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TWI457070B - 顯示裝置及其組裝方法 - Google Patents

顯示裝置及其組裝方法 Download PDF

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Publication number
TWI457070B
TWI457070B TW100148425A TW100148425A TWI457070B TW I457070 B TWI457070 B TW I457070B TW 100148425 A TW100148425 A TW 100148425A TW 100148425 A TW100148425 A TW 100148425A TW I457070 B TWI457070 B TW I457070B
Authority
TW
Taiwan
Prior art keywords
array substrate
disposed
back frame
organic electroluminescent
display panel
Prior art date
Application number
TW100148425A
Other languages
English (en)
Other versions
TW201328564A (zh
Inventor
Yu Chun Huang
Chia Chun Chang
Hong Shen Lin
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW100148425A priority Critical patent/TWI457070B/zh
Priority to CN201210059213.2A priority patent/CN102569668B/zh
Priority to US13/541,866 priority patent/US9196862B2/en
Publication of TW201328564A publication Critical patent/TW201328564A/zh
Application granted granted Critical
Publication of TWI457070B publication Critical patent/TWI457070B/zh
Priority to US14/920,109 priority patent/US9490457B2/en

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/87Arrangements for heating or cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Claims (19)

  1. 一種顯示裝置,包括:一背框;一顯示面板,配置於該背框上方,且該顯示面板包括多條電源線,各該電源線具有一配置方向並大致平行於彼此;以及至少二散熱片材,配置於該背框與該顯示面板之間,且該些散熱片材之間具有至少一拼接縫,該拼接縫大致平行於該配置方向。
  2. 如申請專利範圍第1項所述之顯示裝置,更包括一第一背膠,塗佈於該些散熱片材與該背框之間。
  3. 如申請專利範圍第2項所述之顯示裝置,更包括一第二背膠,塗佈於該些散熱片材與該顯示面板之間。
  4. 如申請專利範圍第1項所述之顯示裝置,其中該些散熱片材的導熱係數大於200W/m-K。
  5. 如申請專利範圍第1項所述之顯示裝置,其中該些散熱片材的材質包括鋁、石墨或陶瓷材料。
  6. 如申請專利範圍第1項所述之顯示裝置,其中該顯示面板更包括:一陣列基板,該些電源線係配置於該陣列基板上;一自發光顯示層,配置於該陣列基板上;以及一封裝蓋,蓋設於該陣列基板上而位於該自發光顯示層與該背框之間,其中,該些散熱片材是配置於該封裝蓋與該背框之間。
  7. 如申請專利範圍第1項所述之顯示裝置,其中該顯示面板更包括:一陣列基板,該些電源線係配置於該陣列基板上;一自發光顯示層,配置於該陣列基板上;以及一封裝蓋,蓋設於該陣列基板上,其中,該陣列基板位於該自發光顯示層與該背框之間,且該些散熱片材是配置於該陣列基板與該背框之間。
  8. 一種顯示裝置,包括:一背框;一有機電致發光顯示面板,配置於該背框上方,且該有機電致發光顯示面板包括多條電源線,各該電源線具有一配置方向並大致平行於彼此,而該有機電致發光顯示面板具有一邊長,該邊長大致垂直於該配置方向;以及至少二散熱片材,適於從一散熱捲材上裁下,該散熱捲材具有一固定寬度,而該些散熱片材大致平行該配置方向而貼附於該背框與該有機電致發光顯示面板之間,以使該固定寬度大致平行於該邊長,且該固定寬度小於該邊長。
  9. 如申請專利範圍第8項所述之顯示裝置,更包括一第一背膠,塗佈於該些散熱片材與該背框之間。
  10. 如申請專利範圍第8項所述之顯示裝置,更包括一第二背膠,塗佈於該些散熱片材與該有機電致發光顯示面板之間。
  11. 如申請專利範圍第8項所述之顯示裝置,其中該些散熱片材的導熱係數大於200W/m-K。
  12. 如申請專利範圍第8項所述之顯示裝置,其中該些散熱片材的材質包括鋁、石墨或陶瓷材料。
  13. 如申請專利範圍第8項所述之顯示裝置,其中該顯示面板更包括:一陣列基板,該些電源線係配置於該陣列基板上;一有機電致發光層,配置於該陣列基板上;以及一封裝蓋,蓋設於該陣列基板上而位於該有機電致發光層與該背框之間,其中,該些散熱片材是配置於該封裝蓋與該背框之間。
  14. 如申請專利範圍第8項所述之顯示裝置,其中該顯示面板更包括:一陣列基板,該些電源線係配置於該陣列基板上;一有機電致發光層,配置於該陣列基板上;以及一封裝蓋,蓋設於該陣列基板上,其中,該陣列基板位於該有機電致發光層與該背框之間,且該些散熱片材是配置於該陣列基板與該背框之間。
  15. 一種顯示裝置的組裝方法,包括:提供一有機電致發光顯示面板以及一背框,其中該有機電致發光顯示面板具有一第一邊長與一第二邊長,該第一邊長大於該第二邊長,且該有機電致發光顯示面板包括多條電源線,各該電源線具有一配置方向並大致平行於彼此,而該配置方向大致上平行於該第二邊長:提供一散熱捲材,該散熱捲材具有一固定寬度,其中該固定寬度小於該第二邊長;依據該第二邊長將該散熱捲材裁切成具有該固定寬度之多個散熱片材,以將該些該散熱片材在該第一邊長的方向上並列地貼附於該背框或該有機電致發光顯示面板上;以及將該有機電致發光顯示面板組裝至該背框上,以使該些散熱片材位於該有機電致發光顯示面板與該背框之間。
  16. 如申請專利範圍第15項所述之顯示裝置的組裝方法,其中在貼附該些散熱片材之前,更包括在該背框上塗佈一第一背膠,以將該些散熱片材貼附於該背框上。
  17. 如申請專利範圍第15項所述之顯示裝置的組裝方法,其中在貼附該些散熱片材之前,更包括在該有機電致發光顯示面板上塗佈一第二背膠,以將該些散熱片材貼附於該有機電致發光顯示面板上。
  18. 如申請專利範圍第15項所述之顯示裝置的組裝方法,其中該顯示面板更包括一陣列基板、一有機電致發光層以及一封裝蓋,該些電源線係配置於該陣列基板上,該有機電致發光層配置於該陣列基板上,該封裝蓋蓋設於該陣列基板上而位於該有機電致發光層與該背框之間,且貼附該些散熱片材的方法包括將該些散熱片材貼附於該封裝蓋與該背框之間。
  19. 如申請專利範圍第15項所述之顯示裝置的組裝方法,其中該顯示面板更包括一陣列基板、一有機電致發光層以及一封裝蓋,該些電源線係配置於該陣列基板上,該有機電致發光層配置於該陣列基板上,該陣列基板位於該有機電致發光層與該背框之間,且該封裝蓋蓋設於該陣列基板上,而貼附該些散熱片材的方法包括將該些散熱片材貼附於該陣列基板與該背框之間。
TW100148425A 2011-12-23 2011-12-23 顯示裝置及其組裝方法 TWI457070B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW100148425A TWI457070B (zh) 2011-12-23 2011-12-23 顯示裝置及其組裝方法
CN201210059213.2A CN102569668B (zh) 2011-12-23 2012-03-08 显示装置及其组装方法
US13/541,866 US9196862B2 (en) 2011-12-23 2012-07-05 Display device and assembly method thereof
US14/920,109 US9490457B2 (en) 2011-12-23 2015-10-22 Display device and assembly method thereof

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Application Number Priority Date Filing Date Title
TW100148425A TWI457070B (zh) 2011-12-23 2011-12-23 顯示裝置及其組裝方法

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TW201328564A TW201328564A (zh) 2013-07-01
TWI457070B true TWI457070B (zh) 2014-10-11

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US (2) US9196862B2 (zh)
CN (1) CN102569668B (zh)
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TWI669816B (zh) * 2018-04-18 2019-08-21 友達光電股份有限公司 拼接用顯示面板及其製造方法

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TW201519751A (zh) * 2013-11-07 2015-05-16 Au Optronics Corp 具有非透光散熱層的顯示裝置及其製造方法
KR102266192B1 (ko) * 2015-02-02 2021-06-17 삼성디스플레이 주식회사 표시 장치
CN106163230B (zh) * 2016-07-20 2018-05-29 广东欧珀移动通信有限公司 显示屏模组及移动终端
CN106206969A (zh) * 2016-08-31 2016-12-07 成都鼎智汇科技有限公司 基于聚酰亚胺的石墨烯电致发光器件
KR102591754B1 (ko) * 2016-09-09 2023-10-20 삼성디스플레이 주식회사 커버 패널 및 이를 포함하는 표시 장치
CN107092117B (zh) * 2017-06-29 2019-11-12 京东方科技集团股份有限公司 显示面板及提高显示面板显示质量的方法
CN117698263A (zh) * 2023-12-19 2024-03-15 青岛中集创赢复合材料科技有限公司 带材生产系统

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Also Published As

Publication number Publication date
US20160043352A1 (en) 2016-02-11
US9196862B2 (en) 2015-11-24
CN102569668A (zh) 2012-07-11
US20130163204A1 (en) 2013-06-27
CN102569668B (zh) 2015-07-22
TW201328564A (zh) 2013-07-01
US9490457B2 (en) 2016-11-08

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