[go: up one dir, main page]

TWI443175B - An anisotropic conductive material, a connecting structure, and a connecting structure - Google Patents

An anisotropic conductive material, a connecting structure, and a connecting structure Download PDF

Info

Publication number
TWI443175B
TWI443175B TW099128490A TW99128490A TWI443175B TW I443175 B TWI443175 B TW I443175B TW 099128490 A TW099128490 A TW 099128490A TW 99128490 A TW99128490 A TW 99128490A TW I443175 B TWI443175 B TW I443175B
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
conductive material
compound
group
weight
Prior art date
Application number
TW099128490A
Other languages
English (en)
Chinese (zh)
Other versions
TW201120182A (en
Inventor
真原茂雄
久保田敬士
Original Assignee
積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化學工業股份有限公司 filed Critical 積水化學工業股份有限公司
Publication of TW201120182A publication Critical patent/TW201120182A/zh
Application granted granted Critical
Publication of TWI443175B publication Critical patent/TWI443175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/0113—
    • H10W72/013—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/073—
    • H10W72/07331—
    • H10W72/354—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW099128490A 2009-08-26 2010-08-25 An anisotropic conductive material, a connecting structure, and a connecting structure TWI443175B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009195431 2009-08-26
JP2009195432 2009-08-26
JP2009195430 2009-08-26

Publications (2)

Publication Number Publication Date
TW201120182A TW201120182A (en) 2011-06-16
TWI443175B true TWI443175B (zh) 2014-07-01

Family

ID=43627825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099128490A TWI443175B (zh) 2009-08-26 2010-08-25 An anisotropic conductive material, a connecting structure, and a connecting structure

Country Status (5)

Country Link
JP (1) JP5602743B2 (fr)
KR (1) KR101538834B1 (fr)
CN (1) CN102484326B (fr)
TW (1) TWI443175B (fr)
WO (1) WO2011024719A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5916423B2 (ja) * 2011-02-17 2016-05-11 積水化学工業株式会社 異方性導電材料のｂステージ化物、異方性導電材料のｂステージ化物の製造方法、接続構造体及び接続構造体の製造方法
JP2012212864A (ja) * 2011-03-18 2012-11-01 Sekisui Chem Co Ltd 接続構造体の製造方法及び接続構造体
JP2013016473A (ja) * 2011-06-10 2013-01-24 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5721593B2 (ja) * 2011-09-12 2015-05-20 積水化学工業株式会社 接続構造体の製造方法
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
TWI553089B (zh) * 2012-09-28 2016-10-11 長興材料工業股份有限公司 塗料組合物及其用途
JP6518100B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
KR102411356B1 (ko) * 2014-09-18 2022-06-22 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
KR102489187B1 (ko) * 2014-10-28 2023-01-17 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
CN107075286B (zh) * 2015-02-12 2021-03-09 积水化学工业株式会社 喷墨用固化性组合物及电子部件的制造方法
KR102569944B1 (ko) * 2015-05-25 2023-08-24 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
CN107251163A (zh) * 2015-08-19 2017-10-13 积水化学工业株式会社 导电材料及连接结构体
KR102605942B1 (ko) * 2015-08-24 2023-11-27 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP2017193630A (ja) * 2016-04-20 2017-10-26 積水化学工業株式会社 硬化性樹脂組成物
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
KR102164171B1 (ko) * 2019-04-26 2020-10-13 (주)엘프스 미니 led 칩 본딩용 자가융착형 도전접속 페이스트, 이를 포함하는 미니 led 칩-회로기판 본딩 모듈 및 이의 제조방법
KR102666344B1 (ko) * 2022-02-08 2024-05-20 국도첨단소재 주식회사 전도성 열경화형 접착 페이스트 및 이를 사용한 배터리 조립체

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000086989A (ja) * 1998-09-14 2000-03-28 Sekisui Chem Co Ltd 表示装置の接続構造体及び接続方法
JP2003055583A (ja) * 1998-12-08 2003-02-26 Taiyo Ink Mfg Ltd 光硬化型異方性導電組成物及びそれを用いて形成した異方性導電パターン
JP2002093485A (ja) * 2000-09-19 2002-03-29 Jsr Corp 複合シートの製造方法および複合シート
JP2001351445A (ja) * 2000-06-09 2001-12-21 Jsr Corp 複合シートの製造方法および複合シート
JP2002124318A (ja) * 2000-10-12 2002-04-26 Jsr Corp 複合シートおよびその製造方法
JP2002128911A (ja) * 2000-10-30 2002-05-09 Jsr Corp 異方導電性シートおよびその使用方法
JP2002076055A (ja) * 2000-08-22 2002-03-15 Hitachi Ltd 半導体装置の実装方法および実装構造
JP2003165825A (ja) * 2001-11-30 2003-06-10 Mitsui Chemicals Inc 異方性導電ペーストおよびその使用方法
JP3864078B2 (ja) * 2001-11-30 2006-12-27 三井化学株式会社 異方性導電ペーストおよびその使用方法
JP2003167331A (ja) * 2001-12-03 2003-06-13 Japan U-Pica Co Ltd 樹脂組成物及びその硬化物
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
JP4492148B2 (ja) * 2004-02-18 2010-06-30 日立化成工業株式会社 回路接続方法
JP2005235530A (ja) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP2006124531A (ja) * 2004-10-29 2006-05-18 Shin Etsu Chem Co Ltd 異方導電性接着剤
CN101147210B (zh) * 2005-03-23 2011-03-30 松下电器产业株式会社 导电性接合材料
PL2223981T3 (pl) * 2006-07-21 2012-08-31 Hitachi Chemical Co Ltd Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów
JP5018779B2 (ja) * 2006-08-22 2012-09-05 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JP5173173B2 (ja) * 2006-09-12 2013-03-27 協立化学産業株式会社 導電性材料の配向方法、及びこの配向方法を用いた異方性材料または異方性材料を有する電子装置の製造方法
JP5268260B2 (ja) * 2007-01-24 2013-08-21 デクセリアルズ株式会社 異方導電性接着剤及び電気装置
JP4850092B2 (ja) * 2007-02-23 2012-01-11 積水化学工業株式会社 接続部材の製造方法、及び、接続部材
JP2009074020A (ja) * 2007-03-06 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜
JP4880533B2 (ja) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電膜及びその製造方法、並びに接合体
JP4673931B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673933B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 異方性導電材料及び接続構造体
JP4673932B2 (ja) * 2009-08-26 2011-04-20 積水化学工業株式会社 接続構造体の製造方法及び異方性導電材料

Also Published As

Publication number Publication date
JP5602743B2 (ja) 2014-10-08
KR101538834B1 (ko) 2015-07-22
WO2011024719A1 (fr) 2011-03-03
TW201120182A (en) 2011-06-16
KR20120062682A (ko) 2012-06-14
CN102484326A (zh) 2012-05-30
JPWO2011024719A1 (ja) 2013-01-31
CN102484326B (zh) 2014-12-10

Similar Documents

Publication Publication Date Title
TWI443175B (zh) An anisotropic conductive material, a connecting structure, and a connecting structure
TWI491601B (zh) A sulfide compound, a mixture containing a cyclic sulfide, a process for producing a mixture containing a cyclic sulfide, a hardened composition and a connecting structure
JP4673933B2 (ja) 異方性導電材料及び接続構造体
TWI402286B (zh) A hardened composition, an anisotropic conductive material, and a connecting structure
JP5520265B2 (ja) 異方性導電材料、ｂステージ状硬化物及び接続構造体の製造方法
JP4673931B2 (ja) 異方性導電材料及び接続構造体
JP4673932B2 (ja) 接続構造体の製造方法及び異方性導電材料
JP5400545B2 (ja) 異方性導電材料、接続構造体の製造方法及び接続構造体
JPWO2018181536A1 (ja) 接着剤組成物及び構造体
TW201129273A (en) Method for manufacturing connection structure
CN101959922B (zh) 固化性环氧组合物、各向异性导电材料以及连接结构体
JP5559723B2 (ja) 接続構造体の製造方法
JP5886582B2 (ja) 異方性導電材料、ｂステージ状硬化物、ｂステージ状硬化物の製造方法及び接続構造体
JP5314713B2 (ja) 接続構造体の製造方法及び異方性導電材料
JPWO2019193961A1 (ja) 樹脂組成物、およびこれを用いた立体造形物の製造方法、ならびに立体造形物
JP2005320491A (ja) 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP5879105B2 (ja) 異方性導電ペースト、異方性導電ペーストの製造方法、接続構造体及び接続構造体の製造方法
JP5705003B2 (ja) 接続構造体の製造方法
JP2012178441A (ja) 接続構造体の製造方法及び接続構造体
JP2012175038A (ja) 接続構造体の製造方法及び異方性導電材料
TW202328380A (zh) 糊狀樹脂組成物、高導熱性材料及半導體裝置
TW202544173A (zh) 樹脂組合物