TWI450647B - Printed circuit board with high speed differential signal wiring structure - Google Patents
Printed circuit board with high speed differential signal wiring structure Download PDFInfo
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- TWI450647B TWI450647B TW098140054A TW98140054A TWI450647B TW I450647 B TWI450647 B TW I450647B TW 098140054 A TW098140054 A TW 098140054A TW 98140054 A TW98140054 A TW 98140054A TW I450647 B TWI450647 B TW I450647B
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- differential signal
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- 230000005540 biological transmission Effects 0.000 claims description 65
- 239000003990 capacitor Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Description
本發明係關於一種具有高速差分訊號佈線結構的印刷電路板。 The present invention relates to a printed circuit board having a high speed differential signal wiring structure.
習知的一般個人電腦主機板上，除了有中央處理器，晶片組外，還有複數用於安裝介面卡的連接器。隨著電子產業的發展，晶片的功能進一步完善，同一晶片可支援不同的連接器，如一款週邊元件互連(Peripheral Component Interconnection，PCI)晶片既可支援第一規格的連接器，例如支援SAS(Serial Attached SCSI)傳輸規格的硬碟，也可同時支援第二規格的連接器，例如支援SATA(Serial ATA)傳輸規格的硬碟。不同的主機板產品會選擇安裝不同的連接器，如有的廠商要求在主機板上只安裝第一規格的連接器，而有的廠商則要求在主機板上安裝第二規格的連接器，因此，縱使晶片能夠支援兩種規格的連接器，但生產時也只能選擇一種生產，即支援第一規格連接器的主機板，或支援第二規格連接器的主機板，兩者無法共用。故按照不同的廠商要求，需要對主機板佈線重新設計，增加了主機板設計的成本。因此，如何提供一種印刷電路板，利用相同的主機板佈線，可支持複數連接器，成為業界急需解決的課題。 On the conventional personal computer motherboard, in addition to the central processing unit and the chipset, there are a plurality of connectors for installing the interface card. With the development of the electronics industry, the functions of the chip are further improved. The same chip can support different connectors. For example, a Peripheral Component Interconnection (PCI) chip can support connectors of the first specification, for example, support SAS ( Serial Attached SCSI) A hard disk that transmits a standard specification. It can also support a connector of the second specification, such as a hard disk that supports the SATA (Serial ATA) transmission specification. Different motherboard products will choose to install different connectors. If some manufacturers require only the connector of the first specification to be installed on the motherboard, some manufacturers require the connector of the second specification to be installed on the motherboard. Even if the chip can support two types of connectors, only one type of production can be selected during production, that is, a motherboard supporting the connector of the first specification or a motherboard supporting the connector of the second specification, and the two cannot be shared. Therefore, according to different manufacturers' requirements, it is necessary to redesign the motherboard layout, which increases the cost of the motherboard design. Therefore, how to provide a printed circuit board and use the same motherboard wiring to support a plurality of connectors has become an urgent problem to be solved in the industry.
鑒於以上內容，有必要提供一種具有高速差分訊號佈線結構的印刷電路板，可選擇性地連接複數連接器。 In view of the above, it is necessary to provide a printed circuit board having a high-speed differential signal wiring structure for selectively connecting a plurality of connectors.
一種具有高速差分訊號佈線結構的印刷電路板，包括一高速差分訊號控制晶片、第一及第二連接元件、第一及第二連接器焊盤、第一至第六傳輸線，該第一及第二傳輸線的一端分別連接於該高速差分訊號控制晶片的兩輸出端，該第三及第四傳輸線分別與該第一連接器焊盤的兩輸入端相連，該第五及第六傳輸線分別與該第二連接器焊盤的兩輸入端相連，當在該第一連接器焊盤上安裝一第一連接器時，該第一及第三傳輸線透過該第一連接元件相連，該第二及第四傳輸線透過該第二連接元件相連，當在該第二連接器焊盤上安裝一第二連接器時，該第一及第五傳輸線透過該第一連接元件相連，該第二及第六傳輸線透過該第二連接元件相連。 A printed circuit board having a high speed differential signal wiring structure, comprising a high speed differential signal control chip, first and second connection elements, first and second connector pads, first to sixth transmission lines, the first and the One ends of the two transmission lines are respectively connected to the two output ends of the high-speed differential signal control chip, and the third and fourth transmission lines are respectively connected to the two input ends of the first connector pad, and the fifth and sixth transmission lines respectively Connecting the two input ends of the second connector pad, when the first connector is mounted on the first connector pad, the first and third transmission lines are connected through the first connecting component, the second and the second The fourth transmission line is connected through the second connecting component. When a second connector is mounted on the second connector pad, the first and fifth transmission lines are connected through the first connecting component, and the second and sixth transmission lines are connected. Connected through the second connecting element.
本發明具有高速差分訊號佈線結構的印刷電路板只需透過設置該第一、第二連接元件的位置，就可使得該具有高速差分訊號佈線結構的印刷電路板連接複數連接器。 The printed circuit board having the high-speed differential signal wiring structure of the present invention can connect the printed circuit board having the high-speed differential signal wiring structure to the plurality of connectors only by providing the positions of the first and second connecting elements.
10‧‧‧高速差分訊號控制晶片 10‧‧‧High speed differential signal control chip
20、30‧‧‧連接元件 20, 30‧‧‧Connecting components
40‧‧‧第一連接器焊盤 40‧‧‧First connector pad
50‧‧‧第二連接器焊盤 50‧‧‧Second connector pad
60‧‧‧第三連接器焊盤 60‧‧‧ third connector pad
70、80‧‧‧過孔 70, 80‧‧‧ Via
102、104、402、404、502、504、602、604‧‧‧傳輸線 102, 104, 402, 404, 502, 504, 602, 604‧‧ transmission lines
P、N‧‧‧輸出端 P, N‧‧‧ output
圖1係本發明具有高速差分訊號佈線結構的印刷電路板的高速差分訊號控制晶片與第一至第三連接器焊盤的示意圖。 1 is a schematic diagram of a high-speed differential signal control chip and first to third connector pads of a printed circuit board having a high-speed differential signal wiring structure according to the present invention.
圖2係本發明具有高速差分訊號佈線結構的印刷電路板的高速差分訊號控制晶片與第一連接器焊盤相連接的示意圖。 2 is a schematic diagram showing the connection of a high-speed differential signal control chip of a printed circuit board having a high-speed differential signal wiring structure to a first connector pad.
圖3係本發明具有高速差分訊號佈線結構的印刷電路板的高速差分訊號控制晶片與第二連接器焊盤相連接的示意圖。 3 is a schematic diagram showing the connection of a high-speed differential signal control chip of a printed circuit board having a high-speed differential signal wiring structure to a second connector pad.
圖4係本發明具有高速差分訊號佈線結構的印刷電路板的高速差分訊號控制晶片與第三連接器焊盤相連接的示意圖。 4 is a schematic diagram showing the connection of a high-speed differential signal control chip of a printed circuit board having a high-speed differential signal wiring structure to a third connector pad.
請一併參閱圖1至圖4，本發明具有高速差分訊號佈線結構的印刷電路板的較佳實施方式包括一設置於印刷電路板下層的高速差分訊號控制晶片10、連接元件20及30、第一至第三連接器焊盤40、50及60、傳輸線102、104、402、404、502、504、602及604。該高速差分訊號控制晶片10包括兩輸出端P及N，該第一至第三連接器焊盤40、50及60為相同或不同規格的連接器焊盤，用以安裝相同或不同的連接器。該傳輸線102及104設置於印刷電路板下層，該傳輸線102及104的一端分別連接於該高速差分訊號控制晶片10的兩輸出端P及N，該兩傳輸線402及404設置於印刷電路板上層且與分別設置於印刷電路板上層的第一連接器焊盤40的兩輸入端相連，該兩傳輸線502及504設置於印刷電路板上層且分別與設置於印刷電路板上層的第二連接器焊盤50的兩輸入端相連，該兩傳輸線602及604設置於印刷電路板下層且分別與設置於印刷電路板下層的第三連接器焊盤60的兩輸入端相連。印刷電路板的上下層之間開設貫穿上下層的兩過孔70及80。且過孔70及80的頂部位於印刷電路板的上層，過孔70及80的底部位於印刷電路板的下層，且分別連接第一傳輸線102及第二傳輸線104。在其他實施方式中，高速差分訊號控制晶片10、第一至第三連接器焊盤40、50、60及傳輸線102、104、402、404、502、504、602及604在印刷電路板的位置也可根據實際需要進行相應設置。在本實施方式中，該兩連接元件20、30作為連通高速差分訊號控制晶片10與第一連接器焊盤40、第二連接器焊盤50或第三連接器焊盤60的開關元件，均 為AC耦合電容，可濾除訊號傳輸中的干擾成分，以便得到更好的訊號傳輸品質。 Referring to FIG. 1 to FIG. 4, a preferred embodiment of the printed circuit board having the high-speed differential signal wiring structure includes a high-speed differential signal control chip 10 disposed on the lower layer of the printed circuit board, and connecting components 20 and 30, One to third connector pads 40, 50 and 60, transmission lines 102, 104, 402, 404, 502, 504, 602 and 604. The high speed differential signal control chip 10 includes two output terminals P and N. The first to third connector pads 40, 50 and 60 are the same or different size connector pads for mounting the same or different connectors. . The transmission lines 102 and 104 are disposed on the lower layer of the printed circuit board. One ends of the transmission lines 102 and 104 are respectively connected to the two output terminals P and N of the high-speed differential signal control chip 10. The two transmission lines 402 and 404 are disposed on the printed circuit board and Connected to the two input terminals of the first connector pad 40 respectively disposed on the printed circuit board layer, the two transmission lines 502 and 504 are disposed on the printed circuit board layer and respectively connected to the second connector pads disposed on the printed circuit board layer The two input terminals are connected to each other. The two transmission lines 602 and 604 are disposed on the lower layer of the printed circuit board and are respectively connected to the two input ends of the third connector pads 60 disposed on the lower layer of the printed circuit board. Two via holes 70 and 80 penetrating the upper and lower layers are formed between the upper and lower layers of the printed circuit board. The tops of the via holes 70 and 80 are located on the upper layer of the printed circuit board, and the bottoms of the via holes 70 and 80 are located on the lower layer of the printed circuit board, and the first transmission line 102 and the second transmission line 104 are respectively connected. In other embodiments, the high speed differential signal control chip 10, the first through third connector pads 40, 50, 60 and the transmission lines 102, 104, 402, 404, 502, 504, 602, and 604 are in position on the printed circuit board. It can also be set according to actual needs. In the present embodiment, the two connection elements 20, 30 serve as switching elements for connecting the high speed differential signal control chip 10 with the first connector pad 40, the second connector pad 50 or the third connector pad 60. It is an AC coupling capacitor that filters out interference components in signal transmission for better signal transmission quality.
當在第一連接器焊盤40上安裝一第一連接器時，如圖1及2所示，將連接元件20連接(可透過焊接方式)於傳輸線402與過孔70的頂部，從而使得傳輸線102與傳輸線402透過連接元件20相連，連接元件30連接於傳輸線404與過孔80的頂部，從而使得傳輸線104與傳輸線404透過連接元件30相連，高速差分訊號控制晶片10與第一連接器進行通訊，該第二連接器焊盤50及第三連接器焊盤60空接；這樣高速差分訊號控制晶片10經輸出端P和N發送的高速差分訊號對，透過傳輸線102及104的傳輸，再經連接元件20及30及傳輸線402、404完整地傳輸給第一連接器焊盤40上的第一連接器。 When a first connector is mounted on the first connector pad 40, as shown in FIGS. 1 and 2, the connecting member 20 is connected (by soldering) to the top of the transmission line 402 and the via 70, thereby making the transmission line The high-speed differential signal control chip 10 is connected to the first connector, and the high-speed differential signal control chip 10 is connected to the first connector. The second connector pad 50 and the third connector pad 60 are vacant; the high-speed differential signal control chip 10 transmits the high-speed differential signal pair transmitted through the output terminals P and N through the transmission lines 102 and 104, and then The connecting elements 20 and 30 and the transmission lines 402, 404 are completely transferred to the first connector on the first connector pad 40.
當在第二連接器焊盤50上安裝一第二連接器時，如圖1及3所示，將連接元件20連接於傳輸線502與過孔70的頂部，從而使得傳輸線102與傳輸線502透過連接元件20相連，連接元件30連接於傳輸線504與過孔80的頂部，從而使得傳輸線104與傳輸線504透過連接元件30相連，高速差分訊號控制晶片10與第二連接器進行通訊，該第一連接器焊盤40及第三連接器焊盤60空接；這樣高速差分訊號控制晶片10經輸出端P和N發送的高速差分訊號對，透過傳輸線102及104的傳輸，再經連接元件20及30及傳輸線502、504完整地傳輸給第二連接器焊盤50上的第二連接器。 When a second connector is mounted on the second connector pad 50, as shown in FIGS. 1 and 3, the connection member 20 is connected to the top of the transmission line 502 and the via 70, thereby allowing the transmission line 102 to be connected to the transmission line 502. The components 20 are connected, and the connecting component 30 is connected to the top of the transmission line 504 and the via 80, so that the transmission line 104 and the transmission line 504 are connected through the connection component 30, and the high-speed differential signal control chip 10 communicates with the second connector. The first connector The pad 40 and the third connector pad 60 are vacant; the high-speed differential signal control chip 10 transmits the high-speed differential signal pair transmitted through the output terminals P and N through the transmission lines 102 and 104, and then through the connection components 20 and 30 and The transmission lines 502, 504 are completely transferred to the second connector on the second connector pad 50.
當在第三連接器焊盤60上安裝一第三連接器時，如圖1及4所示，將連接元件20連接於傳輸線602與過孔70的底部，從而使得傳輸線102與傳輸線602透過連接元件20相連，連接元件30連接於傳輸 線604與過孔80的底部，從而使得傳輸線104與傳輸線604透過連接元件30相連，高速差分訊號控制晶片10與第三連接器進行通訊，該第一連接器焊盤40及第一連接器焊盤50空接；這樣高速差分訊號控制晶片10經輸出端P和N發送的高速差分訊號對，透過傳輸線102及104的傳輸，再經連接元件20及30及傳輸線602、604完整地傳輸給第三連接器焊盤60上的第三連接器。 When a third connector is mounted on the third connector pad 60, as shown in FIGS. 1 and 4, the connecting member 20 is connected to the bottom of the transmission line 602 and the via 70, thereby allowing the transmission line 102 to be connected to the transmission line 602. The components 20 are connected and the connecting component 30 is connected to the transmission The line 604 is connected to the bottom of the via 80, so that the transmission line 104 and the transmission line 604 are connected through the connection component 30, and the high-speed differential signal control chip 10 communicates with the third connector. The first connector pad 40 and the first connector are soldered. The disk 50 is vacant; the high-speed differential signal control chip 10 transmits the high-speed differential signal pair transmitted through the output terminals P and N through the transmission lines 102 and 104, and then completely transmitted to the first through the connection components 20 and 30 and the transmission lines 602 and 604. A third connector on the three connector pads 60.
本發明只需在印刷電路板上設置連接元件20、30的位置，而不需更改印刷電路板上的原有佈線方式，即不需要更改傳輸線102、104、402、404、502、504、602及604的佈線方式，就可實現高速差分訊號控制晶片10選擇性地與第一至第三連接器焊盤40、50或60上的連接器相連接，實施方便，因此節省了印刷電路板的設計成本。並且本發明的印刷電路板還使得線路工作時能維持訊號完整性，具有更好的訊號傳輸品質。 The invention only needs to set the position of the connecting elements 20, 30 on the printed circuit board without changing the original wiring manner on the printed circuit board, that is, without changing the transmission lines 102, 104, 402, 404, 502, 504, 602. And the wiring of the 604, the high-speed differential signal control chip 10 can be selectively connected to the connectors on the first to third connector pads 40, 50 or 60, which is convenient to implement, thereby saving the printed circuit board. Design cost. Moreover, the printed circuit board of the present invention can maintain signal integrity during line operation and has better signal transmission quality.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧高速差分訊號控制晶片 10‧‧‧High speed differential signal control chip
20、30‧‧‧連接元件 20, 30‧‧‧Connecting components
40‧‧‧第一連接器焊盤 40‧‧‧First connector pad
50‧‧‧第二連接器焊盤 50‧‧‧Second connector pad
60‧‧‧第三連接器焊盤 60‧‧‧ third connector pad
102、104、402、404、502、504、602、604‧‧‧傳輸線 102, 104, 402, 404, 502, 504, 602, 604‧‧ transmission lines
P、N‧‧‧輸出端 P, N‧‧‧ output
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098140054A TWI450647B (en) | 2009-11-25 | 2009-11-25 | Printed circuit board with high speed differential signal wiring structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098140054A TWI450647B (en) | 2009-11-25 | 2009-11-25 | Printed circuit board with high speed differential signal wiring structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201119529A TW201119529A (en) | 2011-06-01 |
| TWI450647B true TWI450647B (en) | 2014-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098140054A TWI450647B (en) | 2009-11-25 | 2009-11-25 | Printed circuit board with high speed differential signal wiring structure |
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| TW (1) | TWI450647B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265645B2 (en) * | 2005-06-03 | 2007-09-04 | Dell Products L.P. | Matched-impedance high-bandwidth configuration jumper |
| CN201230402Y (en) * | 2008-07-03 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| TW201119531A (en) * | 2009-11-18 | 2011-06-01 | Hon Hai Prec Ind Co Ltd | Printed circuit board having high-speed differential signal layout configuration |
-
2009
- 2009-11-25 TW TW098140054A patent/TWI450647B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265645B2 (en) * | 2005-06-03 | 2007-09-04 | Dell Products L.P. | Matched-impedance high-bandwidth configuration jumper |
| CN201230402Y (en) * | 2008-07-03 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| TW201119531A (en) * | 2009-11-18 | 2011-06-01 | Hon Hai Prec Ind Co Ltd | Printed circuit board having high-speed differential signal layout configuration |
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| TW201119529A (en) | 2011-06-01 |
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