TWI457180B - Showerhead - Google Patents
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- TWI457180B TWI457180B TW100129008A TW100129008A TWI457180B TW I457180 B TWI457180 B TW I457180B TW 100129008 A TW100129008 A TW 100129008A TW 100129008 A TW100129008 A TW 100129008A TW I457180 B TWI457180 B TW I457180B
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- gas
- gas passage
- coolant
- passage
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- 239000002826 coolant Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 28
- 239000007789 gas Substances 0.000 description 112
- 238000010586 diagram Methods 0.000 description 16
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Description
本發明係有關於一種半導體設備,特別是有關於一種氣體噴頭。 This invention relates to a semiconductor device, and more particularly to a gas showerhead.
半導體設備普遍應用於半導體元件之生產,半導體設備通常具有一反應室,半導體製程所需之製程氣體可藉由反應室之氣體噴頭流入反應室內部。第一圖顯示一傳統氣體噴頭100之示意圖。傳統氣體噴頭100包含一第一空間110、一第二空間120、複數之冷卻液通道130、複數之第一氣體通道111以及複數之第二氣體通道121。 Semiconductor devices are commonly used in the production of semiconductor devices. A semiconductor device usually has a reaction chamber. The process gas required for the semiconductor process can flow into the reaction chamber through a gas nozzle of the reaction chamber. The first figure shows a schematic view of a conventional gas jet head 100. The conventional gas jet head 100 includes a first space 110, a second space 120, a plurality of coolant channels 130, a plurality of first gas passages 111, and a plurality of second gas passages 121.
第一空間110連接至該等第一氣體通道111;第二空間120連接至該等第二氣體通道121,其中,流入第一空間110與第二空間120之製程氣體分別通過該等第一氣體通道111以及該等第二氣體通道121流入反應室內部。流入冷卻液通道130之冷卻液係用以控制傳統氣體噴頭100之溫度,藉以進一步控制通過該等第一氣體通道111與該等第二氣體通道121之製程氣體溫度。 The first space 110 is connected to the first gas channels 111; the second space 120 is connected to the second gas channels 121, wherein the process gases flowing into the first space 110 and the second space 120 respectively pass through the first gases The channel 111 and the second gas channels 121 flow into the interior of the reaction chamber. The coolant flowing into the coolant passage 130 is used to control the temperature of the conventional gas nozzle 100, thereby further controlling the temperature of the process gas passing through the first gas passages 111 and the second gas passages 121.
如第一圖所示,上述冷卻液通道130、第一氣體通道111以及第二氣體通道121呈現平行配置,而且冷卻液與製程氣體之流動方向 均是垂直於圖面。因此,進行操作時,製程氣體之流動方向與冷卻液之流動方向也是呈現平行配置。另外,如第一圖所示,第一氣體通道111或第二氣體通道121僅能藉由設置於一側之冷卻液通道130進行冷卻,導致冷卻效果不佳,進而影響製程結果。 As shown in the first figure, the coolant channel 130, the first gas channel 111, and the second gas channel 121 are arranged in parallel, and the flow direction of the coolant and the process gas Both are perpendicular to the drawing. Therefore, when the operation is performed, the flow direction of the process gas and the flow direction of the coolant are also arranged in parallel. In addition, as shown in the first figure, the first gas passage 111 or the second gas passage 121 can only be cooled by the coolant passage 130 disposed on one side, resulting in poor cooling effect, thereby affecting the process result.
鑑於上述先前技術所存在的缺點,有必要提出一種氣體噴頭,該氣體噴頭對於製程氣體具有較佳之冷卻效能。 In view of the shortcomings of the prior art described above, it is necessary to provide a gas jet head which has better cooling performance for process gases.
本發明欲解決的問題為提供一種氣體噴頭,該氣體噴頭對於製程氣體具有較佳之冷卻效能。 The problem to be solved by the present invention is to provide a gas jet head which has better cooling performance for process gases.
為解決上述的問題,本發明提出一種氣體噴頭,該氣體噴頭包含一本體、一蓋板以及一底板。蓋板貼合於本體之上方,蓋板與本體形成一冷卻液流動空間;底板貼合於本體之下方,底板與本體形成一氣體流動空間,其中,冷卻液流經該冷卻液流動空間,製程氣體流經該氣體流動空間,冷卻液之流動方向與製程氣體之流動方向大致垂直。 In order to solve the above problems, the present invention provides a gas jet head comprising a body, a cover plate and a bottom plate. The cover plate is attached to the upper part of the body, and the cover plate and the body form a cooling liquid flow space; the bottom plate is attached to the lower side of the body, and the bottom plate forms a gas flow space with the body, wherein the coolant flows through the coolant flow space, and the process The gas flows through the gas flow space, and the flow direction of the coolant is substantially perpendicular to the flow direction of the process gas.
藉由本發明之氣體噴頭,冷卻液之流動方向與製程氣體之流動方向大致垂直,而且冷卻液流動空間位於製程氣體之氣體流動空間之上方與兩側,冷卻液可充分冷卻製程氣體,因此,本發明之氣體噴頭對於製程氣體具有較佳之冷卻效能。 According to the gas nozzle of the present invention, the flow direction of the coolant is substantially perpendicular to the flow direction of the process gas, and the coolant flow space is located above and on both sides of the gas flow space of the process gas, and the coolant can sufficiently cool the process gas. The gas nozzle of the invention has better cooling performance for process gases.
100‧‧‧傳統氣體噴頭 100‧‧‧Traditional gas nozzle
110‧‧‧第一空間 110‧‧‧First space
111‧‧‧第一氣體通道 111‧‧‧First gas passage
120‧‧‧第二空間 120‧‧‧Second space
121‧‧‧第二氣體通道 121‧‧‧Second gas channel
130‧‧‧冷卻液通道 130‧‧‧Solution channel
200‧‧‧氣體噴頭 200‧‧‧ gas nozzle
210‧‧‧本體 210‧‧‧ body
211‧‧‧第一凹槽 211‧‧‧First groove
212‧‧‧第一氣體通道 212‧‧‧First gas passage
213‧‧‧第二氣體通道 213‧‧‧Second gas channel
214‧‧‧第三氣體通道 214‧‧‧ Third gas passage
215‧‧‧開孔 215‧‧‧ hole opening
217‧‧‧第二凹槽 217‧‧‧second groove
220‧‧‧蓋板 220‧‧‧ cover
221‧‧‧第一導引板 221‧‧‧First Guide Board
230‧‧‧底板 230‧‧‧floor
231‧‧‧第一部分 231‧‧‧Part 1
232‧‧‧第二部分 232‧‧‧Part II
233‧‧‧第三部分 233‧‧‧Part III
280‧‧‧冷卻液流動空間 280‧‧‧Coolant flow space
290‧‧‧氣體流動空間 290‧‧‧ gas flow space
291‧‧‧第一氣體流動空間 291‧‧‧First gas flow space
292‧‧‧第二氣體流動空間 292‧‧‧Second gas flow space
293‧‧‧第三氣體流動空間 293‧‧‧ Third gas flow space
A‧‧‧冷卻液之流動方向 A‧‧‧flow direction of coolant
第一圖顯示一傳統氣體噴頭之示意圖。 The first figure shows a schematic view of a conventional gas nozzle.
第二A圖顯示本發明一較佳實施例之氣體噴頭之立體分解示意圖。 Figure 2A is a perspective exploded view of a gas jet head in accordance with a preferred embodiment of the present invention.
第二B圖顯示第二A圖中,氣體噴頭之側視剖面示意圖。 Figure 2B shows a side cross-sectional view of the gas jet head in Figure 2A.
第二C圖顯示第二A圖中,氣體噴頭之另一分解示意圖。 The second C diagram shows another exploded view of the gas jet head in the second A diagram.
第二D圖顯示第二A圖中,本體之底視圖。 The second D diagram shows the bottom view of the body in the second A diagram.
第二E圖顯示第二A圖中,本體之俯視圖。 The second E diagram shows a top view of the body in the second A diagram.
第二F圖顯示第二A圖中,蓋板之立體示意圖。 The second F diagram shows a perspective view of the cover plate in the second A diagram.
本發明的一些實施例將詳細描述如下。然而,除了如下描述外,本發明還可以廣泛地在其他的實施例施行,且本發明的範圍並不受實施例之限定,其以之後的專利範圍為準。再者,為提供更清楚的描述及更易理解本發明,圖式內各部分並沒有依照其相對尺寸繪圖,某些尺寸與其他相關尺度相比已經被誇張;不相關之細節部分也未完全繪出,以求圖式的簡潔。 Some embodiments of the invention are described in detail below. However, the present invention may be widely practiced in other embodiments than the following description, and the scope of the present invention is not limited by the examples, which are subject to the scope of the following patents. Further, in order to provide a clearer description and a better understanding of the present invention, the various parts of the drawings are not drawn according to their relative dimensions, and some dimensions have been exaggerated compared to other related dimensions; the irrelevant details are not fully drawn. Out, in order to make the schema simple.
第二A圖顯示本發明一較佳實施例之氣體噴頭200之立體分解示意圖。氣體噴頭200包含一本體210、一蓋板220以及一底板230。 Figure 2A is a perspective exploded view of a gas showerhead 200 in accordance with a preferred embodiment of the present invention. The gas nozzle 200 includes a body 210, a cover 220, and a bottom plate 230.
第二B圖顯示第二A圖中,氣體噴頭200之側視剖面示意圖。如第二B圖所示,蓋板220貼合於本體210之上方,蓋板220與本體210形成冷卻液流動空間280,其中,冷卻液流經冷卻液流動空間280。底板230貼合於本體210之下方,底板230與本體210形成氣體流動空間290,製程氣體流經氣體流動空間290。 Figure 2B shows a side cross-sectional view of the gas jet head 200 in Figure 2A. As shown in FIG. 2B, the cover plate 220 is fitted over the body 210, and the cover plate 220 and the body 210 form a coolant flow space 280, wherein the coolant flows through the coolant flow space 280. The bottom plate 230 is attached to the lower side of the body 210. The bottom plate 230 forms a gas flow space 290 with the body 210, and the process gas flows through the gas flow space 290.
根據本實施例,冷卻液之流動方向A如箭頭方向所示,製 程氣體之流動方向則是垂直於圖面,冷卻液之流動方向與製程氣體之流動方向大致垂直。另外,本實施例中,冷卻液流動空間280位於氣體流動空間290之上方與兩側,冷卻液可充分冷卻製程氣體,因此,本發明之氣體噴頭對於製程氣體具有較佳之冷卻效能。 According to the embodiment, the flow direction A of the coolant is as indicated by the direction of the arrow. The flow direction of the process gas is perpendicular to the plane of the drawing, and the flow direction of the coolant is substantially perpendicular to the flow direction of the process gas. In addition, in this embodiment, the coolant flow space 280 is located above and on both sides of the gas flow space 290, and the coolant can sufficiently cool the process gas. Therefore, the gas nozzle of the present invention has better cooling performance for the process gas.
第二C圖顯示第二A圖中,氣體噴頭200之另一分解示意圖。為了清楚顯示氣體噴頭200之結構,將蓋板220由本體210分離。第二D圖顯示第二A圖中,本體210之底視圖。如第二D圖所示,本體210包含一第一氣體通道212、一第二氣體通道213以及一第三氣體通道214,其中,一第一氣體通道212、一第二氣體通道213以及一第三氣體通道214設置於本體210之下方,且複數之開孔215設置於第一氣體通道212、第二氣體通道213以及第三氣體通道214,製程氣體可分別通過複數之開孔215進入第一氣體通道212、第二氣體通道213以及第三氣體通道214。 The second C diagram shows another exploded view of the gas jet head 200 in the second A diagram. In order to clearly show the structure of the gas jet head 200, the cover plate 220 is separated from the body 210. The second D diagram shows the bottom view of the body 210 in the second A diagram. As shown in the second D, the body 210 includes a first gas passage 212, a second gas passage 213, and a third gas passage 214, wherein a first gas passage 212, a second gas passage 213, and a first The three gas passages 214 are disposed under the body 210, and the plurality of openings 215 are disposed in the first gas passage 212, the second gas passage 213, and the third gas passage 214, and the process gas can enter the first through the plurality of openings 215, respectively. A gas passage 212, a second gas passage 213, and a third gas passage 214.
根據本實施例,第一氣體通道212與第二氣體通道213分別具有梳狀外型,第一氣體通道212與第二氣體通道213分別具有複數之曲線通道,第一氣體通道212之曲線通道與第二氣體通道213之曲線通道交錯排列,第三氣體通道214環繞第一氣體通道212與第二氣體通道213。 According to the embodiment, the first gas passage 212 and the second gas passage 213 respectively have a comb-like outer shape, and the first gas passage 212 and the second gas passage 213 respectively have a plurality of curved passages, and the curved passages of the first gas passage 212 and The curved passages of the second gas passage 213 are staggered, and the third gas passage 214 surrounds the first gas passage 212 and the second gas passage 213.
如第二A圖、第二C圖以及第二D圖所示,本實施例中,底板230包含一第一部分231、一第二部分232以及一第三部分233,第一部分231具有與第一氣體通道212相應之梳狀外型,第一部分231與第一氣體通道212共同形成第一氣體流動空間291;第二部分232具有與第二氣體通道213相應之梳狀外型,第二部分232與第二氣體通道213共同形成 第二氣體流動空間292;第三部分233具有與第三氣體通道214相應之外型,第三部分233與第三氣體通道214共同形成第三氣體流動空間293。另外,本實施例中,底板230之第一部分231、第二部分232以及第三部分233可用同一片材料加工製作,因此,本實施例之底板230具有節省材料,容易製作之優點。 As shown in FIG. 2A, FIG. 2C, and FIG. 2D, in the embodiment, the bottom plate 230 includes a first portion 231, a second portion 232, and a third portion 233. The first portion 231 has the first portion. The gas passage 212 has a corresponding comb shape, the first portion 231 and the first gas passage 212 together form a first gas flow space 291; the second portion 232 has a comb shape corresponding to the second gas passage 213, and the second portion 232 Formed together with the second gas passage 213 The second gas flow space 292; the third portion 233 has a shape corresponding to the third gas passage 214, and the third portion 233 and the third gas passage 214 together form a third gas flow space 293. In addition, in the embodiment, the first portion 231, the second portion 232, and the third portion 233 of the bottom plate 230 can be processed by the same piece of material. Therefore, the bottom plate 230 of the embodiment has the advantages of saving materials and being easy to manufacture.
第二E圖顯示第二A圖中,本體210之俯視圖。如第二E圖所示,本體210包含複數之第一凹槽211,其中,該等第一凹槽211設置於本體210之上方。本實施例中,該等第一凹槽211具有與第一氣體通道212以及第二氣體通道213相應之外型,其中,該等第一凹槽211具有曲線外型,藉以增加冷卻液之擾動。另外,根據本實施例,本體210可進一步包含複數之第二凹槽217,且該等第二凹槽217具有與第三氣體通道214相應之外型。 The second E diagram shows a top view of the body 210 in the second A diagram. As shown in FIG. E, the body 210 includes a plurality of first grooves 211, wherein the first grooves 211 are disposed above the body 210. In this embodiment, the first grooves 211 have a shape corresponding to the first gas passage 212 and the second gas passage 213, wherein the first grooves 211 have a curved shape to increase the disturbance of the coolant. . In addition, according to the embodiment, the body 210 may further include a plurality of second grooves 217, and the second grooves 217 have a shape corresponding to the third gas passage 214.
藉由上述設計,本體210之下方設置第一氣體通道212、第二氣體通道213以及第三氣體通道214,本體210之上方設置第一凹槽211與第二凹槽217,已經盡可能利用本體210之所有空間。由於本體210可用同一片材料加工製作,因此,本實施例之本體210具有結構簡單,容易製作之優點。 With the above design, the first gas channel 212, the second gas channel 213, and the third gas channel 214 are disposed under the body 210. The first groove 211 and the second groove 217 are disposed above the body 210, and the body has been utilized as much as possible. 210 all the space. Since the body 210 can be processed by the same piece of material, the body 210 of the embodiment has the advantages of simple structure and easy manufacture.
第二F圖顯示第二A圖中,蓋板220之立體示意圖。如第二F圖與第二C圖所示,蓋板220包含複數之第一導引板221,該等第一導引板221可延伸至本體210之該等第一凹槽211。本實施例中,該等導引板221具有曲線外型,且該等第一導引板221具有與該等第一凹槽211相應之外型。另外,如第二B圖與第二F圖所示,該等第一導引板221可使 冷卻液具有水平與垂直之流動方向,且該等第一導引板221具有交錯排列之配置,藉以增加冷卻液之擾動。 The second F diagram shows a perspective view of the cover plate 220 in the second A diagram. As shown in FIG. 2F and FIG. 2C, the cover plate 220 includes a plurality of first guiding plates 221, and the first guiding plates 221 may extend to the first grooves 211 of the body 210. In this embodiment, the guiding plates 221 have a curved outer shape, and the first guiding plates 221 have a shape corresponding to the first grooves 211. In addition, as shown in the second B and second F, the first guiding plates 221 can The coolant has a horizontal and vertical flow direction, and the first guide plates 221 have a staggered arrangement to increase the disturbance of the coolant.
藉由本發明之氣體噴頭,冷卻液之流動方向與製程氣體之流動方向大致垂直,而且冷卻液流動空間280位於製程氣體之氣體流動空間290之上方與兩側,冷卻液可充分冷卻製程氣體,因此,本發明之氣體噴頭對於製程氣體具有較佳之冷卻效能。 With the gas jet head of the present invention, the flow direction of the coolant is substantially perpendicular to the flow direction of the process gas, and the coolant flow space 280 is located above and on both sides of the gas flow space 290 of the process gas, and the coolant can sufficiently cool the process gas. The gas nozzle of the present invention has better cooling performance for process gases.
上述本發明之實施例僅係為說明本發明之技術思想及特點,其目的在使熟悉此技藝之人士能了解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即凡其它未脫離本發明所揭示之精神所完成之等效的各種改變或修飾都涵蓋在本發明所揭露的範圍內,均應包含在下述之申請專利範圍內。 The embodiments of the present invention are merely illustrative of the technical spirit and characteristics of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. All other equivalents and modifications of the inventions which are made without departing from the spirit of the invention are intended to be included within the scope of the invention.
200‧‧‧氣體噴頭 200‧‧‧ gas nozzle
210‧‧‧本體 210‧‧‧ body
211‧‧‧第一凹槽 211‧‧‧First groove
217‧‧‧第二凹槽 217‧‧‧second groove
220‧‧‧蓋板 220‧‧‧ cover
221‧‧‧第一導引板 221‧‧‧First Guide Board
230‧‧‧底板 230‧‧‧floor
231‧‧‧第一部分 231‧‧‧Part 1
232‧‧‧第二部分 232‧‧‧Part II
233‧‧‧第三部分 233‧‧‧Part III
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100129008A TWI457180B (en) | 2011-08-15 | 2011-08-15 | Showerhead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100129008A TWI457180B (en) | 2011-08-15 | 2011-08-15 | Showerhead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201306948A TW201306948A (en) | 2013-02-16 |
| TWI457180B true TWI457180B (en) | 2014-10-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100129008A TWI457180B (en) | 2011-08-15 | 2011-08-15 | Showerhead |
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| Country | Link |
|---|---|
| TW (1) | TWI457180B (en) |
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| CN107598661A (en) * | 2017-09-26 | 2018-01-19 | 太仓贝斯特机械设备有限公司 | A kind of Anti-adhesion type peeling is cut somebody's hair |
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| TWI237102B (en) * | 2000-03-13 | 2005-08-01 | John Zink Co Llc | Low NOx radiant wall burner |
| TWI288308B (en) * | 2003-06-19 | 2007-10-11 | Asml Holding Nv | Immersion photolithography system and method using microchannel nozzles |
| TW200927295A (en) * | 2007-10-16 | 2009-07-01 | Applied Materials Inc | Multi-gas concentric injection showerhead |
| TW201111050A (en) * | 2009-08-27 | 2011-04-01 | Applied Materials Inc | Gas distribution showerhead and method of cleaning |
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| US5360144A (en) * | 1992-04-02 | 1994-11-01 | Unilever Patent Holdings B.V. | Dispensing means for simultaneously dispensing two liquids |
| TWI237102B (en) * | 2000-03-13 | 2005-08-01 | John Zink Co Llc | Low NOx radiant wall burner |
| US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
| TWI288308B (en) * | 2003-06-19 | 2007-10-11 | Asml Holding Nv | Immersion photolithography system and method using microchannel nozzles |
| TW200927295A (en) * | 2007-10-16 | 2009-07-01 | Applied Materials Inc | Multi-gas concentric injection showerhead |
| TW201111050A (en) * | 2009-08-27 | 2011-04-01 | Applied Materials Inc | Gas distribution showerhead and method of cleaning |
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| TW201306948A (en) | 2013-02-16 |
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