, it can be performed after being cut into individual devices in a wafer state, and can be displayed on the device according to each detection result.

Further, as described above, in the device which completes the detecting process, only the qualified device can be loaded on the classification device of the waffle pack for the factory or the subsequent process.

Further, as the detection process and the classification process are added in the manufacturing process of the device as described above, the production speed of the device can be controlled by the detection device or the classification device.

However, existing device processors used to load devices into waffle packs require the unloading of filled pods during loading of the wafer into the waffle assembly if the device is filled in the waffle assembly. Component and load the empty worval component.

However, the loading of the device cannot be performed during the alternate period of the empty waffle pack, so the alternate time of the waffle component is additionally required, thereby reducing the time required to load the wafer into the waffle component. limit.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide an alternate time for alternately placing a waffle pack with an empty waffle pack after loading the device into the waffle pack. Device processor for the Volvo component.

In order to achieve the above object, the present invention discloses a device processor, which may include: a wafer loading portion that loads a wafer loaded with a device; and a wafer moving station that receives the wafer supplied from the wafer loading portion Moving the above-mentioned wafer loaded with the device; picking up the tool, picking up the qualified device from the wafer on the wafer moving table; and the device unloading portion, including: the first wavre component transfer portion, moving a first waffle pack and unloading, wherein said first waffle pack is mounted with a device picked up by said pick-up tool; and a second whelf component transfer portion is transferred to said first wavle assembly The partially transferred first waffle pack is coupled to move and unload the second waffle assembly, wherein the second waffle assembly is mounted with the device picked up by the pick-up tool.

The device unloading portion may include: a waffle pack loading portion, a plurality of waffle packs stacked, and sequentially supplied to the waffle pack; and at least one waffle component transfer tool from the waffle assembly The entry portion transfers the waffle assembly and transmits it to the first waffle pack transfer portion or the second waffle assembly transfer portion.

The waffle pack transfer tool can include: a first waffle pack transfer tool that transfers the waffle assembly in a first direction; and a second whelf component transfer tool through the first wavle component transfer tool After the transfer of the waffle pack is completed, the waffle assembly is transferred to the second wavle assembly transfer portion or the second wavre assembly transfer portion.

The first waffle pack transfer portion and the second waffle assembly transfer portion sequentially unload the waffle pack through the first guide portion and the second guide portion, respectively; the first wavre component transfer tool passes The second guiding portion and the third guiding portion sequentially transfer the waffle pack; the second waffle assembly transfer tool sequentially transfers the waffle assembly through the second guiding portion and the fourth guiding portion; It is transmitted to the first wavre pack transfer portion or the second wavre assembly transfer portion.

Depending on the size of the waffle pack described above, the second guides may be alternated with members of different widths and lengths.

The first waffle pack transfer portion and the second waffle assembly transfer portion may respectively include: a first waffle pack pressurizing member and a second whelf assembly pressurizing member respectively supporting the waffle assembly a front end and a rear end to fix the whelf assembly; the moving body, the first wavle assembly pressurizing member and the second whelf assembly pressurizing member are mounted to support the bottom surface of the waffle assembly; The body driving unit moves each of the moving bodies along the body guiding member.

The first waffle pack pressurizing member and the second waffle pack pressurizing member may be provided with a roller that is rotatable in contact with the front end and the rear end of the waffle pack.

At least one of the first waffle pack pressurizing member and the second whelf module pressurizing member may be provided to the moving body.

The moving body may include a fixed body that is movably disposed along the body guiding member, and a supporting body that is movable up and down together with the fixed body.

The device unloading portion may further be provided with an image acquiring portion for performing at least one of visual inspection of the device mounting state and visual inspection of the device, and acquiring an image of the device placed in the waffle pack.

The device processor of the present invention has a dual waffle pack transfer portion that transfers the waffle pack by rotation, thereby continuously transferring the subsequent waffle pack after the preceding waffle pack fills the device, thereby completing the device loading Thereafter, the alternating doffer components are alternated, thereby significantly reducing the alternation time of the waffle pack, thereby enabling faster loading from the wafer to the waffle assembly.

Hereinafter, the device processor of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic structural view of a device processor according to the present invention; FIGS. 2a and 2b are a perspective view and a cross-sectional view showing the structure of each wafer; and FIG. 3 is a perspective view of a wolver assembly for the device processor of FIG. 4 is a conceptual diagram illustrating a movement process of the device from the wafer loading portion to the device unloading portion in FIG. 1; FIGS. 5a to 5c are plan views showing the operation of the wafer loading portion; FIGS. 6a to 6d are Schematic diagram of the working process of the device unloading section; FIG. 7a to FIG. 7d are schematic diagrams showing the working process of the waffle assembly loading section and the waffle component unloading section; FIG. 8 is a schematic structural view of the waffle component transfer section; FIG. Figure 9d is a side view showing the operation of the waffle assembly transfer portion of the device unloading portion.

As shown in FIGS. 1 to 4, the device processor of the present invention includes:

The wafer loading unit 100 loads a wafer 20 on which the device for completing the detecting process is loaded, and the wafer moving table 200 receives the wafer 20 supplied from the wafer loading unit 100 to Each of the wafers 20 loaded with the device 10 is moved to the lead-out position P0; a pick up tool 300, picking up the qualified device 10 in the wafer 20 on the wafer moving table 200; and the device unloading portion 400, The qualified device 10 transferred by the pick-up tool 300 is placed in a waffle pack 30 to unload the device 10, which is formed with a plurality of mounting slots 31 for housing the respective devices 10.

The device 10 is an IC chip such as a DDI (Display Drive IC) which is a display drive chip such as COG (Chip On Glass) or COF (Chip On Film), and a device such as an LED device, which performs a so-called semiconductor process and cutting. The wafer of the process (and the detection process and the classification process). Then, as shown in FIG. 2a and FIG. 2b, after the dicing process is completed, the device 10 is loaded on the wafer 20 and transferred.

The above-described wafer 20 has a structure in which the device 10 is loaded and transferred, and various structures can be employed. As shown in FIG. 2a and FIG. 2b, the wafer 20 may include an adhesive tape 21 having an adhesive surface on the surface of the device 10; the first bonding ring 22 is bonded to the adhesive tape 21; And the second coupling ring 23 applies tension to the outer diameter direction for the adhesive tape 21 bonded to the first coupling ring 22, so that the adhesive tape 21 is deformed in the outer diameter direction, thereby finely isolating the respective devices 10. The wafer 20 may further include only an adhesive tape having an adhesive surface on the surface of the device 10, and a bonding ring coupled with the adhesive tape.

The wafer 20 may have various shapes such as a circular shape and a quadrangular shape, and may be composed of a double bonding ring or a single bonding ring.

As shown in FIG. 3, the waffle pack 30 described above is formed with a plurality of seating grooves 31 for housing the device 10, and may have various shapes such as a rectangle.

When the waffle pack 30 is stacked up and down, in order to prevent damage, it is preferable that the depth of the above-described seating groove 31 is set to be larger than the height of the device 10.

The wafer loading unit 100 may include a cartridge loading unit 110 that loads a wafer cassette 111, wherein the wafer cassette 111 is loaded with a plurality of wafers 20, and the wafers 20 are loaded with The device 10; the wafer moving tool 120 moves the wafer 20 between the wafer cassette 111 and the wafer moving table 200 in order to replace the first wafer 20 and the second wafer 20, wherein the first crystal The circle 20 is the wafer from which the device 10 is to be derived, and the second wafer 20 is the wafer from which the device 10 has been derived.

The wafer cassette 111 is a device for laminating a plurality of wafers 20, and the wafer 20 is loaded with the device 10, and any structure that can stack the wafers 20 can be used. As an embodiment, it is provided in a structure that can be moved up and down, so that the stacked wafers 20 can be sequentially taken out.

Moreover, as shown in FIG. 1 , the wafer loading unit 100 may further include a wafer buffer unit 130 for receiving the first wafer 20 from the wafer mobile station 200 before transmitting the first wafer 20 to the wafer mobile station 200. The second wafer 20 is transferred, and after the first wafer 10 is transferred to the wafer mobile station 200, the second wafer 20 is temporarily stored to transfer the second wafer 20 to the vacancy of the wafer cassette 111. The first of the above is the wafer from which the device 10 is to be derived, and the second wafer 20 is the wafer from which the device 10 has been derived.

The wafer buffer unit 130 is a device for temporarily storing the wafer 20, and any structure for supporting the wafer 20 can be employed.

The wafer moving tool 120 is a device for transferring the wafer 20 between the wafer cassette 111 and the wafer moving table 200, and can adopt various structures. As shown in FIG. 5a to FIG. 5c, according to the structure, when the first wafer 20 is taken out from the wafer cassette 111, the first wafer 20 is moved to the wafer moving stage 200 while pushing the crystal. The second wafer 20 of the circular mobile station 200 moves the second wafer 20 to the wafer buffer portion 130, and after the wafer moving table 200 moves to the derivation position, the second wafer 20 located at the wafer buffer portion 130 Move to the wafer cassette 111.

The wafer moving table 200 is a device for moving the wafer 20 led out from the wafer cassette 111 to the lead-out position Po, wherein the lead-out position Po is a position at which the device 10 can be derived by the pick-up tool 300, which can adopt various structures. . As shown in Fig. 1, it can perform X-Y movement or X-Y-θ movement. Here, X-Y represents a coordinate axis of a vertical coordinate system based on the horizontal plane of the wafer 20, and θ represents rotation at the center of the Z axis.

As shown in FIG. 4, at least one pressing pin 210 may be disposed on the lower side of the lead-out position Po. When the wafer moving table 200 moves the wafer 20 to the lead-out position Po, the device 10 is lifted in order to facilitate the pick-up of the device 10. The upper side is moved to pressurize the adhesive tape 21 of the wafer 20. Among them, the number of the above-described pressurizing stitches 210 differs depending on the size of the device 10.

At this time, if the above-described pressurizing stitch 210 is a structure that moves according to the lead-out position Po of the device 10, it is also necessary to increase the device for moving, thereby increasing the manufacturing cost. Therefore, as a preferred solution, it is fixed, and it is preferable to fix the lead-out position Po of the device 10.

Moreover, the upper side of the wafer moving stage 200 may further be provided with a first image acquiring unit 330 for acquiring an image of the wafer 20 to detect the mounting state of the device 10, such as a camera or the like, so that in the embodiment By rotating the wafer moving stage 200, the wafer 20 is rotated, and the state of being placed on the wafer 20 of the device 10 is adjusted to a state in which it can be placed in the mounting groove 31 of the waffle pack 30.

The first image acquisition unit 330 may perform at least one of visual detection of the state in which the device 10 is placed and visual inspection of the device 10 .

In one aspect, the pick-up tool 300 is a device for transferring the device 10, which may take a variety of configurations depending on the pick-up method, which may include a pick-up head (not shown) for use with up and down movement (Z-direction movement) Vacuum pressure is generated to adsorb the device 10, thereby achieving lifting.

Further, when the pick-up tool 300 is directly transferred from the wafer moving stage 200 to the device unloading unit 400, it may include only one pick-up tool 310. The pick-up tool 300 can adopt various configurations according to the transfer mode of the device, and can also be configured to realize movement in various modes such as X-Y direction movement, X-direction movement, and rotational movement.

In particular, as shown in FIG. 1, when the pick-up tool 300 is loaded in the waffle pack 30 and needs to move in the X direction, it is configured to be movable in the X direction.

As shown in FIG. 1 and FIG. 6a to FIG. 6d, the device unloading portion 400 includes a first waffle pack transfer portion 501 that moves the first waffle pack 30 for unloading, wherein the first wavre The assembly 30 is provided with the device 10 picked up by the pick-up tool 310; and the second waffle assembly transfer portion 502 is linked with the first wavre component moved by the first wavre component transfer portion 501, and moves Two waffle packs 30 are provided for unloading, wherein the second waffle pack 30 houses the device 10 picked up by the pick-up tool 310.

The first waffle pack transfer portion 501 and the second wavler assembly transfer portion 502 are provided with a device 10 for transferring the device 10 transferred by the pick-up tool 300 to the waffle assembly 30, and for transferring the wavf The device of the assembly 30 can also take on a variety of other configurations.

Further, the first waffle pack transfer portion 501 and the second waffle pack transfer portion 502 are substantially identical except for the arrangement and the position of the waffle pack 30. As shown in FIG. 8 and FIG. 9a to FIG. 9d, it may respectively include: a first waffle pack pressurizing member 510 and a second whelf pack pressurizing member 520, wherein the transfer direction of each waffle pack 30 is The reference supports the front end and the rear end of the waffle pack 30, respectively, to secure the waffle pack 30; the moving body 530 is mounted with the first waffle pack pressurization component 510 and the second whelf component pressurization component 520 And supporting the bottom surface of the waffle pack 30; and the body driving unit 550 moving the moving body 530 along the body guiding portion 540.

The first waffle pack pressurization component 510 and the second whelf pack pressurization component 520 are transferable to the waffle pack 30 by supporting the front and rear ends of the waffle assembly 30 to secure the wavf The device of assembly 30 can take on a variety of other configurations. As shown in Figures 9a and 9b, in order to be able to freely position the waffle pack 30, at least one of the first waffle pack pressurization component 510 and the second whelf pack pressurization component 520 is along The body guide 540 is movably disposed on the moving body 530.

The movement of at least one of the first whelf module pressurizing member 510 and the second whelf module pressurizing member 520 described above may be performed by various combinations such as a pneumatic pump and a spring.

Moreover, in order to be able to arbitrarily set the position of the waffle pack 30, the first waffle pack pressurizing member 510 and the second whelf pack pressurizing member 520 are also disposed at the front end and the rear of the waffle assembly 30. A roller 511 and a roller 521 which are rotatable in the state of end contact.

In one aspect, the first waffle pack transfer portion 501 and the second wavler assembly transfer portion 502 exchange the first waffle pack 30 and the second waffle assembly 30 with each other and transfer, first The waffle pack pressurization component 510 and the second waffle pack pressurization component 520 can laterally move the first waffle pack 30 or the second waffle pack 30. And the first waffle pack pressurizing member 510 and the second waffle pack pressurizing member 520 are configured to transfer the waffle pack 30 to the waffle pack unloading portion 460, which will be described later, to transfer a new wrap. The assembly 30 laterally moves the waffle assembly 30 to a position for receiving the transmitted new waffle pack 30.

Further, when the first waffle pack pressurizing member 510 and the second whelf pack pressurizing member 520 laterally move the waffle pack 30, it is preferably moved downward to prevent the movement from being interfered.

There may be a plurality of mechanisms for moving the first waffle pack pressurizing member 510 and the second whelf pack pressurizing member 520 to the lower side.

As shown in FIG. 8 , the moving body 530 disposed to support the first waffle pack pressurizing component 510 and the second whelf component pressurizing component 520 may include: a fixed body 532 along which the body guiding portion 540 can be The support body 531 is provided to be movable up and down together with the fixed body 532; and the vertical drive unit (not shown) drives the support body 531 up and down with respect to the fixed body 532. Therefore, the first waffle pack pressurizing member 510 and the second waffle pack pressurizing member 520 can be moved to the lower side.

The fixed body 532 is movably disposed along the body guiding portion 540 and combined with the moving member 560, wherein the moving member 560 is movably disposed along a belt 570; by a driving device (not shown) The conveyor belt 570 is driven.

And the fixed body 532 may be provided with at least one guide rail 532a for guiding the movement of the support body 531.

The above-described upper and lower drive units can adopt various configurations depending on the driving method. That is, a structure similar to that of at least one of the first waffle pack pressurizing member 510 and the second whelf pack pressurizing member 520 may be employed, for example, a pneumatic pump, a spring, or the like may be employed. Various combinations are implemented.

In one aspect, the first waffle pack transfer portion 501 and the second waffle pack transfer portion 502 can sequentially unload the waffle pack 30 through the first guide portion 411 and the second guide portion 412, respectively.

The first guiding portion 411 and the second guiding portion 412 are means for guiding the waffle pack 30 transferred by the first waffle pack transfer portion 501 and the second wavre assembly transfer portion 502, which may be other A variety of structures. It is set to the Y-axis direction which is perpendicular to the moving direction (X-axis) of the pick-up tool 300.

Moreover, the first guiding portion 411 and the second guiding portion 412 may be alternated with other components having different widths and lengths, so that the length and the width may be adjusted according to the size of the waffle pack 30, that is, with the first guiding portion 411. Length and width between.

In one aspect, the device unloading portion 400 can include a waffle pack loading portion 450 having a plurality of waffle packs 30 stacked and sequentially feeding the waffle assembly 30; and one or more waffle assembly transfer tools 470 At 480, the waffle assembly 30 is transferred from the waffle pack loading portion 450 and passed to the first wavre assembly transfer portion 501 or the second wavre assembly transfer portion 502.

The waffle pack loading unit 450 can be employed as long as it is a structure in which a plurality of waffle packs 30 are stacked and sequentially supplied to the waffle pack 30. As shown in FIG. 1, FIG. 6a to FIG. 6d, and FIG. 7a to FIG. 7d, the waffle pack loading portion 450 may include: one or more vertical frames 451 supporting the sides of the waffle pack 30 for guiding up and down movement; The moving portion 453 moves the waffle assembly 30 up and down along the vertical frame 451; and the stopper 452, for guiding the first wavre assembly transfer tool 470, which will be described later, to the waffle assembly 30 for supporting the lowermost end The bottom surface of the waffle pack 30 is maintained at a distance from the upper and lower moving portions 453.

The above vertical frame 451 is a device for maintaining the stacked state of the waffle pack 30 and for guiding the up and down movement, which can adopt various structures. To accommodate a variety of sizes of waffle packs 30, it is possible to employ structures of adjustable width and length.

As shown in Figs. 7a to 7d, the above-described up-and-down moving portion 453 is a structure for supporting the bottom surface or the side surface of the waffle pack 30 to move upward, and to support when moving to the lower side, which can adopt various other structures.

As shown in FIG. 7a, the stopper 452 supports the bottom surface or the side surface of the lowermost waffle assembly 30 via the support member 452a; as shown in FIG. 7b, the up-and-down moving portion 453 is raised, and the state of the wrap-around assembly 30 is supported. Next, the support member 452a is linearly moved by the linear driving portion 452b, thereby releasing the support thereof.

Further, as shown in Fig. 7c, the vertical movement portion 453 supporting the waffle pack 30 is lowered to the lower side. At this time, the support member 452a is linearly moved to support the waffle assembly 30 on the upper side. As shown in Fig. 7d, the first waffle pack transfer tool 470 presses the waffle pack 30 supported by the up-and-down moving portion 453 to guide it.

In one aspect, the device unloading portion 400 may further include: a waffle pack unloading portion 460 disposed at the other end of the moving path MP, in which the waffle assembly 30 is sequentially stacked, wherein the waffle pack 30 is loaded with the device 10.

The structure and operation of the waffle pack unloading portion 460 are similar to those of the waffle pack loading portion 450, and thus detailed description thereof will be omitted.

Wherein, in connection with the structure of the waffle pack loading portion 450, the waffle pack transfer portion 500 is substituted for the first waffle pack transfer tool 470; and for the structure of the up and down moving portion 453, in addition to the structure for moving the waffle The rest of the structure is almost the same except for the structure of the component transfer unit 500.

In FIGS. 7a to 7d, reference numerals 461, 462, 462a, 462b, and 463 are respectively a vertical frame, a stopper, a support member, a linear drive portion, and an up-and-down moving portion.

Further, in association with the waffle pack loading portion 450 described above, the waffle pack loading portion 450 and the waffle pack unloading portion 460 may be disposed in parallel with each other.

The first waffle pack transfer tool 470 and the second waffle pack transfer tool 480 transfer the waffle pack 30 from the waffle pack loading portion 450 to the first wavler assembly transfer portion 501 or the second The structure of the waffle pack transfer unit 502 can also adopt various other structures. It may include: a first waffle pack transfer tool 470 that transfers in a first direction LP1; and a second waffle component transfer tool 480 that transfers the waffle assembly 30 through the first waffle pack transfer tool 470 After completion, the waffle pack 30 is moved in the second direction LP2 and transmitted to the first wavre component transfer portion 501 or the second wavre assembly transfer portion 502.

The first waffle pack transfer tool 470 and the second waffle pack transfer tool 480 described above are structures for transferring the waffle pack 30, and may take other various configurations, which may further include: a pressurizing member 471 The supercharging member 481 pressurizes one side of the waffle unit 30, and the driving unit (not shown) transfers the wavler to the respective directions, that is, LP1, LP2, by the pressurizing member 471 and the pressurizing member 481. Component 30.

Wherein, the first wrestling component transfer tool 470 and the pressurizing component 471 and the pressurizing component 481 of the second waffle pack transfer tool 480 may be formed as guides for guiding the transfer of the waffle pack 30, respectively. a part of.

In one aspect, the first waffle pack transfer tool 470, in turn, transfers the waffle assembly 30 through the second guide 412 and the third guide 413; the second wavle assembly transfer tool 480 passes through the second guide 412 And the fourth guiding portion 414 sequentially transfers the waffle assembly 30 to the first wavre component transfer portion 501 or the second wavre assembly transfer portion 502.

Wherein, as described above, the third guiding portion 413 is alternated with the second guiding portion 412, and the width and length of the first loading path LP1 can be adjusted according to the size of the waffle pack 30, that is, with the third guiding portion 413. Width and length between.

On the one hand, the loading path of the waffle pack 30 described above is set with a loading position, that is, a device for transferring the tool by the pick-up tool 300 in a loading place that intersects with the moving direction LL (X-axis) of the pick-up tool 300. 10 is placed in the position of the mounting groove 31 of the waffle pack 30. In order to confirm whether the device 10 is stably placed in the seating groove 31 of the waffle pack 30, the upper portion of the loading position may be provided with a second image acquiring portion 350, such as a camera.

Hereinafter, the operation of the device unloading unit 400 having the above configuration will be described in detail.

The plurality of waffle packs 30 to be loaded with the device 10 are sequentially withdrawn from the waffle pack loading portion 450 by the first waffle pack transfer tool .470 by the steps shown in Figures 7a through 7d.

As shown in Figure 6a, the waffle pack 30, which is derived from the waffle pack loading portion 450, is transferred by the first waffle pack transfer tool 470 along the first direction LP1. At this point, the second waffle pack transfer tool 480 awaits a portion of the guide for guiding the waffle pack 30 that is transferred by the first waffle pack transfer tool 470.

As shown in Figure 6b, after the transfer of the waffle assembly 30 of the first waffle pack transfer tool 470 described above is completed, the second waffle assembly transfer tool 480 transfers the waffle assembly 30 along the second direction LP2. To transfer it to the first wolf-valve component transfer portion 501 or the second wav-around component transfer portion 502 that is waiting in advance. At this point, the first waffle pack transfer tool 470 waits for a portion of the guide for guiding the waffle pack 30 that is transferred through the second waffle pack transfer tool 480.

Then, as shown in FIG. 6c, if the waffle pack 30 is transferred to the first wavre component transfer portion 501 or the second wavle assembly transfer portion 502, the first wavle assembly transfer portion 501 or the second nest The Volt component transfer portion 502 transfers the waffle assembly 30 and transfers it to a position adjacent to the previously transferred waffle pack 30, in conjunction with the movement of the preceding waffle assembly 30, thereby effecting transfer.

In one aspect, the preceding waffle pack 30 passes through the first waffle pack transfer portion 501 or the second wavler assembly transfer portion 503 through a load that intersects the transfer direction LL (X-axis) of the pick-up tool 300. At the location, the device 10 is filled and then transferred to the waffle pack unloading portion 460.

And, while the preceding waffle pack 30 is transferred, the other wavre assembly transfer portion, that is, the second wavre assembly transfer portion 502 or the first wavle assembly transfer portion 501, is immediately followed by the nest. The Volt assembly 30 passes through the loading location.

As described above, the waffle assembly 30 for loading the device 10 is continuously transferred to the loading place that intersects the transfer direction LL (X-axis) of the pick-up tool 300, so that the device unloading portion 400 can execute the device more quickly. 10 uninstall process.

In one aspect, the waffle pack 30 filling the device 10, after being transferred to the waffle pack unloading portion 460 through the waffle pack transfer portion 500, passes through a process reverse to that illustrated in Figures 7a through 7d, The stacking is performed on the waffle pack unloading portion 460 to effect loading.

The above is a preferred embodiment in which the present invention can be implemented, and thus the present invention is not limited to the above-described embodiments, and any changes in the technical idea described in the above embodiments are intended to fall within the scope of the present invention.

10. . . Device

20. . . Wafer

30. . . Wowoir components

31. . . Placement slot

100. . . Wafer loading department

200. . . Wafer mobile station

300. . . Pick up tool

400. . . Device unloading unit

1 is a schematic structural view of a device processor of the present invention;

2a and 2b are a perspective view and a cross-sectional view illustrating the structure of each wafer;

3 is a perspective view of a waffle assembly for the device processor of FIG. 1;

4 is a conceptual diagram illustrating a movement process of a device from a wafer loading portion to a device unloading portion in FIG. 1;

5a to 5c are schematic plan views showing the working process of the wafer loading portion;

6a to 6d are schematic plan views showing the operation process of the device unloading portion;

7a to 7d are schematic diagrams showing the operation of the waffle assembly loading portion and the waffle assembly unloading portion;

Figure 8 is a schematic structural view of the wavler component transfer portion;

9a to 9d are side views showing the operation of the waffle assembly transfer portion of the device unloading portion.

10. . . Device

20. . . Wafer

30. . . Wowoir components

100. . . Wafer loading department

110. . . Card loading unit

111. . . Wafer cartridge

120. . . Wafer moving tool

130. . . Wafer buffer

200. . . Wafer mobile station

400. . . Device unloading unit

411. . . First guide

412. . . Second guide

413. . . Third guide

414. . . Fourth guide

450. . . Wowoer component loading department

451. . . Vertical frame

460. . . Wowoer component unloading department

461. . . Reference numeral

470. . . First worval component transfer worker

480. . . Second waffle component transfer tool

501. . . First wavre component transfer unit

502. . . Second wavre component transfer unit

LP1. . . First direction

LP2. . . Second direction

Po. . . Export location

Claims (9)

A device processor, comprising: a wafer loading portion that loads a wafer loaded with a device; a wafer moving station that receives the wafer supplied from the wafer loading portion, and moves the device loaded with the above a wafer; picking up a tool to pick up a qualified device from the wafer on the wafer moving stage; and a device unloading portion including: a first waffle component transfer portion, moving the first waffle component and Performing an unloading, wherein the first waffle pack is provided with a device picked up by the pick-up tool; the second whelf component transfer portion, and the first wavf transferred through the first wavre assembly transfer portion The components are interlocked to move and unload the second socket volt assembly, wherein the second waffle assembly is provided with a device picked up by the pick-up tool; the waffle assembly loading portion is stacked with a plurality of wraps And sequentially feeding the waffle assembly; and at least one waffle assembly transfer tool transferring the waffle assembly from the waffle assembly loading portion and transferring the first wavre component transfer portion or Said second feeding portion waffle pack. The device processor of claim 1, wherein the waffle pack transfer tool comprises: a first waffle pack transfer tool that transfers the waffle assembly to the first direction; and a second wavf The component transfer tool transfers the waffle assembly to the second direction after the transfer of the waffle assembly by the first wavre pack transfer tool, and transmits the wavre assembly to the first wavre component transfer portion Or the second waffle pack transfer unit described above. The device processor according to claim 2, wherein the first waffle pack transfer portion and the second waffle assembly transfer portion are sequentially unloaded by the first guide portion and the second guide portion, respectively a waffle pack; said first waffle pack transfer tool sequentially transferring said waffle assembly through said second guide portion and said third guide portion; said second waffle assembly transfer tool passing said second guide The fourth portion and the fourth guiding portion sequentially transfer the wavre assembly to the first wavre assembly transfer portion or the second wavle assembly transfer portion. The device processor of claim 3, wherein the second guide portion is alternated with members of different widths and lengths according to the size of the waffle pack. The device processor of claim 1, wherein the first waffle pack transfer portion and the second waffle assembly transfer portion respectively comprise: a first waffle pack pressurizing member and a second a whelf assembly pressurizing member respectively supporting a front end and a rear end of the waffle assembly to fix the whelf assembly; the moving body, the first wavle assembly pressurizing member and the second wavre assembly described above The pressurizing members respectively support the bottom surface of the waffle pack; and the body driving portion respectively move the respective moving bodies along the body guiding member. The device processor according to claim 5, wherein The first waffle pack pressurizing member and the second whelf pack pressurizing member are provided with rollers that are rotatable in contact with the front end and the rear end of the waffle pack. The device processor according to claim 5, wherein at least one of the first waffle pack pressurizing member and the second whelf module pressurizing member is provided to the moving body. The device processor according to claim 5, wherein the moving body includes a fixed body that is movably disposed along the body guiding member, and a supporting body that is movable up and down together with the fixed body. The device processor of claim 1, wherein the device unloading portion is further provided with an image acquisition portion for performing at least one of visual detection of a device placement state and visual inspection of the device. , to obtain an image of the device placed in the waffle component.